KR102443114B1 - Display device - Google Patents

Abstract

The display device includes a display panel including a pixel, a lower pad electrically connected to the pixel, and a first signal line connecting the pixel and the lower pad, the display panel being disposed on the display panel, the conductive pattern being electrically connected to the conductive pattern a touch sensing member including an upper pad and a second signal line connecting the conductive pattern and the upper pad, wherein the lower pad is adjacent to a first lower pad connected to the first signal line and the first lower pad a second lower pad, wherein the upper pad includes a first upper pad and a second upper pad adjacent to the first upper pad and connected to the second signal line, wherein the first upper pad includes the first lower pad It may be disposed on the pad, and the second upper pad may be disposed on the second lower pad.

Description

display device {DISPLAY DEVICE}

The present invention relates to a display device, and to a display device in which a touch sensing member is integrated.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. The input devices of the display devices include a keyboard or a mouse. Also, recently, display devices have a touch sensing member as an input device.

An object of the present invention is to reduce defects occurring in a manufacturing process by eliminating a step difference between a pad part of a display panel and a pad part of a touch sensing member.

Another object of the present invention is to improve reliability when a boundary region disposed between an active region and a pad region in a display panel is bent.

A display device according to an embodiment includes a display panel including a pixel, a lower pad electrically connected to the pixel, and a first signal line connecting the pixel and the lower pad, the display panel being disposed on the display panel, a conductive pattern, and the conductive pattern a touch sensing member including an upper pad electrically connected to a pattern and a second signal line connecting the conductive pattern and the upper pad, wherein the lower pad includes a first lower pad connected to the first signal line and the second signal line connected to the first lower pad. a second lower pad adjacent to a first lower pad, wherein the upper pad includes a first upper pad and a second upper pad adjacent to the first upper pad and connected to the second signal line; is disposed on the first lower pad, and the second upper pad is disposed on the second lower pad.

According to an embodiment of the present invention, the pad part of the display panel and the pad part of the touch sensing member may be disposed at the same height.

According to an embodiment of the present invention, ductility of a bent portion of the display panel may be increased.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
1B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment of the present invention.
1C is a perspective view illustrating a third operation of a display device according to an exemplary embodiment of the present invention.
2A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
2B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment of the present invention.
3 is a cross-sectional view of a display device according to an exemplary embodiment.
4 is a cross-sectional view of a display module according to an embodiment of the present invention.
5 is a plan view of an organic light emitting display panel according to an embodiment of the present invention.
6 is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
7 and 8 are partial cross-sectional views of an organic light emitting display panel according to an exemplary embodiment.
9 is a plan view of a touch sensing member according to an embodiment of the present invention.
FIG. 10 is an enlarged view of AA of FIG. 9 .
11 is a cross-sectional view taken along II′ of FIG. 10 .
12 illustrates the display panel pads of FIG. 5 and the touch sensing member pads of FIG. 9 .
13A is a cross-sectional view taken along II-II′ of FIG. 12 .
13B is a cross-sectional view taken along III-III′ of FIG. 12 .
13C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
14A is a cross-sectional view taken along II-II′ of FIG. 12 .
14B is a cross-sectional view taken along III-III′ of FIG. 12 .
14C and 14D are cross-sectional views taken along IV-IV′ of FIG. 12 .
15A is a cross-sectional view taken along II-II′ of FIG. 12 .
15B is a cross-sectional view taken along III-III′ of FIG. 12 .
15C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
16A is a cross-sectional view taken along II-II′ of FIG. 12 .
16B is a cross-sectional view taken along III-III′ of FIG. 12 .
FIG. 16C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
17A is a cross-sectional view taken along II-II′ of FIG. 12 .
17B is a cross-sectional view taken along III-III′ of FIG. 12 .
17C and 17D are cross-sectional views taken along IV-IV′ of FIG. 12 .
18A is a cross-sectional view taken along II-II′ of FIG. 12 .
18B is a cross-sectional view taken along III-III′ of FIG. 12 .
18C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
19A is a cross-sectional view taken along II-II′ of FIG. 12 .
19B is a cross-sectional view taken along III-III′ of FIG. 12 .
19C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
FIG. 20A is a cross-sectional view taken along II-II′ of FIG. 12 .
FIG. 20B is a cross-sectional view taken along III-III′ of FIG. 12 .
20C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
21A is a cross-sectional view taken along II-II′ of FIG. 12 .
21B is a cross-sectional view taken along III-III′ of FIG. 12 .
21C is a cross-sectional view taken along IV-IV′ of FIG. 12 .
22 and 23 are plan views each showing a display module and a printed circuit board according to an embodiment of the present invention.
24 illustrates a bent shape of a display module according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as being “on,” “connected to,” or “coupled with” another component, it is directly disposed/on the other component. It means that it can be connected/coupled or a third component can be placed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “and/or” includes any combination of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as "below", "below", "above", "upper" and the like are used to describe the relationship of the components shown in the drawings. The above terms are relative concepts, and are described with reference to directions indicated in the drawings.

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features, number, or step. , it should be understood that it does not preclude the possibility of the existence or addition of , operation, components, parts or combinations thereof.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment. 1C is a perspective view illustrating a third operation of a display device DD according to an exemplary embodiment.

As shown in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction axis DR1 and the second direction axis DR2 . The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. A front surface (or an upper surface) and a rear surface (or a lower surface) of each member are divided by the third direction axis DR3 . However, the directions indicated by the first to third direction axes DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third direction axes DR1 , DR2 , and DR3 , respectively. Although the flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat display device.

