KR102485312B1 - Forming or molding apparatus for plate including curved surface - Google Patents

Abstract

According to various embodiments of the present invention, a molding apparatus includes a preheating part for preheating a mold containing a basic material; A forming part that deforms at least a portion of the base material by pressing the mold while heating the preheated mold; and a cooling part that cools the mold transported from the molding part, wherein the molding part includes: first heating blocks that pressurize and simultaneously heat the mold from lower and upper portions of the mold; at least one heating unit for heating at least a portion of a side surface of the mold; and a cooling unit positioned adjacent to at least a part of the side surface of the mold by a lifting motion.
The molding apparatus as described above may vary according to embodiments.

Description

Plate molding apparatus including a curved surface {FORMING OR MOLDING APPARATUS FOR PLATE INCLUDING CURVED SURFACE}

Various embodiments of the present invention relate to a molding device, for example, to a molding device that deforms or molds a flat plate into a curved shape.

The exterior of the electronic device may also serve as an interior decoration and an accessory that reveals a user's personality or taste. For example, electronic devices generally have appearances suitable for functions rather than usage environments, but users' demands for design are increasing with the improvement of living standards. Such demands are increasing in various fields from home appliances to telecommunication terminals, etc., or in all electronic devices used by consumers, and market competitiveness of electronic devices can be enhanced through exterior design and decoration.

Electronic device exteriors (eg, cases or housings) have generally been made of synthetic resin materials. For example, a case or the like forming the exterior of an electronic device can be manufactured using an injection molding method that can be easily molded into a desired shape and mass-produced at low cost. As user demand for the appearance of electronic devices increases, the appearance of electronic devices has gradually improved through various finishing processes such as painting and coating. The appearance of electronic devices is made beautiful by using materials.

Synthetic resins and metals are easily processed into desired shapes, but glass may be difficult to mass-produce in a standardized form. For example, glass materials can be processed into desired shapes (e.g., curved surfaces) through mechanical processing such as face milling and polishing, but it may be difficult to ensure uniform quality of individual products. can In addition, in mechanically processing the glass material, even if it is possible to uniformly secure the curvature or thickness of individual products, it takes a considerable amount of time for processing, making mass production difficult. For example, in order to process a curved glass material, a process such as chamfering or polishing may be performed, but chamfering or polishing is a process of removing a material, and consumption of raw materials may increase. In addition, chamfering or polishing may require a lot of processing time, and it may be difficult to mass-produce products of uniform quality.

Various embodiments of the present invention may provide a molding apparatus capable of easily molding a flat plate made of glass material or the like into a desired shape (eg, a curved plate).

Various embodiments of the present invention may provide a molding apparatus capable of mass-producing molded articles (eg, curved plates) of uniform quality (eg, uniform shape and size).

According to various embodiments of the present invention, a molding apparatus includes a preheating part for preheating a mold containing a basic material; A forming part that deforms at least a portion of the base material by pressing the mold while heating the preheated mold; and a cooling part that cools the mold transported from the molding part, wherein the molding part includes: first heating blocks that pressurize and simultaneously heat the mold from lower and upper portions of the mold; at least one heating unit for heating at least a portion of a side surface of the mold; and a cooling unit positioned adjacent to at least a part of the side surface of the mold by a lifting motion.

According to various embodiments of the present invention, a glass material molding apparatus includes a molding chamber; Heating blocks disposed in the molding chamber and including a lower block in which a mold containing a flat plate-shaped glass material is seated, and an upper block pressurizing the mold from an upper portion; a heating unit selectively disposed at a position adjacent to a side surface of the mold seated on the lower block (hereinafter referred to as a 'first position'); and a cooling unit selectively disposed at the first position, wherein the heating unit heats the mold at the first position while the upper block presses the mold, and the heating unit heats the mold at the first position. When deviating from the first position, the cooling unit may be disposed adjacent to the side surface of the mold.

According to various embodiments of the present invention, the molding apparatus may mold a glass material into various shapes corresponding to the design shape of the mold by heating, pressurizing, and cooling the mold in the molding chamber. According to one embodiment, the heating in the molding chamber is performed by heating by direct contact using a pressurizing device (eg, heating blocks), or by heating using a heating unit generating radiant heat, in a state in which the entire mold is uniformly heated. Since it can be molded, the quality of molded products can be made uniform. In one embodiment, by minimizing transfer of the mold by performing heating, pressurization, and cooling in the molding chamber, damage to the mold or generation of foreign substances during mold transfer can be suppressed. In another embodiment, the molding apparatus may prevent damage to the mold or the occurrence of foreign substances by transferring the mold in a floating state using a transfer unit that moves up and down (moving) and horizontally (moving).

1 is a perspective view showing a molding apparatus according to various embodiments of the present invention.
2 is a front view showing a molding apparatus according to various embodiments of the present invention.
3 is a perspective view showing the internal structure of a molding apparatus according to various embodiments of the present invention.
4 and 5 are perspective views illustrating a molding unit of a molding apparatus according to various embodiments of the present invention.
6 is a perspective view illustrating an example of a heating unit of a molding apparatus according to various embodiments of the present disclosure.
7 is a plan view illustrating a disposition structure of a heating unit and a cooling unit in a molding apparatus according to various embodiments of the present disclosure.
8 is a perspective view illustrating a preheating unit of a molding apparatus according to various embodiments of the present disclosure.
9 is a perspective view illustrating a cooling unit of a molding apparatus according to various embodiments of the present disclosure.
10 and 11 are perspective views illustrating an operation of inserting a mold into a preheating unit in a molding apparatus according to various embodiments of the present disclosure.
12 is a perspective view illustrating an operation of inserting a mold into a molding unit in a molding apparatus according to various embodiments of the present disclosure.
13 and 14 are perspective views illustrating an operation of ejecting a mold from a molding unit in a molding apparatus according to various embodiments of the present disclosure.
15 and 16 are views respectively illustrating a curved plate formed by a molding apparatus according to various embodiments of the present disclosure.

Since the present invention can apply various changes and have various embodiments, some embodiments will be described in detail with reference to the drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as 'first' and 'second' may be used to describe various components, but the components are not limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. The term 'and/or' includes a combination of a plurality of related recited items or any one of a plurality of related recited items.

In addition, relative terms described based on what is shown in the drawing, such as 'front', 'rear', 'top', and 'bottom' may be replaced with ordinal numbers such as 'first' and 'second'. For ordinal numbers such as 'first' and 'second', the order is the stated order or arbitrarily determined, and may be arbitrarily changed as needed.

Terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, terms such as "comprise" or "having" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present invention, they should not be interpreted in an ideal or excessively formal meaning. don't

1 is a perspective view showing a molding apparatus 100 according to various embodiments of the present invention. 2 is a front view showing a molding apparatus 100 according to various embodiments of the present invention. 3 is a perspective view showing the internal structure of the molding apparatus 100 according to various embodiments of the present invention.

1 to 3, the molding apparatus 100 according to a preferred embodiment of the present invention may include a molding unit 101, a preheating unit 102, and a cooling unit 103, and a mold (M ) (shown in FIG. 2 or 3) is heated and pressed to mold or deform the basic material (eg, glass material) accommodated in the mold M into a desired shape. Although not shown, the mold M couples the lower mold and the upper mold to face each other, and a molding base material may be mounted or accommodated between the lower mold and the upper mold. According to one embodiment, the molding base material may be a glass material in the form of a flat plate, and after being molded or deformed, the glass material may at least partially include a curved surface. As will be described later, the molding unit 101 may include a heating device such as heating blocks (eg, first heating blocks 211 and 213), a heating unit 215, and a cooling device such as a cooling unit 217. The preheating unit 102 and the cooling unit 103 may be substantially integrated into the molding unit 101 . For example, the molding device 100 may preheat, mold, and cool the molding base material in the molding unit 101 .

According to various embodiments, while the molding unit 101 molds or transforms the molding base material, the preheating unit 102 heats other molding base materials (or molds) at room temperature close to the molding temperature in the molding unit 101. It can be preheated to the desired temperature. While the molding unit 101 is shaping or deforming the molding base material, the cooling unit 103 is another molding base material (or mold) that has already been discharged from the molding unit 101 (eg, has already been molded or deformed). can be cooled. For example, when forming or deforming a molding base material at 1000 degrees Celsius, the forming part 101 can substantially maintain a temperature range of 800 degrees Celsius (or 900 degrees Celsius) or more and 1000 degrees Celsius or less. According to one embodiment, after molding, the cooling unit 103 may cool the mold to a temperature that can be handled by a worker (eg, room temperature). For example, natural cooling may be performed by ejecting a high-temperature mold from the molding unit 101 and leaving it in a room temperature environment, but this may cause a safety accident. It can be cooled to a temperature where it can be safely handled.

According to one embodiment, when heating and cooling are repeated between room temperature and molding temperature (eg, 1000 degrees Celsius) within the molding unit 101, the yield may decrease. According to various embodiments of the present invention, the preheating unit 102 and the cooling unit 103 preheat the mold before being introduced into the molding unit 101 or cool the mold discharged from the molding unit 101, , The molding unit 101 may mold a molding base material into a design shape while maintaining a certain temperature range (eg, 800 degrees Celsius to 1000 degrees Celsius if the molding temperature is 1000 degrees Celsius). For example, while the forming unit 101 is operating, the preheating unit 102 and the cooling unit 103 perform preheating or cooling so that the forming unit 101 maintains a certain temperature range, thereby substantially continuously It is possible to carry out a molding process, thereby increasing the yield.

According to various embodiments, the molding unit 101 includes heating blocks (eg, the first heating blocks 211 and 213) and a heating unit 215 to heat the mold M on which the molding base material is mounted. In addition, when the molding base material reaches a certain temperature, the mold (M) may be pressed to deform the molding base material into a design shape (eg, a shape engraved on the mold). According to one embodiment, the 'constant temperature' at the time of pressing the mold (M) may mean a temperature at which the molding base material is denatured in a state having a predetermined critical flexibility or viscosity value or more. there is. According to another embodiment, the 'constant temperature' at the time of pressing the mold (M) is applied by the mold (M) (or applied to the mold in the molding part 101 without causing cracks in the molding base material) Ji may mean a temperature reaching a deformable state (by pressing force). In some embodiments, after deforming the molding base material into the design shape, the molding unit 101 may cool the mold M using the cooling unit 217 . For example, the molding base material deformed into the design shape may be hardened into the design shape by being cooled in the molding unit 101 . 'The temperature cooled by the cooling unit 217' is such that even if the pressure applied to the mold M (eg, the pressure applied through the first heating blocks 211 and 213) is removed, the molding base material can be molded. It may refer to a temperature capable of maintaining a later shape.

Hereinafter, with further reference to FIGS. 4 and 5 , the configuration of the forming part 101 will be described in more detail. In the following detailed description, the same reference numerals as in the previous embodiments are given or omitted for components that can be easily understood through the preceding embodiments, and detailed descriptions thereof may also be omitted.

4 and 5 are perspective views illustrating a molding unit 101 (eg, the molding unit 101 of FIG. 1 ) of a molding apparatus according to various embodiments of the present disclosure.

Further referring to FIGS. 4 and 5 , the molding part 101 may include first heating blocks 211 and 213 , heating unit 215(s) or cooling unit 217 . According to one embodiment, the molding unit 101 further includes a molding chamber 111, so that the first heating blocks 211 and 213, the heating unit 215(s) or the cooling unit 217 ) can be housed in an enclosed environment. According to another embodiment, the molding unit 101 further includes a first movable cylinder 113 disposed above the molding chamber 111, so that any one of the first heating blocks 211 and 213 , For example, the first upper heating block 213 may be moved up and down in the first vertical direction V1. In some embodiments, the first movable cylinder 113 may lower the first upper heating block 213 to press the mold M seated between the first heating blocks 211 and 213. . The first movable cylinder 113 or other movable cylinders to be described later may include a pneumatic cylinder, a hydraulic cylinder, or a servo press.

According to various embodiments, the molding chamber 111 may include a first transfer window 219a formed on the side of the preheating unit 102 and a second transfer window 219b formed on the side of the cooling unit 103. there is. For example, the preheated mold may be introduced into the molding chamber 111 through the first transfer window 219a, and when the molding process is completed, the mold is transferred to the molding chamber through the second transfer window 219b. may be discharged from (111). While the molding process is in progress, the first transfer window 219a or the second transfer window 219b may be closed by an opening/closing door (eg, a door indicated by reference numeral '239a').

According to various embodiments, the molding chamber 111 may further include a fluid inlet 119 (shown in FIGS. 1 to 3 ). The molding device 100 or the molding unit 101 may inject an inert gas such as nitrogen into the molding chamber 111 through the inlet 119 . The inert gas can suppress or prevent oxidation of various parts in the molding chamber 111 where a high-temperature molding process is performed. The injection amount or speed of the inert gas may be appropriately adjusted in consideration of the internal temperature of the molding chamber 111 and prevention of oxidation of parts exposed to high temperatures. In this embodiment, the 'inlet 119' is referred to as a configuration for injecting an inert gas, but note that the present invention is not limited thereto. For example, the inlet 119 may be an inlet for injecting cooling water to control the temperature of a cooling unit (eg, the cooling unit 217 of FIG. 3 ) or a molding chamber (eg, the molding chamber 111 of FIG. 3 ). can In another embodiment, the number and location of the inlets 119 may be designed in various ways in consideration of circulation and heat exchange efficiency of a cooling medium (eg, cooling water or inert gas).

