KR102458845B1 - Plasma processing apparatus and method using the same - Google Patents

Abstract

One embodiment of the present invention provides a plasma processing device comprising: an accommodating part that accommodates an object to be processed; an exhaust part connected to the accommodating part, and exhausting the air of a predetermined space surrounding the object to be processed; and a processing part that forms an electric field for plasma generation in the predetermined space in which the air is exhausted. Therefore, the present invention is capable of improving a hydrophilic property of a surface of the object to be processed.

Description

Plasma processing apparatus and method using the same

The present invention relates to a plasma processing apparatus and a method using the same, and more particularly, to a plasma processing apparatus and a method using the same for imparting characteristics according to plasma processing to an object to be processed.

Plasma treatment is used for various purposes in various industries such as semiconductors, displays, agriculture and medical industries.

In the agricultural field, plasma treatment is applicable for sterilization and germination promotion of seeds using non-thermal plasma. This plasma treatment can have a sterilizing effect on the microorganisms present on the sprout surface by directly applying non-thermal plasma treatment to the seed surface, and shorten the time required for germination by promoting the germination rate and germination rate of sprout seeds, which is required for production in agriculture. It has the effect of being able to shorten the cooking period and providing safer food.

In addition, with the recent development of the medical industry, plasma treatment is used in various ways, and is used to increase biocompatibility in implantation of biomaterials such as implants. In particular, in dental treatment, a treatment for implanting an artificial tooth (generally referred to as an implant) to replace a tooth after tooth extraction due to tooth decay or other reasons is used.

Implants used as artificial teeth are made of materials that do not react negatively to the human body, and treatment is performed to restore function as well as beauty to areas without bones and gums. In this treatment, the fixture corresponding to the implant is planted in the alveolar bone from which the tooth has escaped, and is fixed to restore the function of the tooth.

Here, the primary procedure of placing the fixture in the alveolar bone and the secondary procedure of fixing the final prosthesis, the crown, are included after waiting for at least 3 months for the fixture to osseointegrate into the alveolar bone. Currently, commonly used fixtures are titanium metal or titanium alloy. This material takes a long time for osteointegration when implanted in the human body, and an oxide film is formed, so stability can be secured compared to metals of other materials. There is a need for more improved human body stability than this.

In order to compensate for these shortcomings, technologies capable of enhancing osseointegration by appropriately treating the surface of titanium and titanium alloy materials have been developed and applied.

The rate and quality of osseointegration are closely related to the chemical composition and surface properties of the implant, such as surface composition, surface roughness, and hydrophilicity. In particular, it is known that an implant having a high hydrophilic surface is advantageous for interaction with biological solutions, cells and tissues. It is also possible to secure hydrophilicity through the plasma surface treatment process in the production stage of the implant. However, there is a change over time from hydrophilicity to hydrophobicity due to the formation of an oxide film during production, transportation, distribution, and storage, and thus, it is difficult to secure existing biocompatibility.

Therefore, in order to solve the conventional problem of change with time, a technology for securing biocompatibility through surface treatment of the fixture before implantation with simple equipment is being developed. Techniques that can improve hydrophilicity and osseointegration efficiency by plasma surface treatment and UV irradiation are representative. However, in the case of medical devices that are inserted into the human body, such as implants, guarantee for sterility is required. There are possible problems.

Accordingly, in the case of ultraviolet irradiation, the above problem is solved by using a quartz tube capable of ensuring the transmittance of ultraviolet rays as a case and locating and processing the object to be treated therein, but in terms of cost in using an expensive quartz tube In addition, there is a problem that inconvenient management is required to prevent damage, and since the object to be treated located inside the quartz tube is isolated in terms of heat flow, heat cannot escape by UV treatment and there is a problem due to thermal damage.

In the case of the conventional plasma treatment, there is a problem in that aseptic packaging is removed for surface treatment of the fixture, and sterility assurance is difficult for fastening with a specific electrode connection part.

In addition, the conventional method of generating and processing plasma in an atmospheric pressure environment has a problem in that plasma processing performance is not constant, and high energy is transmitted locally to damage the object to be treated, thereby causing deterioration of the performance of the fixture.

Since the conventional plasma treatment method performs surface treatment at atmospheric pressure, there is a problem that plasma generation and surface treatment are not spatially uniform. In order to improve this, there is a method of supplying a gas such as helium or argon to the space for plasma surface treatment in order to improve the spatial uniformity of the plasma surface treatment. However, this method has a limitation in that the gas must be continuously supplied, and there is a problem in that the sterility of the supplied gas must be secured.

Although sterility is guaranteed in the process of surface treatment of implants, hydrophobicity changes over time due to deposition of organic substances such as hydrocarbons (CHx) in the air, and accordingly, it is difficult to maintain the biocompatibility secured through surface treatment. have. Therefore, there is a problem in that the surface treatment technology cannot be applied in the production stage, and even if the surface is treated before the implant procedure, there is a problem in that the maintenance performance of the biocompatibility secured in the surface treatment in the relatively short storage process or this process is deteriorated.

An object of the present invention is to provide a plasma processing apparatus for imparting characteristics according to plasma processing of a target object such as a biomaterial, and a method using the same.

In one embodiment of the present invention, an accommodating part for accommodating an object to be treated, an exhaust part for evacuating air of a predetermined space surrounding the object by being connected to the accommodating part, and an exhaust in the predetermined space from which the air is exhausted Provided is a plasma processing apparatus including a processing unit for forming an electric field for plasma generation.

In an embodiment of the present invention, the exhaust unit may include an exhaust flow path generating unit for generating an exhaust flow path communicating with the predetermined space, and a pump for exhausting air in the predetermined space through the exhaust flow path.

In an embodiment of the present invention, the accommodating part includes a first accommodating part accommodating a first to-be-processed object and a second accommodating part accommodating a second to-be-processed object, and the exhaust flow path generator includes the first A first exhaust passage generating unit for generating a first exhaust passage communicating with a first predetermined space surrounding the object to be treated, and a second exhaust passage communicating with a second predetermined space surrounding the second object to be treated; It may include a second exhaust flow path generating unit for generating.

In one embodiment of the present invention, the control unit may further include a control unit for controlling the operation of the exhaust unit based on whether the target object is accommodated in the first accommodating part or the second accommodating part.

In an embodiment of the present invention, the processing unit includes a first electrode part disposed on one side of the accommodating part and a second electrode part disposed on the other side of the accommodating part, and the first electrode part and the second electrode part Plasma may be formed in the predetermined space by the negative voltage difference.

In an embodiment of the present invention, the first electrode part may be electrically connected to the object to be processed.

In an embodiment of the present invention, the predetermined space may be set by a container for accommodating the object to be processed.

In one embodiment of the present invention, the accommodating part is formed in a shape corresponding to the shape of the container in order to fix the container, and may further include a replaceable fixing jig.

In one embodiment of the present invention, the exhaust flow path generating unit may include a communication means for generating the exhaust flow passage by piercing one surface of the container and a driving means for moving the communication means.

In one embodiment of the present invention, the accommodating part and the relative movement to seal the target object from the external environment, and may further include a sealing part for setting the predetermined space.

In one embodiment of the present invention, the upper block disposed on the upper part of the receiving part, provided inside the upper block, the elevating part connected to the sealing part and a motor for elevating the elevating part so that the sealing part is raised and lowered. may include more.

In an embodiment of the present invention, the first electrode part may be disposed in the receiving part, and the second electrode part may be disposed in the sealing part to surround the target object.

In one embodiment of the present invention, a storage determination step of determining whether the object to be processed is received or not, a first exhaust step of exhausting air in a predetermined space surrounding the object when it is determined that the object to be processed is received , wherein air in the predetermined space is exhausted and repeatedly generates plasma in the predetermined space to perform surface treatment of the object to be treated.

In one embodiment of the present invention, the processing step may be a step of generating the repetitive plasma when the internal pressure of the predetermined space reaches a preset reference pressure.

In one embodiment of the present invention, the processing step may be a step of repeatedly performing generation and stopping of plasma generation by repeating 'on' and 'off' of the application of power for plasma generation.

In an embodiment of the present invention, a second exhaust step of continuously evacuating the interior of the accommodating part so that the internal pressure of the accommodating part maintains the reference pressure while the generation and stopping of the plasma generation is repeatedly performed may include

In an embodiment of the present invention, the method may further include a closing step of stopping the exhaust while the plasma generation and generation stop are repeatedly performed.

In one embodiment of the present invention, in the first exhaust step, when the internal pressure of the predetermined space is greater than the reference pressure after a preset reference time has elapsed, it may be determined as defective.

Plasma processing apparatus and method using the same according to embodiments of the present invention lower the internal pressure of the container to a reference pressure lower than atmospheric pressure, and then perform plasma surface treatment to more effectively remove foreign substances such as hydrocarbons from the surface of the object to be treated As a result, the hydrophilicity of the surface of the object to be treated is improved.

In addition, the plasma processing apparatus and the method using the same according to the embodiments of the present invention can generate plasma in a wider area by repeating generation and stopping of plasma generation, that is, performing plasma discharge in the form of a pulse, It is possible to further increase the efficiency of the removal of hydrocarbons by

In addition, the plasma processing apparatus and the method using the same according to embodiments of the present invention increase the ozone concentration in the container and increase the ozone concentration in the container by performing plasma surface treatment while stopping the exhaust of the air inside the container and closing the container from the outside. , through this, it is possible to achieve a high sterilization effect on the surface of the object to be treated.

In addition, the plasma processing apparatus and the method using the same according to the embodiments of the present invention remove foreign substances generated during plasma surface treatment by evacuating the inside of the container again after stopping the plasma surface treatment, so that the foreign substances are removed from the target object. By preventing redeposition on the surface and evacuating the internal pressure of the container to a reference pressure lower than atmospheric pressure, it is possible to improve the sealability of the container. Therefore, the sterilization effect of the surface of the object to be sterilized by ozone is maintained.

In addition, the plasma processing apparatus and the method using the same according to the embodiments of the present invention increase the effect of sterilizing the surface of the object to be treated by ozone by closing the container with the outside during plasma surface treatment, and then include hydrocarbons in the container, etc. By evacuating foreign substances, it is possible to prevent redeposition of foreign substances on the object to be treated.

1 is a block diagram schematically illustrating a plasma processing apparatus according to the present invention.
FIG. 2 is a conceptual diagram for explaining the concept of the plasma processing apparatus of FIG. 1 .
FIG. 3 is a conceptual diagram for explaining a predetermined space in which exhaust is performed in the plasma processing apparatus of FIG. 2 .
4 is a conceptual diagram schematically illustrating a plasma processing apparatus according to a first embodiment of the present invention.
5 is a conceptual diagram illustrating a plasma processing apparatus according to a second embodiment of the present invention.
6 is an exemplary diagram illustrating an embodiment of the plasma processing apparatus of FIG. 5 .
7A and 7B are conceptual diagrams for explaining a plasma processing apparatus according to a third embodiment of the present invention.
8A is a perspective view of a plasma processing apparatus according to a fourth embodiment of the present invention, and FIG. 8B is a cross-sectional view of FIG. 8A.
FIG. 9A is a perspective view illustrating a state in which the holding device holding the object to be processed is seated in the receiving part of the plasma processing device of FIG. 8A , and FIG. 9B is a cross-sectional view of FIG. 9A .
10A is a perspective view illustrating a state in which the space setting unit is lowered from the state of FIG. 9A to seal the object to be processed from the external environment, and FIG. 10B is a cross-sectional view of FIG. 10A .
11 is an exemplary view illustrating a sealing part according to another embodiment.
12 is a perspective view illustrating the inside of the plasma processing apparatus of FIG. 8A.
13 is a perspective view illustrating a state in which a chamber of the plasma processing apparatus is opened.
14 is a diagram showing another embodiment of the processing unit of the plasma processing apparatus of the present invention.
15 is a diagram sequentially illustrating a plasma processing method according to an embodiment of the present invention.
16 is a graph of internal pressure in a predetermined space over time while performing a plasma processing method according to an embodiment of the present invention.
17 is a graph of internal pressure in a predetermined space over time while performing a plasma processing method according to another exemplary embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted.

Since the technical spirit of the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the technical spirit of the present invention to specific embodiments, and it should be understood to include all changes, equivalents or substitutes included in the scope of the technical spirit of the present invention.

In describing the technical idea of the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, numbers (eg, first, second, etc.) used in the description process of the present specification are merely identification symbols for distinguishing one component from other components.

In addition, in this specification, when a component is referred to as "connected" or "connected" with another component, the component may be directly connected or directly connected to the other component, but in particular It should be understood that, unless there is a description to the contrary, it may be connected or connected through another element in the middle.

In addition, terms such as "~ unit", "~ group", "~ character", and "~ module" described in this specification mean a unit that processes at least one function or operation, which is a processor, a micro Processor (Micro Processor), Micro Controller (Micro Controller), CPU (Central Processing Unit), GPU (Graphics Processing Unit), APU (Accelerate Processor Unit), DSP (Drive Signal Processor), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), etc. may be implemented as hardware or software or a combination of hardware and software, and may be implemented in a form combined with a memory that stores data necessary for processing at least one function or operation. .

In addition, it is intended to clarify that the classification of the constituent parts in the present specification is merely a classification for each main function that each constituent unit is responsible for. That is, two or more components to be described below may be combined into one component, or one component may be divided into two or more for each more subdivided function. In addition, each of the constituent units to be described below may additionally perform some or all of the functions of other constituent units in addition to the main function it is responsible for. Of course, it can also be performed by being dedicated to it.

1 is a block diagram schematically illustrating a plasma processing apparatus 10 according to the present invention, FIG. 2 is a conceptual diagram for explaining the concept of the plasma processing apparatus 10 of FIG. 1 , and FIG. 3 is the plasma of FIG. 2 . It is a conceptual diagram for demonstrating the predetermined space S1 in which exhaust is made in the processing device 10 .

1 to 3 , the plasma processing apparatus 10 according to the present invention includes a receiving unit 110 , an exhaust unit 130 , and a processing unit 140 . In addition, the plasma processing apparatus 10 according to an embodiment of the present invention may further include a control unit 160 and a sensor unit 180 .

The plasma processing apparatus 10 according to the present invention accommodates the object 20 and creates a low-pressure environment for plasma discharge in a predetermined space S1 accommodating the object 20, thereby generating the object 20 ), characterized in that the surface of the plasma treatment.

Here, the target object 20 may be any object that can be sterilized through plasma treatment, and for example, a biomaterial such as an implant fixture or a bone graft material may be a target. In addition, the object to be processed 20 may be made of a material having conductivity or may be made of a material having non-conductivity.

The accommodating part 110 performs a function of accommodating the to-be-processed object 20 . At this time, the to-be-processed object 20 may be accommodated in the receiving part 110 by itself of the to-be-processed object 20, and may be accommodated in the state accommodated in the container.

As an embodiment, the accommodation unit 110 may include a bottom member 111 for fixing the object 20 to the plasma processing apparatus 10 . The bottom member 111 may include a binding means (not shown) for fixing the object 20 after being accommodated in the plasma processing apparatus 10 .

As another embodiment, the accommodating part 110 may further include a wall member 113 surrounding the object 20 to be processed. The wall member 113 may form a predetermined space S1 for accommodating the target object 20 together with the floor member 111 , and an electrode of the processing unit 140 to be described later is disposed to generate an environment for plasma. It can perform the function of creating

In FIG. 2 , the wall member 113 is illustrated as enclosing a part of the target object 20 , but this is briefly illustrated for convenience of explanation, and the wall member 113 is a member to be processed together with the floor member 111 . Of course, it may be configured in a shape surrounding the entire area of the water 20 .

On the other hand, the accommodating part 110 is formed in a shape corresponding to the shape of the container 200 in order to fix the container 200 for accommodating the target object 20, and a replaceable fixing jig (not shown) is further added. may include Through this, the accommodating part 110 can fix the containers 200 of various shapes through one accommodating part 110 .

The exhaust unit 130 is connected to the accommodating unit 110 , and performs a function of evacuating the air in the predetermined space S1 surrounding the target object 20 . Here, the predetermined space S1 is a space in which plasma is formed, and may be a space that seals the object 20 from the external environment.

As an embodiment, as shown in (b) of Figure 3, the predetermined space (S1) may be formed by the container 200 containing the target object (20). As another embodiment, as shown in Fig. 3 (c), the predetermined space (S1) is a space formed by the accommodating part 110, specifically, the floor member 111 and the wall member 113 of the accommodating part 110. can be

The exhaust unit 130 may include a pump that exhausts air in the predetermined space S1 and has a configuration connected to the predetermined space S1 so as to be in fluid communication with the predetermined space S1. can do. For example, as shown in FIG. 3B , when the predetermined space S1 is formed by the container 200 , the exhaust unit 130 may have a configuration that can be inserted into the container 200 . More specific details of each of the embodiments will be described later.

The exhaust unit 130 exhausts air in the predetermined space S1 to lower the pressure in the predetermined space S1 to a pressure level at which plasma can be formed. In addition, the exhaust unit 130 is in fluid communication with the predetermined space ( S1 ), so that after plasma processing is completed, it may also perform a function of injecting air for venting the interior of the predetermined space ( S1 ).

The processing unit 140 performs a function of forming an electric field to generate plasma in the predetermined space S1 from which air is exhausted. The plasma processing apparatus 10 according to an embodiment of the present invention may generate plasma in a predetermined space S1 through a dielectric barrier discharge (DBD).

The dielectric barrier may be formed by including the dielectric portion 145 in the plasma processing apparatus 10 , but is not limited thereto. The dielectric barrier may be formed by providing at least a portion of the container 200 for accommodating the object 20 with a dielectric material. For example, in the container 200 , the side portion 201 disposed adjacent to the second electrode 143 in a state accommodated in the accommodation portion 110 may be formed of a dielectric material.

In order for the plasma processing apparatus 10 to generate a high voltage with a dielectric barrier interposed therebetween, the processing unit 140 includes the first electrode unit 142 disposed on one side of the receiving unit 110 and the receiving unit 110 . It may include a second electrode part 143 disposed on the other side. In addition, the processing unit 140 may include a power supply unit 141 for applying a voltage to the first electrode unit 142 and the second electrode unit 143 . The processing unit 140 may form plasma in the predetermined space S1 by the voltage difference between the first electrode unit 142 and the second electrode unit 143 .

As an embodiment, the first electrode part 142 may be electrically connected to the object 20 to be processed. Here, the object 20 is electrically connected to the first electrode part 142 to function as a medium generating a high voltage by itself. The first electrode part 142 is provided on the bottom member 111 of the accommodating part 110, and when the object 20 to be processed is accommodated in the accommodating part 110, it can be electrically connected by contact (FIG. 3(b)).

At this time, when the object 20 is accommodated in the container 200 , an electrical connection part 240 electrically connected to the object 20 is provided on one side of the container 200 , and the electrical connection part 240 . By making contact with the first electrode part 142 , the object 20 to be processed may be electrically connected to the first electrode part 142 .

