KR102444852B1 - Thermalelectric module and method of manufacturing the same - Google Patents

Abstract

A thermoelectric module according to an embodiment of the present invention is positioned between a heat transfer member and a cooling member, a thermoelectric element assembly including a plurality of thermoelectric elements, and a side surface surrounding the thermoelectric element assembly between the heat transfer member and the cooling member and a plate, wherein the thermoelectric element assembly is positioned in a vacuum region formed by the heat transfer member, the cooling member, and the side plate.

Description

Thermoelectric module and manufacturing method thereof

The present invention relates to a thermoelectric module and a method for manufacturing the same, and more particularly, to a thermoelectric module for improving power generation efficiency and high-temperature reliability, and a method for manufacturing the same.

A thermoelectric element is a device used to directly convert thermal energy into electrical energy and electrical energy into thermal energy, and is a material and technology that satisfies the demands of the times for energy saving. It is widely used in industries such as automobiles, aerospace, semiconductors, bio, optics, computers, power generation, and home appliances.

Specifically, when a temperature difference occurs at both ends of a material, a difference in concentration of carriers such as electrons or holes having thermal dependence occurs, and thus a thermoelectric phenomenon appears. This thermoelectric phenomenon may be divided into thermoelectric power generation that produces electrical energy, and thermoelectric cooling/heating that causes a temperature difference between both ends by supplying electricity on the contrary.

A thermoelectric module may be a basic unit of a pair of p-n thermoelectric elements including a p-type thermoelectric element in which holes move to transfer thermal energy and an n-type thermoelectric element in which electrons move to transfer thermal energy. In addition, the thermoelectric module may include an electrode connecting the p-type thermoelectric element and the n-type thermoelectric element. In addition, the thermoelectric module may be disposed outside the thermoelectric element to electrically insulate components such as electrodes from the outside, and may include a substrate to protect the thermoelectric module from external physical or chemical elements.

A thermoelectric module is typically attached to a high-temperature heat source to generate power through a temperature difference with the opposite cooling unit. In this regard, the thermoelectric module is required to have excellent output efficiency and thermal stability. In particular, as thermoelectric modules are often used at a much higher temperature than room temperature, like thermoelectric power generation devices, thermal stability needs to be maintained at a certain level or higher even under such high temperature conditions, and the problem of reliability reduction due to oxidation of thermoelectric elements is prevented. Needs to be.

According to an embodiment of the present invention, it is to provide a thermoelectric module having reliability at high temperature while increasing power generation efficiency and a method for manufacturing the same.

However, the problems to be solved by the embodiments of the present invention are not limited to the above-described problems and may be variously expanded within the scope of the technical idea included in the present invention.

A thermoelectric module according to an embodiment of the present invention is positioned between a heat transfer member and a cooling member, a thermoelectric element assembly including a plurality of thermoelectric elements, and a side surface surrounding the thermoelectric element assembly between the heat transfer member and the cooling member and a plate, wherein the thermoelectric element assembly is positioned in a vacuum region formed by the heat transfer member, the cooling member, and the side plate.

The thermoelectric module may further include a pressing member connecting the heat transfer member and the cooling member, and configured to bring the heat transfer member and the cooling member close to the thermoelectric element assembly.

The pressing member may include at least one screw.

The heat transfer member may include a plurality of unit heat transfer members, and the plurality of unit heat transfer members may correspond to one cooling member.

The pressing member may include at least two screws formed on the unit heat transfer member.

The heat transfer member and the cooling member may be welded to the side plate.

Each of the heat transfer member, the cooling member, and the side plate may include at least one material selected from the group consisting of stainless steel, copper, aluminum, brass, aluminum silicon carbide (AlSiC), and steel.

The heat transfer member, the cooling member, and the side plate may be formed of the same material.

At least one of the heat transfer member and the cooling member and the side plate may be formed of different materials.

One surface of the heat transfer member may be plated with a metal or ceramic, and the one surface may be positioned opposite to a surface adjacent to the thermoelectric element assembly.

The thermoelectric module may further include a heat conduction layer positioned between at least one of between the heat transfer member and the thermoelectric element assembly and between the cooling member and the thermoelectric element assembly.

The cooling member may include at least one water cooling port.

