KR102078175B1 - Display module - Google Patents

Abstract

The display module includes a display area on a plane and a non-display area disposed outside the display area. The display module includes a base layer, a circuit element layer, a display element layer, a thin film encapsulation layer, and a touch sensing layer. The inorganic film of the touch sensing layer is in contact with the inorganic film of the circuit element layer exposed by the organic film of the circuit element layer. The inorganic film of the thin film encapsulation layer is disposed between the inorganic film of the touch sensing layer and the inorganic film of the circuit element layer, thereby blocking the moisture penetration path that causes the thin film encapsulation layer to peel off.

Description

Display module {DISPLAY MODULE}

The present invention relates to a display module and a touch sensing unit integrated display panel.

Various display devices for multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, game machines, and the like are being developed. Input devices for display devices include a keyboard or a mouse. Also, recently, display devices include a touch panel as an input device.

It is an object of the present invention to provide a display module with reduced defects.

The display module according to an exemplary embodiment of the present invention includes a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, a thin film encapsulation layer, and a touch sensing layer. The base layer includes a display area and a non-display area disposed outside the display area. The circuit element layer includes an intermediate inorganic layer overlapping the display region and the non-display region, an intermediate organic layer disposed on the intermediate inorganic layer and exposing a portion of the intermediate inorganic layer in the non-display region, and a circuit element. do. The display element layer includes display elements arranged in the display area. The thin film encapsulation layer includes a first encapsulation inorganic layer including a first area overlapping the display area and a second area overlapping the non-display area and having a smaller thickness than the first area.

The touch sensing layer includes a plurality of touch electrodes and a touch inorganic layer overlapping the display area and the non-display area and contacting the intermediate inorganic layer exposed by the intermediate organic layer.

On the upper surface of the base layer, the edge of the intermediate organic layer may be disposed inside the edge of the intermediate inorganic layer.

The film thickness of the second region may be smaller as it moves away from the first region.

The semiconductor device may further include a dam unit disposed outside the edge of the intermediate organic layer and extending along the edge of the intermediate organic layer. The dam portion may surround the edge of the intermediate organic layer.

The circuit device may include electrically connected signal lines connected to the display elements and signal pads connected to ends of the signal lines. The non-display area may include a pad area in which the signal pads are disposed.

A portion of the dam portion may be parallel to the pad area.

The bank may further include a bank disposed between the portion of the dam portion and the pad area and parallel to the portion of the dam portion.

The dam portion and the bank may be disposed on the intermediate inorganic layer, and the bank may have a height greater than that of the dam portion. The first encapsulation inorganic layer may overlap the dam unit and the bank.

The display device may further include an outer organic layer connected to the bank, spaced apart from the intermediate organic layer, and disposed between the display area and the pad area.

The edge of the outer organic layer may be disposed inside the edge of the touch inorganic layer, and the edge of the touch inorganic layer may be disposed inside the edge of the intermediate inorganic layer.

A portion of the first encapsulation inorganic layer that is not overlapped with the outer organic layer may be disposed between the intermediate inorganic layer and the touch inorganic layer, and may contact the intermediate inorganic layer and the touch inorganic layer.

The non-display area may include a first non-bending area, a second non-bending area spaced apart from the first non-bending area in a first direction, and a bending area defined between the first non-bending area and the second non-bending area. It may include.

The bending area may be bent such that a bending axis is defined along a second direction orthogonal to the first direction.

The intermediate inorganic layer may have a groove exposing a portion of the non-display area of the base layer, and a dummy organic pattern may be disposed inside the groove.

It may further include inorganic lines disposed outside the edge of the intermediate inorganic film, extending along the edge of the intermediate inorganic film. The touch inorganic layer may be spaced apart from the inorganic lines.

The touch sensing layer may further include a touch organic layer disposed on the touch inorganic layer and covering the touch electrodes. The touch organic layer may overlap the inorganic lines.

The thin film encapsulation layer further includes a second encapsulation inorganic film disposed between the display element layer and the first encapsulation inorganic film, and an encapsulation organic film disposed between the first encapsulation inorganic film and the second encapsulation inorganic film. can do.

According to the above, even if the sealing inorganic film has a second region having a low film density, the sealing inorganic film is not peeled off. This is because the inorganic film of the touch sensing layer is directly deposited on the inorganic film of the display panel to compress the encapsulating inorganic film disposed therebetween. In addition, the inorganic film of the touch sensing layer is directly deposited on the inorganic film of the display panel to block the penetration path of moisture.

1 is a perspective view of a display module according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of a display module according to an exemplary embodiment of the present invention.
3 is a plan view of a display panel according to an exemplary embodiment of the present invention.
4 is an equivalent circuit diagram of a pixel according to an exemplary embodiment of the present invention.
5 is an enlarged cross-sectional view of a display panel according to an exemplary embodiment of the present invention.
6A is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
6B is a plan view of a touch sensing unit according to an embodiment of the present invention.
7A is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
7B is a plan view of a touch sensing unit according to an embodiment of the present invention.
8A to 8C are enlarged cross-sectional views of a display module according to an exemplary embodiment of the present invention.
9A and 9B are plan views illustrating manufacturing steps of a display module according to an exemplary embodiment of the present invention.
10A to 10C illustrate a process of forming the thin film encapsulation layer illustrated in FIGS. 9A and 9B.
11A and 11B are plan views illustrating a display module according to an exemplary embodiment of the present invention and a display module according to a comparative example.
12A and 12B are perspective views of a display module according to an exemplary embodiment of the present invention.
13 is a plan view of a display module according to an exemplary embodiment of the present invention.
14 is a cross-sectional view of a display module according to an embodiment of the present invention.
15 is a perspective view of a display module according to an embodiment of the present invention.
16 is a plan view of a display module according to an exemplary embodiment of the present invention.
17 is a cross-sectional view of a display module according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, when a component (or region, layer, portion, etc.) is referred to as being on, "connected", or "coupled" to another component, it is directly connected / connected on the other component. It can be combined or a third component can be arranged between them.