1A to 1C illustrate a foldable display device as an example of the flexible display device DD. 2A and 2B illustrate a foldable display as an example of the flexible display DD. However, the present invention may be a rollable flexible display device that is rolled, and is not particularly limited. The flexible display device DD according to the present invention may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

As illustrated in FIG. 1A , the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be relatively designed.

The flexible display device DD may include a housing HS. The housing HS is disposed outside the flexible display device DD and may accommodate internal components. Hereinafter, for convenience of description, the housing HS is not separately illustrated or described.

1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD displays the bending area BA, the first non-bending area NBA1, and the second non-bending area NBA2 that are bent on the basis of the bending axis BX. may include As illustrated in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C , the display device DD may be outer-bending so that the display surface IS is exposed to the outside.

In an embodiment of the present invention, the display device DD may include a plurality of bending areas BA. In addition, the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined in parallel to the first direction axis DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to a radius of curvature. In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in FIGS. 1A and 1B .

2A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment. 2B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment of the present invention. 2A and 2B illustrate a display device in which the non-display area DD-NDA is folded as an example of the foldable display device DD. As such, in the display device DD according to the present invention, the number of the bending area BA and the non-bending area NBA is not limited, and the position of the bending area is not limited.

3 is a cross-sectional view of a display device DD according to an exemplary embodiment. 4 is a cross-sectional view of a display module DM according to an embodiment of the present invention. 3 illustrates a cross section defined by the second direction axis DR2 and the third direction axis DR3, and FIG. 4 illustrates a cross section defined by the first direction axis DR1 and the third direction axis DR3. did.

As shown in Figure 3, The display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1 and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, and the second adhesive member AM2 couples the display module DM and the window WM. In an embodiment of the present invention, the first adhesive member AM1 and the second adhesive member AM2 may be omitted. Each of the protective film PM and the window WM may be continuously formed through a coating process.

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside, and provides the adhesive surface AS1 adhered to the first adhesive member AM1. Hereinafter, the adhesive surface AS1 of the protective film PM is referred to as a first adhesive surface AS1 to distinguish it from the adhesive surface of other members. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

The protective film PM may include a plastic film as a base layer. The protective film (PM) is made of polyethersulfone (PES, polyethersulphone), polyacrylate (PAR, polyacrylate), polyether imide (PEI, polyetherimide), polyethylene naphthalate (PEN, polyethyelenen napthalate), polyethylene terephthalate (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS, polyphenylene sulfide), polyallylate, polyimide (PI, polyimide), polycarbonate (PC, polycabonate), polyarylene ether sulfone (poly(aryleneether sulfone)) and It may include a plastic film including any one selected from the group consisting of combinations thereof.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic/inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method.

The window WM may protect the display module DM from external impact and may provide an input surface to the user. The window WM provides the second outer surface OS-U exposed to the outside, and provides the adhesive surface AS2 adhered to the second adhesive member AM2 . The display surface IS illustrated in FIGS. 1A to 1C may be the second outer surface OS-U. Hereinafter, the adhesive surface AS2 of the window WM is referred to as a second adhesive surface AS2 to distinguish it from the adhesive surface of other members.

In the display device DD shown in FIGS. 2A and 2B , the window WM may not be disposed in the bending area BA. However, the present invention is not limited thereto, and in another embodiment of the present invention, the window WM may also be disposed in the bending area BA.

The display module DM includes an organic light emitting display panel DP and a touch sensing member TS integrally formed by a continuous process. The organic light emitting display panel DP generates an image IM (refer to FIG. 1A ) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing in the thickness direction DR3.

The touch sensing member TS acquires coordinate information of an external input. The touch sensing member TS may be directly disposed on the second display panel surface BS1-U. In this embodiment, the touch sensing member TS may be manufactured by a continuous process with the organic light emitting display panel DP.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The antireflection layer may include a color filter or a laminate structure of a conductive layer/dielectric layer/conductive layer or an optical member. The antireflection layer absorbs or destructively interferes with or polarizes light incident from the outside to reduce the reflectance of external light.

Each of the first adhesive member AM1 and the second adhesive member AM2 is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR) or a pressure sensitive adhesive film (PSA) Adhesive film). Each of the first adhesive member AM1 and the second adhesive member AM2 includes a photocurable adhesive material or a thermosetting adhesive material, and the material thereof is not particularly limited.

Although not shown separately, the display device DD may further include a frame structure supporting the functional layers to maintain the state illustrated in FIGS. 1A to 2B . The frame structure may include a joint structure or a hinge structure.

As shown in FIG. 4 , the organic light emitting display panel DP includes a base layer SUB, a first circuit layer CL1 disposed on the base layer SUB, a light emitting device layer ELL, and a thin film encapsulation layer. (TFE). The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate.

The first circuit layer CL1 may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the first circuit layer CL1 may constitute signal lines or a circuit portion of a pixel. The light emitting device layer ELL includes organic light emitting diodes (OLED). The thin film encapsulation layer TFE seals the light emitting device layer ELL. The thin film encapsulation layer (TFE) includes at least two inorganic thin films and an organic thin film disposed therebetween. The thin film encapsulation layer TFE may protect the light emitting device layer ELL from foreign substances such as moisture and dust particles.

