KR102138250B1 - Optical communication module - Google Patents

Abstract

According to the present invention, an optical communication module is disclosed. The optical communication module comprises a sub-mount and a light-emitting element and a light-receiving element disposed on the sub-mount. The sub-mount includes: a pattern layer electrically connected to the light-emitting element and the light-receiving element; and a conductive layer disposed to face the pattern layer with an insulating layer therebetween. According to the present invention, provided is an optical communication module capable of blocking errors in transmission/reception data due to crosstalk or interference caused by propagation of high-frequency noise components between conductive patterns through which different signals are communicated.

Description

Optical communication module {Optical communication module}

The present invention relates to an optical communication module.

The optical communication module includes a light emitting element for converting an electrical signal into an optical signal and transmitting an optical signal through the optical fiber, and a light receiving element for converting an optical signal received through the optical fiber into an electrical signal. can do.

The light-emitting element and the light-receiving element may be mounted on a sub-mount, and an error such as cross talk or crosstalk is formed between the conductive pattern connected to the light-emitting element and the conductive pattern connected to the light-receiving element as formed on the sub-mount. May occur. For example, due to crosstalk or crosstalk between conductive patterns through which different signals communicate, errors may occur in transmission data or reception data according to mixing of high-frequency noise components.

One embodiment of the present invention includes an optical communication module capable of blocking errors in transmission/reception data due to crosstalk or crosstalk caused by propagation of high-frequency noise components between conductive patterns through which different signals communicate.

In order to solve the above problems and other problems, the optical communication module of the present invention,

An optical communication module comprising a sub-mount and a light-emitting element and a light-receiving element disposed on the sub-mount,

The sub-mount includes a pattern layer electrically connected to the light-emitting element and the light-receiving element, and a conductive layer disposed to face the pattern layer with an insulating layer interposed therebetween.

For example, the conductive layer may form a bypass capacitance that bypasses the high frequency noise component communicating the pattern layer to the conductive layer.

For example, the sub-mount may include a first region in which the light receiving element and the pattern layer connected to the light receiving element are disposed, and a second region excluding the first region.

For example, the light emitting element and the pattern layer connected to the light emitting element may be disposed in the second region.

For example, the conductive layer may be formed over the entire area of the sub-mount including the first and second regions.

For example, the conductive layer may be selectively formed only in the first region.

For example, the conductive layer may be selectively formed only in the second region.

For example, the conductive layer may have an opening formed in a portion corresponding to the first region while covering the relatively wide second region.

For example, the sub-mount,

It may include a base substrate, the insulating layer formed on the base substrate, the conductive layer formed on the insulating layer, and the pattern layer formed on the conductive layer.

For example, the sub-mount is formed on the conductive layer, and may further include an alignment guide for aligning positions of the light emitting element and the light receiving element.

For example, the alignment guide may be formed to surround two different sides of the light emitting element and the light receiving element.

For example, some of the pattern layers among the pattern layers may be electrically connected to the light-emitting element or the light-receiving element by wires extending from the sub-mount to a predetermined height.

For example, a signal transmission IC connected to the light emitting element to output an electrical signal and a signal receiving IC connected to the light receiving element to receive an electrical signal may be further included.

For example, the signal transmission IC may include an image transmission IC for transmission of an image signal and an auxiliary signal transmission IC for transmission of an auxiliary signal,

The signal receiving IC may include an auxiliary signal receiving IC,

The light emitting device includes first to fourth light emitting devices connected to the image transmission IC and a fifth light emitting device connected to the auxiliary signal transmission IC,

The light receiving element may be connected to the auxiliary signal receiving IC.

For example, the image transmission IC, the auxiliary signal transmission IC, and the auxiliary signal reception IC may be arranged to face different sides of the sub-mount.

For example, the first to fifth light emitting elements and the light receiving element may form an array surrounding the center of the submount so as to face different sides of the submount in which each IC is disposed.

According to the optical communication module of the present invention, by providing a bypass capacitance capable of bypassing high-frequency noise components to a sub-mount on which a light-emitting element and a light-receiving element are mounted, high-frequency noise components can be removed, and different signals communicate. It is possible to prevent crosstalk or crosstalk caused by propagation of high frequency noise components between the conductive patterns.

