KR102439561B1 - Handy type electronic device includingthermoelectric element for providing cooling sensation to user - Google Patents

Abstract

The present disclosure relates to a handy type electronic device using a thermoelectric element, which comprises: a housing where an outer surface has an opened portion; a duct; a first heat dissipation fan; a second heat dissipation fan allowing air inside a flow passage to flow to the outside during operation; a heat dissipation module; a heat suction plate; and a thermoelectric element.

Description

A handy electronic device including a thermoelectric element to provide a feeling of cooling to a user

The present disclosure relates to a handy electronic device including a thermoelectric element, and to an electronic device having a heat absorbing function and/or a cooling sensation providing function using the Peltier effect of the thermoelectric element.

The thermoelectric phenomenon is a phenomenon that occurs by the movement of electrons and holes inside a material, and refers to direct energy conversion between heat and electricity.

The thermoelectric element generates the Seebeck effect, in which a potential difference is generated in a closed circuit due to a temperature difference, and the Peltier effect, in which heat is generated on one side and endothermic phenomenon occurs at the same time when a potential difference is applied, thereby generating a temperature difference.

Such a thermoelectric element is widely applied to the entire industry, and the scope of application is applied to a cooling device, a heating device, a power generation device, and the like.

In general, a thermoelectric element may be used in a refrigerant-free cooling/heating device, and in these devices, a heating surface capable of creating a warm air flow and a heat absorbing surface capable of creating a cold air flow are present at the same time.

However, the conventional cooling device has a problem in that condensation occurs due to the heat absorbing surface located inside the housing, and it is difficult to secure sufficient heat dissipation effect from the heat generating surface located outside the housing.

A handy type electronic device including a thermoelectric element according to various embodiments prevents dew condensation on a heat absorbing surface and forms a discharge hole to prevent interference with a user's hand coming into contact with the heat absorbing surface to provide a heat dissipation effect on the heat absorbing surface By maximizing it, the functionality that provides a feeling of cooling to the user can be improved.

The problem to be solved by the present application is not limited to the above-mentioned problems, and the problems not mentioned will be clearly understood by those of ordinary skill in the art to which the present application belongs from the present specification and the accompanying drawings. .

A handy electronic device using a thermoelectric element according to various embodiments is an electronic device, wherein at least a portion of one surface and the other surface is opened, respectively, an inner space is partitioned between the one surface and the other surface by an outer surface, and the outer surface is A housing including an open portion, an inlet and an outlet are disposed in the inner space of the housing to correspond to the open at least a portion of one surface and the other surface of the housing, and a flow passage is formed by an outer wall between the inlet and the outlet is partitioned, the outer wall is a duct with a part open to correspond to the open part of the outer surface of the housing, located in the inner space of the housing, and coupled to the housing or the duct at the inlet side of the duct, A first heat dissipation fan for flowing external air into the flow passage during operation, is located in the inner space of the housing, is coupled to the housing or the duct at the outlet side of the duct, and is operated inside the flow passage a second heat dissipation fan for flowing air to the outside, at least a portion of which is positioned between the inlet and the outlet in the interior of the duct, and a heat dissipation plate extending in a planar direction to cover the open portion of the outer wall of the duct; a heat dissipation module including a plurality of heat dissipation fins extending from the heat dissipation plate into the flow passage, a heat absorbing plate extending in a planar direction and arranged to cover the open portion of the outer surface of the housing, and heat absorbing during operation A thermoelectric effect is generated on a surface and a heat absorbing surface, and is disposed between the heat dissipation plate and the heat absorbing plate, the heat generating surface is thermally connected to the heat dissipation plate of the heat dissipation module, and the heat absorbing surface is thermally connected to the heat absorbing plate It may include a connected thermoelectric element.

Solutions of the problems are not limited to the above-described solutions, and solutions not mentioned will be clearly understood by those of ordinary skill in the art to which the present application belongs from the present specification and the accompanying drawings. .

According to a handy electronic device using a thermoelectric element according to various embodiments, by forming a heat dissipation structure through the heat dissipation plate, the heat absorbing plate according to the operation of the thermoelectric element may be cooled to a temperature required by the user.

In addition, it is possible to avoid transferring the heat discharged to the outside through the heat dissipation plate to the user's hand holding the handy electronic device.

1 is a diagram illustrating a perspective view of an electronic device 100 including a thermoelectric element 170 according to various embodiments of the present disclosure.
2 is a diagram illustrating a top view, a bottom view, a front view, a rear view, and a side view of the electronic device 100 including the thermoelectric element 170 according to various embodiments of the present disclosure.
3 is an exploded perspective view of the inside of the housing 110 of the electronic device 100 using the thermoelectric element 170 according to an embodiment of the present disclosure.
4 is a view for explaining examples of heat dissipation fins of the heat dissipation module according to various embodiments.
5 is a view for explaining an example of the heat transfer film 200 according to various embodiments.
6 is a cross-sectional view illustrating a lower surface of the electronic device 100 viewed in a direction perpendicular to the xy plane according to various embodiments of the present disclosure. 7 is a cross-sectional side view of the electronic device 100 viewed in a direction perpendicular to the yz plane according to various embodiments of the present disclosure.
8 is a view for explaining a comparative example 801 of the electronic device 100 and an example 802 of the electronic device 100 implemented to improve heat dissipation efficiency according to various embodiments of the present disclosure.
9 is a view for explaining an example of parameters associated with the heat dissipation module 150 and characteristics (eg, heat transfer, static pressure) affected based on the parameters according to various embodiments of the present disclosure.
10 is a diagram for explaining an example of a range of a density parameter calculated based on parameters associated with the heat dissipation module 150 according to various embodiments of the present disclosure.
11 is a view showing an example of the length of the optimal heat dissipation module 150 according to various embodiments.
12 is a diagram for describing an example of a range of a length ratio parameter calculated based on parameters associated with the heat dissipation module 150 according to various embodiments of the present disclosure.
13 is a view for explaining an example of a cooling providing system according to various embodiments.
14 is a diagram for explaining an example of a functional configuration of the electronic device 100 according to various embodiments of the present disclosure.
15 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure.
16 is a diagram for describing an example of an operation of controlling a plurality of fans of the electronic device 100 according to various embodiments of the present disclosure.
17 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure.
18 is a diagram for explaining an example of communication of the electronic device 100 with the external electronic device 1300 according to various embodiments of the present disclosure.
19 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure.
20 is a diagram for explaining an example of an operation of controlling a heat dissipation fan of the electronic device 100 according to various embodiments of the present disclosure.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the various embodiments. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as “comprise” or “have” are intended to designate that the described feature, number, step, operation, component, part, or combination thereof exists, and includes one or more other features or numbers. , it should be understood that it does not preclude the existence or addition of steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms such as those defined in commonly used dictionaries should be interpreted as meanings consistent with the context of the related art, and unless explicitly defined in the present specification, they are not to be interpreted in an ideal or excessively formal meaning. .

Hereinafter, the present disclosure will be described in detail by describing preferred embodiments of the present disclosure with reference to the accompanying drawings. Like reference numerals in each figure indicate like elements.

According to various embodiments, as an electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ), at least one housing (eg, FIGS. 1 to 3 ) including an open outer surface including at least a part. of the upper housing 110, and/or the lower housing 112), the inner space being partitioned by the outer surface, the duct being disposed in the inner space, the duct including an outer wall in which an inlet and an outlet are formed (eg, the duct 120 of FIGS. 1 to 3), and a flow passage through which air flows is formed inside the duct (eg, the duct 120 of FIGS. 1 to 3), and the duct (eg, : A agent that is disposed in a position adjacent to the inlet of the duct 120 of FIGS. 1 to 3 , and causes air to flow into the inside of the electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) during operation 1 a heat dissipation fan (eg, the first heat dissipation fan 130 of FIGS. 1 to 3 ), disposed in a position adjacent to the outlet of the duct (eg, the duct 120 of FIGS. 1 to 3 ), and when operating At least a portion of a second heat dissipation fan (eg, the second heat dissipation fan 140 of FIGS. 1 to 3 ) for flowing air to the outside of the electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) A heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) positioned between the inlet and the outlet of the duct (eg, the duct 120 of FIGS. 1 to 3 ) and extending in a planar direction; and A heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ) including a plurality of heat dissipation fins extending from the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ), extending in a planar direction , a heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ) disposed to cover the open part of the outer surface of the at least one housing, and thermoelectric effect on the heat absorbing surface and the heat generating surface during operation and the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) and the heat absorbing plate (eg, the heat absorbing plate of FIGS. 1 to 3 ) 160)), and the heating surface is on the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3) of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3). It is thermally connected, and the heat absorbing surface includes a thermoelectric element (eg, the thermoelectric element 170 of FIGS. 1 to 3 ) thermally connected to the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ). When the first heat dissipation fan (eg, the first heat dissipation fan 130 of FIGS. 1 to 3) and the second heat dissipation fan (eg, the second heat dissipation fan 140 of FIGS. 1 to 3) operate , the air is introduced into the inlet of the duct (eg, the duct 120 of FIGS. 1 to 3 ), and the space between the plurality of heat dissipation fins (eg, the heat dissipation fin 152 of FIGS. 1 to 3 ). of the duct (eg, the duct 120 of FIGS. 1 to 3 ) flowing through the The cross-sectional area of the inlet and the cross-sectional area of the outlet of the duct through which the air flows (eg, the duct 120 of FIGS. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) that is implemented to be relatively larger than the cross-sectional area of may be provided.

