KR102463357B1 - LED lightening device - Google Patents

Abstract

An LED lighting device is provided. An LED lighting device according to an embodiment of the present invention includes: at least one LED that generates light when power is applied; a heat dissipation unit for dissipating heat generated from the LED; and an anti-glare member that is provided in an open upper and lower portion so as to limit the angle of emission of light generated by the LED and is coupled to the rim of the heat dissipation unit. A plate-shaped support plate to be disposed, and a heat radiation member formed by insert injection molding a composition for forming a heat radiation member including a graphite composite so as to cover the surface of the support plate to be integrated with the support plate, wherein the support plate includes the It includes an exposed surface of a predetermined area exposed to the outside without being covered by the heat dissipation member, wherein the LED is disposed on the exposed surface, and the support plate includes a plurality of passages that are formed so as to be positioned in the remaining portions except for the exposed surface. The heat dissipation member including a ball, the heat dissipation member covering the upper surface of the support plate and the heat dissipation member covering the remaining portion of the lower surface of the support plate except for the exposed surface is a heat dissipation member formed by filling the through hole during insert injection molding and then curing can be integrally connected through

Description

LED lighting device

The present invention relates to an LED lighting device.

LED is used in various lighting devices because it consumes less power, generates high brightness, and can be used semi-permanently.

For example, the LED is applied to street lights installed along the roadside for street lighting, traffic safety, or aesthetics.

Such an LED street lamp has a structure in which a housing is made of a material such as aluminum, ceramic, plastic, etc., an LED light source is disposed on one surface or inside of the housing, and then a translucent cover is coupled to the housing.

However, since the LED emits a lot of heat when emitting light, it is necessary to take measures against heat dissipation.

Accordingly, when a metal material such as aluminum is used as the material of the housing, some heat dissipation is possible due to the characteristics of the metal material, but the heat dissipation performance to the outside is deteriorated due to the low thermal conductivity. It requires a heat dissipation member and has a heavy disadvantage.

In addition, when ceramic is used as a material of the housing, there are advantages in heat resistance and corrosion resistance as properties of the material itself, but there is a disadvantage in that durability is weak.

In addition, when the housing is made of plastic, there is an advantage of being very light and easy to handle, but there is a problem that sufficient heat cannot be dissipated even if a heat sink is used for heat dissipation because the plastic itself does not have a heat dissipation effect.

US 10-2011-0097586 A

The present invention has been devised in view of the above, and by integrating a support plate and a heat dissipation member including a graphite composite having excellent thermal conductivity, it is light, low in production cost, and excellent in heat dissipation It is an object to provide an LED lighting device. .

In order to solve the above problems, the present invention provides at least one LED for generating light when power is applied; a heat dissipation unit for dissipating heat generated from the LED; and an anti-glare member that is provided in an open upper and lower portion so as to limit the angle of emission of light generated by the LED and is coupled to the rim of the heat dissipation unit. A plate-shaped support plate to be disposed, and a heat radiation member formed by insert injection molding a composition for forming a heat radiation member including a graphite composite so as to cover the surface of the support plate to be integrated with the support plate, wherein the support plate includes the It includes an exposed surface of a predetermined area exposed to the outside without being covered by the heat dissipation member, wherein the LED is disposed on the exposed surface, and the support plate includes a plurality of passages that are formed so as to be positioned in the remaining portions except for the exposed surface. The heat dissipation member including a ball, the heat dissipation member covering the upper surface of the support plate and the heat dissipation member covering the remaining portion of the lower surface of the support plate except for the exposed surface is a heat dissipation member formed by filling the through hole during insert injection molding and then curing It provides an LED lighting device that is integrally connected through the

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In addition, the LED lighting device may further include a circuit board on which the LED is mounted, and the circuit board may be disposed such that one surface thereof is in direct contact with the exposed surface.

In addition, the support plate may be a metal PCB, and the LED may be directly mounted on a circuit pattern formed on the exposed surface.

In addition, in the support plate, the exposed surface may be formed to protrude with respect to the remaining portion to prevent bending or distortion of the support plate due to the shrinkage of the heat dissipation member-forming composition during insert injection molding.

In addition, the support plate may include a bent portion bent from the edge to prevent bending or distortion of the support plate due to shrinkage of the heat dissipation member-forming composition during insert injection molding.

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In addition, an anti-glare member for limiting the emission of light generated by the LED is included, and the anti-glare member is provided in a hollow shape having an open upper and lower portions and a predetermined height, and one end is coupled to the edge of the heat dissipation unit. can be

In addition, a band-shaped light-transmitting member may be disposed between the heat dissipation unit and the anti-glare member so that a portion of the light generated by the LED may be transmitted to the outside.

In addition, the heat dissipation unit may include at least one air passage through which air is formed along the height direction to pass therethrough.

