KR102468069B1 - Temperature control apparatus - Google Patents

Abstract

A temperature control device is disclosed. According to one aspect of the present invention, there is provided a temperature control device for controlling power supplied to a plurality of infrared heaters, comprising: a plurality of power semiconductor elements respectively controlling power supplied to the plurality of infrared heaters; a control board on which the plurality of power semiconductor elements are mounted on an upper surface thereof and having a plurality of first through holes; A bottom portion disposed below the control board, a front portion and a rear portion extending upward from both front and rear ends of the bottom portion, and a pair of outer walls extending upward from both left and right ends of the bottom portion, respectively, connecting the front portion and the rear portion. cases involving wealth; a cover member coupled to the case and closing the open upper surface of the case; and a heat dissipation frame for discharging heat from the plurality of power semiconductor devices to the outside of the case, wherein the bottom portion includes a first bottom portion, a pair of inner wall portions extending downward from both left and right ends of the first bottom portion, and A pair of second bottom portions connecting a lower end of the inner wall portion and a lower end of the outer wall portion to form a channel partitioned by the first bottom portion and the pair of inner wall portions in the lower portion of the case; A second through hole is formed in the center of the first bottom portion, and the heat dissipation frame includes a plate-shaped main panel disposed under the first bottom portion, a plurality of heat dissipation plates extending downward from the main panel, and the main panel. A temperature control device may include a plurality of sub-panels that extend upward from the sub-panel and are coupled to the plurality of power semiconductor devices by sequentially passing through the second through-hole and the plurality of first through-holes.

Description

Temperature control device {TEMPERATURE CONTROL APPARATUS}

The present invention relates to a temperature control device, and more particularly, to a temperature control device capable of controlling the heating temperature of an infrared heater by controlling power supplied to the infrared heater.

In general, a heater equipped with an infrared heat bulb is a device that emits thermal energy of about 200 ° C. when turned on to perform a warming function for a predetermined space. It is used for various purposes such as

In addition, a temperature control device for controlling heating temperature may be connected to the infrared heater.

Such a temperature control device may control the heating temperature of the infrared heater by controlling the power supplied to the infrared heater, and for this purpose, a power semiconductor device may be used.

However, since the power semiconductor device is a heat generating device, a heat dissipation design may be problematic in order to prevent functional degradation or damage due to overheating. In particular, when a plurality of infrared heaters are connected to the temperature control device, heat dissipation design may be an important issue.

Republic of Korea Patent Registration No. 10-2200838 (2021.01.12, temperature control device)

An embodiment of the present invention provides a temperature control device with excellent heat dissipation performance.

According to one aspect of the present invention, there is provided a temperature control device for controlling power supplied to a plurality of infrared heaters, comprising: a plurality of power semiconductor elements respectively controlling power supplied to the plurality of infrared heaters; a control board on which the plurality of power semiconductor elements are mounted on an upper surface thereof and having a plurality of first through holes; A bottom portion disposed below the control board, a front portion and a rear portion extending upward from both front and rear ends of the bottom portion, and a pair of outer walls extending upward from both left and right ends of the bottom portion, respectively, connecting the front portion and the rear portion. cases involving wealth; a cover member coupled to the case and closing the open upper surface of the case; and a heat dissipation frame for discharging heat from the plurality of power semiconductor devices to the outside of the case, wherein the bottom portion includes a first bottom portion, a pair of inner wall portions extending downward from both left and right ends of the first bottom portion, and A pair of second bottom portions connecting a lower end of the inner wall portion and a lower end of the outer wall portion to form a channel partitioned by the first bottom portion and the pair of inner wall portions in the lower portion of the case; A second through hole is formed in the center of the first bottom portion, and the heat dissipation frame includes a plate-shaped main panel disposed under the first bottom portion, a plurality of heat dissipation plates extending downward from the main panel, and the main panel. A temperature control device may include a plurality of sub-panels that extend upward from the sub-panel and are coupled to the plurality of power semiconductor devices by sequentially passing through the second through-hole and the plurality of first through-holes.

