KR102453496B1 - Display module - Google Patents

Abstract

The display module includes a display area on a plane and a non-display area disposed outside the display area. The display module includes a base layer, a circuit element layer, a display element layer, a thin film encapsulation layer, and a touch sensing layer. The inorganic film of the touch sensing layer is in contact with the inorganic film of the circuit element layer exposed by the organic film of the circuit element layer. By disposing the inorganic film of the thin film encapsulation layer between the inorganic film of the touch sensing layer and the inorganic film of the circuit element layer, a moisture permeation path that causes peeling of the thin film encapsulation layer is blocked.

Description

Display module {DISPLAY MODULE}

The present invention relates to a display module, and to a touch sensing unit integrated display panel.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. The input devices of the display devices include a keyboard or a mouse. Also, recently, display devices have a touch panel as an input device.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display module with reduced defects.

A display module according to an embodiment of the present invention includes a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, a thin film encapsulation layer, and a touch sensing layer. The base layer includes a display area and a non-display area disposed outside the display area. The circuit element layer includes an intermediate inorganic film overlapping the display area and the non-display area, an intermediate organic film disposed on the intermediate inorganic film and exposing a portion of the intermediate inorganic film in the non-display area, and a circuit element. do. The display element layer includes the display elements disposed in the display area. The thin film encapsulation layer includes a first encapsulation inorganic layer including a first area overlapping the display area and a second area overlapping the non-display area and having a thickness smaller than that of the first area.

The touch sensing layer includes a plurality of touch electrodes and a touch inorganic layer overlapping the display area and the non-display area and contacting the intermediate inorganic layer exposed by the intermediate organic layer.

On the upper surface of the base layer, an edge of the intermediate organic layer may be disposed inside the edge of the intermediate inorganic layer.

A film thickness of the second region may become smaller as the distance from the first region increases.

A dam portion disposed outside the edge of the intermediate organic layer and extending along the edge of the intermediate organic layer may be further included. The dam portion may surround the edge of the intermediate organic layer.

The circuit element may include signal lines electrically connected to the display elements and signal pads connected to ends of the signal lines. The non-display area may include a pad area in which the signal pads are disposed.

A portion of the dam portion may be parallel to the pad region.

A bank may be disposed between the portion of the dam portion and the pad region and may further include a bank parallel to the portion of the dam portion.

The dam part and the bank may be disposed on the intermediate inorganic layer, and the bank may have a greater height than the dam part. The first encapsulation inorganic layer may overlap the dam portion and the bank.

An outer organic layer connected to the bank, spaced apart from the intermediate organic layer, and disposed between the display area and the pad area may be further included.

An edge of the outer organic layer may be disposed inside an edge of the touch inorganic layer, and the edge of the touch inorganic layer may be disposed inside the edge of the intermediate inorganic layer.

A portion of the first encapsulation inorganic layer that does not overlap the outer organic layer may be disposed between the intermediate inorganic layer and the touch inorganic layer, and may contact the intermediate inorganic layer and the touch inorganic layer.

The non-display area includes a first non-bending area, a second non-bending area spaced apart from the first non-bending area in a first direction, and a bending area defined between the first non-bending area and the second non-bending area. may include

The bending region may be bent such that a bending axis is defined along a second direction orthogonal to the first direction.

The intermediate inorganic layer may have a groove exposing a portion of the non-display area of the base layer, and a dummy organic pattern may be disposed inside the groove.

It may further include inorganic lines disposed outside the edge of the intermediate inorganic layer and extending along the edge of the intermediate inorganic layer. The touch inorganic layer may be spaced apart from the inorganic lines.

The touch sensing layer may further include a touch organic layer disposed on the inorganic touch layer and covering the touch electrodes. The touch organic layer may overlap the inorganic lines.

The thin-film encapsulation layer further includes a second encapsulating inorganic layer disposed between the display element layer and the first encapsulating inorganic layer, and an encapsulating organic layer disposed between the first encapsulating inorganic layer and the second encapsulating inorganic layer. can do.

According to the above description, even if the inorganic encapsulation film includes the second region having a low film density, the encapsulation inorganic film is not peeled off. This is because the inorganic film of the touch sensing layer is directly deposited on the inorganic film of the display panel and compresses the encapsulating inorganic film disposed therebetween. In addition, since the inorganic film of the touch sensing layer is directly deposited on the inorganic film of the display panel, the penetration path of moisture is blocked.

1 is a perspective view of a display module according to an embodiment of the present invention.
2 is a cross-sectional view of a display module according to an embodiment of the present invention.
3 is a plan view of a display panel according to an exemplary embodiment.
4 is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
5 is an enlarged cross-sectional view of a display panel according to an exemplary embodiment of the present invention.
6A is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
6B is a plan view of a touch sensing unit according to an embodiment of the present invention.
7A is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
7B is a plan view of a touch sensing unit according to an embodiment of the present invention.
8A to 8C are enlarged cross-sectional views of a display module according to an exemplary embodiment of the present invention.
9A and 9B are plan views illustrating manufacturing steps of a display module according to an embodiment of the present invention.
10A to 10C are views illustrating a process of forming the thin film encapsulation layer shown in FIGS. 9A and 9B .
11A and 11B are plan views illustrating a display module according to an embodiment of the present invention and a display module according to a comparative example.
12A and 12B are perspective views of a display module according to an embodiment of the present invention.
13 is a plan view of a display module according to an embodiment of the present invention.
14 is a cross-sectional view of a display module according to an embodiment of the present invention.
15 is a perspective view of a display module according to an embodiment of the present invention.
16 is a plan view of a display module according to an embodiment of the present invention.
17 is a cross-sectional view of a display module according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as being “on,” “connected to,” or “coupled to” another component, it is directly connected/connected on the other component. It means that they may be coupled or that a third component may be disposed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “and/or” includes any combination of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as "below", "below", "above", "upper" and the like are used to describe the relationship of the components shown in the drawings. The above terms are relative concepts, and are described with reference to directions indicated in the drawings.

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features, number, or step. , it should be understood that it does not preclude the possibility of the existence or addition of , operation, components, parts or combinations thereof.

1 is a perspective view of a display module DM according to an embodiment of the present invention. 2 is a cross-sectional view of a display module DM according to an embodiment of the present invention.

As illustrated in FIG. 1 , the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction axis DR1 and the second direction axis DR2 . The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display module DM. A front surface (or an upper surface) and a rear surface (or a lower surface) of each member are divided by the third direction axis DR3 . However, the directions indicated by the first to third direction axes DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third direction axes DR1 , DR2 , and DR3 , respectively.

The display module DM according to the present embodiment may be a flat rigid display module. However, the present invention is not limited thereto, and the display module according to the present invention may be a flexible display module (DM). The display module DM according to the present embodiment may be applied to large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

1 , the display module DM includes a display area DM-DA in which an image IM is displayed and a non-display area DM-NDA adjacent to the display area DM-DA. The non-display area DM-NDA is an area in which an image is not displayed. 1 illustrates a vase as an example of the image IM. As an example, the display area DM-DA may have a rectangular shape. The non-display area DM-NDA may surround the display area DM-DA. However, the present invention is not limited thereto, and the shape of the display area DM-DA and the shape of the non-display area DM-NDA may be relatively designed.

2 is a cross-sectional view of a display module DM according to an embodiment of the present invention. 2 illustrates a cross-section defined by the first directional axis DR1 and the third directional axis DR3.

As shown in FIG. 2 , the display module DM includes a display panel DP and a touch sensing unit TS or a touch sensing layer. Although not shown separately, the display module DM according to an embodiment of the present invention includes a protective member disposed on the lower surface of the display panel DP, an anti-reflection member disposed on the upper surface of the touch sensing unit TS, and/or It may further include a window member.

The display panel DP may be a light emitting display panel, and is not particularly limited. For example, the display panel DP may be an organic light emitting display panel or a quantum dot light emitting display panel. In the organic light emitting display panel, the light emitting layer includes an organic light emitting material. In the quantum dot light emitting display panel, the light emitting layer includes a quantum dot and a quantum rod. Hereinafter, the display panel DP will be described as an organic light emitting display panel.

The display panel DP includes a base layer SUB, a circuit element layer DP-CL disposed on the base layer SUB, a display element layer DP-OLED, and a thin film encapsulation layer TFE. Although not shown separately, the display panel DP may further include functional layers such as an anti-reflection layer and a refractive index control layer.

The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate. The display area DM-DA and the non-display area DM-NDA described with reference to FIG. 1 may be equally defined in the base layer SUB.

The circuit element layer DP-CL includes at least one intermediate insulating layer and a circuit element. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit element includes signal lines, a driving circuit of a pixel, and the like. A detailed description thereof will be given later.

The display element layer DP-OLED includes at least organic light emitting diodes. The display device layer DP-OLED may further include an organic layer such as a pixel defining layer.

The thin film encapsulation layer TFE encapsulates the display element layer DP-OLED. The thin film encapsulation layer TFE includes at least one inorganic layer (hereinafter, referred to as an encapsulation inorganic layer). The thin film encapsulation layer TFE may further include at least one organic layer (hereinafter, an encapsulation organic layer). The encapsulation inorganic film protects the display element layer (DP-OLED) from moisture/oxygen, and the encapsulation organic film protects the display element layer (DP-OLED) from foreign substances such as dust particles. The encapsulation inorganic layer may include a silicon nitride layer, a silicon oxynitride layer and a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The encapsulation organic layer may include an acryl-based organic layer, but is not limited thereto.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS is directly disposed on the organic light emitting display panel DP. As used herein, "directly disposed" means that it is formed by a continuous process, except for attachment using a separate adhesive layer.

The touch sensing unit TS may have a multi-layered structure. The touch sensing unit TS may include a single or multi-layered conductive layer. The touch sensing unit TS may include a single or multi-layered insulating layer.

The touch sensing unit TS may sense an external input, for example, in a capacitive manner. In the present invention, the operation method of the touch sensing unit TS is not particularly limited, and in an embodiment of the present invention, the touch sensing unit TS may sense an external input using an electromagnetic induction method or a pressure sensing method.

3 is a plan view of a display panel DP according to an exemplary embodiment. 4 is an equivalent circuit diagram of a pixel PX according to an embodiment of the present invention. 5 is an enlarged cross-sectional view of a display panel DP according to an exemplary embodiment.

3 , the display panel DP includes a display area DA and a non-display area NDA in a plan view. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA. The display area DA and the non-display area NDA of the display panel DP respectively correspond to the display area DD-DA and the non-display area DD-NDA of the display module DM shown in FIG. 1 . . The display area DA and the non-display area NDA of the display panel DP are not necessarily the same as the display areas DD-DA and the non-display area DD-NDA of the display module DM, and display It may be changed according to the structure/design of the panel DP.

The display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, and a plurality of pixels PX. The plurality of pixels PX are disposed in the display area DA. Each of the pixels PX includes an organic light emitting diode and a pixel driving circuit connected thereto. The driving circuit GDC, the plurality of signal lines SGL, and the pixel driving circuit may be included in the circuit element layer DP-CL shown in FIG. 2 .

The driving circuit GDC may include a scan driving circuit. The scan driving circuit GDC generates a plurality of scan signals and sequentially outputs the plurality of scan signals to a plurality of scan lines GL to be described later. The scan driving circuit GDC may further output another control signal to the driving circuit of the pixels PX.

The scan driving circuit GDC may include a plurality of thin film transistors formed through the same process as the driving circuit of the pixels PX, for example, a low temperature polycrystaline silicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

The plurality of signal lines SGL include scan lines GL, data lines DL, a power line PL, and a control signal line CSL. The scan lines GL are respectively connected to a corresponding pixel PX among the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX among the plurality of pixels PX. do. The power line PL is connected to the plurality of pixels PX. The control signal line CSL may provide control signals to the scan driving circuit GDC.