Alternatively, the first electrode part 142 may have a structure that can be inserted into the container 200 for accommodating the object 20 from one side of the accommodating part 110 , and may be electrically connected to the object 20 . . In other words, when the object 20 to be processed is accommodated in the container 200 , the first electrode part 142 may be inserted into the container 200 and directly connected to the object 20 to be processed. The water 20 may be electrically connected by contacting the fixing member 22 (refer to FIG. 7A ).

The second electrode part 143 is disposed on the other side of the receiving part 110 , and may be provided on the wall member 113 so as to be disposed adjacent to the target object 20 . The second electrode part 143 is a ground electrode to which no voltage is applied, and may maintain a ground (0 V). The second electrode part 143 is a ground electrode corresponding to a high voltage part by applying a voltage to the object 20 accommodated in the accommodating part 110 , and interacts with the high voltage applied to the object 20 . It performs the function of forming an electromagnetic field.

The control unit 160 performs a function of controlling components of the plasma processing apparatus 10 . The control unit 160 may control the operation of the exhaust unit 130 and the operation of the processing unit 140 based on whether the object to be processed is accommodated in the receiving unit 110 . A method of plasma-treating the object 20 by controlling the operation of the exhaust unit 130 and the processing unit 140 by the control unit 160 will be described later.

The sensor unit 180 performs a function of detecting environmental information necessary for the control unit 160 to perform an operation of the exhaust unit 130 or the processing unit 140 .

As an embodiment, the sensor unit 180 may include an accommodation detection sensor (not shown) that detects whether the object 20 is accommodated in the accommodation unit 110 . For example, the accommodation detection sensor (not shown) is a QR code of the container on the surface in which the object 20 or the container 200 in which the object 20 is accommodated is accommodated in the receiving part 110, Through barcode or proximity communication connection (RFID, NFC), information on the type of the container 200, the type of the object 20, whether it is genuine, and whether the container 200 is accurately stored, etc. ) can be provided.

The sensor unit 180 may further include a pressure gauge (not shown) for measuring the internal pressure of the predetermined space S1 . A pressure gauge (not shown) may provide the measured pressure value of the predetermined space S1 to the controller 160 .

Hereinafter, various embodiments of the plasma processing apparatus 10 of the present invention will be described in more detail with reference to the drawings. The concept of the plasma processing apparatus 10 has been described above, and overlapping descriptions will be omitted for convenience of description.

4 is a conceptual diagram schematically illustrating a plasma processing apparatus 10 - 1 according to a first embodiment of the present invention.

Referring to FIG. 4 , the plasma processing apparatus 10-1 according to the first embodiment of the present invention accommodates the container 200 in which the object 20 is accommodated, so that the object 20 is moved to the external environment. Plasma surface treatment can be performed in a state not exposed to.

The accommodating part 110 according to the first embodiment of the present invention has a structure that surrounds at least a portion of the container 200 , and the lower end of the container 200 may be fitted to fix the container 200 .

As another embodiment, although not shown, the accommodating part 110 is provided with an elastic locking member (not shown), and when the user mounts the container 200 while applying a force, the container 200 with a 'click' sound. ) can be fixed in the device. In this case, the container 200 may be accommodated in the accommodating part 110 and, at the same time, may be in contact with the first electrode part 142 to be electrically connected. In addition, when the user presses the mounted container 200 again, the fixed coupling in the accommodating part 110 is released and the container 200 may be pushed up to the upper part of the accommodating part 110 and protrude.

The exhaust unit 130 may exhaust air inside the container 200 . The exhaust unit 130 exhausts the air in the predetermined space S1 through the exhaust passage generating unit 131 and the exhaust passage 1312 for generating the exhaust passage 1312 communicating with the predetermined space S1 in the container. It may include a pump 135 that does.

The exhaust flow path generating unit 131 may further include a communication means 1311 for generating a path by piercing one surface of the container 200 . The communication means 1311 is formed in the shape of a needle including a tip portion and can be effectively inserted into one surface of the container 200 .

The communication means 1311 may be made of a hollow tube, and a through hole is formed adjacent to the front end, so that the air in the predetermined space S1 is supplied in a state in which the front end including the through hole is inserted into the container 200 . can be exhausted Alternatively, the communication means 1311 may also perform a function of a passage through which air for venting the interior of the vessel 200 is injected after plasma processing is completed through the above-described structure.

In this case, the exhaust unit 130 may further include a driving means 132 for moving the communication means 1311 so that the communication means 1311 can be inserted into or removed from the container 200 . The driving means 132 moves the communication means 1311 to the container 200 side in order to perform plasma treatment after the container 200 is mounted on the receiving part 110, so that air is formed on one surface of the container 200. Distribution channels can be created.

The communication means 1311 may return to its original position by the driving means 132 after the plasma treatment is completed and vented. At this time, the container 200 may be made of an elastic material that can restore the path penetrated by the communication means 1311 when the communication means 1311 is separated.

The exhaust unit 130 may further include an exhaust valve 133 disposed in the exhaust passage 1312 to control opening and closing of the exhaust passage 1312 according to a control signal. The exhaust valve 133 may control the opening and closing of the exhaust passage 1312 , thereby adjusting the internal pressure in the container 200 . The exhaust valve 133 is controlled to close when an error occurs in the binding state of the container 200 or the plasma processing operation, thereby preventing damage to the container 200 or the object 20 to be processed.

Also, the exhaust unit 130 may include a pump valve 134 adjacent to the pump 135 . The pump valve 134 may be opened when the air inside the container 200 is exhausted, and may be closed when the inside of the container 200 is vented.

The exhaust unit 130 is disposed on a path communicating with the filter unit 137, the filter unit 137, and the exhaust flow path generating unit 131 in the path through which external air is introduced to vent the inside of the container 200. , may include a filter valve 136 disposed adjacent to the filter means (137).

Here, the filter means 137 performs a function of filtering or purifying contaminants contained in external air, for example, the filter means 137 may include a HEPA filter (High Efficiency Particulate Air filter). .

The filter valve 136 may be closed when the air inside the container 200 is exhausted, and may operate to be opened when the inside of the container 200 is vented.

The processing unit 140 performs a function of forming an electric field to generate plasma in the predetermined space S1 from which air is exhausted.

In order for the plasma processing apparatus 10 to generate a high voltage with a dielectric barrier interposed therebetween, the processing unit 140 includes the first electrode unit 142 disposed on one side of the receiving unit 110 and the receiving unit 110 . It may include a second electrode part 143 disposed on the other side. In addition, the processing unit 140 may include a power supply unit 141 for applying a voltage to the first electrode unit 142 and the second electrode unit 143 . The processing unit 140 may form plasma in the predetermined space S1 by the voltage difference between the first electrode unit 142 and the second electrode unit 143 .

In this embodiment, the dielectric barrier may be provided on the side 201 of the container 200 , and may be the inner or outer cylinder of the container 200 .

FIG. 5 is a conceptual diagram for explaining a plasma processing apparatus 10-2 according to a second embodiment of the present invention, and FIG. 6 is an exemplary diagram illustrating an embodiment of the plasma processing apparatus 10-2 of FIG. 5 . to be.

The plasma processing apparatus 10 - 2 according to the second embodiment differs from the plasma processing apparatus 10 - 1 according to the first embodiment in the number of accommodating parts and exhaust flow path generators, but functionally it is different from the first embodiment in terms of functionality. Since they are the same, overlapping descriptions will be omitted.

5 and 6, the accommodating part 110 according to the second embodiment of the present invention includes a first accommodating part 110-1 for accommodating the first target object, and accommodating the second target object. and a second accommodating part 110-2. In the drawings, for convenience of explanation, a case in which the plasma processing apparatus 10-2 includes two accommodating parts 110 - 1 and 110 - 2 is illustrated as an example, but the present invention is not limited thereto. Of course, it is possible to have more wealth.

As in the first embodiment, the plurality of receiving portions 110-1 and 110-2 are provided with an elastic locking member (not shown), and when the user mounts the container while applying force, with a 'click' sound The container may be secured within the device. In this case, the container may be accommodated in the plurality of accommodating units 110-1 and 110-2 and, at the same time, may be electrically connected to generate an electrical signal.

The controller (not shown) receives the electrical signal, determines where the container is accommodated among the plurality of accommodating units 110-1 and 110-2, and then controls the operation of the exhaust unit 130 and the processing unit 140 . Thus, plasma treatment can be performed on the accommodated vessel.

On the other hand, in the drawing, the first accommodating part 110-1 and the second accommodating part 110-2 are provided with a 2-1 electrode part 143-1 and a 2-2 electrode part 143-2, , a first dielectric part 145-1 disposed adjacent to the 2-1 electrode part 143-1 and a first dielectric part 145-1 disposed adjacent to the 2-2 electrode part 143-2 to form a dielectric barrier. It is illustrated as including two dielectric parts 145 - 2 .

In this case, the first container 200 - 1 including the first object to be processed and the second container 200 - 2 including the second object to be processed may not include a dielectric on the outer surface. If the outer surfaces of the first container 200-1 and the second container 200-2 are made of a dielectric material, the first container 110-1 and the second container 110-2 have a second container. The first dielectric part 145 - 1 and the second dielectric part 145 - 2 may be omitted.

The exhaust unit 130 includes a first exhaust flow path generating unit 131-1 for generating a first exhaust flow path communicating with the first vessel 200-1, and a second exhaust flow path generating unit 131-1 communicating with the second vessel 200-2. A second exhaust passage generating unit 131 - 2 for generating two exhaust passages may be included. The first exhaust flow path generation unit 131-1 and the second exhaust flow path generation unit 131-2 may include communication means as in the first embodiment.

