KR102471936B1 - Flexible display device and method for fabricating the same - Google Patents

Abstract

The present invention provides a flexible display device that can effectively dissipate heat generated during operation of the display device without using a metal heat dissipation plate and a manufacturing method thereof. A flexible display device according to the present invention includes a first plastic film and a second plastic film disposed on at least one side of the first plastic film, and the second plastic film includes first metal particles.

Description

Flexible display device and manufacturing method thereof

Embodiments of the present invention relate to a flexible display device and a manufacturing method thereof.

As the era develops into an information society, the importance of a flat panel display device (FPD) having excellent characteristics such as thinning, light weight, and low power consumption is increasing. Flat panel displays include Liquid Crystal Display Device (LCD), Plasma Display Panel Device (PDP), and Organic Light Emitting Display Device (OLED). An electrophoretic display device (EPD) is also widely used.

Among them, liquid crystal display devices and organic light emitting display devices including thin film transistors are excellent in resolution, color display, image quality, etc., and are widely commercialized as display devices for televisions, notebook computers, tablet computers, or desktop computers. Such liquid crystal display devices and organic light emitting display devices are also being developed as flexible display devices having flexibility.

A conventional flexible display device includes a base film, a buffer layer, a thin film transistor, and an organic light emitting diode. The base film is provided on the auxiliary substrate and may be a flexible plastic film. A buffer layer is provided on the base film, and a thin film transistor is provided on the buffer layer. The organic light emitting diode is provided on the thin film transistor and electrically connected to the thin film transistor.

When such a conventional flexible display device is driven, deterioration may occur inside the display device. To prevent this, a metal heat dissipation plate may be provided in the flexible display device. However, since the metal heat dissipation plate includes an opaque metal material, flexibility of the flexible display device may deteriorate. Also, when the flexible display device is implemented as a transparent display device, transmittance of the transparent display device may be reduced by a metal heat dissipation plate.

An object of the present invention is to provide a flexible display device capable of effectively dissipating heat generated during operation of the display device without using a metal heat dissipation plate and a manufacturing method thereof.

A flexible display device according to an embodiment of the present invention includes a first plastic film and a second plastic film disposed on at least one side of the first plastic film, wherein the second plastic film includes first metal particles. .

A method of manufacturing a flexible display device according to an embodiment of the present invention includes forming a first plastic film on an auxiliary substrate, and forming a second plastic film including first metal particles on at least one side of the first plastic film. and separating the first and second plastic films from the auxiliary substrate.

An embodiment of the present invention includes a second plastic film disposed on at least one side of the first plastic film and including first metal particles. Accordingly, in an exemplary embodiment of the present invention, heat generated from the display panel may be radiated to the outside without using a metal heat dissipation plate.

In addition, when the flexible display device according to the present invention is used as a transparent display device, since the second plastic film is disposed in the pad area, heat generated from the display panel can be dissipated without reducing the transmittance of the transparent display device. can

In addition, since the embodiment of the present invention does not use a metal plate, deterioration in flexibility of the flexible display panel due to the metal plate can be prevented.

Also, according to an embodiment of the present invention, since the second plastic film includes the first metal particles, mechanical properties of the second plastic film may be improved. Accordingly, the embodiment of the present invention can improve the curling phenomenon of the pad part due to the deposition of the inorganic film used as the buffer layer.

In addition, since the flexible film including the second metal particles is provided in the embodiment of the present invention, heat generated from the source drive IC and the display panel can be additionally dissipated. That is, the flexible film according to the embodiment of the present invention can perform a heat dissipation function capable of dissipating heat generated from the source driver IC and the pads of the display panel.

In addition to the effects of the present invention mentioned above, other features and advantages of the present invention will be described below, or will be clearly understood by those skilled in the art from such description and description.

1 is an exemplary view showing a flexible display device according to a first embodiment of the present invention;
2 is a cross-sectional view showing a cross-section of one side of a flexible display device according to a first embodiment of the present invention.
3 is an exemplary view showing a flexible display device according to a second embodiment of the present invention.
4 is a cross-sectional view of one side of a flexible display device according to a second embodiment of the present invention;
5 is an enlarged view of a pad area of FIG. 4;
6 is a flowchart illustrating a method of manufacturing a flexible display device according to an exemplary embodiment of the present invention.
7A to 7F are cross-sectional views illustrating a method of manufacturing a flexible display device according to an embodiment of the present invention.

