KR101250061B1 - Led lighting with radiating structure - Google Patents

Abstract

PURPOSE: An LED lamp having a heat dissipation structure is provided to implement miniaturization by dissipating heat generated in a plurality of LED modules through a light heat dissipation body. CONSTITUTION: A plurality of LED modules(20) includes a PCB, an LED device, a lens and a lens cover. One side of each of the PCB is installed in a plurality of heat dissipation pins(32). The LED device is installed in the other side of the PCB. The lens cover indirectly lights light of the LED device. A heat dissipation body(40) is arranged between a plurality of the heat dissipation pins and a plurality of the LED modules.

Description

LED light with heat dissipation structure {LED LIGHTING WITH RADIATING STRUCTURE}

The present invention relates to an LED lamp having a heat dissipation structure, and more particularly, to shorten the life of the LED module due to high heat so that heat generated from a plurality of LED modules can be quickly radiated to the outside when the LED lights. It relates to an LED having a heat dissipation structure for preventing.

Generally, light is a device that brightens dark places, and there are many kinds such as incandescent, fluorescent, mercury, and halogen.

However, all of the above-mentioned items have a problem in that they are not fully compatible with the current high-oil price era in which energy consumption is highly demanded due to high power consumption, and their life spans are short.

In recent years, the use of an LED having a small power consumption as a light source has been increasing, but a high temperature is generated when an LED element serving as a light source is emitted. Such a high temperature shortens the lifetime of the LED element, There is a problem that the illuminance of the device is deteriorated.

According to Korean Patent Laid-Open Publication No. 10-2008-103366, a heat dissipation device for an LED lighting module is disclosed. However, in such a heat dissipation device, as the output of the LED lamp increases, the weight increases. There is a problem that the weight of the entire module is increased.

Korean Patent Laid-Open Publication No. 10-2008-103366 (Nov. 27, 2008)

The present invention has been made to solve the above-described problems, an object of the present invention is to radiate heat generated from a plurality of LED modules during the light emission of the LED quickly heat radiation structure for extending the life of the LED module It is to provide an LED and the like.

The problems to be solved by the present invention are not limited to those mentioned above, and other solutions not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention is a lower casing opening is formed in the inner space; And located in the space portion, the lower portion includes a heat dissipation plate is installed, the heat dissipation plate, a plurality of holes for radiating heat generated from the LED module to the outside; And a plurality of heat dissipation fins that are inclined downward from the plurality of holes, respectively, wherein the plurality of LED modules provide LEDs having a heat dissipation structure, wherein the plurality of LED modules are installed on the plurality of heat dissipation fins.

The casing according to the present invention, the upper opening is formed with a first through hole, a plurality of second through holes are formed along the periphery of the upper outer peripheral surface, characterized in that it comprises a mesh for blocking the first and second holes It is done.

The plurality of heat dissipation fins according to the present invention is disposed radially about the center of the heat sink, characterized in that to form a plurality of layers from the edge of the heat sink to the center of the heat sink.

The plurality of layers according to the present invention are characterized in that the inclination angle of the heat dissipation fins decreases from the edge of the heat sink to the center of the heat sink.

Further comprising a heat sink installed on the upper portion of the heat sink according to the invention.

An inner cover coupled to a lower portion of the heat sink according to the present invention; And an outer cover coupled to the lower portion of the inner cover.

In the inner cover according to the present invention, a plurality of through-holes and a plurality of through-holes penetrating inward and downward are formed along a circumference, and the outer cover is hollow and penetrates upward and downward in a central portion. Is formed in a radial shape along the circumference of the hollow, a plurality of secondary hollows are formed in communication with the hollow, the plurality of through grooves and the plurality of through holes are respectively located the LED module, the plurality of through grooves and the The plurality of auxiliary hollows communicate with each other in the up and down directions, and the plurality of through holes are positioned inside the hollow.

The plurality of LED module according to the present invention, each side of the printed circuit board is installed on the heat radiation fin; An LED element installed on the other surface of the printed circuit board; A lens disposed outside the LED element and covering the LED element; And detachably coupled to the lens, characterized in that it comprises a lens cover for indirectly illuminating the light of the LED element.

