KR102446419B1 - Optical communication module - Google Patents

Abstract

The present invention discloses an optical communication module. The optical communication module is an optical communication module including a submount, a light emitting element and a light receiving element disposed on the submount, wherein the submount includes a pattern layer electrically connected to the light emitting element and the light receiving element, and an insulating layer and a conductive layer disposed to face the pattern layer with an interposed therebetween.
According to the present invention, there is provided an optical communication module capable of blocking errors in transmission/reception data due to crosstalk or crosstalk caused by propagation of high-frequency noise components between conductive patterns through which different signals are communicated.

Description

Optical communication module

The present invention relates to an optical communication module.

The optical communication module includes a light emitting element for converting an electrical signal into an optical signal and transmitting an optical signal through an optical fiber, and a light receiving element for converting an optical signal received through the optical fiber into an electrical signal can do.

The light emitting element and the light receiving element may be mounted on a sub-mount, and between a conductive pattern formed on the sub-mount and connected to the light emitting element and a conductive pattern connected to the light receiving element, errors such as crosstalk or crosstalk may occur. For example, due to crosstalk or crosstalk between conductive patterns through which different signals are communicated, errors may occur in transmitted data or received data due to mixing of high-frequency noise components.

An embodiment of the present invention includes an optical communication module capable of blocking errors in transmission/reception data due to crosstalk or crosstalk caused by propagation of high-frequency noise components between conductive patterns through which different signals are communicated.

In order to solve the above and other problems, the optical communication module of the present invention,

An optical communication module comprising a sub-mount, and a light-emitting element and a light-receiving element disposed on the sub-mount, the optical communication module comprising:

The sub-mount includes a pattern layer electrically connected to the light emitting device and the light receiving device, and a conductive layer disposed to face the pattern layer with an insulating layer interposed therebetween.

For example, the conductive layer may form a bypass capacitance that bypasses a high-frequency noise component communicating with the pattern layer to the conductive layer.

For example, the sub-mount may include a first region in which the light-receiving element and a pattern layer connected to the light-receiving element are disposed, and a second region excluding the first region.

For example, the light emitting device and a pattern layer connected to the light emitting device may be disposed in the second region.

For example, the conductive layer may be formed over the entire area of the submount including the first and second regions.

For example, the conductive layer may be selectively formed only in the first region.

For example, the conductive layer may be selectively formed only in the second region.

For example, the conductive layer may have an opening formed in a portion corresponding to the first region while covering the relatively wide second region.

For example, the sub-mount,

It may include a base substrate, the insulating layer formed on the base substrate, the conductive layer formed on the insulating layer, and the pattern layer formed on the conductive layer.

For example, the sub-mount, which is formed on the conductive layer, may further include an alignment guide for aligning the light emitting device and the light receiving device.

For example, the alignment guide may be formed to surround two different sides of the light emitting device and the light receiving device.

For example, some of the pattern layers among the pattern layers may be electrically connected to the light emitting device or the light receiving device by a wire extending from the sub-mount to a predetermined height.

For example, it may further include a signal transmission IC connected to the light emitting device to output an electrical signal, and a signal receiving IC connected to the light receiving device to receive an electrical signal.

For example, the signal transmission IC may include an image transmission IC for transmitting an image signal and an auxiliary signal transmission IC for transmitting an auxiliary signal,

The signal receiving IC may include an auxiliary signal receiving IC,

The light emitting device includes first to fourth light emitting devices connected to the image transmission IC and a fifth light emitting device connected to the auxiliary signal transmission IC,

The light receiving element may be connected to the IC for receiving the auxiliary signal.

For example, the IC for transmitting the image, the IC for transmitting the auxiliary signal, and the IC for receiving the auxiliary signal may be arranged to face different sides of the sub-mount.

For example, the first to fifth light emitting devices and the light receiving device may form an arrangement surrounding the center of the sub mount so as to face different sides of the sub mount on which the respective ICs are disposed.

According to the optical communication module of the present invention, by providing a bypass capacitance capable of bypassing the high-frequency noise component to the submount on which the light-emitting element and the light-receiving element are mounted, the high-frequency noise component can be removed, and different signals can be communicated Crosstalk or crosstalk caused by propagation of high-frequency noise components between conductive patterns to be used can be prevented.

