KR102439012B1 - Deposition apparatus including contact structure - Google Patents

Abstract

A deposition apparatus is disclosed. The deposition apparatus includes: a chamber; a mask assembly located inside the chamber, and including a mask area made of metal including a fine pattern and a frame area surrounding the mask area; a seating plate positioned inside the chamber, and including a first surface on which a substrate is seated and a second surface opposite to the first surface, wherein the substrate is disposed to at least partially face the mask assembly; a magnet structure located inside the chamber, and disposed on the second surface of the seating plate, wherein the magnet structure includes a magnet and a holder in which the magnet is at least partially housed; a first driving module formed to move the magnet structure and the seating plate together in a first direction; a second driving module formed to move the seating plate in the first direction; and a control module formed to adjust a distance between the magnet and the mask area by controlling the first driving module and/or the second driving module. Besides, various embodiments identified through the present specification can be possible. Therefore, the present invention is capable of reducing defects occurring during a deposition process.

Description

Deposition apparatus including a contact structure {DEPOSITION APPARATUS INCLUDING CONTACT STRUCTURE}

Embodiments disclosed in this document relate to a deposition apparatus including a contact structure.

The FMM (Fine Metal Mask) is a mask on which a fine pattern is formed, and is a component related to the resolution of the OLED panel. In general, the mask was prepared as a metal plate with about 20 million or more microscopic holes (patterns) in a 25 μm-thick metal thin film. As the resolution of OLED panels increases, finer patterns (more holes) are required, and thinner masks (8 μm to 15 μm) are required.

As the thickness of the pattern mask becomes thinner and the pattern becomes finer, when the same deposition process is performed as in the prior art, adhesion between the substrate and the pattern mask decreases, resulting in an increase in defects in the deposition process.

According to the embodiments disclosed in this document, a deposition apparatus including a contact structure that improves adhesion between a substrate and a pattern mask and provides uniform adhesion over the entire area of the pattern mask, and a deposition system including the same would like to provide

According to an embodiment disclosed in this document, a deposition apparatus including a contact structure is disclosed. The deposition apparatus includes a chamber; a mask assembly positioned inside the chamber, the mask assembly including a metal mask region including a fine pattern and a frame region surrounding the mask region; a seating plate positioned inside the chamber and including a first surface on which a substrate is mounted and a second surface opposite to the first surface, the substrate being disposed to at least partially face the mask assembly; a magnet structure positioned inside the chamber and disposed on the second surface of the seating plate, the magnet structure including a magnet and a holder in which the magnet is at least partially accommodated; a first driving module configured to move the magnet structure and the seating plate together in a first direction; a second driving module configured to move the seating plate in the first direction; and a control module configured to adjust a distance between the magnet and the mask region by controlling the first driving module and/or the second driving module.

The deposition apparatus according to the embodiments disclosed in this document provides uniform and improved adhesion between the substrate and the pattern mask, thereby reducing defects occurring during the deposition process of the fine pattern. In addition, by independently moving the magnet and the substrate, the distance between the magnet and the mask assembly can be easily controlled, and the pattern mask of various thicknesses and the substrate of various thicknesses can be applied.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a diagram illustrating a deposition system according to an exemplary embodiment.
2 is a diagram illustrating a deposition system according to an exemplary embodiment.
3 is a diagram illustrating a mask assembly and a support structure of a deposition apparatus according to an exemplary embodiment.
4 is a diagram illustrating a contact structure of a deposition apparatus according to an exemplary embodiment.
5 is a diagram illustrating a part of a contact structure of a deposition apparatus according to an exemplary embodiment.
6 is a cross-sectional view illustrating a contact structure of a deposition apparatus according to an exemplary embodiment.
7 is a diagram illustrating a portion of a substrate loading process of a deposition apparatus according to an exemplary embodiment.
8 is a cross-sectional view illustrating the deposition apparatus of FIG. 7 .
9 is a diagram illustrating a portion of a substrate unloading process of a deposition apparatus according to an exemplary embodiment.
FIG. 10 is a cross-sectional view illustrating the deposition apparatus of FIG. 9 .
11 is a diagram illustrating a mask assembly and a magnet of a contact structure of a deposition apparatus according to an exemplary embodiment.
12 is a diagram illustrating a magnet of a deposition apparatus according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included.

1 is a diagram illustrating a deposition system according to an exemplary embodiment. 2 is a diagram illustrating a deposition system according to an exemplary embodiment.

The deposition system 100 illustrated in FIGS. 1 and 2 may be configured to deposit a deposition material on a substrate 201 . For example, the substrate 201 may include a glass material. The deposition material may include an organic material, a metal, or a compound thereof. For example, the deposition system 100 may be used in at least a part of an OLED manufacturing process or a micro LED manufacturing process.

1 and 2 , the deposition system 100 includes a main frame 101 , a deposition device 120 , a transport device 110 , a display module 130 , a control module, and a contact structure 200 . can do. A deposition apparatus 120 , a transfer apparatus 110 , a display module 130 , a control module, and a contact structure 200 may be disposed on the main frame 101 . For example, the transfer apparatus 110 and the deposition apparatus 120 may be arranged in a horizontal direction (eg, a Y-axis direction). For example, the transfer device 110 includes a load lock chamber 112 accommodating the substrate 201 , and an arm member 111 that moves the substrate 201 positioned in the load lock chamber 112 into the deposition apparatus 120 . ), and a fourth driver 115 . In various embodiments, the transfer device 110 may include a first cover 114 operably coupled to the load lock chamber 112 to be opened and closed.

In an embodiment, the arm member 111 of the transport device 110 may extend from the internal space 113 of the load lock chamber 112 of the transport device 110 onto the surface of the seating plate 220 . For example, the arm member 111 may be moved in the horizontal direction by the third actuator. For example, a substrate may be positioned at an end of the arm member 111 . As the arm member 111 moves from the internal space 113 of the load lock chamber 112 to the seating plate 220 of the contact structure 200 , the substrate 201 moves to the seating plate 220 of the contact structure 200 . can be moved to In the substrate transfer process, a portion of the arm member 111 may be positioned inside the mounting plate 220 or the deposition apparatus 120 (eg, the chamber 121 ).