Like reference numerals refer to like elements. In addition, in the drawings, the thickness, ratio, and dimensions of the components are exaggerated for the effective description of the technical contents. “And / or” includes all one or more combinations in which associated configurations may be defined.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Also, terms such as "below", "below", "above", and "above" are used to describe the association of the components shown in the drawings. The terms are described in a relative concept based on the directions indicated in the drawings.

The terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described on the specification, but one or more other features, numbers, steps It is to be understood that the present invention does not exclude, in advance, the possibility of the addition or the presence of any operation, component, part or combination thereof.

1 is a perspective view of a display module DM according to an exemplary embodiment of the present invention. 2 is a cross-sectional view of a display module DM according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the display surface IS on which the image IM is displayed is parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2. The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display module DM. The front (or top) and back (or bottom) surfaces of the members are separated by the third direction axis DR3. However, a direction indicated by the first to third direction axes DR1, DR2, and DR3 may be converted to another direction as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals in directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively.

The display module DM according to the present embodiment may be a flat rigid display module. However, the present invention is not limited thereto, and the display module according to the present invention may be a flexible display module DM. The display module DM according to the present exemplary embodiment may be applied to a large electronic device such as a television, a monitor, and the like, and a small and medium electronic device such as a mobile phone, a tablet, a car navigation device, a game machine, a smart watch, and the like.

As shown in FIG. 1, the display module DM includes a display area DM-DA on which an image IM is displayed and a non-display area DM-NDA adjacent to the display area DM-DA. The non-display area DM-NDA is an area where no image is displayed. 1 illustrates a vase as an example of an image IM. For example, the display area DM-DA may have a rectangular shape. The non-display area DM-NDA may surround the display area DM-DA. However, the present invention is not limited thereto, and the shape of the display area DM-DA and the non-display area DM-NDA may be relatively designed.

2 is a cross-sectional view of a display module DM according to an exemplary embodiment of the present invention. 2 illustrates a cross section defined by the first direction axis DR1 and the third direction axis DR3.

As shown in FIG. 2, the display module DM includes a display panel DP and a touch sensing unit TS or a touch sensing layer. Although not separately illustrated, the display module DM according to an exemplary embodiment of the present invention may include a protection member disposed on the bottom surface of the display panel DP, an antireflection member disposed on the top surface of the touch sensing unit TS, and / or It may further include a window member.

The display panel DP may be a light emitting display panel, and is not particularly limited. For example, the display panel DP may be an organic light emitting display panel or a quantum dot light emitting display panel. In the organic light emitting display panel, the light emitting layer includes an organic light emitting material. In the quantum dot light emitting display panel, the light emitting layer includes a quantum dot and a quantum rod. Hereinafter, the display panel DP is described as an organic light emitting display panel.

The display panel DP includes a base layer SUB, a circuit element layer DP-CL disposed on the base layer SUB, a display element layer DP-OLED, and a thin film encapsulation layer TFE. Although not separately illustrated, the display panel DP may further include functional layers such as an antireflection layer, a refractive index control layer, and the like.

The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate. The display area DM-DA and the non-display area DM-NDA described with reference to FIG. 1 may be identically defined in the base layer SUB.

The circuit element layer DP-CL includes at least one intermediate insulating layer and a circuit element. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit element includes signal lines, a driving circuit of a pixel, and the like. Detailed description thereof will be described later.

The display element layer DP-OLED includes at least organic light emitting diodes. The display element layer DP-OLED may further include an organic layer, such as a pixel defining layer.

The thin film encapsulation layer TFE seals the display element layer DP-OLED. The thin film encapsulation layer TFE includes at least one inorganic film (hereinafter, referred to as an encapsulating inorganic film). The thin film encapsulation layer TFE may further include at least one organic film (hereinafter, referred to as an encapsulation organic film). The encapsulation inorganic layer protects the display element layer (DP-OLED) from moisture / oxygen, and the encapsulation organic layer protects the display element layer (DP-OLED) from foreign matter such as dust particles. The encapsulating inorganic layer may include a silicon nitride layer, a silicon oxy nitride layer and a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, or the like. The encapsulation organic layer may include an acryl-based organic layer, but is not limited thereto.

The touch sensing unit TS obtains coordinate information of an external input. The touch sensing unit TS is disposed directly on the organic light emitting display panel DP. As used herein, “directly disposed” means formed by a continuous process except for attaching using a separate adhesive layer.

The touch sensing unit TS may have a multilayer structure. The touch sensing unit TS may include a single layer or multiple conductive layers. The touch sensing unit TS may include a single layer or a multilayer insulating layer.

The touch sensing unit TS may sense an external input in a capacitive manner, for example. In the present invention, the operation method of the touch sensing unit TS is not particularly limited, and in one embodiment of the present invention, the touch sensing unit TS may sense an external input by an electromagnetic induction method or a pressure sensing method.

3 is a plan view of a display panel DP according to an exemplary embodiment of the present invention. 4 is an equivalent circuit diagram of a pixel PX according to an exemplary embodiment of the present invention. 5 is an enlarged cross-sectional view of a display panel DP according to an exemplary embodiment of the present invention.

As shown in FIG. 3, the display panel DP includes a display area DA and a non-display area NDA on a plane. In the present embodiment, the non-display area NDA may be defined along the edge of the display area DA. The display area DA and the non-display area NDA of the display panel DP correspond to the display area DD-DA and the non-display area DD-NDA of the display module DM shown in FIG. 1, respectively. . The display area DA and the non-display area NDA of the display panel DP are not necessarily the same as the display area DD-DA and the non-display area DD-NDA of the display module DM. It may be changed according to the structure / design of the panel DP.

The display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, and a plurality of pixels PX. The plurality of pixels PX is disposed in the display area DA. Each of the pixels PX includes an organic light emitting diode and a pixel driving circuit connected thereto. The driving circuit GDC, the plurality of signal lines SGL, and the pixel driving circuit may be included in the circuit element layer DP-CL shown in FIG. 2.