In addition, the air passage may include a first through-hole formed through the support plate and a pair of second through-holes formed to pass through the heat dissipation member in an area corresponding to the first through-hole.

In addition, the air passage may include a hollow extension extending downward a predetermined length from the edge of any one of the pair of second through-holes.

In addition, the extension may be made of the same material as the heat dissipation member.

In addition, the pair of second through-holes may be formed to have a relatively larger cross-sectional area than the first through-hole.

In addition, a plurality of femnuts may be integrally coupled to the support plate.

In addition, the composition for forming the heat dissipation member may include a graphite composite in which crystallized nano-metal particles are bonded to the surface of graphite, and a polymer resin in which the graphite composite forms a dispersed phase.

In addition, the graphite composite may further include a catecholamine layer coated on the nanometal particles, and the catecholamine may be dopamine.

In addition, the graphite composite may be included in an amount of 50 to 80% by weight of the total weight of the heat dissipation member.

In addition, the nanometal particles may include at least one selected from the group consisting of Ni, Si, Ti, Cr, Mn, Fe, Co, Cu, Sn, In, Pt, Au, and Mg.

In addition, the heat dissipation member may include a protective coating layer formed on the outer surface, the protective coating layer may be made of a composition for forming a protective coating layer comprising a polymer resin.

In addition, the polymer resin is epoxy-based, polyethylene-based, polypropylene-based, polystyrene-based, polyvinyl chloride-based, nylon-based, silicone-based, polyester-based, phenol-based, polyester-based, polyimide-based, from the group consisting of polyurethane-based It may include one or more selected resins.

In addition, the composition for forming the protective coating layer may include an epoxy resin and a carbon-based filler in order to improve thermal diffusion to the outside.

In addition, the carbon-based filler is selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, graphene oxide, graphene nanoplates, graphite, carbon black, and carbon-metal composites. It may include one or more of the

According to the present invention, since the heat dissipation member integrated with the support plate includes a graphite composite having good thermal conductivity, it is light, has a low production cost, and has excellent heat dissipation properties.

1 is a view showing an LED lighting device according to the present invention;
2 is a view of FIG. 1 viewed from the bottom;
3 is an exploded view of FIG. 1;
4 is a view showing a state in which the heat dissipation unit, the circuit board and the protective cover are separated in FIG. 1;
5a and 5b are views showing a support plate applied to the LED lighting device according to the present invention, 5a is a view seen from the top, 5b is a view seen from the bottom,
6A and 6B are partial cut-away views of a heat dissipation unit applied to an LED lighting device according to the present invention;
7 is a schematic diagram showing a detailed configuration of a heat dissipation member applied to an LED lighting device according to the present invention, and,
8 is a schematic diagram showing the graphite composite applied to the present invention, (a) is a case composed of graphite, nano-metal and catecholamine, (b) is a case of graphite, nano-metal, catecholamine and a case composed of a polymer.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar components throughout the specification.

The LED lighting apparatus 100 according to an embodiment of the present invention includes an LED 110 and a heat dissipation unit 120 as shown in FIGS. 1 to 4 .

The LED 110 is for generating light to the outside when power is applied. At least one of these LEDs 110 is provided and arranged in a predetermined pattern.

For example, the LED 110 may be provided in plurality and mounted on one surface of the circuit board 112 in a predetermined pattern (see FIG. 4 ).

At this time, the circuit board 112 may be a well-known FCCL, CCL, etc. may be used, preferably a metal PCB to emit the heat generated in the LED 110 or to smoothly transfer to the heat dissipation unit 120 side. can be used

The heat dissipation unit 120 is to quickly dissipate and radiate heat generated by the LED to the outside, and includes a support plate 121 and a heat dissipation member 122 (see FIGS. 6A and 6B ).

Here, the support plate 121 may be made of a metal material to reinforce structural strength and dissipate heat generated from the LED 110 to quickly transfer it to the heat dissipation member 122 .

For example, the support plate 121 may be made of an aluminum material, and may have a disk shape.

However, the material and shape of the support plate 121 are not limited thereto, and various known metal materials may be used, and may be provided in various shapes including polygons, arcs, and combinations thereof.

In this case, an exposed surface 123 having a predetermined area is formed on one surface of the support plate 121 , and the remaining portion except for the exposed surface 123 is covered through the heat dissipation member 122 .

Here, the exposed surface 123 is provided to have an area corresponding to the circuit board 112 , so that one surface of the circuit board 112 may be fixed to be in contact with the exposed surface 123 .

For example, the circuit board 112 may be fixed to the exposed surface 123 via a fastening member 101 in a state in which one surface is disposed so as to be in direct contact with the exposed surface 123 , and the exposed surface ( At least one fastening hole 124 for fastening the fastening member 101 may be formed in 123 (see FIG. 4 ).