According to various embodiments, the first heating blocks 211 and 213 include a first lower heating block 211 on which the mold M is seated and a first upper heating block 213 pressurizing the mold M. ) can be made. For example, the first upper heating block 213 moves up and down by the first movable cylinder 113, and in a state where the mold M is seated on the first lower heating block 211, the mold M ) can be pressurized. According to one embodiment, the first heating blocks 211 and 213 may include a heating device including a cartridge heater, a sheath heater, and a SiC heater. According to another embodiment, the first heating blocks 211 and 213 may directly contact to pressurize or heat the mold M, and at least a contact surface may be formed of a material suppressing thermal deformation such as cemented carbide or ceramic. there is. According to another embodiment, another movable cylinder is disposed on the forming chamber 111 (eg, below the forming chamber 111) to move the first lower heating block 211 up and down. can

According to various embodiments, the heating unit 215(s) may move forward and backward along the first horizontal direction H1 within the molding chamber 111 to be positioned adjacent to the mold M. For example, the heating unit 215 (s) may be disposed at substantially the same height as the mold (M) in the molding chamber 111, and a first position adjacent to the side surface of the mold (M) (eg : It is possible to move forward and backward from the first position P1 in FIG. 7 to a second position farther than the first position (eg, the second position P2 in FIG. 7 ). According to one embodiment, the heating unit 215 is a heating device including a halogen lamp or an infrared lamp, and may heat the mold by using, for example, radiant heat.

According to various embodiments, when the mold M is seated on the first lower heating block 211, the first upper heating block 213 descends (or, the first lower heating block 211 moves down). rise) to contact the mold (M). The first lower heating block 213 or the first upper heating block 213 may heat the mold using a built-in heating device. According to one embodiment, when the first upper heating block 213 or the like heats the mold (M), the heating unit 215 is also positioned adjacent to at least one side of the mold (M) (eg, FIG. In the first position (P1) of 7), the mold (M) may be heated. The heating unit 215 may heat the mold M using radiant heat such as a halogen lamp or an infrared lamp.

In one embodiment, when the mold (M) reaches a certain temperature, the molding base material (eg, glass plate) accommodated in the mold (M) is flexible enough to be deformed by an external force without causing cracks or cracks. or viscosity. When the mold M reaches a certain temperature, the first upper heating block 213 may apply greater pressure to the mold M by the first movable cylinder 113 . For example, in a state of flexibility or viscosity enough to be deformed by an external force, the molding base material is pressed by the first movable cylinder 113 (or the first upper heating block 213) and the mold ( M) can be deformed to correspond to the imprinted shape. In some embodiments, the pressure applied to the mold M may increase in inverse proportion to the internal temperature of the molding chamber 111 . For example, even when the mold M does not reach the molding temperature, the molding base material may have flexibility, and a pressure sufficient to prevent cracks or cracks in the molding base material may be applied to the mold M.

According to various embodiments, the cooling unit 217 may be disposed to be able to move up and down in the first vertical direction V1 within the molding chamber 111 and include a flow path through which a cooling medium such as cooling water flows. can do. According to one embodiment, the cooling unit 217 may adjust the heating temperature or heating/cooling rate in the molding chamber 111 by adjusting the circulation speed of the cooling medium. According to another embodiment, the cooling unit 217 cools the molding base material deformed into a design shape to harden it to an extent capable of maintaining the deformed shape. For example, when the set heating or pressurization is completed, the heating unit 215 moves to a position spaced apart from the mold M (eg, the second position P2 in FIG. 7), and the cooling unit 217 rises. The mold (M) (eg, the side surface of the mold) is surrounded or at least partially adjacent to the side surface of the mold (M) to cool the mold (M) or the deformed molding base material. In one embodiment, if the molding base material is deformed by pressing at a temperature of 1000 degrees Celsius, the cooling unit 217 may cool the mold M or the deformed molding base material to about 800 degrees Celsius or 900 degrees Celsius. While the cooling unit 217 cools the mold M, etc., the first upper heating block 213 may maintain a state in contact with the mold M or pressurize the mold M. .

6 is a perspective view illustrating an example of a heating unit 315 of the molding apparatus 100 (eg, the molding apparatus 100 of FIG. 1 ) according to various embodiments of the present disclosure. 7 is a plan view illustrating a disposition structure of a heating unit 315 and a cooling unit 217 in the molding apparatus 100 (eg, the molding apparatus 100 of FIG. 1 ) according to various embodiments of the present disclosure.

Referring to FIGS. 6 and 7 , the heating unit 315 of the molding device (eg, the molding device 100 of FIG. 3 ) according to various embodiments includes a plurality of radiant heat generating devices, for example, a lamp 315b. can include According to one embodiment, the lamps 315b may be halogen lamps or infrared lamps, and may be arranged on inner surfaces of the bases 315a facing each other. In a molding chamber (eg, the molding chamber 111 of FIG. 4 ), the bases 315a are disposed facing each other, and a mold (eg, the mold M of FIG. 4 ) is disposed between the bases 315a. space can be provided. According to one embodiment, the heating unit 315, for example, the bases 315a, have a first position P1 adjacent to the side of the mold M, and a higher position than the first position P1. It may advance and retreat in the first horizontal direction H1 between the second position P2 farther from (M). When in the first position P1, the bases 315a may be positioned adjacent to at least some of the side surfaces of the mold M, and the lamps 315b operate to heat the mold M. can do. When in the second position (P2), one end of the bases (315a) may be separated from each other to provide a path for inserting (I) the mold (M). When the bases 315a are at the second position P2 , the other ends of the bases 315a may move away from each other to provide a path for discharging the mold M after the molding process is completed (O).

According to various embodiments, the cooling unit 217 (eg, the cooling unit 217 of FIG. 5 ) may be positioned lower than the mold M. For example, in a state in which the heating unit 315 is disposed at a heating position, eg, the first position P1 , the cooling unit 217 may be positioned lower than the mold M. In one embodiment, when the heating unit 315 is disposed in the first position P1, the cooling unit 217 is partially part of the base 315a(s) when viewed from the plan view of FIG. 7 . can be covered by According to one embodiment, when the bases 315a are in the second position P2 , the cooling unit 217 may rise and be positioned to surround the mold M. For example, when the bases 315a are at the second position P2, a space is formed between the mold M and the bases 315a so that the cooling unit 217 is connected to the mold M. It may enter between the heating units 315 (eg, the bases 315a).

Hereinafter, with further reference to FIG. 8 together with FIGS. 1 to 3 , the configuration of the preheating unit 102 (eg, the preheating unit 102 of FIG. 1 ) will be described in more detail. 8 is a perspective view showing the preheating unit 102 of the molding apparatus 100 according to various embodiments of the present disclosure.

Referring further to FIG. 8 , the preheating unit 102 may include a preheating chamber 121 and second heating blocks 221 and 223 . The preheating unit 102 controls the internal temperature of the molding unit 101 from room temperature before the mold is put into the molding unit 101 (eg, when the molding temperature is 1000 degrees Celsius, 800 degrees Celsius to 1000 degrees Celsius) The mold may be heated to a temperature close to or substantially the same as The preheating chamber 121 may accommodate the second heating blocks 221 and 223 and create a sealed or adiabatic environment with respect to the external environment while preheating the mold. The second heating blocks may include a second lower heating block 221 and a second upper heating block 223, and may include a heating device.