According to various embodiments, the at least one housing (eg, the upper housing 110 and/or the lower housing 112 of FIGS. 1 to 3 ) includes an upper housing and a lower housing, the upper housing comprising: An electronic device (eg, FIGS. 1 to 3 ) including one side protruding to the outside of the housing to be curved according to a preset first curvature, and the lower housing including the open part facing the one side of the electronic device 100) may be provided.

According to various embodiments, the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ) is coupled to the lower housing, and according to a second curvature corresponding to the first curvature, the electronic device ( Example: An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) having a shape recessed inward of the electronic device 100 of FIGS. 1 to 3 may be provided.

According to various embodiments, the duct (eg, the duct 120 of FIGS. 1 to 3 ) is an electronic device (eg, FIGS. 1 to 3 ) that extends outwardly so that the cross-sectional area is enlarged at the inlet and the outlet The electronic device 100 of FIG. 3 may be provided.

According to various embodiments, the upper surface of the duct (eg, the duct 120 of FIGS. 1 to 3 ) extends from the inlet and the outlet side toward the lower housing toward the one side of the outer surface. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) may be provided.

According to various embodiments, the inner surface of the lower housing is the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ). ), an electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) including a first protrusion protruding toward one end and a second protrusion protruding toward the other end may be provided.

According to various embodiments, the first protrusion and the second protrusion are in contact with a lower surface of the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ), an electronic device (eg, FIGS. 1 to 3 ). The electronic device 100 of 3 may be provided.

According to various embodiments, the first protrusion is in contact with a first side surface of the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ), and the second protrusion is in contact with the heat dissipation plate (eg, FIG. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) contacting the second side surface of the heat dissipation plate 151 of FIGS. 1 to 3 may be provided.

According to various embodiments, the air introduced through the first heat dissipation fan (eg, the first heat dissipation fan 130 of FIGS. 1 to 3 ) is supplied to the duct (eg, FIGS. 1 to 3 ) by the first protrusion. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) guided to the inlet of the duct 120 of FIG. 3 may be provided.

According to various embodiments, the height of the first protrusion and the second protrusion increases while moving away from the one end and the other end of the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) to the outside. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) may be provided in which the rate of change of the protruding height is gradually decreased while gradually increasing.

According to various embodiments, the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ) has one end and the other At the end of the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ) and spaced apart, the thermoelectric element (eg, the thermoelectric element 170 of FIGS. 1 to 3 ) is the heat dissipation plate ( Example: A position in which the spaced distance from the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ) between the one end and the other end of the heat dissipation plate 151 of FIGS. 1 to 3 is reduced. An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) disposed in the .

According to various embodiments, the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ) is disposed between the heat absorbing surface and the heat absorbing plate (eg, the heat absorbing plate 160 of FIGS. 1 to 3 ). ) and the heat absorbing surface, or disposed between the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. The electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) may further include a plate 151) and a heat transfer pad that is in contact with the heating surface at the same time.

According to various embodiments, the first heat dissipation fan (eg, the first heat dissipation fan 130 of FIGS. 1 to 3 ) and the second heat dissipation fan (eg, the second heat dissipation fan 140 of FIGS. 1 to 3 ) )) is an electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) detachable from parts corresponding to the inlet and the outlet of the duct (eg, the duct 120 of FIGS. 1 to 3 ). )) may be provided.

According to various embodiments, a first fan cover and a second fan cover having a plurality of through-holes formed at positions corresponding to the inlet and the outlet of the duct (eg, the duct 120 of FIGS. 1 to 3 ) are provided. An electronic device that further includes (eg, the electronic device 100 of FIGS. 1 to 3 ) may be provided.

According to various embodiments, each of the plurality of heat dissipation fins of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ) is the duct (eg, the duct 120 of FIGS. 1 to 3 )) an electronic device (e.g., the electronic device 100 of )) may be provided.

According to various embodiments, the plurality of heat dissipation fins of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ) are the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 )) An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) having a thickness smaller than the height of .

According to various embodiments, in the plurality of heat dissipation fins of the heat dissipation module (eg, the heat dissipation module 150 of FIGS. 1 to 3 ), the product (N*S) of the number (N) and the thickness (S) is the An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) within the range of 1/3.5 to 1/4.5 of the width X of the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. ) can be provided.

According to various embodiments, the heat dissipation plate (eg, the heat dissipation plate 151 of FIGS. 1 to 3 ) and the plurality of heat dissipation fins are the ducts (eg, the duct 120 of FIGS. 1 to 3 ). The distance between the first heat dissipation fan (eg, the first heat dissipation fan 130 of FIGS. 1 to 3 ) and the second heat dissipation fan (eg, the second heat dissipation fan 140 of FIGS. 1 to 3 ) An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) having a length of 0.85 times or more may be provided.

According to various embodiments, based on an interface that directly receives a manipulation from a user or receives a manipulation from an external electronic device, and an input or received manipulation, the first heat dissipation fan (eg, in FIGS. 1 to 3 ) The first heat dissipation fan 130) and the second heat dissipation fan (eg, the second heat dissipation fan 140 of FIGS. 1 to 3) control the operation, or a thermoelectric element (eg, the thermoelectric element of FIGS. 1 to 3 ) An electronic device (eg, the electronic device 100 of FIGS. 1 to 3 ) may be provided that further includes a processor for controlling the operation of the element 170 .

1. Overview of the electronic device 100

In this specification, the electronic device 100 may be defined as a cooling device capable of providing a feeling of cooling.

For example, the electronic device 100 includes at least one thermoelectric element disposed on a specific substrate, and cools the specific substrate by applying power (eg, current and/or voltage) to the at least one thermoelectric element. Cooling may be provided to the user through the user's body part (eg, hand) in contact with the specific substrate (or by absorbing heat through the specific substrate).

For example, the cooling device may be implemented in a form that can be gripped and/or mounted in the user's hand, but is not limited thereto, and the user's various body parts (eg, hands, head, waist, stomach, arms, legs, thighs, It may be implemented in a form that can be attached and/or firmly fixed on the calf, etc.). For example, a predetermined member (eg, an adhesive layer, clothing, harness, belt) implemented, and/or attached to, and/or coupled to the cooling device is provided, and the cooling device is provided by the predetermined member. may be affixed and/or secured to a part of the user's body (eg, hands, head, waist, belly, arms, legs, thighs, calves, etc.).

2. Physical configuration of the electronic device 100

2.1 Appearance of the electronic device 100

1 is a diagram illustrating a perspective view of an electronic device 100 including a thermoelectric element 170 according to various embodiments of the present disclosure. 2 is a diagram illustrating a top view, a bottom view, a front view, a rear view, and a side view of the electronic device 100 including the thermoelectric element 170 according to various embodiments of the present disclosure. Hereinafter, examples of the appearance of the electronic device 100 according to various embodiments will be described with reference to FIGS. 1 to 2 .

According to various embodiments, the electronic device 100 may include members and/or components constituting the exterior. For example, referring to FIGS. 1 and 2 , the electronic device 100 includes detachable (or coupled) housings (eg, the upper housing 111 and the lower housing 112), and cover members (eg, the upper housing 111 and the lower housing 112). : The first cover member 181, and the second cover member 182), and may include the heat absorbing plate 160, but is not limited to the description and may include members (or parts) constituting more appearances. and/or may be implemented to include fewer members (or parts). For example, the housings (eg, the upper housing 111 and the lower housing 112 ) may be implemented in a single shape. As another example, some of the housings (eg, the upper housing 111 and the lower housing 112) and the cover members (eg, the first cover member 181 and the second cover member 182) Some of them may be implemented in a single form. As another example, the lower housing 112 and the heat absorbing plate 160 may be implemented in a single form coupled to each other.

2.1.1 Housings 110 and 112 and heat absorbing plate 180 of electronic device 100

According to various embodiments, a physical button for controlling (eg, driving) the electronic device 100 may be implemented in the upper housing 110 . For example, referring to FIGS. 1 and 2 , the outer surface of the upper housing 110 may include an open part, and the physical button 191 may be implemented in the open part. The physical button 191 is connected to a circuit disposed inside the electronic device 100 , and when the physical button 191 is pressed by a user, a function (eg, driving) by the circuit may be executed. For example, the physical button 191 may be an On/Off button that receives an input of whether or not the electronic device 100 is operated, or may receive an input of an operation mode, an operation strength, and/or an operation temperature in another embodiment. On the other hand, without being limited to the described example, the physical button 191 may be implemented on the outer surface of the upper housing 110 rather than the open area of the upper housing 110 .

According to various embodiments, the lower housing 112 may include an open area, and the heat absorbing plate 160 may be coupled to the lower housing 112 to cover the open area. As will be described later, the heat absorbing plate 160 is cooled by the heat absorbing surface (not shown) of the thermoelectric element 170 disposed on the heat absorbing plate 160 , and is cooled by being in contact with the user's hand and absorbing heat from the user's hand. effect can occur.

According to various embodiments, the appearance of the electronic device 100 may be implemented in a form that can be easily gripped by a user and/or can be easily touched with a body part (eg, hand) of the user. For example, referring to FIGS. 1 and 2 , at least some regions (eg, one side 111 and the other side 113 facing each other) constituting the exterior of the electronic device 100 have a preset first curvature, respectively. and a second curvature. The second curvature may be implemented to correspond to the first curvature, but is not limited thereto and may be implemented differently. For example, the outer surface of the upper housing 110 is configured to include one side 111 protruding to the outside of the upper housing 110 to be curved according to a preset first curvature, and the heat absorbing plate 160 is The electronic device 100 may be embodied in a shape recessed inside the electronic device 100 to face the one side 111 and to be curved according to a preset second curvature. The curvatures (eg, the first curvature and the second curvature) may be set to be easily gripped by the user. Accordingly, when the user holds the electronic device 100 by hand, the user's grip and/or wearability may be improved by the upper housing 110 and/or the heat absorbing plate 160 .

2.1.2 Fan covers 181 and 182 of the electronic device 100

According to various embodiments, the first fan cover 181 and the second fan cover 182 may have through-holes penetrated to allow air to flow therethrough. In one embodiment, though through-holes may be formed in the entire region of the first fan cover 181 and the second fan cover 182 , the duct 120 which is an internal configuration of the electronic device 100 to be described later in another embodiment. ), the through hole may be formed only in the region corresponding to the inlet 121 and the outlet 122 . Accordingly, the air flowing through the flow passage 123 of the duct 120 may flow through the through holes of the first fan cover 181 and the second fan cover 182 , and accordingly, the air flow is reduced by the housing. The influence on the user's hand holding the 110 and the heat absorbing plate 160 can be minimized.

According to various embodiments, the first fan cover 181 and the second fan cover 182 may be detachably coupled to the duct 120 or the housing 110 . Referring to FIG. 2 as an embodiment, the first fan cover 181 and the second fan cover 182 are coupled to the duct 120 or the housing 110 through a spring and a push-lock button 183, By inserting the push-lock button 183, the coupling can be released. The push-lock button 183 may be exposed to the outside of the housing 110 so that the user can press it.

2.2 Inside the electronic device 100

3 is an exploded perspective view of the inside of the housing 110 of the electronic device 100 using the thermoelectric element 170 according to an embodiment of the present disclosure.

According to various embodiments, the electronic device 100 may include an internal space defined by components (eg, the housings 110 and 112 and the fan covers 181 and 182) constituting the exterior. have. Hereinafter, examples of components disposed in the internal space of the electronic device 100 will be described with reference to FIG. 3 .

2.2.1 Components arranged inside the electronic device 100

According to various embodiments, in the electronic device 100, a flow passage 123 is partitioned by an outer wall between the inlet 121 and the outlet 122 in the inner space, and the outer wall includes the housing ( The duct 120 partly opened to correspond to the open part of the outer surface of 110, is located in the inner space of the housing 110, and from the inlet 121 side of the duct 120 to the housing ( 110) or a first heat dissipation fan 130 coupled to the duct 120, which flows external air into the flow passage 123 during operation, is located in the inner space of the housing 110, and the A second heat dissipation fan 140 coupled to the housing 110 or the duct 120 at the outlet 122 side of the duct 120 and flowing the air inside the flow passage 123 to the outside during operation; At least a portion of the heat dissipation plate is positioned between the inlet 121 and the outlet 122 inside the duct 120 and extends in a planar direction to cover a portion of the open outer wall of the duct 120 . A heat dissipation module 150 (or a heat sink) including a plurality of heat dissipation fins 152 extending from the heat dissipation plate 151 into the flow passage 123 from the heat dissipation plate 151 (or a heat sink) extending in a planar direction and , a heat absorbing plate 160 disposed to cover the open part of the outer surface of the housing 110, and a heat absorbing surface (not shown) and a heat generating surface (not shown) during operation to generate a thermoelectric effect, and the It is disposed between the heat dissipation plate 151 and the heat absorbing plate 160, and the heating surface (not shown) is thermally connected to the heat dissipation plate 151 of the heat dissipation module 150, and the heat absorbing surface (not shown) ) is a thermoelectric element 170 thermally connected to the heat absorbing plate 160, a circuit board 190 having a built-in processor (not shown) and various interfaces (not shown), a first heat dissipation fan 130, a second The battery 192 for supplying the stored power to the heat dissipation fan 140 and/or the heat dissipation module 150 . may include. However, the present invention is not limited thereto, and the electronic device 100 may be implemented to include more configurations than the described configurations or fewer than the described configurations.

According to various embodiments, in the duct 120 , the inlet 121 and the outlet 122 are disposed to correspond to at least a portion of the open surface of the housing 110 and the other surface, and accordingly, the inlet of the duct 120 . The flow passage 123 of the duct 120 communicated through the 121 and the outlet 122 may be exposed to the outside of the housing 110 through one surface and the other surface of the housing 110 to communicate with the outside.

According to various embodiments, a flow passage 123 surrounded by an outer wall may be partitioned in the duct 120 , and a portion of the outer wall may be opened to correspond to an open portion of the outer surface of the housing 110 . That is, an open part of the outer wall defining the flow passage 123 may communicate with an open portion of the outer surface of the housing 110 , and the flow passage 123 may communicate with the outside of the housing 110 .

According to various embodiments, the first heat dissipation fan 130 and the second heat dissipation fan 140 may be respectively disposed at the inlet 121 and the outlet 122 of the duct 120 . The first heat dissipation fan 130 is disposed at the inlet 121 of the duct 120 , and may flow external air into the flow passage 123 of the duct 120 during operation. Conversely, the second heat dissipation fan 140 may be disposed at the outlet 122 of the duct 120 and may flow the air inside the flow passage 123 of the duct 120 to the outside during operation.

According to various embodiments, the first heat dissipation fan 130 and the second heat dissipation fan 140 may be directly coupled to the duct 120 at the inlet 121 and the outlet 122 of the duct 120 , respectively. The first heat dissipation fan 130 and the second heat dissipation fan 140 are located at the front end and the rear end of the flow passage 123, as will be described later, on the inlet 121 and outlet 122 side of the duct 120. It can be inserted and combined in In another embodiment, the first heat dissipation fan 130 and the second heat dissipation fan 140 may be coupled to and fixed to the housing 110 .

According to various embodiments, the first heat dissipation fan 130 and the second heat dissipation fan 140 are at the inlet 121 and the outlet 122 of the duct 120 in which the flow passage 123 is extended outward. Each is disposed, and a portion of the duct 120 may be detachable to the opposite side of the open outer wall. The first heat dissipation fan 130 and the second heat dissipation fan 140 may be detachably coupled to the duct 120 at the inlet 121 and the outlet 122 of the duct 120 . For example, the first heat dissipation fan 130 and the second heat dissipation fan 140 slide from the opposite side of the open outer wall of the duct 120 on which the heat dissipation plate 151 is disposed and are inserted into the duct 120, The heat dissipation plate 151 may be separated by sliding to the opposite side of the open outer wall of the duct 120 disposed therein.

According to various embodiments, the through hole extends to cover one surface and the other surface of the housing 110 , respectively, and corresponds to at least a portion of the one surface and the other surface open or the inlet 121 and the outlet 122 of the duct 120 . The formed first fan cover 181 and the second fan cover 182; may further include.

According to various embodiments, one surface and the other surface of the housing 110 may be completely open, and at least some of them may correspond to the inlet 121 and the outlet 122 of the duct 120 . The first fan cover 181 and the second fan cover 182 may be coupled to the housing 110 to cover one surface and the other surface of the housing 110 . In another embodiment, the first fan cover 181 and the second fan cover 182 may be coupled to the duct 120 .

According to various embodiments, the heat dissipation module 150 may include a heat dissipation plate 151 and a plurality of heat dissipation fans, and the heat dissipation plate 151 and the plurality of heat dissipation fins 152 may be integrally formed. As an embodiment, the heat dissipation plate 151 may be a flat plate extending in a plane direction, and the plurality of heat dissipation fins 152 may protrude from one surface of the heat dissipation plate 151 to extend.

According to various embodiments, the heat dissipation plate 151 may cover an open portion of the outer wall of the duct 120 . The heat dissipation plate 151 may partition the flow passage 123 of the duct 120 by covering the open outer wall. For example, the heat dissipation plate 151 may partition the flow passage 123 by being coupled to the outer wall of the duct 120 to block the flow passage 123 from the outside.

According to various embodiments, the plurality of heat dissipation fins 152 may be formed to protrude from the heat dissipation plate 151 extending in the planar direction into the flow passage 123 of the duct 120 . In one embodiment, the plurality of heat dissipation fins 152 may be columnar fins protruding in the shape of a column having a circular or polygonal cross section, and in another embodiment, the flow passage 123 of the duct 120 extends along the extending direction. It can be straight.

Referring further to FIG. 10 , the heat dissipation module 150 according to an embodiment may include a heat dissipation plate 151 and a plurality of heat dissipation fins 152 . The plurality of heat dissipation fins 152 may extend from the heat dissipation plate 151 into the flow passage 123 of the duct 120 .

In one embodiment, the plurality of heat dissipation fins 152 of the heat dissipation module 150 are strakes extending from the inlet 121 side of the duct 120 to the outlet 122 side, respectively, and the plurality of heat dissipation fins 152 ) may be disposed to be spaced apart from each other in a direction crossing the extending direction. For example, the plurality of heat dissipation fins 152 may be straight extending to the same length as the heat dissipation plate 151 .

According to various embodiments, the heat absorbing plate 160 may be a plate extending in a plane direction to correspond to the heat dissipation plate 151 . The heat absorbing plate 160 may be disposed to be spaced apart from the heat dissipation plate 151 , and in particular, may be disposed to cover an open part of the outer surface of the housing 110 from the outside of the housing 110 .

According to various embodiments, the thermoelectric element 170 (or Peltier element) is an energy source that operates when power is supplied to generate a thermoelectric phenomenon, and the thermoelectric phenomenon may mean the Peltier effect. have. The Peltier effect is an effect in which an energy source generated by power generation simultaneously generates cooling and heating, and the thermoelectric phenomenon in the thermoelectric element 170 is a well-known technique widely known to those of ordinary skill in the art to which the present invention pertains. Therefore, detailed description will be omitted.

According to various embodiments, the surface of the thermoelectric element 170 that generates cold air or heat may change according to a direction in which power is applied. Therefore, only the direction of the power input can be easily switched through the control board when cold air is needed and when warm air is needed.

According to various embodiments, the thermoelectric element 170 may be disposed between the heat absorbing plate 160 and the heat dissipating plate 151 that are spaced apart from each other. For example, the thermoelectric element 170 may be an N-type or P-type semiconductor, and may generate a thermoelectric effect on a heat absorbing surface (not shown) and a heat generating surface (not shown) when operated by the supplied power.

According to various embodiments, the thermoelectric element 170 may be implemented in plurality, and in this case, it may be formed in the form of a thermoelectric element array in which adjacent ones of the plurality of thermoelectric elements are connected to each other.

According to various embodiments, the heating surface (not shown) of the thermoelectric element 170 is disposed to face the heat dissipation plate 151 side, and the heat absorbing surface (not shown) of the thermoelectric element 170 is the heat absorbing plate 160 side. may be placed toward the

The thermoelectric element 170 may be thermally connected to the heat dissipation plate 151 and the heat absorbing plate 160, respectively, and may be thermally conductively connected, for example.

According to various embodiments, the heating surface (not shown) of the thermoelectric element 170 may be in direct contact with the heat dissipation plate 151 , and the heat absorbing surface (not shown) of the thermoelectric element 170 is the heat absorbing plate 160 . can be in direct contact with In another embodiment, the heating surface (not shown) and the heat absorbing surface (not shown) of the thermoelectric element 170 may be indirectly connected to the heat dissipation plate 151 and the heat absorbing plate 160 through the heat transfer pad 171 , respectively. . The heat transfer pad 171 may be made of a material having relatively high thermal conductivity.

Therefore, according to the handy electronic device 100 using the thermoelectric element 170 according to various embodiments, by forming a heat dissipation structure through the heat dissipation plate 151 , the heat absorbing plate 160 according to the operation of the thermoelectric element 170 . can be cooled to the user's required temperature.

In addition, according to the handy type electronic device 100 using the thermoelectric element 170 according to various embodiments, heat discharged to the outside through the heat dissipation plate 151 is transferred to the user's hand holding the handy type electronic device 100 . can be avoided so as not to

In an embodiment, the heat dissipation plate 151 of the heat dissipation module 150 may be disposed to be spaced apart from the heat absorbing plate 160 , and the thermoelectric element 170 includes the heat dissipation plate 151 and the heat absorbing plate 160 spaced apart from each other. ) can be located between

The heat dissipation plate 151 of the heat dissipation module 150 is disposed to be spaced apart from the heat absorbing plate 160 at one end and the other end, and the thermoelectric element 170 is disposed between one end and the other end of the heat dissipation plate 151 . The spaced distance from the heat absorbing plate 160 may be disposed at a reduced position.

In one embodiment, the other side 112 and the heat absorbing plate 160 among the outer surfaces of the housing 110 may be curved to be indented into the inner side of the housing 110 according to a preset second curvature, and the heat dissipation plate 151 may be disposed to correspond to the other side 112 of the housing 110 . The heat dissipation plate 151 disposed inside the housing 110 may be a flat surface that is not curved. Accordingly, the heat dissipation plate 151 may be positioned adjacent to the heat absorbing plate 160 having a curved surface curved at the center than at one end and the other end, and the thermoelectric element 170 is one end of the heat dissipation plate 151 . The spaced distance from the heat absorbing plate 160 between the and the other end may be reduced.

In one embodiment, it is disposed between the heat absorbing plate 160 and the heat absorbing surface (not shown) of the thermoelectric element 170 to simultaneously contact the heat absorbing plate 160 and the heat absorbing surface (not shown), or the heat dissipating plate 151 . and a heat transfer pad 171 disposed between the heat dissipating surface (not shown) of the thermoelectric element 170 and in contact with the heat dissipation plate 151 and the heat generating surface (not shown) at the same time; may further include.

A plurality of heat transfer pads 171 are provided, respectively, between the heat absorbing surface (not shown) of the heat absorbing plate 160 and the thermoelectric element 170 and between the heat dissipating plate 151 and the heat generating surface (not shown) of the thermoelectric element 170 . As a result, thermal conductivity between the thermoelectric element 170 and the heat absorbing plate 160 and the heat dissipating plate 151 may be improved.

For example, the heat transfer pad 171 may be thermal grease, or in another embodiment, a material having a relatively high heat transfer coefficient or thermal conductivity.

In an embodiment, the thermoelectric element 170 may extend over the entire region of the heat dissipation plate 151 and the heat absorbing plate 160 , but in another embodiment, the thermoelectric element 170 includes the heat dissipation plate 151 and the heat absorbing plate 160 . ) may be a size corresponding to a portion of the area.

According to an embodiment, the thermoelectric element 170 extends from the inlet 121 to the outlet 122 of the duct 120, within 1/4 to 1/2 of the length of the heat dissipation plate 151 extending. It can be extended to a length in the range of

For example, the heat dissipation plate 151 may extend to a length of 76 [mm], as will be described later, and the thermoelectric element 170 may extend to a length between 19 [mm] and 38 [mm].

Meanwhile, the electronic device 100 may be implemented to include various types of devices and/or members for providing a feeling of cooling to the user instead of the thermoelectric element 170 . For example, the electronic device 100 is implemented to include a fluid (eg, water) or a member (eg, a balloon) capable of accommodating ice instead of the thermoelectric element 170 , and through the heat dissipation module 150 . Waste heat accumulated in the member may be discharged.

According to various embodiments of the present disclosure, the electronic device 100 receives a manipulation directly from a user or receives a manipulation from an external electronic device (not shown) and the first heat dissipation based on the input or received manipulation. It may further include a processor (not shown) that controls the operation of the fan 130 and the second heat dissipation fan, or controls the operation of the thermoelectric element 170 .

According to various embodiments, the interface (not shown) and the processor (not shown) may be respectively mounted on the circuit board 190 , and the circuit board 190 may be located inside the housing 110 . For example, the circuit board 190 may be disposed on one side 111 of the outer surface of the housing 110 , and in one embodiment, one side of the duct 120 located inside the housing 110 . It may be located on the (111) side.

According to various embodiments, the interface (not shown) may receive a manipulation from an external electronic device through a communication unit (not shown). For example, the external electronic device may be a portable terminal or a wearable device, and may be paired with the handy electronic device 100 using the thermoelectric element 170 through a communication unit (not shown). In an embodiment, the communication unit (not shown) and the external electronic device may be paired through Bluetooth communication or short-distance communication.

According to various embodiments, a processor (not shown) may include, as hardware, a logic circuit and an arithmetic circuit. The processor (not shown) may process data according to a program and/or instructions provided from a memory (not shown), and may generate a control signal according to the processing result. For example, operation control of the first heat dissipation fan 130 , the second heat dissipation fan 140 , and/or the thermoelectric element 170 may be performed according to an operation input from an interface (not shown).

According to various embodiments, the battery 192 disposed on the side of the duct 120 may be provided inside the electronic device 100 . The processor (not shown) of the electronic device 100 may drive the thermoelectric element 170 by providing the power stored in the battery 192 to the thermoelectric element 170 using a power transfer circuit.

2.2.2 Heat dissipation module 150 of electronic device 100

4 is a view for explaining examples of heat dissipation fins of the heat dissipation module according to various embodiments.

According to various embodiments, as shown in FIG. 4 , the plurality of heat dissipation fins 152 included in the heat dissipation module 150 may be implemented in various forms.

In an embodiment, the plurality of heat dissipation fins 152a may be implemented to extend in one direction (eg, a y-axis direction and/or a longitudinal direction of the electronic device 100 ).

In another embodiment, the plurality of heat dissipation fins 152b and 152c extend in one direction (eg, the y-axis direction and/or the longitudinal direction of the electronic device 100), and between the plurality of heat dissipation fins 152b and 152c It may be implemented in a form that promotes the flow of air formed in the . For example, referring to FIG. 4 , the distance between the plurality of heat dissipation fins 152b and 152c may be implemented in a form in which the distance between the plurality of heat dissipation fins 152b and 152c becomes narrower in a partial area of the electronic device 100 (eg, an area other than the area adjacent to the entrance). have. For example, at least some of the plurality of heat dissipation fins 152b and 152c (eg, the heat dissipation fins 152b) may be implemented (or bent) to form a specific angle in a specific portion. For example, at least some of the plurality of heat dissipation fins 152b and 152c (eg, the heat dissipation fins 152b) have a portion adjacent to the inlet 121 (or the outlet 122) of the duct 120 and the remaining portion is flat. It may be implemented to achieve an obtuse angle instead of this. In this case, the remaining portions of the plurality of heat dissipation fins 152b and 152c (eg, the heat dissipation fins 152b) may be implemented in a straight shape without being bent. As a result, the width (x2) of the air passage formed between the plurality of heat dissipation fins 152b and 152c in the center of the duct 120 is the inlet 121 (or outlet 122) of the duct 120. The width (x1) of the passage through which the air flows formed between the plurality of heat dissipation fins 152b and 152c is formed to be narrower, so that the speed at which the air flows may be increased. As the speed at which the air flows is increased, the efficiency of dissipation of waste heat by the thermoelectric element 170 transferred to the heat dissipation module 150 is increased, and as a result, the amount of heat absorbed by the thermoelectric element 170 increases, giving the user an improved feeling of cooling. This can be provided.

The reason why the speed at which the air flows is increased may be explained by Bernoulli's law, which will be clearly understood by those of ordinary skill in the art to which the present application pertains.

2.2.3 Film 200 for heat transfer of electronic device 100

5 is a view for explaining an example of the heat transfer film 200 according to various embodiments.

According to various embodiments, referring to FIG. 5 , a predetermined member (eg, the film 200 ) for smooth heat transfer may be disposed between the thermoelectric element 170 and the heat dissipation module 150 . The member may be implemented to include a material having a higher thermal conductivity than that of the heat dissipation module 150 . As the heat generated from the heat generating surface (not shown) of the thermoelectric element 170 is diffused in the x-axis direction by the member, heat may be more smoothly transferred to the heat dissipation module 150 . As a result, the efficiency of dissipating waste heat through the heat dissipation module 150 is increased, and as a result, the amount of heat absorbed by the thermoelectric element 170 is increased, so that an improved feeling of cooling can be provided to the user.

3. Heat dissipation structure of the electronic device 100

6 is a cross-sectional view illustrating a lower surface of the electronic device 100 viewed in a direction perpendicular to the xy plane according to various embodiments of the present disclosure. 7 is a cross-sectional side view of the electronic device 100 viewed in a direction perpendicular to the yz plane according to various embodiments of the present disclosure. On the other hand, although it is illustrated that air flows from right to left in FIGS. 6 to 7 , this is only an example and is not limited thereto, and the heat dissipation fans 130 and 140 may be driven to flow from left to right.

Hereinafter, an example of a heat dissipation structure of the electronic device 100 will be described with reference to FIGS. 6 to 7 .

According to various embodiments, the heat dissipation module 150 transfers waste heat generated by driving the thermoelectric element 170 to a space (eg, an internal space) for discharging waste heat to the outside of the electronic device 100 (heat transfer) The heat dissipation fans 130 and 140 may operate to discharge the transferred waste heat to the outside (heat dissipation). Since the heat transfer and the heat dissipation are organically performed, the thermoelectric element 170 may be smoothly driven.

According to various embodiments, the waste heat generated according to the driving of the thermoelectric element 170 may be generated in the longitudinal direction (or horizontal direction) of the electronic device 100 formed in the internal space of the electronic device 100 (eg, in the y-axis direction). ) and can be discharged to the outside by air (or fluid) flowing into it. For example, when power is applied to the thermoelectric element 170 , heat is absorbed from a heat source through a heat absorbing surface (not shown) of the thermoelectric element 170 adjacent to (or in contact with) the heat absorbing plate 160 , and heat is radiated. Conversely, waste heat transferred from the heat absorbing surface (not shown) may be generated on the heating surface (not shown) of the thermoelectric element 170 adjacent to (or in contact with) the module 150 . The waste heat may be transferred to the heat dissipation fins 152 through the plate 151 of the heat dissipation module 150 as shown in FIGS. 6 to 7 . The longitudinal direction (or horizontal direction) of the electronic device 100 in the internal space of the electronic device 100 by the inflow of air from the outside and the outflow of air to the outside by the heat dissipation fans 130 and 140 (eg: A flow of air (or fluid) is formed in the y-axis direction), and the waste heat transferred to the heat dissipation fins 152 is discharged to the outside by the flow of air (or fluid) formed in the internal space of the electronic device 100 . can be When the waste heat is smoothly discharged to the outside, heat is smoothly absorbed from the heat absorbing surface (not shown) of the thermoelectric element 170, so that the saturation temperature by the heat absorbing surface (not shown) of the thermoelectric element 170 is critical. It can be as low as you have it. That is, the cooling sensation provided to the user may be improved.

According to various embodiments, referring to FIGS. 6 to 7 , the flow passage 123 through which air flows is a duct 120 of the electronic device 100 between the heat dissipation fans 130 and 140 of the electronic device 100 . may be formed inside of More specifically, a flow of air may be formed between each of the plurality of heat dissipation fins 152 of the heat dissipation module 150 .

Meanwhile, the heat dissipation efficiency may be further improved as the flow of air formed inside the electronic device 100 becomes smoother. An example will be described.

3.1 Internal configuration for improving heat dissipation efficiency of the electronic device 100

8 is a view for explaining a comparative example 801 of the electronic device 100 and an example 802 of the electronic device 100 implemented to improve heat dissipation efficiency according to various embodiments of the present disclosure. Hereinafter, an example of the internal configuration of the electronic device 100 for improving heat dissipation efficiency will be described with reference to FIG. 8 .

3.1.1 Structure to improve heat dissipation efficiency based on Bernoulli's law

According to various embodiments, the internal space of the electronic device 100 so that the cross-sectional area through which air flows in the side adjacent to the heat dissipation fans 130 and 140 is relatively larger and the cross-sectional area through which the air flows in the central portion is relatively smaller. By designing this, the heat dissipation efficiency can be improved by improving the air flow velocity in the interior space according to Bernoulli's law.

According to various embodiments, the duct 120 may extend outwardly so that the cross-sectional area of the flow passage 123 at the inlet 121 and the outlet 122 side is enlarged compared to the cross-sectional area of the central portion. Accordingly, according to Bernoulli's law, the air flow velocity in the flow passage 123 with a relatively narrow cross-sectional area is increased, and thus waste heat accumulated on the heat radiation fins 152 of the heat radiation module 150 in the duct 120 is increased. The efficiency of this external emission can be increased.

Specifically, the duct 120 has a flow passage 123 formed therein, and the flow passage 123 of the duct 120 extends with a constant cross-sectional area, the inlet 121 and the outlet 122 of the duct 120 . ) may have a shape that is extended outwardly so that the cross-sectional area of the flow passage 123 is enlarged, respectively. For example, referring to FIG. 6 , the height of the upper surface of the duct 120 (eg, the height measured in the z-axis direction with respect to the heat dissipation plate 151 ) is measured from the side adjacent to the heat dissipation fans 130 and 140 . It may be implemented to be relatively high and to be relatively low as it is closer to the center in the longitudinal direction (eg, in the y-axis direction).

In one embodiment, at least a portion adjacent to the inlet 121 and the outlet 122 of the upper surface of the duct 120 facing (or opposite to, or corresponding to) the outer surface of the upper housing 110 is in a horizontal direction. and may extend toward the lower housing 112 .

That is, the duct 120 may have a shape extending outward from the inlet 121 and the outlet 122 . Accordingly, the cross-sectional area of the flow passage 123 of the duct 120 may be gradually enlarged at the inlet 121 and the outlet 122 .

According to various embodiments, the lower housing 112 may be implemented to include at least a partial region in which the protrusion 113 protruding in the z-axis direction is formed. Due to the protrusion 113 , a cross-sectional area of the flow passage 123 associated with the partial region may be implemented to be relatively smaller than a cross-sectional area of the flow passage 123 associated with another portion. Accordingly, according to Bernoulli's law, the air flow velocity inside the flow passage 123 with a relatively narrow cross-sectional area is increased, and accordingly, the waste heat accumulated on the heat radiation fins 152 of the heat radiation module 150 inside the duct 120 is Efficiency of emission to the outside may be increased. On the other hand, the protrusion 113 is not formed integrally with the lower housing 112, but may be a structure implemented separately.

In an embodiment, at least a portion of the inner surface of the lower housing 112 may protrude toward one end and the other end of the heat dissipation plate 151 of the heat dissipation module 150 , and accordingly, one end of the heat dissipation plate 151 . The part and the other end may be supported by being in contact with the protrusion 113 protruding from the other side 112 of the housing 110 . That is, the heat dissipation plate 151 may be coupled with the protrusion 113 protruding from the other side 112 of the housing 110 protruding from one end and the other end, or the position may be fixed.

In one embodiment, the protruding portion 113 protruding from the other side surface 112 of the housing 110 may gradually decrease in height as it moves away from one end and the other end of the heat dissipation plate 151 to the outside. . That is, the protrusion 113 protruding from the other side 112 of the housing 110 extends to the outside of one end and the other end of the heat dissipation plate 151, the inlet 121 and the outlet of the duct 120 ( 122) side, as it moves away from one end and the other end of the heat dissipation plate 151 to the outside, the height protruding gradually decreases, so that the cross-sectional area of the flow passage 123 (or the duct 120) can be relatively expanded.

As a result, referring to FIG. 8 , the cross-sectional area through which air flows by the upper surface and the protrusion 113 of the duct 120 of the electronic device 100 becomes smaller toward the center of the electronic device 100, so that the air flow rate can be improved.

3.1.2 Structure to improve heat dissipation efficiency by smoothing air flow

According to various embodiments, the internal space of the electronic device 100 may be designed to allow air to flow smoothly (or smoothly).

3.1.2.1 Smooth air flow by the projection 113

According to various embodiments, the flow of air may be smoothly guided between the heat radiation fins 150 from the heat radiation fans 130 and 140 by the protrusion 113 of the electronic device 100 . For example, the protrusion 113 may protrude from the inner surface of the lower housing 112 and may be formed to contact the lower surface of the heat dissipation plate 151 of the heat dissipation module 150 . Accordingly, referring to FIG. 8 , in the case of Comparative Example 801 of the electronic device 100 in which the protrusion 113 is not formed, the air introduced through the heat dissipation fans 130 and 140 is the lower surface of the heat dissipation plate 151 . In the case of the electronic device 100 in which the protrusion 113 is formed (802), heat dissipation is generated while eddy air is generated by flowing into the space between the inner surface of the lower housing 112 and the air flow in the inner space is inhibited. The air flowing in through the fans 130 and 140 may be guided between the heat dissipation fins 152 along the outer surface of the protrusion 113 without obstruction, so that the air may flow smoothly. Also, for example, the protrusion 113 may be formed to contact (or surround the side surface) of the heat dissipation plate 151 while being in contact with the lower surface of the heat dissipation plate 151 of the heat dissipation module 150 . . Accordingly, the air guided along the outer surface of the protrusion 113 is directly guided between the heat dissipation fins 152, so that the air can flow smoothly. As a result, heat dissipation efficiency may be improved.

