KR20230041643A - Plasma processing apparatus and method using the same - Google Patents

Abstract

One embodiment of the present invention provides a plasma processing device comprising: a sealing part wherein the inside is sealed against an external environment; a pressure adjusting part that exhausts an air inside of the sealing part to form the air, which is at a low pressure state, of a preset process pressure range inside of the sealing part; a processing part that discharges the air, which is in the low pressure state, by forming an electric field inside of the sealing part; and a control part that controls the pressure adjusting part to adjust an internal pressure of the sealing part. Therefore, the present invention enables efficiency of hydrocarbon removal by plasma to be further increased.

Description

Plasma processing apparatus and method using the same {Plasma processing apparatus and method using the same}

The present invention relates to a plasma processing device and a method using the same, and more particularly, to a plasma processing device for imparting characteristics according to plasma processing to an object to be processed and a method using the same.

Plasma treatment is used for various purposes in various industries such as semiconductor, display, agriculture and medical industries.

In the field of agriculture, plasma treatment is applicable for sterilization and promotion of germination of seeds using non-thermal plasma. This plasma treatment can have a sterilization effect of microorganisms present on the surface of the sprout by directly treating the surface of the seed with non-thermal plasma, and shortens the time required for germination by accelerating the germination rate and speed of sprout seed, which is required for production in agriculture. It has the effect of shortening the processing period and providing safer food.

In addition, with the recent development of the medical industry, plasma treatment is used in various ways, and is used to increase biocompatibility in implantation of biomaterials such as implants. In particular, in dental treatment, a treatment for implanting an artificial tooth (generally referred to as an implant) to replace a tooth after tooth extraction due to tooth decay or other reasons is used.

Implants used as artificial teeth are made of materials that are not rejected by the human body, and treatment is performed to restore functions as well as beauty to parts without bones and gums. In this treatment, a fixture corresponding to the implant is planted in the alveolar bone from which the tooth has been extracted, and is fixed to restore the function of the tooth.

Here, a primary procedure of placing the fixture into the alveolar bone and a secondary procedure of fixing a crown, which is the final prosthesis after waiting for 3 months or more for the fixture to osseointegrate into the alveolar bone, are included. Currently, commonly used fixtures are mainly made of titanium metal or titanium alloy. This material takes a long time to osseointegrate when implanted into the human body and creates an oxide film, so stability can be secured compared to metals of other materials. There is a need for securing more improved human body stability.

In order to compensate for these disadvantages, technologies capable of enhancing osseointegration by appropriately treating the surface of titanium and titanium alloy materials have been developed and applied.

The rate and quality of osseointegration are closely related to the surface properties and chemical composition of implants, such as surface composition, surface roughness, and hydrophilicity. In particular, it is known that an implant having a highly hydrophilic surface is advantageous for interaction with biological solutions, cells, and tissues. In the production stage of the implant, hydrophilicity may be secured through a plasma surface treatment process. However, due to the formation of an oxide film during production, transportation, distribution, and storage, hydrophilicity changes over time to hydrophobicity, and accordingly, it is difficult to secure existing biocompatibility.

Therefore, in order to solve the problem of conventional change over time, a technique for securing biocompatibility through surface treatment of a fixture before an implant procedure with simple equipment is being developed. Techniques that can improve hydrophilicity and osseointegration efficiency by irradiating plasma surface treatment and ultraviolet rays are representative. However, in the case of medical devices that are inserted into the human body, such as implants, sterility assurance is required, but sterility assurance is not possible because the aseptic packaging of the fixture is removed from plasma surface treatment or UV irradiation, and the process is performed externally, and the object to be treated may be contaminated. There are possible problems.

Therefore, in the case of ultraviolet irradiation, the above problem is solved by using a quartz tube capable of securing the permeability of ultraviolet rays as a case and positioning and processing the object to be treated therein, but in terms of cost in using an expensive quartz tube In addition, there is a problem that inconvenient management is required to prevent breakage, and since the treatment object located inside the quartz tube is isolated from the heat flow side, heat cannot escape by UV treatment and there is a problem due to thermal damage.

In the case of the conventional plasma treatment, there is a problem in that aseptic packaging is removed for surface treatment of the fixture and aseptic guarantee is difficult for fastening with a specific electrode connection part.

In addition, the conventional method of processing by generating plasma in an atmospheric pressure environment has a problem in that plasma processing performance is not constant, and high energy is transmitted locally, resulting in damage to the object to be treated and deterioration in the performance of the fixture.

The conventional plasma treatment method has a problem in that plasma generation and surface treatment are not spatially uniform because surface treatment is performed at atmospheric pressure. In order to improve this, there has been a method of supplying a gas such as helium or argon to the space for plasma surface treatment for the purpose of improving spatial uniformity of plasma surface treatment. However, this method has a limitation in that the gas must be continuously supplied, and there is a problem in that the sterility of the supplied gas must be secured.

Even if sterility is guaranteed in the process of surface treatment of implants, the deposition of organic substances such as hydrocarbons (CHx) in the air causes changes over time to become hydrophobic, which makes it difficult to maintain biocompatibility obtained through surface treatment. there is. Therefore, there is a problem that the surface treatment technology cannot be applied in the production stage, and even if the surface is treated before the implant procedure, there is a relatively short storage process or a problem in that the maintenance performance of the biocompatibility obtained from the surface treatment is deteriorated during this process.

A technical problem to be achieved by the present invention is to provide a plasma processing device and a method using the same for imparting characteristics according to plasma processing of a material to be treated such as a bio material.

One embodiment of the present invention, an airtight sealing portion sealed against the external environment, a pressure adjusting unit for exhausting the air inside the sealing portion to form a low-pressure atmosphere in a pre-set process pressure range inside the sealing portion, the Provided is a plasma processing apparatus including a processing unit that generates an electric field inside the sealing unit to discharge the low-pressure air, and a control unit that controls the pressure adjusting unit to adjust the internal pressure of the sealing unit.

In one embodiment of the present invention, the pressure adjusting unit includes a pump for exhausting the air inside the sealing unit and a valve for opening and closing a flow path connecting the sealing unit and the pump, and the control unit operates the pump. Alternatively, the internal pressure of the sealing portion may be adjusted by controlling the opening and closing of the valve.

In one embodiment of the present invention, the sealing unit includes a separated upper member and a lower member, and the upper member and the lower member are moved relative to each other to seal the inside of the sealing unit.

In one embodiment of the present invention, the lower member may include a hole corresponding to the shape of a container in which an object to be treated is stored, and the processing unit may include an electrode provided on a wall member of the hole.

In one embodiment of the present invention, the inside of the sealing portion is made of a plasma-resistant material or a plasma-resistant coating layer may be formed.

In one embodiment of the present invention, at least a portion of the sealing portion is made of a transparent material, and the low-pressure air discharged inside the sealing portion can be visually confirmed from the outside.

In one embodiment of the present invention, the transparent material may be a glass material.

In one embodiment of the present invention, at least a portion of the electrode may be exposed to the inside of the sealing part.

In one embodiment of the present invention, the electrode, at least a part of which is exposed to the inside of the sealing part, is a processing target stored in the sealing unit, a gripping device holding the processing target, or a container containing the processing target. It can be electrically connected to a part of

In one embodiment of the present invention, the sealing part is a magnet for fixing and seating a part of the object to be treated stored in the sealing part, a gripping device for holding the object to be treated, or a container in which the object to be treated is stored. can include more.

In one embodiment of the present invention, the control unit may control the pressure adjusting unit so that the inside of the sealing unit is sealed against the external environment, the internal pressure of the sealing unit.

In one embodiment of the present invention, the sealing part may include an elastic member that is deformed so that the inside of the sealing part is sealed against the external environment using a pressure difference between the inside and outside of the sealing part.

In one embodiment of the present invention, the control unit controls the pump to keep the internal pressure of the sealing unit constant within the preset process pressure range, so that the pressure of the low-pressure state of the atmosphere is kept constant. The inside of the part can be discharged.

In one embodiment of the present invention, the control unit, by continuously operating the pump to maintain a constant internal pressure of the sealing portion and discharge in the interior of the sealing portion in which the atmospheric pressure of the low pressure state is maintained constant can be there is.

In one embodiment of the present invention, the control unit can open and close the valve to keep the internal pressure of the sealing unit constant and discharge the inside of the sealing unit in which the atmospheric pressure in the low pressure state is kept constant.

In one embodiment of the present invention, a venting unit for injecting external air into the sealing unit is further included, and the control unit opens and closes a flow path connecting the pump or the venting unit and the sealing unit to pressure the inside of the sealing unit. It can be maintained constant and discharged inside the sealing part where the pressure of the low-pressure state of the atmosphere is kept constant.

In one embodiment of the present invention, the control unit controls the pressure adjusting unit to vary the internal pressure of the sealing unit within the preset process pressure range, so that in the interior of the sealing unit where the atmospheric pressure in the low pressure state is varied. can discharge

In one embodiment of the present invention, the control unit can open and close the valve to vary the internal pressure of the sealing unit and discharge the inside of the sealing unit where the atmospheric pressure in the low pressure state is varied.

In one embodiment of the present invention, a venting unit for injecting external air into the sealing unit is further included, and the control unit opens and closes a flow path connecting the pump or the venting unit and the sealing unit to pressure the inside of the sealing unit. and can be discharged inside the sealing part where the atmospheric pressure in the low pressure state is varied.

In one embodiment of the present invention, the control unit may further include a sensor for measuring the internal pressure of the sealing unit.

In one embodiment of the present invention, the control unit may control the pressure adjusting unit based on a preset time.

In one embodiment of the present invention, the processing unit can discharge the low-pressure atmosphere by forming the electric field during the process time when the internal pressure of the sealing part is within the preset process pressure range with AC power. there is.