Accordingly, in the LED lighting device 100 according to the present invention, the entire surface area of the heat dissipation member 122 in contact with the air is widened by the remaining portion except for the exposed surface 123 is covered by the heat dissipation member 122 to increase the heat dissipation area. It is possible to increase the heat dissipation performance by expanding the

Due to this, the heat generated in the LED 110 is transferred to the heat dissipation member 122 through the support plate 121 and then is rapidly dispersed through the heat dissipation member 122 in contact with the outside air, thereby being rapidly discharged to the outside. be able to

In addition, since a plurality of fastening holes 124 for fastening the fastening member 101 are formed in the exposed surface 123 , the fastening member 101 is directly coupled to the rigid support plate 121 to increase the fastening force. Since the fastening hole 124 is formed on the exposed surface side of the support plate 121, the processing of the heat dissipating member 122 is unnecessary in the process of forming the fastening hole 124, so as to prevent damage to the heat dissipating member 122. be able to

On the other hand, the support plate 121 is provided with a metal PCB having a predetermined circuit pattern for mounting the LED on the exposed surface exposed to the outside so that the LED 110 can be directly mounted, and the heat dissipation member 122 . It should be noted that may be configured to cover the remaining portion except for the exposed surface.

At this time, the heat dissipation member 122 may be integrated with the support plate 121 through insert injection molding through the heat dissipation member forming composition including the graphite composite (A, A') and the polymer resin (B) (Fig. 6a and 6b).

That is, the LED lighting device 100 according to the present invention may be integrated with the support plate 121 so that the heat dissipation member forming composition covers all of the remaining portions except for the exposed surface 123 through insert injection molding.

Accordingly, the heat dissipation member forming composition implemented as the heat dissipation member 122 through hardening after insert injection molding is made of a material containing graphite having good thermal conductivity, so that the thermal conductivity is greatly improved and excellent heat dissipation performance can be realized. . For example, in the heat dissipation member 122, the graphite composite (A, A') is included in an amount of 50 to 80% by weight based on the total weight of the composition for forming the heat dissipation member, thereby implementing excellent heat dissipation properties.

In addition, the heat dissipation member 122 according to the present invention can also obtain ancillary effects of weight reduction and cost reduction compared to a metal material generally used as a heat dissipation member.

In this case, the support plate 121 may be structurally reinforced to prevent bending or distortion due to the shrinkage of the heat dissipation member-forming composition during insert injection molding.

For example, the support plate 121 may include a bent portion 125 in which the exposed surface 123 may protrude in one direction with respect to the remaining portion, and bent in one direction from the edge of the support plate 121 . may be (see FIGS. 5A and 5B).

Here, the bent part 125 may be provided entirely or partially along the edge of the support plate 121 .

Through this, in the process of implementing the heat dissipation member 122 to cover the support plate 121, even if different amounts of the heat dissipation member forming composition exist depending on the position of the support plate 121, the shrinkage of the heat dissipation member forming composition is reduced. It is possible to maintain the initially designed shape by preventing distortion or bending.

On the other hand, the LED lighting device 100 according to the present invention is the support plate to prevent the heat dissipation member 122 integrated with the support plate 121 from being separated from the support plate 121 through insert injection molding. A plurality of through-holes 126 may be formed through the 121 (see FIGS. 5A to 6B ).

The through-hole 126 is formed through the remaining area except for the exposed surface 123, and the heat-dissipating member forming composition constituting the heat-dissipating member 122 is filled in the through-hole 126 during insert injection molding. The composition for forming a heat dissipation member covering the upper surface of the support plate 121 and the composition for forming a heat dissipation member covering the rest of the lower surface except for the exposed surface 123 are connected to each other.

Accordingly, insert injection molding can be performed smoothly by preventing the composition for forming a heat dissipation member having fluidity from being easily peeled off from the support plate 121 .

In addition, after the insert injection molding is completed, the heat dissipating member covering the upper surface of the support plate 121 and the heat dissipating member covering the remaining area except for the exposed surface 123 of the lower surface of the support plate 121 is filled in the heat dissipation member forming composition Since the hardened and integrally connected state is maintained, it is possible to prevent the heat dissipation member 122 from being completely separated from the support plate 121 even if cracks or cracks due to external impact occur.

At this time, in the heat dissipation part 120 , at least one air passage P is formed to penetrate in the height direction. This air movement path (P) allows the convection of the external air to be smoothly made, so that the air around the LED whose temperature is increased by the heat generated in the LED can be moved quickly.

To this end, the support plate 121 has a first through hole 127 having a predetermined area formed therethrough, and the heat dissipation member 122 covering both surfaces of the support plate 121 is formed through the first through hole ( 127) and a pair of second through-holes 128 are formed through each of the regions (see FIGS. 6A and 6B).