1 is a diagram schematically showing an entire system to which the optical communication module of the present invention can be applied.
FIG. 2 is a diagram showing a planar structure of the optical communication module shown in FIG. 1 .
3 is a diagram schematically showing a cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 2 .
4 to 10, a view is shown for each process for forming the optical communication module shown in FIG. 2, and in each of FIGS. 4 to 10, (a) is a plan view of the optical communication module according to each process It shows the structure, and (b) shows the schematic cross-sectional structure of the optical communication module according to each process.
11 is a diagram showing a planar structure of an optical communication module according to another embodiment of the present invention.
FIG. 12 is a view showing a schematic cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 11 .
13 is a view for explaining the formation of the optical communication module shown in FIG. 11. In FIG. 13, (a) shows a planar structure of the optical communication module according to the illustrated process, (b) is the illustrated It shows the schematic cross-sectional structure of the optical communication module according to the process.
14 is a view showing a planar structure of an optical communication module according to another embodiment of the present invention.
15 is a diagram showing a schematic cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 14 .
16 is a view for explaining the formation of the optical communication module shown in FIG. 14. In FIG. 16, (a) shows a planar structure of the optical communication module according to the illustrated process, (b) is the illustrated It shows the schematic cross-sectional structure of the optical communication module according to the process.

Hereinafter, an optical communication module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a diagram schematically showing an entire system to which the optical communication module M of the present invention can be applied. Referring to the drawings, a source device as an AV source that generates a video signal and a sink device for realizing a video image from the video signal of the source device perform data communication through an optical fiber (F) for mediating optical communication. The optical communication module M according to an embodiment of the present invention may be interposed between the source device and the optical fiber F and between the sink device and the optical fiber F, respectively.

The optical communication module (M) according to an embodiment of the present invention is interposed between the source device and the optical fiber (F) and functions as a transmission module (T) for transmitting data of the source device through the optical fiber (F), or Alternatively, it may function as a receiving module R that is interposed between the sink device and the optical fiber F and transmits data received through the optical fiber F to the sink device.

Hereinafter, the optical communication module (M) functioning as the transmission module (T) is mainly described, but the optical communication module (M) of the present invention may also function as the reception module (R), the transmission module (T) or The optical communication module M functioning as the receiving module R is to perform bidirectional communication, respectively, and each of the transmitting module T and the receiving module R is a light emitting element TX and a light receiving element RX. may include

For example, the source device is an AV source that generates a video signal, and may be exemplified by a computer, a game machine, a mobile phone, a digital camera, etc., and the sink device is configured to implement a video image from the video signal of the source device. As such, it may be an image device such as a television or a projector.

The optical communication module (M) according to an embodiment of the present invention is connected between any one of a source device and a sink device and the optical fiber (F) to convert an electrical signal into an optical signal and convert the optical signal to the optical fiber (F). ) through a light emitting device (TX) for transmitting an optical signal to the other device, and a light receiving device (RX) for converting the optical signal received from the other device through the optical fiber (F) into an electrical signal and transmitting it. may include

In the optical communication module M functioning as the transmission module T, the light emitting element TX may include first to fourth light emitting elements TX1, TX2, TX3, TX4 for transmitting the main data signal. and may include a fifth light emitting element TX5 for transmitting auxiliary data. For example, the first to fourth light emitting devices TX1, TX2, TX3, and TX4 are channels for transmitting R, G, and B video data in synchronization with a pixel clock, and include three transition-minimized differential signaling (TMDS). ) channels (L1, L2, L3) and a TMDS clock channel (CLK) can be formed as a channel for transmitting the TMDS clock. The fifth light emitting element TX5 and the light receiving element RX relate to Extended Display Identification Data (EDID), which is configuration information and control information of the sink device, and Display Port Configuration Data (DPCD), which is reception condition information of the sink device. A channel for transmitting and receiving auxiliary data AUX may be formed. For example, the first to fourth light emitting devices TX1, TX2, TX3, and TX4 form a channel for main data transmission, and may be connected to an IC for image transmission, and the fifth light emitting device TX5. and the light receiving element RX may be connected to an IC for transmitting an auxiliary signal and an IC for receiving an auxiliary signal, respectively.