According to various embodiments, the height of the protrusion 113 protruding from the lower surface of the upper housing 112 of the electronic device 100 is reduced as it moves away from one end and the other end of the heat dissipation plate 151 to the outside. At the same time, the rate of change of the protruding height may be gradually increased. Accordingly, when air flows into the flow passage 123 of the duct 120 from the inlet 121 side of the duct 120, the rate of change of the cross-sectional area is gradually reduced in a relatively large state, so that the air is discharged from the heat dissipation plate ( 151) and the heat dissipation fins 152 may flow smoothly. In addition, when air is discharged from the flow passage 123 at the outlet 122 side of the duct 120 , the change rate of the cross-sectional area is gradually increased, so that the air inside the flow passage 123 can flow smoothly.

In another embodiment, the height protruding from one end and the other end of the heat dissipation plate 151 to the outside is reduced, and at the same time, the height of the protrusion 113 protruding from the other side 112 of the upper housing 110 is reduced. The rate of change may be constant, or, conversely, the rate of change with respect to the height of the protrusion 113 protruding from the other side 112 of the upper housing 110 may be increased.

3.1.2.2 Smooth air flow due to alignment of the space between the through-holes of the cover members 181 and 182, the heat dissipation fans 130 and 140, and the heat dissipation fins 152

According to various embodiments, air flow may be smoothed based on the arrangement of components forming the flow passage of the electronic device 100 in the longitudinal direction (eg, the x-axis direction). For example, when viewed in the longitudinal direction (eg, the x-axis direction) perpendicular to the cover members 181 and 182 , the position of at least some of the through holes formed in the cover members 181 and 182 , the heat dissipation fan 130 . , 140), the position of the space between the wings, the outlet / inlet of the duct 120, and the position of at least some of the spaces between the heat dissipation fins may correspond to each other. The position may mean a position on the y-z plane. By the alignment, the air flow is formed smoothly, so that heat dissipation efficiency can be improved.

4. Heat dissipation efficiency of the electronic device 100

4.1 Physical shape and heat transfer rate of the heat dissipation module 150

9 is a view for explaining an example of parameters associated with the heat dissipation module 150 and characteristics (eg, heat transfer, static pressure) affected based on the parameters according to various embodiments of the present disclosure.

According to various embodiments, a heat-related characteristic of the heat dissipation module 150 may be determined by parameters related to a physical shape of the heat dissipation module 150 . For example, the parameters related to the physical shape of the heat dissipation module 1500 include the width S of the heat dissipation fins 152, the width G of the space between the heat dissipation fins 152, the number of heat dissipation fins 152 (N), and the heat dissipation fins. It may include a height H of 152 , a height T of the heat dissipation plate 151 , and a width X of the heat dissipation plate 151. For example, the heat dissipation module 150 associated with a row Characteristics may include heat transfer rate and static pressure (or heat resistance) The higher the heat transfer rate, the greater the amount of waste heat generated in the thermoelectric element 170 is smoothly transferred to the heat dissipation fins of the heat dissipation module 150, and the heat resistance increases As the value increases, the amount of waste heat generated in the thermoelectric element 170 may be smoothly transferred to the heat dissipation fins of the heat dissipation module 150 may be reduced.

According to various embodiments, as shown in FIG. 9 , by the values of parameters related to the physical shape of the heat dissipation module 150, heat-related properties (eg, heat transfer, static pressure) that are opposite to each other may be determined, Each configuration of the heat dissipation module 150 needs to be implemented to have an optimal heat transfer rate. Meanwhile, it is not limited to the illustrated example, and characteristics affected by each parameter may be more diverse. For example, although not shown, the length L of the heat dissipation plate 151 may be proportional to heat transfer and may also be proportional to static pressure.

4.2 Physical shape and heat dissipation rate of the heat dissipation module 150

According to various embodiments, the physical shape of the heat dissipation module 150 may affect not only the heat transfer rate of the heat dissipation module 150, but also the heat dissipation rate as shown in [Table 1] below. The heat dissipation rate may mean the efficiency at which heat generated in the heat dissipation fins 152 is radiated to the outside. For example, the heat dissipation rate may be proportional to an area in which the heat dissipation module 150 (eg, the heat dissipation fins 152 or the heat dissipation plate 151 ) and air contact.

parameter heat emission S (width of heat dissipation fins 152) inversely G (width of space between heat sink fins 152) proportion H (height of heat dissipation fins 152) proportion L (length of heat dissipation plate 151) proportion

For example, as the width G of the space between the heat dissipation fins 152 increases, the cross-sectional area of the flow passage increases, and thus the heat release rate may increase. As a result, as described in [Table 2] below, according to each parameter The heat transfer rate, static pressure, and heat release rate can be determined.

parameter heat transfer static pressure heat emission S (width of heat dissipation fins 152) inversely proportion inversely G (width of space between heat sink fins 152) inversely inversely proportion H (height of heat dissipation fins 152) proportion proportion proportion L (length of heat dissipation plate 151) proportion proportion proportion

Referring to [Table 2], since a trade-off relationship is formed between the heat transfer rate and the heat release rate in the case of a specific parameter (eg, the width G of the space between the heat dissipation fins 152 ), it may need to be optimally determined. For example, in the case of the width G of the space between the heat dissipation fins 152, the larger the heat transfer rate, the smaller the heat transfer rate. For example, the width G of the space between the respective heat dissipation fins 152 may be formed to be at least 2.5 times the thickness of the heat dissipation fins 152 . For example, the thickness of the heat dissipation fin 152 is set to 1 [mm], and between the plurality of heat dissipation fins 152 may be spaced apart by a distance of 3 [mm]. Accordingly, a cross-sectional area through which air flows through the flow passage 123 of the duct 120 between the respective heat dissipation fins 152 may be sufficiently secured.

4.3 Example of optimal implementation of parameters

4.3.1 Optimal Density Parameters

10 is a diagram for explaining an example of a range of a density parameter calculated based on parameters associated with the heat dissipation module 150 according to various embodiments of the present disclosure.

According to various embodiments, the density parameter P1 may be calculated as in [Equation 1] below.

In [Equation 1], S is the width of the heat dissipation fins 152, G is the width of the space between the heat dissipation fins 152, N is the number of heat dissipation fins 152, H is the height of the heat dissipation fins 152, T is heat dissipation A height of the plate 151 and X may indicate a width of the heat dissipation plate 151 .

Referring to FIG. 10 , a saturation temperature having a critical significance in P1 in a specific range (eg, a lower limit value (min1) and an upper limit value (max1)) may be formed, which is the heat transfer rate and heat release rate of the heat dissipation module 150 It may mean that it is implemented optimally. For example, the saturation temperature may be defined as the temperature of the heat absorbing plate 160 that is finally maintained as the heat absorbing plate 160 is cooled as the thermoelectric element 170 is driven. The heat dissipation module 150 may be implemented so that the P1 is set within a range where the lower limit value is 174000 [/m] and the upper limit value is 194000 [/m], and in this case, the saturation temperature is below the threshold value (eg, 1 Celsius degrees Celsius or less).

4.3.1.1 Optimal Pin Density Parameters

According to various embodiments, the fin density parameter P1-1 may be calculated as in Equation 2 below.

In Equation 2, S may represent the width of the heat dissipation fin 152 , N may represent the number of heat dissipation fins 152 , and X may represent the width of the heat dissipation plate 151 .

According to various embodiments, the fin density parameter P1-1 may be implemented within a range of 1/3.5 to 1/4.5 of the width X of the heat dissipation plate 151 . When the product (N*S) of the number (N) and the thickness (S) of the plurality of heat dissipation fins 152 is greater than 1/3.5 of the width (X) of the heat dissipation plate 151, the flow passage of the duct 120 ( 123) is reduced, the amount of heat emission is reduced, and the product (N*S) of the number (N) and the thickness (S) of the plurality of heat dissipation fins 152 (N * S) of the width (X) of the heat dissipation plate 151 When it is smaller than 1/4.5, the contact area between the plurality of heat dissipation fins 152 and the air is reduced, so that the amount of heat emission can be reduced.

For example, the width (X) of the heat dissipation plate 151 may be 23 [mm], the plurality of heat dissipation fins 152, the product (N * S) of the number (N) and the thickness (S) is 5.11 to It can be set between 6.57.

In one embodiment, as for the plurality of heat dissipation fins 152 , the number of heat dissipation fins 152 having a thickness of 1 [mm] is set to 6, so that the product (N*S) of the number (N) and the thickness (S) is set to 6 can be

In one embodiment, the plurality of heat dissipation fins 152 of the heat dissipation module 150 have a thickness smaller than the height of the heat dissipation plate 151 , and between the plurality of heat dissipation fins 152 is 2.5 times or more of the thickness of the heat dissipation fin 152 . can be separated by distance.

4.3.2 Optimal length parameters

11 is a view showing an example of the optimal length of the heat dissipation module 150 according to various embodiments.