Through this, the air heated by the heat generated by the LED 110 disposed on the exposed surface 123 side is the air passage P formed by the second through hole 128 and the first through hole 127 (P). Since the convection is smoothly performed by being able to move to the opposite side through the , external air having a relatively low temperature can move toward the LED 110 .

For this reason, the air having a relatively low temperature through the flow of external air continuously moves toward the LED 110 , so that heat generated by the LED 110 can be quickly dispersed.

At this time, any one of the pair of second through-holes 128 may include a hollow extension 129 extending downward a predetermined length from the edge thereof.

Here, the extension hole 129 may be formed of the composition for forming the heat radiation member in the same manner as the heat radiation member 122 , and may be integrally formed with any one of the pair of second through holes 128 .

For example, the extension hole 129 may extend integrally with the second through hole 128 from the edge of the second through hole 128 formed on the same side as the exposed surface 123 .

Through this, the extension hole 129 serves as a passage through which air can flow through the hollow part and at the same time is formed to protrude a predetermined length from one surface of the support plate 121, thereby increasing the contact area with external air. can also be performed at the same time. For this reason, the heat dissipation can be made more quickly by further expanding the contact area with the outside air through the extension hole 129 .

At this time, the pair of second through-holes 128 are provided to have a relatively larger cross-sectional area than the first through-holes 127, so that the support plate 121 around the second through-holes 128 can be exposed. (see FIG. 6a).

Through this, the support plate 121 exposed to the outside around the second through-hole 128 is in direct contact with the outside air, so that the heat transferred from the LED 110 to the support plate 121 is transferred to the outside air and Direct heat exchange can be achieved.

In addition, a separate protective coating layer 160 may be formed on the outer surface of the heat dissipation member 122 to increase heat dissipation performance or perform other additional functions (see FIG. 7 ). A detailed description of the protective coating layer 160 will be described later.

On the other hand, the LED lighting device 100 according to the present invention may include a protective cover 130 for protecting the LED 110 from the external environment, the protective cover 130 is the support plate 121 and It may be detachably coupled via the fastening member 101 (see FIGS. 2 and 3).

Here, the fastening hole to which the fastening member 101 is fastened in order to fix the protective cover 130 to the support plate 121 may be formed separately, and to fix the circuit board 112 to the support plate 121 . By being fastened to the fastening hole 124 for the purpose, the circuit board 112 and the protective cover 130 may be simultaneously fixed to the support plate 121 through a single fastening member 101 .

In addition, the protective cover 130 may be provided with an airtight member 132 such as an O-ring along the edge. Through this, it is possible to prevent moisture from flowing into the circuit board 112 through the gap in which the protective cover 130 and the support plate 121 are coupled to each other.

The LED lighting apparatus 100 according to the present invention may include at least one fem nut 102 for fastening with other members. The femnut 102 may be inserted in a state of being fastened to the support plate 121 during insert injection molding for constituting the heat dissipation unit 120 to be integrated with the heat dissipation unit 120 .

A well-known eyebolt 103 is coupled to any one of these femnuts 102, so that the LED lighting device 100 according to the present invention is spaced apart from the ground or the floor by a certain height using the eyebolt 103. state can be fixed.

In addition, some of the fem nut 102 may be used for fixing the LED lighting device or for fastening a separate bracket for adjusting the installation angle of the LED lighting device.

In addition, the LED lighting apparatus 100 according to the present invention may include an anti-glare member 140 for limiting the emission angle of the light generated by the LED 110 (see FIG. 3 ).

That is, the anti-glare member 140 is provided in a hollow shape having a predetermined height, and the upper end is coupled to the edge of the heat dissipation unit 120 .

For example, the anti-glare member 140 may be coupled to the edge of the heat dissipation unit 120 via an extension 142 extending inward along the upper rim.

At this time, the anti-glare member 140 may be provided to have a color to prevent light transmission, or may be made of an opaque material. For example, the anti-glare member 140 may be made of aluminum.

Accordingly, the light generated from the LED 110 is blocked by the anti-glare member 140, so that the light can be irradiated only in a desired direction, so that glare in a direction other than the desired direction can be prevented.

In addition, in the case of the LED lighting device 100 according to the present invention, even if the anti-glare member 140 is disposed on the front side of the LED 110, the convection of the outside air can be made smoothly through the air passage P. As a result, the air heated by the LED 110 inside the anti-glare member 140 can escape to the outside through the air passage P, so that the heat dissipation performance by the anti-glare member 140 is delayed. can be prevented in

On the other hand, when the anti-glare member 140 is disposed between the anti-glare member 140 and the heat dissipation unit 120, a portion of the light generated by the LED 110 may be transmitted to the outside in a band shape. A light-transmitting member 150 may be disposed (see FIG. 3 ).

