KR102476810B1 - Method of forming a composite including metal and ceramic - Google Patents
Method of forming a composite including metal and ceramic Download PDFInfo
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- KR102476810B1 KR102476810B1 KR1020150181021A KR20150181021A KR102476810B1 KR 102476810 B1 KR102476810 B1 KR 102476810B1 KR 1020150181021 A KR1020150181021 A KR 1020150181021A KR 20150181021 A KR20150181021 A KR 20150181021A KR 102476810 B1 KR102476810 B1 KR 102476810B1
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
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- C23C24/00—Coating starting from inorganic powder
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/129—Flame spraying
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
Abstract
본 발명의 일 실시예에 따르면, 기판, 금속 분말 및 세라믹 분말을 준비하는 단계, 및 상기 금속 분말 및 상기 세라믹 분말을 분사하여 상기 기판을 코팅하는 단계를 포함하며, 상기 금속 분말은 저온 분사 공정을 통해 코팅을 수행하고, 상기 세라믹 분말은 열용사 공정을 통해 코팅을 수행하며, 상기 금속 분말 및 상기 세라믹 분말의 코팅은 동시에 수행되는 금속 및 세라믹 복합재 형성 방법을 제공한다.According to one embodiment of the present invention, the steps of preparing a substrate, metal powder, and ceramic powder, and spraying the metal powder and the ceramic powder to coat the substrate, wherein the metal powder is sprayed at a low temperature It provides a method of forming a metal and ceramic composite in which coating is performed through a thermal spraying process, the ceramic powder is coated through a thermal spraying process, and the metal powder and the ceramic powder are simultaneously coated.
Description
본 발명은 금속 및 세라믹 복합재 형성 방법에 관한 것이다.The present invention relates to methods of forming metal and ceramic composites.
일반적으로 저온 스프레이 장치는 마이크로미터(㎛) 크기의 분말 입자를 질소, 헬륨, 공기 등의 고압 가스를 이용하여 입자 속도를 가속시키면 모재와 코팅 소재에 따른 임계 속도에 다다르면서 코팅이 시작되는 저온 분사 코팅(cold spray coating) 장치를 의미한다.In general, a low-temperature spray device accelerates particle speed by using high-pressure gas such as nitrogen, helium, or air to micrometer (㎛)-sized powder particles, and the low-temperature spray starts coating as the critical speed is reached according to the base material and coating material. Means a cold spray coating device.
하지만, 저온 분사 코팅에 사용되는 소재 중 경도가 높은 세라믹 또는 경도가 높은 금속 소재는 저온 분사 코팅에 부적합하고 적층 효율이 떨어지며, 코팅층 특성이 저하될 수 있다.However, ceramic materials with high hardness or metal materials with high hardness among materials used for low-temperature spray coating are unsuitable for low-temperature spray coating, have poor lamination efficiency, and may deteriorate coating layer properties.
이러한 문제점을 보완하기 위해 금속과 세라믹 분말을 혼합하여 저온 분사 코팅을 수행하지만, 금속과 세라믹 분말의 밀도 차이에 의해 균일한 코팅층을 얻기 어렵고, 접합 강도가 약한 문제점이 있다.In order to compensate for this problem, low-temperature spray coating is performed by mixing metal and ceramic powder, but it is difficult to obtain a uniform coating layer due to the difference in density between the metal and ceramic powder, and the bonding strength is weak.
본 발명이 해결하고자 하는 기술적 과제는 적층 효율이 우수하고 균일하며, 고인성(toughness), 고내식성(corrosion resistance), 내마모성(wear resistance) 및 내열성(hear resistance)이 개선된 금속 및 세라믹 복합재의 형성 방법을 제공하고자 한다.The technical problem to be solved by the present invention is to form a metal and ceramic composite having excellent and uniform lamination efficiency and improved toughness, high corrosion resistance, wear resistance and heat resistance. We want to provide a way.