In an embodiment of the present invention, the touch sensing member TS may be of a single-layer type. That is, the touch sensing member TS may include a single conductive layer. Here, the single conductive layer means “one conductive layer divided by an insulating layer”. The stacked structure of the first metal layer/second metal layer/metal oxide layer corresponds to a single conductive layer, and the first metal layer/insulation layer/metal oxide layer corresponds to a double conductive layer.

A plurality of touch electrodes and a plurality of touch signal lines are formed by patterning a single conductive layer. That is, the sensors of the touch sensing member TS are disposed on the same layer. The sensors may be disposed directly on the thin film encapsulation layer (TFE). Also, a portion of each of the touch signal lines is disposed on the same layer as the sensors. A portion of each of the touch signal lines may be disposed on the first circuit layer CL1 . A detailed description of the structure of the touch sensing member TS will be described later.

The touch signal lines and sensors may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch signal lines and sensors may include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch signal lines and the sensors may include the same material or different materials.

Since the display module DM according to the present embodiment includes a single-layer touch sensing member, the structure is simplified compared to the display module DM including a multi-layered touch sensing member. Even when the display module DM is bent as shown in FIGS. 1B and 1C , the stress generated in the touch sensing member TS is reduced. This is because the touch sensing member TS is slim.

5 is a plan view of an organic light emitting display panel DP according to an embodiment of the present invention. 6 is an equivalent circuit diagram of a pixel PX according to an embodiment of the present invention. 7 and 8 are partial cross-sectional views of an organic light emitting display panel DP according to an exemplary embodiment.

5 , the organic light emitting display panel DP includes a display area DA and a non-display area NDA in a plan view. The display area DA and the non-display area NDA of the organic light emitting display panel DP respectively correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD. The display area DA and the non-display area NDA of the organic light emitting display panel DP are not necessarily the same as the display area DD-DA and the non-display area DD-NDA of the display device DD. , may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of signal lines SGL and a plurality of pixels PX. An area in which the plurality of pixels PX are disposed is defined as the display area DA. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The plurality of signal lines SGL includes gate lines GL, data lines DL, a power line PL, and a control signal line CSL. The gate lines GL are respectively connected to a corresponding pixel PX of the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX of the plurality of pixels PX. do. The power line PL is connected to the plurality of pixels PX. A gate driving circuit DCV to which the gate lines GL are connected may be disposed on one side of the non-display area NDA. The control signal line CSL may provide control signals to the gate driving circuit DCV.

Some of the gate lines GL, data lines DL, power line PL, and control signal line CSL are disposed on the same layer, and some are disposed on different layers. When the signal lines disposed on any one of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL are defined as the first signal line, the other The signal lines disposed in the layer may be defined as second signal lines. Signal lines disposed on another layer may be defined as third signal lines.

Each of the gate lines GL, data lines DL, power line PL, and control signal line CSL may include a signal wiring unit and lower pads PD-D connected to ends of the signal wiring unit. can The signal wiring portion may be defined as a portion excluding the lower pads PD-D of each of the gate lines GL, the data lines DL, the power line PL, and the control signal line CSL.

In an embodiment of the present invention, the lower pads PD-D may include a lower display panel pad PD-DPD and a lower touch sensing member pad PD-TSD. The lower pads PD-D may be formed in the same process as transistors for driving the pixels PX. For example, transistors for driving the lower pads PD-D and the pixels PX may be formed in the same low temperature polycrystaline silicon (LTPS) process or low temperature polycrystalline oxide (LTPO) process.

In an embodiment of the present invention, the display panel pads PD-DP may include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although not shown, the gate pad part may overlap the gate driving circuit DCV and be connected to the gate driving circuit DCV. Although not specifically indicated, a portion of the non-display area NDA in which the control pad CSL-P, the data pad DL-P, and the power pad PL-P are aligned is defined as a pad area. As will be described later, the pads of the touch sensing member TS may be disposed adjacent to the pads of the organic light emitting display panel DP.

6 exemplarily illustrates a pixel PX connected to any one gate line GL, any one data line DL, and a power supply line PL. The configuration of the pixel PX is not limited thereto and may be modified and implemented.

The pixel PX includes an organic light emitting diode OLED as a display device. The organic light emitting diode (OLED) may be a top light emitting diode or a bottom light emitting diode. The pixel PX is a circuit part for driving the organic light emitting diode OLED and includes a first transistor TFT1 or a switching transistor, a second transistor TFT2 or a driving transistor, and a capacitor CP. The organic light emitting diode OLED generates light by an electrical signal provided from the transistors TFT1 and TFT2.

The first transistor TFT1 outputs a data signal applied to the data line DL in response to the scan signal applied to the gate line GL. The capacitor CP is charged with a voltage corresponding to the data signal received from the first transistor TFT1 .

The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls a driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor CP. The organic light emitting diode OLED emits light during the turn-on period of the second transistor TFT2.

FIG. 7 is a cross-sectional view of a portion corresponding to the first transistor TFT1 and the capacitor CP of the equivalent circuit shown in FIG. 6 . FIG. 8 is a cross-sectional view of a portion corresponding to the second transistor TFT2 and the organic light emitting diode OLED of the equivalent circuit shown in FIG. 6 .

7 and 8 , the first circuit layer CL1 is disposed on the base layer SUB. A semiconductor pattern AL1 (hereinafter, referred to as a first semiconductor pattern) of the first transistor TFT1 and a semiconductor pattern AL2 (hereinafter, a second semiconductor pattern) of the second transistor TFT2 are disposed on the base layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be selected to be the same as or different from each other in amorphous silicon, polysilicon, and metal oxide semiconductors.