In an embodiment, the deposition apparatus 120 may be connected to the transfer apparatus 110 to perform a deposition process of depositing a deposition material on the substrate 201 transferred from the transfer apparatus 110 . For example, the deposition apparatus 120 and the transfer apparatus 110 may be connected so that the substrate 201 is movable. The deposition apparatus 120 includes a chamber 121 in which a deposition process is performed, and a target (eg, a substrate 201 ) on which a deposition material is sputtered may be disposed in the chamber 121 . The chamber 121 may be formed by vacuum. A support structure 124 for supporting the mask assembly 210 may be disposed inside the chamber 121 . In various embodiments, the deposition apparatus 120 may include a second cover 122 for opening and closing the chamber 121 and an opening/closing module 123 for driving the second cover 122 .

Referring to the drawings, the support structure 124 may be provided in a substantially cylindrical shape open to both sides in the Z-axis direction, but is not limited thereto, and supports the mask assembly 210 in the direction of gravity (eg, the -Z-axis direction). may be provided in various forms. In an embodiment, the mask assembly 210 may at least partially overlap the substrate 201 and the magnet structure 250 when viewed in the Z-axis direction. For example, when viewed in the Z-axis direction, the mask assembly 210 is disposed on the top, the substrate 201 is disposed under the mask assembly 210 , and the magnet structure 250 is disposed under the substrate 201 . can be

In an embodiment, the contact structure 200 may be located at least partially inside the deposition apparatus 120 . For example, the contact structure 200 may include a seating plate 220 on which the substrate 201 is mounted, a magnet structure 250 disposed under the seating plate 220 , and a mask assembly disposed on the seating plate 220 . 210 may be included.

In an embodiment, the contact structure 200 may include driving modules 230 and 240 for adjusting positions of the magnet 251 and the substrate 201 . For example, the first driving module 230 may be configured to move the magnet structure 250 and the seating plate 220 together, and the second driving module 240 may be configured to move only the magnet structure 250 .

In an embodiment, the contact structure 200 may further include a third driving module 270 for moving the substrate. The third driving module 270 may be operated in association with the operation of the arm member 111 of the transport device 110 . For example, the arm member 111 moves in the +Y-axis direction while supporting the lower surface of the substrate 201 to enter the deposition apparatus 120 , and thereafter, the third driving module 270 moves in the +Z direction. By moving in the axial direction, the substrate 201 may be spaced apart from the arm member 111 . After that, the arm member 111 whose contact with the substrate 201 is released moves again in the -Y-axis direction, and the third driving module 270 moves the substrate so that the substrate 201 is seated on the mounting plate 220 - It can be moved in the Z-axis direction.

In the illustrated embodiment, the mounting plate 220 and the mask assembly 210 may be located inside the deposition apparatus 120 , and the driving modules 230 , 240 , and 270 are partially inside the deposition apparatus 120 . can be located in

In an embodiment, the control module is configured to control at least one of the deposition apparatus 120 , the transfer apparatus 110 , the first driving module 230 , the second driving module 240 , and the third driving module 270 . can be For example, the control module operates a vacuum pump to form a vacuum inside the chamber 121 of the deposition apparatus 120 , or the arm member 111 of the transfer apparatus 110 to move the substrate 201 . or to operate the first driving module 230 , the second driving module 240 , and the third driving module 270 of the contact structure 200 .

3 is a diagram illustrating a mask assembly and a support structure of a deposition apparatus according to an exemplary embodiment.

Referring to FIG. 3 , the mask assembly 210 may be supported on the support structure 124 . The support structure 124 may be located in the chamber 121 of the deposition apparatus 120 together with the mask assembly 210 . The support structure 124 is provided in a form in which both sides in the Z-axis direction are open, and the mask assembly 210 is formed in the -Z-axis direction by the flange 125 formed at the periphery of the -Z-axis direction opening of the support structure 124 . can be supported by

Referring also to FIG. 9 , in an embodiment, the mask assembly 210 may include a mask region 211 including a fine pattern and a frame region 212 that is a periphery of the mask region 211 . For example, frame region 212 may be supported on flange 125 .

7 and 8 together, in an embodiment, the mask assembly 210 may be moved in the Z-axis direction by the first driving module 230 . For example, the first driving module 230 moves the magnet structure 250 and the mounting plate 220 in the +Z-axis direction, and the deposition surface (eg: upper surface) may contact the mask region 211 of the mask assembly 210 . In this case, the first driving module 230 may further move in the +Z-axis direction while the substrate 201 and the mask region 211 of the mask assembly 210 are in contact.

Referring to FIGS. 3 and 4 together, a first protrusion 126 may be formed on each of the flanges 125 of the support structure 124 . The first protrusion 126 may be provided to protrude in the +Z-axis direction. For example, the first protrusion 126 may be at least partially inserted into the first hole 216 of the mask assembly 210 . The first protrusion 126 may be formed at a position aligned in the Z-axis direction in the first hole 216 of the mask assembly 210 . The first protrusion 126 and the first hole 216 may align the mask assembly 210 and the support structure 124 .

In an embodiment, when the seating plate 220 is moved in the +Z-axis direction by the first driving module 230 and the mask assembly 210 is pressed in the +Z-axis direction, the mask assembly 210 is formed by the flange 125 . ) and the first protrusion 126 formed on the flange 125 may be separated from the first hole 216 .

3 and 4 together, a second hole 217 is formed in the mask assembly 210 , and a second protrusion ( ) that can be at least partially inserted into the second hole 217 on the mounting plate 220 . 227) may be formed. The second hole 217 and the second protrusion 227 may guide the mask assembly 210 and the seating plate 220 to move in an aligned state.

In an embodiment, when the seating plate 220 is moved in the +Z-axis direction by the first driving module 230 and the mask assembly 210 is pressed in the +Z-axis direction, the second hole 217 is formed in the second hole 217 . The protrusion 227 is inserted so that the mask assembly 210 and the seating plate 220 can move integrally.

In an embodiment, the flange 125 may be formed to correspond to the open area 228 formed at the edge of the mounting plate 220 . For example, the flange 125 may be aligned with the open area 228 of the seating plate 220 when viewed in the Z-axis direction.