1 is a view schematically showing an entire system to which the optical communication module of the present invention can be applied.
FIG. 2 is a view showing a planar structure of the optical communication module shown in FIG. 1.
3 is a view schematically showing a cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 2.
4 to 10, a drawing is shown for each process for forming the optical communication module shown in FIG. 2, and in each of FIGS. 4 to 10, (a) is a plane of the optical communication module according to each process The structure is shown, and (b) shows a schematic cross-sectional structure of the optical communication module according to each process.
11 is a view showing a planar structure of an optical communication module according to another embodiment of the present invention.
FIG. 12 is a view showing a schematic cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 11.
13 is a view for explaining the formation of the optical communication module shown in FIG. 11, in FIG. 13, (a) shows a planar structure of the optical communication module according to the illustrated process, and (b) is shown It shows the schematic cross-sectional structure of the optical communication module according to the process.
14 is a view showing a planar structure of an optical communication module according to another embodiment of the present invention.
15 is a view showing a schematic cross-sectional structure of a sub-mount of the optical communication module shown in FIG. 14.
In FIG. 16, a view for explaining the formation of the optical communication module shown in FIG. 14, in FIG. 16, (a) shows a planar structure of the optical communication module according to the illustrated process, and (b) shows It shows the schematic cross-sectional structure of the optical communication module according to the process.

Hereinafter, an optical communication module according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a view schematically showing an entire system to which the optical communication module M of the present invention can be applied. Referring to the drawings, a source device as an AV source for generating a video signal and a sink device for realizing a video image from the video signal of the source device perform data communication through an optical fiber F for mediating optical communication. The optical communication module M according to an embodiment of the present invention may be interposed between the source device and the optical fiber F, and between the sink device and the optical fiber F, respectively.

The optical communication module M according to an embodiment of the present invention is interposed between the source device and the optical fiber F to function as a transmission module T that transmits data of the source device through the optical fiber F or Alternatively, it may be interposed between the sink device and the optical fiber F to function as a receiving module R that transmits data received through the optical fiber F to the sink device.

Hereinafter, the optical communication module M functioning as the transmission module T is mainly described, but the optical communication module M of the present invention may function as the reception module R, or the transmission module T or The optical communication module M functioning as the receiving module R performs bidirectional communication, respectively, and each transmitting module T and the receiving module R uses a light emitting element TX and a light receiving element RX. It can contain.

For example, the source device is an AV source that generates a video signal, and may be exemplified by a computer, a game machine, a mobile phone, a digital camera, and the sink device for realizing a video image from the video signal of the source device. As such, it may be a video device such as a television or a projector.

The optical communication module M according to an embodiment of the present invention is connected between any one of a source device or a sink device and an optical fiber F to convert an electrical signal into an optical signal and convert the optical fiber F ), a light emitting element (TX) for transmitting an optical signal to the other device, and a light receiving element (RX) for converting and transmitting an optical signal received from the other device through the optical fiber (F) into an electrical signal. It can contain.

In the optical communication module M functioning as the transmission module T, the light emitting element TX includes first to fourth light emitting elements TX1, TX2, TX3, and TX4 for transmitting the main data signal. And a fifth light emitting element TX5 for transmitting auxiliary data. For example, the first to fourth light emitting elements TX1, TX2, TX3, and TX4 are channels for transmitting video data of R, G, and B in synchronization with a pixel clock and three transition-minimized differential signaling (TMDS) ) Channels L1, L2, L3 and TMDS clock channels CLK may be formed as channels for transmitting TMDS clocks. The fifth light-emitting element TX5 and the light-receiving element RX are related to an EDID (Extended Display Identification Data), which is configuration information and control information of a sink device, and a Display Port Configuration Data (DPCD), which is reception condition information of a sink device. A channel for transmitting and receiving auxiliary data (AUX) may be formed. For example, the first to fourth light emitting elements TX1, TX2, TX3, and TX4 form channels for transmission of main data, and may be connected to an image transmission IC, and the fifth light emitting element TX5 And the light receiving element RX may be connected to an IC for transmitting an auxiliary signal and an IC for receiving an auxiliary signal, respectively.