In one embodiment of the present invention, the control unit may discharge the air in the low voltage state by maintaining the AC power source ON during the process time.

In one embodiment of the present invention, the control unit may discharge the air in the low voltage state by repeatedly turning ON and OFF of the AC power during the process time.

In one embodiment of the present invention, the control unit may control the pump to remove foreign substances generated by discharging the low-pressure air inside the sealing unit from the inside of the sealing unit.

In one embodiment of the present invention, the pressure adjusting unit may further include a filter provided in a flow path connecting the sealing unit and the pump.

In one embodiment of the present invention, the pressure adjusting unit may include a venting unit exposed to the outside atmosphere, and the control unit may vent the sealing unit by opening a passage connecting the sealing unit and the venting unit.

In one embodiment of the present invention, the pressure adjusting unit may further include a filter for filtering external air in the passage connecting the sealing part and the venting part.

In one embodiment of the present invention, an object to be treated is accommodated inside the sealing portion and the surface is treated, and the object to be treated may be an implant fixture, a bone graft material, or a dental implant.

Plasma processing apparatus and method using the same according to embodiments of the present invention reduce the internal pressure of the container to a reference pressure lower than atmospheric pressure, and then perform plasma surface treatment, thereby more effectively removing foreign substances such as hydrocarbons from the surface of the object to be treated. As a result, the hydrophilicity of the surface of the object to be treated is improved.

In addition, the plasma processing apparatus and method using the same according to the embodiments of the present invention can generate plasma in a wider area by repeating the generation and interruption of plasma generation, that is, by performing plasma discharge in the form of a pulse. It is possible to further increase the efficiency of hydrocarbon removal by.

In addition, the plasma processing apparatus and method using the same according to embodiments of the present invention stop exhausting air inside the container and perform plasma surface treatment while closing the container from the outside, thereby increasing the ozone concentration inside the container and increasing the concentration of ozone inside the container. , Through this, it is possible to achieve a high sterilization effect on the surface of the object to be treated.

In addition, the plasma processing apparatus and method using the same according to embodiments of the present invention remove foreign substances generated during the plasma surface treatment by evacuating the inside of the container again after stopping the plasma surface treatment, so that the foreign substances are removed from the object to be treated. It is possible to improve the airtight preservation of the container by preventing redeposition on the surface and simultaneously exhausting the internal pressure of the container to a reference pressure lower than the atmospheric pressure. Therefore, the sterilization effect of the surface of the object to be treated sterilized by ozone is maintained.

In addition, the plasma processing apparatus and method using the same according to embodiments of the present invention increase the effect of sterilizing the surface of the object to be treated by ozone by closing the vessel to the outside during plasma surface treatment, By exhausting foreign substances, redeposition of foreign substances on the object to be treated can be prevented.

1 is a schematic block diagram of a plasma processing apparatus according to the present invention.
FIG. 2 is a conceptual diagram for explaining the concept of the plasma processing apparatus of FIG. 1 .
FIG. 3 is a conceptual diagram illustrating a certain space in which exhaust is performed in the plasma processing apparatus of FIG. 2 .
4 is a conceptual diagram schematically illustrating a plasma processing apparatus according to a first embodiment of the present invention.
5 is a conceptual diagram for explaining a plasma processing apparatus according to a second embodiment of the present invention.
FIG. 6 is an exemplary diagram illustrating an embodiment of the plasma processing apparatus of FIG. 5 .
7A and 7B are conceptual diagrams for explaining a plasma processing apparatus according to a third embodiment of the present invention.
8A is a perspective view of a plasma processing apparatus according to a fourth embodiment of the present invention, and FIG. 8B is a cross-sectional view of FIG. 8A.
FIG. 9A is a perspective view illustrating a state in which a holding device holding an object to be treated is seated in a receiving portion of the plasma processing device of FIG. 8A , and FIG. 9B is a cross-sectional view of FIG. 9A .
FIG. 10A is a perspective view showing a state in which the space setting unit descends to seal the object from the external environment in the state of FIG. 9A, and FIG. 10B is a cross-sectional view of FIG. 10A.
11 is an exemplary view showing a sealing part of another embodiment.
FIG. 12 is a perspective view illustrating the inside of the plasma processing apparatus of FIG. 8A.
13 is a perspective view illustrating a state in which a chamber of the plasma processing apparatus is opened.
14 is a diagram showing another embodiment of the processing unit of the plasma processing apparatus of the present invention.
15 is a diagram sequentially illustrating a plasma processing method according to an embodiment of the present invention.
16 is a graph of internal pressure in a certain space over time during a plasma treatment method according to an embodiment of the present invention.
17 is a graph of internal pressure in a certain space over time while performing a plasma treatment method according to another embodiment.

Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are given the same reference numerals, and redundant description thereof will be omitted.

Since the technical idea of the present invention can be made with various changes and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the technical spirit of the present invention to specific embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the scope of the technical spirit of the present invention.

In describing the technical idea of the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, numbers (eg, first, second, etc.) used in the description process of this specification are only identifiers for distinguishing one component from another component.

In addition, in this specification, when one component is referred to as “connected” or “connected” to another component, the one component may be directly connected or directly connected to the other component, but in particular Unless otherwise described, it should be understood that they may be connected or connected via another component in the middle.

In addition, terms such as "~ unit", "~ group", "~ character", and "~ module" described in this specification mean a unit that processes at least one function or operation, which includes a processor, a micro Processor (Micro Processor), Micro Controller, CPU (Central Processing Unit), GPU (Graphics Processing Unit), APU (Accelerate Processor Unit), DSP (Drive Signal Processor), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), etc., or a combination of hardware and software, or may be implemented in a form combined with a memory storing data necessary for processing at least one function or operation. .

In addition, it is intended to make it clear that the classification of components in this specification is merely a classification for each main function in charge of each component. That is, two or more components to be described below may be combined into one component, or one component may be divided into two or more for each more subdivided function. In addition, each component to be described below may additionally perform some or all of the functions of other components in addition to its main function, and some of the main functions of each component may be performed by other components. Of course, it may be dedicated and performed by .

1 is a block diagram schematically illustrating a plasma processing apparatus 10 according to the present invention, FIG. 2 is a conceptual diagram illustrating the concept of the plasma processing apparatus 10 of FIG. 1, and FIG. 3 is a plasma processing apparatus 10 of FIG. 2 It is a conceptual diagram for explaining a certain space (S1) in which exhaust is made in the treatment device 10.

Referring to FIGS. 1 to 3 , the plasma processing apparatus 10 according to the present invention includes a receiving part 110 , an exhaust part 130 and a processing part 140 . In addition, the plasma processing apparatus 10 according to an embodiment of the present invention may further include a control unit 160 and a sensor unit 180.

The plasma processing apparatus 10 according to the present invention accommodates the object to be treated 20 and creates a low-pressure environment for plasma discharge in a certain space S1 accommodating the object 20 to be treated 20. ) characterized in that the surface of the plasma treatment.

Here, the object to be treated 20 may be any object that can be sterilized through plasma treatment, and for example, a biomaterial such as an implant fixture or a bone graft material may be a target. In addition, the object to be treated 20 may be made of a conductive material or may be made of a non-conductive material.

The accommodating unit 110 performs a function of accommodating the object to be processed 20 . At this time, the object to be processed 20 may be accommodated in the accommodating unit 110 by itself or may be accommodated in a state of being stored in a container.

As an example, the accommodating part 110 may include a bottom member 111 fixing the object 20 to the plasma processing apparatus 10 . A binding unit (not shown) may be provided on the bottom member 111 to fix the object to be processed 20 after being accommodated in the plasma processing apparatus 10 .

As another embodiment, the accommodating part 110 may further include a wall member 113 surrounding the target object 20 . The wall member 113 together with the floor member 111 may form a certain space S1 accommodating the object to be processed 20, and the electrode of the processing unit 140 to be described later is disposed to generate an environment for plasma. It can perform the function of creating.

In FIG. 2, the wall member 113 is shown as surrounding a part of the target object 20, but this is briefly shown for convenience of description, and the wall member 113 is treated together with the bottom member 111. Of course, it may be configured in a form surrounding the entire area of the water (20).

On the other hand, the receiving part 110 is formed in a shape corresponding to the shape of the container 200 in order to fix the container 200 accommodating the object to be processed 20, and a replaceable fixing jig (not shown) is further provided. can include Through this, the accommodating part 110 may fix the containers 200 of various shapes through one accommodating part 110 .

The exhaust unit 130 is connected to the accommodating unit 110 and serves to exhaust air in a certain space S1 surrounding the object 20 . Here, the predetermined space S1 is a space where plasma is formed, and may be a space that seals the object 20 from the external environment.

As an example, as shown in (b) of FIG. 3 , the predetermined space S1 may be formed by the container 200 accommodating the object 20 to be treated. As another embodiment, as shown in (c) of FIG. 3, the predetermined space (S1) is a space formed by the accommodating part 110, specifically, the floor member 111 and the wall member 113 of the accommodating part 110. can be

The exhaust unit 130 may include a pump for exhausting air in the predetermined space S1, and is configured to be connected to the predetermined space S1 so as to be fluidly communicated with the predetermined space S1. can do. For example, as shown in (b) of FIG. 3 , when a certain space S1 is formed by the container 200 , the exhaust unit 130 may have a configuration capable of being inserted into the container 200 . More specific details of each embodiment will be described later.

The exhaust unit 130 exhausts air in the predetermined space S1 to lower the pressure in the predetermined space S1 to a pressure level at which plasma can be formed. In addition, the exhaust unit 130 is in fluid communication with the predetermined space S1, so that it may inject air for venting the inside of the predetermined space S1 after the plasma treatment is completed.