The exhaust unit 130 includes a first driving means 132-1 and a first driving means 132-1 for inserting or removing the communication means into each of the first container 200-1 and the second container 200-2, respectively. It may include two driving means 132-2. The first driving means 132-1 and the second driving means 132-2 may be provided separately, but the present invention is not limited thereto and is provided as a single driving means to independently drive a plurality of communication means. may be

The exhaust unit 130 may include a pump 135 for exhausting air inside the plurality of containers 200 - 1 and 200 - 2 and a pump valve 134 adjacent to the pump 135 . In this case, the second embodiment may exhaust the air inside the plurality of containers 200 - 1 and 200 - 2 that are fluidly communicated by using one pump 135 .

To this end, the exhaust unit 130 includes a first exhaust valve 133-1 disposed on the first exhaust passage and a second exhaust valve 133-2 disposed on the second exhaust passage, and the control unit ( air in the plurality of containers 200-1 and 200-2 can be independently exhausted by individually controlling the first exhaust valve 133-1 and the second exhaust valve 133-2 by have.

In addition, the exhaust unit 130 is one filter means 137 in the path through which external air is introduced to vent the inside of the container 200 . A filter valve 136 disposed on a path communicating with the filter means 137 and the exhaust flow path generator 131 and adjacent to the filter means 137 may be included.

The processing unit 140 includes a 1-1 electrode part (not shown) and a 2-1 electrode part ( 143-1) and a first processing unit including a first power supply unit 141-1, and a first for forming an electric field inside the second container 200-2 accommodated in the second accommodating unit 110-2 a second processing unit including a -2 electrode unit (not shown), a 2-2 electrode unit 143-2, and a second power source unit 141-2.

The first power supply unit 141-1 and the second power supply unit 141-2 are configured as a single unit, and a switch is provided on the power line for applying power to each container 200-1, 200-2 to operate simultaneously or individually. It can be configured to make this possible.

Here, the plasma processing apparatus 10-2 includes a first housing 100-1 and a pump 135 for configuring a stand-alone plasma processing module by arranging a plurality of accommodating parts 110-1 and 110-2 therein. and a second housing 100-2 for arranging the filter means 137 therein, and a connecting member 100-3 for connecting the first housing 100-1 and the second housing 100-2. may include

The first housing 100-1 includes a body member 101 for arranging components such as a plurality of accommodating parts 110-1 and 110-2 therein.

As another embodiment, the first housing 100-1 may further include a cover member 102 disposed on the body member 101 to open and close the plurality of accommodating parts 110-1 and 110-2. . The cover member 102 opens and closes the upper portions of the first accommodating part 110-1 and the second accommodating part 110-2 to thereby open and close the first accommodating part 110-1 and the second accommodating part 110-2. After the container is stored in the container, it can perform a function of preventing the container from being separated. In addition, the outer surface of the cover member 102 may include a display unit 190 for displaying the operating state of the device.

The connecting member 100-3 may be made of a material having elasticity or flexibility, or may have a structure in which a plurality of unit components are connected, so that the first housing 100-1 and the second housing 100-2 are connected to each other. It is possible to change the point and length, and it is possible to easily change the arrangement structure. However, this is only one embodiment, and it goes without saying that the plasma processing apparatus 10 - 2 may include one housing to configure the exterior.

7A and 7B are conceptual diagrams for explaining the plasma processing apparatus 10-3 according to the third embodiment of the present invention.

Referring to FIGS. 7A and 7B , the plasma processing apparatus 10-3 according to the third embodiment applies an electric field and means for evacuating a container 200 in which the object 20 is accommodated for plasma generation. It is characterized in that the means consists of one configuration.

In this case, the container 200 in which the target object 20 is accommodated may include a fixing member 21 for fixing the target object 20 in contact with the target object 20 .

As an embodiment, the container 200 may be an ampoule for accommodating the target object 20 and the fixing member 21 , and the fixing member 21 is coupled to the lower part 203 of the container to accommodate the processing target 20 . ) can be fixed in the container 200 .

The container 200 may be made of at least a portion of a dielectric material to form a dielectric barrier. For example, when the container 200 is accommodated in the accommodating part 110 , the side part 201 disposed adjacent to the second electrode 143 may be formed of a dielectric material. Alternatively, the container 200 may include the side portion 201 and the upper portion 202 as a single cover member, and the cover member may be made of a dielectric material.

In addition, the container 200 forms a portion through which the contact member 142 passes with an elastic material, so that the inside of the container 200 is sealed to maintain a vacuum state even if it is penetrated by the contact member 142 . To this end, at least one region of the lower portion 203 of the container 200 may be made of an ABS material based on styrene, a silicone material having a hardness of 10, or a mixed material thereof.

The fixing member 21 may be made of a material having electrical conductivity. The fixing member 21 may be in contact with the contact member 142 inserted into the container 200 from the outside.

The plasma processing apparatus 10 - 3 according to the third embodiment includes a receiving part 110 accommodating the container 200 in which the object 20 is accommodated, and a contact member electrically connected to the object 20 . 142 and a power supply unit 141 for applying power for generating plasma to the object 20 through the contact member 142 .

Here, the contact member 142 may be formed in a needle shape including a tip portion 1421 that can penetrate one surface of the container 200, and may be made of an electrically conductive material. At this time, the contact member 142 functions as an electrode of the plasma processing apparatus and at the same time functions as a communication means for forming an exhaust passage in the vessel 200 . To this end, the contact member 142 may have a hollow tube shape, and a through hole 1422 may be formed in the front end portion 1421 .

7b is for explaining when the contact member 142 is inserted into the container 200. Referring to FIG. 7b, the contact member 142 is inserted into the container 200 by the moving member 148. Thus, the side portion may be electrically connected to the object 20 to be processed. More specifically, the contact member 142 can be electrically connected by being inserted into the insertion groove of the fixing means 21 electrically connected to the object 20 to be processed, so that the side is in contact with the inner protrusion of the fixing means 21 . .

The through hole 1422 of the contact member 142 is located farther from the object 20 than the electrical contact between the contact member 142 and the object 20 in order to exhaust the internal air of the container 200 . can be formed in As an embodiment, the through hole 1422 may be formed at a position closer to the plasma processing apparatus 10 - 3 than the line or surface where the side of the contact member 142 and the fixing means 21 come into contact with each other. Through this, exhaust through the through hole 1422 strengthens the binding to the line or surface where the side of the contact member 142 and the fixing means 21 touch, and the problem that all of the internal air of the container 200 is not exhausted can be solved. have.

On the other hand, as another embodiment, the plasma processing apparatus 10 - 3 does not move the contact member 142 from the outside to the inside of the container 200 when the container 200 is accommodated, but rather one side of the container 110 . The contact member 142 may be fixedly disposed. In this case, the contact member 142 may be inserted into the container 200 by the pressure that is pressed while the container 200 is accommodated in the accommodation part 110 , and may come into contact with the fixing means 21 . have.

8A is a perspective view of a plasma processing apparatus 10-4 according to a fourth embodiment of the present invention, FIG. 8B is a cross-sectional view of FIG. 8A, and FIG. 9A is a receiving part of the plasma processing apparatus 10-4 of FIG. 8A. It is a perspective view showing a state in which the gripping device gripped by the object to be treated is seated, and FIG. 9B is a cross-sectional view of FIG. 8A . 10A is a perspective view showing a state in which the space setting unit is lowered in the state of FIG. 9A to seal the object to be processed from the external environment, FIG. 10B is a cross-sectional view of FIG. 10A, and FIG. 11 is an example showing the sealing part of another embodiment FIG. 12 is a perspective view illustrating the inside of the plasma processing apparatus of FIG. 8A , and FIG. 13 is a perspective view illustrating a state in which a chamber of the plasma processing apparatus is opened.

8A to 13 , in the plasma processing apparatus 10 - 4 according to the fourth embodiment, a seating part 2200 on which the object 20 is mounted, and the seating part 2200 are moved relative to each other. The sealing part 2400 for sealing the processed object 20 from the external environment, the processing part 2500 for discharging plasma inside the sealing part 2400 sealed from the external environment, and the sealing part 2400 sealed from the external environment. An exhaust part 2600 for exhausting the air inside, an upper block 2300 disposed on the upper part of the seating part 2200, and an elevating part ( 2310), and a motor 2340 for elevating the elevating unit 2310 so that the sealing unit 2400 is elevated and lowered, and an elastic member 2350 provided between the elevating unit 2310 and the sealing unit 2400. And, A magnet 2220 provided in the seating part 2200, a chamber 2110 provided on an upper portion of the body 2100, and a first UV LED 2130 irradiating UV to the inside of the chamber 2110, and the chamber It may be configured to include a chamber door 2120 for opening and closing the inside of the 2110 and a second UV LED 2360 for irradiating UV to the inside of the sealing part 2400 .

The surface of the object to be treated 20 is modified from hydrophobicity to hydrophilicity by plasma surface treatment of the plasma processing apparatus 10-4. The target object 20 may be a dental implant used in dentistry. The to-be-processed object 20 can be taken out by the holding device 22 from the packaging material in which the to-be-processed object 20 was sealed.

The gripping device 22 grips the object 20 to take out the object 20 from the packaging material, and then is seated on the seating unit 2200 in a state in which the object 20 is gripped. Accordingly, the object 20 to be processed may be seated on the seating unit 2200 by the gripping device 22 .

The body 2100 is positioned at the rear of the seating part 2200 and the upper block 2300 .

A power supply unit 2530 , an exhaust pump 2630 , and a filter 2660 are provided inside the body 2100 . A chamber 2110 is provided at an upper portion of the body 2100 . The holding device 22 holding the target object 20 may be accommodated in the chamber 2110 .

A first UV LED 2130 irradiating UV to the inside of the chamber 2110 is provided inside the chamber 2110 . The first UV LED 2130 may sterilize the target object 20 and the holding device 22 by irradiating UV to the holding device 22 holding the target object 20 .