In an embodiment, the mask region 211 may include a metal material. The mask region 211 may be referred to as a fine metal mask (FMM) including a pattern of several micrometers to several tens of micrometers. The frame region 212 may include a metal material having a strength capable of supporting the mask region 211 .

In an embodiment, the fine pattern formed in the mask region 211 may include a plurality of openings. For example, each of the plurality of openings may be formed in a substantially rectangular shape. During the deposition process, the organic/metal material passing through the rectangular opening may be deposited on the substrate 201 . For example, an organic/metal material passing through one opening may form one pixel (R, G, or B) included in the OLED device. In this case, the rectangular opening may have a side length of 10 μm to 40 μm. As another example, the fine pattern may include an align mark for defining a position of the mask assembly 210 . The alignment mark may have a side length of 5 μm to 20 μm.

4 is a diagram illustrating a contact structure of a deposition apparatus according to an exemplary embodiment. 5 is a diagram illustrating a part of a contact structure of a deposition apparatus according to an exemplary embodiment.

Referring to FIG. 4 , the contact structure 200 includes a mask assembly 210 , a substrate 201 , a mounting plate 220 on which the substrate 201 is mounted, a magnet structure 250 , a first driving module 230 , It may include a second driving module 240 and a third driving module 270 .

In an embodiment, the substrate 201 may be formed to overlap the mask region 211 of the mask assembly 210 . For example, when the substrate 201 is viewed in the Z-axis direction, the substrate 201 may be formed to be larger than the mask region 211 . The substrate 201 may be positioned on the first surface 221 of the mounting plate 220 . For example, the substrate 201 may be positioned between the mounting plate 220 and the mask assembly 210 .

In an embodiment, the mounting plate 220 may be configured to support the substrate 201 . For example, the substrate 201 transferred from the transfer device 110 may be seated on the mounting plate 220 . The substrate 201 may be disposed on the first surface 221 of the mounting plate 220 , and the magnet structure 250 may be disposed on the second surface 222 . The mounting plate 220 may be disposed between the substrate 201 and the magnet structure 250 . The mounting plate 220 may move in the Z-axis direction together with the substrate 201 seated on the first surface 221 .

In an embodiment, a region in which the substrate 201 is seated and a peripheral region may be defined in the mounting plate 220 . A notch 229 for aligning the substrate 201 may be formed in the peripheral region. For example, a corresponding notch formed on the periphery of the substrate 201 may be inserted into the notch 229 to prevent rotation of the substrate 201 . In other words, the notch 229 may align the substrate 201 in the correct orientation.

In an embodiment, a second protrusion 227 may be formed in a peripheral area of the seating plate 220 . The second protrusion 227 may protrude in the +Z-axis direction. The second protrusion 227 may be partially inserted into the second hole 217 formed in the mask assembly 210 when the seating plate 220 moves in the +Z-axis direction. This may be to align the moving direction of the seating plate 220 .

In an embodiment, the third opening 226 may be formed in the seating plate 220 . The second connecting member 274 may extend to the lower surface of the substrate 201 through the third opening 226 . For example, when the third driving module 270 operates, the second connecting member 274 may contact the lower surface of the substrate 201 through the third opening 226 . Through this, the third driving module 270 may move only the substrate 201 independently of the mounting plate 220 using the second connecting member 274 .

In an embodiment, the magnet structure 250 may include a magnet 251 and a magnet holder 252 in which the magnet 251 is at least partially accommodated. The magnet 251 may be configured to form an attractive force with the mask region 211 made of a metal material. The magnet 251 may include a plurality of sub-magnets 259 . The magnet 251 may be at least partially surrounded by the magnet holder 252 . For example, referring to the drawings, the edge of the magnet 251 may be surrounded by the magnet holder 252 . In one embodiment, the magnet holder 252 is provided in a shape surrounding the lower surface and the side surface of the magnet 251 , but is not limited thereto and may be provided in various forms capable of holding the magnet 251 . A first guide member 233 may be coupled to a lower side of the magnet holder 252 .

In one embodiment, the magnet holder 252 of the magnet structure 250 may include a protruding portion 253 protruding from the side. A first guide hole 255 may be formed in the protruding portion 253 . The second connecting member 274 formed in the first guide member 233 may be at least partially inserted into the first guide hole 255 .

In an embodiment, the second connection member 274 may control the Z-axis direction of the substrate 201 while supporting the lower surface of the substrate 201 . For example, the second connection member 274 may move in the Z-axis direction by the third driving module 270 . At this time, as the second connection member 274 moves while being inserted into the first guide hole 255 , the substrate 201 may move in the Z-axis direction without shaking. The second connecting member 274 may extend to the lower surface of the substrate 201 through the third opening 226 .

In an embodiment, the magnet structure 250 may independently move in the Z-axis direction by the second driving module 240 . The magnet structure 250 moves in the +Z/-Z-axis direction while the second connecting member 274 of the first guide member 233 is inserted into the first guide hole 255 of the protruding portion 253 . can For example, the coupling of the first guide hole 255 and the second connection member 274 may guide the movement of the magnet structure 250 .

In summary, when the third driving module 270 operates, the first guide hole 255 may be fixed and the second connection member 274 may move while being inserted into the first guide hole 255 . When the second driving module 240 operates, the second connecting member 274 is fixed and the first guide hole 255 moves together with the magnet structure 250 in a state in which the second connecting member 274 is inserted. can As such, the second connection member 274 may be guided by the first guide hole 255 or may guide the movement of the first guide hole 255 .

The contact structure 200 disclosed in this document may include a first driving module 230 , a second driving module 240 , and a third driving module 270 . Hereinafter, the driving modules will be described in detail with reference to FIGS. 4 to 6 .

In an embodiment, the first driving module 230 may include a first rod 232 , a first guide member 233 , and a first connection member 235 linearly driven in the Z-axis direction. In one embodiment, the first driving module 230 may include a linear driver configured to drive the first rod 232 in the +Z / -Z axis direction.

In an embodiment, the first rod 232 may extend long in the +Z-axis direction. A first guide member 233 may be coupled to an end of the first rod 232 . For example, when the first driving module 230 operates, the first rod 232 and the first guide member 233 move in the +Z-axis or -Z-axis direction, and the first guide member 233 The magnet structure 250 coupled to the may also move together.