FIG. 2 is a diagram showing a planar structure of the optical communication module M shown in FIG. 1 . 3 is a view schematically showing a cross-sectional structure of the sub-mount (S) of the optical communication module (M) shown in FIG.

Referring to the drawings, the light emitting element TX and the light receiving element RX and each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) includes a signal line for data communication between each other; They may be connected to each other through a ground line for sharing a common ground voltage. The signal line and the ground line may include a signal pattern layer P1 and a ground pattern layer P2 formed on the submount S, and unlike the signal pattern layer P1 and the ground pattern layer P2, , it may include a signal wire (W1) and a ground wire (W2) extending from the sub-mount (S) in a floating form to a predetermined height. As such, in one embodiment of the present invention, the signal line and the ground line are different types of wiring, that is, a patterned layer P and a sub-mount S patterned on the sub-mount S. ) is formed in the form of a wire (W) floated to a predetermined height from each other, and since the signal line and the ground line are formed in different shapes, sufficient clearance between lines communicating different signals can be secured, and thus each other Crosstalk or crosstalk between different lines may be prevented, and workability may be improved in a wiring forming process. The signal line and the ground line may be formed of a metal material having excellent conductivity, for example, a pattern layer P or wire W having excellent conductivity such as copper, gold, or silver.

The light emitting element TX and the light receiving element RX may be aligned in place on the sub mount S according to the guidance of the alignment guide A formed on the sub mount S, and from the sub mount S A light emitting element TX or light receiving element RX surrounded by the alignment guide A by avoiding physical interference with the alignment guide A through the wire W extending across the alignment guide A to a predetermined height ) can be associated with

Referring to the drawings, the sub-mount S may have a stacked structure in which different layer structures are stacked on each other. More specifically, the sub-mount S includes a base substrate 10 and the base a conductive layer 20 formed on the substrate 10 , an insulating layer 30 formed on the conductive layer 20 , a pattern layer P and an alignment guide A formed on the insulating layer 30 . can do.

The base substrate 10 forms the base of the sub-mount S, and may be formed of, for example, a silicon wafer. The base substrate 10 may support the conductive layer 20 , the insulating layer 30 , and the pattern layer P sequentially formed thereon. The conductive layer 20 may form a capacitive coupling with the pattern layer P with the insulating layer 30 interposed therebetween, and the conductive layer 20 may be formed with the pattern layer (P) with the insulating layer 30 interposed therebetween. P) and may form a capacitance, that is, bypass capacitance. The conductive layer 20 forms a capacitive coupling with the pattern layer P, so that a high-frequency noise component communicating the pattern layer P can be bypassed to the conductive layer 20, and the bypass capacitance ), by removing the high-frequency noise component of the pattern layer (P), it is possible to remove the noise component of the pattern layer (P).

In one embodiment of the present invention, the conductive layer 20 of the sub-mount S may be formed over the entire area of the sub-mount S. That is, the conductive layer 20 of the submount S forms a capacitive coupling with the pattern layer P connected to the light receiving element RX and the pattern layer P connected to the light emitting element TX, and these A high-frequency noise component may be removed from the pattern layer P, and a signal and a ground voltage communicated through the pattern layer P of the light-receiving element RX and the light-emitting element TX may be stabilized.

Hereinafter, the formation of the optical communication module M shown in FIG. 2 will be described with reference to FIGS. 4 to 10 . For reference, in each of FIGS. 4 to 10 , (a) shows the planar structure of the optical communication module M according to each process, and (b) is a schematic cross-section of the optical communication module M according to each process show the structure.

First, as shown in FIGS. 4 to 9 , a sub-mount S on which the light emitting device TX and the light receiving device RX can be mounted is formed. More specifically, as shown in FIG. 4 , the base substrate 10 of the sub-mount S is formed. For example, the base substrate 10 may be provided as a silicon wafer.

Next, as shown in FIG. 5 , a conductive layer 20 is formed on the base substrate 10 . In one embodiment of the present invention, the conductive layer 20 may be formed over the entire area of the base substrate 10 . For example, the conductive layer 20 may be formed over the entire area of the base substrate 10 through deposition on the base substrate 10 . For example, the conductive layer 20 may be formed of a metal material such as gold, silver, or copper having excellent electrical conductivity.