For example, referring to FIG. 11 , the width (S) of the heat dissipation fins 152 of the heat dissipation module 150 is 1 [mm], the width G of the space between the heat dissipation fins 152 is 3 [mm], the heat dissipation fins The number of 152 is 6, the height (H) of the heat dissipation fin 152 is 8 [mm], the height (T) of the heat dissipation plate 151 is 2 [mm], and the width (X) of the heat dissipation plate 151 ) is 23 [mm], the length (L) of the heat dissipation plate 151 so that the heat transfer rate is optimally designed, between the first heat dissipation fan 130 and the second heat dissipation fan 140 of the duct 120 It can be extended to more than 0.85 times the distance spaced apart. Here, the flow passage 123 of the duct 120 is formed between the first heat dissipation fan 130 and the second heat dissipation fan 140 , for example, the first heat dissipation fan 130 and the second heat dissipation fan 140 . ) between the flow passage 123 of the duct 120 may extend to 85 [mm], the heat dissipation plate 151 and the plurality of heat dissipation fins 152 may extend to 72.25 [mm] or more.

The graph of FIG. 11 shows the temperature change of the heat absorbing plate 160 according to the case where the length of the heat dissipation module 150 is 56 [mm], 66 [mm], and 76 [mm]. As the thermoelectric element 170 is driven for the first time t1 , the temperature of the heat absorbing plate 160 may be reduced, and the temperature of the heat absorbing plate 160 may be maintained within a specified range for the second time t2 . The temperature of the heat absorbing plate 160 during the second time period may be defined as a saturation temperature. Referring to the saturation temperature, it can be seen that the saturation temperature decreases as the length of the heat dissipation module 150 becomes longer, and since the average performance is meaningless compared to the target temperature (0 degrees Celsius or less), the length of the heat dissipation module 150 is the weight It can be chosen as the optimal point between the increase and the temperature performance. For example, the saturation temperature of the heat absorbing plate 160 may be stably maintained in the target temperature range of 0-1 degrees Celsius when the length of the heat dissipation module 150 is 76 [mm].

As described above, the amount of heat emitted to the outside is determined according to the length of the heat dissipation module 150. If the length of the heat dissipation module 150 increases, the amount of heat transfer inside the heat dissipation module 150 increases, but the air flow distance As α increases, the amount of heat release can be decreased. Accordingly, the length of the heat dissipation module 150 can be optimally designed to be 72.25 [mm] or more and 76 [mm].

4.3.2.1 Optimal Length Ratio Parameters

12 is a diagram for describing an example of a range of a length ratio parameter calculated based on parameters associated with the heat dissipation module 150 according to various embodiments of the present disclosure.

According to various embodiments, the length ratio parameter P2 may be calculated as in [Equation 3] below.

In Equation 3, L1 may represent a length (eg, a length in the X-axis direction) of the thermoelectric element 170 , and L2 may represent a length 152 of the heat dissipation plate 151 .

Referring to FIG. 12 , a saturation temperature having a critical significance in which P2 is in a specific range (eg, a lower limit value (min2) and an upper limit value (max2)) may be formed, which indicates that the heat transfer rate and heat release rate of the heat dissipation module 150 are It may mean that it is implemented optimally. For example, the length L1 of the thermoelectric element 170 and the length L2 of the heat dissipation plate 151 are implemented so that P2 is set within the range where the lower limit value is 2 [AU] and the upper limit value is 4 [AU] In this case, the saturation temperature can be maintained below a critical value (eg below 1 degree Celsius).

4.3.3 Optimal implementation example of the heat dissipation module 150

According to various embodiments, the width (S) of the heat dissipation fin 152 of the heat dissipation module 150 is 1 [mm], the width G of the space between the heat dissipation fins 152 is 3 [mm], the heat dissipation fins 152 6, the height (H) of the heat dissipation fin 152 is 8 [mm], the height (T) of the heat dissipation plate 151 is 2 [mm], and the width (X) of the heat dissipation plate 151 is 23 In the case of [mm], the heat dissipation module 150 may be implemented to have an optimal heat transfer rate.

5. Functions of the electronic device 100

Hereinafter, a functional configuration of the electronic device 100 and an example of an operation of the electronic device 100 based on the functional configuration according to various embodiments will be described.

5.1. cooling system

13 is a view for explaining an example of a cooling providing system according to various embodiments.

Referring to FIG. 13 , the cooling providing system may include the aforementioned electronic device 100 (or electronic device) and the external electronic device 1300 . Since the electronic device 100 has been described above, a redundant description thereof will be omitted. The external electronic device 1300 may include an external server and a user terminal (eg, a smart phone, a wearable device, an HMD device, etc.). The external server may include a server implemented to provide information related to temperature, a home network server, and the like. The electronic device 100 may perform an operation using a physical button as described above, but may also perform an operation by driving instructions received from the external electronic device 1300 .

5.2. Functional configuration of the electronic device 100

14 is a diagram for explaining an example of a functional configuration of the electronic device 100 according to various embodiments of the present disclosure.

According to various embodiments, as shown in FIG. 14 , the electronic device 100 includes a plurality of heat dissipation fans (eg, the first heat dissipation fan 130 , the second heat dissipation fan 140 ) and a thermoelectric element 170 . ) including a cooling device 1410 , a processor 1420 , a sensor 1430 , and a communication circuit 1440 . Meanwhile, the electronic device 100 may be implemented to include more devices or fewer devices, without being limited to what is illustrated and/or described in FIG. 14 . For example, the electronic device 100 may further include the components described with reference to FIGS. 1 to 3 , and since this has been described above, a redundant description thereof will be omitted. Hereinafter, examples of each configuration will be described.

According to various embodiments, the cooling device 1410 may be implemented to provide a feeling of cooling. Since the plurality of heat dissipation fans (eg, the first heat dissipation fan 130 , the second heat dissipation fan 140 ) and the thermoelectric element 170 included in the cooling device 1410 have been described above, overlapping descriptions will be omitted. .

According to various embodiments, the processor 1420 executes, for example, software (eg, a program 1420 ) to at least one other component (eg, hardware) of the electronic device 100 connected to the processor 1420 . or a software component), and may perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 1420 may store commands or data received from other components (eg, the sensor 1430 or the communication circuit 1440) into a volatile memory (not shown). may be stored in , process commands or data stored in a volatile memory (not shown), and store the result data in a non-volatile memory (not shown). According to an embodiment, the processor 1420 is a main processor (eg, a central processing unit or an application processor) or an auxiliary processor (eg, a graphic processing unit, a neural processing unit (NPU)) that can be operated independently or together with the main processor (eg, a central processing unit or an application processor). , an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 100 includes a main processor and an auxiliary processor, the auxiliary processor may use less power than the main processor or may be set to specialize in a specified function. The coprocessor may be implemented separately from or as part of the main processor.

According to various embodiments, the sensor 1430 detects an operating state (eg, power or temperature) of the electronic device 100 or an external environmental state (eg, a user state), and generates electricity corresponding to the sensed state. It can generate signals or data values. According to an embodiment, the sensor 1430 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, and a temperature. It may include a sensor, a humidity sensor, or an illuminance sensor.

According to various embodiments, the communication circuit 1440 establishes a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 100 and the external electronic device 1300 , and performs communication through the established communication channel. can support The communication circuit 1440 may include one or more communication processors that operate independently of the processor 1420 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication circuit 1440 is a wireless communication module (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (eg, a local area network (LAN) communication module). ) communication module, or power line communication module). Among these communication modules, the corresponding communication module is a first network (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct or IrDA (infrared data association)) or a second network (eg, a legacy cellular network, a 5G network, It may communicate with an external electronic device through a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module may identify or authenticate the electronic device within a communication network such as the first network or the second network using subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module. The wireless communication module may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module may support various requirements defined in the electronic device 100 , the external electronic device 1300 , or a network system (eg, a second network). According to an embodiment, the wireless communication module has a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (eg, down) for realizing URLLC. Each link (DL) and uplink (UL) may support 0.5 ms or less, or 1 ms or less round trip).

5.3. Example of operation of the electronic device 100

5.3.1 Cooling action

15 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure. According to various embodiments, the operations illustrated in FIG. 15 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 15 or at least one fewer operations may be performed. Hereinafter, FIG. 15 will be described with reference to FIG. 16 .

16 is a diagram for describing an example of an operation of controlling a plurality of fans of the electronic device 100 according to various embodiments of the present disclosure.

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may apply power to the thermoelectric element in operation 1501 . For example, the electronic device 100 may apply power (eg, current and/or voltage) stored in the battery to the thermoelectric element 170 through a power application circuit (eg, a power supply). In this case, the electronic device 100 may apply power in a pre-set direction (eg, + or -) so that the heat absorbing surface (not shown) of the thermoelectric element 170 is cooled.

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may initiate an operation of applying power to the thermoelectric element based on various types of events. In an embodiment, when the physical button 191 is pressed by the user, the electronic device 100 may apply power to the thermoelectric element. In another embodiment, the electronic device 100 uses the sensor 1430 to identify that a specified event occurs (eg, a pre-set movement occurs, a pre-set gesture occurs, a pre-set external temperature is reached) In this case, power may be applied to the thermoelectric element. In another embodiment, the electronic device 100 may apply power to the thermoelectric element based on information received from the external electronic device 1300 , which will be further described below with reference to FIGS. 17 to 18 .

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may control the plurality of fans so that each of the wings of the plurality of fans 130 and 140 rotates in a specific rotation direction in operation 1503 . can For example, referring to FIG. 16 , in the electronic device 100 , the blades of each of the plurality of fans 130 and 140 move in a specific rotational direction (eg, clockwise or counterclockwise) so that air flow is formed in one direction. can be controlled to rotate. In this case, the rotational directions of the blades of each of the plurality of fans 130 and 140 may correspond to each other.