The first circuit layer CL1 includes a first conductive pattern CDP1 (refer to FIG. 12 ) and organic/inorganic layers BR, BL, 12 , 14 , and 16 . The first conductive pattern CDP1 (refer to FIG. 12 ) may include a first transistor TFT1 , a second transistor TFT2 , and electrodes E1 and E2 . The organic/inorganic layers BR, BL, 12, 14, and 16 include the functional layers BR and BF, the first insulating layer 12 , the second insulating layer 14 , and the third insulating layer 16 . may include

The functional layers BR and BF may be disposed on one surface of the base layer SUB. The functional layers BR and BF include at least one of a barrier layer BR and a buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be disposed on the barrier layer BR or the buffer layer BF.

A first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and/or an inorganic layer. In particular, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

A control electrode GE1 (hereinafter, referred to as a first control electrode) of the first transistor TFT1 and a control electrode GE2 (hereinafter, referred to as a second control electrode) of the second transistor TFT2 are disposed on the first insulating layer 12 . do. The first electrode E1 of the capacitor CP is disposed on the first insulating layer 12 . The first control electrode GE1 , the second control electrode GE2 , and the first electrode E1 may be manufactured according to the same photolithography process as the gate lines GL (refer to FIG. 5 ). In other words, the first electrode E1 may be made of the same material as the gate lines GL, have the same stacked structure, and be disposed on the same layer.

A second insulating layer 14 is disposed on the first insulating layer 12 to cover the first control electrode GE1 , the second control electrode GE2 , and the first electrode E1 . The second insulating layer 14 includes an organic layer and/or an inorganic layer. In particular, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

Data lines DL (refer to FIG. 5 ) may be disposed on the second insulating layer 14 . An input electrode SE1 (hereinafter, a first input electrode) and an output electrode DE1 (hereinafter, a first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14 . An input electrode SE2 (hereinafter, a second input electrode) and an output electrode DE2 (hereinafter, a second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14 . The first input electrode SE1 is branched from a corresponding data line among the data lines DL. The power line PL (refer to FIG. 5 ) may be disposed on the same layer as the data lines DL. The second input electrode SE2 may be branched from the power line PL.

The second electrode E2 of the capacitor CP is disposed on the second insulating layer 14 . The second electrode E2 may be manufactured according to the same photolithography process as the data lines DL and the power line PL, may be made of the same material, have the same stacked structure, and may be disposed on the same layer. have.

The first input electrode SE1 and the first output electrode DE1 form a first through hole CH1 and a second through hole CH2 passing through the first insulating layer 12 and the second insulating layer 14 . are respectively connected to the first semiconductor pattern AL1 through the The first output electrode DE1 may be electrically connected to the first electrode E1 . For example, the first output electrode DE1 may be connected to the first electrode E1 through a through hole (not shown) penetrating the second insulating layer 14 . The second input electrode SE2 and the second output electrode DE2 form a third through hole CH3 and a fourth through hole CH4 passing through the first insulating layer 12 and the second insulating layer 14 . through the second semiconductor pattern AL2. Meanwhile, in another embodiment of the present invention, the first transistor TFT1 and the second transistor TFT2 may be modified to have a bottom gate structure.

The third insulating layer 16 covering the first input electrode SE1 , the first output electrode DE1 , the second input electrode SE2 , and the second output electrode DE2 on the second insulating layer 14 . ) is placed. The third insulating layer 16 includes an organic layer and/or an inorganic layer. In particular, the third insulating layer 16 may include an organic material to provide a flat surface.

Any one of the first insulating layer 12 , the second insulating layer 14 , and the third insulating layer 16 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 may be defined as an interlayer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the interlayer insulating layer to insulate the conductive patterns.

The first circuit layer CL1 includes dummy conductive patterns. The dummy conductive patterns are disposed on the same layer as the semiconductor patterns AL1 and AL2, the control electrodes GE1 and GE2, or the output electrodes DE1 and DE2. The dummy conductive patterns may be disposed in the non-display area NDA (refer to FIG. 5 ). A detailed description of the dummy conductive patterns will be described later.

A light emitting device layer ELL is disposed on the third insulating layer 16 . A pixel defining layer PXL and an organic light emitting diode OLED are disposed on the third insulating layer 16 . An anode AE is disposed on the third insulating layer 16 . The anode AE is connected to the second output electrode DE2 through the fifth through hole CH5 penetrating the third insulating layer 16 . An opening OP is defined in the pixel defining layer PXL. The opening OP of the pixel defining layer PXL exposes at least a portion of the anode AE.

The light emitting device layer ELL includes a light emitting area PXA and a non-emission area NPXA adjacent to the light emitting area PXA. The non-emission area NPXA may surround the light emission area PXA. In the present embodiment, the light emitting area PXA is defined to correspond to the anode AE. However, the light emitting area PXA is not limited thereto, and it is sufficient if the light emitting area PXA is defined as an area in which light is generated. The emission area PXA may be defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (refer to FIG. 5 ).

An organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be disposed only in a region corresponding to the opening OP. That is, the organic emission layer EML may be formed separately in each of the plurality of pixels PX.

An electronic control layer ECL is disposed on the organic light emitting layer EML. A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. Also, the organic light emitting layer EML may have a multi-layered structure.

In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed. In this case, the thin film encapsulation layer (TFE) directly covers the capping layer. The thin film encapsulation layer TFE may include an organic layer including an organic material and an inorganic layer including an inorganic material.