Next, as shown in FIG. 6 , an insulating layer 30 is formed on the conductive layer 20 . The insulating layer 30 may be formed by coating polyimide or depositing a dielectric material. The insulating layer 30 may be formed over the entire area on the conductive layer 20 .

Next, as shown in FIG. 7 , a pattern mask 40 for defining a pattern layer P connected to the light emitting device TX and the light receiving device RX is formed on the insulating layer 30 . do. The pattern mask 40 may be formed of a photoresist.

Next, as shown in FIG. 8 , a metal layer (not shown) is deposited on the pattern mask 40 and the pattern mask 40 and the pattern mask ( 40) The metal layer (not shown) formed thereon is removed together. Accordingly, a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX may be formed on the insulating layer 30 .

Next, as shown in FIG. 9 , an alignment guide A for aligning the light emitting element TX and the light receiving element RX in the proper position is formed on the pattern layer P. For example, the alignment guide A may be formed to surround two different side surfaces of the light emitting device TX and the light receiving device RX. For example, the light-emitting element TX and the light-receiving element RX may be formed in a substantially rectangular shape, and the alignment guide A may be formed so that two sides of the light-emitting element TX and the light-receiving element RX are in contact with each other. It may be formed to surround.

For example, the alignment guide A may be formed through an appropriate pattern process such as photolithography after forming a polymer layer (not shown) on the pattern layer P on the entire surface. Accordingly, a plurality of alignment guides A surrounding two different sides of the light emitting device TX and the light receiving device RX may be formed on the pattern layer P.

In this way, through the processes shown in FIGS. 4 to 9 , a sub-mount S on which the light emitting device TX and the light receiving device RX can be seated may be formed, and then, as shown in FIG. As shown, the light emitting device TX and the light receiving device RX may be seated on the sub mount S.

That is, the light-emitting element TX and the light-receiving element RX may be aligned at a predetermined position on the sub-mount S according to the guidance of the alignment guide A formed on the sub-mount S. In addition, the light emitting device TX and the light receiving device RX aligned in the correct position may be electrically connected to the pattern layer P. For example, a soldering material (not shown) may be interposed between the electrodes of the light emitting device TX and the light receiving device RX and the pattern layer P to electrically connect them.

In the connection between the light-emitting element TX and the light-receiving element RX and the pattern layer P, the light-emitting element TX and the light-receiving element RX may be directly connected to some pattern layer P, and some other patterns The light emitting element TX and the light receiving element RX are not directly connected to the layer P, but the pattern layer P and the light emitting element TX and the light receiving element RX may be connected via the wire W. have. For example, the light emitting element TX through wire bonding connecting one end of the wire W to the electrode of the light emitting element TX or the light receiving element RX and connecting the other end of the wire W to the pattern layer P. ) and the light receiving element RX and the pattern layer P may be electrically connected to each other.

Finally, as shown in FIG. 2 , the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) electrically connect to The pattern layer P and each IC may be connected by wire bonding. For example, the pattern layer (P) and each IC are electrically connected to each other through wire bonding that connects one end of the wire (W) to the pattern layer (P) and the other end of the wire (W) to the electrode of each IC. can be connected

For example, the sub mount (S) may be formed in a substantially rectangular shape, and each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) has different sides of the sub mount (S). can be placed in each. For example, each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) may be disposed to face different sides of the sub-mount S from the outside of the sub-mount S. In addition, the light emitting device TX and the light receiving device RX electrically connected to each IC (IC for video transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) are connected to each IC (IC for transmitting video). , it is possible to form an arrangement surrounding the center of the sub-mount (S) so as to face the side on which the auxiliary signal transmission IC, auxiliary signal reception IC) is disposed. For example, the light emitting element TX and the light receiving element RX may be arranged to surround the center of the sub mount S so as not to overlap each other radially from the center of the sub mount S. In one embodiment of the present invention, the first to fourth light emitting devices TX1, TX2, TX3, TX4 may be connected to an IC for image transmission, and the fifth light emitting device TX5 and the light receiving device RX are It may be connected to an IC for transmitting an auxiliary signal and an IC for receiving an auxiliary signal, respectively.

11 is a view showing a planar structure of the optical communication module (M) according to another embodiment of the present invention is shown. 12 is a view showing a schematic cross-sectional structure of the sub-mount (S) of the optical communication module (M) shown in FIG. 11 is shown.