The user may prevent the object 20 from being contaminated by taking out the object 20 from the packaging material using the holding device 22 inside the chamber 2110 .

A chamber door 2120 for opening and closing the inside of the chamber 2110 may be provided in the chamber 2110 .

The seating part 2200 is disposed to be positioned in front of the main body 2100 . The seating part 2200 is disposed to be positioned below the upper block 2300 . A hole 2210 into which the lower portion of the gripping device 22 is inserted is provided on the upper surface of the seating part 2200 . The lower portion of the gripping device 22 is inserted into the hole 2210 to be seated while being fixed to the seating portion 2200 . In this case, the lower surface of the gripping device 22 comes into contact with the bottom surface 2211 of the hole 2210 .

A magnet 2220 is provided in the seating part 2200 . The magnet 2220 may be provided on the bottom surface 2211 of the hole 210 .

The bottom surface of the gripping device 22 may be provided with a metal material, or the bottom surface itself may be made of a metal material. Accordingly, when the gripping device 22 is inserted into the hole 2210 , the bottom surface of the gripping device 22 may be coupled to the bottom surface 2211 of the hole 2210 by the magnet 2220 . As described above, the holding device 22 and the target object 20 may be firmly fixed to the seating part 2200 by the magnet 2220 and be seated therein.

The sealing part 2400 is moved relative to the seating part 2200 to seal the target object 20 from the external environment. In the present invention, as an example, the sealing part 2400 is raised and lowered so that the lower part of the sealing part 2400 is in contact with the upper surface of the seating part 2200, so that an enclosed space is formed inside the sealing part 2400. . Alternatively, the seating portion 2200 may be raised and lowered to form an enclosed space inside the sealing portion 2400 .

The sealing part 2400 is connected to the elevating part 2310 provided in the upper block 2300 . The sealing part 2400 has a hollow 410 formed in the center, and may have a double-wall structure including an inner wall 2420 and an outer wall 2430 . When the sealing part 2400 descends and the lower surface of the sealing part 2400 comes into contact with the upper surface of the seating part 2200, the hollow 410 of the sealing part 2400 forms an enclosed space.

Since the gripping device 22 seated on the seating part 2200 and the object 20 gripped by the gripping device 22 are located inside the hollow 410 of the sealing part 2400, the sealing part 2400 ) and the seating portion 2200 are sealed, the holding device 22 and the object 20 are located in the sealed space. Accordingly, the gripping device 22 and the object 20 are sealed from the external environment. The inner surface of the inner wall 2420 forms the inner surface of the hollow 410 , and the outer surface of the outer wall 2430 forms the outer surface of the sealing part 2400 .

A second electrode 2520 is disposed between the inner wall 2420 and the outer wall 2430 . The second electrode 2520 may be formed by coating the outer surface of the inner wall 2420 and the inner surface of the outer wall 2430 . A coating layer (not shown) may be formed on the inner surface of the inner wall 2420 . The coating layer may be made of a material capable of withstanding high temperature and high voltage to prevent the inner wall 2420 from being damaged or foreign substances eluted due to high temperature and high voltage during plasma discharge. The coating layer is a function of preventing foreign substances from adhering to the object to be treated 20 as the inner surface of the inner wall 2420 is damaged and eluted or foreign substances are eluted during plasma treatment on the inside of the sealing unit 2400 by the processing unit 2500 do

The coating layer may be made of a material containing calcium. As such, when the coating layer is made of a material containing calcium, calcium can be adhered to the surface of the object 20 by inducing the elution of calcium by plasma treatment. As such, by artificially attaching calcium to the surface of the object 20 to be treated, when implanting or engrafting the object 20 in the human body, the inflammatory reaction is relieved or the implantation or engraftment is strengthened. The implantation rate or engraftment rate can be guaranteed.

As described above, by including a biocompatible material in the coating layer so that the biocompatible material adheres to the surface of the object 20 during plasma treatment, the object 20 can be more safely implanted or engrafted in the human body. have.

The sealing part 2400 and the second electrode 2520 may be made of a transparent material. The sealing part 2400 may be a tubular tube made of a transparent tempered glass material having an inner wall 2420 and an outer wall 2430 .

The upper block 2300 is disposed to be positioned in front of the main body 2100 and above the seating part 2200 . An elevating unit 2310 is provided inside the upper block 2300 . The elevating unit 2310 is connected to the shaft 2330 by a connecting member 2320 . The shaft 2330 is rotatable by a motor 2340 . The connecting member 2320 and the elevating unit 2310 can be raised or lowered by the rotation of the shaft 2330 .

Accordingly, the shaft 2330 is rotated by the driving of the motor 2340 , and through this, the connecting member 2320 and the elevating unit 2310 are raised or lowered. The sealing part 2400 is connected to the elevating part 2310 . As described above, according to the rise or fall of the elevating unit 2310, the sealing unit 2400 is also raised or lowered.

9A and 9B, when the connecting member 2320 and the elevating part 2310 are in the raised position, the sealing part 2400 is also in the raised position, so that most of the area of the sealing part 2400 is It is inserted into the upper block 2300 and positioned inside the upper block 2300 .

10A and 10B, when the motor 2340 is driven to rotate the shaft 2330, the connecting member 2320 and the elevating unit 2310 are in the lowering position. In this case, the sealing part 2400 is also lowered so that the lower surface of the sealing part 2400 is in contact with the upper surface of the seating part 2200 , and most of the sealing part 2400 is taken out to the outside of the upper block 2300 . do.

An elastic member 2350 is provided between the elevating part 2310 and the sealing part 2400 . When the elastic member 2350 is in contact with the upper surface of the seating part 2200 as the lower surface of the sealing part 2400 descends by the elevating part 2310 and the sealing part 2400, the lifting part 2310 and the sealing part 2400. It functions to alleviate the impact transmitted to the closure and to make the sealing of the sealing part 2400 and the seating part 2200 more robust. As such, as the elastic member 2350 is provided, since the elastic force of the elastic member 2350 is generated in the downward direction of the sealing part 2400, that is, in the upper surface direction of the seating part 2200, the sealing part 2400 of The sealing force of the lower surface and the upper surface of the seating part 2200 may be further improved.

The second UV LED 2360 may be provided in the elevating unit 2310 . The second UV LED 2360 irradiates UV to the inside of the sealing part 2400 by irradiating the UV downward. As the second UV LED 2360 irradiates UV inside the sealing part 2400 , sterilization may be made inside the sealing part 2400 . Therefore, when the object 20 is positioned inside the sealing part 2400 , it is possible to prevent the object 20 from being contaminated.

The processing unit 2500 discharges plasma into the hollow 410 of the sealing unit 2400 constituting the sealed space when the sealing unit 2400 descends and the seating unit 2200 and the sealing unit 2400 are sealed. It functions to perform processing. The processing unit 2500 includes a first electrode 2510 provided on the seating unit 2200 to be electrically connected to the processing target 20 ; and provided in the sealing unit 2400 to surround the processing target 20 . a second electrode 2520 which becomes The first wire 2540 and the second wire 2550 connecting the second electrode 2520 and the power supply unit 2530; may be configured to include.

The first electrode 2510 is provided on the bottom surface 2211 of the hole 2210 of the seating part 2200 . Accordingly, when the gripping device 22 is inserted into the hole 2210 of the seating unit 2200 and seated, the lower surface of the gripping device 22 comes into contact with the first electrode 2510 . All parts to which the holding device 22 and the target object 20 are connected are made of a metal material so that the holding device 22 and the target object 20 are electrically connected to each other. Therefore, when the gripping device 22 is seated on the seating portion 2200 , the seating portion 2200 , that is, the first electrode 2510 , the gripping device 22 , and the object 20 are all electrically connected to each other. do.

As described above, the second electrode 2520 is provided between the inner wall 2420 and the outer wall 2430 of the sealing part 2400 . Accordingly, when the sealing part 2400 and the seating part 2200 form an enclosed space, the second electrode 2520 surrounds the object 20 to be processed.

The first conductor 2540 is disposed inside the seating part 2200 and inside the body 2100 . The second conductor 2550 is disposed inside the upper block 2300 and inside the body 2100 . Accordingly, the first conductive wire 2540 is disposed along the lower portion of the plasma processing apparatus 10 - 4 , and the second conductive wire 2550 is disposed along the upper portion of the plasma processing apparatus 10 - 4 .

Unlike the above, the second conductive wire 2550 may be provided to be disposed on the receiving part 2200 . In this case, the second conductive wire 2550 is disposed inside the seating part 2200 and inside the main body 2100 . In this case, a grounding part (not shown) is connected to an end of the second conductive wire 2550 , and the grounding part is located on the upper surface of the seating part 2200 at a position corresponding to the second electrode 2520 .

As such, when the second conductive wire 2550 is provided in the seating part 2200, when the sealing part 2400 is in an elevated state, the second electrode 2520 and the second conductive wire 2550 are not electrically connected to each other. does not Thereafter, when the sealing part 2400 descends and the second electrode 2520 and the ground part come into contact with each other, the second electrode 2520 is electrically connected to the second conductive wire 2550 , so that the power supply part 2530 and the second The electrode 2520 is electrically connected. That is, when the second electrode 2520 of the sealing part 2400 and the grounding part of the seating part 2200 contact the object 20 to be sealed from the external environment, the second electrode 2520 is connected to the power supply part 2530. is electrically connected to

The inner wall 2420 of the sealing part 2400 may be formed of a dielectric barrier layer. When the sealing part 2400 and the seating part 2200 come into contact with each other and sealed to form an enclosed space, the power supply unit 2530 applies power to the first electrode 2510 and the second electrode 2520 . Accordingly, plasma is generated in the hollow 410 of the sealing portion 2400 constituting the sealed space, that is, the inside of the dielectric barrier. When plasma is generated in the closed space, the surface of the object 20 is modified from hydrophobicity to hydrophilicity, whereby plasma surface treatment is performed.