In an embodiment, the first guide member 233 may be coupled to a lower surface of the magnet holder 252 and an end of the first rod 232 . The first guide member 233 may include an extension portion 234 that further extends outwardly from a side surface of the magnet holder 252 . Referring to the drawings, the first guide member 233 may be provided in an X-shape. For example, the extended portion 234 of the first guide member 233 may at least partially face the second surface 222 of the mounting plate 220 on which the substrate 201 is mounted. A first connecting member 235 and a second connecting member 274 may be disposed on the extension portion 234 of the first guide member 233 .

In an embodiment, each of the first connecting member 235 and the second connecting member 274 may be provided in plurality. For example, the first guide member 233 includes four extension portions 234 facing the second surface 222 of the seating plate 220 , and each of the four first connecting members 235 is 4 It may be disposed in each of the extension portions 234 . Each of the four second connecting members 274 may be respectively disposed on the four extension portions 234 . Referring to the drawings, the first connecting member 235 may be positioned outwardly compared to the second connecting member 274 .

In an embodiment, the first connection member 235 may be configured to contact the second surface of the seating plate 220 on which the substrate 201 is mounted. Accordingly, when the first driving module 230 operates, the first rod 232 , the first guide member 233 , and the magnet structure 250 move in the +Z/−Z axis direction, and the first guide The mounting plate 220 on which the substrate 201 is mounted by the first connection member 235 disposed on the member 233 may also move together in the Z-axis direction.

In an embodiment, the first driving module 230 may be configured to move the magnet structure 250 and the substrate 201 together. The first driving module 230 moves the magnet structure 250 and/or the substrate 201 in a direction (eg, +Z-axis direction) closer to the second cover 122 of the deposition apparatus 120 , It may be moved in a direction away from the second cover 122 (eg, -Z-axis direction).

In an embodiment, a second guide hole 237 penetrating through the extension portion 234 may be formed in the extension portion 234 of the first guide member 233 . A second connection member 274 may be at least partially inserted into the second guide hole 237 .

In an embodiment, when the second connecting member 274 moves by the third driving module 270 , the second guide hole 237 moves in the direction of movement of the second connecting member 274 (eg, in the Z-axis direction). can guide you. A plurality of second guide holes 237 may be provided to correspond to the number of second connection members 274 . The second guide hole 237 may be positioned closer to the magnet than the first connecting member 235 . For example, when the first guide member 233 is viewed from above (viewed in the +Z-axis direction), the second guide hole 237 may be positioned between the magnet 251 and the first connection member 235 . have.

In an embodiment, the second driving module 240 may be disposed on the first rod 232 of the first driving module 230 . For example, the second driving module 240 may be positioned adjacent to an end of the first rod 232 . The second driving module 240 may be connected to the magnet structure 250 . The second driving module 240 may be configured to move the magnet structure 250 . For example, when the second driving module 240 operates, the first guide member 233 , the mounting plate 220 , and the substrate 201 are fixed, and only the magnet structure 250 is relatively fixed in the Z-axis direction. can be moved to In one embodiment, the second driving module 240 includes a second rod 242 elongated in the Z-axis direction, and the second rod 242 is +Z according to the operation of the second driving module 240 . // Can move in the Z-axis direction. Movement of the second rod 242 may move the magnet structure 250 .

In an embodiment, as the second driving module 240 operates, the magnet structure 250 moves, and the movement of the magnet structure 250 is performed by the second connecting member 274 and the first guide hole 255 . can be guided. The first guide hole 255 may be formed in the protruding portion 253 protruding outward of the holder 252 , and the second connecting member 274 may be inserted into the first guide hole 255 to extend. In one embodiment, when the second driving module 240 operates, the second connection member 274 maintains a state fixed to the first guide member 233 , and the magnet structure 250 operates the second connection member ( 274 may move while maintaining the inserted state in the first guide hole 255 . Accordingly, the magnet structure 250 may move in the +Z/-Z axis direction without shaking.

In an embodiment, the second driving module 240 may be driven independently of the first driving module 230 . For example, when the first driving module 230 operates, the deposition surface of the substrate 201 contacts the mask region 211 of the mask assembly 210 , and the second driving module 240 additionally operates to operate the magnet 251 . ) and the distance between the mask assembly 210 may be adjusted.

In an embodiment, the third driving module 270 may be configured to move the substrate 201 in the Z-axis direction. For example, when the arm member 111 enters the deposition apparatus 120 together with the substrate 201 , the third driving module 270 moves the substrate 201 in the +Z-axis direction to move the substrate 201 . ) and the arm member 111 may release contact. Thereafter, when the arm member 111 moves to the outside of the deposition apparatus 120 again, the third driving module 270 moves the substrate 201 in the -Z-axis direction to move the substrate 201 to the mounting plate 220 . It may be seated on the first surface 221 .

In an embodiment, the third driving module 270 may include a third driver 271 , a third rod 272 , a second guide member 273 , and a second connection member 274 . In an embodiment, the third actuator 271 may include a linear actuator configured to drive the third rod 272 and the second guide member 273 in the +Z/-Z axis direction. The second guide member 273 may be coupled to the third rod 272 to integrally move in the +Z/−Z axis direction.

In the illustrated embodiment, the second guide member 273 may be provided in a substantially U-shape, but is not limited thereto, and may be provided in various ways that may contact the first portion 274a of the second connection member 274 . may be provided in the form. In the illustrated embodiment, the second guide member 273 may be provided to drive independently of the first rod 232 of the first driving module 230 . For example, the second guide member 273 is provided in a form that is spaced apart from the first rod 232 and partially surrounds the first rod 232 , so that the first driving module 230 and the third driving module ( 270) may not interfere with each other.

In an embodiment, the second guide member 273 may be configured to press the first portion 274a of the second connecting member 274 . The second connection member 274 may include a first portion 274a penetrating the first guide member 233 through the second guide hole 237 . For example, the first portion 274a may be formed thinner than other portions. Accordingly, the second connecting member 274 may freely move in the Z-axis direction while being inserted into the second guide hole 237 . The first portion 274a of the second connection member 274 may contact the second guide member 273 . For example, when the second guide member 273 moves in the +Z-axis direction due to the operation of the third driving module 270 , the second guide member 273 moves to the first part ( 274a), and the second connection member 274 presses the lower surface of the substrate 201 to elevate the substrate 201 in the +Z-axis direction.