Referring to the drawing, the optical communication module M or the submount S on which the light emitting element TX and the light receiving element RX of the optical communication module M are seated, the light receiving element RX and the light receiving element RX ) and a first region Z1 in which a patterned layer (P, hereinafter, a light receiving element RX, etc.) is formed, and a light emitting element TX and a patterned layer (P, hereinafter, a light emitting element TX, etc.) connected to the light emitting element TX are formed A second region Z2 may be included. For example, the second region Z2 may be defined as the remaining region of the submount S except for the first region Z1 in which the light receiving element RX is formed. As will be described later, the first region Z1 and the second region Z2 may have different stacked structures.

Referring to FIG. 12 , the sub-mount S includes a base substrate 10 , a conductive layer 20 formed on the base substrate 10 , and an insulating layer 30 formed on the conductive layer 20 . And, it may be formed of a stacked structure including the pattern layer (P) and the alignment guide (A) formed on the insulating layer (30).

In the embodiment of the present invention, the conductive layer 20 may not be formed over the entire area of the submount S, but may be selectively formed only in the first region Z1 . That is, the conductive layer 20 may be selectively formed only in the first region Z1 in which the light-receiving element RX is formed, and the conductive layer 20 in the second region Z2 in which the light-emitting element TX is formed. 20) may not be formed. As described above, by applying different stacked structures in the first region Z1 in which the light-receiving element RX is disposed and the second region Z2 in which the light-emitting element TX is disposed, the light-receiving element RX or the like is formed. The formed first region Z1 and the second region Z2 where the light emitting device TX, etc. are formed are electrically connected to each other through the conductive layer 20 extending across the first and second regions Z2, Crosstalk or crosstalk may be prevented between the pattern layer P connected to the light receiving element RX and the pattern layer P connected to the light emitting element TX.

More specifically, the pattern layer P connected to the light emitting element TX is configured to communicate an electrical signal input to the light emitting element TX, and the pattern layer P connected to the light receiving element RX is , a configuration for communicating an electrical signal output from the light receiving element RX. At this time, the pattern layer P connected to the light emitting device TX is configured to input a signal generated from an IC (IC for image transmission, IC for auxiliary signal transmission) to the light emitting device TX, and a relatively short transmission Since it is input to the light emitting device TX through a path, it is unlikely that a high-frequency noise component will intervene through a relatively short transmission path. However, the pattern layer P connected to the light receiving element RX converts an optical signal received through a transmission path relatively far from the counterpart device through the optical fiber F into an electrical signal through the light receiving element RX After this, it is a configuration for inputting the converted electrical signal to an IC (an auxiliary signal receiving IC), and there is a high probability that a high-frequency noise component is intervened through a relatively distant transmission path. As such, for the light-receiving element (RX, or the pattern layer P connected to the light-receiving element RX) that is relatively weak to high-frequency noise components than the light-emitting element (TX, or the pattern layer P connected to the light-emitting element TX), the capacitance, that is, By providing bypass capacitance, the high-frequency noise component may be bypassed to the conductive layer 20 . That is, by selectively forming the conductive layer 20 only in the first region Z1 in which the light-receiving element RX is formed, the first region Z1 in which the light-receiving element RX, etc. are formed, and the light-emitting element TX, etc. The formed second region Z2 is electrically connected to each other through the conductive layer 20 extending across the first and second regions Z2, so that the pattern layer P connected to the light receiving element RX and the light emitting element are electrically connected to each other. Crosstalk or crosstalk between (TX) and the connected pattern layer (P) can be prevented.

Hereinafter, with reference to FIG. 13, the formation of the optical communication module M shown in FIG. 11 will be described. For reference, in FIG. 13 , (a) shows a planar structure of the optical communication module M according to the illustrated process, and (b) shows a schematic cross-sectional structure of the optical communication module M according to the illustrated process. .

First, a base substrate 10 of the sub-mount S is formed, and then, a conductive layer 20 is formed on the base substrate 10 . In this case, the conductive layer 20 may be selectively formed only in the first region Z1 in which the light receiving element RX is disposed, and in the second region Z2 excluding the first region Z1, that is, light emission. The conductive layer 20 may not be formed in the second region Z2 in which the device TX is disposed. Then, an insulating layer 30 is formed on the conductive layer 20 .