The sealing part 2400 may be formed of a tubular member, as shown in FIG. 9B or FIG. 10B, but the present invention is not limited thereto. 11(a) or 11(b), the sealing part 2400 may be formed in a shape in which the upper part of the tubular member is connected. In this case, in the sealing part 2400 , the second electrode 2520 may be connected to the upper region, and the inner wall 2420 of the upper region may also be formed of a dielectric barrier layer.

The exhaust part 2600 functions to exhaust the air inside the sealed part 2400 from the external environment, and an exhaust port 2610 provided in the seating part 2200; and an exhaust flow path communicating with the exhaust port 2610 (2620); And, an exhaust pump 2630 communicating with the exhaust passage 2620 to generate suction force; and a pump valve 2640 for blocking communication between the exhaust pump 2630 and the exhaust passage 2620; A venting valve 2650 provided on the exhaust passage 2620; and a filter 2660 for filtering foreign substances in the exhaust passage; and a pressure sensor 2670 for measuring the pressure of the exhaust passage 2620; Including; can be configured.

The exhaust port 2610 is provided in the hole 2210 in the seating part 2200 . Therefore, when the sealing part 2400 forms the sealed space, the air inside the sealing part 2400 may be easily exhausted through the exhaust port 2610 .

The exhaust passage 2620 is a path for communicating the exhaust port 2610 and the exhaust pump 2630 . The exhaust pump 2630 is provided on the exhaust passage 2620 to exhaust the air inside the sealing part 2400 by operation.

The pump valve 2640 is provided on the exhaust passage 2620 to communicate the exhaust pump 2630 and the exhaust passage 2620 when opened, and block communication between the exhaust pump 2630 and the exhaust passage 2620 when closed. . Therefore, when the exhaust pump 2630 is operated in a state where the pump valve 2640 is opened, the air inside the sealing part 2400 is exhausted, and even if the exhaust pump 2630 is operated, when the pump valve 2640 is closed, The air inside the sealing part 2400 is not exhausted. The pump valve 2640 may be a solenoid valve whose opening and closing are controlled by a controller (not shown).

The venting valve 2650 is operably provided on the exhaust passage 2620 to open and close. When the venting valve 2650 is opened, the exhaust passage 2620 is opened to exhaust the air inside the sealing part 2400 . When the venting valve 2650 is closed, the exhaust passage 2620 is closed so that the air inside the sealing part 2400 is not exhausted.

The venting valve 2650 exhausts the inside of the sealing part 2400 and blocks the exhaust flow path 2620 during plasma processing, thereby stopping the exhaust of the air inside the sealing part 2400 and venting.

The pressure sensor 2670 functions to measure the pressure of the sealing part 2400 or the exhaust passage 2620 . Accordingly, the controller may exhaust the interior of the sealing unit 2400 up to a preset pressure value using the pressure sensor 2670 and the exhaust pump 2630 .

The above-described exhaust unit 2600 exhausts the air inside the sealing unit 2400 when the processing unit 2500 generates plasma inside the sealing unit 2400 to perform plasma processing, whereby plasma processing is performed in a vacuum state. function to make it happen.

The above-described plasma processing apparatus 10-4 of the present invention has the following effects. Since the sealing part 2400 and the seating part 2200 are moved relative to each other to form an enclosed space, plasma processing can be performed in an enclosed space with an external environment. When the plasma treatment is performed while the inside of the sealing unit 2400 is exhausted by the exhaust unit 2600 , foreign substances such as hydrocarbons from the surface of the object 20 are effectively removed, and the object 20 is ) the hydrophilicity of the surface can be improved.

After performing the plasma treatment simultaneously with the exhaust by the exhaust unit 2600, if the inside of the sealing unit 2400 is vented through the venting valve 2650, the ozone (O3) concentration inside the sealing unit 2400 increases. Thus, it is possible to achieve a high sterilization effect on the surface of the object 20 to be treated. After the plasma treatment is completely completed, when the sealing unit 2400 is evacuated again, foreign materials generated during plasma treatment are removed, thereby preventing redeposition of foreign materials on the surface of the object 20 .

Through the magnet 2220 and the hole 2210, the holding device 22 and the target object 20 may be firmly seated. Since the sealing part 2400 and the second electrode 2520 are made of a transparent material, when the plasma surface treatment is performed on the object 20, the plasma surface treatment process can be checked with the naked eye.

14 is a diagram showing another embodiment of the processing unit of the plasma processing apparatus of the present invention.

Referring to FIG. 14 , the plasma processing apparatus may perform plasma processing on the object 20 having no electrical conductivity. The object to be treated 20 may be a non-conductor such as a bone graft material. The object 20 to be processed may be accommodated in the plasma processing apparatus while being accommodated in the container 200 .

In the plasma processing apparatus according to the above-described embodiments, a plasma discharge can be effectively generated by using the object 20 having electrical conductivity as a high voltage unit. However, as in the present embodiment, when the object 20 is made of an insulator, it may be difficult to create a sufficient voltage environment for generating plasma discharge because the object 20 cannot be used as a high voltage unit.

To this end, the processing unit 140 of the plasma processing apparatus according to the present embodiment further includes the upper electrode 147 on the accommodating unit 110 , thereby creating a voltage environment sufficient to generate a plasma discharge. The upper electrode 147 may be electrically connected to the second electrode 143 , and a voltage level equal to that of the second electrode 143 may be applied.

In this case, the side portion 201 of the container 200 may be formed of a dielectric barrier layer, whereas the upper portion 202 of the container 200 may be formed of a gas-permeable material to create an internal exhaust environment. In addition, the container 200 is made of an electrically conductive material so that the lower portion 203 is electrically connected to the first electrode 142 , or has an electric terminal in contact with the first electrode 142 in the lower portion 203 . You may.

15 is a view sequentially illustrating a plasma processing method according to an embodiment of the present invention, and FIG. 16 is an internal pressure in a predetermined space over time while performing the plasma processing method according to an embodiment of the present invention. It is a graph, and FIG. 17 is a graph of internal pressure in a certain space over time while performing a plasma processing method according to another embodiment.

First, referring to FIGS. 15 and 16 , the plasma processing method according to an embodiment of the present invention includes a preparation step before plasma processing ( S100 ). Here, the preparation step ( S100 ) may be a step of confirming whether an environment composition for plasma discharge is made before applying a voltage for plasma processing.

Specifically, in the plasma processing method, it is determined whether the object to be processed 20 is accommodated in the accommodating unit 110 (S110). Here, the to-be-processed object 20 may be accommodated in the accommodating part 110 as the to-be-processed object 20 itself, or may be accommodated using the container 200 in which the to-be-processed object 20 is accommodated. Hereinafter, for convenience of explanation, a case in which the object 20 is accommodated in the container 200 and accommodated in the container 110 will be mainly described.

The plasma processing apparatus 10 may detect that the container 200 is accommodated using the sensor unit 180 and provide it to the control unit 160 . However, the present invention is not limited thereto, and when the container 200 is accommodated in the receiving unit 110, the plasma processing apparatus 10 is electrically connected to the first electrode unit 142 through an electrical signal generated, It can be determined whether the container 200 is accommodated.

Then, in the plasma processing method, when it is determined that the container 200 is accommodated in the accommodating part 110 , the air inside the container 200 is exhausted ( S120 ). In this case, in the plasma treatment method, after fluid communication with the inside of the vessel 200 using the exhaust flow path generating unit 131 or the contact member 142 (refer to FIG. 7A ) as described above, the exhaust pump 135 is operated to exhaust the air. can start

Thereafter, the plasma processing method determines whether the internal pressure of the vessel 200 has reached a preset reference pressure P _B ( S130 ). The reference pressure P _B is a pressure lower than atmospheric pressure, and is preset in the control unit 160 as a pressure at which plasma discharge occurs well during plasma surface treatment.

At this time, in the plasma processing method, after a preset reference time has elapsed, if the internal pressure of the container 200 is greater than the reference pressure P _B , it is determined that a packaging defect of the container 200 has occurred (S140), and the operation is performed After stopping, you can notify the outside. The reference time is a time taken for the inside of the normally packaged container 200 to be exhausted to the reference pressure P _B , and is preset in the control unit 160 . The reference time may be set by measuring the time it takes for the inside of the container 200 to be exhausted to the reference pressure P _B through the test, and the reference time may be t ₁ of FIG. 16 .

After the reference time has elapsed, the control unit 160 determines that the packaging defect of the container 200 has occurred if the pressure measured by the pressure gauge is higher than the reference pressure P _B and does not reach the reference pressure P _B . do. This is because, when the packaging of the container 200 is defective, the external air flows into the interior of the container 200, so that the internal pressure of the container 200 is higher than the reference pressure ( _PB ) even if the reference time elapses.

As such, when a packaging defect of the container 200 occurs, the control unit 160 does not perform the processing step S200 and subsequent steps.

In the failure determination step ( S140 ), if it is determined that the packaging of the container 200 is defective, a process of sounding a warning sound may be performed. Accordingly, the user may remove the defective packaging container 200 from the receiving unit 110 through a warning sound, so that unnecessary plasma surface treatment may not be performed.

Then, in the plasma treatment method, when the internal pressure of the vessel 200 reaches a preset reference pressure (P _B ), the plasma is generated and stopped in the vessel 200 repeatedly to treat the surface of the object 20 . to perform (S200).