In an embodiment, the second connecting member 274 may extend through the second guide hole 237 formed in the first guide member 233 and the first guide hole 255 formed in the magnet holder 252 . can Accordingly, when the second connection member 274 moves in the +Z/-Z axis direction, the seating plate 220 , the magnet structure 250 , and the first guide member 233 do not move and are fixed at a designated position. can be

Referring to FIG. 5 , the second connecting member 274 may extend through the third opening 226 penetrating the mounting plate 220 to contact the lower surface of the substrate 201 .

In one embodiment, when the third driving module 270 operates, the third rod 272 and the second guide member 273 move in the +Z/-Z axis direction, and the second connection member 274 may move in the +Z/-Z axis direction while being inserted into the first guide hole 255 and the second guide hole 237 . In this case, the end of the second connection member 274 may contact the lower surface of the substrate 201 and move the position of the substrate 201 .

In an embodiment, the first driving module 230 , the second driving module 240 , and the third driving module 270 may be driven independently. The first driving module 230 may move the mounting plate 220 on which the substrate 201 is mounted and the magnet 251 together. The second driving module 240 may move the magnet 251 . For example, the second driving module 240 may change the distance between the magnet 251 and the seating plate 220 . The third driving module 270 may move the substrate 201 . For example, the third driving module 270 may change the distance between the substrate 201 and the mounting plate 220 .

In various embodiments, each of the first driving module 230 , the second driving module 240 , and the third driving module 270 may include drivers of various mechanisms. For example, the actuator may be provided as a hydraulic actuator including a piston, or a motor including a gear box.

6 is a cross-sectional view illustrating a contact structure of a deposition apparatus according to an exemplary embodiment.

Referring to FIG. 6 , the mask assembly 210 and the substrate 201 may be disposed to at least partially face each other. The substrate 201 may be seated on the first surface 221 of the mounting plate 220 , and a magnet 251 may be disposed on the second surface 222 of the mounting plate 220 . The magnet 251 is coupled to the first guide member 233 through the magnet holder 252 to move integrally with the first guide member 233 .

In one embodiment, when the first driving module 230 operates, the first rod 232 , the first guide member 233 , the first connection member 235 , the second connection member 274 , the magnet structure ( 250 , the mounting plate 220 , and the substrate 201 may move together. The first connection member 235 may be fixedly disposed on the first guide member 233 and contact the second surface 222 of the seating plate 220 . The second connection member 274 may move in a fixed state between the first guide member 233 and the seating plate 220 .

In an embodiment, when the second driving module 240 operates, the second rod 242 and the magnet structure 250 may move. In this case, the first guide member 233 , the substrate 201 , and the seating plate 220 may not move. Accordingly, the second driving module 240 may adjust the distance between the magnet 251 and the substrate 201 or the distance between the magnet 251 and the mask assembly 210 .

In an embodiment, when the third driving module 270 operates, the second connecting member 274 and the substrate 201 may move. The second connecting member 274 may be spaced apart from or in contact with the 'C'-shaped second guide member 273 of the third driving module 270 . Accordingly, the third driving module 270 may adjust the distance between the substrate 201 and the seating plate 220 by only moving the substrate 201 . The arm member 111 may move through a gap between the substrate 201 and the seating plate 220 .

7 is a diagram illustrating a portion of a substrate loading process of a deposition apparatus according to an exemplary embodiment. 8 is a cross-sectional view illustrating the deposition apparatus of FIG. 7 .

The substrate loading process 300 may be performed before starting 307 a deposition process on the substrate 201 . The substrate 201 may be moved to a designated position inside the deposition apparatus 120 through the substrate loading process 300 .

In an embodiment, the substrate loading process 300 includes moving the substrate 201 inside the transfer device 110 into the deposition device 120 (eg, the chamber 121 ) using the arm member 111 . (301); moving the substrate 201 in the +Z-axis direction so that the substrate 201 and the arm member 111 are spaced apart from each other using the third driving module 270 ( 302 ); moving the arm member 111 out of the deposition apparatus 120 ( 303 ); moving the substrate 201 in the -Z-axis direction so that the substrate 201 is seated on the first surface 221 of the mounting plate 220 using the third driving module 270 ( 304 ); moving the magnet structure 250 and the mounting plate 220 in the +Z-axis direction using the first driving module 230 so that the deposition surface of the substrate 201 and the mask region 211 are in contact ( 305 ); and moving the magnet structure 250 in the +Z-axis direction using the second driving module 240 so that the magnet 251 and the mask region 211 have a predetermined interval ( 306 ).

In an embodiment, the step 301 of moving the substrate 201 inside the transfer apparatus 110 into the inside of the deposition apparatus 120 (eg, the chamber 121 ) using the arm member 111 includes the deposition apparatus. The method may further include opening a door provided between the 120 and the transfer device 110 . For example, the door may maintain a pressure difference between the inside of the deposition apparatus 120 and the inside of the transfer apparatus 110 . For example, the inside of the transfer device 110 may have a relatively low vacuum and the inside of the deposition device 120 may have a relatively high vacuum. In other words, the inside of the deposition apparatus 120 may have a higher level of vacuum. The arm member 111 may move in the +Y-axis direction. The arm member 111 may move while supporting the lower surface of the substrate 201 .

In an embodiment, in the step 302 of moving the substrate 201 in the +Z-axis direction so that the substrate 201 and the arm member 111 are spaced apart from each other using the third driving module 270, the third driving module Reference numeral 270 may move the second guide member 273 and the second connection member 274 in the +Z-axis direction. At this time, as the second connection member 274 is inserted into the first guide hole 255 and the second guide hole 237 , the movement direction may be guided. The second connection member 274 may press the lower surface of the substrate 201 in the +Z-axis direction to move the substrate 201 in the +Z-axis direction. In this case, the contact between the substrate 201 and the arm member 111 may be released.

In an embodiment, in step 303 of moving the arm member 111 to the outside of the deposition apparatus 120 , the arm member 111 may move in the -Y-axis direction. In this case, since the arm member 111 is spaced apart from the substrate 201 , only the arm member 111 may move to the transfer device 110 .