The driving circuit GDC may include a scan driving circuit. The scan driving circuit GDC generates a plurality of scan signals and sequentially outputs the plurality of scan signals to a plurality of scan lines GL which will be described later. The scan driving circuit GDC may further output another control signal to the driving circuit of the pixels PX.

The scan driving circuit GDC may include a plurality of thin film transistors formed through the same process as the driving circuit of the pixels PX, for example, a low temperature polycrystaline silicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

The signal lines SGL include scan lines GL, data lines DL, a power line PL, and a control signal line CSL. The scan lines GL are respectively connected to the corresponding pixels PX of the plurality of pixels PX, and the data lines DL are respectively connected to the corresponding pixels PX of the plurality of pixels PX. do. The power line PL is connected to the plurality of pixels PX. The control signal line CSL may provide control signals to the scan driving circuit GDC.

The display panel DP includes signal pads DP-PD connected to ends of the signal lines SGL. The signal pads DP-PD may be a kind of circuit element. An area in which the signal pads DP-PD are disposed in the non-display area NDA is defined as a pad area NDA-PD. In the pad area NDA-PD, touch pads TS-PD connected to touch signal lines to be described later may also be disposed.

The display panel DP may include a dam unit DMP. The dam part DMP may extend along the edge of the display area DA. The dam part DMP may surround the display area DA. A portion of the dam part DMP may be parallel to the pad area NDA-PD.

 The display panel DP may include a bank BNP. The bank BNP may be disposed between the display area DA and the pad area NDA-PD. The bank BNP may be parallel to a portion of the dam portion DMP and the pad area NDA-PD. In an embodiment of the present disclosure, at least one of the dam unit DMP and the bank BNP may be omitted.

In FIG. 4, one scan line GL, one data line DL, and a pixel PX connected to the power line PL are illustrated. The configuration of the pixel PX is not limited thereto and may be modified.

The organic light emitting diode OLED may be a top emission diode or a bottom emission diode. The pixel PX is a pixel driving circuit for driving the organic light emitting diode OLED, and includes a first transistor T1 or a switching transistor, a second transistor T2 or a driving transistor, and a capacitor Cst. The first power supply voltage ELVDD is provided to the second transistor T2, and the second power supply voltage ELVSS is provided to the organic light emitting diode OLED. The second power supply voltage ELVSS may be lower than the first power supply voltage ELVDD.

The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cst charges a voltage corresponding to the data signal received from the first transistor T1.

The second transistor T2 is connected to the organic light emitting diode OLED. The second transistor T2 controls the driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor Cst. The organic light emitting diode OLED emits light during the turn-on period of the second transistor T2.

FIG. 5 is a partial cross-sectional view of the display panel DP corresponding to the equivalent circuit shown in FIG. 4. The circuit element layer DP-CL, the display element layer DP-OLED, and the thin film encapsulation layer TFE are sequentially disposed on the base layer SUB.

The circuit device layer DP-CL includes at least one inorganic film, at least one organic film, and a circuit device. The circuit element layer DP-CL includes a buffer film BFL as an inorganic film, a first intermediate inorganic film 10, and a second intermediate inorganic film 20, and includes an intermediate organic film 30 as an organic film. can do.

The inorganic layers may include silicon nitride, silicon oxy nitride, silicon oxide, and the like. The organic film is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin It may include. The circuit element includes conductive patterns and / or semiconductor patterns.

The buffer film BFL improves the bonding force between the base layer SUB and the conductive patterns or the semiconductor patterns. Although not separately illustrated, a barrier layer may be further disposed on the top surface of the base layer SUB to prevent foreign substances from entering. The buffer film BFL and the barrier layer may be selectively disposed / omitted.

The semiconductor pattern OSP1 (hereinafter referred to as a first semiconductor pattern) of the first transistor T1 and the semiconductor pattern OSP2 (hereinafter referred to as a second semiconductor pattern) of the second transistor T2 are disposed on the buffer film BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 may be selected from amorphous silicon, polysilicon, and metal oxide semiconductors.

The first intermediate inorganic layer 10 is disposed on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2. On the first intermediate inorganic layer 10, a control electrode GE1 (hereinafter referred to as first control electrode) of the first transistor T1 and a control electrode GE2 (hereinafter referred to as second control electrode) of the second transistor T2 are disposed. do. The first control electrode GE1 and the second control electrode GE2 may be manufactured according to the same photolithography process as the scan lines GL (see FIG. 5A).

The second intermediate inorganic film 20 covering the first control electrode GE1 and the second control electrode GE2 is disposed on the first intermediate inorganic film 10. The input electrode DE1 of the first transistor T1 (hereinafter, referred to as a first input electrode), the output electrode SE1 (the first output electrode), and the input electrode of the second transistor T2 on the second intermediate inorganic layer 20. (DE2: second input electrode) and output electrode SE2 (second output electrode) are disposed.

The first input electrode DE1 and the first output electrode SE1 have a first through hole CH1 and a second through hole CH2 passing through the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. Are respectively connected to the first semiconductor pattern OSP1. The second input electrode DE2 and the second output electrode SE2 have a third through hole CH3 and a fourth through hole CH4 penetrating the first intermediate inorganic layer 10 and the second intermediate inorganic layer 20. Are respectively connected to the second semiconductor pattern OSP2. Meanwhile, in another embodiment of the present invention, some of the first transistor T1 and the second transistor T2 may be modified to have a bottom gate structure.

The intermediate organic layer 30 covering the first input electrode DE1, the second input electrode DE2, the first output electrode SE1, and the second output electrode SE2 on the second intermediate inorganic layer 20. ) Is placed. The intermediate organic film can provide a flat surface.

The display element layer DP-OLED is disposed on the intermediate organic layer 30. The display element layer DP-OLED may include a pixel definition layer PDL and an organic light emitting diode OLED. The pixel definition layer PDL may include an organic material like the intermediate organic layer 30. The first electrode AE is disposed on the intermediate organic layer 30. The first electrode AE is connected to the second output electrode SE2 through the fifth through hole CH5 penetrating the intermediate organic layer 30. An opening OP is defined in the pixel definition layer PDL. The opening OP of the pixel definition layer PDL exposes at least a portion of the first electrode AE.