The control board may be supported by a plurality of support protrusions protruding from an upper surface of the first bottom part and spaced apart from the upper surface of the first bottom part in a vertical direction.

The channel may extend in a front-rear direction connecting the front part and the rear part, and both ends of the channel in the front-rear direction may be open.

The main panel may face the first bottom part to close the second through hole, and a ring type sealing member may be interposed between the first bottom part and the main panel.

A plurality of fixing protrusions inserted into a plurality of positioning holes formed on a lower surface of the first bottom portion may be formed on an upper surface of the main panel.

The plurality of heat dissipation plates may be spaced apart from each other in a left and right direction perpendicular to the front and rear directions, and passages extending in the forward and backward directions may be respectively formed between the plurality of heat dissipation plates.

A lower end of the heat dissipation plate may be disposed higher than a lower surface of the second bottom part so that the pair of second bottom parts may be placed on a flat bottom surface.

The power semiconductor devices may be coupled to each of the plurality of sub-panels.

The plurality of sub-panels may be spaced apart from each other in a left-right direction perpendicular to the front-back direction.

The sub-panel may include a plate shape perpendicular to the left-right direction.

One surface of the sub-panel may be disposed in contact with the power semiconductor device.

The power semiconductor element has a first fastening part having a third through hole formed thereon at an upper end, a fastening hole is formed in the sub panel, and the power semiconductor element and the sub panel are connected to the fastening hole through the third through hole. It can be coupled to each other through the fastening member to be coupled.

The front part may include a plurality of cable glands.

The cover member may include a display unit for displaying an operating state.

The case may include a second fastening part having a fourth through hole into which a fastening member can be inserted at each corner of the bottom so as to be fixed on the support structure through the fastening member.

According to an embodiment of the present invention, heat generated from the power semiconductor device may be discharged to the outside of the case through the sub-panel of the heat dissipation frame, the main panel, and the heat dissipation plate in sequence.

In particular, since a channel is formed in the lower portion of the case, even when the temperature control device is placed on a flat bottom surface, contact between the heat dissipation frame and the outside air can be smoothly achieved.

In addition, by arranging the main panel of the heat dissipation frame outside the case and ensuring a sufficient separation distance from the control board, the contact area between the heat dissipation frame and the atmosphere can be widened to improve heat dissipation performance, and the heat dissipation frame It is also possible to minimize adverse effects that may be received on the control board and various electronic devices mounted thereon due to heat dissipation.

1 is a block diagram showing a connection relationship of a temperature control device according to an embodiment of the present invention;
2 is a perspective view of the temperature control device of FIG. 1;
Figure 3 is a front view of Figure 2,
Figure 4 is a plan view of Figure 2,
Figure 5 is a bottom view of Figure 2,
6 is an exploded perspective view of FIG. 2;
7 is a cross-sectional view taken along line I-I in FIG. 4;
8 is a cross-sectional view taken at II-II of FIG. 4;
9 is a diagram showing an example of a display screen of the display unit of FIG. 2;
10 is a bottom view of the case of FIG. 6;
11 is a plan view of the case of FIG. 6;
12 is a plan view illustrating the case of FIG. 11 in a state in which a control board is coupled;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Terms used in the embodiments of the present invention may be interpreted as meanings that can be generally understood by those of ordinary skill in the art to which the present invention belongs, unless clearly defined otherwise, and only specific The examples are intended to be illustrative and are not intended to limit the present invention.

In this specification, the singular form will be considered to include the plural form as well, unless otherwise specified.

In addition, when a part is described as "including" a certain component, it means that the corresponding part may further include other components.

In addition, when a component is described as "on", it means above or below the corresponding component, and does not necessarily mean that it is located on the upper side relative to the direction of gravity.

Also, when a component is described as being “connected” or “coupled” to another component, that component is not only directly connected to or coupled to another component, but also indirectly through another component. It may also include the case of being connected or combined with.

In addition, although terms such as first and second may be used to describe a certain component, these terms are only used to distinguish the corresponding component from other components, and the essence or sequence of the corresponding component is determined by the term. or order, etc., is not intended to be limiting.