The control unit 160 controls 'On' and 'Off' of the power supply unit 141 for applying power to the first electrode unit 142 and the second electrode unit 143 to control the power supply unit for a preset generation time Ta. Plasma is generated by turning 'On', and the power unit is turned 'Off' for a preset generation stop time (Tb) to stop plasma generation.

The active time (Ta) is a time during which plasma generation is continued, and is preset in the control unit 160 . The generation stop time (Tb) is a time for continuing to stop the generation of plasma, and is preset in the control unit 160 . As such, in the processing step ( S200 ), by repeatedly performing generation and stopping of plasma generation, the surface treatment of the object to be treated 20 by plasma discharge is performed.

When plasma discharge is generated in the vessel 200 , hydrocarbons on the surface of the object 20 are removed by the plasma and surface treatment is performed in which the carbon content of the object 20 is lowered. When hydrocarbons are removed from the object IM to lower the carbon content of the object 20 , the hydrophilicity of the surface of the object 20 is increased.

In the treatment step (S200), when plasma is discharged in the form of a kind of pulse (PULSE) by repeating generation and stopping of plasma generation, compared with plasma surface treatment in which only plasma generation is continued, the target object ( 20), the effect of increasing the hydrophilicity on the surface and the effect of removing hydrocarbons is further increased. That is, the surface treatment efficiency of the target object 20 is increased.

This is, when only the existing plasma generation is continued, stabilization is made in the plasma discharge state inside the vessel 200 when the plasma discharge time is continued, and thereby, the removal of hydrocarbons from the surface of the object 20 is difficult. not much will be done. That is, as the plasma treatment time increases, the efficiency of the plasma surface treatment decreases.

However, if plasma generation and generation stop are repeatedly performed in the form of a pulse, plasma generation is stopped before stabilization in the above-described plasma discharge state is achieved, and then plasma is generated again. Therefore, it is possible to prevent the efficiency of plasma surface treatment from being lowered by stabilization in the plasma discharge state.

In addition, the discharge of plasma is generated in a random region inside the vessel 200. When the generation and interruption of plasma generation in the form of a pulse are repeated, the plasma is generated in more regions than the existing plasma generation only continues. Since the generation possibility is increased and plasma discharge is made in a wider area, the efficiency of plasma surface treatment can be increased.

In the processing step S200 , the generation time Ta and the generation stop time Tb preferably satisfy the relationship 'generation time (Ta) > generation stop time (Tb)'. This is to increase the time for surface treatment by plasma discharge by making the generation time Ta longer than the generation stop time Tb. As an example, it is preferable that the production time (Ta) is 4 seconds, and the production stop time (Tb) is 2 seconds.

The processing step S200 is a section from t1 to t3 in FIG. 16 .

In the processing step (S200), since generation and stopping of plasma generation are repeated, plasma is generated during the generation time Ta in the section from t1 to t3, and plasma generation is stopped during the generation stop time Tb.

The processing step ( S200 ) may include a first processing step of continuously evacuating the inside of the container 200 , that is, the accommodating part 110 , and a second processing step of closing the inside of the accommodating part.

The processing step (S200) may overlap with the second exhaust step (S210).

In other words, the plasma treatment method is a second exhaust step of continuously evacuating the interior of the vessel 200 so that the internal pressure of the vessel 200 maintains the reference pressure P _B while the plasma is repeatedly generated and stopped. is performed

While plasma generation and interruption are repeatedly performed, the control unit 160 continuously exhausts the interior of the vessel 200 through the exhaust pump so that the internal pressure can maintain the reference pressure P _B . As such, as the exhaust inside the container 200 is continuously made in the process of surface treatment by plasma, hydrocarbons removed by plasma from the surface of the object 20 to be treated are combined with the internal air of the container 200. Since it is exhausted together, the inside of the container 200 can be maintained in a clean state. Accordingly, since there is no foreign material inside the container 200 , the surface treatment of the object 20 to be treated can be performed more effectively.

In the second exhaust step (S210), since the inside of the container 200 is continuously exhausted, the pressure in the section from t1 to t2 continues to maintain the reference pressure ( _PB ).

When the second exhaust step (S210) in which the plasma surface treatment and exhaust are performed at the same time is completed, the closing step (S220) is performed. In the closing step (S60), when the predetermined exhaust time (t2 - t1) has elapsed, the exhaust of the inside of the container 200 is stopped, and the valve provided on the exhaust path communicating with the inside of the container 200 is closed. The process of closing the container 200 is performed. The exhaust time (t2 - t1) is a time during which the exhaust inside the container 200 in the second exhaust step S210 is continued, and is preset in the control unit 400 . The control unit 160 stops the operation of the exhaust pump to stop exhausting the internal air of the container 200 through the exhaust path. Also, the controller 160 closes the valve to close the exhaust path itself.

As the exhaust path is closed, the inside of the container 200 is in a closed state with the outside. In the closing step ( S220 ), the inside of the vessel 200 is in a closed state with the outside while the plasma generation and stopping are repeatedly performed. Therefore, even in the closing step (S220), the plasma surface treatment of the object 20 is performed.

As described above, when the plasma surface treatment is performed with the inside of the container 200 closed from the outside, ozone (O ₃ ) generated in the plasma surface treatment process is not exhausted and the concentration of ozone (O ₃ ) is maintained. or rise. As such, as the concentration of ozone (O ₃ ) in the container 200 increases, the sterilization of the target object 20 is effectively performed.

In addition, when the inside of the container 200 is in a closed state with the outside, even if the exhaust path is closed by the valve, a leak occurs and the internal pressure of the container 200 rises slightly. As described above, in the closing step (S60), since the internal pressure of the container 200 is increased by the leak, the pressure in the section from t2 to t3 is slightly increased from the reference pressure ( _PB ) to P1. As above, when the plasma surface treatment is performed by closing the valve, the closing step (S220) is completed.

After the closing step (S220) is completed, the third exhaust step (S300) is performed.

In the third exhaust step (S300), when the preset closing time (t3 - t2) has elapsed, the plasma generation and generation stop are both stopped to stop the surface treatment of the object IM, and the valve is opened to open the container. The process of releasing the closing of 200 and evacuating the inside of the container 200 again to the reference pressure P _B through the exhaust unit 130 is performed (S310).

The closing time (t3 - t2) is a time during which the closing step S220 of performing plasma surface treatment by closing the valve 350 continues, and is preset in the control unit 160 . When the closing time (t3 - t2) has elapsed, the control unit 160 turns off the power unit 141 of the processing unit 140 to completely stop the plasma generation.

Thereafter, the control unit 160 opens the valve to open the exhaust path to release the closing of the container 200 , and operates the exhaust pump to exhaust the interior of the container 200 again. _In this case, the interior of the container 200 is exhausted to the reference pressure (PB). As described above, when only the air inside the container 200 is exhausted without plasma surface treatment in the third exhaust step (S300), impurities such as hydrocarbons generated by plasma surface treatment are exhausted, and the impurities are removed from the target object 20 redeposition can be prevented. In addition, it is possible to achieve the improvement of the re-closing preservation of the inside of the container (200).

In the third exhaust step (S300), since the inside of the container 200 is exhausted again, the pressure is lowered to the reference pressure PB in the section from t3 to t4, and then the reference pressure PB is continuously maintained. As described above, after the third exhaust step (S300) is completed, the exhaust passage generating unit 131 or the contact member 142 (refer to FIG. 7A ) may be removed to release communication between the exhaust passage and the container 200. .

As described above, when the exhaust flow path generating unit 131 or the contact member 142 (refer to FIG. 7A ) is pulled out of the container 200 , the lower portion of the container 200 is elastically restored by the exhaust flow path generating unit 131 or The hole created by the contact member 142 (see Fig. 7A) is closed to maintain the seal. As described above, when the exhaust flow path generating unit 131 or the contact member 142 (refer to FIG. 7A ) is separated from the container 200 and the communication between the interior of the container 200 and the exhaust path is released, the accommodating part removes the object to be treated. By removing it, the plasma treatment method is completed.

On the other hand, after the processing step (S200), it may further include the step of injecting external air into the interior of the receiving unit (110). In this case, outside air may be injected through the exhaust path of the exhaust unit 130 .

The plasma surface treatment method according to an embodiment of the present invention described above has the following effects. After lowering the internal pressure of the container 200 to a reference pressure lower than atmospheric pressure ( _PB ), plasma surface treatment is performed, so that foreign substances such as hydrocarbons on the surface of the object 20 to be treated are more effectively removed, The hydrophilicity of the surface of the water 20 is improved.

By repeating generation and stopping of plasma generation, that is, performing plasma discharge in a pulse form, plasma can be generated in a wider area, and the efficiency of removing hydrocarbons by plasma can be further increased.

By stopping the exhaust of the internal air of the vessel 200 and performing plasma surface treatment while the vessel 200 is closed from the outside, the ozone (O ₃ ) concentration inside the vessel 200 is increased, and through this, A high sterilization effect of the surface of the treated material 20 can be achieved.

After stopping the plasma surface treatment, by evacuating the inside of the vessel 200 again, foreign substances generated during plasma surface treatment are removed, preventing the foreign substances from being redeposited on the object 20 to be treated, and at the same time, the vessel ( By evacuating the internal pressure of 200) to a reference pressure ( _PB ) lower than atmospheric pressure, it is possible to improve the sealing and preservation of the container (200). Accordingly, the sterilization effect of the object IM sterilized by ozone (O ₃ ) is maintained.

In the above-described plasma surface treatment method according to the first embodiment of the present invention, plasma surface treatment may be performed by generating and discharging only plasma without repeating generation and stopping of plasma generation in the treatment step S200 . That is, it is possible to generate plasma by continuously turning on the power supply unit 141, not in the form of a pulse, so that plasma discharge can be performed.