본 발명의 일 구현예는, 기판, 금속 분말 및 세라믹 분말을 준비하는 단계, 및 상기 금속 분말 및 상기 세라믹 분말을 분사하여 상기 기판을 코팅하는 단계를 포함하며, 상기 금속 분말은 저온 분사 공정을 통해 코팅을 수행하고, 상기 세라믹 분말은 열용사 공정을 통해 코팅을 수행하며, 상기 금속 분말 및 상기 세라믹 분말의 코팅은 동시에 수행되는 금속 및 세라믹 복합재 형성 방법을 제공한다.One embodiment of the present invention includes preparing a substrate, metal powder, and ceramic powder, and spraying the metal powder and the ceramic powder to coat the substrate, wherein the metal powder is applied through a low-temperature spraying process. Coating is performed, the ceramic powder is coated through a thermal spraying process, and the metal powder and the ceramic powder are coated simultaneously.
상기 금속 분말은 순수 금속, 혼합 금속 및 합금 중 선택된 어느 하나 이상일 수 있다. The metal powder may be at least one selected from pure metal, mixed metal, and alloy.
상기 금속 분말은 알루미늄, 구리, 주석, 철 및 코발트 중 적어도 어느 하나 일 수 있다.The metal powder may be at least one of aluminum, copper, tin, iron and cobalt.
상기 금속 분말의 입경은 5~ 200㎛일 수 있다.The particle size of the metal powder may be 5 to 200 μm.
상기 세라믹 분말은 알루미나, 실리콘 카바이드, 텅스텐 카바이드 및 다이아몬드 중 적어도 어느 하나 이상일 수 있다.The ceramic powder may be at least one of alumina, silicon carbide, tungsten carbide, and diamond.
상기 세라믹 분말의 입경은 5~ 200㎛일 수 있다.The particle diameter of the ceramic powder may be 5 to 200 μm.
상기 열용사 공정은 가스 화염 용사법, 저속 및 고속 화염 용사법, 폭발 용사법, 대기 플라즈마 용사법 및 감압 플라즈마 용사법 중에서 선택된 어느 하나일 수 있다.The thermal spraying process may be any one selected from a gas flame spraying method, a low-speed and high-speed flame spraying method, an explosive spraying method, an atmospheric plasma spraying method, and a reduced-pressure plasma spraying method.
상기 저온 분사 공정은 저온 분사 노즐을 통해 수행하고, 상기 열용사 공정은 상기 저온 분사 노즐과 별도의 열용사 노즐을 통해 수행할 수 있다.The low-temperature spraying process may be performed through a low-temperature spray nozzle, and the thermal spraying process may be performed through a thermal spray nozzle separate from the low-temperature spray nozzle.
또한, 본 발명의 다른 구현예는, 기판, 금속 분말 및 세라믹 분말을 준비하는 단계, 및 상기 금속 분말 및 상기 세라믹 분말을 분사하여 상기 기판을 코팅하는 단계를 포함하며, 상기 금속 분말은 제1 금속 분말 및 상기 제1 금속 분말보다 상대적으로 경도가 높은 제2 금속 분말을 포함하고, 상기 제1 금속 분말은 저온 분사 공정을 통해 코팅을 수행하고, 상기 제2 금속 분말 및 상기 세라믹 분말은 열용사 공정을 통해 코팅을 수행하며, 상기 금속 분말 및 상기 세라믹 분말의 코팅은 동시에 수행되는 금속 및 세라믹 복합재 형성 방법을 제공한다.Further, another embodiment of the present invention includes preparing a substrate, metal powder, and ceramic powder, and coating the substrate by spraying the metal powder and the ceramic powder, wherein the metal powder is a first metal powder and a second metal powder having a relatively higher hardness than the first metal powder, wherein the first metal powder is coated through a low-temperature spraying process, and the second metal powder and the ceramic powder are subjected to a thermal spraying process The coating is performed through, and the coating of the metal powder and the ceramic powder is performed simultaneously.