The display panel DP includes signal pads DP-PD connected to ends of the signal lines SGL. The signal pads DP-PD may be a kind of circuit element. An area in which the signal pads DP-PD are disposed among the non-display area NDA is defined as the pad area NDA-PD. Touch pads TS-PD connected to touch signal lines to be described later may also be disposed in the pad area NDA-PD.

The display panel DP may include a dam part DMP. The dam portion DMP may extend along the edge of the display area DA. The dam portion DMP may surround the display area DA. A portion of the dam portion DMP may be parallel to the pad area NDA-PD.

The display panel DP may include a bank BNP. The bank BNP may be disposed between the display area DA and the pad area NDA-PD. The bank BNP may be parallel to a portion of the dam portion DMP and the pad area NDA-PD. In an embodiment of the present invention, at least one of the dam part DMP and the bank BNP may be omitted.

4 exemplarily illustrates a pixel PX connected to any one scan line GL, any one data line DL, and a power line PL. The configuration of the pixel PX is not limited thereto and may be modified and implemented.

The organic light emitting diode (OLED) may be a top light emitting diode or a bottom light emitting diode. The pixel PX is a pixel driving circuit for driving the organic light emitting diode OLED and includes a first transistor T1 or a switching transistor, a second transistor T2 or a driving transistor, and a capacitor Cst. The first power voltage ELVDD is provided to the second transistor T2 , and the second power voltage ELVSS is provided to the organic light emitting diode OLED. The second power voltage ELVSS may be lower than the first power voltage ELVDD.

The first transistor T1 outputs a data signal applied to the data line DL in response to the scan signal applied to the scan line GL. The capacitor Cst is charged with a voltage corresponding to the data signal received from the first transistor T1 .

The second transistor T2 is connected to the organic light emitting diode OLED. The second transistor T2 controls the driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor Cst. The organic light emitting diode OLED emits light during the turn-on period of the second transistor T2 .

FIG. 5 is a partial cross-section of the display panel DP corresponding to the equivalent circuit shown in FIG. 4 . A circuit element layer DP-CL, a display element layer DP-OLED, and a thin film encapsulation layer TFE are sequentially disposed on the base layer SUB.

The circuit element layer DP-CL includes at least one inorganic film, at least one organic film, and a circuit element. The circuit element layer DP-CL includes a buffer layer BFL as an inorganic layer, a first intermediate inorganic layer 10 , and a second intermediate inorganic layer 20 , and includes an intermediate organic layer 30 as an organic layer. can do.

The inorganic layers may include silicon nitride, silicon oxynitride and silicon oxide. The organic film is at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin may include The circuit element includes conductive patterns and/or semiconductor patterns.

The buffer layer BFL improves bonding strength between the base layer SUB and the conductive patterns or semiconductor patterns. Although not shown separately, a barrier layer that prevents foreign substances from entering may be further disposed on the upper surface of the base layer SUB. The buffer layer BFL and the barrier layer may be selectively disposed/omitted.

A semiconductor pattern OSP1 (hereinafter, referred to as a first semiconductor pattern) of the first transistor T1 and a semiconductor pattern OSP2 (hereinafter, referred to as a second semiconductor pattern) of the second transistor T2 are disposed on the buffer layer BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may be selected from amorphous silicon, polysilicon, and metal oxide semiconductors.

A first intermediate inorganic layer 10 is disposed on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 . A control electrode (GE1: hereinafter, first control electrode) of the first transistor T1 and a control electrode (GE2: hereinafter, a second control electrode) of the second transistor T2 are disposed on the first intermediate inorganic layer 10 . do. The first control electrode GE1 and the second control electrode GE2 may be manufactured according to the same photolithography process as the scan lines GL (refer to FIG. 5A ).

A second intermediate inorganic layer 20 covering the first control electrode GE1 and the second control electrode GE2 is disposed on the first intermediate inorganic layer 10 . An input electrode (DE1: hereinafter, a first input electrode) and an output electrode (SE1: a first output electrode) of the first transistor T1 and an input electrode of the second transistor T2 are formed on the second intermediate inorganic layer 20 . (DE2: hereinafter, a second input electrode) and an output electrode (SE2: a second output electrode) are disposed.

The first input electrode DE1 and the first output electrode SE1 have a first through hole CH1 and a second through hole CH2 passing through the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20 . ) to each of the first semiconductor patterns OSP1. The second input electrode DE2 and the second output electrode SE2 have a third through hole CH3 and a fourth through hole CH4 passing through the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20 . ) to each of the second semiconductor patterns OSP2. Meanwhile, in another embodiment of the present invention, some of the first transistor T1 and the second transistor T2 may be modified into a bottom gate structure.

An intermediate organic film 30 covering the first input electrode DE1 , the second input electrode DE2 , the first output electrode SE1 , and the second output electrode SE2 on the second intermediate inorganic film 20 . ) is placed. The intermediate organic layer may provide a flat surface.

A display device layer DP-OLED is disposed on the intermediate organic layer 30 . The display device layer DP-OLED may include a pixel defining layer PDL and an organic light emitting diode OLED. The pixel defining layer PDL may include an organic material like the intermediate organic layer 30 . The first electrode AE is disposed on the intermediate organic layer 30 . The first electrode AE is connected to the second output electrode SE2 through a fifth through hole CH5 penetrating the intermediate organic layer 30 . An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the first electrode AE.

The pixel PX may be disposed in the pixel area on a plane. The pixel area may include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA may surround the light emission area PXA. In the present exemplary embodiment, the emission area PXA is defined to correspond to a partial area of the first electrode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (refer to FIG. 3 ).