1 is a block diagram showing a connection relationship of a temperature control device according to an embodiment of the present invention.

Referring to FIG. 1 , the temperature control device 10 according to an embodiment of the present invention may control the heating temperature of the infrared heaters 20 by controlling power supplied to the plurality of infrared heaters 20 .

To this end, the temperature control device 10 may be respectively connected to the plurality of infrared heaters 20 through a plurality of power cables.

In addition, the temperature control device 10 may be connected to the external power source 30 through a power cable in order to receive power to be supplied to the plurality of infrared heaters 20, and operates through the controller 40, for example, a remote controller. A signal may be input.

2 is a perspective view of the temperature control device of FIG. 1 , FIG. 3 is a front view of FIG. 2 , FIG. 4 is a plan view of FIG. 2 , FIG. 5 is a bottom view of FIG. 2 , and FIG. 6 is an exploded perspective view of FIG. 2 , FIG. 7 is a cross-sectional view taken along line I-I in FIG. 4 .

2 to 7, the temperature control device 10 may include a plurality of power semiconductor devices 100, a control board 200, a case 300, a cover member 400, and a heat radiation frame 500. can

The plurality of power semiconductor devices 100 may respectively control power supplied to the plurality of infrared heaters 20 .

For example, the power semiconductor device 100 may include a triac, and one power semiconductor device 100 may control power supplied to one infrared heater 20 .

A plurality of power semiconductor devices 100 may be mounted on an upper surface of the control board 200 . Preferably, the power semiconductor device 100 has a side facing the sub-panel 530 of the heat dissipation frame 500 rather than a lower surface facing the control board 200 in order to maximize a contact area with the heat dissipation frame 500. It can be mounted so that it has a large area. On the other hand, in the present specification, up and down, left and right, or front and back are considered to be set based on the drawings for explanatory convenience unless otherwise specified.

The power semiconductor device 100 may be provided with a first fastening part 110 at an upper end of the power semiconductor device 100 so that it can be fixed to the sub panel 530 through a fastening member such as a bolt, and the first fastening part A third through hole 110a penetrating the first fastening part 110 may be formed in 110 so that a fastening member may be inserted therein.

The control board 200 may be disposed within the case 300, and includes a first terminal 210 to which power cables are connected, a plurality of second terminals 220 to which a plurality of power cables are connected, and the control board 200. It may be provided with a circuit pattern (not shown) connecting various electronic elements and terminals mounted on or coupled thereto.

The control board 200 may have a plurality of first through-holes 200a into which the sub-panels 530 of the heat dissipation frame 500 are respectively inserted.

The case 300 may have a container shape with an open upper surface so that the control board 200 can be mounted therein.

Specifically, the case 300 may include a bottom portion 310, a front portion 320, a rear portion 330, and a pair of outer wall portions 340.

The bottom portion 310 may be placed on a flat bottom surface, for example, the top surface of a support structure.

The front part 320 may extend upward from the front end of the bottom part 310 .

A plurality of cable glands 321, 322, and 323 may be coupled to the front portion 320. Specifically, a power cable may be coupled to the first cable gland 321, a plurality of power cables may be coupled to the plurality of second cable glands 322, respectively, and the third cable gland 323 A sensor cable connecting a temperature sensor (not shown) and the control board 200 may be coupled.

Accordingly, penetration of foreign substances such as dust and moisture through the cable inlet of the case 300 may be suppressed.

The rear part 330 may be disposed to face the front part 320 by extending upward from the rear end of the bottom part 320 .

The pair of outer wall portions 340 extend upward from both left and right ends of the bottom portion 310 to connect the front portion 320 and the rear portion 330, and may be disposed to face each other.

In addition, the bottom part 310 includes a first bottom part 311, a pair of inner wall parts 313, and a pair of second bottom parts so that the air channel C can be formed in the lower part of the case 300. (315).