The processing unit 140 performs a function of forming an electric field to generate plasma in a certain space S1 from which air is exhausted. The plasma processing apparatus 10 according to an embodiment of the present invention may generate plasma in a certain space S1 through dielectric barrier discharge (DBD).

The dielectric barrier may be formed by including the dielectric part 145 in the plasma processing apparatus 10, but is not necessarily limited thereto. The dielectric barrier may be formed by including at least a portion of the container 200 accommodating the object 20 as a dielectric material. For example, the container 200 may have a side portion 201 disposed adjacent to the second electrode 143 in a state accommodated in the accommodating portion 110 and made of a dielectric material.

To enable the plasma processing device 10 to generate a high voltage across a dielectric barrier, the processing unit 140 includes a first electrode unit 142 disposed on one side of the housing unit 110 and the housing unit 110. A second electrode unit 143 disposed on the other side may be included. In addition, the processing unit 140 may include a power supply unit 141 that applies voltage to the first electrode unit 142 and the second electrode unit 143 . The processing unit 140 may form plasma in a certain space S1 by a voltage difference between the first electrode unit 142 and the second electrode unit 143 .

As an example, the first electrode unit 142 may be electrically connected to the object to be processed 20 . Here, the object to be processed 20 functions as a medium generating a high voltage by being electrically connected to the first electrode unit 142 . The first electrode unit 142 is provided on the bottom member 111 of the accommodating unit 110, and can be electrically connected by contact when the processing target 20 is accommodated in the accommodating unit 110 (Fig. 3(b)).

At this time, when the object to be processed 20 is housed in the container 200, one side of the container 200 is provided with an electrical connector 240 electrically connected to the object to be treated 20, and the electrical connector 240 By contacting the first electrode unit 142 , the object to be processed 20 may be electrically connected to the first electrode unit 142 .

Alternatively, the first electrode unit 142 has a structure that can be inserted into the container 200 accommodating the object to be processed 20 at one side of the accommodating portion 110, and can be electrically connected to the object to be treated 20. . In other words, when the object to be processed 20 is accommodated in the container 200, the first electrode unit 142 may be inserted into the container 200 and directly connected to the object 20 to be treated, or It may be electrically connected by contacting the water 20 and the fixed member 22 (see FIG. 7A).

The second electrode unit 143 is disposed on the other side of the accommodating unit 110 and may be provided on the wall member 113 to be disposed adjacent to the object 20 to be treated. The second electrode unit 143 is a ground electrode to which voltage is not applied, and may maintain a ground (0 V). The second electrode part 143 is a ground electrode corresponding to the high voltage part that is applied to the object to be treated 20 accommodated in the accommodating part 110, and interacts with the high voltage applied to the object to be treated 20. to perform the function of forming an electromagnetic field.

The control unit 160 performs a function of controlling elements of the plasma processing apparatus 10 . The control unit 160 may control the operation of the exhaust unit 130 and the processing unit 140 based on whether or not the accommodation unit 110 accommodates the object to be processed. A method of plasma processing the object 20 by controlling the operation of the exhaust unit 130 and the processing unit 140 in the control unit 160 will be described later.

The sensor unit 180 performs a function of detecting environmental information required to perform the operation of the exhaust unit 130 or the processing unit 140 in the control unit 160 .

As an example, the sensor unit 180 may include a storage detection sensor (not shown) that detects whether or not the processing target 20 is accommodated in the storage unit 110 . For example, the storage detection sensor (not shown) stores the object to be processed 20 or the container 200 in which the object to be treated 20 is stored in the receiving unit 110, and the QR code of the container, Information on the type of the container 200, the type of the object to be processed 20, whether it is genuine, whether the container 200 is stored correctly, etc. is obtained through barcode or proximity communication connection (RFID, NFC), and this is obtained by the control unit 160 ) can be provided.

The sensor unit 180 may further include a pressure gauge (not shown) for measuring the internal pressure of the predetermined space S1. A pressure gauge (not shown) may provide the measured pressure value of the predetermined space S1 to the control unit 160 .

Hereinafter, various embodiments of the plasma processing apparatus 10 of the present invention will be described in more detail with reference to the drawings. Since the concept of the plasma processing apparatus 10 has been described above, duplicate descriptions will be omitted for convenience of description.

4 is a conceptual diagram schematically illustrating the plasma processing apparatus 10-1 according to the first embodiment of the present invention.

Referring to FIG. 4 , the plasma processing apparatus 10-1 according to the first embodiment of the present invention accommodates the container 200 in which the object to be treated 20 is stored, so that the object to be treated 20 is exposed to the external environment. Plasma surface treatment can be performed in a state where it is not exposed to.

The receiving part 110 according to the first embodiment of the present invention has a structure surrounding at least a part of the container 200, and the container 200 can be fixed by fitting the lower end of the container 200.

As another embodiment, the accommodating portion 110 is provided with an elastic locking member (not shown), so that when the user mounts the container 200 while applying force, the container 200 is accompanied by a 'click' sound. ) can be fixed in the device. In this case, the container 200 may be accommodated in the accommodating part 110 and electrically connected to the first electrode part 142 by being in contact therewith. In addition, when the user presses the mounted container 200 again, the fixed coupling in the accommodating part 110 is released, and the container 200 may be pushed up to the upper part of the accommodating part 110 and protrude.

The exhaust unit 130 may exhaust air inside the container 200 . The exhaust unit 130 exhausts air in the predetermined space S1 through the exhaust flow path generating unit 131 and the exhaust flow path 1312 for generating an exhaust flow path 1312 communicating with the predetermined space S1 in the container. It may include a pump 135 that does.

The exhaust passage generating unit 131 may further include a communication means 1311 for generating a path by piercing one surface of the container 200 . The communication means 1311 is formed in a needle shape including a front end and can be effectively inserted into one surface of the container 200 .

The communication means 1311 may be made of a hollow tube, and a through hole is formed adjacent to the front end, so that air in a certain space S1 is blown in a state in which the front end including the through hole is inserted into the container 200. can exhaust Alternatively, the communication means 1311 may also function as a passage through which air is injected for venting the inside of the container 200 after the plasma treatment is completed through the above structure.

In this case, the exhaust unit 130 may further include a driving means 132 for moving the communication means 1311 so that the communication means 1311 can be inserted into or removed from the container 200 . After the container 200 is mounted in the housing 110, the driving means 132 moves the communication means 1311 toward the container 200 so that air is blown on one side of the container 200 in order to perform plasma treatment. Distribution channels can be created.

The communication unit 1311 may return to its original position by the driving unit 132 after the plasma treatment is completed and vented. At this time, the container 200 may be made of an elastic material capable of reversing the path penetrated by the communication means 1311 when the communication means 1311 is separated.

The exhaust unit 130 may further include an exhaust valve 133 disposed in the exhaust passage 1312 and controlling opening and closing of the exhaust passage 1312 by a control signal. The exhaust valve 133 controls the opening and closing of the exhaust passage 1312 to adjust the internal pressure in the container 200 . The exhaust valve 133 is controlled to be closed when the vessel 200 is stuck or when an error occurs in the plasma processing operation, thereby preventing damage to the vessel 200 or the object to be treated 20 .

In addition, the exhaust 130 may include a pump valve 134 adjacent to the pump 135 . The pump valve 134 is opened when the air inside the container 200 is exhausted, and may be closed when the inside of the container 200 is vented.

The exhaust unit 130 is disposed on a path communicating with the filter unit 137, the filter unit 137, and the exhaust passage generating unit 131 on the path through which external air flows in to vent the inside of the container 200. , It may include a filter valve 136 disposed adjacent to the filter means 137.

Here, the filter means 137 performs a function of filtering or purifying pollutants contained in the external air. For example, the filter means 137 may include a HEPA filter (High Efficiency Particulate Air filter). .

The filter valve 136 may operate to be closed when the air inside the container 200 is exhausted and opened when the inside of the container 200 is vented.

The processing unit 140 performs a function of forming an electric field to generate plasma in a certain space S1 from which air is exhausted.

To enable the plasma processing device 10 to generate a high voltage across a dielectric barrier, the processing unit 140 includes a first electrode unit 142 disposed on one side of the housing unit 110 and the housing unit 110. A second electrode unit 143 disposed on the other side may be included. In addition, the processing unit 140 may include a power supply unit 141 that applies voltage to the first electrode unit 142 and the second electrode unit 143 . The processing unit 140 may form plasma in a certain space S1 by a voltage difference between the first electrode unit 142 and the second electrode unit 143 .

In this embodiment, the dielectric barrier may be provided on the side 201 of the container 200, and may be an inner or outer cylinder of the container 200.

FIG. 5 is a conceptual diagram for explaining a plasma processing device 10-2 according to a second embodiment of the present invention, and FIG. 6 is an exemplary diagram illustrating an embodiment of the plasma processing device 10-2 of FIG. 5 am.

The plasma processing apparatus 10-2 according to the second embodiment is different from the plasma processing apparatus 10-1 according to the first embodiment in terms of functionality, except for the number of accommodating units and exhaust passage generators. Since they are the same, overlapping descriptions will be omitted.

5 and 6, the accommodating part 110 according to the second embodiment of the present invention includes a first accommodating part 110-1 accommodating a first object to be treated, and accommodating a second object to be treated. It may include a second accommodating portion 110-2. In the drawings, for convenience of description, a case in which the plasma processing apparatus 10-2 includes two accommodating units 110-1 and 110-2 is illustrated as an example, but the present invention is not limited thereto and accommodates more than this. Of course, it is possible to have more wealth.