An emission layer EML is disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the opening OP. That is, the emission layer EML may be formed separately in each of the plurality of pixels PX. The emission layer EML may include an organic material and/or an inorganic material. Although the patterned emission layer EML is illustrated as an example in the present embodiment, the emission layer EML may be commonly disposed in the plurality of pixels PX. In this case, the emission layer EML may generate white light. In addition, the light emitting layer EML may have a multilayer structure.

An electronic control layer ECL is disposed on the emission layer EML. Although not shown separately, the electronic control layer ECL may be commonly formed in the plurality of pixels PX (refer to FIG. 3 ).

The second electrode CE is disposed on the electronic control layer ECL. The second electrode CE is commonly disposed in the plurality of pixels PX.

A thin film encapsulation layer TFE is disposed on the second electrode CE. The thin film encapsulation layer TFE is commonly disposed on the plurality of pixels PX. In this embodiment, the thin film encapsulation layer TFE directly covers the second electrode CE. In an embodiment of the present invention, a capping layer covering the second electrode CE may be further disposed between the thin film encapsulation layer TFE and the second electrode CE. In this case, the thin film encapsulation layer TFE may directly cover the capping layer.

6A is a cross-sectional view of a touch sensing unit TS according to an embodiment of the present invention. 6B is a plan view of a touch sensing unit according to an embodiment of the present invention. 7A is a cross-sectional view of a touch sensing unit TS according to an embodiment of the present invention. 7B is a plan view of a touch sensing unit according to an embodiment of the present invention.

As shown in FIG. 6A , the touch sensing unit TS includes a first conductive layer TS-CL1, a first insulating layer TS-IL1 (hereinafter, a first touch insulating layer), and a second conductive layer TS-CL2. ), and a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive layer TS-CL1 is directly disposed on the thin film encapsulation layer TFE. The present invention is not limited thereto, and another inorganic layer or an organic layer may be further disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single-layer structure or a multi-layer structure stacked along the third direction axis DR3 . The multi-layered conductive layer may include at least two or more of transparent conductive layers and metal layers. The multi-layered conductive layer may include metal layers including different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof. For example, each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a three-layer structure of titanium/aluminum/titanium.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, it will be described that the first conductive layer TS-CL1 includes first conductive patterns and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic material or an organic material. At least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

At least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an organic layer. The organic film is made of at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin. may include In the present exemplary embodiment, the first touch insulating layer TS-IL1 is described as a touch inorganic layer, and the second touch insulating layer TS-IL2 is described as a touch organic layer. As shown in FIG. 6B , the touch sensing unit TS has a first touch signal connected to the first touch electrodes TE1-1 to TE1-5 and the first touch electrodes TE1-1 to TE1-5. The second touch signal lines ( ) connected to the lines SL1-1 to SL1-5 , the second touch electrodes TE2-1 to TE2-4 , and the second touch electrodes TE2-1 to TE2-4 . SL2-1 to SL2-4, and the touch pads TS connected to the first touch signal lines SL1-1 to SL1-5 and the second touch signal lines SL2-1 to SL2-4 -PD) The first touch signal lines SL1-1 to SL1-5 are respectively connected to one end of the first touch electrodes TE1-1 to TE1-5. The lines SL2-1 to SL2-4 are respectively connected to both ends of the second touch electrodes TE2-1 to TE2-4. In an embodiment of the present invention, one touch signal line SL1-1 to SL1-5 are also connected to both ends of the first touch electrodes TE1-1 to TE1-5, or the second touch signal lines SL2-1 to SL2-4 are connected to the second touch electrodes TE2 -1 to TE2-4), and Fig. 6b shows a dam portion DMP and a bank BNP provided in the display panel DP to indicate a relative position with respect to the touch sensing unit TS. Each of the first touch electrodes TE1-1 to TE1-5 may have a mesh shape in which a plurality of touch openings are defined. It includes a plurality of first touch sensor parts SP1 and a plurality of first connection parts CP1. The first touch sensor parts SP1 are arranged along the second direction DR2. First connection parts CP1 ), each of the first touch sensor units SP1 connects two adjacent first touch sensor units SP1, although not specifically illustrated, the first touch signal lines SL1-1 to SL1-5 It may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-4 insulate and cross the first touch electrodes TE1-1 to TE1-5. Each of the second touch electrodes TE2-1 to TE2-4 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-4 includes a plurality of second touch sensor units SP2 and a plurality of second connection units CP2. The second touch sensor units SP2 are arranged along the first direction DR1 . Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2 . The second touch signal lines SL2-1 to SL2-4 may also have a mesh shape.

The first touch electrodes TE1-1 to TE1-5 and the second touch electrodes TE2-1 to TE2-4 are electrostatically coupled. As touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-5, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

A plurality of first touch sensor units SP1, a plurality of first connection units CP1, first touch signal lines SL1-1 to SL1-5, a plurality of second touch sensor units SP2, a plurality of Some of the second connection parts CP2 and the second touch signal lines SL2-1 to SL2-4 are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A , and other parts are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A . may be formed by patterning the second conductive layer TS-CL2 shown in Fig. 6A In this embodiment, the plurality of first connection parts CP1 are formed from the first conductive layer TS-CL1, A plurality of first touch sensor units SP1, first touch signal lines SL1-1 to SL1-5, a plurality of second touch sensor units SP2, a plurality of second connection units CP2, and a second The two touch signal lines SL2-1 to SL2-4 may be formed from the second conductive layer TS-CL2.

Although the touch sensing unit TS in which the plurality of first connection parts CP1 and the plurality of second connection parts CP2 cross each other is illustrated as an example, the present invention is not limited thereto. For example, each of the second connection parts CP2 may be deformed in a V shape so as not to overlap the plurality of first connection parts CP1 . The V-shaped second connection parts CP2 may overlap the first touch sensor parts SP1 . Although the first touch sensor units SP1 and the second touch sensor units SP2 having a rhombic or triangular shape have been illustrated as examples in the present embodiment, the present disclosure is not limited thereto.

