KR102420880B1 - Surface mount system for increased productivity and efficiency of process - Google Patents

Abstract

The present invention relates to a surface mount system for increasing process efficiency and productivity, comprising: a substrate loading unit for loading a substrate; a printer unit for applying solder paste to the loaded substrate through a screen printer; a component mounting unit for mounting components on the board through a chip mounter; a reflow soldering unit using a reflow oven for soldering components to the substrate by applying heat to the component mounting board to melt the solder paste; In the surface mounting system comprising a; board unloading unit for unloading the component mounting board after the reflow soldering has been completed, installed between the board loading unit and the printer unit, while transferring the substrate from the substrate loading unit to the printer unit a substrate cleaning unit for removing foreign substances from the surface of the substrate through an air injection method or an air suction method toward the substrate; a substrate cooling unit installed between the reflow soldering unit and the substrate unloading unit, and cooling the reflow soldering component mounting board using a blower fan while transferring the substrate from the reflow soldering unit to the substrate unloading unit; It is characterized in that it includes.
According to the present invention, it is possible to increase the overall productivity while increasing the process efficiency of performing surface mounting, and it is possible to provide the advantage of improving the working environment while enabling the production of high-quality products.

Description

SURFACE MOUNT SYSTEM FOR INCREASED PRODUCTIVITY AND EFFICIENCY OF PROCESS

The present invention relates to a surface mounting system, and more particularly, to a surface mounting system capable of increasing productivity while increasing the efficiency of performing a surface mounting process.

In general, surface mount technology (SMT) is to mount a surface mount device (SMD) such as a semiconductor chip and various electric and electronic devices on a printed circuit board (PCB), the surface of the printed circuit board It refers to the technology of attaching parts that can be directly mounted on the top.

In addition, the surface mount technology is a technology that attaches to the surface through soldering (solder) with heat applied from the connection pattern on the surface without putting the lead into the hole of the component when mounting the electric and electronic device such as a chip on the board. , high-density mounting is possible according to the narrowing of lead pins, so it is applied to the production of most electrical and electronic products with PCBs.

Looking at the process related to the surface mounting technology, the process of applying solder paste to the PCB through a screen printer, and SMT machines such as the process of applying the solder paste to the PCB through a screen printer, are provided to transport and supply the transfer conveyor one by one while the PCB is mounted on the magazine. It consists of a process of mounting SMD devices such as chip components on a PCB coated with solder paste through a process, and a process of forming a solder joint by applying heat by passing it through a reflow oven and then soldering.

At this time, the reflow soldering process uses a solder paste composed of solder powder and flux, and the flux serves to improve the wettability of the molten solder by helping the lead adhesion and melting and removing the oxide film of the solder surface and the PCB. do

However, in the process of heating and melting the solder paste during the reflow soldering process, harmful substances and odors are generated, which are easily exposed to workers and cause workability deterioration factors such as asthma, as well as have a bad effect on the health of workers It has been reported that there is a problem, and there is a situation in which improvement is required.

In addition, in the prior art, after loading the PCB on the equipment and transferring it to the screen printer, it is simply transferred through a transfer conveyor. However, if the PCB substrate has foreign substances or static electricity, the application efficiency of the solder paste decreases and soldering is performed. There was a problem that a defect occurred.

In addition, in the prior art, after the reflow soldering process, the PCB substrate is discharged, and since it is discharged as it is in a state with heat by soldering, there is a problem in that a soldering defect occurs due to a decrease in curability as well as a decrease in productivity.

In addition, when SMD devices such as chip parts are mounted on the board through the chip mounter, there was a problem that the parts could not be mounted due to static electricity or magnetism possessed by the board. It causes mis-insertion, such as mounting in a different position, and studies are being conducted to improve it.