A method of manufacturing a thermoelectric module according to another embodiment of the present invention includes disposing a thermoelectric element assembly between a heat transfer member and a cooling member, connecting the heat transfer member and the cooling member, and the heat transfer member and the cooling member pressing the thermoelectric element assembly to be close to it; forming a side plate positioned between the heat transfer member and the cooling member and surrounding the thermoelectric element assembly; and the heat transfer member, the cooling member and the side plate. Including the step of creating a vacuum state in the area partitioned by the.

In the step of pressing the heat transfer member and the cooling member to be close to the thermoelectric element assembly, the distance between the heat transfer member and the cooling member is increased by using a pressing member so that the thermoelectric element assembly is formed between the heat transfer member and the heat transfer member and the cooling member. It may be made to be in close contact with the cooling member.

The step of making the region defined by the heat transfer member, the cooling member, and the side plate into a vacuum state may be performed after the step of pressing the heat transfer member and the cooling member to be close to the thermoelectric element assembly.

The forming of the side plate may include welding the heat transfer member and the cooling member.

According to embodiments, a heat transfer member for transferring high-temperature heat and a cooling member for cooling the thermoelectric element are formed in a pressurizing structure to be in close contact with the plurality of thermoelectric elements, and then the thermoelectric element, the cooling member and the heat transfer member are formed. By packaging all of them with a vacuum structure, the power generation efficiency and reliability of the thermoelectric module can be improved.

1 is a diagram illustrating a thermoelectric module according to an embodiment of the present invention.
FIG. 2 is a schematic perspective view for explaining the vacuum structure of FIG. 1 .
3 is a perspective view schematically illustrating a thermoelectric element assembly including the thermoelectric element of FIG. 1 .
4 is a cross-sectional view illustrating the thermoelectric element assembly of FIG. 3 .
5 is a perspective view illustrating a cooling member according to an embodiment of the present invention.
6 is a perspective view illustrating a heat transfer member according to an embodiment of the present invention.
7 is a side view showing a side plate according to an embodiment of the present invention.
FIG. 8 is a photograph showing the cooling member of FIG. 5 .
9 is a photograph showing the heat transfer member of FIG. 6 .
FIG. 10 is a photograph showing the side plate of FIG. 7 .
11 is a diagram illustrating a method of measuring the amount of power generated by a thermoelectric module according to an embodiment of the present invention.
12 is a diagram illustrating a method of measuring the amount of power generated by the thermoelectric module according to the modification of FIG. 11 .
13 is a diagram illustrating a thermoelectric module according to another embodiment of the present invention.
14 is a flowchart illustrating a method of manufacturing a thermoelectric module according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, various embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In addition, throughout the specification, when a part "includes" a certain component, this means that other components may be further included rather than excluding other components unless otherwise stated.

In addition, throughout the specification, when it is referred to as "planar view", it means when the target part is viewed from above, and when it is referred to as "cross-section", it means when the cross-section obtained by cutting the target part vertically is viewed from the side.

1 is a diagram illustrating a thermoelectric module according to an embodiment of the present invention.

Referring to FIG. 1 , a thermoelectric module according to an embodiment of the present invention includes a heat transfer member 100 , a cooling member 200 corresponding to the heat transfer member 100 , and a heat transfer member 100 and a cooling member ( 200) and a plurality of thermoelectric elements 500 positioned between them. In this case, the plurality of thermoelectric elements 500 , the heat transfer member 100 , and the cooling member 200 are all located in the vacuum structure 1000 .

In this embodiment, the heat transfer member 100 and the cooling member 200 may be connected by a pressing member 600 , and the pressing member 600 is a thermoelectric element for each of the heat transfer member 100 and the cooling member 200 . The heat transfer member 100 and the cooling member 200 generate a force acting in a direction facing each other so as to approach 500 . In other words, pressure may be applied to the heat transfer member 100 in a direction toward the cooling member 200 , and pressure may be applied to the cooling member 200 in a direction toward the heat transfer member 100 .

The pressing member 600 may include at least one screw 600a, 600b, and 600c. 1 shows a cross-sectional view, and three screws 600a, 600b, and 600c are shown in the cross-section, but as the number of screws increases, the pressing process can be performed more precisely. However, if too many screws are used, processing time and cost may be added.

The plurality of thermoelectric elements 500 may be connected to each other by the element connection member 450 and may be connected to an external terminal by the module electrode 400 to transmit electrical signals. In addition, the cooling member 200 includes water cooling ports 300a and 300b extending outside the vacuum structure 1000 . The thermoelectric module according to the present embodiment further includes heat conductive layers 105 and 205 positioned between the heat transfer member 100 and the thermoelectric element 500 and between the cooling member 200 and the thermoelectric element 500 . By including, it is possible to increase adhesion between the heat transfer member 100 and the thermoelectric element 500 and between the cooling member 200 and the thermoelectric element 500 , and increase heat transfer efficiency.