As shown in FIG. 7A , the touch sensing unit TS according to an embodiment of the present invention includes a single-layer touch sensing unit including a conductive layer TS-CL and an insulating layer TS-IL (touch insulating layer). can be The tomographic touch sensing unit may acquire coordinate information in a self-cap method.

The conductive layer TS-CL may have a single-layer structure or a multi-layer structure stacked along the third direction axis DR3. The multi-layered conductive layer may include at least two or more of transparent conductive layers and metal layers. The conductive layer TS-CL includes a plurality of patterns such as touch electrodes and touch signal lines. The touch insulating layer TS-IL includes at least an inorganic layer. The touch insulating layer may further include an organic layer.

The touch sensing unit TS includes touch electrodes TE and touch signal lines SL that are spaced apart from each other. The touch electrodes TE may be arranged in a matrix form and are respectively connected to the touch signal lines SL. The shape and arrangement of the touch electrodes TE are not particularly limited. Some of the touch signal lines SL may be disposed in the display area DA, and some may be disposed in the non-display area NDA. FIGS. 8A and 8B show a display module ( DM) is an enlarged cross-sectional view. FIG. 8A shows a cross-section corresponding to I-I' of FIG. 6B, and FIG. 8B shows a cross-section corresponding to II-II' of FIG. 6B. 8c shows a cross-section corresponding to III-III' of FIG. 6b. FIG. 8B illustrates a cross section overlapping the data line DL, and FIG. 8C illustrates a cross section overlapping the touch signal line SL.

The stacked structure of the circuit element layer DP-CL, the display element layer DP-OLED, and the thin film encapsulation layer TFE disposed in the display area DA is the same as the configuration described with reference to FIG. 5 , and detailed description thereof is omitted. However, the hole control layer HCL and the electron control layer ECL are not shown in FIGS. 8A and 8B . The stacked structure of the touch sensing unit TS is also the same as that described with reference to FIGS. 6A and 6B , and detailed description thereof will be omitted. A thin film including a first encapsulating inorganic layer IOL1 , a second encapsulating inorganic layer IOL2 , and an encapsulating organic layer OL disposed between the first encapsulating inorganic layer IOL1 and the second encapsulating inorganic layer IOL2 . An encapsulation layer (TFE) is illustrated as an example.

8A and 8B , the scan driving circuit GDC constituting the circuit element layer DP-CL is disposed in the non-display area NDA. The scan driving circuit GDC includes at least one transistor GDC-T formed through the same process as the pixel transistor T2 . The scan driving circuit GDC may include signal lines GDC-SL disposed on the same layer as the input electrode of the pixel transistor T2 . Although not shown separately, the scan driving circuit GDC may further include a signal line disposed on the same layer as the control electrode of the pixel transistor T2 .

The power electrode PWE providing the second power voltage ELVSS is disposed outside the scan driving circuit GDC. The power electrode PWE may receive the second power voltage from the outside. A connection electrode E-CNT is disposed on the intermediate organic layer 30 . The connection electrode E-CNT connects the power electrode PWE and the second electrode CE. Since the connection electrode E-CNT is formed through the same process as that of the first electrode AE, the connection electrode E-CNT may include the same layer structure and the same material. The connection electrode E-CNT and the first electrode AE may have the same thickness.

One data line DL disposed on the second intermediate inorganic layer 20 is illustrated as an example. A signal pad DP-PD is connected to an end of the data line DL.

8A to 8C , the dam part DMP may have a multilayer structure. The lower portion DM1 may be formed simultaneously with the intermediate organic layer 30 , and the upper portion DM2 may be formed simultaneously with the pixel defining layer PDL. The dam part DMP prevents the liquid organic material from spreading to the outside of the intermediate inorganic layers 10 and 20 in the process of forming the encapsulation organic layer OL. In the encapsulation organic layer OL, a liquid organic material may be formed on the first encapsulation inorganic layer IOL1 by an inkjet method. In this case, the dam part DMP sets the boundary of a region where the liquid organic material is disposed .

The bank BNP may have a multi-layer structure. The lower portion BN1 may be formed simultaneously with the intermediate organic layer 30 , and the upper portion BN2 may be formed simultaneously with the pixel defining layer PDL. The upper part BN2 has a stepped shape and includes a first part BN2-1 and a second part BN2-2 integrally formed. The bank BNP is higher than the dam part DMP by the height of the second part BN2 - 2 . The bank BNP supports a mask used in the process of forming the encapsulation inorganic layers IOL1 and IOL2.

The circuit element layer DP-CL may further include an outer organic layer 30 -O connected to the bank BNP. The outer organic layer 30 -O may have a multilayer structure. The outer organic layer 30 - O may include a lower portion formed simultaneously with the intermediate organic layer 30 and an upper portion formed simultaneously with the pixel defining layer PDL. The outer organic layer 30 - O is spaced apart from the intermediate organic layer 30 and is disposed between the display area DA and the pad area NDA-PD.

The first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2 overlap the dam portion DMP. The first encapsulating inorganic layer IOL1 and the second encapsulating inorganic layer IOL2 also overlap the bank BNP. Since the intermediate organic layer 30 and the dam part DMP are spaced apart from each other, and the dam part DMP and the bank BNP are spaced apart from each other, no organic material is disposed in the regions therebetween. The first encapsulation inorganic layer IOL1 may contact the second intermediate inorganic layer 20 in these interspaced regions. In FIG. 8B , a portion of the data line DL is disposed between the second intermediate inorganic layer 20 and the first encapsulation inorganic layer IOL1 , but as shown in FIG. 8C , another data line DL is not disposed. In the region, the first encapsulation inorganic layer IOL1 and the second intermediate inorganic layer 20 contact each other.