The pixel PX may be disposed in the pixel area on a plane. The pixel area may include a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA may surround the light emitting area PXA. In the present exemplary embodiment, the emission area PXA is defined to correspond to a partial area of the first electrode AE exposed by the opening OP.

The hole control layer HCL may be disposed in common in the light emitting area PXA and the non-light emitting area NPXA. Although not separately illustrated, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (see FIG. 3).

The emission layer EML is disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the opening OP. That is, the emission layer EML may be formed separately from each of the plurality of pixels PX. The emission layer EML may include an organic material and / or an inorganic material. Although the patterned emission layer EML is illustrated in the exemplary embodiment, the emission layer EML may be commonly disposed in the plurality of pixels PX. In this case, the emission layer EML may generate white light. In addition, the emission layer EML may have a multilayer structure.

The electronic control layer ECL is disposed on the emission layer EML. Although not separately illustrated, the electronic control layer ECL may be formed in common with the plurality of pixels PX (see FIG. 3).

The second electrode CE is disposed on the electronic control layer ECL. The second electrode CE is commonly disposed in the plurality of pixels PX.

The thin film encapsulation layer TFE is disposed on the second electrode CE. The thin film encapsulation layer TFE is commonly disposed in the plurality of pixels PX. In this embodiment, the thin film encapsulation layer TFE directly covers the second electrode CE. In one embodiment of the present invention, a capping layer covering the second electrode CE may be further disposed between the thin film encapsulation layer TFE and the second electrode CE. In this case, the thin film encapsulation layer TFE may directly cover the capping layer.

6A is a cross-sectional view of the touch sensing unit TS according to an embodiment of the present invention. 6B is a plan view of a touch sensing unit according to an embodiment of the present invention. 7A is a cross-sectional view of the touch sensing unit TS according to an embodiment of the present invention. 7B is a plan view of a touch sensing unit according to an embodiment of the present invention.

As shown in FIG. 6A, the touch sensing unit TS includes a first conductive layer TS-CL1, a first insulating layer TS-IL1 (hereinafter referred to as a first touch insulating layer), and a second conductive layer TS-CL2. ), And a second insulating layer TS-IL2 (hereinafter, referred to as a second touch insulating layer). The first conductive layer TS-CL1 is disposed directly on the thin film encapsulation layer TFE. The inorganic layer or the organic layer may be further disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single layer structure or may have a multilayer structure stacked along the third direction axis DR3. The multilayered conductive layer may include at least two of the transparent conductive layers and the metal layers. The conductive layer of the multilayer structure may include metal layers including different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The metal layer may comprise molybdenum, silver, titanium, copper, aluminum, and alloys thereof. For example, each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a three-layer structure of titanium / aluminum / titanium.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, the first conductive layer TS-CL1 includes first conductive patterns, and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic material or an organic material. At least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic film. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide silicon oxynitride, zirconium oxide, and hafnium oxide.

At least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an organic layer. The organic film is at least one of acrylic resin, methacryl resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. It may include. In the present exemplary embodiment, the first touch insulating layer TS-IL1 is described as a touch inorganic layer, and the second touch insulating layer TS-IL2 is described as a touch organic layer. As illustrated in FIG. 6B, the touch sensing unit TS may include first touch signals connected to the first touch electrodes TE1-1 to TE1-5 and the first touch electrodes TE1-1 to TE1-5. Second touch signal lines connected to the lines SL1-1 to SL1-5, the second touch electrodes TE2-1 to TE2-4, and the second touch electrodes TE2-1 to TE2-4 ( And touch pads TS connected to the first and second touch signal lines SL1-1 to SL1-5 and the second and second touch signal lines SL2-1 to SL2-4. The first touch signal lines SL1-1 to SL1-5 are connected to one ends of the first touch electrodes TE1-1 to TE1-5, respectively. The lines SL2-1 to SL2-4 are connected to both ends of the second touch electrodes TE2-1 to TE2-4, respectively. In one embodiment of the present invention, one touch signal lines SL1-1 are provided. To SL1-5 are also connected to both ends of the first touch electrodes TE1-1 to TE1-5, or the second touch signal lines SL2-1 to SL2-4 are second touch electrodes. Each of the terminals TE2-1 to TE2-4 may be connected to one end of each of the terminals TE2-1 to TE2-4, and FIG. 6B shows a dam unit DMP and a bank BNP provided in the display panel DP to indicate a relative position of the touch sensing unit TS. Each of the first touch electrodes TE1-1 to TE1-5 may have a mesh shape in which a plurality of touch openings are defined. Each of the plurality of first touch sensor parts SP1 and the plurality of first connection parts CP1 is arranged along the second direction DR2. Each of the first touch sensor parts SP1 connects two adjacent first touch sensor parts SP1 (not shown), but the first touch signal lines SL1-1 to SL1- are not shown. 5) may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-4 insulate and cross the first touch electrodes TE1-1 to TE1-5. Each of the second touch electrodes TE2-1 to TE2-4 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-4 includes a plurality of second touch sensor parts SP2 and a plurality of second connection parts CP2. The second touch sensor parts SP2 are arranged along the first direction DR1. Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 to which the second touch sensor parts SP2 are adjacent. The second touch signal lines SL2-1 to SL2-4 may also have a mesh shape.

The first touch electrodes TE1-1 through TE1-5 and the second touch electrodes TE2-1 through TE2-4 are electrostatically coupled. As touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-5, capacitors are formed between the first touch sensor parts SP1 and the second touch sensor parts SP2.