As in the first embodiment, the plurality of accommodating parts 110-1 and 110-2 are provided with an elastic locking member (not shown), and when the user mounts the container while applying force, a 'click' sound is heard. The container may be secured within the device. In this case, the container may be accommodated in the plurality of accommodating parts 110-1 and 110-2 and electrically connected to generate an electrical signal.

The control unit (not shown) receives the electrical signal and determines where the container is accommodated among the plurality of accommodating units 110-1 and 110-2, and then controls the operation of the exhaust unit 130 and the processing unit 140. Thus, plasma treatment may be performed on the container accommodated therein.

Meanwhile, in the drawing, the first accommodating part 110-1 and the second accommodating part 110-2 are provided with a 2-1 electrode part 143-1 and a 2-2 electrode part 143-2, , a first dielectric portion 145-1 disposed adjacent to the 2-1 electrode portion 143-1 and a second disposed adjacent to the 2-2 electrode portion 143-2 to form a dielectric barrier. It is shown as including two dielectric parts 145-2.

In this case, the outer surfaces of the first container 200-1 including the first object to be treated and the second container 200-2 including the second object to be treated may not include a dielectric material. If the outer surfaces of the first container 200-1 and the second container 200-2 are made of a dielectric material, the first accommodating part 110-1 and the second accommodating part 110-2 The first dielectric part 145-1 and the second dielectric part 145-2 may be omitted.

The exhaust unit 130 includes a first exhaust flow path generating unit 131-1 for generating a first exhaust flow path communicating with the first container 200-1 and a first exhaust flow path communicating with the second container 200-2. It may include a second exhaust passage generating unit 131-2 for generating two exhaust passages. The first exhaust passage generating unit 131-1 and the second exhaust passage generating unit 131-2 may include a communication means as in the first embodiment.

The exhaust unit 130 includes a first driving means 132-1 and a first driving means 132-1 for inserting or removing the above communication means into each of the first container 200-1 and the second container 200-2. Two driving means 132-2 may be included. The first driving means 132-1 and the second driving means 132-2 may be provided individually, but the present invention is not limited thereto and is provided as one driving means to independently drive a plurality of communication means. may be

The exhaust unit 130 may include a pump 135 for exhausting air inside the plurality of containers 200-1 and 200-2 and a pump valve 134 adjacent to the pump 135. At this time, in the second embodiment, air inside the plurality of containers 200-1 and 200-2 fluidly communicated may be exhausted using one pump 135.

To this end, the exhaust unit 130 includes a first exhaust valve 133-1 disposed on the first exhaust flow path and a second exhaust valve 133-2 disposed on the second exhaust flow path, and a controller ( The air inside the plurality of containers 200-1 and 200-2 can be independently exhausted by individually controlling the first exhaust valve 133-1 and the second exhaust valve 133-2 by (not shown). there is.

In addition, the exhaust unit 130 has one filter means 137 in a path through which external air is introduced to vent the inside of the container 200. A filter valve 136 disposed adjacent to the filter unit 137 while being disposed on a path communicating with the filter unit 137 and the exhaust passage generating unit 131 may be included.

The processing unit 140 includes a 1-1 electrode unit (not shown) and a 2-1 electrode unit (not shown) for forming an electric field inside the first container 200-1 accommodated in the first accommodating unit 110-1. 143-1) and a first power supply unit 141-1, and a first processing unit for forming an electric field inside the second container 200-2 accommodated in the second accommodating unit 110-2. It includes a second processing unit including a -2 electrode unit (not shown), a 2-2 electrode unit 143-2, and a second power supply unit 141-2.

The first power supply unit 141-1 and the second power supply unit 141-2 are composed of a single unit, and a switch is provided in a power line for supplying power to each container 200-1 and 200-2 to operate simultaneously or individually. It can be configured to make this possible.

Here, the plasma processing apparatus 10-2 includes a first housing 100-1 and a pump 135 for constituting an independent plasma processing module by disposing the plurality of accommodating parts 110-1 and 110-2 therein. and a second housing 100-2 for disposing the filter means 137 therein, and a connecting member 100-3 connecting the first housing 100-1 and the second housing 100-2 can include

The first housing 100-1 includes a body member 101 for arranging components such as a plurality of accommodating parts 110-1 and 110-2 therein.

As another embodiment, the first housing 100-1 may further include a cover member 102 disposed above the body member 101 to open and close the plurality of accommodating parts 110-1 and 110-2. . The cover member 102 opens and closes the upper portions of the first accommodating portion 110-1 and the second accommodating portion 110-2, thereby opening and closing the first accommodating portion 110-1 and the second accommodating portion 110-2. After the container is accommodated in, it can perform a function of preventing the container from escaping. In addition, the outer surface of the cover member 102 may include a display unit 190 displaying the operating state of the device.

The connecting member 100-3 may be made of a material having elasticity or flexibility, or may be made of a structure in which a plurality of unit components are connected, so that the first housing 100-1 and the second housing 100-2 are connected. It is possible to change the location and length, and it may be easy to modify the arrangement structure. However, this is only one embodiment, and the plasma processing apparatus 10 - 2 may have a single housing to configure an external appearance, of course.

7A and 7B are conceptual diagrams for explaining a plasma processing apparatus 10-3 according to a third embodiment of the present invention.

Referring to FIGS. 7A and 7B , the plasma processing apparatus 10-3 according to the third embodiment includes an exhaust unit for generating plasma and an electric field applied to the container 200 in which the object to be treated 20 is accommodated. It is characterized in that the means consists of one component.

At this time, the container 200 in which the object to be treated 20 is accommodated may include a fixing member 21 for fixing the object to be treated 20 in contact with the object to be treated 20 .

As an embodiment, the container 200 may be an ampoule for accommodating the object to be treated 20 and the fixing member 21, and the fixing member 21 is coupled to the lower portion 203 of the container to ) can be fixed in the container 200.

At least a part of the container 200 may be made of a dielectric material to form a dielectric barrier. For example, when the container 200 is accommodated in the accommodating part 110, the side part 201 disposed adjacent to the second electrode 143 may be formed of a dielectric material. Alternatively, the container 200 may include a side portion 201 and an upper portion 202 of a single cover member, and the cover member may be made of a dielectric material.

In addition, the container 200 is formed of an elastic material at a portion through which the contact member 142 penetrates, so that the inside of the container 200 is sealed to maintain a vacuum state even when the contact member 142 penetrates the container 200 . To this end, at least one region of the lower part 203 of the container 200 may be made of styrene-based ABS material, a silicon material having a hardness of 10, or a mixture thereof.

The fixing member 21 may be made of a material having electrical conductivity. The fixing member 21 may contact the contact member 142 inserted from the outside to the inside of the container 200 .

The plasma processing apparatus 10-3 according to the third embodiment includes a receiving part 110 accommodating a container 200 in which an object to be treated 20 is accommodated, and a contact member electrically connected to the object 20 to be treated. 142 and a power supply unit 141 for applying power for generating plasma to the target object 20 through the contact member 142 .

Here, the contact member 142 may be formed in a needle shape including a front end 1421 capable of penetrating one surface of the container 200 and may be made of an electrically conductive material. At this time, the contact member 142 functions as an electrode of the plasma processing device and at the same time functions as a communication means for forming an exhaust flow path inside the container 200 . To this end, the contact member 142 may have a hollow tubular shape, and a through hole 1422 may be formed at the front end 1421 .

7B is for explaining the case when the contact member 142 is inserted into the container 200. Referring to FIG. 7B, the contact member 142 is inserted into the container 200 by the movable member 148. As a result, the side portion may be electrically connected to the object to be processed 20 . More specifically, the contact member 142 may be electrically connected by being inserted into the insertion groove of the fixing means 21 electrically connected to the object to be processed 20 and contacting the inner protrusion of the fixing means 21 at its side. .

The through hole 1422 of the contact member 142 is farther from the object to be processed 20 than the electrical contact between the contact member 142 and the object to be treated 20 in order to exhaust the air inside the container 200. can be formed in As an example, the through hole 1422 may be formed at a position closer to the plasma processing device 10 - 3 than a line or surface where the side of the contact member 142 and the fixing means 21 come into contact. Through this, the exhaust through the through hole 1422 strengthens the binding to the line or surface where the side of the contact member 142 and the fixing means 21 touch, and solves the problem that all the air inside the container 200 is not exhausted. there is.

Meanwhile, as another embodiment, the plasma processing apparatus 10-3 does not move the contact member 142 from the outside of the container 200 to the inside when the container 200 is accommodated, but one side of the receiving part 110. The contact member 142 can be fixedly arranged. In this case, the contact member 142 may be inserted into the container 200 and brought into contact with the fixing means 21 by the pressure applied while the container 200 is accommodated in the receiving part 110. there is.

8A is a perspective view of a plasma processing device 10-4 according to a fourth embodiment of the present invention, FIG. 8B is a cross-sectional view of FIG. 8A, and FIG. 9A is a receiving portion of the plasma processing device 10-4 of FIG. 8A. It is a perspective view showing a state in which the gripping device holding the object to be processed is seated, and FIG. 9B is a cross-sectional view of FIG. 8A. FIG. 10A is a perspective view showing a state in which the space setting unit descends in the state of FIG. 9A to seal the object from the external environment, FIG. 10B is a cross-sectional view of FIG. 10A, and FIG. 11 is an example showing a sealing unit of another embodiment. FIG. 12 is a perspective view illustrating the inside of the plasma processing apparatus of FIG. 8A, and FIG. 13 is a perspective view illustrating a state in which a chamber of the plasma processing apparatus is opened.