FIG. 2 is a view showing a planar structure of the optical communication module M shown in FIG. 1. 3 is a view schematically showing a cross-sectional structure of the sub-mount S of the optical communication module M shown in FIG. 2.

Referring to the drawings, the light emitting element TX and the light receiving element RX and each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal reception IC), a signal line for data communication with each other, They can be connected to each other through a ground line for sharing a common ground voltage. The signal line and the ground line may include a signal pattern layer (P1) and a ground pattern layer (P2) formed on the sub-mount (S), unlike the signal pattern layer (P1) and the ground pattern layer (P2) , It may include a signal wire (W1) and a ground wire (W2) extending in a form floating from the sub-mount (S) to a predetermined height. As described above, in one embodiment of the present invention, the signal line and the ground line are different types of wiring, that is, the pattern layer P and the submount S in the form of a layer patterned on the submount S ) Is formed in the form of a wire (W) floating to a predetermined height, the signal line and the ground line are formed in different forms, it is possible to secure a sufficient clearance between the lines communicating different signals, and accordingly Crosstalk or crosstalk between different lines can be prevented, and workability can be improved in a wiring forming process. The signal line and the ground line may be formed of a metal material having excellent conductivity, for example, may be formed of a pattern layer (P) or wire (W) of copper, gold, silver, etc. having excellent conductivity.

The light-emitting element TX and the light-receiving element RX may be aligned in place on the sub-mount S according to the guidance of the alignment guide A formed on the sub-mount S, from the sub-mount S A light emitting device TX or a light receiving device RX surrounded by the alignment guide A by avoiding physical interference with the alignment guide A through a wire W extending across the alignment guide A to a predetermined height ).

Referring to the drawings, the sub-mount (S), may be made of a stacked structure in which different layer structures are stacked with respect to each other. More specifically, the sub-mount (S) is the base substrate 10 and the base It includes a conductive layer 20 formed on the substrate 10, an insulating layer 30 formed on the conductive layer 20, a pattern layer P formed on the insulating layer 30 and an alignment guide A can do.

The base substrate 10 is to form the base of the sub-mount (S), for example, may be formed of a silicon wafer. The base substrate 10 may support a conductive layer 20, an insulating layer 30 and a pattern layer P formed sequentially thereon. The conductive layer 20 may form a capacitive bond with the pattern layer P with the insulating layer 30 interposed therebetween, and the conductive layer 20 may have a pattern layer ( It is possible to form a capacitance facing the P), that is, a bypass capacitance (bypass capacitance). The conductive layer 20 may form a capacitive coupling with the pattern layer P, thereby bypassing the high frequency noise component communicating the pattern layer P to the conductive layer 20, and bypass capacitance. By removing the high-frequency noise component of the pattern layer (P) through (), it is possible to remove the noise component of the pattern layer (P).

In one embodiment of the present invention, the conductive layer 20 of the sub-mount S may be formed over the entire area of the sub-mount S. That is, the conductive layer 20 of the sub-mount S forms a capacitive coupling with the pattern layer P connected to the light-receiving element RX and the pattern layer P connected to the light-emitting element TX, and The high frequency noise component may be removed from the pattern layer P, and the signal and ground voltage communicated through the pattern layer P of the light receiving element RX and the light emitting element TX may be stabilized.

Hereinafter, the formation of the optical communication module M shown in FIG. 2 will be described with reference to FIGS. 4 to 10. For reference, in each of FIGS. 4 to 10, (a) shows the planar structure of the optical communication module M for each process, and (b) is a schematic cross-section of the optical communication module M for each process. It shows the structure.

First, as illustrated in FIGS. 4 to 9, a sub-mount S capable of seating the light emitting element TX and the light receiving element RX is formed. More specifically, as shown in FIG. 4, the base substrate 10 of the sub-mount S is formed. For example, the base substrate 10 may be provided as a silicon wafer.

Next, as shown in FIG. 5, a conductive layer 20 is formed on the base substrate 10. In one embodiment of the present invention, the conductive layer 20 may be formed over the entire area of the base substrate 10. For example, the conductive layer 20 may be formed over the entire area of the base substrate 10 through deposition on the base substrate 10. For example, the conductive layer 20 may be formed of a metal material such as gold, silver, and copper having excellent electrical conductivity characteristics.