According to various embodiments, the preheating unit 102 may further include a second movable cylinder 123 . For example, the second movable cylinder 123 may be disposed above the preheating chamber 121 to adjust a distance between the disposed mold and the second upper heating block 223 . According to another embodiment, the second upper heating block 223 may include a radiant heat generator similar to the heating unit (eg, the heating unit 215 of FIG. 3 ) of the forming part 101 . According to another embodiment, the second upper heating block 223 may include a cartridge heater, a SiC heater, or the like similar to the first upper heating block 213 of the molding unit 101 . If the second upper heating block 223 is similar to the first upper heating block 213, the second movable cylinder 123 is disposed so that the second upper heating block 223 can contact the mold. there is. The configuration of the second movable cylinder 123 or the second heating blocks 211 and 223 is the first movable cylinder or first heating blocks (eg, the first movable cylinder 113 of FIG. 3 or Similar to the first heating blocks 211 and 213), further detailed descriptions will be omitted. In another embodiment, similar to a heating unit (eg, heating unit 315 in FIG. 6 ) disposed in a forming chamber (eg, forming chamber 111 in FIG. 4 ), the second upper heating block 223 may generate radiant heat. It may consist of a generating device. When the second upper heating block 223 is made of a radiant heat generator, the second movable cylinder 123 does not necessarily need to be installed. For example, in the case of a radiant heat generating device, the second upper heating block 223 may be installed in a fixed state inside the preheating chamber 121 . In some embodiments, even if the second upper heating block 223 is made of a radiant heat generator, the second movable cylinder 123 is disposed to move the second upper heating block 223 up and down within a certain range. can make it

According to various embodiments, the preheating chamber 121 may include an inlet and an outlet, and the outlet is substantially the first transfer window of the above-described forming chamber (eg, the first transfer window 219a of FIG. 4 or 5 ). )) or may be part of the first transfer window. For example, the preheating chamber 121 may be connected to one side (eg, the first transfer window 219a) of the molding chamber 111 . Note that FIG. 8 shows a state in which the inlet and outlet are closed by the opening and closing doors 199 and 229, so the inlet and outlet of the preheating chamber 121 are not shown. According to one embodiment, the molding device (eg, the molding device 100 of FIG. 3 ) may further include the opening/closing cylinder 191(s) for operating the opening/closing door(s). For example, the opening/closing cylinder 191 may open and close the inlet of the preheating chamber 121 by operating the opening/closing door 199 at the inlet side, for example, by performing a linear reciprocating motion.

According to various embodiments, the molding apparatus 100 may include a first transfer unit 104 that inserts a mold into the preheating unit 102 or transfers the preheated mold from the preheating unit 102 to the molding unit 101 . ) may be included. The first transfer unit 104 may transfer the mold while moving in the second vertical direction V2 and/or the second horizontal direction H2 with respect to the preheating chamber 121 . The second vertical direction V2 may be substantially the same as or parallel to the aforementioned first vertical direction (eg, the first vertical direction V1 of FIG. 4 ). The second horizontal direction H2 may mean a direction perpendicular to each of the second vertical direction V2 and the aforementioned first horizontal direction (eg, the first horizontal direction H1 of FIG. 4 ).

According to various embodiments, the first transfer unit 104 moves the mold to the second lower heating block 221 (or the molding unit ( 101), the mold seated on the first lower heating block 211) or the mold seated on the second lower heating block 221 may be separated from the second lower heating block 221 or lifted. According to one embodiment, the first transfer unit 104 moves in the second horizontal direction H2 in a state in which the mold is mounted, to the inside of the preheating unit 102 or to the molding unit 101. The mold can be transported inside. For example, the first transfer unit 104 may transfer the mold to the position of the preheating unit 102 or the molding unit 101 by horizontal movement, and descends from the position to move the mold to the preheating unit 102. ) or the molding unit 101 (eg, the second lower heating block 221 or the first lower heating block 211). While the first transfer unit 104 rises from the mold arrangement position, the mold may be lifted (or separated) from the second lower heating block 221 . The operation of the first transfer unit 104 will be reviewed again through FIGS. 10 to 12 .

Hereinafter, with further reference to FIG. 9 together with FIGS. 1 to 3 , the configuration of the cooling unit 103 (eg, the cooling unit 103 of FIG. 1 ) will be described in more detail. 9 is a perspective view illustrating a cooling unit 103 of the molding apparatus 100 according to various embodiments of the present disclosure.

Referring further to FIG. 9 , the cooling unit 103 may include a cooling chamber 131 , a third movable cylinder 133 , and third heating/cooling blocks 231 and 233 . The cooling unit 103 is substantially for cooling the mold ejected from the molding unit 101, but the 'third heating/cooling block' is included to control the cooling rate. For example, by maintaining the cooling rate within a certain range, the structure of the molding base material or molded product can be stabilized, and the third heating/cooling blocks 231 and 233 do not simply cool the mold, but heat the mold as needed. cooling rate can be reduced.

According to various embodiments, the third heating/cooling blocks 231 and 233 may include a heating device using a resistance wire or a passage through which a cooling medium flows. In one embodiment, the cooling unit 103 may cool the mold by introducing gas into the cooling chamber 131 using an air blower or the like. In another embodiment, the gas introduced into the cooling chamber 131 for cooling may be directly injected into the mold. The gas introduced into the cooling chamber 131 may be discharged to the outside after circulating inside the cooling chamber 131 .

According to various embodiments, the cooling unit 103 may substantially cool the mold discharged from the molding unit 101 to room temperature so that the operator can directly handle the mold. Although the cooling unit (e.g., the cooling unit 217 of FIG. 5) partially cools the mold in the molding part 101, the internal temperature of the molding part 101 is kept at a certain level in order to quickly resume the molding process ( Example: When the molding temperature is 1000 degrees Celsius, it can be maintained at 800 degrees Celsius to 1000 degrees Celsius). For example, the cooling unit 103 may cool a mold at a considerably high temperature (eg, 800 degrees Celsius) to room temperature, but may adjust the cooling rate.

According to various embodiments, the cooling unit 103 includes a first cooling unit 103a connected to the other side of the forming chamber 111 (eg, the second transfer window 219b of FIG. 4 ), and the first cooling unit 103a. A second cooling unit 103b connected to the outlet side of the unit 103a may be included. According to one embodiment, the high-temperature molding base material (or molded article) discharged from the molding unit 101 may be cooled for a longer time than the time required for the molding process. For example, when a high-temperature molding base material is rapidly cooled, shape deformation may occur, and a structure of a composition material constituting the molding base material may become unstable. The molding base material or molded product in a high temperature state is cooled while maintaining a pressurized state in the mold, so that deformation of the shape can be suppressed, and the structure of the composition material can be hardened in a stable state.