In addition, since most of the equipment for each process for the conventional surface mounting process is different from the manufacturer and the data provided is different, there are data that cannot be provided along with it, so it is difficult and technically difficult to monitor the production process for the entire line at a glance. There is a limit, and the response to equipment that has a problem in a series of processes for product production may be delayed, which is a factor that lowers overall productivity.

Republic of Korea Patent Publication No. 10-2017-0096775 Republic of Korea Patent Publication No. 10-2004-0077243

The present invention has been devised in consideration of and solving the above-described problems in the prior art, and an object of the present invention is to provide a surface mounting system capable of increasing productivity while increasing the overall efficiency of a surface mounting process.

An object of the present invention is to provide a surface mounting system capable of producing with excellent quality, such as reducing the defect rate of products produced by surface mounting.

An object of the present invention is to provide a surface mount system that can protect workers by improving the working environment, such as minimizing exposure of workers to harmful substances and odors generated during reflow soldering.

An object of the present invention is to provide a surface mount system that enables a quick response in case of an abnormality or problem in the surface mount facility, and enables monitoring to prevent or prevent the occurrence of an abnormality in advance, thereby implementing a smart factory. .

A surface mounting system for increasing process efficiency and productivity according to the present invention for achieving the above object includes: a substrate loading unit for loading a substrate; a printer unit for applying solder paste to the loaded substrate through a screen printer; a component mounting unit for mounting components on the board through a chip mounter; a reflow soldering unit using a reflow oven for soldering components to the substrate by applying heat to the component mounting board to melt the solder paste; In the surface mounting system comprising a; board unloading unit for unloading the component mounting board after the reflow soldering has been completed, installed between the board loading unit and the printer unit, while transferring the substrate from the substrate loading unit to the printer unit a substrate cleaning unit for removing foreign substances from the surface of the substrate through an air injection method or an air suction method toward the substrate; a substrate cooling unit installed between the reflow soldering unit and the substrate unloading unit, and cooling the reflow soldering component mounting board using a blower fan while transferring the substrate from the reflow soldering unit to the substrate unloading unit; It is characterized in that it includes.

Here, the substrate cleaning unit, in the case of the air injection method, is configured to install an air injection hybrid ionizer combining a compressor and a static electricity removal device to spray air toward the substrate and ionize the sprayed air to the substrate while ionizing it. This removes foreign substances from the surface of the board and simultaneously removes the static electricity possessed by the board, thereby increasing the solder paste application efficiency on the board during reflow soldering and preventing the phenomenon of not being inserted or incorrectly inserted into the board due to static electricity during component mounting. It can be configured to prevent

Here, the air injection-type hybrid ionizer may include: a body of a bar-type structure connected to a compressor on one side to receive compressed air, and connected to a high-voltage cable on the other side to receive a high voltage; At least one or more is coupled to the body of the bar-shaped structure and is disposed in a downwardly protruding structure, an ionizing needle for generating ions is mounted in the center, and an ion air jet having a compressed air outlet formed on the outside or inside of the antistatic needle It may be configured to include a nozzle;

Here, the substrate cleaning unit installs a transparent case covering the air jet hybrid ionizer between the substrate loading unit and the printer unit, and forms a foreign material outlet tapering downward at the lower end of the transparent case to form a surface of the substrate It can be configured to process the dust collecting the foreign matter removed from the.

Here, the substrate cooling unit installs a transparent case between the reflow soldering unit and the substrate unloading unit, and a blower fan is mounted on one side of the transparent case to blow the reflow soldering finished component mounting board. It is provided to enable cooling treatment by the An ionizer may be further installed on the upper surface to emit ions to the surface of the substrate, thereby cooling the substrate and removing static electricity.