Such a light-transmitting member 150 is provided to have a relatively lower height than the anti-glare member 140 , and a part of the light generated by the LED 110 is transmitted in a band shape to the outside, thereby enhancing the aesthetics. do.

The heat dissipation member 122 applied to the LED lighting device 100 according to the present invention is made of a heat dissipation member forming composition comprising a graphite composite (A, A') and a polymer resin (B), and the heat dissipation member forming composition is By covering the support plate 121 through insert injection molding, it can be integrated with the support plate 121 to configure the heat dissipation unit 120 (see FIGS. 6A and 6B ).

The graphite composite (A, A') may be formed of a composite in which nano-metal particles (A2) are bonded to the surface of plate-shaped graphite (A1) (see FIGS. 8 (a) and 8 (b)). .

Here, the specific bonding method of the graphite (A1) and the nanometal particles (A2), the content of the graphite (A1) and the nanometal particles (A2), and the type of the nanometal particles may be appropriately selected according to design conditions.

However, preferably, the nano-metal particles (A2) may be a conductive metal to exhibit an electromagnetic wave shielding effect. For example, the nano-metal particles (A2) may include at least one selected from the group consisting of Ni, Si, Ti, Cr, Mn, Fe, Co, Cu, Sn, In, Pt, Au, and Mg. have.

Meanwhile, the polymer resin (B) may include at least one of a thermosetting resin and a thermoplastic resin, and the thermosetting resin is at least one selected from the group consisting of an epoxy-based resin, a urethane-based resin, a melamine-based resin, and a polyimide-based resin. may include, wherein the thermoplastic resin is a polycarbonate-based resin, a polystyrene-based resin, a polysulfone-based resin, a polyvinyl chloride-based resin, a polyether-based resin, a polyacrylate-based resin, a polyester-based resin, and a polyamide-based resin. , and may include at least one selected from the group consisting of a cellulose-based resin, a polyolefin-based resin, and a polypropylene-based resin.

Such a graphite composite (A, A') may be prepared by various methods.

For example, the graphite composite (A, A') may be prepared by mixing plate-shaped graphite (A1) and nano-metal particles (A2). At this time, the mixing ratio of the nano-metal particles (A2) and the plate-shaped graphite (A1) can be arbitrarily set according to the purpose of use.

Then, plasma is applied to the graphite composite (A, A') to vaporize the nano-metal particles (A2). Thereafter, a quenching gas is injected into the vaporized nano-metal particles A2 to condense or quench the vaporized nano-metal particles A2. Accordingly, the growth of the vaporized nanometal particles (A2) is suppressed, and the graphite particle composites (A, A') in which the nanometal particles (A2) are crystallized are formed on the surface of the graphite (A1).

Here, the nano-metal particles (A2) included in the graphite composite (A, A') should be present in high density on the surface of the plate-shaped graphite (A1), so that it may be contained in an amount of 20 to 50 wt% based on the total weight of the graphite (A1). and may be bonded to the surface of the graphite (A1) in the form of crystals having an average particle diameter of 10 to 200 nm. In addition, it may have a surface area range of 30 to 70 area% with respect to the cross section of the graphite composite (A, A').

In this case, in the composition for forming the heat dissipation member, the graphite composite (A, A') may form a dispersed phase in the polymer resin (B) (see FIG. 7 ).

To this end, the graphite composite (A, A') may include a catecholamine layer (A3) on the nanometal particles (A2) (see FIGS. 8(a) and 8(b)). ).

This is by coating the plate-shaped graphite (A1) on which the nano-metal particles (A2) are crystallized on the surface with catecholamine such as polydopamine to modify the surface of the plate-shaped graphite without lowering the intrinsic physical properties of the catecholamine itself. This is because strong interfacial bonding with the polymer resin can be improved by using the strong adhesive properties.

In addition, when the catecholamine layer (A3) is coated on the nanometal particles (A2), dispersibility is improved in an organic solvent, and when an organic solvent is included in the composition for forming the heat dissipation member, the graphite composite (A, A') is a polymer It becomes possible to be uniformly dispersed in the resin (B).

Accordingly, it is possible to prepare a composite material with remarkably improved dispersibility in a desired polymer resin by preferentially preparing the graphite composite (A, A') containing graphite - nano metal particles - catecholamine.

Here, the term "catecholamine" refers to a single molecule having a hydroxy group (-OH) as an ortho-group of a benzene ring and various alkylamines as a para-group, such As various derivatives of the structure, dopamine, dopamine-quinone, alpha-methyldopamine, norepinephrine, epinephrine, alpha-methyldopa, droxidopa ), indolamine, serotonin, or 5-hydroxydopamine are included in the catecholamines. Most preferably, dopamine may be used.