Referring to FIGS. 8A to 13 , the plasma processing apparatus 10-4 according to the fourth embodiment moves relative to a seating portion 2200 on which an object to be treated 20 is seated, and the seating portion 2200 is moved. A sealing part 2400 that seals the processing object 20 from the external environment, a processing part 2500 that discharges plasma into the sealed part 2400 sealed from the external environment, and a sealing part 2400 that is sealed from the external environment An exhaust unit 2600 for exhausting internal air, an upper block 2300 disposed above the seating unit 2200, and an elevating unit provided inside the upper block 2300 and connected to the sealing unit 2400 ( 2310), a motor 2340 that raises and lowers the elevating unit 2310 so that the sealing unit 2400 moves up and down, and an elastic member 2350 provided between the elevating unit 2310 and the sealing unit 2400, A magnet 2220 provided on the seating part 2200, a chamber 2110 provided on the upper part of the main body 2100, a first UV LED 2130 for irradiating UV inside the chamber 2110, and a chamber It may include a chamber door 2120 that opens and closes the inside of the chamber 2110 and a second UV LED 2360 that irradiates UV into the sealing part 2400.

The surface of the object to be treated 20 is modified from hydrophobic to hydrophilic by the plasma surface treatment of the plasma treatment apparatus 10-4. The object to be treated 20 may be a dental implant used in dentistry. The object to be treated 20 can be taken out by the holding device 22 from the packaging material in which the object to be treated 20 is sealed.

The holding device 22 grips the object 20 to take out the object 20 from the packaging material, and then is seated on the seating portion 2200 while holding the object 20 . Accordingly, the object to be processed 20 may be seated on the seating portion 2200 by the gripping device 22 .

The main body 2100 is located behind the seating portion 2200 and the upper block 2300 .

Inside the main body 2100, a power supply unit 2530, an exhaust pump 2630, and a filter 2660 are provided. A chamber 2110 is provided above the main body 2100 . The holding device 22 holding the object 20 may be accommodated in the chamber 2110 .

The inside of the chamber 2110 is provided with a first UV LED 2130 for irradiating UV into the inside of the chamber 2110 . The first UV Led 2130 can sterilize the object to be treated 20 and the holding device 22 by irradiating UV light to the holding device 22 holding the object 20 .

The user can prevent the object to be treated 20 from being contaminated by taking out the object 20 from the packaging material using the gripping device 22 inside the chamber 2110 .

The chamber 2110 may include a chamber door 2120 that opens and closes the inside of the chamber 2110 .

The seating part 2200 is disposed in front of the main body 2100 . The seating part 2200 is disposed under the upper block 2300 . A hole 2210 into which the lower portion of the gripping device 22 is inserted is provided on the upper surface of the seating portion 2200 . The lower portion of the gripping device 22 is seated while being fixed to the seating portion 2200 by being inserted into the hole 2210 . In this case, the lower surface of the gripping device 22 comes into contact with the bottom surface 2211 of the hole 2210.

A magnet 2220 is provided on the seating portion 2200 . The magnet 2220 may be provided on the bottom surface 2211 of the hole 210 .

The bottom surface of the gripping device 22 may be provided with a metal material, or the bottom surface itself may be made of a metal material. Accordingly, when the gripping device 22 is inserted into the hole 2210 , the bottom surface of the gripping device 22 may be coupled to the bottom surface 2211 of the hole 2210 by the magnet 2220 . As described above, the gripping device 22 and the object to be processed 20 may be firmly fixed to and seated on the seating portion 2200 by the magnet 2220 .

The sealing part 2400 moves relative to the seating part 2200 to seal the object 20 from the external environment. In the present invention, as an example, the sealing part 2400 is raised and lowered so that the lower part of the sealing part 2400 comes into contact with the upper surface of the seating part 2200, thereby forming a closed space inside the sealing part 2400. . Alternatively, a sealed space may be formed inside the sealing part 2400 by moving the seating part 2200 up and down.

The sealing part 2400 is connected to the elevating part 2310 provided on the upper block 2300 . The sealing part 2400 may have a double wall structure in which a hollow 410 is formed in the center and includes an inner wall 2420 and an outer wall 2430 . When the sealing part 2400 descends and the lower surface of the sealing part 2400 comes into contact with the upper surface of the seating part 2200, the hollow 410 of the sealing part 2400 forms a closed space.

Since the gripping device 22 seated on the seating portion 2200 and the target object 20 gripped by the holding device 22 are positioned inside the hollow 410 of the sealing portion 2400, the sealing portion 2400 ) and the seating portion 2200 are closed, the gripping device 22 and the object to be treated 20 are located in the closed space. Thus, the holding device 22 and the object to be processed 20 are sealed from the external environment. The inner surface of the inner wall 2420 forms the inner surface of the hollow 410, and the outer surface of the outer wall 2430 forms the outer surface of the sealing part 2400.

A second electrode 2520 is disposed between the inner wall 2420 and the outer wall 2430 . The second electrode 2520 may be formed by coating the outer surface of the inner wall 2420 and the inner surface of the outer wall 2430 . A coating layer (not shown) may be formed on an inner surface of the inner wall 2420 . The coating layer may be made of a material that can withstand high temperature and high voltage to prevent damage to the inner surface of the inner wall 2420 or elution of foreign substances due to high temperature and high voltage during plasma discharge. The coating layer has a function of preventing foreign substances from adhering to the object to be treated 20 due to elution of the inner surface of the inner wall 2420 when plasma treatment is performed on the inside of the sealing part 2400 by the processing unit 2500 or elution of foreign substances. do

The coating layer may be made of a material containing calcium. In this way, when the coating layer is made of a material containing calcium, calcium can be adhered to the surface of the object to be treated 20 by inducing elution of calcium by plasma treatment. In this way, by artificially adhering calcium to the surface of the object to be treated 20, when the object to be treated 20 is implanted or engrafted in the human body, the inflammatory reaction is alleviated or the implantation or engraftment becomes firm. The implantation rate or engraftment rate can be guaranteed.

As described above, by including a biocompatible material in the coating layer so that the biocompatible material adheres to the surface of the object to be treated 20 during plasma treatment, the object to be treated 20 can be more safely implanted or engrafted to the human body. there is.

The sealing part 2400 and the second electrode 2520 may be made of a transparent material. The sealing part 2400 may be a tubular tube made of a transparent tempered glass material having an inner wall 2420 and an outer wall 2430 .

The upper block 2300 is disposed in front of the main body 2100 and above the mounting portion 2200 . An elevating unit 2310 is provided inside the upper block 2300 . The elevating unit 2310 is connected to the shaft 2330 by a connecting member 2320. Shaft 2330 is rotatable by motor 2340 . The connecting member 2320 and the elevating unit 2310 can be raised or lowered by rotation of the shaft 2330 .

Accordingly, the shaft 2330 is rotated by driving the motor 2340, and through this, the connecting member 2320 and the elevating unit 2310 are raised or lowered. The sealing part 2400 is connected to the elevating part 2310 . As described above, the sealing unit 2400 also rises or falls according to the rise or fall of the elevating unit 2310 .

As shown in FIGS. 9A and 9B , when the connection member 2320 and the elevating unit 2310 are in an elevated position, the sealing unit 2400 is also in an elevated position, so that most of the area of the sealing unit 2400 is in an elevated position. It is inserted into the upper block 2300 and positioned inside the upper block 2300.

As shown in FIGS. 10A and 10B , when the motor 2340 is driven to rotate the shaft 2330, the connecting member 2320 and the elevating unit 2310 are in a lowered position. In this case, the sealing part 2400 is also lowered so that the lower surface of the sealing part 2400 comes into contact with the upper surface of the seating part 2200, and most of the area of the sealing part 2400 is taken out of the upper block 2300. do.

An elastic member 2350 is provided between the elevating unit 2310 and the sealing unit 2400 . When the elevating portion 2310 and the sealing portion 2400 descend and the lower surface of the sealing portion 2400 comes into contact with the upper surface of the seating portion 2200, the elastic member 2350 moves the elevating portion 2310 and the sealing portion 2400. It serves to mitigate the impact transmitted to the function and to further strengthen the sealing of the sealing part 2400 and the seating part 2200. As such, since the elastic member 2350 is provided, the elastic force of the elastic member 2350 is generated in the downward direction of the sealing part 2400, that is, in the direction of the upper surface of the seating part 2200, so that the sealing part 2400 The sealing force between the lower surface and the upper surface of the mounting portion 2200 can be further improved.

The second UV LED 2360 may be provided in the elevating unit 2310 . The second UV LED 2360 radiates UV into the sealing portion 2400 by downwardly radiating UV. As the second UV LED 2360 irradiates the inside of the sealing part 2400 with UV, the inside of the sealing part 2400 can be sterilized. Therefore, when the object to be treated 20 is located inside the sealing part 2400, it is possible to prevent the object to be treated 20 from being contaminated.

When the sealing part 2400 descends and the seating part 2200 and the sealing part 2400 are sealed, the processing unit 2500 discharges plasma into the hollow 410 of the sealing part 2400 constituting the closed space to form a plasma. function to perform processing. The processing unit 2500 includes a first electrode 2510 provided on the seating portion 2200 to be electrically connected to the processing target 20; and provided in the sealing unit 2400 to surround the processing target 20. a second electrode 2520; and a power supply unit 2530 for applying power to the first electrode 2510 and the second electrode 2520; and a first electrode connecting the first electrode 2510 and the power supply unit 2530. It may include a first conducting wire 2540 and a second conducting wire 2550 connecting the second electrode 2520 and the power supply unit 2530.

The first electrode 2510 is provided on the bottom surface 2211 of the hole 2210 of the seating part 2200 . Accordingly, when the gripping device 22 is inserted into the hole 2210 of the mounting portion 2200 and seated, the lower surface of the gripping device 22 comes into contact with the first electrode 2510 . All parts where the gripping device 22 and the object to be treated 20 are connected are made of metal so that the gripping device 22 and the object 20 are electrically connected to each other. Therefore, when the gripping device 22 is seated on the seating portion 2200, the seating portion 2200, that is, the first electrode 2510, the holding device 22, and the object to be processed 20 are all electrically connected to each other. do.