The touch inorganic layer TS-IL1 overlaps the dam portion DMP and the bank BNP. The touch inorganic layer TS-IL1 is in contact with the intermediate organic layer 30 , the dam portion DMP, and the bank BNP, and the second intermediate inorganic layer 20 exposed from the outer organic layer 30 - O . In FIG. 8B , the data line DL is disposed between the touch inorganic layer TS-IL1 and the second intermediate inorganic layer 20 , but as shown in FIG. 8C , in another area where the data line DL is not disposed. The touch inorganic layer TS-IL1 and the second intermediate inorganic layer 20 are in contact with each other.

9A and 9B are plan views illustrating manufacturing steps of a display module DM according to an embodiment of the present invention. 10A to 10C are diagrams illustrating a process of depositing the thin film encapsulation layer (TFE) illustrated in FIGS. 9A and 9B .

9A is a plan view illustrating the edges of the second intermediate inorganic film 20 , the intermediate organic film 30 , the outer organic film 30 -O , and the second encapsulation inorganic film IOL2 described with reference to FIGS. 8A to 8C . shown. Although not shown separately, the first intermediate inorganic film 10 may have substantially the same shape as the second intermediate inorganic film 20 on a plan view. The first encapsulating inorganic layer IOL1 may have substantially the same shape as the second encapsulating inorganic layer IOL2 on a plan view. The shape of the edge of the encapsulation organic layer OL may correspond to the shape of the dam part DMP. The buffer layer BFL may have the same shape as the base layer SUB.

The second intermediate inorganic layer 20 overlaps the display area DA and the non-display area NDA. The edge of the second intermediate inorganic layer 20 has a shape similar to the edge of the base layer SUB. The edge of the second intermediate inorganic layer 20 is disposed inside the edge of the base layer SUB, and disposed adjacent to the edge of the base layer SUB.

The intermediate organic layer 30 overlaps the display area DA and the non-display area NDA. The intermediate organic layer 30 is disposed inside the second intermediate inorganic layer 20 . That is, the edge of the intermediate organic layer 30 is disposed inside the edge of the second intermediate inorganic layer 20 . An edge of the intermediate organic layer 30 is disposed adjacent to the boundary between the display area DA and the non-display area NDA. Accordingly, the intermediate organic layer 30 exposes a portion of the second intermediate inorganic layer 20 in the non-display area NDA. The intermediate organic layer 30 may expose an edge portion of the second intermediate inorganic layer 20 in the non-display area NDA.

The outer organic layer 30 -O is connected to the bank BNP, is spaced apart from the middle organic layer 30 , and is disposed between the display area DA and the pad area NDA-PD. The outer organic layer 30 - O exposes a portion of the second intermediate inorganic layer 20 in the non-display area NDA.

The second encapsulation inorganic layer IOL2 overlaps the display area DA and the non-display area NDA. As illustrated in FIG. 9B , the second encapsulation inorganic layer IOL2 includes a first area IOL2-1 overlapping the display area DA and a second area IOL2-2 overlapping the non-display area NDA. ) may be included. The first area IOL2-1 may further overlap the non-display area NDA, and the second area IOL2-2 may not overlap the display area DA.

The second region IOL2-2 is thinner than the first region IOL2-1. Also, the second region IOL2 - 2 has a film density lower than that of the first region IOL2-1 . This is because, as will be described later, the second encapsulation inorganic layer IOL2 is deposited using an open mask. Although not shown separately, the first encapsulation inorganic layer IOL1 may also have a first region and a second region having a thickness lower than that of the first region. This is because the first encapsulating inorganic layer IOL1 and the second encapsulating inorganic layer IOL2 were formed using the same mask.

10A to 10C are views illustrating a process of forming the thin film encapsulation layer (TFE) illustrated in FIGS. 8A to 9B .

As shown in FIG. 10A , the same process is performed on a plurality of cell regions C-SUB set in the mother substrate MS to form a display module DM for each of the plurality of cell regions C-SUB. do. After the manufacturing process is completed, the mother board MS is cut to separate the display modules DM.

The first encapsulating inorganic layer IOL1, the encapsulating organic layer OL, and the second encapsulating inorganic layer IOL1 shown in FIGS. 8A and 8C are sequentially formed, but the encapsulating organic layer OL is formed by the inkjet method described above. to form with The first encapsulating inorganic layer IOL1 and the second encapsulating inorganic layer IOL2 are formed through a deposition process described below. The second encapsulation inorganic layer IOL2 will be mainly described.

As shown in FIGS. 10A and 10B , a mask MSK having a plurality of openings M-OP defined is aligned with the mother substrate MS. The opening M-OP may correspond to the display area DA shown in FIGS. 9A and 9B . An inorganic material is deposited after placing the mother substrate MS on which the mask MSK is aligned in the deposition chamber.

The display module DP-I shown in FIG. 10B has a form in which even the display element layer DP-OLED of the display panel DP shown in FIG. 2 is formed. The mask MSK is supported by the bank BNP. Since a gap is maintained between the mask MSK and the display module DP-I, the inorganic material is deposited over a larger area than the opening M-OP. That is, the inorganic material is deposited not only in the display area DA but also in the non-display area NDA. Accordingly, the second encapsulation inorganic layer IOL2 having the shape shown in FIG. 9B is formed.

As shown in FIG. 10C , since the second region IOL2 - 2 of the second encapsulation inorganic layer IOL2 overlaps the mask MSK, the amount of inorganic material deposited is relatively small, and thus the first region IOL2 - The second thickness TH2 is thinner than the first thickness TH1 of 1). The second thickness TH2 of the second area IOL2 - 2 becomes smaller as the distance from the first area IOL2 - 1 increases. Also, the second area IOL2 - 2 has a smaller density than the first area IOL2 - 1 . This is because ashing gases used to remove organic residues before depositing the encapsulation inorganic film, for example, N ₂ O, exist around the mask (MSK) and prevent deposition.