The first bottom part 311 may be disposed below the control board 200, and the second through hole 311a into which the plurality of sub-panels 530 are inserted is formed at the center of the first bottom part 311. can be formed

The pair of inner wall portions 313 extend downward from both left and right ends of the first bottom portion 311 and may be disposed facing each other.

The pair of second bottom parts 315 may connect a lower end of the inner wall part 313 and a lower end of the outer wall part 340 .

Accordingly, a channel C partitioned by the first bottom portion 311 and the pair of inner wall portions 313 may be formed in the lower portion of the case 300 .

The channel C may extend in the front and back direction (Y direction) connecting the front part 320 and the rear part 330, and both ends of the channel C in the front and rear direction may be open to form an air passage. have.

Also, the pair of second bottom parts 315 may be disposed on the same plane, that is, at the same height.

On the other hand, the case 300 may be provided with a second fastening part 350 at each corner of the lower end of the case 300 so that it can be fixed on the supporting structure through a fastening member such as a bolt, and the second fastening part 350 ) may be formed with a fourth through hole 350a penetrating the second fastening part 350 in the vertical direction (Z direction) so that the fastening member can be inserted. In addition, the case 300 may include a storage unit 360 in which the controller 40 is detachably coupled to accommodate the controller 40 .

The cover member 400 may be coupled to the case 300 to close the open upper surface of the case 300 .

For example, the cover member 400 may be detachably coupled to the case 300 through a fastening member such as a bolt, and between the case 300 and the cover member 400, a ring type first sealing member ( S1) may be interposed to suppress the penetration of foreign substances such as dust and moisture.

A display unit 410 for displaying an operating state of the temperature control device 10 may be formed on an upper surface of the cover member 400, and for this purpose, a display device for driving the display unit 410 ( 420), for example, a display control board and the like may be combined.

The heat dissipation frame 500 may discharge heat from the plurality of power semiconductor devices 100 to the outside of the case 300 .

To this end, the heat dissipation frame 500 may include a main panel 510, a plurality of heat dissipation plates 520, and a plurality of sub panels 530.

The main panel 510 may be formed in a plate shape and may be disposed under the first bottom part 311 .

The main panel 510 may face the first bottom portion 311 to close the second through hole 311a.

In particular, a ring-type second sealing member S2 may be interposed between the first bottom portion 311 and the main panel 510 to prevent penetration of foreign substances such as dust and moisture.

Each of the plurality of heat dissipation plates 520 may protrude from the lower surface of the main panel 510 and extend downward.

The plurality of heat dissipation plates 520 may be spaced apart from each other in a left-right direction (X direction) perpendicular to the front-back direction, and a passage G extending in the forward-backward direction may be formed between the plurality of heat dissipation plates 520 . have. Therefore, the flow path (G) may be formed to extend in the same direction as the channel (C), so that the air introduced into the channel (C) can cool the heat dissipation frame 500 while moving along the flow path (G).

For example, the heat dissipation plate 520 may be formed in a plate shape extending in the front-rear direction.

In particular, a lower end of the heat dissipation plate 520 may be disposed higher than a lower surface of the pair of second bottom parts 315 . Thus, the pair of second bottom parts 315 can be stably seated on the flat bottom surface.

Each of the plurality of sub-panels 530 may protrude from the upper surface of the main panel 510 and extend upward.

The plurality of sub-panels 530 may be coupled to the plurality of power semiconductor devices 100 by sequentially passing through the second through hole 311a and the plurality of first through holes 200a.

For example, one power semiconductor device 100 may be coupled to each of the plurality of sub-panels 530 .

Specifically, a fastening hole 530a corresponding to the third through hole 110a may be formed in the sub panel 530, and the power semiconductor device 100 and the sub panel 530 may have the third through hole 110a. It can be coupled to each other through a fastening member such as a bolt coupled to the fastening hole (530a) through.

In addition, one surface of the sub panel 530 may be disposed in contact with the power semiconductor device 100 .

In addition, the plurality of sub-panels 530 may be spaced apart from each other in a left-right direction perpendicular to the extending direction of the channel C, and the sub-panels 530 may be disposed in a front-back direction parallel to the extending direction of the channel C. It may be formed in an extended plate shape. Therefore, heat dissipation performance can be improved.