According to various embodiments of the present invention, the cooling unit 103 includes at least one cooling stage (eg, the first cooling unit 103a and the second cooling unit 103b), thereby forming a base material or a molded product. can be cooled to substantially room temperature (eg, to a temperature that can be safely handled by the operator). According to one embodiment, the first cooling unit 103a may slowly cool the mold at a rate of 30 to 50 degrees Celsius/min until the structure of the molding base material is stabilized, and after the structure of the molding base material is stabilized The second cooling unit 103b may cool the mold more rapidly at a rate of 70 to 100 degrees Celsius/min. The cooling rate of the mold or the molding base material (or molded article) disposed in the mold is determined by the cooling medium flowing through the flow path or the gas introduced into the first cooling part 103a or the second cooling part 103b (eg, inert gas). ) It can be appropriately adjusted using the temperature, circulation speed, etc.

According to various embodiments, by including a plurality of cooling stages, the cooling unit 103 may cool the mold or the molding base material for a longer time than the time required for the molding operation of the forming unit 101 . For example, if a molding process of 10 minutes is performed in the molding unit 101, the mold (or molding base material) discharged from the molding unit 101 is the first cooling unit 103a and the second cooling unit 103b. ) can be cooled for 10 minutes in each (eg, for 20 minutes in the entire cooling unit 103). The number of cooling stages (eg, the first cooling unit 103a or the second cooling unit 103b) disposed as the cooling unit 103 depends on the cooling time and speed of the mold and the second transfer unit 105 to be described later. ) may be appropriately selected in consideration of the horizontal movement range of the A plurality of cooling stages included in the cooling unit 103 may be sequentially connected to other cooling stages, and may cool the mold to a lower temperature as the distance from the molding unit 101 increases.

Hereinafter, a configuration in which the cooling unit 103 includes one cooling stage (eg, the first cooling unit 103a) will be described, and another cooling unit connected to the first cooling unit 103a ( Example: A description of the second cooling unit 103b) or an additional cooling stage not shown may be omitted.

According to various embodiments, the cooling chamber 131 may accommodate the third heating/cooling blocks 231 and 233 and create a sealed or adiabatic environment with respect to the external environment while cooling the mold. The third heating/cooling blocks may include a third lower heating/cooling block 231 and a third upper heating/cooling block 233, and the third movable cylinder 133 is the cooling chamber 131 can be placed on top of For example, the third movable cylinder 133 may move the third upper heating/cooling block 233 up and down. While cooling the mold discharged from the molding unit 101, the third movable cylinder 133 uses the third upper heating / cooling block 233 to form a mold (eg, the third lower heating / cooling block ( 231) can be pressurized. For example, the third movable cylinder 133 may pressurize the mold so that the molding base material may maintain the design shape even while the mold is being cooled.

According to various embodiments, the cooling chamber 131 may include an inlet or outlet (eg, an outlet of the first cooling unit 103a or an inlet of the second cooling unit 103b indicated by reference number '539'). The inlet (eg, the inlet of the first cooling unit 103a) is substantially connected to the second transfer window (eg, the second transfer window 219b of FIG. 4 or 5) of the molding chamber described above, or It may be part of the second transfer window. For example, the cooling chamber 131 may be connected to the other side (eg, the second transfer window 219b) of the molding chamber 111 . 9 shows a state in which the opening and closing doors (eg, the opening and closing doors 239a and 239b of FIG. 3 or 4) close the inlet and outlet of the cooling unit (eg, the first cooling unit 103a). Note that the inlet and outlet of the cooling chamber 131 are not clearly shown. According to one embodiment, the molding device (eg, the molding device 100 of FIG. 3 ) may further include other opening/closing cylinder(s) for operating the opening/closing door(s) 239a and 239b.

According to various embodiments, the molding device 100 transfers the mold from the molding unit 101 to the cooling unit 103 or discharges the mold cooled in the cooling unit 103 to the outside (or other and a second transport unit 105 for transporting to the cooling stage. The second transfer unit 105 may transfer the mold while moving in a third vertical direction V3 and/or a third horizontal direction H3 with respect to the cooling chamber 131 . The third vertical direction V3 may be, for example, the aforementioned first vertical direction (eg, the first vertical direction V1 of FIG. 4 ) or the second vertical direction (eg, the second vertical direction of FIG. 8 ( V2)) can be substantially the same or parallel. The third horizontal direction H3 may mean a direction perpendicular to each of the third vertical direction V3 and the aforementioned first horizontal direction (eg, the first horizontal direction H1 of FIG. 4 ). In one embodiment, the third horizontal direction H3 may be substantially the same as or parallel to the aforementioned second horizontal direction H2.

According to various embodiments, the second transfer unit 105 may seat the mold on the third lower heating/cooling block 231 while moving in the third vertical direction (V3), for example, in an elevation movement. , The mold seated on the first lower heating block 211 may be separated from or lifted from the first lower heating block 211 . In some embodiments, the second transfer unit 105 may separate or lift the mold seated on the third lower heating/cooling block 231 from the third lower heating/cooling block 231 . According to one embodiment, the second transfer unit 105 may transfer the mold into the cooling unit 103 by moving in the third horizontal direction H3 while the mold is mounted thereon. For example, the second transfer unit 105 may transfer the mold from the molding unit 101 to the position of the cooling unit 103 by horizontal movement, and descends from the position to transfer the mold to the cooling unit ( 103) (eg, the third lower heating/cooling block 231). In another embodiment, when the mold is seated in the third lower heating/cooling block 231), the second transfer unit 105 rises from the lower part of the mold and moves to the third lower heating/cooling block 231. The mold can be lifted (or released) from the mold. The operation of the second transfer unit 105 will be reviewed again through FIGS. 13 and 14 .

10 and 11 are perspective views illustrating an operation of inserting a mold into the preheating unit 102 (eg, the preheating unit 102 of FIG. 1 ) in the molding apparatus 100 according to various embodiments of the present disclosure. 12 is a perspective view illustrating an operation of inserting a mold into a molding unit 101 (eg, the molding unit 101 of FIG. 1 ) in the molding apparatus 100 according to various embodiments of the present disclosure.

10 and 11, while the first transfer unit 104 moves in the second vertical direction V2 or the second horizontal direction H2, the preheating unit 102 or the molding unit 101 ), the mold (M) can be seated or transported. The mold M may be seated on the first seating part T1 of the first transfer unit 104 outside the preheating chamber 121 . In one embodiment, a separate transfer device such as a crane (eg, a transfer device indicated by reference number '193' in FIG. 2) may seat the mold M on the first seating portion T1. The mold (M) seated on the first seating part (T1), while the preheating, molding, and cooling completed molds in the molding apparatus 100 are discharged from the corresponding chamber, respectively, the first transfer unit ( 104) may be introduced into the preheating unit 102. According to one embodiment, the first transfer unit 104 inputs the mold M into the preheating unit 102 and at the same time transfers the mold preheated in the preheating unit 102 to the molding unit 101. can be transferred to While the mold is transferred as described above, the opening/closing cylinder 191 may operate the opening/closing door 199 to keep the inlet of the preheating chamber 121 open. While the first transfer unit 104 moves horizontally along the second horizontal direction H2, the inlet of the preheating chamber 121 or the first transfer window 219a may remain open.

