KR102453908B1 - 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들 - Google Patents

반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들 Download PDF

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Publication number
KR102453908B1
KR102453908B1 KR1020150162613A KR20150162613A KR102453908B1 KR 102453908 B1 KR102453908 B1 KR 102453908B1 KR 1020150162613 A KR1020150162613 A KR 1020150162613A KR 20150162613 A KR20150162613 A KR 20150162613A KR 102453908 B1 KR102453908 B1 KR 102453908B1
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KR
South Korea
Prior art keywords
substrate
sealing element
elastomeric sealing
moment arm
radially inwardly
Prior art date
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KR1020150162613A
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English (en)
Korean (ko)
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KR20160063252A (ko
Inventor
징빈 펑
로버트 마셜 스토월
산티나트 공가디
아쉬윈 라메쉬
Original Assignee
노벨러스 시스템즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from US14/685,526 external-priority patent/US9988734B2/en
Application filed by 노벨러스 시스템즈, 인코포레이티드 filed Critical 노벨러스 시스템즈, 인코포레이티드
Publication of KR20160063252A publication Critical patent/KR20160063252A/ko
Priority to KR1020220127998A priority Critical patent/KR102641458B1/ko
Application granted granted Critical
Publication of KR102453908B1 publication Critical patent/KR102453908B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7625—Means for applying energy, e.g. heating means
    • H01L2224/763—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/76301—Pressing head
    • H01L2224/76314—Auxiliary members on the pressing surface
    • H01L2224/76315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
    • H01L2224/7925—Means for applying energy, e.g. heating means
    • H01L2224/793—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/79301—Pressing head
    • H01L2224/79314—Auxiliary members on the pressing surface
    • H01L2224/79315—Elastomer inlay

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020150162613A 2014-11-26 2015-11-19 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들 KR102453908B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220127998A KR102641458B1 (ko) 2014-11-26 2022-10-06 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462085171P 2014-11-26 2014-11-26
US62/085,171 2014-11-26
US14/685,526 2015-04-13
US14/685,526 US9988734B2 (en) 2011-08-15 2015-04-13 Lipseals and contact elements for semiconductor electroplating apparatuses

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220127998A Division KR102641458B1 (ko) 2014-11-26 2022-10-06 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들

Publications (2)

Publication Number Publication Date
KR20160063252A KR20160063252A (ko) 2016-06-03
KR102453908B1 true KR102453908B1 (ko) 2022-10-11

Family

ID=56040086

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020150162613A KR102453908B1 (ko) 2014-11-26 2015-11-19 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들
KR1020220127998A KR102641458B1 (ko) 2014-11-26 2022-10-06 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들
KR1020240025954A KR20240029754A (ko) 2014-11-26 2024-02-22 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020220127998A KR102641458B1 (ko) 2014-11-26 2022-10-06 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들
KR1020240025954A KR20240029754A (ko) 2014-11-26 2024-02-22 반도체 전기도금 장치들을 위한 립시일들 및 콘택트 엘리먼트들

Country Status (4)

Country Link
JP (1) JP6745103B2 (zh)
KR (3) KR102453908B1 (zh)
CN (2) CN105624754B (zh)
TW (2) TWI702311B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180251907A1 (en) * 2017-03-01 2018-09-06 Lam Research Corporation Wide lipseal for electroplating
JP6963524B2 (ja) * 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
JP7471778B2 (ja) * 2019-03-29 2024-04-22 株式会社日本マイクロニクス プローブカード
US20220396894A1 (en) * 2019-10-04 2022-12-15 Lam Research Corporation Wafer shielding for prevention of lipseal plate-out
WO2021108466A1 (en) * 2019-11-27 2021-06-03 Lam Research Corporation Edge removal for through-resist plating
JP7242516B2 (ja) * 2019-12-13 2023-03-20 株式会社荏原製作所 基板ホルダ
JP7081063B1 (ja) * 2021-10-18 2022-06-06 株式会社荏原製作所 めっき方法及びめっき装置
CN113846363B (zh) * 2021-10-27 2022-09-23 上海戴丰科技有限公司 一种晶圆电镀挂具
JP7264545B1 (ja) 2022-02-22 2023-04-25 有限会社クズハラゴム 部分メッキ治具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US7033465B1 (en) * 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US6755946B1 (en) * 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
US6550484B1 (en) * 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
JP3940648B2 (ja) * 2002-08-07 2007-07-04 日本エレクトロプレイテイング・エンジニヤース株式会社 ウェハーのめっき装置
US7087144B2 (en) 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7005379B2 (en) * 2004-04-08 2006-02-28 Micron Technology, Inc. Semiconductor processing methods for forming electrical contacts
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US9512538B2 (en) * 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
JP5237924B2 (ja) * 2008-12-10 2013-07-17 ノベルス・システムズ・インコーポレーテッド ベースプレート、及び電気メッキ装置
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US9309603B2 (en) * 2011-09-14 2016-04-12 Applied Materials, Inc Component cleaning in a metal plating apparatus

Also Published As

Publication number Publication date
JP2016135912A (ja) 2016-07-28
JP6745103B2 (ja) 2020-08-26
CN105624754A (zh) 2016-06-01
CN109137029B (zh) 2021-01-01
KR20160063252A (ko) 2016-06-03
KR20240029754A (ko) 2024-03-06
TWI681082B (zh) 2020-01-01
TWI702311B (zh) 2020-08-21
TW201629275A (zh) 2016-08-16
TW202010881A (zh) 2020-03-16
CN105624754B (zh) 2019-06-11
KR20220141268A (ko) 2022-10-19
KR102641458B1 (ko) 2024-02-28
CN109137029A (zh) 2019-01-04

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