Here, the reflow soldering unit, but forming a ventilation hole on the upper surface of the reflow oven and connecting the exhaust duct to exhaust the air generated in the reflow oven during soldering to which heat is applied, between the ventilation hole and the exhaust duct It includes a harmful material removal means for removing toxic substances generated during soldering and at the same time deodorizing the odor; a photocatalytic filter positioned at the rear of the negative ion generator to filter harmful substances and perform antibacterial and deodorizing functions; UV LEDs located at the front and rear of the photocatalyst filter to promote photochemical reaction on the photocatalytic filter side through ultraviolet irradiation while secondary removal and sterilization of harmful substances that have passed through the photocatalytic filter are included, and the exhaust duct is also on the exhaust path It can be configured to purify the air by removing harmful substances and sterilizing by irradiating UV rays in the exhaust path by arranging UV LEDs at intervals.

Here, the component mounting unit includes a mounting head provided to be movable left and right, and a component suction nozzle provided to be coupled and elevating to the lower surface of the mounting head and for adsorbing components from a feeder for supplying components, a pair of fixing brackets fixed to the mounting head and positioned on both sides of the component adsorption nozzle; an optical sensor by a light emitting unit and a light receiving unit disposed to face each other on the pair of fixing brackets and mounted to emit light energy on one side and receive light energy on the other side; Information on the thickness of the component to be put into the component mounting unit is recorded, and when the mounting head-side component is adsorbed or moved up and down for mounting, the component in the component adsorption nozzle through the sensing signal from the optical sensor and the recorded component thickness information It may further include; a control unit for controlling the component mounting by detecting whether the adsorption.

Here, the overall production process of the facility is monitored by receiving signals from the tower lamp, which is a rod-type warning light installed in the substrate loading unit, the printer unit, the component mounting unit, the reflow soldering unit, and the substrate unloading unit, respectively, and the motion detection sensor. A central control unit that enables; further comprising, wherein the central control unit operates with a tower lamp that is a rod-type warning light installed in the substrate loading unit, the printer unit, the component mounting unit, the reflow soldering unit, and the substrate unloading unit, respectively A communication board that is installed for each equipment and has a unique ID as an ON/OFF signal, a position signal, and a PLC control signal generated from the sensing sensor; a DB server that analyzes and calculates packets from each device-specific signal sent from each device-specific communication board, stores and manages them in a DB, and recognizes them through a unique ID of the communication board; It may be a configuration including; a monitoring server that enables monitoring by displaying the operation state of each equipment transmitted from the DB server on a screen.

Here, the monitoring server displays the arrangement status of each line-arranged equipment on the screen through a user interface (UI), but on the upper side of the displayed equipment, the tower lamp indicating the number of times of ON by color of the corresponding tower lamp as a number It can be configured to include a display unit and a substrate presence/absence display unit that displays whether or not there is a substrate inside for each equipment by color, and a cycle time display unit that displays the time required for entering/exiting by equipment on the displayed image for each equipment. have.

Here, a barcode or QR code recognition code sheet or NFC sheet is attached to the substrate; By mounting a code recognizer or NFC recognizer for each equipment of the substrate loading unit, printer unit, component mounting unit, reflow soldering unit, and substrate unloading unit, the current position of the board put into the facility is tracked and displayed through the monitoring server of the central control unit can be configured to do so.

According to the present invention, it is possible to increase the productivity while increasing the process efficiency compared to the prior art during the surface mounting operation, and it is possible to achieve the usefulness of producing a product with excellent quality, such as reducing the defect rate of the product produced by the surface mounting. .

According to the present invention, it is possible to improve the working environment, such as minimizing the exposure of the operator due to harmful substances and odors generated during reflow soldering, and it is possible to achieve the usefulness of protecting the operator.

According to the present invention, by performing the overall monitoring of the surface mounting process, it is possible to quickly respond to abnormalities or problems in the surface mounting equipment, and to achieve the usefulness of implementing a smart factory, such as being able to prevent or prevent abnormal occurrences through monitoring can do.

1 is a schematic block diagram showing a surface mounting system according to an embodiment of the present invention.
2 and 3 are exemplary views illustrating a substrate cleaning unit in a surface mounting system according to an embodiment of the present invention.
4 is a view showing a substrate cleaning unit including a transparent case in the surface mounting system according to an embodiment of the present invention.
5 is an exemplary view illustrating a substrate cooling unit in a surface mount system according to an embodiment of the present invention.
6 is an exemplary view to explain the improved structure of the component mounting part in the surface mounting system according to the embodiment of the present invention.
7 and 8 are exemplary views illustrating the improved structure of the reflow soldering part in the surface mounting system according to the embodiment of the present invention.
9 and 10 are exemplary views to explain the central control unit in the surface mount system according to the embodiment of the present invention.

Preferred embodiments of the present invention will be described with reference to the accompanying drawings, and the purpose and configuration of the present invention and its features will be better understood through such detailed description.

As shown in FIG. 1, a surface mounting system for increasing process efficiency and productivity according to an embodiment of the present invention includes a substrate loading unit 100 for loading a substrate onto a facility system, and the substrate loading unit 100. A printer unit 200 for applying solder paste to a substrate loaded on a facility system, a component mounting unit 300 for mounting components on a substrate in a state in which the solder paste is applied in the printer unit 200, and the The reflow soldering unit 400 for soldering the components to the substrate by melting the solder paste by applying heat to the component mounting board on which the component is mounted through chip mounting in the component mounting unit 300, and the reflow soldering unit 400 ) based on a configuration including a board unloading unit 500 for unloading the component mounting board to the outside after reflow soldering through.

The substrate is a PCB, the printer unit 200 uses a screen printer, the component mounting unit 300 uses a chip mounter, and the reflow soldering unit 400 uses a reflow oven.

The substrate loading unit 100 , the printer unit 200 , the component mounting unit 300 , the reflow soldering unit 400 , and the substrate unloading unit 500 each have a film that informs the operation state of each device. A tower lamp, a large warning light, and sensors for motion detection are installed.

In this case, as the sensor for detecting the motion, a photosensor is mainly used.

Here, the substrate is transferred by a transfer conveyor and inputted for each equipment of the substrate loading unit 100 , the printer unit 200 , the component mounting unit 300 , and the reflow soldering unit 400 , and the substrate unloading unit It is finally discharged to the outside through the loading unit (500).

In the present invention, the substrate cleaning unit 600 and the substrate cooling unit 700 are further included in the configuration made of the above-described base.

The substrate cleaning unit 600 is installed between the substrate loading unit 100 and the printer unit 200, and while transferring the substrate from the substrate loading unit 100 to the printer unit 200, an air jet method toward the substrate. Alternatively, it is a configuration for removing foreign substances from the surface of the substrate through an air suction method.

To this end, when the substrate cleaning unit 600 is installed in an air injection method, an air injection type hybrid ionizer 610 combining a compressor and a static electricity removal device is installed to spray air toward the substrate and the air is sprayed at the same time It can be configured to transfer to the substrate while ionizing.

Through this, it is possible to remove foreign substances from the surface of the board and at the same time remove static electricity possessed by the board, thereby increasing the solder paste application efficiency on the board side during reflow soldering. It can provide the advantage of preventing the phenomenon of erroneous insertion.

As shown in FIGS. 2 and 3, the air injection type hybrid ionizer 610 is connected to a compressor on one side to receive compressed air, and on the other side is connected to a high-voltage cable to receive a high voltage. Bar-shaped body 611 And, at least one or more is coupled to the body 611 of the bar-shaped structure and is arranged in a downwardly protruding structure, and an antistatic needle 612a that generates ions is mounted in the center, and is positioned outside or inward of the antistatic needle 612a The compressed air discharge port 612b may be configured to include an ion air jet nozzle 612 formed therein.

In addition, as shown in FIG. 4 , the substrate cleaning unit 600 includes a transparent case 620 to cover the air jet hybrid ionizer 610 installed between the substrate loading unit 100 and the printer unit 200 . ), but forming a foreign material outlet 621 tapering downward at the lower end of the transparent case 620 to collect the foreign material removed from the surface of the substrate.