As described above, the second electrode 2520 is provided between the inner wall 2420 and the outer wall 2430 of the sealing part 2400 . Accordingly, when the sealing part 2400 and the seating part 2200 form a closed space, the second electrode 2520 surrounds the object to be treated 20 .

The first conducting wire 2540 is disposed inside the seating part 2200 and inside the main body 2100 . The second conducting wire 2550 is disposed inside the upper block 2300 and inside the main body 2100 . Accordingly, the first conducting wire 2540 is disposed along the lower portion of the plasma processing apparatus 10-4, and the second conductive wire 2550 is disposed along the upper portion of the plasma processing apparatus 10-4.

Unlike the foregoing, the second conductor 2550 may be provided to be disposed on the seating portion 2200 . In this case, the second conducting wire 2550 is disposed inside the seating part 2200 and the inside of the main body 2100 . In this case, a grounding part (not shown) is connected to an end of the second conducting wire 2550, and the grounding part is located on the upper surface of the seating part 2200 at a position corresponding to the second electrode 2520.

As such, when the second conducting wire 2550 is provided on the seating part 2200 and the sealing part 2400 is in an elevated state, the second electrode 2520 and the second conducting wire 2550 are not electrically connected to each other. don't Then, when the sealing part 2400 descends and the second electrode 2520 comes into contact with the ground part, the second electrode 2520 is electrically connected to the second conducting wire 2550, so that the power supply unit 2530 and the second electrode 2520 are electrically connected to each other. Electrodes 2520 are electrically connected. That is, when the second electrode 2520 of the sealing part 2400 and the grounding part of the seating part 2200 come into contact and the object to be processed 20 is sealed from the external environment, the second electrode 2520 is connected to the power supply unit 2530. is electrically connected with

The inner wall 2420 of the sealing part 2400 may be formed of a dielectric barrier layer. When the sealing part 2400 and the seating part 2200 come into contact with each other to form a sealed space, the power supply unit 2530 applies power to the first electrode 2510 and the second electrode 2520 . Accordingly, plasma is generated in the hollow 410 of the sealing part 2400 constituting the closed space, that is, inside the dielectric barrier. When plasma is generated in the closed space, the surface of the object to be treated 20 is modified from hydrophobic to hydrophilic, thereby performing plasma surface treatment.

The sealing unit 2400 may be made of a tubular member as shown in FIG. 9b or 10b, but the present invention is not limited thereto. As shown in FIG. 11(a) or 11(b) , the sealing part 2400 may be formed in a shape in which an upper portion of a tubular member is connected. In this case, the second electrode 2520 of the sealing portion 2400 may be connected to an upper region, and an inner wall 2420 of the upper region may also be formed of a dielectric barrier layer.

The exhaust unit 2600 functions to exhaust air inside the sealed unit 2400 from the external environment, and includes an exhaust port 2610 provided in the seating unit 2200; and an exhaust passage communicating with the exhaust port 2610. 2620; and, an exhaust pump 2630 that communicates with the exhaust flow path 2620 to generate a suction force; and a pump valve 2640 that blocks communication between the exhaust pump 2630 and the exhaust flow path 2620; and, A venting valve 2650 provided on the exhaust passage 2620; and a filter 2660 for filtering foreign substances in the exhaust passage; and a pressure sensor 2670 for measuring the pressure of the exhaust passage 2620; including can be configured.

The exhaust port 2610 is provided in the hole 2210 of the seating part 2200 . Therefore, when the sealing part 2400 forms a closed space, air inside the sealing part 2400 can be easily exhausted through the exhaust port 2610 .

The exhaust passage 2620 is a path for communicating the exhaust port 2610 and the exhaust pump 2630 . The exhaust pump 2630 is provided on the exhaust passage 2620 and exhausts air inside the sealing part 2400 by operation.

The pump valve 2640 is provided on the exhaust passage 2620 to communicate the exhaust pump 2630 and the exhaust passage 2620 when open, and to block communication between the exhaust pump 2630 and the exhaust passage 2620 when closed. . Therefore, when the exhaust pump 2630 is operated while the pump valve 2640 is open, the air inside the seal 2400 is exhausted, and even when the exhaust pump 2630 is operated, when the pump valve 2640 is closed, The air inside the sealing part 2400 is not exhausted. The pump valve 2640 may be a solenoid valve whose opening and closing are controlled by a controller (not shown).

The venting valve 2650 is provided on the exhaust passage 2620 to open and close. When the venting valve 2650 is opened, the exhaust passage 2620 is opened and the air inside the sealing part 2400 is exhausted. When the venting valve 2650 is closed, the exhaust passage 2620 is closed and air inside the sealing part 2400 is not exhausted.

The venting valve 2650 exhausts the inside of the sealing part 2400 and blocks the exhaust passage 2620 during plasma treatment, thereby stopping the exhausting of the air inside the sealing part 2400 and venting it.

The pressure sensor 2670 functions to measure the pressure of the sealing part 2400 or the exhaust passage 2620 . Accordingly, the control unit may exhaust the inside of the sealing unit 2400 up to a predetermined pressure value by using the pressure sensor 2670 and the exhaust pump 2630 .

The above-described exhaust unit 2600 exhausts air inside the sealing unit 2400 when the processing unit 2500 generates plasma inside the sealing unit 2400 to perform plasma processing, so that plasma processing is performed in a vacuum state. function to make it happen.

The above-described plasma processing apparatus 10-4 of the present invention has the following effects. The sealing part 2400 and the seating part 2200 are moved relative to each other to form a closed space, so that plasma processing can be performed in a space closed to the external environment. When the plasma treatment is performed while the inside of the sealing part 2400 is exhausted by the exhaust part 2600, foreign substances such as hydrocarbons on the surface of the object to be treated 20 are effectively removed, and the object to be treated 20 ) can improve the hydrophilicity of the surface.

After the plasma treatment is performed simultaneously with the exhaust by the exhaust unit 2600, when the inside of the sealing unit 2400 is vented through the venting valve 2650, the concentration of ozone (O3) inside the sealing unit 2400 increases. Thus, a high sterilization effect on the surface of the object to be treated 20 can be achieved. After the plasma treatment is completely completed, when the airtight part 2400 is exhausted again, foreign substances generated during the plasma treatment are removed, thereby preventing foreign substances from being re-deposited on the surface of the object 20 to be treated.

Through the magnet 2220 and the hole 2210, the gripping device 22 and the object to be treated 20 may be firmly seated. Since the sealing part 2400 and the second electrode 2520 are made of a transparent material, when the plasma surface treatment is performed on the object 20, the plasma surface treatment process can be confirmed with the naked eye.

14 is a diagram showing another embodiment of the processing unit of the plasma processing apparatus of the present invention.

Referring to FIG. 14 , the plasma processing apparatus may perform plasma processing even on a non-conductive object 20 . The object to be treated 20 may be an insulator such as a bone graft material. The object to be processed 20 may be accommodated in the plasma processing apparatus while being accommodated in the container 200 .

In the plasma processing apparatus according to the above-described embodiments, a plasma discharge can be effectively generated by using the electrically conductive target object 20 as a high voltage part. However, when the object to be processed 20 is made of a non-conductor as in the present embodiment, it may be difficult to create a sufficient voltage environment for generating a plasma discharge because the object 20 cannot be used as a high voltage part.

For this purpose, the processing unit 140 of the plasma processing apparatus according to the present embodiment may further include an upper electrode 147 above the accommodating unit 110 to create a sufficient voltage environment for generating a plasma discharge. The upper electrode 147 may be electrically connected to the second electrode 143, and a voltage level equal to that of the second electrode 143 may be applied.

At this time, the side portion 201 of the container 200 may be made of a dielectric barrier layer, and on the other hand, the upper portion 202 of the container 200 may be made of a gas permeable material to create an internal exhaust environment. In addition, the container 200 is made of an electrically conductive material so that the lower part 203 is electrically connected to the first electrode 142, or the lower part 203 is provided with an electrical terminal in contact with the first electrode 142. You may.

15 is a diagram sequentially illustrating a plasma processing method according to an embodiment of the present invention, and FIG. 16 is an internal pressure in a certain space over time while performing a plasma processing method according to an embodiment of the present invention. FIG. 17 is a graph of internal pressure in a certain space over time during a plasma treatment method according to another embodiment.

First, referring to FIGS. 15 and 16 , the plasma processing method according to an embodiment of the present invention first includes a preparation step before plasma processing (S100). Here, the preparation step ( S100 ) may be a step of confirming whether an environment for plasma discharge has been created before applying a voltage for plasma treatment.

Specifically, in the plasma processing method, it is determined whether the object to be processed 20 is accommodated in the accommodating unit 110 (S110). Here, the object to be processed 20 may be stored in the accommodating unit 110 by itself or may be stored using the container 200 in which the object 20 is stored. Hereinafter, for convenience of description, a case in which the object to be processed 20 is accommodated in the container 200 and stored in the receiving unit 110 will be mainly described.

The plasma processing apparatus 10 may detect that the container 200 is accommodated using the sensor unit 180 and provide the result to the control unit 160 . However, the present invention is not limited thereto, and when the vessel 200 is accommodated in the accommodating unit 110, the plasma processing apparatus 10 is electrically connected to the first electrode unit 142 through an electrical signal generated, It is possible to determine whether the container 200 is accommodated.