9 is a plan view of a touch sensing member TS according to an embodiment of the present invention.

In this embodiment, a one-layer capacitive touch sensing member TS is illustrated as an example. It may be driven in a self-capacitance method, and a driving method of the touch sensing member TS for obtaining coordinate information is not particularly limited. In addition, the structure of the touch sensing member TS is not limited to a one-layer structure and may be a two-layer structure.

The touch sensing member TS includes first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-2, and second touch patterns TE1-1 to TE1-3 on a plane view. It may include two touch signal lines SL2 and upper pads PD-U of the touch sensing member.

The first touch patterns TE1-1 to TE1-3 extend in the first direction DR1 and are arranged in the second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 may have a mesh shape in which a plurality of touch openings OP-TC are defined.

Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1. The first sensing patterns SP1 are arranged in the first direction DR1 . Each of the first connection patterns CP1 connects two adjacent first sensing patterns SP1 among the first sensing patterns SP1.

The first touch signal lines SL1 may also have a mesh shape. The first touch signal lines SL may have the same layer structure as the first touch patterns TE1-1 to TE1-3.

The second touch patterns TE2-1 to TE2-3 intersect the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 may be insulated from the first touch patterns TE1-1 to TE1-3 by the insulating patterns IL-P. The insulating patterns IL-P may include an inorganic material or an organic material. The inorganic material may include silicon oxide or silicon nitride. The organic material may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, and a perylene-based resin.

Each of the second touch patterns TE2-1 to TE2-3 may have a mesh shape in which a plurality of touch openings OP-TC are defined.

Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2. The second sensing patterns SP2 are arranged in the second direction DR2 . Each of the second connection patterns CP2 connects two adjacent second sensing patterns SP2 among the second sensing patterns SP2 .

The second connection patterns CP2 have a bridge function. The insulating patterns IL-P are disposed on the first connection patterns CP1 , and the second connection patterns CP2 are disposed on the insulating patterns IL-P.

The second touch signal lines SL2-1 to SL2-3 may also have a mesh shape. The second touch signal lines SL2-1 to SL2-3 may have the same layer structure as the second touch patterns TE2-1 to TE2-3.

The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are electrostatically coupled. As touch sensing signals are applied to the first touch patterns TE1-1 to TE1-3, capacitors are formed between the first sensing patterns SP1 and the second sensing patterns SP2.

In the present invention, the shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are merely exemplary and are not limited thereto. It is sufficient if the connection patterns CP1 and CP2 are defined as a portion where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 intersect, and the sensing pattern It is sufficient if the first and second touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are defined as non-overlapping portions SP1 and SP2. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a bar shape having a constant width.

The upper pads PD-U of the touch sensing member may be disposed at distal ends of the first touch signal lines SL1 and the second touch signal lines SL2 . The upper pads PD-U may include an upper display panel pad PD-DPU and an upper touch sensing member pad PD-TSU. The upper pads PD-U include first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-2, and The second touch signal lines SL2 may be formed in the same process.

FIG. 10 is an enlarged view of AA of FIG. 9 . 11 is a cross-sectional view taken along line II′ of FIG. 10 .

The display area DA includes a plurality of light-emitting areas PXA and a non-emission area NPXA surrounding the plurality of light-emitting areas PXA. The first sensing patterns SP1 may have a mesh shape overlapping the non-emission area NPXA. Although not shown separately, the second sensing patterns SP2 and the touch signal lines SL1 and SL2 may also have a mesh shape overlapping the non-emission area NPXA.

The first sensing pattern SP1 includes a plurality of vertical portions SP1-C extending in the first direction DR1 and a plurality of horizontal portions SP1-L extending in the second direction DR2. . The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L may be defined as mesh lines. The line width of the mesh line may be several micrometers.

The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L are connected to each other to form a plurality of touch openings TS-OP. Although it is illustrated that the touch openings TS-OP correspond to the emission areas PXA one-to-one, the present invention is not limited thereto. One touch opening TS-OP may correspond to two or more emission areas PXA. Although the mesh wire exposed to the outside is illustrated in FIGS. 10 and 11 , the display module DM (refer to FIG. 4 ) may further include an insulating layer disposed on the thin film encapsulation layer TFE to cover the mesh wire.

12 illustrates the display panel pads PD-DP of FIG. 5 and the touch sensing member pads PD-TS of FIG. 9 . The display module DM may be divided into an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD between the active area AR-ACV and the pad area AR-PD. can

In the active region AR-ACV, the display module DM includes the first conductive pattern CDP1. In the pad area AR-PD, the display module DM includes the second conductive pattern CDP2. In the boundary area AR-BD, the display module DM includes the third conductive pattern CDP3. The first to third conductive patterns CDP1 to CDP3 are patterns for conducting electrical signals for driving the display panel DP or the touch sensing member TS, respectively, and may include metal.

The display panel pads PD-DP and the touch sensing member pads PD-TS may be disposed adjacent to each other. Also, the display panel pads PD-DP and the touch sensing member pads PD-TS may be arranged side by side. However, the present invention is not limited thereto, and the separation distance between the display panel pads PD-DP and the touch sensing member pads PD-TS may be changed as needed, and may not be arranged side by side.

13A is a cross-sectional view taken along II-II′ of FIG. 12 . 13B is a cross-sectional view taken along III-III′ of FIG. 12 . 13C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 13A to 13C show an embodiment of the present invention.