The meaning of terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first” and “second” are used to distinguish one component from another, The scope of rights should not be limited by these terms. It should be understood that terms such as "comprise" or "having" do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It means a combination of all items that can be presented from one or more. The term "on" means not only the case where a certain component is formed directly on top of another component, but also the case where a third component is interposed between these components.

Hereinafter, a preferred example of a flexible display device and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to components of each drawing, the same components may have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

1 is an exemplary diagram showing a flexible display device according to a first embodiment of the present invention. 2 is a cross-sectional view showing a cross-section of one side of a flexible display device according to a first embodiment of the present invention.

In FIG. 1 , the X-axis represents a direction parallel to the gate line, the Y-axis represents a direction parallel to the data line, and the Z-axis represents the height direction of the organic light emitting display device. In addition, in FIG. 1, a configuration invisible by being covered by the flexible film is indicated by a dotted line. Hereinafter, the flexible display device according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2 .

Referring to FIGS. 1 and 2 , a flexible display device according to an exemplary embodiment of the present invention includes a flexible display panel 100, a gate driver 200, a source drive integrated circuit (hereinafter referred to as "IC") (310 ), a flexible film 330, a circuit board 350, and a timing controller 400.

The flexible display panel 100 includes a display area DA and a pad area PA. Gate lines and data lines may be formed in the display area DA, and light emitting units may be formed in intersection areas of the gate lines and data lines. The light emitting units of the display area DA may display an image. The pad area PA is disposed on the edge of the display area DA. The gate driver 200 and pads 160 may be provided in the pad area PA.

Specifically, the flexible display panel 100 includes a first plastic film 111, a second plastic film 113, a buffer layer 130, a thin film transistor (T), a passivation layer (PAS), a planarization layer (PAC), and an organic light emitting layer. A diode (OLED) and an encapsulation layer 180 are included.

The first plastic film 111 is provided in the display area DA. The first plastic film 111 may be a flexible plastic film. For example, the first plastic film 111 may include a cellulose resin such as triacetyl cellulose (TAC) or diacetyl cellulose (DAC), a cyclo olefin polymer (COP) such as norbornene derivatives, or a cyclo olefin copolymer (COC). ), acrylic resin such as PMMA (poly(methylmethacrylate), polyolefin such as PC(polycarbonate), PE(polyethylene) or PP(polypropylene), PVA(polyvinyl alcohol), PES(poly ether sulfone), PEEK(polyetheretherketone) ), polyester such as PEI (polyetherimide), PEN (polyethylenenaphthalate), PET (polyethyleneterephthalate), PI (polyimide), PSF (polysulfone), or fluoride resin. However, it is not limited thereto.

The second plastic film 113 is disposed on the pad area PA. The second plastic film 113 is disposed on at least one side of the first plastic film 111 . However, it is not necessarily limited thereto, and the second plastic film 113 may be disposed surrounding all side surfaces of the first plastic film 111 as shown in FIG. 1 . The second plastic film 113 may be a flexible plastic film. The second plastic film 113 includes first metal particles 113a. Pads 160 are provided on the first surface 113a of the second plastic film 113 . The first metal particles 113c are disposed adjacent to the second surface 113b of the second plastic film 113 opposite to the first surface 113a and electrically insulated from the pads 160 . For example, the second plastic film 113 may include a cellulose resin such as triacetyl cellulose (TAC) or diacetyl cellulose (DAC) provided with the first metal particles 113c, or a COP (such as norbornene derivatives). cyclo olefin polymer), cyclo olefin copolymer (COC), acrylic resins such as poly(methylmethacrylate) (PMMA), polyolefins such as polycarbonate (PC), polyethylene (PE) or polypropylene (PP), polyvinyl alcohol (PVA), Polyester such as polyether sulfone (PES), polyetheretherketone (PEEK), polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET), polyimide (PI), polysulfone (PSF), or fluoride resin ), etc., but is not limited thereto, etc. Here, the first metal particles 113c may be aluminum particles, but are not limited thereto.

The embodiment of the present invention is disposed on at least one side of the first plastic film 111 and includes a second plastic film 113 including first metal particles 113c. Accordingly, in an exemplary embodiment of the present invention, heat generated from the display panel may be radiated to the outside without using a metal heat dissipation plate.

In addition, when the flexible display device according to the present invention is used as a transparent display device, since the second plastic film 113 is disposed in the pad area PA, transmittance of the transparent display device is not lowered and light generated in the display panel is reduced. Heat can be released to the outside.

In addition, since the embodiment of the present invention does not use a metal plate, deterioration in flexibility of the flexible display panel due to the metal plate can be prevented.