이상과 같이 본 발명의 일 실시예에 따른 금속 및 세라믹 복합재 형성 방법은 저온 분사 코팅과 열용사 코팅을 함께 수행하여 복합재를 형성함으로써, 적층 효율이 우수하고 균일하며, 고인성, 고내식성, 내마모성 및 내열성이 개선될 수 있다.As described above, the method for forming a metal and ceramic composite material according to an embodiment of the present invention forms a composite material by performing low-temperature spray coating and thermal spray coating together, so that the lamination efficiency is excellent and uniform, high toughness, high corrosion resistance, wear resistance and Heat resistance can be improved.
도 1은 본 발명의 일 실시예에 따른 코팅 장치의 개략도이다.
도 2는 본 발명의 일 실시예에 따른 복합재 형성 방법에 따라 형성된 금속 및 세라믹 복합재를 촬영한 사진이다.1 is a schematic diagram of a coating apparatus according to an embodiment of the present invention.
2 is a photograph of a metal and ceramic composite formed according to a method for forming a composite according to an embodiment of the present invention.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구항의 범주에 의해 정의될 뿐이다.Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.
명세서 전체에서, 어떤 부분이 어떤 구성요소를 “포함”한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.Throughout the specification, when a certain component is said to "include", it means that it may further include other components without excluding other components unless otherwise stated.
먼저, 도 1을 참고하여 본 발명의 일 실시예에 따른 금속 및 세라믹 분말 복합재의 코팅 장치 및 형성 방법에 대해서 상세하게 설명한다.First, with reference to FIG. 1, a coating apparatus and a method for forming a metal and ceramic powder composite material according to an embodiment of the present invention will be described in detail.
도 1은 본 발명의 일 실시예에 따른 코팅 장치의 개략도이다.1 is a schematic diagram of a coating apparatus according to an embodiment of the present invention.
도 1을 참고하면, 본 발명의 일 실시예에 따른 코팅 장치는 기판(10), 기판(10) 위에 금속/ 세라믹 분말 복합재(10)를 형성하기 위한 저온 분사 노즐(30A) 및 열용사 노즐(30B)을 포함한다.Referring to FIG. 1 , the coating apparatus according to an embodiment of the present invention includes a
금속 분말은 순수 금속, 혼합 금속 또는 합금일 수 있고, 예를 들어 알루미늄, 구리, 주석, 철 및 코발트 중 적어도 어느 하나 이상일 수 있으나, 이에 한정되는 것은 아니며, 다양한 금속 재료일 수 있다.The metal powder may be a pure metal, a mixed metal, or an alloy, and may be, for example, at least one of aluminum, copper, tin, iron, and cobalt, but is not limited thereto, and may be various metal materials.
금속 분말의 입경은 5~ 200㎛일 수 있다. The particle size of the metal powder may be 5 μm to 200 μm.
금속 분말의 입경이 5㎛ 미만일 경우 금속 분말의 송급(loading)이 불균일할 뿐만 아니라, 코팅 공정을 수행할 때 날리는 현상이 발생할 수 있어 코팅 공정에서 적층이 용이하지 않을 수 있고, 금속 분말의 입경이 200㎛ 초과일 경우에는 금속 분말이 완전히 용융되지 않아 코팅 공정이 용이하지 않을 수 있기 때문이다.When the particle diameter of the metal powder is less than 5 μm, not only the loading of the metal powder is non-uniform, but also a flying phenomenon may occur during the coating process, which may make it difficult to stack in the coating process, and the particle diameter of the metal powder This is because when the thickness exceeds 200 μm, the coating process may not be easy because the metal powder is not completely melted.
여기서, 금속 분말은 상대적으로 경도가 낮은(soft) 제1 금속 분말과 제1 금속 분말 대비 경도가 높은(hard) 제2 금속 분말을 포함할 수 있다.Here, the metal powder may include a first metal powder having a relatively low hardness (soft) and a second metal powder having a relatively high hardness (hard) compared to the first metal powder.
또한, 세라믹 분말은 알루미나, 실리콘 카바이드, 텅스텐 카바이드 및 다이아몬드 중 적어도 어느 하나 이상일 수 있으나, 이에 한정되는 것은 아니다.In addition, the ceramic powder may be at least one of alumina, silicon carbide, tungsten carbide, and diamond, but is not limited thereto.