In addition, it characterized in that it further comprises a radiator provided between each of the plurality of radiating fins and the plurality of LED modules.

The heat sink according to the present invention, the graphite having a top, a bottom; And silver foil attached to at least one surface of upper and lower surfaces of the graphite.

According to the present invention, the heat generated from the plurality of LED modules during the light emission of the LED, etc. is quickly radiated to the outside, thereby preventing the life of the LED module from shortening due to high heat.

The effects of the present invention are not limited to those mentioned above, and other solutions not mentioned may be clearly understood by those skilled in the art from the following description.

1 is a bottom perspective view showing an LED lamp having a heat dissipation structure according to the present invention.
Figure 2 is a perspective view showing a casing in the LED and the like having a heat dissipation structure according to the present invention.
Figure 3a and Figure 3b is an exploded perspective view and a perspective view showing the LED module in the LED, such as having a heat dissipation structure in accordance with the present invention.
Figure 4 is a use state diagram showing the LED lamp having a heat radiation structure according to the present invention.
5 and 6 are a bottom perspective view and a longitudinal sectional view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention.
7 and 8 are a perspective view and a bottom perspective view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention.
9 is a perspective view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention.
10 is an exploded perspective view showing the inner cover and the outer cover coupled to the heat sink in the LED having a heat dissipation structure according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a bottom perspective view showing an LED lamp having a heat dissipation structure according to the present invention, Figure 2 is a perspective view showing a casing in the LED lamp having a heat dissipation structure according to the present invention, Figure 3a and 3b is a heat dissipation structure according to the present invention Figure 4 is an exploded perspective view and a perspective view showing the LED module in the LED, etc., Figure 4 is a state diagram showing the use of the LED lamp having a heat radiation structure according to the present invention.

1 to 4, the LED lamp 1 having a heat dissipation structure according to the present invention has a casing 10 and a space portion 11 in which a lower portion is opened and a space portion 11 is formed inward. It is located, the lower includes a heat sink 30 is installed a plurality of LED module 20.

The casing 10 may be formed in various forms, but most preferably, the casing 10 is formed in a truncated cone shape that becomes narrower from the bottom to the top.

As shown in FIG. 2, the casing 10 has upper and lower openings, and the surface of the casing 10 is engraved or embossed so that light emitted from the plurality of LED modules 20 can be reflected in various directions. The first casing 12 and the first casing 12 are positioned above the first casing 12, and a first through hole 14 is formed in the upper portion thereof to communicate with the first casing 12. And a second casing 13 in which two through holes 15 are formed.

The heat generated from the plurality of LED modules 20 located inside the casing 10 is discharged to the first and second through holes 14 and 15 to the outside, and blocks the inflow of bees, insects, and the like. Meshes 14a and 15a for the purpose may be installed.

As illustrated in FIG. 4, the LED lamp 1 having the heat dissipation structure may include a ballast 80, which is required to turn on the plurality of LED modules 20, and the ballast 80 may include the first ballast. Located in the casing 12 or may be provided in the fixed frame 90 is installed on the upper casing (10).

The fixing frame 90 may be provided with a hook 91 to be suspended from the ceiling of the building.

In addition, the LED lamp 1 having the heat dissipation structure may be installed on the ceiling while the wire 110 and the like provided on the other fixing device 100 fixed to the ceiling by the hook ring 91 are connected. .

The plurality of LED modules 20 includes a printed circuit board 21 and LED elements 22 installed on the printed circuit board 21, respectively, as shown in FIGS. 3A and 3B.

In addition, the plurality of LED modules 20 may further include a lens 23 installed on the outside of the LED element 22 and a lens cover 24 detachably coupled to the lens 23. .

The printed circuit board 21 may be provided with a cradle 25 on which the lens 23 is mounted to the outside of the LED element 22.

A pair of fastening grooves 26 are formed in the lens 23, and a pair of fastening protrusions 27 are detachably coupled to the pair of fastening grooves 26 in the lens cover 24. do.