In addition, in the embodiment of the present invention, since the second plastic film 113 includes the first metal particles 113c, mechanical properties of the second plastic film 113 may be improved. Accordingly, the embodiment of the present invention can improve the curling phenomenon of the pad part PA due to the deposition of the inorganic film used as the buffer layer.

The buffer layer 130 is provided on the first and second plastic films 111 and 113 . The buffer layer 130 prevents moisture from penetrating into the flexible display panel 100 from the first plastic film 111 , which is vulnerable to moisture permeation, and thereby deteriorating the characteristics of the thin film transistors T. In addition, the buffer layer 130 prevents impurities such as metal ions from diffusing from the first plastic film 111 and penetrating into the active layer ACT. To this end, the buffer layer 130 may include at least one inorganic film. The buffer layer 130 may be, for example, SiO2 (silicon dioxide), SiNx (silicon nitride), SiON (silicon oxynitride), or a multi-layer thereof, but is not necessarily limited thereto.

The thin film transistor T is provided on the first plastic film 111 disposed in the display area DA. The thin film transistor T includes an active layer ACT, a gate insulating layer GI, a gate electrode GE, an interlayer insulating layer ILD, a source electrode SE, and a drain electrode DE.

The active layer ACT is provided on the buffer layer 130 . The active layer ACT includes one end region A1 located on the source electrode SE side, another end region A2 located on the drain electrode DE side, and a center located between one end region A1 and the other end region A2. Area A3 may be included. The central region A3 may be formed of a semiconductor material not doped with a dopant, and one end region A1 and the other end region A2 may be formed of a semiconductor material doped with a dopant.

A gate insulating layer GI is provided on the active layer ACT. The gate insulating layer GI serves to insulate the active layer ACT and the gate electrode GE. The gate insulating layer GI covers the active layer ACT and is formed on the entire surface of the display area DA. The gate insulating layer (GI) may be formed of an inorganic layer, for example, silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiple layers thereof, but is not limited thereto.

The gate electrode GE is provided on the gate insulating layer GI. The gate electrode GE overlaps the central region A3 of the active layer ACT with the gate insulating layer GI interposed therebetween. The gate electrode GE may be made of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto.

An interlayer insulating layer ILD is provided on the gate electrode GE. The interlayer insulating layer ILD covers the gate electrode GE and may be provided on the entire surface of the base film 110 . The interlayer insulating layer (ILD) may be formed of the same inorganic layer as the gate insulating layer (GI), for example, silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiple layers thereof, but is not limited thereto. .

The source electrode SE and the drain electrode DE are spaced apart from each other on the interlayer insulating layer ILD. A first contact hole CNT1 exposing a part of one end area A1 of the active layer ACT and a part of the other end area A2 of the active layer ACT are formed in the aforementioned gate insulating film GI and interlayer insulating film ILD. An exposed second contact hole CNT2 is provided. The source electrode SE is connected to one end region A1 of the active layer ACT through the first contact hole CNT1, and the drain electrode DE connects to the active layer ACT through the second contact hole CNT2. It is connected to the other end area (A2) of.

The configuration of the thin film transistor T is not limited to the above-described example, and may be variously modified into a known configuration that can be easily implemented by those skilled in the art.

The passivation layer PAS is provided on the thin film transistor T. The passivation layer PAS serves to protect the thin film transistor T. The passivation layer (PAS) may be formed of an inorganic film, for example, silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or a multilayer thereof, but is not limited thereto.

The planarization layer PAC is provided on the passivation layer PAS positioned in the display area DA. The planarization layer PAC serves to flatten the top of the second plastic film 113 where the thin film transistor T is provided. The planarization layer (PAC) is made of, for example, acrylic resin, epoxy resin, phenolic resin, polyamides resin, polyimide resin, etc. It may be made, but is not limited thereto. A third contact hole CNT3 exposing the drain electrode DE of the thin film transistor T is provided in the passivation layer PAS and the planarization layer PAC located in the display area DA. The drain electrode DE and the anode electrode AND are connected through the third contact hole CNT3.

The organic light emitting diode (OLED) is provided on the thin film transistor (T). The organic light emitting diode (OLED) includes an anode electrode (AND), an organic layer (EL), and a cathode electrode (CAT). The anode electrode AND is connected to the drain electrode DE of the thin film transistor T through the third contact hole CNT3 provided in the passivation layer PAS and the planarization layer PAC. A bank B is provided between adjacent anode electrodes AND, so that the adjacent anode electrodes AND can be electrically insulated from each other. The bank B may be formed of, for example, an organic layer such as polyimide resin, acryl resin, or benzocyclobutene (BCB), but is not limited thereto.