세라믹 분말의 입경은 5~ 200㎛일 수 있다.The particle diameter of the ceramic powder may be 5 to 200 μm.
이는 세라믹 분말의 입경이 5㎛ 미만일 경우 세라믹 분말의 송급(loading)이 불균일할 뿐만 아니라, 코팅 공정을 수행할 때 날리는 현상이 발생할 수 있어 코팅 공정에서 적층이 용이하지 않을 수 있고, 세라믹 분말의 입경이 200㎛ 초과일 경우에는 세라믹 분말이 완전히 용융되지 않아 코팅 공정이 용이하지 않을 수 있기 때문이다.This is because when the particle size of the ceramic powder is less than 5 μm, the loading of the ceramic powder is not uniform, and a flying phenomenon may occur during the coating process, which may make it difficult to stack in the coating process, and the particle size of the ceramic powder This is because when the thickness exceeds 200 μm, the coating process may not be easy because the ceramic powder is not completely melted.
본 실시예에 따른 코팅 장치의 저온 분사 노즐(30A) 및 열용사 노즐(30B)은 기판(20)의 전면에서 자유롭게 이동할 수 있으며, 기판(20)으로부터 소정 거리 이격되어 위치한다.The low-
또한, 저온 분사 노즐(30A) 및 열용사 노즐(30B)은 기판(20) 의 일면에서 소정 거리 이격되어 위치한 채로 동시에 동일한 위치로 이동할 수 있으며, 기판(20)의 코팅을 위한 금속 분말 및/ 또는 세라믹 분말을 가스와 함께 혼합 분사할 수 있다.In addition, the low-
저온 분사 노즐(30A)을 통해 저온 분사 공정을 수행할 수 있으며, 저온 분사 공정은 고상 상태의 공정으로서 금속의 소성 변형을 통하여 코팅이 이루어진다. A low temperature spraying process may be performed through the low
이러한 저온 분사 공정은 수십 mm의 상대적으로 두꺼운 코팅이 가능하며, 소재의 상변화나 산화가 일어나지 않아 원래 분말의 특징을 그대로 유지할 수 있다는 장점이 있다. This low-temperature spraying process is advantageous in that a relatively thick coating of several tens of mm is possible, and the characteristics of the original powder can be maintained without phase change or oxidation of the material.
본 실시예에 따른 저온 분사 노즐(30A)에서는 기판(20)의 일면에 금속 분말의 코팅을 수행할 수 있다.In the low-
열용사 노즐(30B)을 통해서는 열용사 공정을 수행할 수 있으며, 열용사 코팅은 일반적으로 고온의 플라즈마 불꽃에 금속 및/ 또는 세라믹 분말을 주입하여 가열한 후 완전 용융 또는 반용융된 상태에서 기판(20)의 표면에 적층하여 피막을 형성하는 방법이다.A thermal spraying process can be performed through the
열용사 공정으로는 가스 화염 용사법, 저속 및 고속 화염 용사법, 폭발 용사법, 대기 플라즈마 용사법, 감압 플라즈마 용사법 등이 포함될 수 있으나, 이에 한정되지 않는다.The thermal spraying process may include, but is not limited to, a gas flame spraying method, a low-speed and high-speed flame spraying method, an explosive spraying method, an atmospheric plasma spraying method, a reduced-pressure plasma spraying method, and the like.