In this case, the transparent case 620 may be made of a transparent synthetic resin material such as polyethylene terephthalate (PET), polycarbonate (PC), polycyclohexylenedimethylene terephthalate (PCT), and polymethyl methacrylate (PMMA). have.

In this way, through the configuration of applying the transparent case 620 to the substrate cleaning unit 600, it is possible to improve the working environment, such as protecting the operator while increasing the cleaning efficiency.

Here, the air injection hybrid ionizer 610 serves to neutralize and dissipate the positive ions and negative ions obtained by discharging a high voltage to the substrate in a polarity opposite to that of the charged static electricity, and can be used without contacting the substrate.

The substrate cooling unit 700 is installed between the reflow soldering unit 400 and the substrate unloading unit 500 , and transferring the substrate from the reflow soldering unit 400 to the substrate unloading unit 500 . It is a configuration for cooling processing by supplying air using a blower fan to the component mounting board that has finished reflow soldering during the process.

In particular, the substrate cooling unit 700 is preferably configured to allow rapid cooling and increase process efficiency through a cooling process using forced convection.

To this end, as shown in FIG. 5 , the substrate cooling unit 700 includes a transparent case 710 installed between the reflow soldering unit 400 and the substrate unloading unit 500 , and the transparent case ( A blower fan 720 that is mounted on one side of 710 and performs cooling treatment by blowing to a component mounting board that is transferred to the board unloading unit 500 after reflow soldering is completed, and the transparent case 710 A suction fan 730 mounted on the other side of the transparent case 710 to induce forced convection by air suction in the transparent case 710 to cool the component mounting board transferred to the board unloading unit 500 after reflow soldering is completed. And, it may be of a configuration including a plurality of air outlets 740 formed on the other side of the suction fan 730 of the transparent case 710 is mounted.

In addition, an ionizer 750 is further installed on the inner upper surface of the transparent case 710 in the substrate cooling unit 700 to emit ions to the surface of the substrate, thereby cooling the substrate and removing static electricity. can do.

Here, the transparent case 710 is made of a transparent synthetic resin material such as polyethylene terephthalate (PET), polycarbonate (PC), polycyclohexylenedimethylene terephthalate (PCT), and polymethyl methacrylate (PMMA). can

Here, an exhaust duct may be connected to the other side of the transparent case 710 in which the suction fan 730 is mounted and the air outlet 740 is formed to protect the operator and improve the working environment.

On the other hand, as schematically shown in FIG. 6 , the component mounting unit 300 includes a mounting head 310 provided to be movable left and right, and a mounting head 310 provided to be coupled and elevating to the lower surface of the mounting head 310 and to mount the components. It basically has a component suction nozzle 320 that absorbs components from the feeder that supplies it. When mounting SMD devices such as chip components on the board through the chip mounter, to prevent non-insertion or erroneous insertion as follows. You can have additional configurations.

To this end, a pair of fixing brackets 331 and 332 fixed to the mounting head 310 and positioned on both sides of the component suction nozzle 320, and the pair of fixing brackets 331 and 332 are located at the lower end of An optical sensor by a light emitting unit 341 and a light receiving unit 342 that is fixed and disposed to face each other and is mounted to emit light energy on one side and receive light energy on the other side, and is input to the component mounting unit 300 The information on the thickness of the part is recorded and the part adsorption nozzle 320 through the sensing signal from the optical sensor and the recorded part thickness information when the mounting head 310 side adsorbs the part or moves up and down for mounting. It is possible to have a configuration including a control unit for controlling component mounting by detecting whether or not.

Here, the control unit adsorbs the parts from the feeder through descending from the parts adsorption nozzle 320 and then checks the reception time of the optical signal received from the light receiving unit 342 based on the thickness information of the parts when ascending. decide whether

That is, if the reception time in the light receiving unit 342 is short based on the thickness information of the component, it may be determined that the component is not adsorbed.