The organic layer EL is provided on the anode electrode AND. The organic layer EL may include a hole transporting layer, an organic light emitting layer, and an electron transporting layer. Furthermore, the organic layer EL may further include at least one functional layer for improving light emitting efficiency and/or lifetime of the light emitting layer.

The cathode electrode CAT is provided on the organic layer EL and the bank B. When voltage is applied to the anode electrode AND and the cathode electrode CAT, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the organic light emitting layer to emit light.

In FIG. 2 , the flexible display panel 100 is embodied in a top emission method, but is not limited thereto and may be implemented in a bottom emission method. In the top emission method, since the organic layer EL emits light toward the upper substrate, the transistor T can be widely provided under the bank B and the anode AND. Accordingly, the top emission method has an advantage in that the design area of the transistor T is wider than that of the bottom emission method. In the top emission method, it is preferable that the anode electrode AND is formed of a highly reflective metal material such as aluminum or a laminated structure of aluminum and ITO, and the cathode electrode CAT is formed of a transparent metal material such as ITO or IZO.

The encapsulation layer 180 is provided on the thin film transistor T and the organic light emitting diode OLED. In this case, a portion of the second plastic film 113 may be exposed without being covered by the encapsulation layer 180 . The encapsulation layer 180 serves to protect the thin film transistor T and the organic light emitting diode OLED from external impact and to prevent moisture from penetrating into the flexible display panel 100 .

Additionally, an adhesive layer 190 may be provided on the encapsulation layer 180 . The adhesive layer 190 protects the thin film transistor T and the organic light emitting diode OLED from external impact and prevents penetration of moisture. The adhesive layer 190 may be a metal layer or a barrier film, but is not necessarily limited thereto.

The gate driver 200 supplies gate signals to the gate lines according to the gate control signal input from the timing controller 400 . 1 illustrates that the gate driver 200 is formed outside one side of the display area DA of the flexible display panel 100 by a gate driver in panel (GIP) method, but is not limited thereto. That is, the gate driver 200 may be formed on the outside of both sides of the display area DA of the flexible display panel 100 by the GIP method, or may be manufactured as a driving chip and mounted on a flexible film, and may be TAB (tape automated bonding) It can also be attached to the flexible display panel 100 in this way.

The source drive IC 310 receives digital video data and a source control signal from the timing controller 400 . The source drive IC 310 converts digital video data into analog data voltages according to a source control signal and supplies them to data lines. When the source drive IC 310 is manufactured as a driving chip, it may be mounted on the flexible film 330 in a chip on film (COF) or chip on plastic (COP) method.

Pads 160, such as data pads, are provided on a portion of the second plastic film 113 that is exposed and not covered by the encapsulation layer 180. Wires connecting the pads 160 and the source drive IC 310 and wires connecting the pads and wires of the circuit board 350 may be formed on the flexible film 330 . The flexible film 330 is attached on the pads 160 using an anisotropic conducting film, and thus, the pads 160 and wires of the flexible film 330 may be connected.

The circuit board 350 may be attached to the flexible films 330 . A plurality of circuits implemented as driving chips may be mounted on the circuit board 350 . For example, the timing controller 400 may be mounted on the circuit board 350 . The circuit board 350 may be a printed circuit board or a flexible printed circuit board.

The timing controller 400 receives digital video data and timing signals from an external system board (not shown). The timing controller 400 generates a gate control signal for controlling the operation timing of the gate driver 200 and a source control signal for controlling the source drive ICs 310 based on the timing signal. The timing controller 400 supplies gate control signals to the gate driver 200 and supplies source control signals to the source drive ICs 310 .

3 is an exemplary diagram showing a flexible display device according to a second embodiment of the present invention. 4 is a cross-sectional view showing a cross-section of one side of a flexible display device according to a second exemplary embodiment of the present invention. FIG. 5 is an enlarged view of the pad area of FIG. 4 . The second embodiment of the present invention is the same as the first embodiment of the present invention except that the flexible film includes the second metal particle. Therefore, in the following description, only the flexible film and components related thereto will be described, and redundant description of the components other than these will be omitted.