Although not shown in FIG. 1 , the thermoelectric module according to the present embodiment includes a side plate surrounding the plurality of thermoelectric elements 500 between the heat transfer member 100 and the cooling member 200 . This side plate will be described with reference to FIG. 2 .

FIG. 2 is a schematic perspective view for explaining the vacuum structure of FIG. 1 .

Referring to FIG. 2 , the vacuum structure 1000 according to the present embodiment includes a side plate 900 positioned between the heat transfer member 100 and the cooling member 200 . The side plate 900 surrounds four sides of a rectangular parallelepiped formed between the heat transfer member 100 and the cooling member 200 . The side plate 900 is welded to the heat transfer member 100 and the cooling member 200 so that the thermoelectric element positioned inside the rectangular parallelepiped is positioned in a vacuum state. The heat transfer member 100, the cooling member 200, and the side plate 900 may each include at least one material selected from the group consisting of stainless steel, copper, aluminum, brass, aluminum silicon carbide (AlSiC), and steel. . However, it is not limited to these materials, and any material having high thermal conductivity may be used without limitation. At this time, for the ease of the process, the heat transfer member 100 , the cooling member 200 and the side plate 900 may be formed of the same material, and the heat transfer member 100 and/or the heat transfer member 100 and/or to select a material with high thermal conductivity. Alternatively, the cooling member 200 may be formed of a material different from that of the side plate 900 .

3 is a perspective view schematically illustrating a thermoelectric element assembly including the thermoelectric element described in FIG. 1 . 4 is a cross-sectional view illustrating the thermoelectric element assembly of FIG. 3 .

Referring to FIG. 3 , a thermoelectric element assembly 500A according to an embodiment of the present invention includes a first substrate 110 , a second substrate 210 , a plurality of electrodes 550 , and a plurality of thermoelectric elements 500 . do.

The first and second substrates 110 and 210 are formed in a plate shape, are disposed outside the thermoelectric element assembly 500A to protect various elements constituting the thermoelectric module such as the thermoelectric element 500, and the thermoelectric element assembly 500A ) and the outside can maintain electrical insulation. The first and second substrates 110 and 210 may be alumina substrates.

The electrodes 550 are positioned on the first and second substrates 110 and 210 and have electrical conductivity to allow current to flow. The electrode 550 is formed so that at least one surface of the first and second substrates 110 and 210 is exposed, so that the thermoelectric element 500 can be mounted. As shown in FIG. 3 , at least two thermoelectric elements 500 may be mounted on the electrode 550 , and the electrode 550 provides a path through which current may flow between the two thermoelectric elements 500 . do. The electrode 550 may be formed on the upper surface of the first substrate 110 and the lower surface of the second substrate 210 by a method such as deposition, sputtering, direct compression, or printing, and the electrode formed on the first substrate 110 . A thermoelectric element 500 may be disposed between the 550 and the electrode 550 formed on the second substrate 210 .

The electrode 550 may be formed of a conductive material, for example, at least one metal selected from the group consisting of copper, gold, silver, nickel, aluminum, chromium, tin, indium, zinc, etc. or these metals. It may be formed of an alloy containing.

The thermoelectric element 500 may be formed of a thermoelectric material, that is, a thermoelectric semiconductor. The thermoelectric semiconductor may include various types of thermoelectric materials such as chalcogenide-based, scuterudite-based, silicide-based, clathrate-based, and half-whistler-based thermoelectric materials. For example, a thermoelectric material such as a BiTe-based material or a PbTe-based material may be appropriately doped and used.

The thermoelectric element 500 includes an n-type thermoelectric element 510 and a p-type thermoelectric element 520 , and in the n-type thermoelectric element 510 , holes move to transfer thermal energy, and the p-type thermoelectric element ( 520) may transfer thermal energy by moving electrons. In the thermoelectric element 500 , an n-type thermoelectric element 510 and a p-type thermoelectric element 520 may form a pair to constitute one basic unit. Two or more of the n-type thermoelectric element 510 and/or the p-type thermoelectric element 520 may be provided to form a plurality of pairs. In addition, the n-type thermoelectric element 510 and the p-type thermoelectric element 520 may be alternately arranged to form a plurality of n-type thermoelectric element 510-p-type thermoelectric element 520 pairs.