According to various embodiments, in a state in which the mold M is seated on the first seating part T1, the first transfer unit 104 transfers the mold M to the inlet of the preheating chamber 121 and It may be moved (eg, raised) along the second vertical direction (V2) in a parallel position (eg, the same height). According to one embodiment, the first transfer unit 104 has already moved along the second vertical direction V2, and the mold M is seated on the first seating portion T1 and the preheating chamber at the same time. It can be located parallel to the inlet of (121). According to one embodiment, the first transfer unit 104 may include a second seating portion T2 different from the first seating portion T1. The first seating part T1 and the second seating part T2 may be arranged along the second horizontal direction H2. The second seating part T2 may be positioned below the preheating chamber 121 before the first transfer unit 104 rises, and when the first transfer unit 104 rises, the second seating part T2 Part T2 may be located inside the preheating chamber 121 . Although reference numerals are not assigned in the drawings, the preheating chamber 121 may include an opening or a slit through which the second seating portion T2 may enter and exit.

According to various embodiments, in an elevated state as shown in FIG. 10 , the first transfer unit 104 moves in the second horizontal direction H2 to transfer the mold M to the second lower heating block ( 221) can be transferred to the corresponding position. For example, the first seating part T1 may move into the preheating chamber 121 and the second seating part T2 may enter the molding part 101 . When the mold M is positioned correspondingly to the second lower heating block 221, the first transfer unit 104 descends in the second vertical direction V2 to move the mold M to the second lower heating block 221. It can be placed in the lower heating block 221. In a state where the mold M is disposed on the second lower heating block 221, the first transfer unit 104 interferes with the inner floor of the preheating chamber 121 or the first transfer window 219a. It may move in the second horizontal direction H2 while maintaining a position where it is not. For example, after the mold M is seated on the second lower heating block 221, the first transfer unit 104 moves along the second horizontal direction H2, and the first seating part ( T1 ) may be located outside the preheating chamber 121 , and the second seating part T2 may be located inside the preheating chamber 121 . When the second seating portion T2 reaches a position corresponding to the opening or slit of the preheating chamber 121 (or a position corresponding to the second lower heating block 221), the first transfer unit ( 104) may descend along the second vertical direction V2. For example, the second seating portion T2 may move to a lower portion of the preheating chamber 121 through an opening or a slit of the preheating chamber 121 .

According to various embodiments, the mold M preheated in the preheating chamber 121 is separated from or lifted from the second lower heating block 221 by the second seating part T2 to form the forming chamber 111 ) can be transported into the interior of While transferring the mold M from the preheating chamber 121 to the molding chamber 111, the first transfer unit 104 may sequentially perform an ascending motion, a first horizontal motion, and a first descending motion. there is. After the mold M is seated in the forming chamber 111, for example, on the first lower heating block 211 (eg, after the first transfer unit 104 moves down for the first time) , The first transfer unit 104 may position the second seating part T2 below the preheating chamber 121 by sequentially performing a second horizontal motion and a second descending motion. An operation of transferring the mold to the molding unit 101 may be substantially the same as an operation of inserting the mold M into the preheating chamber 121 . Heating units, for example, the bases 315a of FIG. 7 , may be moved or disposed to the second position P2 while the second seating part T2 is located inside the forming chamber 111. .

According to various embodiments, if another mold is already disposed inside the preheating chamber 121 (eg, the second lower heating block 221), the mold M is placed inside the preheating chamber 121. While being transported to the , the second seating part T2 lifts or separates the mold disposed on the second lower heating block 221 to transfer it to the molding part 101 . For example, if another mold is already placed inside the preheating chamber 121 (if the mold is in a preheated state), the operation of transferring the mold from the preheating chamber 121 to the molding chamber 111 and the preheating chamber The operation of inputting the mold M to 121 may be simultaneously performed by the first transfer unit 104 . For example, in a state where the first mold is placed on the first seating part T1 and the preheated second mold is placed on the second seating part T2, the first transfer unit 104 moves the first mold and the second mold. may be transferred to the preheating unit 102 and the molding unit 101, respectively.

13 and 14 are perspective views illustrating an operation of discharging a mold from a molding unit 101 (eg, the molding unit 101 of FIG. 1 ) in the molding apparatus 100 according to various embodiments of the present disclosure.

Referring to FIGS. 13 and 14 , the mold that has completed the molding process in the molding unit 101 may be discharged by the second transfer unit 105 or transferred to the cooling unit 103 . The second transfer unit 105 is disposed below the cooling unit 103, and when the molding process of the molding unit 101 is completed, it rises along the third vertical direction V3 and then enters the inlet or It may move horizontally through an outlet (for example, an outlet of the first cooling unit 103a indicated by reference number 539 or an inlet of the second cooling unit 103b) or the second transfer window 219b. The third seating portion T3 of the second transfer unit 105 may enter the molding chamber 111 by moving horizontally along the third horizontal direction H3 . When the second transfer unit 105 (or the third seating part T3) is located inside the molding chamber 111, the heating unit (eg, the bases 315a of FIG. 7) It may be moved or disposed to a second position (eg, the second position P2 of FIG. 7) spaced apart from (M). When the second transfer unit 105 (or the third seating part T3) is located inside the molding chamber 111, the cooling unit 217 is used to heat the mold M or the first lower part. It may be disposed at a lower position than the block 211. Inside the molding chamber 111, the third seating part T3 rises from the lower part of the mold M to lift or separate the mold M from the first lower heating block 211. .

According to various embodiments, when the mold M reaches substantially the same height as the second transfer window 219b, the second transfer unit 105 stops the movement in the vertical direction and the third horizontal transfer window 219b. By moving along the direction H3, the mold M may be transferred to the cooling unit 103. When the third seating part T3 or the mold M is positioned correspondingly to the third lower heating/cooling block 231, the second transfer unit 105 moves in the third vertical direction V3. The mold (M) may be disposed on the third lower heating/cooling block 231 by descending along it. If another mold being cooled in the cooling unit 103 is already placed, the second transfer unit 105 moves the fourth seating unit (T3) while transferring the mold (M). T4) may be used to transport or discharge other molds being cooled from the cooling unit 103.

According to various embodiments, after disposing a mold on the third lower heating/cooling block 231, the second transfer unit 105 further descends along the third vertical direction V3 to the cooling unit ( 103) may be located below. Although reference numerals are not given in the drawings, the cooling unit 103, for example, the cooling chamber 131 may include an opening or a slit, and the second transfer unit 105 may include the cooling chamber 131 ) may move into or out of the cooling chamber 131 through the opening or slit.

According to various embodiments, an inert gas may be injected into the molding chamber while a molding process is performed in the molding unit 101 . For example, durability of the molding apparatus 100 and durability of the mold M may be secured by suppressing oxidation of various parts operating in a high-temperature environment using an inert gas. After heating/pressing is completed, the inert gas injected into the molding chamber may cool the mold M or the molded article in the mold to a certain temperature together with the cooling unit 217 .