8 is a cross-sectional view taken along line II-II of FIG. 4 .

Referring to FIG. 8 , a first cable gland 321 to which a power cable can be coupled can be coupled to the front part 320 of the case 300, and a power cable can be inserted into the front part 320. A cable inlet 320a may be formed. Similarly, a plurality of cable inlets may be formed in the front portion 320 so that power cables or sensor cables coupled to the first cable gland 322 or the third cable gland 323 may be inserted.

9 is a diagram illustrating an example of a display screen of the display unit of FIG. 2 .

Referring to FIG. 9 , the display unit 410 may display an operating state of the temperature control device 10 .

For example, the display unit 410 includes a power connection indicator lamp 410-1, a dimming operation indicator lamp 410-2, a remote controller receiver 410-3, a current temperature display unit 410-4, and an upper limit setting temperature. Display unit 410-5, lower limit setting temperature display unit 410-6, operating time display unit 410-7, power on/off button 410-8, dimming range setting button 410-9, temperature range setting button (410-10), a setting down button 410-11, and a setting up button 410-12.

When the user checks the connection state of the power cable and presses the power on/off button 410-8, the power connection indicator lamp 410-1 may be turned on.

In addition, the user may adjust the dimming range by pressing the dimming range setting button 410-9 and then pressing the setting down button 410-11 and the setting up button 410-12. At this time, the dimming range may be displayed on the upper limit setting temperature display unit 410-5.

Meanwhile, the dimming operation indicator lamp 410-2 may be turned on during dimming operation, and the dimming operation display lamp 410-2 may be turned off when the dimming temperature is set to 100%.

In addition, the user may adjust the upper limit setting temperature and the lower limit setting temperature by pressing the temperature range setting button 410-10 and then pressing the setting down button 410-11 and the setting up button 410-12. In this case, the upper limit setting temperature may be displayed on the upper limit setting temperature display unit 410-5, and the lower limit setting temperature may be displayed on the lower limit setting temperature display unit 410-6.

10 is a bottom view of the case of FIG. 6;

6 and 10, a plurality of positioning holes 311b may be formed on the lower surface of the first bottom part 311, and a plurality of positioning holes 311b may be formed on the upper surface of the main panel 510. A plurality of fixing protrusions 510a to be inserted may be formed. For example, each of the positioning hole 311b and the fixing protrusion 510a may be formed by four as shown, but is not necessarily limited thereto.

Accordingly, alignment and coupling of the heat dissipation frame 500 may be more easily performed.

Meanwhile, an insertion groove 311c into which the second sealing member S2 is inserted may be formed on the lower surface of the first bottom portion 311 .

11 is a plan view of the case of FIG. 6, and FIG. 12 is a plan view of the case of FIG. 11 in a state in which a control board is coupled.

6, 11 and 12 , the first bottom portion 311 may include a plurality of support protrusions 311d protruding from the upper surface of the first bottom portion 311, and the control board 200 is supported by the plurality of support protrusions 311d and may be spaced apart from the upper surface of the first bottom part 311 in the vertical direction.

In addition, the control board 200 may have a plurality of fifth through-holes 200b into which fastening members such as bolts may be inserted, and are fastened to the support protrusions 311d through the fifth through-holes 200b. It may be fixed to the case 300 by a fastening member such as a bolt.

Although the above has been described with a focus on preferred embodiments of the present invention, this is only an example and does not limit the present invention. Those skilled in the art to which the present invention pertains can modify and change the embodiments in various ways by adding, changing, deleting, or adding components within the scope that does not deviate from the spirit of the present invention described in the claims. It will be possible, and this will also be said to be included within the scope of the present invention.