Next, as illustrated in FIG. 6, an insulating layer 30 is formed on the conductive layer 20. The insulating layer 30 may be formed by coating a polyimide or depositing a dielectric material. The insulating layer 30 may be formed over the entire area on the conductive layer 20.

Next, as shown in FIG. 7, on the insulating layer 30, a pattern mask 40 for defining a pattern layer P connected to the light emitting element TX and the light receiving element RX is formed. do. The pattern mask 40 may be formed of photoresist.

Next, as shown in FIG. 8, a metal layer (not shown) is deposited on the pattern mask 40 and the pattern mask 40 and the pattern mask (through lift off of the pattern mask 40) 40) The metal layer (not shown) formed on the surface is removed together. Accordingly, a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX may be formed on the insulating layer 30.

Next, as shown in FIG. 9, on the pattern layer P, an alignment guide A for aligning the light emitting element TX and the light receiving element RX is formed. For example, the alignment guide A may be formed to surround two different sides of the light emitting device TX and the light receiving device RX. For example, the light-emitting element TX and the light-receiving element RX may be formed in a substantially rectangular shape, and the alignment guide A has two side surfaces that abut each other of the light-emitting element TX and the light-receiving element RX. It can be formed to surround.

For example, the alignment guide A may be formed through an appropriate pattern process, such as photolithography, after forming a polymer layer (not shown) on the pattern layer P. Accordingly, a plurality of alignment guides A surrounding the two different sides of the light emitting device TX and the light receiving device RX may be formed on the pattern layer P.

As described above, through the process illustrated in FIGS. 4 to 9, a sub-mount S capable of seating the light emitting element TX and the light receiving element RX may be formed, and thereafter, illustrated in FIG. 10. As described above, the light emitting element TX and the light receiving element RX may be mounted on the submount S.

That is, the light-emitting element TX and the light-receiving element RX may be aligned at a predetermined position on the sub-mount S according to the guidance of the alignment guide A formed on the sub-mount S. In addition, the light emitting device TX and the light receiving device RX aligned in a predetermined position may be electrically connected to the pattern layer P. For example, a soldering material (not shown) is interposed between the electrodes of the light emitting device TX and the light receiving device RX and the pattern layer P to electrically connect them.

In the connection between the light emitting element TX and the light receiving element RX and the pattern layer P, for some pattern layers P, the light emitting element TX and the light receiving element RX may be directly connected, and some other patterns The light emitting element TX and the light receiving element RX are not directly connected to the layer P, but the pattern layer P and the light emitting element TX and the light receiving element RX may be connected via a wire W. have. For example, one end of the wire W is connected to the electrode of the light emitting element TX or the light receiving element RX, and the light emitting element TX through wire bonding connecting the other end of the wire W to the pattern layer P ) And the light receiving element RX and the pattern layer P may be electrically connected to each other.

Lastly, as shown in FIG. 2, the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal reception IC) Electrically connect. The pattern layer P may be connected to each IC by wire bonding. For example, the pattern layer P and each IC are electrically connected to each other through wire bonding connecting one end of the wire W to the pattern layer P and the other end of the wire W to the electrodes of each IC. Can be connected.

For example, the sub-mount (S) may be formed in a substantially rectangular shape, each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal receiving IC) different side of the sub-mount (S) Can be placed respectively. For example, each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal reception IC) may be arranged to face different sides of the sub mount S from the outside of the sub mount S. In addition, the light-emitting element TX and the light-receiving element RX electrically connected to each IC (IC for image transmission, IC for auxiliary signal transmission, and IC for receiving auxiliary signal) are each IC (IC for video transmission) to be connected. , Auxiliary signal transmission IC, auxiliary signal reception IC) may be arranged to surround the center of the sub-mount (S) so as to face the disposed side. For example, the light emitting element TX and the light receiving element RX may be arranged to surround the center of the sub mount S so that they do not overlap each other radially from the center of the sub mount S. In one embodiment of the present invention, the first to fourth light emitting elements (TX1,TX2,TX3,TX4) may be connected to an image transmission IC, the fifth light emitting element (TX5) and the light receiving element (RX) Each may be connected to an auxiliary signal transmission IC and an auxiliary signal reception IC.