Touch Sensing Member Pad Touch Sensing Member Pad Touch Sensing Member Pad Referring to FIG. 13A , the base layer SUB includes an active region AR-ACV, a pad region AR-PD, and an active region AR-ACV and a pad. It includes a boundary region AR-BD between regions AR-PD.

In an embodiment of the present invention, the active area AR-ACV, the pad area AR-PD, and the boundary area AR-BD are based on the display panel DP, and the active area AR-ACV emits light. The region including the device layer ELL, and the pad region AR-PD including the display panel pads PD-DP and the touch sensing member pads PD-TS receiving signals from the printed circuit board. area, and the boundary area AR-BD may be an area between the active area AR-ACV and the pad area AR-PD.

Circuit layers CL1 and CL2 are disposed on the base layer SUB. The circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2 . The first circuit layer CL1 is disposed on the active region AR-ACV of the base layer SUB. The second circuit layer CL2 is disposed on the pad region AR-PD of the base layer SUB.

A light emitting device layer ELL and a thin film encapsulation layer TFE are disposed on the first circuit layer CL1 . The first circuit layer CL1 and the second circuit layer CL2 may include functional layers BR and BF, respectively. For convenience, among the functional layers BR and BF, a first functional layer included in the first circuit layer CL1 may be referred to as a first functional layer, and a second functional layer included in the second circuit layer CL2 may be referred to as a second functional layer.

Since the first circuit layer CL1, the light emitting device layer ELL, and the thin film encapsulation layer TFE have been described with reference to FIGS. 7 and 8 , a detailed description thereof will be omitted.

A touch sensing member TS may be disposed on the thin film encapsulation layer TFE. The touch sensing member TS includes a touch inorganic layer IL-T, an insulating pattern IL-P, a plurality of touch electrodes, and a touch protection layer PVX on a cross-section. Each of the inorganic touch layer IL-T and the insulating pattern IL-P may include an inorganic material. The touch protection layer PVX may include an organic material.

Referring to FIG. 9 , the plurality of touch electrodes include first touch patterns TE1-1 to TE1-3, first touch signal lines SL1, and second touch patterns TE2-1 to TE2-2. , second touch signal lines SL2 may be formed.

The second circuit layer CL2 may include a second conductive pattern CDP2 (refer to FIG. 12 ) and organic/inorganic layers BR, BL, 12, 14, and 16 . The second conductive pattern CDP2 may include a display panel pad PD-DP and a touch sensing member pad PD-TS. The organic/inorganic layers BR, BL, 12, 14 and 16 include the second functional layers BR and BF, the first insulating layer 12 , the second insulating layer 14 , and the third insulating layer 16 . ) may be included.

The display panel pad PD-DP may be disposed on the second functional layer and may be electrically connected to the first circuit layer CL1 . At least one of the first insulating layer 12 and the second insulating layer 14 may be disposed between the display panel pad PD-DP and the second functional layer.

The display panel pad PD-DP may include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CDP1 by the third conductive pattern CDP3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD, and is electrically connected to the lower display panel pad PD-DPD. Accordingly, the electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CDP1 of the first circuit layer CL1 through the lower display panel pad PD-DPD.

A boundary layer BDL is disposed on the boundary region AR-BD of the base layer SUB. The boundary layer BDL may include an organic layer OG and a third conductive pattern CDP3. The organic layer OG may be in contact with the base layer SUB, and the organic layer OG may be disposed between the first circuit layer CL1 and the second circuit layer CL2 . More specifically, the organic layer OG may be disposed between the first functional layer and the second functional layer.

Unlike the first and second circuit layers CL1 and CL2 adjacent to each other, the boundary layer BDL does not include an inorganic material layer including an inorganic material. Accordingly, the flexibility of the boundary layer BDL is improved, and a portion of the display panel DP that overlaps the boundary region AR-BD may be bent.

An organic layer may be further disposed on the third conductive pattern CDP3 . The organic layer disposed on the third conductive pattern CDP3 may be formed in the same process as the third insulating layer 16 or the pixel defining layer PXL.

The third conductive pattern CDP3 may be formed in the same process as the lower display panel pad PD-DPD. However, the present invention is not limited thereto, and the third conductive pattern CDP3 may be electrically connected to the lower display panel pad PD-DPD formed through a separate process.

Referring to FIG. 13B , unlike in FIG. 13A , the touch signal line SL2 of the touch sensing member TS is electrically connected to the third conductive pattern CDP3 in the active region AR-ACV. In the pad area AR-PD, the third conductive pattern CDP3 is electrically connected to the upper touch sensing member pad PD-TSU. In this case, the third conductive pattern CDP3 may be electrically insulated from the lower touch sensing member pad PD-TSD.

9 and 13B , the touch sensing member TS includes the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 disposed in the active area AR-ACV. to TE2-2), the touch sensing member pad PD-TS disposed in the pad region AR-PD, and the touch patterns TE1-1 to TE1-3, TE2-1 to TE2-2 and touch sensing and touch signal lines SL1 and SL2 electrically connecting the member pads PD-TS.

The touch sensing member pad PD-TS may include a lower touch sensing member pad PD-TSD and an upper touch sensing member pad PD-TSU. The upper touch sensing member pad PD-TSU is connected to the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-2 by the touch signal lines SL1 and SL2 and the third conductive pattern CDP3. electrically connected. That is, the upper touch sensing member pad PD-TSU is electrically connected to the sensing patterns SP1 by the touch signal lines SL1 and SL2 and the third conductive pattern CDP3.