10: temperature control device 20: infrared heater
30: external power supply 40: controller
100: power semiconductor device 110: first fastening part
110a: third through hole 200: control board
200a: first through hole 200b: fifth through hole
210: first terminal 220: second terminal
300: case 310: bottom
311: first bottom portion 311a: second through hole
311b: positioning hole 311c: insertion groove
311d: support protrusion 313: inner wall
315: second bottom part 320: front part
321: first cable gland 322: second cable gland
323: third cable gland 330: rear part
340: outer wall portion 350: second fastening portion
350a: fourth through hole 360: accommodating unit
400: cover member 410: display unit
420: display device 500: heat dissipation frame
510: main panel 510a: fixed protrusion
520: heat sink 530: sub panel
530a: fastening hole

Claims (15)

A temperature control device for controlling power supplied to a plurality of infrared heaters,
a plurality of power semiconductor devices respectively controlling power supplied to the plurality of infrared heaters;
a control board on which the plurality of power semiconductor elements are mounted on an upper surface thereof and having a plurality of first through holes;
A bottom portion disposed below the control board, a front portion and a rear portion extending upward from both front and rear ends of the bottom portion, and a pair of outer walls extending upward from both left and right ends of the bottom portion, respectively, connecting the front portion and the rear portion. cases involving wealth;
a cover member coupled to the case and closing the open upper surface of the case; and
A heat dissipation frame for discharging heat from the plurality of power semiconductor devices to the outside of the case;
The bottom portion includes a first bottom portion, a pair of inner wall portions extending downward from both left and right ends of the first bottom portion, and a pair of second bottom portions connecting a lower end of the inner wall portion and a lower end of the outer wall portion, Forming a channel partitioned by the first bottom part and the pair of inner wall parts in the lower part of the case;
A second through hole is formed in the center of the first bottom portion,
The heat dissipation frame includes a plate-shaped main panel disposed under the first bottom portion, a plurality of heat dissipation plates extending downward from the main panel, and extending upward from the main panel to form the second through hole and the plurality of first heat dissipation plates. A temperature control device comprising a plurality of sub-panels coupled to the plurality of power semiconductor devices by sequentially passing through through-holes. According to claim 1,
The control board is supported by a plurality of support protrusions protruding from the upper surface of the first bottom part and is spaced apart from the upper surface of the first bottom part in a vertical direction. According to claim 1,
The channel extends in a forward and backward direction connecting the front and rear portions,
Both ends of the channel in the forward and backward directions are open. According to claim 3,
The main panel is disposed facing the first bottom portion to close the second through hole;
A temperature control device in which a ring-type sealing member is interposed between the first bottom portion and the main panel. According to claim 4,
The temperature control device of claim 1 , wherein a plurality of fixing protrusions are formed on an upper surface of the main panel to be inserted into a plurality of positioning holes formed on a lower surface of the first bottom part. According to claim 3,
The plurality of heat dissipation plates are spaced apart from each other in a left and right direction perpendicular to the front and rear directions,
The temperature control device of claim 1 , wherein flow passages extending in the front-back direction are formed between the plurality of heat dissipation plates, respectively. According to claim 3,
A lower end of the heat sink is disposed higher than a lower surface of the second bottom part so that the pair of second bottom parts can be placed on a flat bottom surface. According to claim 3,
The temperature control device wherein the power semiconductor elements are respectively coupled to the plurality of sub-panels. According to claim 8,
The plurality of sub-panels are spaced apart from each other in a left-right direction perpendicular to the front-back direction. According to claim 9,
The temperature control device of claim 1 , wherein the sub-panel includes a plate shape perpendicular to the left-right direction. According to claim 8,
The temperature control device of claim 1 , wherein one surface of the sub-panel is disposed in contact with the power semiconductor element. According to claim 8,
The power semiconductor device has a first fastening portion formed with a third through hole at an upper end,
A fastening hole is formed in the sub panel,
The power semiconductor element and the sub-panel are coupled to each other through a fastening member coupled to the fastening hole through the third through hole. According to claim 1,
The front part has a temperature control device having a plurality of cable glands. According to claim 1,
The temperature control device according to claim 1 , wherein the cover member has a display unit for displaying an operating state. According to claim 1,
The case has a second fastening part having a fourth through hole into which the fastening member can be inserted at each corner of the lower end so that the case can be fixed on the support structure through the fastening member.

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