In general, it is difficult to coat the catecholamine layer on the pure plate-like graphite surface, but in the graphite composite (A, A') according to the present invention, the crystallized nano-metal particles (A2) on the surface form a high-density bond, so the crystallized nano By binding a catecholamine compound such as polydopamine to the metal particles A2, the catecholamine layer A3 may be stably formed.

When the catecholamine layer is composed of dopamine, the catecholamine layer may be formed by dipping the graphite complex (A, A') into an aqueous dopamine solution. At this time, when a basic aqueous dopamine solution is used as the dopamine aqueous solution, dopamine reacts spontaneously under oxidizing conditions, thereby polymerizing on the nanometal particles (A2) of the graphite complex (A, A') to form a polydopamine layer. Therefore, a separate firing process is not required, and the addition of the oxidizing agent is not particularly limited, but oxygen gas in the air may be used as the oxidizing agent without the addition of the oxidizing agent.

Here, the thickness of the polydopamine layer is determined by the dipping time. Accordingly, when using an aqueous dopamine solution prepared by dissolving dopamine so that the dopamine concentration is 0.1 to 5 mg/mL in a tris buffer solution having a pH of 8 to 14, a polydopamine layer having a thickness of 5 to 100 nm is formed by about 0.5 to It is preferable to dipping the plate-like graphite to which the nano-metal particles (A2) are bonded to the surface for 24 hours.

As described above, since the graphite composite (A, A') constituting the composition for forming a heat dissipation member according to the present invention is in a state in which the nano-metal particles (A2) are bonded to the surface of the graphite, a catecholamine layer is formed by the nano-metal particles (A2) may be (see FIGS. 8(a) and 8(b)).

Accordingly, the interfacial properties between the polymer resin (B) and the graphite composite (A, A') are improved through the catecholamine layer, thereby improving the dispersibility of the graphite composite (A, A') and improving the orientation. Due to this, it is possible to increase the content of the graphite composite included in the composition for forming the heat dissipation member, so that even if a small amount of the polymer resin is included in the composition for forming the heat dissipation member, it is possible to manufacture the sheet in the form of a sheet.

On the other hand, the graphite composite (A') according to the present invention may include a polymer (A4) bound to the catecholamine layer (A3) (see (b) of FIG. 8). For example, the graphite composite (A) coated with the nanometal particles (A2) with the catecholamine may be added to the polymer resin solution to bind the polymer (A4) on the catecholamine layer.

Here, the polymer (A4) may be formed to completely cover the catecholamine layer (A3), the polymer (A4) may be bonded to the catecholamine layer (A3) in the form of particles, and the surface of the graphite composite (A) It may be formed to completely cover the

In addition, the polymer (A4) is not particularly limited in its type, but may be selected from the group consisting of a thermosetting resin, a thermoplastic resin, and rubber. At this time, if the polymer (A4) has reactivity and compatibility with each other with the polymer resin (B) constituting the composition for forming the heat dissipation member, there is no major limitation on the type thereof, but is preferably the same as the type of the polymer resin (B) Similar types of polymers can be used.

Through this, graphite (A1), nano-metal particles (A2), catecholamine layer (A3), and a graphite composite (A') including a polymer (A4) is primarily prepared, and then in the desired polymer resin (B) When dispersed, the graphite composite (A') can be very uniformly and evenly dispersed in the polymer resin (B).

That is, since the graphite composite (A') contains the polymer (A4) on the surface, not only the low dispersibility and agglomeration of the graphite itself, but also the aggregation phenomenon due to the high tackiness of the catecholamine layer itself does not occur, so uniform dispersion in the polymer resin be able to achieve Accordingly, it is possible to increase the overall content of the graphite composite (A') in the composition for forming the heat dissipation member, thereby obtaining excellent heat dissipation performance.

On the other hand, the composition for forming the heat dissipation member, in addition to the organic solvent, a leveling agent, a pH adjuster, an ion trapping agent, a viscosity modifier, a thixotropic agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant , a dehydrating agent, a flame retardant, an antistatic agent, an antifungal agent, and a preservative, one or more of various additives may be added. The various additives described above may use those known in the art, and thus is not particularly limited in the present invention.

In addition, the catecholamine layer (A3) may further include a solvent. A solvent suitable for this can be selected according to the selected adhesive component, and thus the present invention is not particularly limited thereto. As the solvent, any solvent that enables proper dissolution of each component can be used, for example, water, etc. At least one selected from the group consisting of an aqueous solvent, an alcohol-based solvent, a ketone-based solvent, an amine-based solvent, an ester-based solvent, an amide-based solvent, a halogenated hydrocarbon-based solvent, an ether-based solvent, and a furan-based solvent may be used.