The lower touch sensing member pad PD-TSD may be electrically insulated from the upper touch sensing member pad PD-TSU. However, the present invention is not limited thereto, and in another embodiment of the present invention, the lower touch sensing member pad PD-TSD may be electrically connected to the upper touch sensing member pad PD-TSU.

The upper touch sensing member pad PD-TSU is disposed on the lower touch sensing member pad PD-TSD. The height at which the upper touch sensing member pad PD-TSU is disposed may be increased by the thickness of the lower touch sensing member pad PD-TSD.

Unlike the third conductive pattern CDP3 of FIG. 13 , the third conductive pattern CDP3 in FIG. 13B is not electrically connected to the first conductive pattern CDP1 . However, the present invention is not limited thereto, and if necessary, the third conductive pattern CDP3 and the first conductive pattern CDP1 of FIG. 14 may be electrically connected to each other.

In FIG. 13B , descriptions of other components are substantially the same as those described in FIG. 13A , and thus, descriptions thereof will be omitted.

The length HH1 measured from the base layer SUB to the upper display panel pad PD-DPU is substantially the same as the length HH2 measured from the base layer SUB to the upper touch sensing member pad PD-TSU. do.

Although not shown, in another embodiment of the present invention, at least one of the inorganic touch layer IL-T and the insulating patterns IL-P may also be disposed in the boundary region AR-BD. That is, in this case, at least one of the inorganic touch layer IL-T and the insulating patterns IL-P is in the active region AR-ACV, the pad region AR-PD, and the boundary region AR-BD. laid out as a whole.

Referring to FIG. 13C , the upper display panel pad PD-DPU and the upper touch sensing member pad PD-TSU are disposed on the same layer. The upper display panel pad PD-DPU may be electrically connected to the lower display panel pad PD-DPD through the sixth through hole CH6. Although not shown, a dummy electrode may be disposed on the first insulating layer 12 .

Therefore, in the process of attaching the printed circuit board to the display panel pad PD-DP and the touch sensing member pad PD-TS, the height of the display panel pad PD-DP and the touch sensing member pad PD-TS The pressure applied to the pads PD-DP and PD-TS is constant by the difference. Accordingly, it is possible to prevent defects occurring in the process of attaching the printed circuit board. In addition, according to the operation process of the flexible display device DD, durability against external stress may be improved.

14A is a cross-sectional view taken along II-II′ of FIG. 12 . 14B is a cross-sectional view taken along III-III′ of FIG. 12 . 14C and 14D are cross-sectional views taken along IV-IV′ of FIG. 12, respectively. 14A to 14D show an embodiment of the present invention.

The description of FIG. 14A is substantially the same as that of FIG. 13A, and thus will be omitted.

14B and 14C , the upper touch sensing member pad PD-TSU may be electrically connected to the lower touch sensing member pad PD-TSD through the seventh through hole CH7.

14D shows that the width of the sixth through hole CH6 and the seventh through hole CH7 is larger than that of FIG. 14C , so that the structures of the display panel pad PD-DP and the touch sensing member pad PD-TS are deformed. it shows that

Descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus will be omitted.

15A is a cross-sectional view taken along II-II′ of FIG. 12 . 15B is a cross-sectional view taken along III-III′ of FIG. 12 . 15C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 15A to 15C show an embodiment of the present invention.

15A and 15C , the upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. 15B and 15C , the upper touch sensing member pad PD-TSU is in contact with the lower touch sensing member pad PD-TSD.

Descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus will be omitted.

16A is a cross-sectional view taken along II-II′ of FIG. 12 . 16B is a cross-sectional view taken along III-III′ of FIG. 12 . FIG. 16C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 16A to 16C show an embodiment of the present invention.

The third conductive pattern CDP3 shown in FIGS. 16A and 16B is different from the previously described third conductive pattern CDP3, the first conductive pattern through the electrode GE3 formed in the same process as the control electrodes GE1 and GE2. (CDP1) is electrically connected.

In addition, descriptions of other components in FIGS. 16A and 16C are substantially the same as those described in FIGS. 13A and 13B, and thus will be omitted. The description of FIG. 16C is substantially the same as that of FIG. 13C, and thus will be omitted.

17A is a cross-sectional view taken along II-II′ of FIG. 12 . 17B is a cross-sectional view taken along III-III′ of FIG. 12 . 17C and 17D are cross-sectional views taken along IV-IV′ of FIG. 12 . 17A to 17D show an embodiment of the present invention.

The third conductive pattern CDP3 shown in FIGS. 17A and 17B is electrically connected to the first conductive pattern CDP1 through the electrode GE3 formed in the same process as the control electrodes GE1 and GE2.

Other descriptions of the other components shown in FIGS. 17A and 17B are substantially the same as those described in FIGS. 14A and 14B, and thus will be omitted. The description of FIGS. 17C and 17D is substantially the same as the description of FIGS. 14C and 14D, and thus will be omitted.

18A is a cross-sectional view taken along II-II′ of FIG. 12 . 18B is a cross-sectional view taken along III-III′ of FIG. 12 . 18C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 18A to 18C show an embodiment of the present invention.

The third conductive pattern CDP3 shown in FIGS. 18A and 18B is electrically connected to the first conductive pattern CDP1 through the electrode GE3 formed in the same process as the control electrodes GE1 and GE2.

Other descriptions of other components shown in FIGS. 18A and 18B are substantially the same as those described in FIGS. 15A and 15B, and thus will be omitted. The description of FIG. 18C is substantially the same as that of FIG. 15C, and thus will be omitted.