The n-type thermoelectric element 510 and the p-type thermoelectric element 520 may be omnisciently connected to each other through the electrode 550 . For example, based on one electrode 550 , the n-type thermoelectric element 510 is bonded to one end of the electrode 550 , and the p-type thermoelectric element 520 is bonded to the other end of the electrode 550 . can

Referring to FIG. 4 , the thermoelectric module 2000 generates electricity using a temperature difference between the heat transfer member 100 and the cooling member 200 or is cooled/heated by supplying electricity. The heat conductive layers 105 and 205 may be positioned between the heat transfer member 100 and the first substrate 110 and between the cooling member 200 and the second substrate 210 . The heat conductive layers 105 and 205 transfer heat from the heat transfer member 100 to the thermoelectric element 500 or radiate heat to the cooling member 200, and at the same time, shock or vibration from the outside and the thermoelectric module 2000 component. It is possible to alleviate the increase in the mounting load due to the thermal expansion of the The thermal conductive layers 105 and 205 may include at least one of a graphite sheet, thermal grease, and a thermal pad.

5 is a perspective view illustrating a cooling member according to an embodiment of the present invention. 6 is a perspective view illustrating a heat transfer member according to an embodiment of the present invention. 7 is a side view showing a side plate according to an embodiment of the present invention. FIG. 8 is a photograph showing the cooling member of FIG. 5 . 9 is a photograph showing the heat transfer member of FIG. 6 . FIG. 10 is a photograph showing the side plate of FIG. 7 .

Referring to FIG. 5 , the cooling member 200 may include four welding portions that are welded to the side plate 900 . The cooling member 200 includes a water cooling port 300 , and the water cooling port 300 may be a passage through which a cooling material is introduced, and may be attached to an upper surface of the cooling member 200 .

A screw 600 is formed on the surface of the cooling member 200 as a pressing member extending from the heat transfer member and penetrating the surface of the cooling member 200 . Although a total of seven screws 600 are shown, the number may be increased or decreased in consideration of the required pressure level. In addition to the screw 600 , the module electrode 400 protrudes from the upper surface of the cooling member 200 . An example of the cooling member 200 described with reference to FIG. 5 can be confirmed through the photograph shown in FIG. 8 .

Referring to FIG. 6 , one surface of the heat transfer member 100 is plated with metal or ceramic, and one surface of the heat transfer member 100 shown in FIG. 6 is adjacent to the thermoelectric element assembly 500A of FIG. 3 . It may be located on the opposite side of the surface. An example of the heat transfer member 100 described with reference to FIG. 6 can be confirmed through the photograph shown in FIG. 9 .

Referring to FIG. 7 , the cooling member 200 shown in FIG. 5 is positioned at the upper end of the side plate 900 , and the heat transfer member 100 shown in FIG. 6 is positioned at the lower end thereof. An example of the side plate 900 described with reference to FIG. 7 can be confirmed through the photo shown in FIG. 10 .

11 is a diagram illustrating a method of measuring the amount of power generated by a thermoelectric module according to an embodiment of the present invention. 12 is a diagram illustrating a method of measuring the amount of power generated by the thermoelectric module according to the modification of FIG. 11 .

Referring to FIG. 11 , in the thermoelectric module according to the present embodiment described in FIG. 1 , the cooler 1200 is connected to the water cooling ports 300a and 300b , and the heat transfer member 100 using the radiant heater 1100 . heat can be supplied to In this case, the amount of thermoelectric generation may be measured using the electronic loader 1300 connected to the module electrode 400 of the thermoelectric element 500 .

Referring to FIG. 12 , although it is mostly similar to FIG. 11 , heat may be supplied to the heat transfer member 100 by using a cycling heater 1400 instead of the radiation heater of FIG. 11 . The cycling heater 1400 may contact the heat transfer member 100 .

The results measured by the method described in FIGS. 11 and 12 are shown in Table 1 below. In Table 1, the comparative example corresponds to a thermoelectric module having a pre-vacuum and post-pressurization structure, and the Example corresponds to a thermoelectric module having a pre-pressurized and post-vacuum structure.

comparative example Example power generation 4W 8.3W

Referring to Table 1, the thermoelectric module according to an embodiment of the present invention described above may have a structure formed by pre-pressurization and post-vacuum processes as described in a manufacturing method to be described later with reference to FIG. 14, and As a result of measuring the power generation, it was found to be 8.3W. On the other hand, as a comparative example, a thermoelectric module was formed after forming a pressurized structure in a pre-vacuum state. As a result of measuring the amount of power generation of this thermoelectric module, it was found to be 4W. In the case of the comparative example, since pressure is first applied to the structure constituting the thermoelectric module after the vacuum is formed, it is difficult to effectively apply the pressure, so that it is difficult to maintain the power generation efficiency due to a decrease in the pressure applied to the thermoelectric element.