Here, the control unit will be provided in the form of inputting additional functions to the control unit installed and used on the component mounting unit 300 side, and may be in the form of redesigning the program.

On the other hand, as shown in FIGS. 7 and 8 , the reflow soldering unit 400 forms a ventilation hole 420 on the upper surface of the reflow oven 410 and connects the exhaust duct 430 to apply heat during soldering. Exhaust air generated in the reflow oven 410, but remove harmful substances generated during soldering between the ventilation hole 420 and the exhaust duct 430 and at the same time, a toxic substance removal means for deodorizing ( 440) can be configured to install.

At this time, the harmful substance removal means 440 includes an anion generator 441 for generating and discharging negative ions, and a photocatalytic filter 442 located at the rear of the negative ion generator 441 to filter harmful substances and perform antibacterial and deodorizing functions. And, located in the front and rear of the photocatalytic filter 442 to promote the photochemical reaction on the side of the photocatalytic filter 442 through ultraviolet irradiation and secondary removal and sterilization of harmful substances that have passed through the photocatalytic filter 442 UV LED ( 443) may be configured.

In addition, the exhaust duct 430 may also be configured to purify air by removing harmful substances and sterilizing by irradiating UV rays in the exhaust path by arranging UV LEDs 450 at intervals on the inlet of the exhaust path.

Meanwhile, in the present invention, as shown in FIGS. 9 and 10 , the substrate loading unit 100 , the printer unit 200 , the component mounting unit 300 , the reflow soldering unit 400 , and the substrate unloading unit 500 . ) to receive a signal from the tower lamp (L), which is a rod-type warning light installed in each of the motion detection sensors (S), and further include a central control unit 800 that enables monitoring of the overall production process of the surface mount system can have

The central control unit 800 may include a communication board 810 , a DB server 820 , and a monitoring server 830 .

The communication board 810 is a rod-type installed in each of the substrate loading unit 100 , the printer unit 200 , the component mounting unit 300 , the reflow soldering unit 400 , and the substrate unloading unit 500 . It is a component that is installed and provided for each equipment as a tower lamp (L), which is a warning light, and an ON/OFF signal, a position signal, and a PLC control signal generated from the motion sensor (S).

In this case, the communication board 810 is provided in a form having a unique ID to enable signal processing for each device and easy identification.

The DB server 820 analyzes and calculates packets from each device-specific signal sent from each of the communication boards 810 mounted for each device, stores and manages them in the DB, and stores a unique ID of each communication board 810. It is a component that is recognized and classified through

The monitoring server 830 is a component that enables monitoring by displaying the operation state of each device transmitted from the DB server 820 together with an image on the screen.

Here, the monitoring server 830 may be a terminal having a screen such as a desktop (PC), a notebook computer, a personal portable terminal, or a smart phone.

Here, the monitoring server 830 displays the arrangement state for each line-arranged equipment along with an image on the screen through a user interface (UI).

At this time, in the monitoring server 830, the tower lamp display unit 831 that displays the number of ON times for each color of the corresponding tower lamp on the upper side of each displayed equipment, and whether or not there is a substrate under process work inside for each equipment It includes a substrate presence or absence expression unit 832 that is expressed in color.

In addition, it may be configured to include a cycle time display unit 833 for indicating the time required for the input and output of the substrate for each equipment on the displayed image for each equipment.

Furthermore, although not shown, the substrate for the process operation may have a configuration in which a barcode or QR code recognition code sheet or NFC sheet is attached to one surface.

To correspond to this, each device of the substrate loading unit 100, the printer unit 200, the component mounting unit 300, the reflow soldering unit 400, and the substrate unloading unit 500 is equipped with a code recognizer or NFC recognizer. It can be configured to track the current position and process of the substrate put on the surface mounting system and display it in real time through the monitoring server 830 of the central control unit 800 .