In one embodiment, since the mold M is substantially transported in a floating state inside various chambers by the first transfer unit 104 or the second transfer unit 105, interference or friction with other structures can be freed from For example, damage to the mold or generation of foreign substances due to interference or friction during the transfer of the mold M can be suppressed. According to another embodiment, the molding apparatus 100 to remove foreign substances that may occur inside each of the aforementioned chambers (eg, the molding chamber 111, the preheating chamber 121, or the cooling chamber 131). ) may further include a suction device. In some embodiments, even if a foreign substance is generated in one of the chambers described above, since the mold is transferred in a floating state, it is possible to prevent other chambers from being contaminated by the foreign substance.

15 and 16 are views respectively illustrating a curved plate 600 formed by a molding device (eg, the molding device 100 of FIG. 1 ) according to various embodiments of the present disclosure.

15 and 16, the curved plate 600 formed through the above-described molding apparatus is, for example, a front cover of an electronic device (eg, a window member for a display), and is edged by finishing treatment after molding. Some areas of may include a printed layer. According to one embodiment, the molding base material introduced into the mold (eg, between the lower mold and the upper mold) of the mold (eg, the mold M in FIG. 14 ) may be a glass material in the form of a flat plate, and The curved plate 600 may at least partially include the curved surface C. According to one embodiment, the curved plate (eg, the curved plate 600) after being molded may be used as a rear cover of an electronic device. In some embodiments, the shape of the curved plate 600 (eg, a ratio of a curved surface area, a curvature of a curved surface, etc.) may vary. For example, since the curved plate 600 is molded corresponding to the shape imprinted on the mold, the shape of the curved plate 600 may vary according to the shape imprinted on the mold. For example, as shown in FIG. 15 or 16, the curved plate 600 may have a shape in which both edges of the curved plate 600 are molded into curved surfaces, and in another embodiment, both edges and upper and/or lower edges are also curved. It may be a molded shape.

In order to process a curved glass material, a process such as chamfering or polishing may be performed, but chamfering or polishing is a process of removing a material, and consumption of raw materials may increase. In addition, it has been previously described that chamfering or polishing may require a lot of processing time, and it may be difficult to mass-produce products of uniform quality.

According to various embodiments of the present invention, in manufacturing the curved plate 600 using a glass material, the molding device, for example, the above-described molding part (eg, the molding part 101 of FIG. 3) cracks However, after heating the molding base material to a state having a degree of flexibility or viscosity that does not cause breakage, the molding base material may be deformed into a desired shape through pressurization. For example, it is possible to substantially suppress consumption of raw materials and produce curved plates of uniform quality. While the molding process is in progress in the molding section, another mold (or molding base material) that has completed the molding process is cooled in the cooling section, and another mold (or molding base material) to be introduced into the molding section may be sufficiently preheated in the preheating section. For example, in a molding process requiring cooling and heating of a mold, the molding unit according to various embodiments of the present invention continuously performs a molding process while substantially maintaining the molding temperature, thereby forming a molded product (eg, the curved plate 600 of FIG. 15). production can be increased.

A molding device (eg, the molding device 100 of FIG. 3) according to various embodiments of the present invention,

a pre-heating part (eg, the pre-heating part 102 of FIG. 3 ) for pre-heating the mold containing the basic material;

a forming part that deforms at least a portion of the base material by pressing the mold while heating the preheated mold (eg, the forming part 101 of FIG. 3 ); and

It may include a cooling part (eg, the cooling part 103 of FIG. 3) for cooling the mold transferred from the molding part,

The molding part,

first heating blocks (eg, the first heating blocks 211 and 213 of FIG. 3 ) that pressurize and simultaneously heat the mold from the lower and upper portions of the mold;

at least one heating unit (eg, the heating unit 215 of FIG. 3 ) for heating at least a portion of the side surface of the mold; and

It may include a cooling unit (eg, the cooling unit 217 of FIG. 3 ) positioned adjacent to at least a part of the side surface of the mold by the lifting movement.

According to various embodiments, the first heating blocks may heat the mold by contacting the mold.

According to various embodiments, the heating unit may heat the mold using radiant heat.

According to various embodiments, the molding part,

a forming chamber accommodating the first heating blocks, the heating unit or the cooling unit (eg, the forming chamber 111 of FIG. 3 ); and

It may further include a first movable cylinder (eg, the first movable cylinder 113 of FIG. 3) disposed above the molding chamber,

The first movable cylinder may lift and lower an upper block among the first heating blocks.

According to various embodiments, the heating unit may be disposed at a first position adjacent to the mold (eg, the first position P1 in FIG. 7 ) and at a second position farther than the first position (eg, the first position P1 in FIG. 7 ). It can move horizontally between two positions (P2)).

According to various embodiments, the heating unit may move horizontally between a first position adjacent to the mold and a second position farther than the first position,

When the heating unit is in the second position, the cooling unit may be raised and positioned adjacent to a side surface of the mold.

According to various embodiments, the molding unit may further include an inlet (eg, the inlet 119 of FIG. 3 ) for injecting an inert gas into the molding chamber.

According to various embodiments, the preheating unit (eg, the preheating unit 102 of FIG. 3),

a preheat chamber (eg, preheat chamber 121 of FIG. 3 );

a second lower heating block (eg, the second lower heating block 221 of FIG. 3 ) disposed in the preheating chamber and in which the injected mold is seated; and

A second upper heating block (eg, the second upper heating block 223 of FIG. 3 ) may be included to heat the mold by contacting the mold or by using radiant heat in the preheating chamber.

According to various embodiments, the cooling unit (eg, the cooling unit 103 of FIG. 3),

a cooling chamber (eg, cooling chamber 131 in FIG. 3 );

a third movable cylinder disposed above the cooling chamber (eg, the third movable cylinder 133 in FIG. 3);

a third lower heating/cooling block (eg, the third lower heating/cooling block 231 of FIG. 3) disposed in the cooling chamber and in which the introduced mold is seated; and

A third upper heating/cooling block (eg, the third upper heating/cooling block 233 of FIG. 3 ) moving up and down by the third movable cylinder within the cooling chamber may be included.

According to various embodiments, the cooling unit may include a plurality of cooling chambers,

A plurality of the cooling chambers may be sequentially arranged from the forming part.

According to various embodiments, the molding unit may include a molding chamber accommodating the first heating blocks, the heating unit, or the cooling unit,

The preheating unit may include a preheating chamber connected to one side of the molding chamber, and second heating blocks for preheating the mold in the preheating chamber,

The cooling unit may include a cooling chamber connected to the other side of the molding chamber and a third heating/cooling block for heating or cooling the mold transferred from the molding chamber.

According to various embodiments, the molding apparatus may include a transporting window provided between the molding chamber and the preheating chamber or between the molding chamber and the cooling chamber (eg, first and second transport windows in FIG. 4 ). 219a, 219b)) may further be included,

The transport window is closed when the mold is seated in at least one of the molding chamber, the preheating chamber, and the cooling chamber, and is selectively opened to be between the preheating chamber and the molding chamber or between the molding chamber and the cooling chamber. can provide a mold transport path.