In an embodiment, moving the substrate 201 in the -Z-axis direction so that the substrate 201 is seated on the first surface 221 of the mounting plate 220 using the third driving module 270 ( 304 ) ), the third driving module 270 may move the second connecting member 274 in the -Z-axis direction. In this case, as the second connecting member 274 is inserted into the first guide hole 255 and the second guide hole 237 , the movement direction may be guided. The substrate 201 may move together with the second connection member 274 in the -Z axis direction, and the substrate 201 may be seated on the mounting plate 220 . The second connecting member 274 may further move in the -Z-axis direction by a predetermined distance even after the substrate 201 is seated.

In one embodiment, the magnet structure 250 and the mounting plate 220 are moved in the +Z-axis direction using the first driving module 230 so that the deposition surface of the substrate 201 and the mask region 211 are in contact. In step 305 , the first driving module 230 includes the second driving module 240 , the magnet structure 250 , the first guide member 233 , the first connecting member 235 , and the second connecting member 274 . ), the mounting plate 220 , and the substrate 201 may all be moved. In this case, the first driving module 230 may further move in the +Z-axis direction by a predetermined distance even after the deposition surface of the substrate 201 comes into contact with the mask region 211 . As described above, since the first protrusion 126 formed on the flange 125 is inserted into the first hole 216 of the mask assembly 210 , the mask assembly 210 and the support structure 124 may be aligned. .

In one embodiment, in the step 306 of moving the magnet structure 250 in the +Z-axis direction using the second driving module 240 so that the magnet 251 and the mask region 211 have a specified interval, The second driving module 240 may independently move only the magnet structure 250 . In this case, the substrate 201 , the mounting plate 220 , and the first guide member 233 may be fixed without moving. Accordingly, the second driving module 240 may change the distance between the magnet 251 and the mask region 211 or the distance between the magnet 251 and the substrate 201 . For example, the second driving module 240 operates the magnet 251 so that the magnet 251 and the substrate 201 are intercepted at a specified interval, or the magnet 251 and the mask region 211 are spaced apart at a specified interval. can be moved In this case, the specified interval may be a distance sufficient to form a magnetic field in the mask region 211 so that the mask region 211 and the substrate 201 are sufficiently in close contact with each other. For example, a magnetic field measured on the surface of the substrate 201 or the mask region 211 may vary according to a distance between the magnet 251 and the substrate 201 or the mask region 211 . In various embodiments, in order to more finely control the magnetic field, the magnet structure 250 may further include a metal plate. For example, when a metal plate contacts the magnet 251 , a magnetic field may increase.

9 is a diagram illustrating a portion of a substrate unloading process of a deposition apparatus according to an exemplary embodiment. 10 is a cross-sectional view illustrating the deposition apparatus according to FIG. 9 .

The substrate unloading process 400 may be performed to take out the deposited substrate 201 after the deposition process by the deposition apparatus 120 is completed.

In one embodiment, the substrate unloading process 400 includes the steps of moving the magnet structure in the -Z-axis direction using the second driving module (402); moving the magnet structure and the mounting plate in the -Z-axis direction using the first driving module so that the deposition surface of the substrate and the mask region are spaced apart (403); moving the substrate in the +Z-axis direction so that the substrate is spaced apart from the first surface of the mounting plate by using the third driving module (404); entering (405) the arm member into the space between the substrate and the first surface of the seating plate; moving the substrate in the -Z-axis direction so that the substrate is seated on the arm member using the third driving module (406); and moving the arm member and the substrate into the transfer device ( 407 ).

In an embodiment, in the step 402 of moving the magnet structure 250 in the -Z-axis direction using the second driving module 240 , the distance between the magnet 251 and the mask region 211 may increase. can In other words, the magnet 251 may be moved earlier than other structures. For example, when the magnet 251 and the mask region 211 are moved in a close state using the first driving module 230 , the gap between the magnet 251 and the frame region 212 of the mask assembly 210 is A strong attraction may cause damage to the mask region 211 and the substrate 201 on which deposition is completed. Accordingly, after increasing the distance between the magnet 251 and the mask region 211 in step 402 , in step 403 , the magnet 251 , the mask assembly 210 , and the substrate 201 are moved together. can

In an embodiment, the magnet structure 250 and the seating plate 220 are moved in the -Z-axis direction using the first driving module 230 so that the deposition surface of the substrate 201 and the mask region 211 are spaced apart. In step 403 , the mask assembly 210 does not move in the -Z axis direction by the flange 125 of the support structure 124 inside the chamber 121 after moving by a certain distance, but the support structure 124 . ) can be maintained on the flange 125 of the. As described above, since the first protrusion 126 formed on the flange 125 is inserted into the first hole 216 of the mask assembly 210 , the mask assembly 210 and the support structure 124 may be aligned. .

In an embodiment, moving the substrate 201 in the +Z-axis direction so that the substrate 201 is spaced apart from the first surface 221 of the mounting plate 220 by using the third driving module 270 ( 404 ) ), a predetermined space may be formed between the substrate 201 and the mounting plate 220 .

In an embodiment, in the step 405 of introducing the arm member 111 into the space between the substrate 201 and the first surface 221 of the seating plate 220 , the arm member 111 may be moved to the substrate 201 . It can move into the space between the and the seating plate 220 . In this case, step 405 may further include opening a door between the deposition apparatus 120 and the transfer apparatus 110 . For example, the arm member 111 may move into the deposition apparatus 120 after the door is opened.

In an embodiment, in the step 406 of moving the substrate 201 in the -Z axis direction so that the substrate 201 is seated on the arm member 111 using the third driving module 270; Reference numeral 240 may move the second connecting member 274 in the -Z axis direction. The substrate 201 supported by the second connection member 274 may move together with the second connection member 274 in the -Z-axis direction. The second connection member 274 may further move by a predetermined distance even after the substrate 201 is seated on the arm member 111 .

In an embodiment, in the step 407 of moving the arm member 111 and the substrate 201 into the transfer device 110 , the arm member 111 moves along the -Y axis while the substrate 201 is seated direction can be moved. After step 407 is performed, a step of closing the door between the transfer apparatus 110 and the deposition apparatus 120 may be further performed.