The heat dissipation part 120 according to the present invention is a heat dissipation member 122 such that the heat dissipation member forming composition in which the graphite composite (A, A') and the polymer resin (B) are mixed covers the support plate 121 through insert injection. ), the heat dissipation member 122 and the support plate 121 can be integrated.

In addition, when a catecholamine layer, for example, a polydopamine layer is formed on the nanometal particles (A2) constituting the graphite composite (A, A'), the graphite composite is 50 to 80 based on the total weight of the composition for forming a heat dissipation member It may be included in weight %.

As described above, the LED lighting device 100 according to the present invention is insert injection-molded to cover the surface of the support plate 121 so that the composition for forming a heat dissipation member containing 50 to 80% by weight of the graphite composite (A, A') is supported. By configuring the heat dissipation unit 120 to be integrated with the plate 121 , excellent heat dissipation can be realized.

Meanwhile, the LED lighting device 100 according to the present invention may include a protective coating layer 160 made of a composition for forming a protective coating layer including a polymer resin on the outer surface (see FIG. 7 ).

As an example, the protective coating layer 160 is applied to the surface of the heat dissipation member 122 to a predetermined thickness to protect the heat dissipation member 122 from the external environment and the components included in the protective coating layer 160 . Through this, additional performance such as insulation, earthquake resistance, and heat dissipation can be realized.

In addition, by preventing the heat dissipation member 122 from being directly exposed to the outside through the protective coating layer 160 , it is possible to prevent the graphite composite (A, A') particles from being buried in the user's hand, and by external impact It can be prevented from breaking easily.

At this time, the thickness of the protective coating layer 160 may be 0.1 ~ 1000㎛ . This is, when the thickness of the protective coating layer is less than 0.1 μm, the graphite composite (A, A′) included in the heat dissipation member 122 is more likely to be separated, and the thickness of the protective coating layer 160 exceeds 1000 μm. This is because there is a disadvantage that thinning is difficult in this case.

As the composition for forming the protective coating layer constituting the protective coating layer 160 , any coating layer-forming component known in the art may be used.

For example, the composition for forming the protective coating layer may include a polymer resin, and the polymer resin may include at least one of a thermosetting resin and a thermoplastic resin. The thermosetting resin may include at least one selected from the group consisting of an epoxy-based resin, a silicone resin, a urethane-based resin, a melamine-based resin, a phenol resin, and a polyimide-based resin, and the thermoplastic resin is a polycarbonate-based resin, a polystyrene-based resin Resin, polysulfone-based resin, polyvinyl chloride-based resin, polyether-based resin, polyacrylate-based resin, polyester-based resin, polyamide-based resin, cellulose-based resin, polyolefin-based resin and polypropylene-based resin It may include one or more selected from the group.

In addition, the composition for forming the protective coating layer may include various polymer resins depending on the purpose of use. For example, when it is intended to implement insulation through the protective coating layer 160, a silicone resin, an epoxy resin, a polyester resin, etc. may be included, and when it is intended to improve the earthquake resistance, a phenol resin or an epoxy resin may be included. In addition, in the case of increasing heat dissipation, a carbon-based filler may be included in the epoxy resin.

However, when a carbon-based filler is included in order to add heat dissipation to the protective coating layer 160, very excellent adhesion performance is expressed between the heat-dissipating member 122 and the carbon-based filler and the protective coating layer forming component and compatibility with the carbon-based filler is included. The protective coating layer forming component may include an epoxy resin, and a curing agent for curing the epoxy resin may be included in the protective coating layer forming component so as to simultaneously achieve improved heat dissipation performance according to the improvement. The epoxy resin is not particularly limited in a specific kind since it is possible to use an epoxy resin known in the art, and may be selected differently depending on the purpose.

Here, the epoxy resin is a glycidyl ether type epoxy resin, a glycidylamine type epoxy resin, a glycidyl ester type epoxy resin, a linear aliphatic type epoxy resin, a cycloaliphatic type epoxy resin, It may include at least one selected from the group consisting of a cyclic-containing epoxy resin, a substituted epoxy resin, a naphthalene-based epoxy resin, and derivatives thereof.

In addition, the type of the curing agent included in the protective coating layer forming component together with the epoxy resin may be different depending on the specific type of the selected epoxy resin, and the specific type may use a curing agent known in the art, preferably It may include any one or more of polyhydric hydroxy compounds, aliphatic amines, aromatic amines, acid anhydrides, and latent curing agents.

On the other hand, the protective coating layer forming component may further include a curing accelerator in addition to the above-described epoxy resin and curing agent. The curing accelerator serves to adjust the curing rate or physical properties of the cured product, and a known curing accelerator may be selected and used according to the type of the selected curing agent.