According to various embodiments, the molding device,

a first transfer unit (for example, the first transfer unit 104 of FIG. 3 ) that inputs the mold into the preheating unit by horizontal movement or transfers the preheated mold from the preheating unit to the molding unit; and

A second transfer unit (eg, the second transfer unit 105 of FIG. 3 ) may be further included to transfer the mold from the molding unit to the cooling unit by horizontal movement or to discharge the mold from the cooling unit.

According to various embodiments, when the mold reaches the position where the preheating unit or the molding unit is disposed by horizontal movement of the first transfer unit, the first transfer unit descends to move the mold to the preheating unit or the molding unit. can be settled.

According to various embodiments, the second transfer unit,

It can rise in the molding part or the cooling part to float the mold (floating the (metal) mold),

The floating mold may be ejected from the molding unit or the cooling unit by horizontal movement.

According to various embodiments of the present invention, the molding device is for molding a glass material,

forming chamber;

Heating blocks disposed in the molding chamber and including a lower block in which a mold containing a flat plate-shaped glass material is seated, and an upper block pressurizing the mold from an upper portion;

a heating unit selectively disposed at a position adjacent to a side surface of the mold seated on the lower block (hereinafter referred to as a 'first position'); and

It may include a cooling unit selectively disposed at a position at least partially adjacent to a side surface of the mold,

While the upper block presses the mold,

the heating unit heats the mold at the first position;

When the heating unit deviates from the first position, the cooling unit may be disposed adjacent to a side surface of the mold.

According to various embodiments, the heating blocks may directly contact each other, and the heating unit may heat the mold using radiant heat.

According to various embodiments, the molding device,

a first transfer unit that inserts the mold into the molding chamber by horizontal movement and moves the mold downward in the molding chamber to seat the mold on the lower block; and

A second transfer unit lifting the mold from the lower block by moving upward inside the molding chamber and discharging the lifted mold from the molding chamber by horizontal movement may be further included.

According to various embodiments, the molding apparatus may further include a movable cylinder mounted on an upper portion of the molding chamber,

The movable cylinder may move the upper block up and down.

According to various embodiments, the molding apparatus may further include an inlet for injecting an inert gas into the molding chamber.

In the above detailed description of the present invention, specific embodiments have been described, but it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present invention.

For example, in various embodiments of the present invention, the temperature of heating or cooling performed in a molding chamber, a preheating chamber, or a cooling chamber is presented as a certain value, but this is only an example, and the heating temperature in actual product manufacturing B. Cooling temperature or heating/cooling rate can be appropriately adjusted according to the material of the molded product.

100: molding device 101: molding unit
102: preheating unit 103: cooling unit
104: first transfer unit 105: second transfer unit
M: mold 111: molding chamber
211: first lower heating block 213: first upper heating block
215 Heating unit 217 Cooling unit

Claims (20)

In the molding device,
a pre-heating part for pre-heating a mold containing a basic material;
a forming part that deforms at least a portion of the base material by pressing the mold while heating the preheated mold; and
It includes a cooling part for cooling the mold transferred from the molding part,
The molding part,
first heating blocks for simultaneously heating and pressurizing the mold from lower and upper portions of the mold;
at least one heating unit for heating at least a portion of a side surface of the mold; and
A molding apparatus comprising a cooling unit positioned adjacent to at least some of the side surfaces of the mold by means of a lifting motion.
The molding apparatus according to claim 1, wherein the first heating blocks heat the mold by contacting the mold.
The molding apparatus according to claim 1, wherein the heating unit heats the mold using radiant heat.
The method of claim 1, wherein the molding part,
a molding chamber accommodating the first heating blocks, the heating unit or the cooling unit; and
Further comprising a first movable cylinder disposed above the molding chamber,
The first movable cylinder moves the upper block of the first heating blocks up and down.
5. The molding apparatus according to claim 4, wherein the heating unit moves horizontally between a first position adjacent to the mold and a second position further away from the first position.
The method of claim 4, wherein the heating unit moves horizontally between a first position adjacent to the mold and a second position farther than the first position,
When the heating unit is in the second position, the cooling unit is raised and positioned adjacent to a side surface of the mold.
The molding apparatus according to claim 4, wherein the molding unit further comprises an inlet for injecting an inert gas into the molding chamber.
The method of claim 1, wherein the preheating unit,
warm-up chamber;
a second lower heating block disposed in the preheating chamber and on which the injected mold is seated; and
and a second upper heating block that heats the mold by contacting the mold in the preheating chamber or by using radiant heat.
The method of claim 1, wherein the cooling unit,
cooling chamber;
a third movable cylinder disposed above the cooling chamber;
a third lower heating/cooling block disposed in the cooling chamber and in which the injected mold is seated; and
and a third upper heating/cooling block moved up and down by the third movable cylinder in the cooling chamber.
10. The method of claim 9, wherein the cooling unit includes a plurality of the cooling chambers,
A plurality of the cooling chambers are disposed sequentially from the molding unit.
◈Claim 11 was abandoned when the registration fee was paid.◈ According to claim 1,
The molding unit includes a molding chamber accommodating the first heating blocks, the heating unit or the cooling unit,
The preheating unit includes a preheating chamber connected to one side of the molding chamber, and second heating blocks for preheating the mold in the preheating chamber,
The cooling unit includes a cooling chamber connected to the other side of the molding chamber and a third heating / cooling block for heating or cooling the mold transferred from the molding chamber.
◈Claim 12 was abandoned when the registration fee was paid.◈ 12. The method of claim 11, wherein the molding apparatus further comprises a transporting window provided between the molding chamber and the preheating chamber or between the molding chamber and the cooling chamber,
The transport window is closed when the mold is seated in at least one of the molding chamber, the preheating chamber, and the cooling chamber, and is selectively opened to be between the preheating chamber and the molding chamber or between the molding chamber and the cooling chamber. Molding device for providing a transport path of the mold in the.
◈Claim 13 was abandoned when the registration fee was paid.◈ The method of claim 1, wherein the molding device,
a first transfer unit for injecting the mold into the preheating unit by horizontal movement or transferring the preheated mold from the preheating unit to the molding unit; and
The molding apparatus further comprises a second transfer unit for transporting the mold from the molding unit to the cooling unit or discharging the mold from the cooling unit by horizontal movement.
◈Claim 14 was abandoned when the registration fee was paid.◈ The method of claim 13, wherein when the mold reaches the position where the preheating unit or the molding unit is disposed by horizontal movement of the first transfer unit, the first transfer unit descends to move the mold to the preheating unit or the molding unit. shaping device for anchoring.
◈Claim 15 was abandoned when the registration fee was paid.◈ The method of claim 13, wherein the second transfer unit,
Floating the (metal) mold by rising in the molding part or the cooling part,
A molding device for discharging the lifted mold from the molding part or the cooling part by horizontal movement.
delete delete delete delete delete

Images