11 is a view showing a planar structure of an optical communication module M according to another embodiment of the present invention. 12 is a view showing a schematic cross-sectional structure of the sub-mount (S) of the optical communication module (M) shown in FIG.

Referring to the drawings, the sub-mount S in which the light-emitting element TX and the light-receiving element RX of the optical communication module M or the optical communication module M are seated includes a light-receiving element RX and a light-receiving element RX. ) And a first region Z1 on which a pattern layer (P, light receiving element RX, etc.) is formed and a pattern layer (P, light emitting element TX, etc.) connected to the light emitting element TX and the light emitting element TX are formed. The second region Z2 may be included. For example, the second region Z2 may be defined as the remaining region of the submount S except for the first region Z1 in which the light receiving element RX or the like is formed. As described later, the first region Z1 and the second region Z2 may have different stacked structures.

Referring to FIG. 12, the sub-mount S includes a base substrate 10, a conductive layer 20 formed on the base substrate 10, and an insulating layer 30 formed on the conductive layer 20. And, it may be made of a layered structure including a pattern layer (P) and an alignment guide (A) formed on the insulating layer (30).

In an embodiment of the present invention, the conductive layer 20 is not formed over the entire area of the sub-mount S, but may be selectively formed only in the first region Z1. That is, the conductive layer 20 may be selectively formed only in the first region Z1 in which the light-receiving element RX or the like is formed, and in the second region Z2 in which the light-emitting element TX or the like is formed, the conductive layer ( 20) may not be formed. As described above, by applying different stacked structures in the first area Z1 where the light-receiving element RX or the like is disposed and the second area Z2 where the light-emitting element TX or the like is disposed, the light-receiving element RX or the like is applied. The formed first region Z1 and the second region Z2 on which the light emitting device TX is formed are electrically connected to each other through the conductive layer 20 extending across the first and second regions Z2, Crosstalk or cross talk may be prevented between the pattern layer P connected to the light receiving element RX and the pattern layer P connected to the light emitting element TX.

More specifically, the pattern layer P connected to the light emitting device TX is configured to communicate an electrical signal input to the light emitting device TX, and the pattern layer P connected to the light receiving device RX is , It is a configuration for communicating an electrical signal output from the light receiving element (RX). At this time, the pattern layer P connected to the light emitting device TX is configured to input a signal generated from an IC (image transmission IC, auxiliary signal transmission IC) to the light emitting device TX, and relatively short transmission Since it is input to the light emitting element TX through a path, the probability of high-frequency noise components intervening through a relatively short transmission path is not great. However, the pattern layer P connected to the light-receiving element RX converts an optical signal received through a relatively distant transmission path from the other device through the optical fiber F into an electrical signal through the light-receiving element RX. After this, a configuration for inputting the converted electrical signal to an IC (auxiliary signal receiving IC) has a high probability that high-frequency noise components will intervene through a relatively distant transmission path. In this way, for a light-receiving element (RX, or a pattern layer P connected to the light-receiving element RX) that is relatively more susceptible to high-frequency noise components than the light-emitting element (TX, or the pattern layer P connected to the light-emitting element TX), the capacitance, that is, By providing a bypass capacitance, high-frequency noise components can be bypassed to the conductive layer 20. That is, by selectively forming the conductive layer 20 only in the first region Z1 where the light-receiving element RX or the like is formed, the first region Z1 and the light-emitting element TX, etc., in which the light-receiving element RX or the like is formed, are formed. The formed second region Z2 is electrically connected to each other through the conductive layer 20 extending across the first and second regions Z2, so that the pattern layer P connected to the light receiving element RX and the light emitting element Crosstalk or crosstalk can be prevented between the (TX) and the pattern layer P connected.

Hereinafter, the formation of the optical communication module M shown in FIG. 11 will be described with reference to FIG. 13. For reference, in FIG. 13, (a) shows a planar structure of the optical communication module M according to the illustrated process, and (b) shows a schematic cross-sectional structure of the optical communication module M according to the illustrated process. .

First, the base substrate 10 of the sub-mount S is formed, and then, a conductive layer 20 is formed on the base substrate 10. At this time, the conductive layer 20 may be selectively formed only in the first region Z1 in which the light-receiving element RX or the like is disposed, and the second region Z2 excluding the first region Z1, that is, light emission The conductive layer 20 may not be formed in the second region Z2 in which the device TX or the like is disposed. Then, an insulating layer 30 is formed on the conductive layer 20.