Subsequent processes are substantially the same as those described with reference to FIGS. 7 to 10 . That is, as shown in FIGS. 7 and 8 , a pattern mask 40 for defining a pattern layer P connected to the light emitting device TX and the light receiving device RX is formed, and the pattern mask 40 is formed. ) by depositing a metal layer (not shown) on the pattern mask 40 and then removing both the pattern mask 40 and the metal layer (not shown) formed on the pattern mask 40 through lift off of the pattern mask 40 . , a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX are formed on the insulating layer 30 .

Next, as shown in FIGS. 9 and 10 , an alignment guide (A) for aligning the light emitting device (TX) and the light receiving device (RX) in a fixed position is formed on the pattern layer (P), The light emitting device TX and the light receiving device RX are seated according to the guidance of the alignment guide A, and the light emitting device TX and the light receiving device RX and the pattern layer P are electrically connected to each other.

Finally, as shown in FIG. 11 , the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) electrically connect to For example, the connection between the pattern layer P and each IC may be formed by wire bonding (wire W).

14 is a view showing a planar structure of the optical communication module (M) according to another embodiment of the present invention is shown. 15 is a view showing a schematic cross-sectional structure of the sub-mount (S) of the optical communication module (M) shown in FIG. 14 is shown.

Referring to the drawing, the optical communication module M or the submount S on which the light emitting element TX and the light receiving element RX of the optical communication module M are seated, the light receiving element RX and the light receiving element RX ) and a first region Z1 in which a patterned layer (P, hereinafter, a light receiving element RX, etc.) is formed, and a light emitting element TX and a patterned layer (P, hereinafter, a light emitting element TX, etc.) connected to the light emitting element TX are formed A second region Z2 may be included, and the first region Z1 and the second region Z2 may have different stacked structures.

Referring to the drawings, the sub-mount S includes a base substrate 10 , a conductive layer 20 formed on the base substrate 10 , an insulating layer 30 formed on the conductive layer 20 , and , may have a laminated structure including a pattern layer (P) and an alignment guide (A) formed on the insulating layer (30).

In the embodiment of the present invention, the conductive layer 20 may not be formed over the entire area of the submount S, but may be selectively formed only in the second region Z2 . That is, the conductive layer 20 may be selectively formed only in the second region Z2 in which the light emitting device TX, etc. are formed, and the conductive layer 20 in the first region Z1 in which the light receiving device RX, etc. are formed. may not be formed. More specifically, in the present invention, an opening OP may be formed in a portion corresponding to the first region Z1 of the conductive layer 20 .

The conductive layer 20 is selectively formed only in the second region Z2 in which the light emitting element TX is formed, so that the first region Z1 in which the light receiving element RX is formed and the first region Z1 in which the light emitting element TX is formed. The two regions Z2 are electrically connected to each other through the conductive layer 20 extending across the first and second regions Z2, so that the pattern layer P of the light-receiving element RX and the light-emitting element TX is formed. It is possible to prevent crosstalk or crosstalk between them.

As described above, the pattern layer P connected to the light receiving element RX is configured to process an optical signal received through a transmission path that is relatively far from the counterpart device through the optical fiber F, and is transmitted relatively far away. It is highly probable that a high-frequency noise component will intervene through the path, and in this case, the first region Z1 in which the light-receiving element RX is disposed and the second region Z2 in which the light-emitting element TX, etc. are disposed are the conductive layers ( By selectively forming the conductive layer 20 only in the second region Z2 so as not to be electrically connected to each other through the conductive layer 20, the light emitting device TX disposed in the second region Z2 through the conductive layer 20, etc. This can block the propagation of noise components.

Hereinafter, with reference to FIG. 16, the formation of the optical communication module M shown in FIG. 14 will be described. For reference, in FIG. 16 , (a) shows a planar structure of the optical communication module M according to the illustrated process, and (b) shows a schematic cross-sectional structure of the optical communication module M according to the illustrated process. .

First, a base substrate 10 of the sub-mount S is prepared, and then, a conductive layer 20 is formed on the base substrate 10 . In this case, the conductive layer 20 includes a second region Z2 excluding the first region Z1 in which the light receiving element RX is disposed, that is, the second region Z2 in which the light emitting device TX is disposed. ) can be selectively formed. In this case, in the conductive layer 20 , an opening OP may be formed in a portion corresponding to the first region Z1 while covering the second region Z2 having a relatively large area. Next, an insulating layer 30 is formed on the conductive layer 20 .

Subsequent processes are substantially the same as those described with reference to FIGS. 7 to 10 . That is, as shown in FIGS. 7 and 8 , a pattern mask 40 for defining a pattern layer P connected to the light emitting device TX and the light receiving device RX is formed, and the pattern mask 40 is formed. After depositing a metal layer (not shown) on the ), a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX are formed through lift off of the pattern mask 40 . do.

Next, as shown in FIGS. 9 and 10 , an alignment guide (A) for aligning the light emitting device (TX) and the light receiving device (RX) in a fixed position is formed on the pattern layer (P), The light emitting device TX and the light receiving device RX are seated according to the guidance of the alignment guide A, and the light emitting device TX and the light receiving device RX and the pattern layer P are electrically connected to each other.

Finally, as shown in FIG. 14 , the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (IC for image transmission, IC for transmitting auxiliary signal, IC for receiving auxiliary signal) electrically connect to

Although the present invention has been described with reference to the embodiment shown in the accompanying drawings, this is merely an example, and that various modifications and equivalent other embodiments are possible therefrom by those skilled in the art to which the present invention pertains. point can be understood. Accordingly, the true scope of protection of the present invention should be defined by the appended claims.

10: base substrate 20: conductive layer
30: insulating layer 40: pattern mask
TX: light-emitting element RX: light-receiving element
TX1 to TX5: first to fifth light emitting devices
P: pattern layer P1: signal pattern layer
P2: ground pattern layer W: wire
W1: signal wire W2: ground wire
S: Sub mount A: Alignment guide
Z1: first area Z2: second area
F: optical fiber op: opening of conductive layer

Claims (16)

An optical communication module comprising a sub-mount, and a light-emitting element and a light-receiving element disposed on the sub-mount, the optical communication module comprising:
The sub-mount includes a first area in which the light-receiving element and the pattern layer connected to the light-receiving element are disposed, and a second area in which the light-emitting element and the pattern layer connected to the light-emitting element are disposed,
The sub-mount may include a pattern layer electrically connected to the light emitting element and the light receiving element, a metal conductive layer disposed to face the pattern layer with an insulating layer interposed therebetween, and a base substrate on which the insulating layer and the metal conductive layer are formed. including,
In the metal conductive layer, an opening is formed in a portion corresponding to the first region to alternatively cover a relatively wide second region among the first region or the second region,
The insulating layer is formed in both the first region and the second region,
The light emitting device includes first to fourth light emitting devices connected to an IC for transmitting an image and a fifth light emitting device connected to an IC for transmitting an auxiliary signal, and the light receiving device is connected to an IC for receiving an auxiliary signal,
The first to fifth light emitting elements and the light receiving element form an arrangement surrounding the center of the sub mount so that each IC disposed outside the sub mount faces different sides of the sub mount facing each other, arranged to surround the center of the submount so as not to overlap each other radially from the center of the mount,
The optical communication module, characterized in that the opening of the metal conductive layer is formed in a first area disposed adjacent to one side of the submount that the light receiving element faces, among the first and second areas. The method of claim 1,
The metal conductive layer forms a bypass capacitance for bypassing a high-frequency noise component communicating with the pattern layer to the metal conductive layer. delete delete delete delete delete delete The method of claim 1,
The sub-mount is
and the base substrate, the metal conductive layer formed on the base substrate, the insulating layer formed on the metal conductive layer, and the pattern layer formed on the insulating layer. 10. The method of claim 9,
The sub-mount is formed on the insulating layer, and the optical communication module further comprises an alignment guide for positioning the light emitting element and the light receiving element. 11. The method of claim 10,
The alignment guide is an optical communication module, characterized in that formed to surround two different sides of the light emitting element and the light receiving element. The method of claim 1,
Some of the pattern layers among the pattern layers are electrically connected to the light emitting element or the light receiving element by a wire extending from the sub-mount to a predetermined height. delete delete delete delete

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