19A is a cross-sectional view taken along II-II′ of FIG. 12 . 19B is a cross-sectional view taken along III-III′ of FIG. 12 . 19C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 19A to 19C show an embodiment of the present invention.

19A and 19C , the display panel pad PD-DP has a single-layer structure. 19B and 19C , the touch sensing member pad PD-TS has a single-layer structure.

Descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13C, and thus will be omitted.

FIG. 20A is a cross-sectional view taken along II-II′ of FIG. 12 . FIG. 20B is a cross-sectional view taken along III-III′ of FIG. 12 . 20C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 20A to 20C show an embodiment of the present invention.

20A and 20C , the display panel pad PD-DP has a single-layer structure. 20B and 20C , the touch sensing member pad PD-TS has a single-layer structure.

Descriptions of other components are substantially the same as those described with reference to FIGS. 20A to 20C, and thus will be omitted.

19A to 19C and 20A to 20C, the display panel pad PD-DP and the touch sensing member pad PD-TS are formed to have the same height as a single-layer structure, which may occur during the manufacturing process. possible defects can be reduced.

21A is a cross-sectional view taken along II-II′ of FIG. 12 . 21B is a cross-sectional view taken along III-III′ of FIG. 12 . 21C is a cross-sectional view taken along IV-IV′ of FIG. 12 . 21A to 21C show an embodiment of the present invention.

The second conductive pattern CDP2 may include a dummy electrode ET-D, a display panel pad PD-DP, and a touch sensing member pad PD-TS.

The dummy electrode ET-D may include the same material as the control electrode GE2 of the first circuit layer CL1 . The dummy electrode ET-D may be formed by the same process as the control electrode GE2 . The dummy electrode ET-D is insulated from other electrodes, and may serve to adjust the height of the display panel pad PD-DP in the pad region AR-PD.

Descriptions of other components are substantially the same as those described with reference to FIGS. 13A to 13B, and thus will be omitted.

touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad touch sensing member pad

22 and 23 respectively show a display module DM and a printed circuit board PCB and PBC-1 according to an embodiment of the present invention.

Referring to FIG. 22 , the pads PD-TS and PD-DP of the display module DM are electrically connected to the pads PD-PCB of the printed circuit board PCB. An integrated circuit (DIC) may be disposed on a printed circuit board (PCB). The integrated circuit (DIC) may be formed in a Chip On Flexible Printed Circuit (COF) method. The integrated circuit DIC may transmit/receive data information and the like to/from the display module DM through the pads PD-PCB, PD-TS, and PD-DP.

Referring to FIG. 23 , the integrated circuit DIC-1 may be disposed on the pad area AR-PD of the display module DM. In this case, the integrated circuit DIC-1 may be formed in a chip on plastic (COP) method.

In FIG. 23 , the touch signal lines SL1 and SL2 are illustrated as not connected to the integrated circuit DIC-1, but the present invention is not limited thereto. In an embodiment of the present invention, the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

24 illustrates a bent shape of the display module DM according to an embodiment of the present invention. Referring to FIG. 24 , the display module DM may be bent based on the boundary area AR-BD. As described above, since the boundary region AR-BD of the display module DM includes only an organic layer without an inorganic layer, it may have sufficient flexibility for bending.

Although described with reference to embodiments, those skilled in the art can understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. There will be. In addition, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, and all technical ideas within the scope of the following claims and their equivalents should be construed as being included in the scope of the present invention. .

DD: Flexible display DM: Display module
DP: organic light emitting display panel TS: touch sensing member
AR-ACV: active area AR-BD: border area
AR-PD: pad region CL1: first circuit layer
CL2: second circuit layer

Claims (9)

a base layer including a display area and a non-display area;
a display element layer overlapping the display area and disposed on the base layer, the display element layer including a pixel;
a touch sensing member disposed on the display element layer and including a conductive pattern;
a first pad overlapping the non-display area and disposed on the base layer; and
a second pad disposed on the first pad;
The first pad includes a first lower pad and a second lower pad, the second pad includes a first upper pad and a second upper pad, and any one of the first upper pad and the second upper pad is A display device electrically connected to one of the first lower pad and the second lower pad. According to claim 1,
The touch sensing member includes a touch insulating layer overlapping the display area and the non-display area,
The touch insulating layer is disposed between the first pad and the second pad. According to claim 1,
any one of the first pad and the second pad is connected to the pixel;
The other one of the first pad and the second pad is connected to the conductive pattern. According to claim 1,
and the other one of the first pad and the second pad includes a floating dummy electrode. According to claim 1,
any one of the first pad and the second pad electrically connected to the display element layer is disposed on the same layer as the display element layer;
The other one of the first pad and the second pad electrically connected to the touch sensing member is disposed on the same layer as the touch sensing member. According to claim 1,
The first upper pad is disposed on the first lower pad, and the second upper pad is disposed on the second lower pad. 7. The method of claim 6,
the first lower pad is electrically connected to the display element layer and the second lower pad includes a floating dummy electrode;
The first upper pad includes a floating dummy electrode, and the second upper pad is electrically connected to the touch sensing member. According to claim 1,
An encapsulation layer is disposed between the display element layer and the touch sensing member, and the touch sensing member is disposed directly on the encapsulation layer. 9. The method of claim 8,
and an insulating layer disposed between the first upper pad and the first lower pad, wherein the first upper pad and the first lower pad are electrically connected through a through hole penetrating the insulating layer.

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