In addition, the protective coating layer forming component is a leveling agent, a PH regulator, an ion trapping agent, a viscosity regulator, a thixotropic agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant, a dehydrating agent, a flame retardant, One or more kinds of various additives such as antistatic agent, antifouling agent (防黴劑), preservative, etc. may be added, and the protective coating layer forming component may include a conventional solvent suitable for this according to the selected adhesive component.

On the other hand, when a carbon-based filler is included in the protective coating layer forming component in order to smoothly radiate heat radiated from the heat dissipating member 122 through the protective coating layer 160 by adding heat dissipation to the protective coating layer 160 , the The carbon-based filler may be used without limitation when it contains carbon in its material, and a carbon-based material known in the art may be used.

Here, since the carbon-based filler includes carbon in the same way as the heat dissipation member, the interface characteristics between the heat dissipation member and the protective coating layer can be improved. In addition, the shape and size of the carbon-based filler is not limited, and may be porous or non-porous in structure, and may be selected differently depending on the purpose. However, preferably, in order to express excellent heat dissipation performance, the carbon-based filler is single-walled carbon nanotube, double-walled carbon nanotube, multi-walled carbon nanotube, graphene, graphene oxide, graphene nanoplate, graphite, carbon black And it may include one or more from the group consisting of a carbon-metal composite, and more preferably carbon black as a main material of the carbon-based filler.

In addition, the protective coating layer 160 may include a physical property enhancing component in the composition for forming the protective coating layer.

When the composition for forming a protective coating layer is coated on the heat dissipation member 122 , the physical property enhancing component is to express further improved heat dissipation and excellent adhesion to improve durability.

When used together with an epoxy resin or carbon black among the above-described protective coating layer forming components, these properties enhancing components cause a synergistic effect on the desired physical properties to express remarkable durability and heat dissipation. It is possible to improve the physical properties that have not been achieved, and it is possible to express improved heat dissipation and adhesiveness even in molded products made of organic compounds such as non-metals or plastics rather than metals.

In addition, the physical property enhancing component may further include a known dispersing agent, dispersion stabilizer, and the like.

The above-described LED lighting device 100 according to the present invention may be installed both indoors and outdoors where lighting is required. For example, the LED lighting device 100 may be used as an outdoor light such as a street light, a security light, a transmission light, and a parking lot, and may also be used as an indoor light installed in an office or residential space.

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Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art who understand the spirit of the present invention can add components within the scope of the same spirit. , changes, deletions, additions, etc. may easily suggest other embodiments, but this will also fall within the scope of the present invention.

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100: LED lighting device 101: fastening member
102: fem nut 103: eye bolt
110: LED 112: circuit board
120: heat dissipation unit 121: support plate
122: heat dissipation member 123: exposed surface
124: fastening hole 125: bent part
126: through hole 127: first through hole
128: second through hole 129: extension hole
P: air passage 130: protective cover
132: airtight member 140: anti-glare member
150: light transmitting member 160: protective coating layer
A: Graphite Composite A1: Graphite
A2: nano metal particles A3: catecholamine layer
A4: Polymer B: Polymer resin

Claims (25)

at least one LED that generates light when power is applied;
a heat dissipation unit for dissipating heat generated from the LED; and
Including; and an anti-glare member which is provided in a hollow shape with upper and lower parts open to limit the emission angle of the light generated by the LED and is coupled to the rim of the heat dissipation part;
The heat dissipation unit,
A plate-shaped support plate on which the LED is disposed, and a heat radiation member formed by insert injection molding a composition for forming a heat radiation member including a graphite composite so as to cover the surface of the support plate to be integrated with the support plate,
The support plate includes an exposed surface of a predetermined area exposed to the outside without being covered by the heat dissipation member,
The LED is disposed on the exposed surface,
The support plate includes a plurality of through-holes that are formed through to be located in the remaining portion except for the exposed surface,
The heat dissipation member covering the upper surface of the support plate and the heat dissipation member covering the remaining portion of the lower surface of the support plate except for the exposed surface are integrally connected through the heat dissipation member formed by filling the through hole during insert injection molding and then curing it. LED lighting device. The method of claim 1,
The LED lighting device further includes a circuit board on which the LED is mounted,
The circuit board is an LED lighting device disposed so that one surface is in direct contact with the exposed surface. The method of claim 1,
The support plate is a metal PCB, and the LED is directly mounted on a circuit pattern formed on the exposed surface. delete The method of claim 1,
The heat dissipation unit includes at least one air passage through which air passes along the height direction,
The air movement path,
A first through-hole formed through the support plate, a pair of second through-holes formed to pass through the heat dissipation member in an area corresponding to the first through-hole, and an edge of any one of the pair of second through-holes LED lighting device including a hollow extension extending downward a predetermined length from the. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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