Referring to FIGS. 3 to 5 , the flexible film 330 according to the second embodiment of the present invention includes second metal particles 330c. The flexible film 330 includes lead wires 331 and 332 and a source drive IC 310 . The lead wires 331 and 332 and the source drive IC 310 are disposed on the first surface 330a of the flexible film 330 . The second metal particles 330c are disposed adjacent to the second surface 330b opposite to the first surface 330a of the flexible film 330 . Accordingly, the second metal particles 330c are electrically insulated from the lead wires 331 and 332 and the source drive IC 310 . For example, the second metal particles 330c may be aluminum particles, but are not limited thereto.

The flexible film 330 is attached to the pads 160 of the second base film 113 . A flexible film 330 is attached onto the pads 160 using an anisotropic conducting film. Accordingly, the pads 160 and the first lead wires 331 among the lead wires provided on the flexible film 330 may be electrically connected. In this case, a first adhesive member 391 may be provided between the first lead wires 331 and the pads 160 . The first adhesive member 391 has a conductive ball 391a therein, and the first lead wires 331 and the pads 160 may be electrically connected through the conductive ball 391a.

In addition, the flexible film 330 is attached on the circuit board 350 using an anisotropic conducting film. Accordingly, the circuit board 350 and the second lead wire 332 among the lead wires provided on the flexible film 330 may be electrically connected. In this case, a second adhesive member 392 may be provided between the circuit board 350 and the second lead wire 332 . Like the first adhesive member 391, the second adhesive member 392 has a conductive ball 392a therein, and the circuit board 350 and the second lead wire 332 connect through the conductive ball 392a. can be electrically connected.

The flexible display device according to the second embodiment of the present invention provides the same effect as the flexible display device according to the first embodiment of the present invention. In addition, since the flexible film 330 including the second metal particles 330c is provided, heat generated from the source drive IC 310 and the display panel can be additionally dissipated. That is, the flexible film 330 according to the embodiment of the present invention can perform a heat dissipation function capable of dissipating heat generated from the source drive IC 310 and the pads 160 of the display panel.

6 is a flowchart illustrating a method of manufacturing a flexible display device according to an exemplary embodiment of the present invention. 7A to 7F are cross-sectional views illustrating a method of manufacturing a flexible display device according to an exemplary embodiment of the present invention. This illustrates a manufacturing method of the flexible display panel according to the second embodiment of the present invention shown in FIG. 4 . Therefore, the same reference numerals are assigned to the same components, and redundant descriptions of repetitive parts in the materials and structures of each component are omitted. Hereinafter, a manufacturing method of a flexible display device according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 6 and 7A to 7F.

First, as shown in FIG. 7A , a first plastic film 111 is formed on the auxiliary substrate 115 . For example, the first plastic film 111 may be formed using a slit coating method. The slit coating method is a method of forming a thin flexible film by uniformly applying a liquid material used as the first plastic film 111 onto the auxiliary substrate 115 using a nozzle and then curing the liquid material. However, a method of forming the first plastic film 111 is not necessarily limited thereto, and the first plastic film 111 may be formed by a roll coating method. (S101 in FIG. 6)

Second, as shown in FIG. 7B , a second plastic film 113 including first metal particles 113c is formed on at least one side of the first plastic film 111 . First, a second plastic material in which the first metal particles 113a are mixed is applied to at least one side surface of the first plastic film 111 . For example, the second plastic material may be applied on the auxiliary substrate 115 using a slit coating method. In this case, over time, the first metal particles 113a sink under the second plastic material. After the first metal particles 113a sink under the second plastic material, the second plastic material is thermally cured to manufacture the second plastic film 113 . Accordingly, the first metal particles 113c are disposed adjacent to the second surface 113b opposite to the first surface 113a of the second plastic film 113, and the pads 160 formed in a subsequent process Can be electrically insulated. (S102 in Fig. 6)

Thirdly, as shown in FIG. 7C , thin film transistors T are formed on the first plastic film 111 and pads 160 are formed on the second plastic film 113 . First, the buffer layer 130, the active layer ACT, and the gate insulating layer G1 are sequentially formed on the first plastic film 111. Next, an interlayer insulating layer ILD is formed on the gate electrode GE. Finally, a source electrode SE and a drain electrode DE connected to the active layer ACT through the first and second contact holes CNT1 and CNT2 are formed on the interlayer insulating film ILD, and the second Pads 160 are formed on the plastic film 113 . In this case, the source electrode SE and the drain electrode DE and the pad 160 are simultaneously formed through the same process and may be made of the same material.