The lens 23 emits light generated from the LED element 22 to the outside, and is fixed to the holder 25 by an adhesive or the like, and may be formed in various colors, but it is most preferably made of colorless transparent.

The lens cover 24 not only diffuses the light of the LED element 22 to the outside, but also prevents glare by direct lighting.

To this end, the lens cover 24 may be made of translucent or opaque by a sanding process or the like so that light of the LG element 22 may be indirectly illuminated, or a pattern engraved or embossed on a surface thereof may be formed.

5 and 6 are a bottom perspective view and a longitudinal sectional view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention.

5 to 6, the heat sink 30 is inclined downward from the plurality of holes 31 and the plurality of holes 31 for discharging the heat from the LED module 20, respectively. It comprises a plurality of heat dissipation fins (32).

The plurality of holes 31 allow the air to flow smoothly to the heat sink 30 or the plurality of LED modules 20 so that heat generated from the plurality of LED modules 20 by the flow of air is generated. Allow natural heat dissipation to the outside.

The plurality of holes 31 may be formed in various shapes, but most preferably formed in a quadrangular shape.

The plurality of heat dissipation fins 32 has three surfaces except one surface toward the center portion of the heat dissipation plate 30 among four surfaces forming a circumference thereof, and forms a shape bent downward with respect to one surface thereof. That is, the plurality of heat dissipation fins 32 are cut out from the plurality of holes 31 and bent, and are inclined toward the center of the heat dissipation plate 30.

The plurality of heat dissipation fins 32 may be disposed radially around the center portion of the heat sink 30, and a plurality of layers may be formed from the edge of the heat sink 30 to the center part of the heat sink 30.

For example, the plurality of heat dissipation fins 32 may be disposed on the first heat dissipation layer 33 and the heat dissipation plate 30, which are disposed radially at the edge of the heat dissipation plate 30, as shown in FIGS. 5 and 6. A second heat dissipation layer 34 disposed radially inside the first heat dissipation layer 33 may be formed around the central portion.

In this case, the inclination angle of the heat dissipation fins disposed on the first heat dissipation layer 33 may be different from the inclination angle of the heat dissipation fins disposed on the second heat dissipation layer 34.

That is, the inclination angle A of the heat dissipation fins disposed on the first heat dissipation layer 33 may be greater than the inclination angle B of the heat dissipation fins disposed on the second heat dissipation layer 34. Here, the inclination angles (A, B) of the heat dissipation fin 32 may be understood as an angle inclined downward from the heat dissipation plate 30.

This is to form an inclined angle of the LED module 20 fixed to the heat dissipation fin 32 gradually from the center of the heat dissipation plate 30 toward the outer edge thereof so as to realize optimal light distribution and illuminance.

7 and 8 are a perspective view and a bottom perspective view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention, Figure 9 is a perspective view showing a heat sink in the LED lamp having a heat dissipation structure according to the present invention, Figure 10 is the present invention An exploded perspective view showing the inner cover and the outer cover coupled to the heat sink in the LED having a heat dissipation structure according to.

Referring to FIGS. 7 to 10, the plurality of LED modules 20 are fixedly installed on the plurality of heat dissipation fins 32, are connected to each other by a power supply line, and are supplied with power from the outside to emit light.

That is, the plurality of LED modules 20 are fixed to the plurality of heat dissipation fins 32 by fasteners 28 such as screws. In this case, it may be understood that the printed circuit board 21 is fixed to the heat dissipation fin 32.

In this case, the LED lamp 1 having a heat dissipation structure may further include a heat dissipation body 40 provided between the plurality of heat dissipation fins 32 and the plurality of LED modules 20.

The radiator 40 may include a graphite 41 having upper and lower surfaces, and a silver foil 42 may be attached to at least one of upper and lower surfaces of the graphite 41. Here, the graphite 41 is preferably understood to be a thin thickness in the form of a film, it may be made of a single number, but most preferably made of a plurality, for example, three.

In addition, the graphite 41 faces upward, that is, the printed circuit board 21, and the silver foil 42 is preferably installed downward.