The embodiments described above are merely illustrative of preferred embodiments of the present invention and are not limited to these embodiments, and various modifications and variations or modifications by those skilled in the art within the spirit and claims of the present invention It will be said that the substitution of steps may be made, and this will be said to be within the scope of the technical rights of the present invention.

100: board loading unit 200: printer unit
300: component mounting unit 400: reflow soldering unit
500: substrate unloading unit 600: substrate cleaning unit
700: substrate cooling unit 800: central control unit

Claims (10)

a substrate loading unit for loading a substrate; a printer unit for applying solder paste to the loaded substrate through a screen printer; a component mounting unit for mounting components on the board through a chip mounter; a reflow soldering unit using a reflow oven for soldering components to the substrate by applying heat to the component mounting board to melt the solder paste; In the surface mounting system comprising a; a board unloading unit for unloading the component mounting board after the reflow soldering,
a substrate cleaning unit installed between the substrate loading unit and the printer unit and configured to remove foreign substances from the surface of the substrate through an air jet method or an air suction method toward the substrate while transferring the substrate from the substrate loading unit to the printer unit;
It is installed between the reflow soldering unit and the substrate unloading unit, and while transferring the substrate from the reflow soldering unit to the substrate unloading unit, the reflow soldering part is cooled using a blower fan to the mounted board, but using forced convection a substrate cooling unit for cooling processing; includes,
The substrate cooling unit,
A transparent case installed between the reflow soldering unit and the substrate unloading unit, and a component mounted board that is mounted on one side of the transparent case and transferred to the substrate unloading unit after reflow soldering is cooled by blowing a blowing fan mounted on the other side of the transparent case to induce forced convection by air suction in the transparent case to finish reflow soldering and then a suction fan for cooling the component mounting board transferred to the board unloading unit; , Including a plurality of air outlets formed on the other side of the suction fan of the transparent case is mounted,
an ionizer is further installed on the inner upper surface of the transparent case to emit ions to the surface of the substrate, thereby cooling the substrate and removing static electricity;
The reflow soldering unit,
A ventilation hole is formed on the upper surface of the reflow oven and an exhaust duct is connected to exhaust the air generated in the reflow oven when soldering heat is applied, but harmful substances generated during soldering between the ventilation hole and the exhaust duct are removed. At the same time, including a harmful substance removal means for deodorizing,
The harmful substance removal means includes an anion generator for generating and discharging negative ions, a photocatalytic filter located behind the negative ion generator to filter harmful substances and antibacterial and deodorizing, and front and rear of the photocatalytic filter through ultraviolet irradiation It includes a UV LED that promotes the photochemical reaction on the photocatalytic filter side and performs secondary removal and sterilization treatment of harmful substances that have passed through the photocatalytic filter.
A surface mount system for increasing process efficiency and productivity, characterized in that by arranging UV LEDs at intervals on the exhaust path in the exhaust duct as well to purify the air by removing harmful substances and sterilizing by UV irradiation in the exhaust path. delete delete delete delete delete The method of claim 1,
The component mounting unit,
A mounting head provided so as to be movable left and right, and a component suction nozzle which is provided so as to be coupled and elevating to the lower surface of the mounting head and for adsorbing components from a feeder for supplying components,
a pair of fixing brackets fixed to the mounting head and positioned on both sides of the component suction nozzle;
an optical sensor by a light emitting unit and a light receiving unit disposed to face each other on the pair of fixing brackets and mounted to emit light energy on one side and receive light energy on the other side;
Information on the thickness of the component to be put into the component mounting unit is recorded, and when the mounting head-side component is adsorbed or moved up and down for mounting, the component in the component adsorption nozzle through the sensing signal from the optical sensor and the recorded component thickness information a control unit that detects adsorption and controls component mounting; Surface mounting system for increasing process efficiency and productivity, characterized in that it further comprises. delete delete delete

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