A plurality of first touch sensor units SP1, a plurality of first connection units CP1, first touch signal lines SL1-1 to SL1-5, a plurality of second touch sensor units SP2, and a plurality of first touch sensor units SP1 Some of the second connection parts CP2 and the second touch signal lines SL2-1 to SL2-4 are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A, and the other part thereof. 6 may be formed by patterning the second conductive layer TS-CL2 shown in Fig. 6A. In the present exemplary embodiment, the plurality of first connection parts CP1 is formed from the first conductive layer TS-CL1. A plurality of first touch sensor units SP1, first touch signal lines SL1-1 to SL1-5, a plurality of second touch sensor units SP2, a plurality of second connection units CP2, and a first The two touch signal lines SL2-1 to SL2-4 may be formed from the second conductive layer TS-CL2.

Although the touch sensing unit TS in which the plurality of first connecting portions CP1 and the plurality of second connecting portions CP2 cross each other is illustrated as an example, the present invention is not limited thereto. For example, each of the second connection parts CP2 may be deformed in a V shape so as not to overlap the plurality of first connection parts CP1. The V-shaped second connection parts CP2 may overlap the first touch sensor parts SP1. In the present exemplary embodiment, the first touch sensor parts SP1 and the second touch sensor parts SP2 having a rhombus or triangular shape are exemplarily illustrated, but the present invention is not limited thereto.

As shown in FIG. 7A, the touch sensing unit TS according to the exemplary embodiment of the present invention includes a single layer type touch sensing unit including a conductive layer TS-CL and an insulating layer TS-IL and a touch insulating layer. Can be. The tomography type touch sensing unit may acquire coordinate information by a self-cap method.

The conductive layer TS-CL may have a single layer structure or may have a multilayer structure stacked along the third direction axis DR3. The multilayered conductive layer may include at least two of the transparent conductive layers and the metal layers. The conductive layer TS-CL includes a plurality of patterns such as a touch electrode and touch signal lines. The touch insulating layer TS-IL includes at least an inorganic layer. The touch insulating layer may further include an organic layer.

The touch sensing unit TS includes touch electrodes TE and touch signal lines SL spaced apart from each other. The touch electrodes TE may be arranged in a matrix form and are respectively connected to the touch signal lines SL. The shape and arrangement of the touch electrodes TE are not particularly limited. Some of the touch signal lines SL may be disposed in the display area DA, and some may be disposed in the non-display area NDA. FIGS. 8A and 8B illustrate a display module according to an embodiment of the present invention. DM) is an enlarged cross-sectional view. FIG. 8A illustrates a cross section corresponding to II ′ of FIG. 6B, and FIG. 8B illustrates a cross section corresponding to II-II ′ of FIG. 6B. 8C shows a cross section corresponding to III-III ′ in FIG. 6B. 8B illustrates a cross section overlapping the data line DL, and FIG. 8C illustrates a cross section overlapping the touch signal line SL.

The stacked structure of the circuit element layer DP-CL, the display element layer DP-OLED, and the thin film encapsulation layer TFE disposed in the display area DA is the same as the structure described with reference to FIG. 5. Is omitted. However, the hole control layer HCL and the electronic control layer ECL are not shown in FIGS. 8A and 8B. The stacked structure of the touch sensing unit TS is also the same as the structure described with reference to FIGS. 6A and 6B, and thus a detailed description thereof will be omitted. A thin film including a first encapsulation inorganic film IOL1, a second encapsulation inorganic film IOL2, and an encapsulation organic film OL disposed between the first encapsulation inorganic film IOL1 and the second encapsulation inorganic film IOL2. Encapsulation layer (TFE) is shown by way of example.

As shown in FIGS. 8A and 8B, the scan driving circuit GDC constituting the circuit element layer DP-CL is disposed in the non-display area NDA. The scan driving circuit GDC includes at least one transistor GDC-T formed through the same process as the pixel transistor T2. The scan driving circuit GDC may include signal lines GDC-SL disposed on the same layer as the input electrode of the pixel transistor T2. Although not separately illustrated, the scan driving circuit GDC may further include a signal line disposed on the same layer as the control electrode of the pixel transistor T2.

The power supply electrode PWE providing the second power supply voltage ELVSS is disposed outside the scan driving circuit GDC. The power electrode PWE may receive a second power voltage from the outside. The connection electrode E-CNT is disposed on the intermediate organic layer 30. The connection electrode E-CNT connects the power electrode PWE and the second electrode CE. Since the connection electrode E-CNT is formed through the same process as the first electrode AE, the connection electrode E-CNT may include the same layer structure and the same material. The connection electrode E-CNT and the first electrode AE may have the same thickness.

One data line DL disposed on the second intermediate inorganic layer 20 is exemplarily illustrated. The signal pad DP-PD is connected to the end of the data line DL.

As shown in FIGS. 8A to 8C, the dam part DMP may have a multilayer structure. The lower portion DM1 may be formed simultaneously with the intermediate organic layer 30, and the upper portion DM2 may be simultaneously formed with the pixel definition layer PDL. The dam unit DMP prevents the liquid organic material from spreading to the outside of the intermediate inorganic layers 10 and 20 in the process of forming the encapsulation organic layer OL. The encapsulation organic layer OL may be formed on the first encapsulation inorganic layer IOL1 in which the liquid organic material is inkjet. In this case, the dam part DMP sets a boundary of an area in which the liquid organic material is disposed. .

The bank BNP may have a multilayer structure. The lower portion BN1 may be formed simultaneously with the intermediate organic layer 30, and the upper portion BN2 may be formed simultaneously with the pixel definition layer PDL. The upper portion BN2 has a stepped shape and includes an integrally formed first portion BN2-1 and a second portion BN2-2. The bank BNP is higher than the dam portion DMP by the height of the second portion BN2-2. The bank BNP supports a mask used during the formation of the encapsulation inorganic layers IOL1 and IOL2.

The circuit element layer DP-CL may further include an outer organic layer 30-O connected to the bank BNP. The outer organic layer 30-O may have a multilayer structure. The outer organic layer 30-O may include a lower portion formed simultaneously with the intermediate organic layer 30 and an upper portion formed simultaneously with the pixel definition layer PDL. The outer organic layer 30-O is spaced apart from the intermediate organic layer 30 and is disposed between the display area DA and the pad area NDA-PD.