11 is a diagram illustrating a mask assembly and a magnet of a contact structure of a deposition apparatus according to an exemplary embodiment. 11 is a view of the mask assembly viewed from above (eg, in the +Z-axis direction).

Referring to FIG. 11 , the mask assembly 210 may include a mask region 211 and a frame region 212 surrounding the mask region 211 . In an embodiment, the mask region 211 may include a first region 211a and a second region 211b that is a periphery of the first region 211a. For example, the first region 211a may be defined as a region including a fine pattern through which a deposition material passes in a deposition process. The second region 211b is defined between the first region 211a and the frame region 212 and is an area in which a fine pattern is not formed, an area that is not utilized in a deposition process even when a fine pattern is formed, or is deposited. It may be a region in contact with the cut region in the finished substrate.

Referring to FIG. 11 , when the mask assembly 210 is viewed from above, the magnet 251 may be provided to completely cover the first region 211a of the mask assembly 210 . For example, the edge of the magnet 251 may be disposed to be spaced apart from the edge of the first region 211a by the first interval G1. The first gap G1 may be greater than or equal to 10 mm. This may be to make the first region 211a of the mask assembly 210 closely adhere to the substrate 201 as a whole. Through this, both the central portion and the outer portion of the first region 211a receive a uniform magnetic field to uniformly adhere to the substrate and provide improved deposition quality.

Referring to FIG. 11 , when the mask assembly 210 is viewed from above, an edge of the magnet may be disposed to be spaced apart from the frame region 212 of the mask assembly 210 by a second gap G2 . For example, the second gap G2 may be greater than or equal to 20 mm. Since the frame region 212 is formed thicker than the mask region 211 , a large attractive force acts between the magnet 251 and the frame region 212 , and the magnet 251 or the frame region 212 moves during the deposition process. There are concerns. Accordingly, the magnet 251 of the contact structure 200 according to an embodiment may be configured to be spaced apart from the frame region 212 by at least 20 mm.

12 is a diagram illustrating a magnet of a deposition apparatus according to an exemplary embodiment.

12A is a plan view of a partial region of a magnet. Fig. 12(b) is a cross-sectional view taken along line A-A of Fig. 12(a).

Referring to FIG. 12 , the magnet 251 may include a plurality of sub-magnets 259 . Each of the sub-magnets 259 may be disposed to be in surface contact with a neighboring sub-magnet. For example, the sub-magnets 259 may be arranged in contact with each other without being spaced apart from each other. Due to the arrangement structure of the sub-magnets 259 as described above, a uniform surface magnetic field is formed on the surface of the substrate 201 , and the substrate 201 and the mask region 211 are uniformly in close contact with each other, thereby reducing the defect rate and reducing the deposition rate. Quality can be improved. In particular, it can be advantageously applied in a process requiring fine pattern deposition, such as a micro LED process.

Referring to FIGS. 12A and 12B , the sub-magnets 259 may form one surface 251a of the magnet 251 . One sub-magnet 259 may form an N-pole region, and another sub-magnet 259 at least partially in contact with the one sub-magnet 259 may form an S-pole region. For example, the surface 251a may have a shape in which an N-pole region and an S-pole region are alternately arranged.

In an embodiment, the magnet 251 may be provided so that the surface magnetic field measured at the surface of the substrate 201 may be in the range of 500G to 2500G. In one embodiment, the substrate 201 may have a thickness of 0.5T to 2.0T. Preferably, the thickness of the substrate 201 may be 1.5T. In an embodiment, the thickness of the mask region 211 may be 5 μm to 15 μm or less. Preferably, the thickness of the mask region 211 may be 10 μm.

According to the embodiments disclosed in this document, a deposition apparatus 120 is disclosed. The deposition apparatus 120 includes a chamber 121; a mask assembly 210 positioned inside the chamber 121 and including a metal mask region 211 including a fine pattern and a frame region 212 surrounding the mask region 211; A seating plate 220 located inside the chamber 121 and including a first surface 221 on which the substrate 201 is seated and a second surface 222 opposite to the first surface 221 ; the substrate 201 is disposed to at least partially face the mask assembly 210; A magnet structure 250 located inside the chamber 121 and disposed on the second surface 222 of the seating plate 220, the magnet structure 250 includes a magnet 251 and the magnet 251. at least partially accommodated magnet holder 252; a first driving module 230 configured to move the magnet structure 250 and the seating plate 220 together in a first direction; a second driving module 240 configured to move the magnet structure 250 in the first direction; and a control module configured to adjust the distance between the magnet 251 and the mask region 211 by controlling the first driving module 230 and/or the second driving module 240 . have.

In various embodiments, the magnet 251 may include a plurality of sub-magnets 259 , and each of the plurality of sub-magnets 259 may be disposed to be in surface contact with the neighboring sub-magnets 259 .

In various embodiments, the plurality of sub-magnets 259 may form an opposing surface 251a facing the substrate, and the opposing surface 251a may be provided such that an N-pole region and an S-pole region are alternately disposed. can

In various embodiments, the mask region 211 includes a first region 211a on which a fine pattern is formed, and a second region 211b that is a peripheral region of the first region 211a, and the magnet 251 . is disposed to completely cover the first region 211a, and when the mask region 211 is viewed from above, the edge of the magnet 251 and the edge of the first region 211a have a gap of at least 10 mm can

In various embodiments, when the mask area 211 is viewed from above, the magnet 251 is disposed such that an edge of the magnet 251 overlaps the second area 211b, and the edge of the magnet 251 is overlapped with the second area 211b. and an edge of the frame region 212 may have a gap of at least 20 mm or more.

In various embodiments, the thickness of the mask region 211 is provided in the range of 5 μm to 15 μm, the thickness of the substrate 201 is provided in the range of 0.5T to 2.0T, and the magnet 251 is the substrate The magnetic field measured on the surface of 201 may be spaced apart from the mask region 211 at a predetermined interval to have a range of 500G to 2500G.