The graphite 41 has a high specific strength, is extremely resistant to thermal shock and corrosion, and has a high thermal conductivity and electrical conductivity, and the silver foil 42 compensates for the strength of the graphite 41.

The radiator 40 has both ends and is formed extending in both ends thereof, and one end is positioned between the LED module 20 and the heat dissipation fin 32 to be fixed by the fastener 28, and the other end. Is drawn into the hole 31 or folded upward from the outer circumferential surface of the heat sink 30.

The width of the heat dissipator 40 is smaller than the width of the heat dissipation fin 32, and is preferably the same as or smaller than the width of the printed circuit board 21. This is to prevent the heat sink 40 from being easily exposed to the outside of the printed circuit board 21.

The heat sink 30 may have a heat sink 50 installed on an upper surface thereof, and in this case, the heat sink 30 may be located at the center of the heat sink 30 so as not to interfere with the heat discharge from the hole 31.

The heat sink 50 may be formed in various forms known to radiate heat generated from the plurality of LED modules 20 to the outside.

The heat dissipation plate 30 may be fixed to the casing 10 by rivets, and a heat dissipation grease may be applied between the casing 10 and the heat dissipation plate 30.

The heat dissipation grease connects the heat dissipation plate 30 and the casing 10 to conduct heat generated from the LED module 20 to the casing 10. The casing 10 is in contact with the outside air is naturally radiated heat generated by the LED module 20.

For this reason, the LED lamp 1 having the heat dissipation structure may radiate heat generated from the plurality of LED modules 20 to the outside.

In addition, the LED lamp 1 having the heat dissipation structure can achieve miniaturization and large capacity by dissipating heat generated by the plurality of LED modules 20 to the light-emitting heat sink 40.

Meanwhile, the LED lamp 1 having the heat dissipation structure may further include an inner cover 60 coupled to the lower portion of the heat sink 30 and an outer cover 70 coupled to the lower portion of the inner cover 60. have.

The inner cover 60 is detachably fixed to the heat dissipation plate 30, and forms a disc, and a plurality of penetratings are formed along a circumference such that the lenses 23 provided in the plurality of LED modules 20 pass through the inner cover 60. The groove 61 and a plurality of through holes 62 penetrating inward and downward are formed.

For example, the heat sink 30 has a plurality of first supports 35 having one end fixed to a lower surface of the heat sink 30, the other end extending downward, and a thread formed inside the bottom of the heat sink 30. ) Is provided. One end portion is fixed to the lower surface of the heat sink 30 at an edge thereof, and the other end portion is formed to extend downward, and a plurality of second support members 36 are formed with threads formed in the lower portion thereof.

The inner cover 60 has a plurality of fastening holes 63 are formed in the central portion so as to correspond to the plurality of first supports 35, and fasteners 64 such as screws pass through the fastening holes 63. While being bound to the first support 35 is fixed to the heat sink 30 detachably.

Among the plurality of LED modules 20, the plurality of through holes 61 may include an LED module disposed in the first heat dissipation layer 33, and the plurality of through holes 62 may include the second heat dissipation layer. It can be understood that the LED module disposed at 34 is located.

The inner cover 60 may be formed with a plurality of ventilation holes 65 to allow heat generated from the plurality of LED modules 20 to be radiated to the outside, the plurality of ventilation holes 65 is the inner Most preferably, it is formed in the center of the cover 60.

The outer cover 70 has a plurality of second fastening holes 74 are formed at the edge thereof to correspond to the plurality of second support 36, the coupling hole 73, such as screws, the second fastening holes 74 It is bound to the second support (36) through) and is detachably fixed to the heat sink (30).

The outer cover 70 is formed in the shape of a disc, a hollow 71 penetrating in the up and down direction in the center portion and formed radially along the circumference of the hollow 71, the plurality of communication with the hollow 71 The secondary hollow 72 is formed.

The plurality of through holes 61 and the plurality of auxiliary hollows 72 communicate with each other in the up and down directions, and the plurality of through holes 62 are positioned inside the hollow 71.