Thereafter, in the plasma processing method, when it is determined that the vessel 200 is accommodated in the accommodating unit 110, air inside the vessel 200 is exhausted (S120). At this time, the plasma processing method fluidly communicates with the inside of the container 200 using the above-described exhaust flow path generator 131 or the contact member 142 (see FIG. 7A), and then operates the exhaust pump 135 to exhaust the gas. can start

Thereafter, the plasma treatment method determines whether the internal pressure of the vessel 200 has reached a predetermined reference pressure (P _B ) (S130). The reference pressure (P _B ) is preset in the control unit 160 as a pressure at which plasma discharge is easily performed during plasma surface treatment at a pressure lower than atmospheric pressure.

At this time, in the plasma processing method, if the internal pressure of the container 200 is greater than the reference pressure P _B after a predetermined reference time has elapsed, it is determined that the packaging defect of the container 200 has occurred (S140), and the operation is performed. After stopping, it can be notified to the outside world. The reference time is the time taken for the inside of the normally packaged container 200 to be exhausted to the reference pressure P _B , and is preset in the controller 160 . The reference time may be set by measuring the time taken for the inside of the container 200 to be exhausted to the reference pressure P _B through the test, and the reference time may be t ₁ in FIG. 16 .

When the pressure measured by the pressure gauge is higher than the reference pressure (P _B ) after the reference time elapses and does not reach the reference pressure (P _B ), the control unit 160 determines that packaging defects in the container 200 have occurred. do. This is because outside air flows into the container 200 when the packaging of the container 200 is defective, so that the internal pressure of the container 200 becomes higher than the reference pressure P _B even after the reference time elapses.

As such, when a packaging defect of the container 200 occurs, the controller 160 does not perform the processing step (S200) and subsequent steps.

In the defective determination step (S140), when it is determined that the packaging of the container 200 is defective, a warning sound may be sounded. Accordingly, the user can remove the defective packaging container 200 from the accommodating unit 110 through a warning sound, thereby avoiding unnecessary plasma surface treatment.

Thereafter, in the plasma treatment method, when the internal pressure of the container 200 reaches the preset reference pressure (P _B ), the surface of the object to be treated 20 is treated by repeatedly generating and stopping the plasma generation in the container 200. is performed (S200).

The control unit 160 controls the 'On' and 'Off' of the power supply unit 141 for applying power to the first electrode unit 142 and the second electrode unit 143 to control the power supply unit for a predetermined generation time (Ta). to 'On' to generate plasma, and to 'Off' the power supply during a predetermined generation stop time (Tb) to stop the generation of plasma.

The formation time Ta is a time period during which plasma generation is continued, and is preset in the control unit 160 . The production stop time Tb is a time period during which plasma production is stopped, and is preset in the control unit 160 . As such, in the processing step (S200), the surface treatment of the object 20 by plasma discharge is performed by repeatedly performing generation and interruption of plasma generation.

When a plasma discharge is generated in the container 200, hydrocarbons on the surface of the object to be treated 20 are removed by the plasma, and the surface treatment in which the carbon content of the object to be treated 20 is lowered is performed. When the carbon content of the material to be treated 20 is lowered by removing hydrocarbons from the material to be treated IM, the hydrophilicity of the surface of the material to be treated 20 is increased.

In the processing step (S200), when the plasma is discharged in a kind of pulse form by repeating the generation and stopping of the plasma, compared to the conventional plasma surface treatment in which only the generation of plasma continues, the object to be treated ( 20), the effect of increasing the hydrophilicity on the surface and the effect of removing hydrocarbons are further enhanced. That is, the surface treatment efficiency of the object to be treated 20 is increased.

This is because, when only the existing plasma generation is continued, if the plasma discharge time continues, stabilization is performed in the plasma discharge state inside the vessel 200, and thus, the removal of hydrocarbons from the surface of the object to be treated 20 is performed. not much gets done. That is, as the plasma treatment time increases, the efficiency of the plasma surface treatment decreases.

However, when plasma is repeatedly generated and stopped in the form of a pulse, plasma is generated again after the plasma generation is stopped before stabilization in the above-described plasma discharge state is achieved. Therefore, it is possible to prevent a decrease in efficiency of plasma surface treatment by stabilization in a plasma discharge state.

In addition, the plasma discharge is generated in a random area inside the container 200. When the plasma is generated and stopped in the form of a pulse, the plasma is generated in a larger area than the existing plasma generation only. Since the possibility of generation is increased and plasma discharge is performed in a wider area, the efficiency of plasma surface treatment can be increased.

In the processing step (S200), it is preferable that the generation time (Ta) and the generation stop time (Tb) satisfy the relation 'creation time (Ta) > generation stop time (Tb)'. This is to increase the time during which the surface treatment is performed by plasma discharge by making the generation time Ta longer than the generation stop time Tb. As an example, preferably, the generation time (Ta) is 4 seconds, and the generation stop time (Tb) is preferably 2 seconds.

The processing step (S200) is a section from t1 to t3 in FIG. 16.

In the process step S200, since the generation and cessation of plasma generation are repeated, plasma is generated during the generation time Ta in the interval from t1 to t3, and the plasma generation is stopped during the generation cessation time Tb.

The processing step (S200) may include a first processing step of continuously exhausting the inside of the container 200, that is, the accommodating part 110, and a second processing step of closing the inside of the accommodating part.

The processing step (S200) may overlap with the second exhausting step (S210).

In other words, the plasma treatment method is a second exhaust step of continuously evacuating the inside of the container 200 so that the internal pressure of the container 200 maintains the reference pressure P _B while the plasma is repeatedly generated and stopped. is performed

While the plasma is repeatedly generated and stopped, the control unit 160 continuously exhausts the inside of the container 200 through an exhaust pump so that the internal pressure can maintain the reference pressure P _B . In this way, as the exhaust inside the container 200 is continuously performed in the process of surface treatment by plasma, the hydrocarbons removed by the plasma from the surface of the object 20 to be treated are mixed with the air inside the container 200. Since it is exhausted together, the inside of the container 200 can be maintained in a clean state. Therefore, the surface of the object to be treated 20 can be treated more effectively without foreign matter inside the container 200 .

In the second exhaust step (S210), since the inside of the vessel 200 is continuously exhausted, the pressure in the section from t1 to t2 is continuously maintained at the reference pressure (P _B ).

When the second exhausting step (S210), in which plasma surface treatment and exhausting are performed simultaneously, is completed, a closing step (S220) is performed. In the closing step (S60), when the predetermined exhaust time (t2 - t1) elapses, the exhaust of the inside of the container 200 is stopped, and the valve provided on the exhaust path communicating with the inside of the container 200 is closed A process of closing the container 200 is performed. The evacuation time (t2 - t1) is the duration of the evacuation of the inside of the container 200 in the second evacuation step (S210), and is preset in the control unit 400. The control unit 160 stops the operation of the exhaust pump to stop exhausting the air inside the container 200 through the exhaust path. In addition, the controller 160 closes the valve to close the exhaust path itself.

As the exhaust path is closed, the inside of the vessel 200 is closed to the outside. In the closing step (S220), the inside of the vessel 200 is closed to the outside while the plasma is repeatedly generated and stopped. Therefore, the plasma surface treatment of the object to be treated 20 is also performed in the closing step (S220).

As described above, when the plasma surface treatment is performed while the inside of the vessel 200 is closed to the outside, the ozone (O ₃ ) generated in the plasma surface treatment process is not exhausted, so that the concentration of ozone (O ₃ ) is maintained. or rise. As such, as the concentration of ozone (O ₃ ) in the container 200 increases, the sterilization of the object to be treated 20 is effectively performed.

In addition, when the inside of the container 200 is closed to the outside, even if the exhaust path is closed by the valve, a leak occurs and the internal pressure of the container 200 slightly rises. As described above, since the internal pressure of the container 200 rises due to the leak in the closing step (S60), the pressure slightly rises from the reference pressure P _B to P1 in the period from t2 to t3. As described above, when the valve is closed to perform the plasma surface treatment, the closing step (S220) is completed.

After the closing step (S220) is completed, a third exhausting step (S300) is performed.

In the third evacuation step (S300), when the predetermined closing time (t3 - t2) has elapsed, both the generation and the cessation of generation of plasma are stopped to stop the surface treatment of the object (IM), and the valve is opened to The closing of the container 200 is released, and the process of exhausting the inside of the container 200 again up to the reference pressure P _B through the exhaust unit 130 is performed (S310).

The closing time (t3 - t2) is the duration of the closing step (S220) of closing the valve 350 to perform the plasma surface treatment, and is preset in the control unit 160. When the closing time (t3 - t2) has elapsed, the control unit 160 turns off the power supply unit 141 of the processing unit 140 to completely stop the generation of plasma.

Thereafter, the control unit 160 opens the valve to open the exhaust path to release the closing of the container 200, and operates the exhaust pump to exhaust the inside of the container 200 again. In this case, the inside of the vessel 200 is exhausted to the reference pressure P _B . As described above, when only the air inside the vessel 200 is exhausted without the plasma surface treatment in the third exhaust step (S300), impurities such as hydrocarbons generated by the plasma surface treatment are exhausted, and the impurities are removed from the object to be treated 20. redeposition can be prevented. In addition, it is possible to improve the reclosable preservation of the inside of the container 200 .

In the third exhaust step (S300), since the inside of the container 200 is exhausted again, the pressure in the section from t3 to t4 is lowered to the reference pressure (PB), and then the reference pressure (PB) is continuously maintained. As described above, after the third exhausting step (S300) is completed, the exhaust path generating unit 131 or the contact member 142 (see FIG. 7A) is removed to release the communication between the exhaust path and the container 200. .