In various embodiments, the first driving module 230 includes a first rod 232 moving in the first direction, and the first rod 232 , the magnet structure 250 , and the seating plate 220 . ) and a first guide member 233 coupled to it, the second driving module 240 is coupled to the first rod 232 and the magnet structure 250 , and the control module includes the substrate 201 ) and the mask region 211 to operate the first driving module 230 and to adjust the distance between the magnet structure 250 and the substrate 201 , the second driving module 240 . can be configured to operate.

In various embodiments, it further includes a third driving module 270 configured to move the substrate 201 , wherein the third driving module 270 includes the first guide member 233 and the seating plate ( It may further include a second connection member 274 that extends through the 220 and is configured to contact the lower surface of the substrate 201 .

In various embodiments, the holder 252 includes a protruding portion 253 protruding from a side surface, and the protruding portion 253 includes a first guide hole 255 into which a portion of the second connecting member 274 is inserted. ) can be formed.

The various embodiments of this document and the terms used therein are not intended to limit the technology described in this document to a specific embodiment, but it should be understood to include various modifications, equivalents, and/or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like components. The singular expression may include the plural expression unless the context clearly dictates otherwise. In this document, expressions such as “A or B”, “at least one of A and/or B”, “A, B or C” or “at least one of A, B and/or C” refer to all of the items listed together. Possible combinations may be included. Expressions such as "first," "second," "first," or "second," can modify the corresponding elements, regardless of order or importance, and to distinguish one element from another element. It is used only and does not limit the corresponding components. When an (eg, first) component is referred to as being “connected (functionally or communicatively)” or “connected” to another (eg, second) component, that component is It may be directly connected to the component or may be connected through another component (eg, a third component).

In this document, "adapted to or configured to", depending on the context, for example, hardware or software "suitable for," "having the ability to," "modified to, Can be used interchangeably with ""made to," "capable of," or "designed to." In some contexts, the expression “a device configured to” may mean that the device is “capable of” with other devices or components. For example, the phrase "a processor configured (or configured to perform) A, B, and C" refers to a dedicated processor (eg, an embedded processor) or one or more stored in a memory device (eg, memory) for performing the operations. By executing programs, it may mean a general-purpose processor (eg, CPU or AP) capable of performing corresponding operations.

As used herein, the term “module” includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. can A “module” may be an integrally formed component or a minimum unit or a part of performing one or more functions. A “module” may be implemented mechanically or electronically, for example, known or to be developed, application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), or It may include a programmable logic device.

At least a portion of an apparatus (eg, modules or functions thereof) or a method (eg, operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (eg, memory) in the form of a program module. can When the instruction is executed by a processor (eg, a processor), the processor may perform a function corresponding to the instruction. Computer-readable recording media include hard disks, floppy disks, magnetic media (eg, magnetic tape), optical recording media (eg, CD-ROM, DVD, magneto-optical media (eg, floppy disks), built-in memory, etc.) An instruction may include code generated by a compiler or code that can be executed by an interpreter.

Each of the components (eg, a module or a program module) according to various embodiments may be composed of a singular or a plurality of entities, and some sub-components of the aforementioned sub-components may be omitted, or other sub-components may be included. may include more. Alternatively or additionally, some components (eg, a module or a program module) may be integrated into one entity to perform the same or similar functions performed by each corresponding component before being integrated. Operations performed by modules, program modules, or other components according to various embodiments are sequentially, parallelly, repetitively or heuristically executed, or at least some operations are executed in a different order, omitted, or other operations This can be added.

100: deposition system 110: transfer device
120: deposition apparatus 130: display module
200: contact structure 201: substrate
210: mask assembly 220: seating plate
230: first driving module 240: second driving module
270: third driving module 250: magnet structure

Claims (9)

In the deposition apparatus,
chamber;
a mask assembly positioned inside the chamber, the mask assembly including a metal mask region including a fine pattern and a frame region surrounding the mask region;
a substrate disposed to at least partially face the mask assembly;
a seating plate positioned inside the chamber and including a first surface on which the substrate is mounted and a second surface opposite to the first surface;
a magnet structure positioned inside the chamber and disposed on the second surface of the seating plate, the magnet structure including a magnet and a holder at least partially accommodating the magnet;
a first driving module configured to move the magnet structure and the seating plate together in a first direction;
a second driving module configured to move the magnet structure in the first direction; and
a third driving module configured to move the substrate in the first direction;
and a control module configured to adjust a distance between the magnet and the mask region by controlling at least one of the first driving module, the second driving module, and the third driving module. The method according to claim 1,
The magnet includes a plurality of sub-magnets,
Each of the plurality of sub-magnets is disposed to be in surface contact with neighboring sub-magnets. 3. The method according to claim 2,
The plurality of sub-magnets form an opposite surface facing the substrate,
The opposing surface is a deposition apparatus provided such that an N-pole region and an S-pole region are alternately disposed. The method according to claim 1,
The mask region includes a first region in which a fine pattern is formed, and a second region that is a peripheral region of the first region,
The magnet is disposed to completely cover the first area,
When the mask area is viewed from above, an edge of the magnet and an edge of the first area have a distance of at least 10 mm or more. 5. The method according to claim 4,
When the mask area is viewed from above, the magnet is arranged such that an edge of the magnet overlaps the second area,
A deposition apparatus having a gap between the edge of the magnet and the edge of the frame region is at least 20 mm. The method according to claim 1,
The thickness of the mask region is provided in the range of 5㎛ to 15㎛,
The thickness of the substrate is provided in the range of 0.5T to 2.0T,
The magnet is a deposition apparatus spaced apart from the mask area at a predetermined interval so that a magnetic field measured on the surface of the substrate has a range of 500G to 2500G. The method according to claim 1,
The first driving module includes a first rod moving in the first direction, and a first guide member coupled to the first rod, the magnet structure, and the seating plate,
The second driving module is coupled to the first rod and the magnet structure,
and the control module is configured to operate the first driving module to bring the substrate into contact with the mask region, and to operate the second driving module to adjust a distance between the magnet structure and the substrate. 8. The method of claim 7,
The third driving module may further include a second connecting member extending through the first guide member and the seating plate and configured to contact a lower surface of the substrate. 9. The method of claim 8,
The holder includes a protruding portion protruding from the side,
and a first guide hole into which a portion of the second connecting member is inserted is formed in the protruding portion.

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