The first encapsulation inorganic film IOL1 and the second encapsulation inorganic film IOL2 overlap the dam portion DMP. The first encapsulation inorganic film IOL1 and the second encapsulation inorganic film IOL2 also overlap the bank BNP. Since the intermediate organic film 30 and the dam part DMP are spaced apart from each other, and the dam part DMP and the bank BNP are spaced apart from each other, organic materials are not disposed in the areas therebetween. The first encapsulation inorganic layer IOL1 may contact the second intermediate inorganic layer 20 in the interregions. In FIG. 8B, a portion of the data line DL is disposed between the second intermediate inorganic film 20 and the first encapsulation inorganic film IOL1, but another data line DL is not disposed as shown in FIG. 8C. The first encapsulation inorganic film IOL1 and the second intermediate inorganic film 20 are in contact with each other in the region.

The touch inorganic film TS-IL1 overlaps the dam portion DMP and the bank BNP. The touch inorganic layer TS-IL1 contacts the intermediate organic layer 30, the dam unit DMP, and the bank BNP, and the second intermediate inorganic layer 20 exposed from the outer organic layer 30-O. . In FIG. 8B, the data line DL is disposed between the touch inorganic layer TS-IL1 and the second intermediate inorganic layer 20, but as shown in FIG. 8C, in another region in which the data line DL is not disposed. The touch inorganic film TS-IL1 is in contact with the second intermediate inorganic film 20.

9A and 9B are plan views illustrating manufacturing steps of the display module DM according to an exemplary embodiment of the present invention. 10A to 10C illustrate a process of depositing a thin film encapsulation layer (TFE) shown in FIGS. 9A and 9B.

FIG. 9A illustrates the edges of the second intermediate inorganic film 20, the intermediate organic film 30, the outer organic film 30-O, and the second encapsulation inorganic film IOL2 described with reference to FIGS. 8A to 8C in plan view. Shown. Although not separately illustrated, the first intermediate inorganic layer 10 may have substantially the same shape as the second intermediate inorganic layer 20 on a plane. The first encapsulation inorganic layer IOL1 may have a shape substantially the same as that of the second encapsulation inorganic layer IOL2. The shape of the edge of the encapsulation organic film OL may correspond to the shape of the dam part DMP. The buffer film BFL may have the same shape as the base layer SUB.

The second intermediate inorganic film 20 overlaps the display area DA and the non-display area NDA. The edge of the second intermediate inorganic film 20 has a shape similar to the edge of the base layer SUB. The edge of the second intermediate inorganic film 20 is disposed inside the edge of the base layer SUB and is disposed adjacent to the edge of the base layer SUB.

The intermediate organic layer 30 overlaps the display area DA and the non-display area NDA. The intermediate organic film 30 is disposed inside the second intermediate inorganic film 20. That is, the edge of the intermediate organic film 30 is disposed inside the edge of the second intermediate inorganic film 20. The edge of the intermediate organic layer 30 is disposed adjacent to the boundary of the display area DA and the non-display area NDA. Accordingly, the intermediate organic layer 30 exposes a portion of the second intermediate inorganic layer 20 in the non-display area NDA. The intermediate organic layer 30 may expose an edge portion of the second intermediate inorganic layer 20 in the non-display area NDA.

The outer organic layer 30-O is connected to the bank BNP, spaced apart from the intermediate organic layer 30, and disposed between the display area DA and the pad area NDA-PD. The outer organic layer 30-O exposes a portion of the second intermediate inorganic layer 20 in the non-display area NDA.

The second encapsulation inorganic film IOL2 overlaps the display area DA and the non-display area NDA. As shown in FIG. 9B, the second encapsulation inorganic layer IOL2 includes the first region IOL2-1 overlapping the display area DA and the second region IOL2-2 overlapping the non-display area NDA. ) May be included. The first area IOL2-1 may further overlap the non-display area NDA, and the second area IOL2-2 may non-overlap the display area DA.

The second region IOL2-2 is thinner than the first region IOL2-1. In addition, the second region IOL2-2 has a lower film density than the first region IOL2-1. This is because the second encapsulation inorganic film IOL2 was deposited using an open mask as described later. Although not separately illustrated, the first encapsulation inorganic layer IOL1 may also have a first region and a second region having a lower thickness than the first region. This is because the first encapsulation inorganic film IOL1 and the second encapsulation inorganic film IOL2 are formed using the same mask.

10A through 10C illustrate a process of forming the thin film encapsulation layer TFE shown in FIGS. 8A through 9B.

As shown in FIG. 10A, the same process is performed on the plurality of cell regions C-SUB set in the mother substrate MS to form the display module DM for each of the plurality of cell regions C-SUB. do. After the manufacturing process is completed, the mother substrate MS is cut to separate the display modules DM.

The first encapsulation inorganic film IOL1, the encapsulation organic film OL, and the second encapsulation inorganic film IOL1 shown in FIGS. 8A and 8C are sequentially formed, and the encapsulation organic film OL is the inkjet method described above. To form. The first encapsulation inorganic film IOL1 and the second encapsulation inorganic film IOL2 are formed through a deposition process described below. It demonstrates centering on the 2nd sealing inorganic film IOL2.

As shown in FIGS. 10A and 10B, the mask MSK in which the plurality of openings M-OP are defined is aligned with the mother substrate MS. The opening M-OP may correspond to the display area DA shown in FIGS. 9A and 9B. After the mask MSK is aligned, the mother substrate MS is disposed in the deposition chamber, and the inorganic material is deposited.

The display module DP-I shown in FIG. 10B has a form formed up to the display element layer DP-OLED of the display panel DP shown in FIG. 2. The mask MSK is supported by the bank BNP. Since a gap is maintained between the mask MSK and the display module DP-I, the inorganic material is deposited in a larger area than the opening M-OP. That is, the inorganic material is deposited not only in the display area DA but also in the non-display area NDA. As a result, a second encapsulation inorganic film IOL2 of the type shown in FIG. 9B is formed.