본 실시예에 따른 열용사 노즐(30B)에서는 기판(20)의 일면에 세라믹 분말의 코팅을 수행할 수 있다.In the
또한, 금속 분말이 상대적으로 경도가 낮은(soft) 제1 금속 분말과 제1 금속 분말 대비 경도가 높은(hard) 제2 금속 분말을 포함할 경우에는 상대적으로 경도가 낮은 제1 금속 분말은 저온 분사 노즐(30A)을 통해 분사되며, 상대적으로 경도가 높은 제2 금속 분말은 열용사 노즐(30B)을 통해 세라믹 분말과 함께 분사될 수 있다.In addition, when the metal powder includes a first metal powder having a relatively low hardness (soft) and a second metal powder having a relatively high hardness (hard) compared to the first metal powder, the first metal powder having a relatively low hardness is sprayed at low temperature The second metal powder, which is sprayed through the
즉, 본 실시예에 따른 금속 및 세라믹 복합재(10) 형성 방법은 저온 분사 노즐(30A) 및 열용사 노즐(30B)을 함께 포함하고 있는 코팅 장치를 사용함으로써, 저온 분사 공정과 열용사 공정이 동시에 수행될 수 있다.That is, in the method of forming the metal and
일반적으로 세라믹 분말 또는 상대적으로 경도가 높은 금속 분말의 경우 저온 분사 공정을 통해 복합재(10)를 형성할 경우 적층 효율이 떨어지고 코팅층 특성이 저하될 뿐만 아니라, 기판(20)과의 접합 강도도 상대적으로 떨어질 수 있다. In general, in the case of ceramic powder or metal powder having relatively high hardness, when the
이에 본 실시예에 따른 복합재(10) 형성 방법은 세라믹 분말 및 경도가 높은 제2금속 분말은 열용사 노즐(30B)을 이용한 열용사 공정을 수행하고, 이와 동시에 상대적으로 경도가 낮은 제2 금속 분말은 저온 분사 노즐(30A)을 이용한 저온 분사 공정을 수행하여 적층 효율이 우수하고 코팅층의 특성을 개선시킬 뿐만 아니라, 기판(20)과의 접합 강도도 개선할 수 있다.Therefore, in the method of forming the
이렇게, 본 발명의 실시예에 따른 복합재의 형성 방법에 따라 형성된 금속 및 세라믹 복합재를 촬영한 사진을 도 2에 나타내었다.In this way, a photograph of a metal and ceramic composite formed according to the method for forming a composite according to an embodiment of the present invention is shown in FIG. 2 .
도 2를 참고하면 금속과 세라믹 복합재가 기판 상에서 균일하게 형성되어 있는 것을 확인할 수 있었다.Referring to FIG. 2 , it was confirmed that the metal and ceramic composite material was uniformly formed on the substrate.
이상과 같이 본 발명의 일 실시예에 따른 금속 및 세라믹 복합재 형성 방법에 따르면, 저온 분사 코팅과 열용사 코팅을 함께 수행하여 복합재를 형성함으로써, 적층 효율이 우수하고 균일하며, 고인성, 고내식성, 내마모성 및 내열성이 개선될 수 있는 장점이 있다.As described above, according to the method for forming a metal and ceramic composite according to an embodiment of the present invention, by performing low-temperature spray coating and thermal spray coating together to form a composite, the lamination efficiency is excellent and uniform, high toughness, high corrosion resistance, There is an advantage that wear resistance and heat resistance can be improved.
10: 복합재 20: 기판
30A: 저온 분사 노즐 30B: 열용사 노즐10: composite material 20: substrate
30A: low
Claims (13)
상기 금속 분말 및 상기 세라믹 분말을 분사하여 상기 기판을 코팅하는 단계를 포함하며,
상기 금속 분말은 저온 분사 공정을 통해 코팅을 수행하고,
상기 저온 분사 공정은 고상 상태의 공정이며,
상기 세라믹 분말은 열용사 공정을 통해 코팅을 수행하며,
상기 금속 분말 및 상기 세라믹 분말의 코팅은 동시에 수행되며,
상기 세라믹 분말은 알루미나 및 실리콘 카바이드 중 적어도 어느 하나 이상인 금속 및 세라믹 복합재 형성 방법.preparing a substrate, metal powder and ceramic powder; and
coating the substrate by spraying the metal powder and the ceramic powder;
The metal powder is coated through a low-temperature spraying process,
The low temperature spraying process is a solid state process,
The ceramic powder is coated through a thermal spraying process,
Coating of the metal powder and the ceramic powder is performed simultaneously,
Wherein the ceramic powder is at least one of alumina and silicon carbide.