The second region IOL2 - 2 having a thin film thickness and a small film density has relatively weak bonding force to the lower film compared to the first region IOL2-1 . In particular, when the lower layer is an organic layer, moisture may penetrate between the interface between the inorganic layer and the organic layer, and the inorganic layer may be peeled off. The first encapsulation inorganic layer IOL1 may be peeled off more easily than the second encapsulating inorganic layer IOL2 because the intermediate organic layer 30 or the pixel defining layer PDL, which is an organic layer, is disposed thereunder.

According to the present exemplary embodiment, in order to prevent the inorganic layer from being peeled off, the touch inorganic layer is in contact with the intermediate inorganic layer 20 exposed by the intermediate organic layer 30 in the non-display area NDA. Hereinafter, it will be described in more detail with reference to FIGS. 11A and 11B.

11A and 11B are plan views illustrating a display module DM according to an embodiment of the present invention and a display module DM-S according to a comparative example.

11A , in the non-display area NDA, the touch inorganic layer TS-IL1 contacts the second intermediate inorganic layer 20 exposed by the intermediate organic layer 30 . . A corner area AA of the second encapsulation inorganic layer IOL2 is indicated by a dotted line. In the corner area AA, the second encapsulation inorganic layer IOL2 is in contact with the touch inorganic layer TS-IL1. In the corner area AA, since the touch inorganic layer TS-IL1 comes into contact with the intermediate inorganic layer 20 and the second encapsulation inorganic layer IOL2 disposed therebetween is sealed, the penetration path of moisture as indicated by the arrow is is blocked

In addition, the touch inorganic layer TS-IL1 and the intermediate inorganic layer 20 are in contact along the edge of the display area DP. The second encapsulation inorganic layer IOL2 is sealed along the edge of the display area DP. Even within the pad area NDA-PD, the touch inorganic layer TS-IL1 and the intermediate inorganic layer 20 are in contact.

The edge of the touch inorganic layer TS-IL1 may be disposed inside the edge of the second intermediate inorganic layer 20 . The edge of the outer organic layer 30 -O is disposed inside the edge of the touch inorganic layer TS-IL1. The touch inorganic layer TS-IL1 may contact a portion of the second intermediate inorganic layer 20 exposed from the outer organic layer 30 -O in the non-display area NDA. The second intermediate inorganic layer 20 and the touch inorganic layer TS-IL1 may contact each other in the pad area NDA-PD.

According to the comparative embodiment shown in FIG. 11B , the intermediate organic layer 30 and the second intermediate inorganic layer 20 have substantially the same shape in plan view. Since the touch inorganic layer TS-IL1 is disposed on the intermediate organic layer 30 , it is not in contact with the second intermediate inorganic layer 20 . Moisture permeated in the direction of the arrow peels off the encapsulation inorganic membrane. In particular, the second region of the encapsulating inorganic film having a small film density can be peeled off.

According to the present embodiment, defects due to moisture may be reduced compared to the display module DM-S according to the comparative example. This is because, as described above, the display panel DP includes the patterned organic layer, and the inorganic layer of the touch sensing layer TS contacts the exposed portion of the inorganic layer of the display panel DP.

12A and 12B are perspective views of a display module DM according to an embodiment of the present invention. 13 is a plan view of a display module DM according to an embodiment of the present invention. 14 is a cross-sectional view of a display module according to an embodiment of the present invention. Hereinafter, a detailed description of the same configuration as that described with reference to FIGS. 1 to 11B will be omitted.

12A and 12B , the display module DM includes a first non-bending area NBA1, a first non-bending area NBA1, and a second non-bending area spaced apart from each other in the first direction DR1. NBA2), and a bending area BA defined between the first non-bending area NBA1 and the second non-bending area NBA2. The display area DA may be included in the first non-bending area NBA1. Portions of the non-display area NDA correspond to the second non-bending area NBA2 and the bending area BA, respectively, and a portion of the non-display area NDA adjacent to the display area DA is the first non-bending area ( Included in NBA1).

The bending area BA may be bent such that the bending axis BX is defined along the second direction DR2 orthogonal to the first direction DR1 . The second non-bending area NBA2 faces the first non-bending area NBA1. The bending area BA and the second non-bending area NBA2 may have a width in the second direction DR2 smaller than that of the first non-bending area NBA1 . Although not shown separately, the display module DM shown in FIG. 1 may also include a bending area corresponding to the bending area BA.

As shown in FIG. 13 , even if the bending area BA is provided, it may have the same planar structure as that of FIG. 11A . Accordingly, as shown in the arrow shown in FIG. 11A , the penetration path of moisture may be blocked. This is because the touch inorganic layer TS-IL1 contacts a portion of the second intermediate inorganic layer 20 exposed from the organic layer of the display panel DP in the non-display area NDA.

14 , a groove GRV exposing the non-display area NDA of the base layer SUB may be defined in the buffer layer BFL and the intermediate inorganic layers 10 and 20 . A dummy organic pattern DOP may be disposed inside the groove GRV. Since the inorganic layer is removed from the bending area BA, stress in the bending area BA may be reduced, and cracks in the intermediate inorganic layers 10 and 20 may be prevented.

15 is a perspective view of a display module DM according to an embodiment of the present invention. 16 is a plan view of a display module DM according to an embodiment of the present invention. 17 is a cross-sectional view of a display module DM according to an embodiment of the present invention. Hereinafter, a detailed description of the same configuration as that described with reference to FIGS. 1 to 13 will be omitted.

15 and 16 , the display module DM includes a first non-bending area NBA1, a second non-bending area NBA2, a first bending area BA1, and a second bending area BA2. , and a third bending area BA3 . The display module DM shown in FIGS. 12A and 12B further includes a second bending area BA2 and a third bending area BA3 .

The second bending area BA2 and the third bending area BA3 are spaced apart from each other in the second direction DR2 with the first non-bending area NBA1 interposed therebetween. The second bending area BA2 and the third bending area BA3 may have a greater radius of curvature than the first bending area BA1 . A pixel PX (refer to FIG. 3 ) may be disposed in a portion of the second bending area BA2 and the third bending area BA3 .