As shown in FIG. 10C, since the second region IOL2-2 of the second encapsulation inorganic layer IOL2 is a region overlapping the mask MSK, the amount of the inorganic material deposited is relatively small, and thus the first region IOL2-2 is reduced. It has a second thickness TH2 that is thinner than the first thickness TH1 of 1). The second thickness TH2 of the second region IOL2-2 becomes smaller as it moves away from the first region IOL2-1. In addition, the second region IOL2-2 has a smaller density than the first region IOL2-1. This is because the ashing gases used to remove organic residues before depositing the encapsulated inorganic film, such as N ₂ O, around the mask MSK, are present and hinder the deposition.

The second region IOL2-2 having a thin film thickness and small film density has a relatively weak bonding force with respect to the lower layer than the first region IOL2-1. In particular, when the undercoat is an organic film, moisture may penetrate between the interface of the inorganic film and the organic film, and the inorganic film may be separated. The first encapsulation inorganic layer IOL1 may be more easily peeled off than the second encapsulation inorganic layer IOL2 because the intermediate organic layer 30 or the pixel defining layer PDL, which is an organic layer, is disposed under the first encapsulation inorganic layer IOL1.

According to the present exemplary embodiment, the touch inorganic layer contacts the intermediate inorganic layer 20 exposed by the intermediate organic layer 30 in the non-display area NDA to prevent the inorganic layer from being peeled off. Hereinafter, with reference to FIGS. 11A and 11B will be described in more detail.

11A and 11B are plan views illustrating a display module DM and a display module DM-S according to a comparative example, according to an exemplary embodiment.

According to the present exemplary embodiment illustrated in FIG. 11A, in the non-display area NDA, the touch inorganic layer TS-IL1 contacts the second intermediate inorganic layer 20 exposed by the intermediate organic layer 30. . The corner area AA of the second encapsulation inorganic film IOL2 is indicated by a dotted line. In the corner area AA, the second encapsulation inorganic film IOL2 contacts the touch inorganic film TS-IL1. In the corner area AA, since the touch inorganic film TS-IL1 is in contact with the intermediate inorganic film 20, the second encapsulating inorganic film IOL2 disposed therebetween is sealed, so that the penetration path of moisture such as an arrow is reduced. Is blocked.

In addition, the touch inorganic layer TS-IL1 and the intermediate inorganic layer 20 are in contact with each other along the edge of the display area DP. The second encapsulation inorganic film IOL2 is sealed along the edge of the display area DP. Even in the pad region NDA-PD, the touch inorganic layer TS-IL1 and the intermediate inorganic layer 20 are in contact with each other.

 The edge of the touch inorganic film TS-IL1 may be disposed inside the edge of the second intermediate inorganic film 20. The edge of the outer organic film 30-O is disposed inside the edge of the touch inorganic film TS-IL1. The touch inorganic layer TS-IL1 may contact a portion of the second intermediate inorganic layer 20 exposed from the outer organic layer 30-O in the non-display area NDA. In the pad region NDA-PD, the second intermediate inorganic layer 20 and the touch inorganic layer TS-IL1 may contact each other.

According to the comparative example shown in FIG. 11B, the intermediate organic film 30 and the second intermediate inorganic film 20 have substantially the same shape on a plane. Since the touch inorganic film TS-IL1 is disposed on the intermediate organic film 30, the touch inorganic film TS-IL1 is not in contact with the second intermediate inorganic film 20. Water penetrated in the direction of the arrow peels off the encapsulating inorganic film. Especially the 2nd area | region of the sealing inorganic film with small film density can be peeled.

According to the present exemplary embodiment, defects due to moisture may be reduced compared to the display module DM-S according to the comparative example. As described above, the display panel DP includes a patterned organic layer, and the inorganic layer of the touch sensing layer TS contacts the exposed portion of the inorganic layer of the display panel DP.

12A and 12B are perspective views of a display module DM according to an exemplary embodiment of the present invention. 13 is a plan view of a display module DM according to an exemplary embodiment of the present invention. 14 is a cross-sectional view of a display module according to an embodiment of the present invention. Hereinafter, detailed description of the same configuration as the configuration described with reference to FIGS. 1 to 11B will be omitted.

As shown in FIGS. 12A and 12B, the display module DM may include a first non-bending area NBA1 and a second non-bending area spaced apart from the first non-bending area NBA1 in the first direction DR1. NBA2) and a bending area BA defined between the first non-bending area NBA1 and the second non-bending area NBA2. The display area DA may be included in the first non-bending area NBA1. Portions of the non-display area NDA respectively correspond to the second non-bending area NBA2 and the bending area BA, and a portion of the non-display area NDA adjacent to the display area DA is the first non-bending area ( NBA1).

The bending area BA may be bent such that the bending axis BX is defined along the second direction DR2 orthogonal to the first direction DR1. The second non-bending area NBA2 faces the first non-bending area NBA1. The bending area BA and the second non-bending area NBA2 may have a width of the second direction DR2 smaller than the first non-bending area NBA1. Although not separately illustrated, the display module DM shown in FIG. 1 may also include a bending area corresponding to the bending area BA.

As shown in FIG. 13, even if the bending area BA is provided, the same structure as that of FIG. 11A may be provided. Thus, as shown by the arrow shown in Figure 11a, the penetration path of moisture can be blocked. This is because the touch inorganic layer TS-IL1 contacts a portion of the second intermediate inorganic layer 20 exposed from the organic layer of the display panel DP in the non-display area NDA.

As illustrated in FIG. 14, grooves GRV exposing the non-display area NDA of the base layer SUB may be defined in the buffer layer BFL and the intermediate inorganic layers 10 and 20. The dummy organic pattern DOP may be disposed inside the groove GRV. As the inorganic film is removed from the bending area BA, stress of the bending area BA may be reduced, and cracks of the intermediate inorganic films 10 and 20 may be prevented.