상기 금속 분말은 순수 금속, 혼합 금속 및 합금 중 선택된 어느 하나 이상인 복합재 형성 방법.In paragraph 1,
Wherein the metal powder is at least one selected from a pure metal, a mixed metal, and an alloy.
상기 금속 분말은 알루미늄, 구리, 주석, 철 및 코발트 중 적어도 어느 하나 이상인 복합재 형성 방법.In paragraph 2,
Wherein the metal powder is at least one of aluminum, copper, tin, iron and cobalt.
상기 금속 분말의 입경은 5~ 200㎛인 복합재 형성 방법.In paragraph 2,
The particle size of the metal powder is 5 ~ 200㎛ composite material forming method.
상기 세라믹 분말의 입경은 5~ 200㎛인 복합재 형성 방법.In paragraph 1,
The method of forming a composite material in which the particle diameter of the ceramic powder is 5 to 200 μm.
상기 열용사 공정은 가스 화염 용사법, 저속 및 고속 화염 용사법, 폭발 용사법, 대기 플라즈마 용사법 및 감압 플라즈마 용사법 중에서 선택된 어느 하나인 복합재 형성 방법.In paragraph 1,
The thermal spraying process is any one selected from a gas flame spraying method, a low-speed and high-speed flame spraying method, an explosive spraying method, an atmospheric plasma spraying method, and a reduced pressure plasma spraying method.
상기 저온 분사 공정은 저온 분사 노즐을 통해 수행하고,
상기 열용사 공정은 상기 저온 분사 노즐과 별도의 열용사 노즐을 통해 수행하는 복합재 형성 방법.In paragraph 1,
The low-temperature spraying process is performed through a low-temperature spray nozzle,
The thermal spraying process is performed through the low-temperature spraying nozzle and a separate thermal spraying nozzle.
상기 금속 분말 및 상기 세라믹 분말을 분사하여 상기 기판을 코팅하는 단계를 포함하며,
상기 금속 분말은 제1 금속 분말 및 상기 제1 금속 분말보다 상대적으로 경도가 높은 제2 금속 분말을 포함하고,
상기 제1 금속 분말은 저온 분사 공정을 통해 코팅을 수행하고,
상기 저온 분사 공정은 고상 상태의 공정이며,
상기 제2 금속 분말 및 상기 세라믹 분말은 열용사 공정을 통해 코팅을 수행하며,
상기 금속 분말 및 상기 세라믹 분말의 코팅은 동시에 수행되며,
상기 세라믹 분말은 알루미나 및 실리콘 카바이드 중 적어도 어느 하나 이상인 금속 및 세라믹 복합재 형성 방법.preparing a substrate, metal powder and ceramic powder; and
coating the substrate by spraying the metal powder and the ceramic powder;
The metal powder includes a first metal powder and a second metal powder having a relatively higher hardness than the first metal powder,
The first metal powder is coated through a low-temperature spraying process,
The low temperature spraying process is a solid state process,
The second metal powder and the ceramic powder are coated through a thermal spraying process,
Coating of the metal powder and the ceramic powder is performed simultaneously,
Wherein the ceramic powder is at least one of alumina and silicon carbide.
상기 금속 분말은 순수 금속, 혼합 금속 및 합금 중 선택된 어느 하나 이상인 복합재 형성 방법.In paragraph 9,
Wherein the metal powder is at least one selected from a pure metal, a mixed metal, and an alloy.
상기 금속 분말 및 상기 세라믹 분말의 입경은 5~ 200㎛인 복합재 형성 방법.In paragraph 9,
The method of forming a composite material wherein the metal powder and the ceramic powder have a particle diameter of 5 to 200 μm.
상기 저온 분사 공정은 저온 분사 노즐을 통해 수행되고,
상기 열용사 공정은 상기 저온 분사 노즐과 별도의 열용사 노즐을 통해 수행하는 복합재 형성 방법.In paragraph 9,
The low-temperature spraying process is performed through a low-temperature spray nozzle,
The thermal spraying process is performed through the low-temperature spraying nozzle and a separate thermal spraying nozzle.
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