The lenses 23 provided in the plurality of LED modules 20 are exposed to the outside through the through groove 61, the auxiliary hollow 72, the through hole 62, and the hollow 71.

Therefore, the LED lamp 1 having the heat dissipation structure may brightly illuminate the surroundings while the plurality of LED modules 20 are exposed to the outside when the LED lamp 1 is turned on.

What has been described above is merely an embodiment for implementing the LED and the like having a heat dissipation structure according to the present invention, the present invention is not limited to the above-described embodiment, the subject matter of the present invention as claimed in the following claims Without departing from the technical spirit of the present invention to the extent that any person of ordinary skill in the art to which the present invention pertains various modifications can be made.

Description of the Related Art [0002]
1: LED 10: Casing
11: space part 12: first casing
13: 2nd casing 14: 1st hole
15: second hole 20: LED module
21: printed circuit board 22: LED element
23 lens 24 lens cover
25: holder 26: fastening groove
27: fastening protrusion 30: heat sink
31 hole 32 heat sink
33: first heat radiation layer 34: second heat radiation layer
35: first support 36: second support
40: heat sink 41: graphite
42: foil 50: heat sink
60: inner cover 61: through groove
62: through-hole 65: ventilation hole
70: outer cover 71: hollow
72: secondary hollow 80: ballast
90: fixed frame 91: hook
100: fixing device 110: wire

Claims (10)

A casing in which a lower portion is opened to form a space portion inwardly; And
Located in the space portion, the lower portion includes a heat sink is installed a plurality of LED modules,
The heat sink is,
A plurality of holes for radiating heat generated from the LED module to the outside; And
Comprising a plurality of heat radiation fins each inclined downward from the plurality of holes,
LEDs having a heat dissipation structure, characterized in that the plurality of LED modules are installed on the plurality of heat dissipation fins. The method of claim 1,
The casing includes:
The upper opening is formed to form a first through hole, and a plurality of second through holes are formed in the upper outer circumferential surface thereof,
LED having a heat dissipation structure, characterized in that it comprises a net body for blocking the first and second holes. The method of claim 1,
LEDs having a heat dissipation structure, wherein the plurality of heat dissipation fins are disposed radially about a central portion of the heat sink, and a plurality of layers are formed from an edge of the heat sink to a center of the heat sink. The method of claim 3, wherein
The plurality of layers,
LEDs having a heat dissipation structure, characterized in that the inclination angle of the heat dissipation fin becomes smaller from the edge of the heat sink to the center of the heat sink. The method of claim 1,
LED having a heat dissipation structure characterized in that it further comprises a heat sink installed on the top of the heat sink. The method of claim 1,
An inner cover coupled to a lower portion of the heat sink; And
LED having a heat dissipation structure further comprises an outer cover coupled to the lower portion of the inner cover. The method according to claim 6,
The inner cover is,
A plurality of through holes are formed along the circumference and a plurality of through-holes penetrating inward and downward,
The outer cover is,
Hollow penetrating in the vertical direction in the central portion and the radially formed along the circumference of the hollow, a plurality of auxiliary hollows are formed in communication with the hollow,
The LED module is located in each of the plurality of through holes and the plurality of through holes,
The plurality of through holes and the plurality of auxiliary hollows communicate in up and down directions,
LEDs having a heat dissipation structure, characterized in that the plurality of through holes are located inside the hollow. 8. The method according to any one of claims 1 to 7,
The plurality of LED modules,
A printed circuit board having one surface installed at the heat dissipation fins;
An LED element installed on the other surface of the printed circuit board;
A lens disposed outside the LED element and covering the LED element; And
Removably coupled to the lens, the LED having a heat dissipation structure, characterized in that it comprises a lens cover for indirectly illuminating the light of the LED element. The method of claim 8,
LEDs having a heat dissipation structure, characterized in that further comprising a heat dissipation provided between the plurality of heat dissipation fins and the plurality of LED modules, respectively. The method of claim 9,
The heat sink,
Graphite having a top and bottom surface; And
LEDs having a heat dissipation structure, characterized in that it comprises a silver foil attached to at least one of the upper and lower surfaces of the graphite.

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