15 is a perspective view of a display module DM according to an embodiment of the present invention. 16 is a plan view of a display module DM according to an exemplary embodiment of the present invention. 17 is a cross-sectional view of a display module DM according to an exemplary embodiment of the present invention. Hereinafter, detailed description of the same configuration as the configuration described with reference to FIGS. 1 to 13 will be omitted.

As shown in FIGS. 15 and 16, the display module DM includes a first non-bending area NBA1, a second non-bending area NBA2, a first bending area BA1, and a second bending area BA2. , And a third bending area BA3. A second bending area BA2 and a third bending area BA3 are further included in comparison with the display module DM shown in FIGS. 12A and 12B.

The second bending area BA2 and the third bending area BA3 are spaced apart from each other in the second direction DR2 with the first non-bending area NBA1 interposed therebetween. The second bending area BA2 and the third bending area BA3 may have a radius of curvature greater than that of the first bending area BA1. Pixels PX (see FIG. 3) may be disposed in portions of the second bending area BA2 and the third bending area BA3.

As shown in FIGS. 16 and 17, the second bending region BA2 and the third bending region BA3 are disposed outside the edges of the intermediate inorganic layer 30, and the edges of the intermediate inorganic layer 30 are formed. The extended inorganic lines DM-CP may be arranged.

The inorganic lines DM-CP may be spaced apart from each other along the second direction DR2 and may extend along the first direction DR1. Each of the inorganic lines DM-CP may include a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 may have the same thickness as the first intermediate inorganic layer 10 and may include the same material. The second layer DM-C2 has the same thickness as the second intermediate inorganic layer 20 and may include the same material.

The touch inorganic layer TS-IL1 may be spaced apart from the inorganic lines DM-CP. The touch organic layer TS-IL2 overlaps the inorganic lines DM-CP. The touch organic layer TS-IL2 may contact the inorganic lines DM-CP. The touch organic layer TS-IL2 may completely cover the inorganic lines DM-CP to contact the buffer layer BFL.

When an external shock is applied to the edge of the display module DM, the inorganic lines DM-CP are broken to absorb the shock. The touch organic layer TS-IL2 stops the cracks of the inorganic lines DM-CP and prevents the expansion of the cracks of other components.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art or those skilled in the art without departing from the spirit and scope of the invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope thereof.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

T1: first thin film transistor T2: second thin film transistor
OLED: organic light emitting diode DMP: dam
BNP: Bank 10: Intermediate Organic Film
20, 30: intermediate inorganic film TFE: thin film encapsulation layer
TS-IS1: touch inorganic film

Claims (18)

A base layer including a display area and a non-display area disposed outside the display area;
An intermediate inorganic film overlapping the display area and the non-display area, an intermediate organic film disposed on the intermediate inorganic film and exposing a portion of the intermediate inorganic film in the non-display area, and a circuit element; A circuit element layer disposed on the layer;
A display element layer disposed on the circuit element layer and including display elements arranged in the display area;
A first encapsulation inorganic film, an encapsulation organic film disposed on the first encapsulation inorganic film, and a second encapsulation inorganic film disposed on the encapsulation organic film, wherein the first encapsulation inorganic film and the second encapsulation inorganic film At least one thin film encapsulation layer including a first region overlapping the display region and a second region overlapping the non-display region and having a smaller thickness than the first region;
A touch sensing layer including a plurality of touch electrodes, a touch inorganic layer overlapping the display area and the non-display area and contacting the portion of the intermediate inorganic layer exposed by the intermediate organic layer,
The display inorganic layer is disposed on the second encapsulation inorganic layer and in contact with the second encapsulation inorganic layer. According to claim 1,
On the top surface of the base layer, the edge of the intermediate organic film is disposed inside the edge of the intermediate inorganic film. According to claim 1,
The display module of claim 2, wherein the film thickness of the second region becomes smaller as it moves away from the first region. According to claim 1,
And a dam portion disposed outside the edge of the intermediate organic film and extending along the edge of the intermediate organic film. The method of claim 4, wherein
And the dam portion surrounds the edge of the intermediate organic layer. The method of claim 4, wherein
The circuit device may include signal lines electrically connected to the display elements and signal pads connected to ends of the signal lines.
The non-display area includes a pad area in which the signal pads are disposed. The method of claim 6,
A portion of the dam portion is parallel to the pad region,
And a bank disposed between the portion of the dam portion and the pad area and parallel to the portion of the dam portion. The method of claim 7, wherein
And the dam portion and the bank are disposed on the intermediate inorganic layer, and the bank has a height greater than that of the dam portion. The method of claim 7, wherein
And the first encapsulation inorganic layer overlaps the dam and the bank. The method of claim 7, wherein
And an outer organic layer connected to the bank, spaced apart from the intermediate organic layer, and disposed between the display area and the pad area. The method of claim 10,
The edge of the outer organic film is disposed inside the edge of the touch inorganic film,
And the edge of the touch inorganic film is disposed inside the edge of the intermediate inorganic film. The method of claim 10,
A portion of the first encapsulation inorganic layer that is not overlapped with the outer organic layer is disposed between the intermediate inorganic layer and the touch inorganic layer and contacts the intermediate inorganic layer and the touch inorganic layer. According to claim 1,
The non-display area may include a first non-bending area, a second non-bending area spaced apart from the first non-bending area in a first direction, and a bending area defined between the first non-bending area and the second non-bending area. Including,
And the bending area is bent such that a bending axis is defined along a second direction orthogonal to the first direction. According to claim 1,
The intermediate inorganic layer has a groove exposing a portion of the non-display area of the base layer,
A display module in which a dummy organic pattern is disposed inside the groove. According to claim 1,
And an inorganic line disposed outside the edge of the intermediate inorganic layer and extending along the edge of the intermediate inorganic layer. The method of claim 15,
The display inorganic layer is spaced apart from the inorganic lines. The method of claim 15,
The touch sensing layer further includes a touch organic layer disposed on the touch inorganic layer and covering the touch electrodes. The method of claim 17,
The display organic layer overlaps the inorganic lines.

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