5.3.2 Operation of starting to provide a feeling of cooling by the external electronic device 1300

17 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure. According to various embodiments, the operations illustrated in FIG. 17 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 17 or at least one fewer operations may be performed. Hereinafter, FIG. 17 will be described with reference to FIG. 18 .

18 is a diagram for explaining an example of communication of the electronic device 100 with the external electronic device 1300 according to various embodiments of the present disclosure.

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may identify an event for driving the thermoelectric element in operation 1701 and apply power to the thermoelectric element in operation 1703 . For example, the electronic device 100 may receive a message (or a request, or instructions) from the external electronic device 1300 , and may identify an event for driving the thermoelectric element based on the received message. Referring to FIG. 18 , the electronic device 100 establishes a communication connection with a server 1810 and/or a user terminal (eg, a smart phone 1821 and a wearable device 1823 ) through a communication circuit 1440 . can In an embodiment, the electronic device 100 may identify an event for driving the thermoelectric element based on a message received from the server 1810 . For example, the server 1810 may be a server implemented to collect and provide information on temperature. In this case, the electronic device 100 determines whether the temperature exceeds a threshold value based on information on the temperature included in the message received from the server 1810 , and when the temperature exceeds the threshold value, the thermoelectric element ( 170), it is possible to identify the occurrence of an event for driving. In another embodiment, the electronic device 100 may identify an event for driving the thermoelectric element based on a message received from the user terminal. For example, the user terminal (eg, the smart phone 1821 and the wearable device 1823 ) may execute an application for controlling the electronic device 100 . When a user terminal (eg, the smart phone 1821 and the wearable device 1823 ) receives an input for driving the electronic device 100 from a user using the executed application, the It can send a message containing instructions to trigger the actuation. The electronic device 100 may identify an event for driving the thermoelectric element based on the driving-inducing instructions included in the message. Also, for example, the user terminal (eg, the smart phone 1821 and the wearable device 1823 ) transmits a message including information on temperature and/or information on the user's body temperature to the electronic device 100 . can In this case, the electronic device 100 determines whether the temperature and/or body temperature exceeds a threshold value based on information included in the received message, and when the temperature and/or body temperature exceeds the threshold value, the thermoelectric element ( 170), it is possible to identify the occurrence of an event for driving.

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may control the plurality of fans so that each of the wings of the plurality of fans rotates in a specific rotation direction in operation 1703 .

5.3.3 Heat dissipation start operation

19 is a flowchart illustrating an example of an operation of the electronic device 100 according to various embodiments of the present disclosure. According to various embodiments, the operations illustrated in FIG. 19 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 19 or at least one fewer operations may be performed. Hereinafter, FIG. 19 will be described with reference to FIG. 20 .

20 is a diagram for explaining an example of an operation of controlling a heat dissipation fan of the electronic device 100 according to various embodiments of the present disclosure.

According to various embodiments, the electronic device 100 (eg, the processor 1420 ) may apply power to the thermoelectric element in operation 1901 .

According to various embodiments, the electronic device 100 (eg, the processor 1420) identifies an event for driving a fan in operation 1903, and causes each of the wings of the plurality of fans to rotate in a specific rotation direction in operation 1905; You can control multiple fans. For example, the electronic device 100 (eg, the processor 1420 ) may control the rotational speed of the blades of the plurality of fans 130 and 140 according to the amount of waste heat generated by the thermoelectric element 170 . have. For example, referring to FIG. 20 , as the amount of waste heat generated by the thermoelectric element 170 increases, the electronic device 100 increases the rotation speed of the blades of the plurality of fans 130 and 140 to increase the amount of heat emitted. can do it As an example, the electronic device 100 measures the temperature of the heat dissipation module 150 (eg, the heat dissipation plate 151 or the heat dissipation fin 152 ) using the sensor 1430 (eg, a first event, and second event), power may be applied to the heat dissipation fans 130 and 140 based on the magnitude of the measured temperature. For example, referring to FIG. 20 , the period of application of the power may be inversely proportional to the magnitude of the temperature, but the embodiment is not limited thereto and the magnitude of the applied power may be set to be proportional to the magnitude of the temperature.

Meanwhile, without being limited to the described example, the electronic device 100 (eg, the processor 1420 ) may control the degree of rotation of the heat dissipation fans 130 and 140 under the user's control (manual operation).

Claims (19)

An electronic device comprising:
At least one housing including an outer surface including at least a part of the open; and, the inner space is partitioned by the outer surface,
and a duct disposed in the inner space and including an outer wall having an inlet and an outlet formed therein, and a flow passage through which air flows is formed in the duct,
a first heat dissipation fan disposed at a position adjacent to the inlet of the duct and configured to flow air into the electronic device during operation;
a second heat dissipation fan disposed adjacent to the outlet of the duct and configured to flow the air to the outside of the electronic device during operation;
a heat dissipation module, at least a portion of which is positioned between the inlet and the outlet of the duct, and includes a heat dissipation plate extending in a plane direction and a plurality of heat dissipation fins extending from the heat dissipation plate;
a heat absorbing plate extending in a planar direction and arranged to cover the open portion of the outer surface of the at least one housing; and
During operation, a thermoelectric effect is generated on a heat absorbing surface and a heat absorbing surface, and is disposed between the heat dissipation plate and the heat absorbing plate, the heat generating surface is thermally connected to the heat dissipation plate of the heat dissipation module, and the heat absorbing surface is the heat absorbing plate a thermoelectric element thermally connected to
When the first heat dissipation fan and the second heat dissipation fan operate, the air flows into the inlet of the duct, flows through the spaces between the plurality of heat dissipation fins, and flows out from the outlet of the duct,
and a cross-sectional area of the inlet of the duct through which the air is introduced and a cross-sectional area of the outlet of the duct through which the air flows are relatively larger than a cross-sectional area of the remaining part of the duct.
The method of claim 1,
the at least one housing comprises an upper housing and a lower housing;
The upper housing includes one side protruding to the outside of the housing to be bent according to a preset first curvature,
The lower housing includes the open portion facing the one side,
electronic device.
3. The method of claim 2,
The heat absorbing plate,
It is coupled to the lower housing and has a shape recessed inward of the electronic device according to a second curvature corresponding to the first curvature,
electronic device.
3. The method of claim 2,
The duct is extended outwardly so that the cross-sectional area is enlarged at the inlet and the outlet side,
electronic device.
5. The method of claim 4,
The upper surface of the duct extends obliquely from the inlet and the outlet side toward the lower housing toward the one side of the outer surface,
electronic device.
3. The method of claim 2,
The inner surface of the lower housing includes a first protrusion protruding toward one end of the heat dissipation plate of the heat dissipation module and a second protrusion protruding toward the other end of the heat dissipation module,
electronic device.
7. The method of claim 6,
The first protrusion and the second protrusion are in contact with the lower surface of the heat dissipation plate,
electronic device.
8. The method of claim 7,
The first protrusion is in contact with the first side of the heat dissipation plate,
The second protrusion is in contact with the second side of the heat dissipation plate,
electronic device.
9. The method of claim 8,
The air introduced through the first heat dissipation fan is guided to the inlet of the duct by the first protrusion,
electronic device.
10. The method of claim 9,
The height of the first protrusion and the second protrusion are gradually decreased as they move away from the one end and the other end of the heat dissipation plate, and the rate of change of the protruding height is gradually increased at the same time,
electronic device.
The method of claim 1,
The heat dissipation plate of the heat dissipation module,
It is disposed to be spaced apart from the heat absorbing plate at one end and the other end,
The thermoelectric element is disposed between the one end and the other end of the heat dissipation plate at a position in which the spaced apart distance from the heat absorbing plate is reduced,
electronic device.
The method of claim 1,
A heat transfer pad disposed between the heat absorbing plate and the heat absorbing surface and in contact with the heat absorbing plate and the heat absorbing surface at the same time, or disposed between the heat dissipating plate and the heat absorbing surface and contacting the heat dissipating plate and the heat absorbing surface at the same time; more containing,
electronic device.
The method of claim 1,
The first heat dissipation fan and the second heat dissipation fan are detachable from parts corresponding to the inlet and the outlet of the duct,
electronic device.
The method of claim 1,
Further comprising; a first fan cover and a second fan cover having a plurality of through-holes formed at positions corresponding to the inlet and the outlet of the duct;
electronic device.
According to claim 1,
Each of the plurality of heat dissipation fins of the heat dissipation module is a straight extending in a direction from the inlet side to the outlet side of the duct, and the plurality of heat dissipation fins are disposed to be spaced apart from each other in a direction crossing the extending direction,
electronic device.
16. The method of claim 15,
The plurality of heat dissipation fins of the heat dissipation module have a thickness smaller than the height of the heat dissipation plate,
Between the plurality of heat dissipation fins, spaced apart by a distance of 2.5 times or more of the thickness of the heat dissipation fins,
electronic device.
17. The method of claim 16,
The plurality of heat dissipation fins of the heat dissipation module, the product (N * S) of the number (N) and the thickness (S) is within the range of 1/3.5 to 1/4.5 of the width (X) of the heat dissipation plate,
electronic device.
18. The method of claim 17,
The heat dissipation plate and the plurality of heat dissipation fins extend in length by 0.85 times or more of the distance between the first heat dissipation fan and the second heat dissipation fan of the duct,
electronic device.
The method of claim 1,
an interface for directly receiving a manipulation input from a user or receiving a manipulation from an external electronic device; and
A processor that controls the operation of the first heat dissipation fan and the second heat dissipation fan or controls the operation of the thermoelectric element based on the input received or the received operation; further comprising,
electronic device.

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