After the surface treatment by the continuous plasma discharge is performed in the treatment step (S200) and the second exhaust step (S210), in the closing step (S220), the plasma discharge in the form of a pulse, that is, the generation and interruption of plasma generation is repeated. Plasma surface treatment may also be performed.

As another embodiment, in the treatment step (S200) and the second exhaust step (S210), the plasma discharge in the form of a pulse, that is, the generation and interruption of plasma generation is repeatedly performed to perform the surface treatment of the plasma, and then the closing step (S220) Surface treatment by continuous plasma discharge may be performed in the

In other words, in the plasma surface treatment method according to the first embodiment of the present invention, in at least one of the treatment step (S200), the second exhaust step (S210) and the closing step (S220), the plasma is generated and generated. It is possible to perform the surface treatment of the target object 20 by repeatedly performing the interruption.

On the other hand, referring to FIG. 17 , the plasma processing method according to another embodiment of the present invention is compared with the plasma processing method according to the above-described embodiment, after the closing step ( S220 ′), the second exhaust step ( S230 ′) and There is only a difference in that the third exhaust step (S300') is sequentially performed, and since the remaining components are the same, the overlapping description will be omitted.

In the closing step (S220'), while the generation and stopping of plasma generation is repeatedly performed, the exhaust of the interior of the vessel 200 is stopped, and the valve provided on the exhaust path communicating with the interior of the vessel 200 is closed. The process of closing the container 200 is performed.

The control unit 160 stops the operation of the exhaust pump to stop exhausting the internal air of the container 200 through the exhaust path. Also, the controller 160 closes the valve to close the exhaust path itself. As the exhaust path is closed, the inside of the container 200 is in a closed state with the outside.

In the closing step (S220'), the inside of the vessel 200 is in a closed state with the outside while plasma generation and interruption are repeatedly performed. Accordingly, the plasma surface treatment of the object 20 is also performed in the closing step (S220'). As above, when the plasma surface treatment is performed with the inside of the container 200 closed from the outside, ozone (O ₃ ) generated in the plasma surface treatment process is not exhausted and the concentration of ozone (O ₃ ) is maintained. or rise. As such, as the concentration of ozone (O ₃ ) in the container 200 increases, the sterilization of the target object 20 is effectively performed.

In addition, when the inside of the container 200 is in a closed state with the outside, even if the exhaust path is closed by the valve, a leak occurs and the internal pressure of the container 200 rises slightly. As described above, in the closing step (S220'), since the internal pressure of the container 200 is increased by the leak, the pressure in the section from t'1 to _t'2 slightly rises from the reference pressure (PB ) to P1. will do As described above, when the plasma surface treatment is performed by closing the valve, the closing step (S220') is completed.

When the closing step (S220') is completed, the second exhaust step (S230') is performed.

In the second exhaust step (S230'), after the closing step (S220'), when a preset closing time (t'2 - t'1) has elapsed, the valve is opened to release the closing of the container 200, and the container The process of evacuating the interior of the container 200 again so that the internal pressure of 200 reaches the reference pressure ( _PB ) is performed.

The closing time (t'2 - t'1) is a time during which the closing step (S220') of performing plasma surface treatment by closing the valve is continued, and is preset in the control unit 160 . In the second exhaust step (S230'), plasma generation and interruption are repeatedly performed. Accordingly, the plasma surface treatment of the object 20 is also performed in the second exhaust step (S230').

While the plasma generation and interruption are repeatedly performed, the control unit 160 exhausts the interior of the vessel 200 again through the exhaust pump so that the internal pressure reaches the reference pressure P _B . As such, as the exhaust inside the container 200 is continuously made in the process of surface treatment by plasma, hydrocarbons removed by plasma from the surface of the object 20 to be treated are combined with the internal air of the container 200. Since it is exhausted together, the inside of the container 200 can be maintained in a clean state. Accordingly, since there is no foreign material inside the container 200 , the surface treatment of the object 20 to be treated can be performed more effectively.

In the second exhaust step (S230'), since the inside of the container 200 is exhausted again, in the section from t'2 to t'3, the pressure is lowered from P1 to the reference pressure P _B , and the reference pressure P _B ) is still maintained.

After the second exhaust step (S230') is completed, the third exhaust step (S300') is performed.

In the third exhaust step (S300'), after the second exhaust step (S230'), when the preset exhaust time (t'3 - t'2) has elapsed, the plasma generation and generation stop are both stopped and the object to be treated The process of continuously evacuating the inside of the container 200 is performed so that the surface treatment of ( 20 ) is stopped, and the internal pressure of the container ( 200 ) maintains the reference pressure ( P _B ).

The exhaust time (t'3 - t'2) is a time during which the exhaust inside the container 200 is continued in the second exhaust step (S230'), and is preset in the control unit 160 . When the exhaust time (t'3 - t'2) has elapsed, the control unit 160 turns off the power unit 141 of the processing unit 140 to completely stop the plasma generation.

Thereafter, the operation of the exhaust pump is continuously maintained to continuously exhaust the interior of the container 200 . _In this case, the inside of the container 200 is to maintain the reference pressure (PB). As described above, when only the air inside the container 200 is exhausted without plasma surface treatment in the third exhaust step (S300'), impurities such as hydrocarbons generated by plasma surface treatment are exhausted, and the impurities are removed from the target object ( IM) can be prevented from being redeposited. In addition, it is possible to achieve the improvement of the re-closing preservation of the inside of the container (200).

In the third exhaust step (S300'), since the inside of the container 200 is continuously exhausted, the pressure in the section from t'3 to t'4 continuously maintains the reference pressure P _B .

The plasma surface treatment method according to another embodiment of the present invention has the following effects in addition to the effects of one embodiment of the present invention. After performing the closing step (S220') in the plasma surface treatment process, since the second exhaust step (S230') and the third exhaust step (S300') are performed, ozone (O ₃ ) in the initial stage of plasma surface treatment is high The concentration is guaranteed, so that a high sterilization effect of the surface of the object 20 to be treated inside the container 200 can be expected.

In addition, after the sterilization treatment by ozone (O ₃ ) in the closing step (S220'), it is subjected to an exhaust process to remove hydrocarbons, so that redeposition of hydrocarbons can also be effectively achieved. In the above-described plasma surface treatment method according to another embodiment of the present invention, plasma surface treatment may be performed by generating and discharging only plasma without repeating generation and stopping of plasma generation in the treatment step ( S200 ′). That is, it is possible to generate plasma by continuously turning on the power supply unit 141, not in the form of a pulse, so that plasma discharge can be performed.

After the surface treatment by the continuous plasma discharge is performed in the treatment step (S200') and the closing step (S220'), in the second exhaust step (S230'), the plasma discharge in the form of a pulse, that is, the generation and generation of plasma is stopped. It is also possible to repeatedly perform plasma surface treatment.

As another embodiment, in the treatment step (S200') and the closing step (S220'), the plasma discharge in the form of a pulse, that is, the generation and stop of the plasma is repeatedly performed after performing the surface treatment of the plasma, the second exhaust step ( In S230'), surface treatment by continuous plasma discharge may be performed. In other words, in the plasma surface treatment method according to another embodiment of the present invention, in at least one of the processing step (S220'), the closing step (S220') and the second exhaust step (S230'), the plasma is generated and The surface treatment of the object to be treated 20 may be performed by repeatedly stopping the production.

As such, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

10: plasma processing device
100: housing
110: receiving part
130: exhaust part
140: processing unit
160: control unit
180: sensor unit

Claims (11)

a first member;
a second member separated from the first member and accommodating the object to be treated;
a driving unit for moving the first member or the second member so that the first member and the second member are coupled to form an enclosed space therein;
an elastic member disposed between the first member and the second member to be coupled;
an exhaust unit for exhausting air inside the closed space; and
a control unit configured to control the exhaust unit so that the internal pressure of the enclosed space becomes a reference pressure, and to apply power to an electrode provided in at least one of the first member and the second member to form an electric field in the closed space; include
The control unit is
Controlling the exhaust unit so that the internal pressure of the sealed space becomes the reference pressure from the initial pressure to increase the sealing property of the sealed space by the elastic member,
After the internal pressure of the enclosed space reaches the reference pressure, power is applied to the electrode to control the exhaust unit so that the internal pressure of the enclosed space is maintained at the reference pressure while the electric field is formed in the enclosed space, ,
After stopping the application of the power to the enclosed space, the electric field is formed in the enclosed space to control the exhaust unit to discharge impurities removed from the surface of the object to be processed,
Plasma processing device. delete delete delete According to claim 1,
The control unit is
After discharging the impurities from the closed space, venting the closed space,
Plasma processing device. 6. The method of claim 5,
The exhaust portion further includes an exhaust passage communicating with the sealed space,
The control unit exhausts and vents the sealed space through the exhaust passage,
plasma processing device According to claim 1,
The control unit is
After controlling the exhaust unit for a preset reference time so that the internal pressure of the enclosed space becomes the reference pressure from the initial pressure, the operation is stopped when the internal pressure of the enclosed space is greater than the reference pressure,
Plasma processing device. According to claim 1,
The exhaust unit further includes a pump that allows the internal pressure of the sealed space to become a low pressure equal to or higher than a specific pressure even if the sealed space is exhausted for a certain period of time or longer.
Plasma processing device. delete According to claim 1,
The electrode is
An exhaust hole for exhausting the internal air of the sealed space is formed,
Plasma processing device. According to claim 1,
the electrode is
A first electrode disposed under the second member and a second electrode disposed on an outer circumferential surface of the second member,
The first electrode is formed with an exhaust hole for exhausting the internal air of the sealed space,
Plasma processing device.

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