Subsequent processes are substantially the same as described with reference to FIGS. 7 to 10. That is, as illustrated in FIGS. 7 and 8, a pattern mask 40 is formed to define a pattern layer P connected to the light emitting device TX and the light receiving device RX, and the pattern mask 40 After depositing a metal layer (not shown) on ), by removing the pattern mask 40 and the metal layer (not shown) formed on the pattern mask 40 through lift off of the pattern mask 40 , On the insulating layer 30, a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX are formed.

Next, as shown in FIGS. 9 and 10, on the pattern layer P, an alignment guide A for aligning the light emitting element TX and the light receiving element RX in place is formed, The light emitting element TX and the light receiving element RX are seated according to the guide of the alignment guide A, and the light emitting element TX and the light receiving element RX and the pattern layer P are electrically connected to each other.

Finally, as shown in FIG. 11, the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal reception IC) Electrically connect. For example, the connection between the pattern layer P and each IC may be made of wire bonding (wire W).

14 is a view showing a planar structure of an optical communication module M according to another embodiment of the present invention. 15 is a view showing a schematic cross-sectional structure of the sub-mount (S) of the optical communication module (M) shown in FIG.

Referring to the drawings, the sub-mount S in which the light-emitting element TX and the light-receiving element RX of the optical communication module M or the optical communication module M are seated includes a light-receiving element RX and a light-receiving element RX. ) And a first region Z1 on which a pattern layer (P, light receiving element RX, etc.) is formed and a pattern layer (P, light emitting element TX, etc.) connected to the light emitting element TX and the light emitting element TX are formed. The second region Z2 may be included, and the first region Z1 and the second region Z2 may have different stacked structures.

Referring to the drawings, the sub-mount (S), the base substrate 10, the conductive layer 20 formed on the base substrate 10, and the insulating layer 30 formed on the conductive layer 20 and , It may be made of a layered structure including a pattern layer (P) formed on the insulating layer 30 and the alignment guide (A).

In an embodiment of the present invention, the conductive layer 20 is not formed over the entire area of the sub-mount S, but may be selectively formed only in the second region Z2. That is, the conductive layer 20 may be selectively formed only in the second region Z2 where the light emitting element TX or the like is formed, and the conductive layer 20 may be formed in the first region Z1 where the light receiving element RX or the like is formed. It may not be formed. More specifically, in the present invention, an opening OP may be formed in a portion corresponding to the first region Z1 of the conductive layer 20.

The conductive layer 20 is selectively formed only in the second region Z2 in which the light emitting element TX or the like is formed, so that the first region Z1 in which the light receiving element RX is formed and the light emitting element TX are formed. Since the two regions Z2 are electrically connected to each other through the conductive layers 20 extending across the first and second regions Z2, the pattern layer P of the light-receiving element RX and the light-emitting element TX is Crosstalk and crosstalk between the liver can be prevented.

As described above, the pattern layer P connected to the light receiving element RX is configured to process an optical signal received through a relatively distant transmission path from a counterpart device through the optical fiber F, and transmits relatively distantly. There is a high probability that high-frequency noise components will be intervened through the path. At this time, the first region Z1 in which the light-receiving element RX or the like is disposed and the second region Z2 in which the light-emitting element TX is disposed are conductive layers ( By forming the conductive layer 20 selectively only in the second region Z2 so as not to be electrically connected to each other through 20, the light emitting device TX disposed in the second region Z2 through the conductive layer 20, etc. It can block the propagation of noise components.

Hereinafter, formation of the optical communication module M shown in FIG. 14 will be described with reference to FIG. 16. For reference, in FIG. 16, (a) shows a planar structure of the optical communication module M according to the illustrated process, and (b) shows a schematic cross-sectional structure of the optical communication module M according to the illustrated process. .