13 is a diagram illustrating a thermoelectric module according to another embodiment of the present invention.

Most of the components of the thermoelectric module according to the present embodiment are the same as those of the embodiment of FIG. 1 , and only the different configurations will be described below.

Referring to FIG. 13 , the heat transfer member 100 includes a plurality of unit heat transfer members 100a, 100b, 100c, and 100d. The plurality of unit heat transfer members 100a, 100b, 100c, and 100d may correspond to one cooling member 200 . In FIG. 13, the unit heat transfer members 100a, 100b, 100c, and 100d are illustrated as four, but this is an example, and the unit heat transfer members 100a, 100b, 100c, The number of 100d) is variable. The unit heat transfer members 100a, 100b, 100c, and 100d may correspond to one thermoelectric element 500, and the pressing member 600 is at least formed in one unit heat transfer member 100a, 100b, 100c, 100d. It may include two screws. That is, each of the plurality of unit heat transfer members 100a , 100b , 100c , and 100d may overlap one thermoelectric element 500 in a direction perpendicular to the lower surface of the cooling member 200 .

The thermoelectric module according to the embodiment of FIG. 13 can apply uniform pressure to the thermoelectric element 500 in comparison with a method of pressing with one heat transfer member 100 , thereby increasing power generation efficiency and improving reliability.

14 is a flowchart illustrating a method of manufacturing a thermoelectric module according to an embodiment of the present invention.

Referring to FIG. 14 , the method of manufacturing a thermoelectric module according to the present embodiment includes disposing a thermoelectric element assembly between a heat transfer member and a cooling member ( S10 ). Thereafter, connecting the heat transfer member and the cooling member and pressurizing them (S20). At this time, as the distance between the heat transfer member and the cooling member increases, the thermoelectric element assembly comes into close contact with the heat transfer member and the cooling member.

By pressing, the heat transfer member that transmits high-temperature heat and the cooling member that cools the thermoelectric element can be in close contact with the plurality of thermoelectric elements, thereby increasing power generation efficiency.

Thereafter, a step (S30) of forming a side plate positioned between the heat transfer member and the cooling member and surrounding the thermoelectric element assembly is performed. In this case, the side plate may be welded to the heat transfer member and the cooling member.

Thereafter, a step (S40) of creating a vacuum state in the region partitioned by the heat transfer member, the cooling member, and the side plate may be performed. After the internal air is drawn out through the vacuum port formed on the upper surface of the cooling member, the vacuum port is welded to block a passage through which air can pass, and a vacuum state may be maintained.

By the step of creating a vacuum state, oxidation of the thermoelectric element is prevented, thereby improving the reliability of the element.

Although the preferred embodiment of the present invention has been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims are also provided. is within the scope of the

100: heat transfer member 200: cooling member
500: thermoelectric element 500A: thermoelectric element assembly
600: pressure member 1000: vacuum structure

Claims (16)

delete delete delete delete delete delete delete delete delete delete delete delete disposing the thermoelectric element assembly between the heat transfer member and the cooling member;
connecting the heat transfer member and the cooling member, and pressing the heat transfer member and the cooling member to be close to the thermoelectric element assembly;
forming a side plate positioned between the heat transfer member and the cooling member and surrounding the thermoelectric element assembly; and
vacuuming an area defined by the heat transfer member, the cooling member and the side plate;
The step of making the region defined by the heat transfer member, the cooling member, and the side plate into a vacuum state is performed after the step of pressing the heat transfer member and the cooling member to come close to the thermoelectric element assembly. Way. In claim 13,
The step of pressing the heat transfer member and the cooling member to be close to the thermoelectric element assembly includes:
A method of manufacturing a thermoelectric module in which the thermoelectric element assembly is brought into close contact with the heat transfer member and the cooling member as the distance between the heat transfer member and the cooling member increases by using a pressing member. delete In claim 13,
The forming of the side plate includes welding the heat transfer member and the cooling member.

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