Fourth, as shown in FIG. 7D , organic light emitting diodes (OLEDs) connected to the thin film transistors (T) are formed, and an encapsulation layer 180 covering the organic light emitting diodes (OLEDs) is formed. A passivation layer (PAS) and a planarization layer (PAC) are sequentially formed on the thin film transistors (T). The anode electrode AND is formed on the thin film transistor T and is connected to the drain electrode DE through the third contact hole CNT3 provided in the passivation layer PAS and the planarization layer PAC. A bank B is formed between adjacent anode electrodes AND. The organic layer EL is formed on the anode electrode AND. The cathode electrode CAT is formed on the organic layer EL and the bank B. The encapsulation layer 180 is formed to cover the thin film transistor T and the organic light emitting diode OLED. An adhesive layer 190 may be additionally formed on the encapsulation layer 180 .

Fifthly, as shown in FIG. 7E, the flexible films 330 are attached on the pads 160. Link wires connecting the pads 160 and the driving circuit 310 and link wires connecting the pads 160 and the wires of the circuit board 350 may be formed in the flexible film 330 . Also, the flexible film 330 may include second metal particles 330c. The flexible film 330 is attached on the pads 160 using an anisotropic conducting film, and thus the pads 160 and wires of the flexible film 330 can be electrically connected.

Finally, as shown in FIG. 7F , the first and second plastic films 111 and 113 are separated from the auxiliary substrate 115 . In this case, the auxiliary substrate 115 and the first and second plastic films 111 and 113 may be separated from each other using a laser. (S103 in Fig. 6)

The embodiment of the present invention is disposed on at least one side of the first plastic film 111 and includes a second plastic film 113 including first metal particles 113c. Accordingly, in an exemplary embodiment of the present invention, heat generated from the display panel may be radiated to the outside without using a metal heat dissipation plate.

In addition, when the flexible display device according to the present invention is used as a transparent display device, since the second plastic film 113 is disposed in the pad area PA, transmittance of the transparent display device is not lowered and light generated in the display panel is reduced. Heat can be released to the outside.

In addition, since the flexible film 330 including the second metal particles 330c is provided in the embodiment of the present invention, heat generated from the source drive IC 310 and the display panel can be additionally dissipated. That is, the flexible film 330 according to the embodiment of the present invention can perform a heat dissipation function capable of dissipating heat generated from the source drive IC 310 and the pads 160 of the display panel.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention belongs that various substitutions, modifications, and changes are possible without departing from the technical details of the present invention. It will be clear to those who have knowledge of Therefore, the scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention.

100: flexible display panel 105: auxiliary substrate
111: first base film 113: second base film
113a: first metal particle 130: buffer layer
160: pad 180: encapsulation layer
190: adhesive layer 200: gate driving unit
310: source drive IC 330: flexible film
330c: second metal particle 331: first lead wiring
332: second lead wire 391: first adhesive member
391a: conductive ball 392: second adhesive member
350: circuit board 400: timing controller
T: thin film transistor OLED: organic light emitting diode

Claims (8)

a first plastic film;
a second plastic film disposed on at least one side of the first plastic film; and
having pads disposed on the first surface of the second plastic film;
The flexible display device of claim 1 , wherein the second plastic film includes first metal particles disposed adjacent to a second surface opposite to the first surface. According to claim 1,
The second plastic film surrounds all side surfaces of the first plastic film. delete According to claim 1,
and a flexible film attached to the pads of the second plastic film and including second metal particles. According to claim 4,
Further comprising lead wires and a source drive IC disposed on the first surface of the flexible film;
The second metal particles are disposed adjacent to a second surface opposite to the first surface of the flexible film. According to claim 1,
a thin film transistor provided on the first plastic film;
an organic light emitting diode provided on the thin film transistor and electrically connected to the thin film transistor;
an encapsulation layer provided on the organic light emitting diode; and
The flexible display device further comprises an adhesive layer provided on the encapsulation layer. forming a first plastic film on an auxiliary substrate;
forming a second plastic film on at least one side of the first plastic film;
forming pads on the first side of the second plastic film; and
Separating the first and second plastic films from the auxiliary substrate;
The method of claim 1 , wherein the second plastic film includes first metal particles disposed adjacent to a second surface opposite to the first surface. According to claim 7,
forming thin film transistors on the first plastic film;
forming organic light emitting diodes electrically connected to the thin film transistors on the thin film transistors;
forming an encapsulation layer on the organic light emitting diodes and forming an adhesive layer on the encapsulation layer; and
The method of manufacturing a flexible display device further comprising attaching a flexible film including second metal particles to the pads.

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