First, the base substrate 10 of the sub-mount S is prepared, and then, a conductive layer 20 is formed on the base substrate 10. At this time, the conductive layer 20 is a second region Z2 excluding the first region Z1 in which the light-receiving element RX or the like is disposed, that is, the second region Z2 in which the light-emitting element TX or the like is disposed. ) Can be selectively formed. In this case, the conductive layer 20 may cover the second area Z2 having a relatively large area, and an opening OP may be formed in a portion corresponding to the first area Z1. Next, an insulating layer 30 is formed on the conductive layer 20.

Subsequent processes are substantially the same as described with reference to FIGS. 7 to 10. That is, as illustrated in FIGS. 7 and 8, a pattern mask 40 is formed to define a pattern layer P connected to the light emitting device TX and the light receiving device RX, and the pattern mask 40 After depositing a metal layer (not shown) on ), a plurality of pattern layers P connected to the light emitting device TX and the light receiving device RX are formed through lift off of the pattern mask 40. do.

Next, as shown in FIGS. 9 and 10, on the pattern layer P, an alignment guide A for aligning the light emitting element TX and the light receiving element RX in place is formed, The light emitting element TX and the light receiving element RX are seated according to the guide of the alignment guide A, and the light emitting element TX and the light receiving element RX and the pattern layer P are electrically connected to each other.

Finally, as shown in FIG. 14, the pattern layer P connected to the light emitting element TX and the light receiving element RX and each IC (image transmission IC, auxiliary signal transmission IC, auxiliary signal reception IC) Electrically connect.

The present invention has been described with reference to the embodiments shown in the accompanying drawings, but these are merely exemplary, and those skilled in the art to which the present invention pertains may have various modifications and other equivalent embodiments. You will understand the point. Therefore, the true protection scope of the present invention should be defined by the appended claims.

10: base substrate 20: conductive layer
30: insulating layer 40: pattern mask
TX: light emitting element RX: light receiving element
TX1 to TX5: first to fifth light emitting elements
P: Pattern layer P1: Signal pattern layer
P2: Ground pattern layer W: Wire
W1: Signal wire W2: Ground wire
S: Submount A: Alignment guide
Z1: first area Z2: second area
F: optical fiber op: conductive layer opening

Claims (16)

An optical communication module comprising a sub-mount and a light-emitting element and a light-receiving element disposed on the sub-mount,
The sub-mount includes a first region in which a pattern layer connected to the light-receiving element and a light-receiving element is disposed, and a second region in which a pattern layer connected to the light-emitting element and a light-emitting element is disposed,
The sub-mount is a silicon base on which a pattern layer electrically connected to the light emitting element and the light receiving element, a metal conductive layer disposed to face the pattern layer with an insulating layer interposed therebetween, and the insulating layer and a metal conductive layer are formed. Including a substrate,
The metal conductive layer is alternatively formed exclusively in any one of the first region or the second region,
The light emitting element includes first to fourth light emitting elements connected to the image transmitting IC and a fifth light emitting element connected to the auxiliary signal transmitting IC, and the light receiving element is connected to the auxiliary signal receiving IC,
The first to fifth light emitting elements and the light receiving element form an array surrounding the center of the submount so that each IC disposed outside the submount faces a different side of the submount facing each other, and the sub Arranged to surround the center of the sub-mount so as not to overlap radially from the center of the mount,
The metal conductive layer is formed exclusively in a first region disposed adjacent to one side of a sub-mount viewed by the light-receiving element among the first and second regions,
The insulating layer is formed in both the first and second regions, the optical communication module. According to claim 1,
And the metal conductive layer forms a bypass capacitance that bypasses the high frequency noise component communicating the pattern layer to the metal conductive layer. delete delete delete delete delete delete According to claim 1,
The sub-mount,
An optical communication module comprising the silicon base substrate, the insulating layer formed on the silicon base substrate, the metal conductive layer formed on the insulating layer, and the pattern layer formed on the metal conductive layer. . The method of claim 9,
The sub-mount is formed on the insulating layer, further comprising an alignment guide for aligning the position of the light emitting element and the light receiving element. The method of claim 10,
The alignment guide is formed so as to surround two different sides of the light emitting element and the light receiving element. According to claim 1,
Some of the pattern layer of the pattern layer, the optical communication module, characterized in that electrically connected to the light-emitting element or the light-receiving element by a wire extending in a form floating to a predetermined height from the sub-mount. delete delete delete delete

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