16 and 17 , the second bending area BA2 and the third bending area BA3 are disposed outside the edge of the intermediate inorganic layer 30 , and the edge of the intermediate inorganic layer 30 is Inorganic material lines DM-CP extending along the line may be disposed.

The inorganic lines DM-CP may be spaced apart from each other along the second direction DR2 and may extend along the first direction DR1 . Each of the inorganic lines DM-CP may include a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 may have the same thickness as the first intermediate inorganic layer 10 and include the same material. The second layer DM-C2 may have the same thickness as the second intermediate inorganic layer 20 and include the same material.

The inorganic touch layer TS-IL1 may be spaced apart from the inorganic lines DM-CP. The touch organic layer TS-IL2 overlaps the inorganic lines DM-CP. The touch organic layer TS-IL2 may contact the inorganic lines DM-CP. The touch organic layer TS-IL2 may completely cover the inorganic lines DM-CP to contact the buffer layer BFL.

When an external shock is applied to the edge of the display module DM, the inorganic lines DM-CP are broken to absorb the shock. The touch organic layer TS-IL2 stops cracks of the inorganic lines DM-CP and prevents them from expanding into cracks of other components.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field will not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

T1: first thin film transistor T2: second thin film transistor
OLED: organic light emitting diode DMP: dam part
BNP: Bank 10: Intermediate organic film
20, 30: intermediate inorganic film TFE: thin film encapsulation layer
TS-IS1: Touch Barrier

Claims (15)

a base layer including a display area and a non-display area disposed outside the display area;
an intermediate inorganic layer overlapping the display area and the non-display area;
an intermediate organic layer disposed on the intermediate inorganic layer and exposing a portion of the intermediate inorganic layer in the non-display area;
a transistor disposed on the base layer and overlapping the display area;
a display device disposed on the intermediate organic layer and overlapping the display area;
a first encapsulation inorganic layer disposed on the intermediate organic layer and covering the display device; an encapsulation organic layer disposed on the first encapsulation inorganic layer;
a second encapsulation inorganic layer disposed on the encapsulation organic layer;
a plurality of first touch electrodes disposed on the second encapsulation inorganic layer;
second touch electrodes disposed on the second encapsulation inorganic layer and intersecting the plurality of first touch electrodes; and
a touch inorganic layer disposed on the second encapsulation inorganic layer, overlapping the display area and the non-display area, and in contact with the portion of the intermediate inorganic layer exposed by the intermediate organic layer;
At least one of the first encapsulation inorganic layer and the second encapsulating inorganic layer includes a first area overlapping the display area and a second area overlapping the non-display area and having a smaller film thickness than the first area; ,
Each of the first touch electrodes includes a plurality of first portions arranged in a second direction and a plurality of second portions each connecting two adjacent first portions of the plurality of first portions,
Each of the second touch electrodes includes a plurality of third portions arranged along a first direction intersecting the second direction, and a plurality of third portions each connecting two adjacent third portions of the plurality of third portions. contains 4 parts,
the first parts have a shape different from the second parts, and the third parts have a different shape than the fourth parts;
The first portions, the third portions, and the fourth portions are disposed on the same layer, and the second portions are disposed on a different layer from the first portions. The method of claim 1,
On the upper surface of the base layer, an edge of the intermediate organic layer is disposed inside the edge of the intermediate inorganic layer. The method of claim 1,
A film thickness of the second region of at least one of the first encapsulating inorganic layer and the second encapsulating inorganic layer becomes smaller as the distance from the first region increases. The method of claim 1,
and a dam portion disposed outside an edge of the intermediate organic layer and extending along the edge of the intermediate organic layer. The method of claim 1,
The first parts, the third parts, and the fourth parts are disposed above the touch inorganic layer, and the second parts are disposed below the touch inorganic layer. 6. The method of claim 5,
an insulating layer disposed on the touch inorganic layer and covering the first parts, the third parts, and the fourth parts;
The insulating layer is a display module including an inorganic material or an organic material. The method of claim 1,
The non-display area includes a first non-bending area, a second non-bending area spaced apart from the first non-bending area in a first direction, and a bending area defined between the first non-bending area and the second non-bending area. including,
The bending area is bent such that a bending axis is defined along a second direction orthogonal to the first direction. The method of claim 1,
the intermediate inorganic layer has a groove exposing a portion of the non-display area of the base layer;
A display module having a dummy organic pattern disposed inside the groove. The method of claim 1,
The display module further comprising inorganic lines disposed outside the edge of the intermediate inorganic layer and extending along the edge of the intermediate inorganic layer. 10. The method of claim 9,
The touch inorganic film is a display module spaced apart from the inorganic lines. 10. The method of claim 9,
Further comprising an insulating layer disposed on the touch inorganic layer,
The first parts, the third parts, and the fourth parts are disposed on the upper side of the touch inorganic layer, and the second parts are disposed on the lower side of the touch inorganic layer,
the insulating layer covers the first parts, the third parts, and the fourth parts;
The insulating layer is a display module including an inorganic material or an organic material. 12. The method of claim 11,
and the insulating layer overlaps the inorganic lines. The method of claim 1,
An adhesive layer is not disposed between the second encapsulation inorganic layer and the plurality of first touch electrodes,
A display module in which an adhesive layer is not disposed between the second encapsulation inorganic layer and the plurality of second touch electrodes. The method of claim 1,
The display device includes a first electrode, a light emitting layer disposed on the first electrode, and a second electrode disposed on the light emitting layer,
and a capping layer disposed on the second electrode and the first encapsulation inorganic layer to cover the second electrode. The method of claim 1,
The display module further comprising an inorganic layer or an organic layer disposed between the second encapsulation inorganic layer and the touch inorganic layer.

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