As described above, when the exhaust passage generating unit 131 or the contact member 142 (see FIG. 7A ) falls out of the container 200, the lower part of the container 200 is moved to the exhaust passage generating unit 131 or The hole created by the contact member 142 (see FIG. 7A) is plugged to maintain a seal. As described above, when the exhaust passage generating unit 131 or the contact member 142 (see FIG. 7A) is separated from the vessel 200 and the communication between the inside of the vessel 200 and the exhaust path is released, the object to be processed is removed from the receiving unit. By removing, the plasma treatment method is completed.

Meanwhile, after the processing step (S200), a step of injecting outside air into the receiving part 110 may be further included. In this case, outside air may be injected through an exhaust path of the exhaust unit 130 .

The above-described plasma surface treatment method according to an embodiment of the present invention has the following effects. After lowering the internal pressure of the container 200 to the reference pressure (P _B ) lower than atmospheric pressure, by performing the plasma surface treatment, foreign matter such as hydrocarbons on the surface of the object to be treated 20 is more effectively removed, The hydrophilicity of the surface of the water 20 is improved.

Plasma can be generated in a wider area and the efficiency of removing hydrocarbons by plasma can be further increased by repeating the generation and interruption of plasma generation, that is, by performing the plasma discharge in the form of a pulse.

By stopping the exhaust of the air inside the container 200 and performing the plasma surface treatment with the container 200 closed from the outside, the concentration of ozone (O ₃ ) inside the container 200 is increased, and through this, the blood A high sterilization effect on the surface of the treated object 20 can be achieved.

After stopping the plasma surface treatment, the inside of the container 200 is evacuated again to remove foreign substances generated during the plasma surface treatment, thereby preventing the foreign substances from being re-deposited on the object to be treated 20, and at the same time, the container ( By exhausting the internal pressure of the container 200 to a reference pressure (P _B ) lower than the atmospheric pressure, the airtight preservation of the container 200 can be improved. Therefore, the sterilization effect of the object IM sterilized by ozone (O ₃ ) is maintained.

In the above-described plasma surface treatment method according to the first embodiment of the present invention, the plasma surface treatment may be performed by generating and discharging only the plasma without repeating the generation and interruption of the plasma generation in the processing step (S200). That is, plasma can be discharged by generating plasma by continuously 'on' the power supply unit 141 instead of in the form of a pulse.

After the surface treatment by continuous plasma discharge is performed in the treatment step (S200) and the second exhaust step (S210), in the closing step (S220), the pulse-shaped plasma discharge, that is, the generation and cessation of the plasma, is repeated. Plasma surface treatment may be performed.

As another embodiment, in the processing step (S200) and the second exhaust step (S210), the surface treatment of the plasma is performed by repeating the pulse-type plasma discharge, that is, the generation and interruption of the plasma generation, and then the closing step (S220) Surface treatment by continuous plasma discharge may be performed.

In other words, the plasma surface treatment method according to the first embodiment of the present invention generates and generates plasma in at least one of the treatment step (S200), the second exhaust step (S210), and the closing step (S220). The surface treatment of the object to be treated 20 may be performed by repeatedly performing interruption.

On the other hand, referring to FIG. 17, the plasma processing method according to another embodiment of the present invention is compared with the plasma processing method according to the above-described embodiment, after the closing step (S220'), the second exhaust step (S230') and There is only a difference in that the third exhaust step (S300') is performed sequentially, and since the rest of the components are the same, overlapping descriptions will be omitted.

In the closing step (S220'), the exhaust of the inside of the container 200 is stopped while the plasma generation and production stop are repeatedly performed, and the valve provided on the exhaust path communicating with the inside of the container 200 is closed. A process of closing the container 200 is performed.

The control unit 160 stops the operation of the exhaust pump to stop exhausting the air inside the container 200 through the exhaust path. In addition, the controller 160 closes the valve to close the exhaust path itself. As the exhaust path is closed, the inside of the vessel 200 is closed to the outside.

In the closing step (S220'), the inside of the vessel 200 is closed to the outside while the plasma is repeatedly generated and stopped. Therefore, the plasma surface treatment of the object to be treated 20 is performed even in the closing step (S220'). As described above, when the plasma surface treatment is performed while the inside of the vessel 200 is closed to the outside, the ozone (O ₃ ) generated in the plasma surface treatment process is not exhausted, so that the concentration of ozone (O ₃ ) is maintained. or rise. As such, as the concentration of ozone (O ₃ ) in the container 200 increases, the sterilization of the object to be treated 20 is effectively achieved.

In addition, when the inside of the container 200 is closed to the outside, even if the exhaust path is closed by the valve, a leak occurs and the internal pressure of the container 200 slightly rises. As described above, since the internal pressure of the container 200 rises due to the leak in the closing step (S220'), the pressure in the section from t'1 to t'2 slightly rises from the reference pressure (P _B ) to P1 will do As described above, when the valve is closed to perform the plasma surface treatment, the closing step (S220') is completed.

When the closing step (S220') is completed, the second exhausting step (S230') is performed.

In the second exhaust step (S230'), after the closing step (S220'), when the predetermined closing time (t'2 - t'1) elapses, the valve is opened to release the closing of the container 200, and the container A process of exhausting the inside of the container 200 again is performed so that the internal pressure of the container 200 reaches the reference pressure P _B .

The closing time (t'2 - t'1) is the duration of the closing step (S220') of closing the valve and performing the plasma surface treatment, and is preset in the control unit 160. In the second evacuation step (S230'), the generation and interruption of plasma are repeatedly performed. Therefore, the plasma surface treatment of the object to be treated 20 is also performed in the second exhaust step (S230').

While the plasma is repeatedly generated and stopped, the control unit 160 exhausts the inside of the vessel 200 again through an exhaust pump so that the internal pressure reaches the reference pressure P _B . In this way, as the exhaust inside the container 200 is continuously performed in the process of surface treatment by plasma, the hydrocarbons removed by the plasma from the surface of the object 20 to be treated are mixed with the air inside the container 200. Since it is exhausted together, the inside of the container 200 can be maintained in a clean state. Therefore, the surface of the object to be treated 20 can be treated more effectively without foreign matter inside the container 200 .

In the second exhaust step (S230'), since the inside of the container 200 is exhausted again, the pressure in the section from t'2 to t'3 is lowered from P1 to the reference pressure (P _B ), and the reference pressure (P _B ) is maintained.

After the second exhaust step (S230') is completed, the third exhaust step (S300') is performed.

In the third exhausting step (S300'), after the second exhausting step (S230'), when the predetermined exhausting time (t'3 - t'2) has elapsed, both the generation and interruption of plasma generation are stopped so that the object to be treated is The surface treatment of (20) is stopped, and a process of continuously evacuating the inside of the container 200 so that the internal pressure of the container 200 maintains the reference pressure (P _B ) is performed.

The evacuation time (t'3 - t'2) is the duration of the evacuation of the inside of the vessel 200 in the second evacuation step (S230'), and is preset in the control unit 160. When the evacuation time (t'3 - t'2) elapses, the control unit 160 turns off the power supply unit 141 of the processing unit 140 to completely stop the generation of plasma.

Thereafter, by continuously maintaining the operation of the exhaust pump, the inside of the container 200 is continuously exhausted. In this case, the inside of the vessel 200 maintains the reference pressure (P _B ). As described above, when only the air inside the container 200 is exhausted without the plasma surface treatment in the third exhaust step (S300'), impurities such as hydrocarbons generated by the plasma surface treatment are exhausted, so that the impurities are the object to be treated ( IM) can be prevented from being redeposited. In addition, it is possible to improve the reclosable preservation of the inside of the container 200 .

In the third exhaust step (S300'), since the inside of the container 200 is continuously exhausted, the pressure in the section from t'3 to t'4 continuously maintains the reference pressure (P _B ).

Plasma surface treatment method according to another embodiment of the present invention has the following effects in addition to the effects of one embodiment of the present invention. After performing the closing step (S220') in the plasma surface treatment process, the second exhaust step (S230') and the third exhaust step (S300') are performed, so that the ozone (O ₃ ) is high in the initial stage of the plasma surface treatment. Since the concentration is guaranteed, a high sterilization effect on the surface of the object to be treated 20 inside the container 200 can be expected.

In addition, after sterilization by ozone (O ₃ ) in the closing step (S220′), since an exhaust process for removing hydrocarbons is performed, hydrocarbon re-deposition can also be effectively achieved. In the above-described plasma surface treatment method according to another embodiment of the present invention, the plasma surface treatment may be performed by generating and discharging only the plasma without repeating the generation and interruption of the plasma generation in the processing step (S200′). That is, plasma can be discharged by generating plasma by continuously 'on' the power supply unit 141 instead of in the form of a pulse.

After the surface treatment by continuous plasma discharge is performed in the treatment step (S200') and the closing step (S220'), in the second exhaust step (S230'), the pulsed plasma discharge, that is, the generation and cessation of generation of plasma The plasma surface treatment may be performed repeatedly.

As another embodiment, in the processing step (S200') and the closing step (S220'), after performing the surface treatment of the plasma by repeating the plasma discharge in the form of a pulse, that is, the generation and interruption of the plasma generation, the second exhaust step ( In S230'), surface treatment by continuous plasma discharge may be performed. In other words, the plasma surface treatment method according to another embodiment of the present invention generates and The surface treatment of the object to be treated 20 may be performed by repeatedly stopping the production.

As such, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

10: plasma processing device
100: housing
110: receiving part
130: exhaust
140: processing unit
160: control unit
180: sensor unit

Claims (1)

a hermetically sealed portion with an interior sealed against the external environment;
a pressure adjusting unit configured to exhaust air inside the sealing unit to form an atmosphere at a low pressure within a preset process pressure range inside the sealing unit;
a processing unit for discharging the air in the low pressure state by forming an electric field inside the sealing unit; and
A plasma processing apparatus comprising: a control unit controlling the pressure adjusting unit to adjust the internal pressure of the sealing unit.

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