KR102423617B1 - 광학식 지문 인식 센서 모듈 및 이를 적용한 전자 장치 - Google Patents
광학식 지문 인식 센서 모듈 및 이를 적용한 전자 장치 Download PDFInfo
- Publication number
- KR102423617B1 KR102423617B1 KR1020200067791A KR20200067791A KR102423617B1 KR 102423617 B1 KR102423617 B1 KR 102423617B1 KR 1020200067791 A KR1020200067791 A KR 1020200067791A KR 20200067791 A KR20200067791 A KR 20200067791A KR 102423617 B1 KR102423617 B1 KR 102423617B1
- Authority
- KR
- South Korea
- Prior art keywords
- fingerprint recognition
- optical fingerprint
- sensor module
- opening
- unit
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000000465 moulding Methods 0.000 claims abstract description 26
- 239000012779 reinforcing material Substances 0.000 claims abstract description 20
- 239000011810 insulating material Substances 0.000 claims abstract description 7
- 230000002787 reinforcement Effects 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14678—Contact-type imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H01L27/3234—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200067791A KR102423617B1 (ko) | 2020-06-04 | 2020-06-04 | 광학식 지문 인식 센서 모듈 및 이를 적용한 전자 장치 |
| PCT/KR2021/006227 WO2021246685A1 (fr) | 2020-06-04 | 2021-05-18 | Module de capteur optique de reconnaissance d'empreintes digitales et dispositif électronique comprenant ledit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200067791A KR102423617B1 (ko) | 2020-06-04 | 2020-06-04 | 광학식 지문 인식 센서 모듈 및 이를 적용한 전자 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210150853A KR20210150853A (ko) | 2021-12-13 |
| KR102423617B1 true KR102423617B1 (ko) | 2022-07-22 |
Family
ID=78831320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200067791A KR102423617B1 (ko) | 2020-06-04 | 2020-06-04 | 광학식 지문 인식 센서 모듈 및 이를 적용한 전자 장치 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102423617B1 (fr) |
| WO (1) | WO2021246685A1 (fr) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003288573A (ja) * | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | Ｉｃカード及びその製造方法 |
| KR20150009481A (ko) * | 2013-07-16 | 2015-01-26 | 주식회사 아이피시티 | 모바일 장치용 지문센서 모듈 및 이의 제조방법 |
| KR20170126332A (ko) * | 2016-05-09 | 2017-11-17 | 시그네틱스 주식회사 | 연성회로기판을 포함하는 지문인식센서 패키지 |
| KR102197849B1 (ko) | 2017-03-14 | 2021-01-04 | 한온시스템 주식회사 | 블로워 모듈의 듀티비 보정 장치 및 방법 |
| KR20190085660A (ko) * | 2018-01-11 | 2019-07-19 | 삼성전자주식회사 | 지문 센서 패키지 및 이를 포함하는 디스플레이 장치 |
| KR102492626B1 (ko) * | 2018-03-20 | 2023-01-27 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 광학 기기 |
-
2020
- 2020-06-04 KR KR1020200067791A patent/KR102423617B1/ko active IP Right Grant
-
2021
- 2021-05-18 WO PCT/KR2021/006227 patent/WO2021246685A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021246685A1 (fr) | 2021-12-09 |
| KR20210150853A (ko) | 2021-12-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |