KR102402520B1 - Variable Beamshaping Optics Module for Reflow Devices - Google Patents

Abstract

The present invention relates to a laser reflow apparatus for bonding or debonding electronic components to a substrate, comprising: a body unit provided with an accommodation space therein; a laser light source provided inside the body unit and irradiating a laser beam; a beam shaper which receives the laser beam irradiated from the laser light source and adjusts a shape of the laser beam; and an optical unit adjusting an optical path by reflecting the laser beam output from the light source. The beam shaper is configured by stacking a plurality of lenticular lenses, and adjusts an output beam size by moving and varying some of the stacked lenticular lenses.

Description

Variable Beamshaping Optics Module for Reflow Devices

The present invention relates to a variable beam shaping optic module of a laser reflow apparatus, and more particularly, to a variable beam shaping optic module of a laser reflow apparatus capable of adjusting the size of an irradiated laser beam to a desired standard.

In industrial laser processing, an application field with micron (㎛) precision is micro laser processing, which is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. Memory chips used in all electronic devices have developed technologies to reduce the circuit spacing to a minimum to realize integration, performance and ultra-high speed communication speed, but now, the required technology level is achieved only by reducing the circuit line width and line width gap. It is difficult to do so, and it has reached the level of stacking memory chips in a vertical direction. The stacking technology up to 128 layers has already been developed by TSMC, and the stacking technology up to 72 layers is being applied to mass production by Samsung Electronics and SK Hynix.

In addition, technology development for mounting a memory chip, a microprocessor chip, a graphic processor chip, a wireless processor chip, a sensor processor chip, etc. in one package is intensely researched and developed, and a considerable level of technology has already been applied in practice.

However, in the process of developing the aforementioned technology, more and more electrons have to participate in the signal processing process inside the ultra-high-speed/ultra-high-capacity semiconductor chip, so the power consumption increases, and the issue of cooling treatment for heat has been raised. In addition, in order to achieve the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing for more signals, a technical issue that large amounts of electrical signals must be transmitted at high speed has been raised. In addition, since the number of signal lines has to be increased, it is no longer possible to process the signal interface lines to the outside of the semiconductor chip using a one-dimensional lead wire method, but a ball grid array (BGA) method (Fan-In BGA) that processes two-dimensionally at the bottom of the semiconductor chip. Or Fan-in Wafer-Level-Package (FIWLP)) and a signal layout redistribution layer under the ultra-fine BGA layer under the chip, and a second fine BGA layer is installed under it. The method (referred to as Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) is being applied.

Recently, in the case of semiconductor chips, products with a thickness of 200 μm or less including an EMC (Epoxy-Mold Compound) layer, and for LEDs, products in the form of micro or mini LED are appearing.

With the advent of these products, a new type of bonding technology is needed. This is a bonding technique using a laser beam.

Currently, bonding using a laser beam has already been used in some product processes, and is expected to be increasingly required in various product groups.

However, the bonding technology using such a laser beam needs to be newly configured to suit the gradually diversifying product size. Accordingly, there is a problem in that a lot of time and money are generated.

Accordingly, the present invention was invented to solve the above problems, and the present invention aims to provide a variable beam shaping optic module of a laser reflow apparatus capable of adjusting the beam size to fit the product size during laser irradiation. do.

The present invention for achieving the above object, in the beam shaping optics module of the laser reflow apparatus, the body portion provided with a receiving space therein; a laser light source provided inside the body and irradiating a laser beam; a beam shaper for receiving the laser beam irradiated from the laser light source and adjusting the shape of the laser beam; and an optical unit for adjusting the optical path by reflecting the laser beam output from the light source, wherein the beam shaper is configured in a separate stacking method using a plurality of rectangular lenticular lenses, and among the separately stacked lenticular lenses Adjusts the output beam size by moving a part of it.

In addition, the variable movement of the separately stacked lenticular lenses is generally performed by the uppermost lenticular lens and the lowermost lenticular lens when disposed in a vertical direction to secure the shortest and longest separation distances.

In addition, the separately stacked lenticular lenses include X1 and X2 lenses arranged in the same direction and Y1 and Y2 lenses arranged in different directions from these lenses, respectively. At this time, each of the X1, X2, Y1, and Y2 lenticular lenses is formed by bonding and laminating other plate-shaped cylindrical lenses.

In addition, it further includes a driving control unit for variable movement of the separately stacked lenticular lens, and the driving control unit includes any one of DC MOTOR, CORELESSD MOTOR, UNIVERSAL MOTOR, STEPPING MOTOR, and GEARED MOTOR.

In addition, the shape of the laser beam through the beam shaper is a quadrangular surface.

In addition, the interval of variable movement of the lenticular lens is within an interval that can be adjusted by a minimum of 0.1 times to a maximum of 20 times based on the lenticular lens height (H) when disposed in the vertical direction.

In addition, the radius of curvature of the lenticular lens is within a minimum of 1mm to a maximum of 50mm.

In addition, the separately-stacked lenticular lens includes a support for protecting an outer edge and a housing to surround the support and to be fixed and movable within the body.

In addition, a laser beam mask having a diameter of 10 mm to 50 mm in a through hole for transmitting a laser beam at the center is installed at the input end.

In addition, the separated and stacked lenticular lens is composed of a stacked plate-type cylindrical lens array module (Stacked Plate-Type Cylindrical Lens Array Module), the X1 module and the X2 module arranged in the same direction are aligned between the corresponding respective plate-shaped cylindrical lenses inside the module and a predetermined adjustment device capable of coherence between the respective plate-shaped cylindrical lenses in the Y1 module and the Y2 module disposed in a different direction from the X1 and X2 modules. . This coherence function is a method that plays a decisive role in making the beam uniformity and beam inclination of the beam shaping module optimal.

In addition, a circular lens using a heat-resistant material such as metal, ceramic, etc., after a collimation lens that is disposed next to the emitting surface of an optical connector such as a QBH connector or SMA connector from which the laser beam is first emitted and converts a divergent laser beam into a parallel beam. A mask is placed and used, and this mask serves to help keep the center point and the beam size of the flat top beam constant even when the center point of the laser beam is slightly changed or the beam spread angle is minutely changed.

According to the present invention as described above, a desired beam size can be adjusted to fit the product size, thereby increasing product productivity.

1 is a conceptual diagram of a single beam module of a laser reflow apparatus according to an embodiment of the present invention;
2 is an image of an FPCB substrate to which a dual laser beam is irradiated by a laser reflow device according to an embodiment of the present invention;
3 is a conceptual diagram illustrating a configuration of a laser irradiation unit of a laser reflow apparatus according to an embodiment of the present invention;
4 is a conceptual diagram of an optical system of a laser reflow apparatus according to an embodiment of the present invention;
5 is a configuration diagram of a variable beam shaping optics module of a laser reflow apparatus according to an embodiment of the present invention;
6 is a separate stacking configuration diagram of a lenticular lens in a variable beam shaping optical module of a laser reflow apparatus according to an embodiment of the present invention;
7 is a cross-sectional view of a lenticular lens in a variable beam shaping optics module of a laser reflow apparatus according to an embodiment of the present invention;

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" to "include" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the present specification exist, but one It should be understood that it does not preclude the possibility of the presence or addition of or more other features or numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise herein, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present specification. shouldn't

Hereinafter, FIG. 1 is a conceptual diagram of a single beam module of a laser reflow apparatus according to an embodiment of the present invention, and FIG. 2 is an FPCB to which a dual laser beam is irradiated by the reflow apparatus according to an embodiment of the present invention. It is an image of the board.

Referring to FIG. 1 , the laser reflow apparatus according to an embodiment of the present invention includes a single laser module 310, thereby irradiating a single laser beam onto the FPCB substrate. At this time, referring to FIG. 2 , the circular laser beam and the square laser irradiated by the plurality of laser modules are irradiated onto the substrate in an overlapping state.

Hereinafter, the dual beam configuration and operation relationship according to the present invention will be described in detail according to an embodiment with reference to FIGS. 3 and 4 .

3 is a conceptual diagram illustrating a configuration of a laser irradiation unit of a laser reflow apparatus according to an embodiment of the present invention.

In FIG. 3 , the laser module 310 of the laser irradiation unit includes a laser oscillator 311 having a cooling device 316 , a beam shaper 312 , an optical lens module 313 , a driving device 314 , and a control device. It is configured to include a 315 and a power supply unit (317).

The laser oscillator 311 generates a laser beam having a wavelength and output power in a predetermined range. The laser oscillator is, for example, a diode laser (Laser Diode, LD) having a wavelength of '750 nm to 1200 nm' or '1400 nm to 1600 nm' or '1800 nm to 2200 nm' or '2500 nm to 3200 nm' or a rare-earth medium fiber laser (Rare-Earth- It may be a Doped Fiber Laser) or a Rare-Earth-Doped Crystal Laser, and alternatively, a medium for emitting alexandrite laser light having a wavelength of 755 nm, or Nd Yag (Nd) having a wavelength of 1064 nm or 1320 nm :YAG) may be implemented including a medium for emitting laser light.

The beam shaper 312 converts a spot type laser generated from the laser oscillator 311 and transmitted through an optical fiber into an area beam type having a flat top. The beam shaper 312 may be implemented by including a square light pipe, a diffractive optical element (DOE), or a micro-lens array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted from the beam shaper to the surface light source shape to irradiate the electronic component mounted on the PCB board or the irradiation area. The optical lens module constitutes an optical system by combining a plurality of lenses.

The driving device 314 moves the distance and position of the laser module with respect to the irradiated surface, and the controller 315 controls the driving device 314 to form a beam when the laser beam reaches the irradiated surface and the size of the beam area. , adjust the beam sharpness and beam irradiation angle. The control device 315 may also integrally control the operation of each part of the laser module 310 in addition to the driving device 314 .

Meanwhile, the laser power adjusting unit 370 controls the amount of power supplied to the laser module 310 from the power supply unit 317 corresponding to the laser module 310 according to a program received through the user interface or a preset program. The laser output adjustment unit 370 receives information about each component, each area, or the entire debonding state on the irradiation surface from one or more camera modules 350 and controls the power supply unit 317 based on this information.

Contrary to this, the control information from the laser power adjusting unit 370 is transmitted to the control device 315 of the laser module 310, and the control device 315 is a feedback signal for controlling the corresponding power supply unit 317, respectively. It is also possible to provide

On the other hand, when a plurality of laser modules are configured to emit laser beams having different wavelengths, a plurality of material layers (eg, EMC layer, silicon layer, solder layer) included in the laser irradiation unit are well absorbed by the laser irradiator. It can be composed of individual laser modules having a wavelength of

Accordingly, the laser debonding apparatus according to the present invention selectively raises the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connection material between the printed circuit board or the electrode of the electronic component, to optimize bonding (attaching or bonding). Bonding) or separation (Detaching or Debonding) process may be performed.

Specifically, it penetrates both the EMC mold layer and the silicon layer of the electronic component so that all energy of each laser beam is absorbed by the solder layer, or the laser beam does not penetrate the EMC mold layer and heats the surface of the electronic component to lower the electronic component It is also possible to conduct heat to the bonding portion of the

4 is a conceptual diagram of an optical system of a laser reflow apparatus according to an embodiment of the present invention.

4 is an optical system of the simplest structure applicable to the present invention. When the laser beam emitted from the beam transmission optical fiber 410 is focused through the convex lens 420 and is incident on the beam shaper 430, the beam shaper ( In 430 ), the spot-shaped laser beam is converted into a flat-top-shaped surface light source A1 , and the square laser beam A1 output from the beam shaper 430 is desired through the concave lens 440 . It is irradiated to the imaging plane (S) with the expanded surface light source (A2) enlarged in size.

5 is a block diagram of a variable beam shaping optics module of a laser reflow apparatus according to an embodiment of the present invention.

Hereinafter, the configuration and operation relationship of the variable beam shaping optics module of the laser reflow apparatus according to the present invention will be described in detail with reference to FIG. 5 attached thereto. First, the beam shaping optics module 600 of the present invention will be described below with some components excluding the laser oscillator 311 , the cooling device 316 , the driving device 314 , and the like in the above-described laser module of FIG. 3 .

As shown in FIG. 5 , the variable beam shaping optical module 500 of the laser reflow apparatus of the present invention may include a body part 510 , a light source 520 , a beam shaper 530 , and an optical part 540 . can

The body part 510 may have an external shape of the module, and an accommodating space may be formed therein.

It is provided in the receiving space inside the body 510 and may include a light source 520 for irradiating a laser beam. In this case, a separate optical system may be included to irradiate the parallel light from the light source.

A beam shaper 530 for receiving the beam irradiated from the light source 520 and adjusting the shape of the laser beam may be included.

The shape of the laser beam output from the beam shaper 530 may be a planar shape.

At this time, as shown in FIG. 6, the beam shaper is configured by separately stacking a plurality of lenticular lenses (that is, arranging them spaced apart by a predetermined distance), and adjusts the output beam size by moving some of the separately stacked lenticular lenses. can

In detail, the lenticular lenses may include X1 and X2 lenses arranged in the same direction and Y1 and Y2 lenses arranged in different directions from these lenses, respectively. Of course, the order of arrangement may be different according to design matters.

At this time, if X1 is the uppermost layer and Y2 is the lowermost layer in the stacking order, the size of the beam size can be adjusted by changing the movement of X1 and Y2. The shape of the adjusted beam may be implemented as a square, a rectangle, a line, or the like.

Here, a driving control unit 550 may be further included for variable movement. The driving control unit may be any one of DC MOTOR, CORELESSD MOTOR, UNIVERSAL MOTOR, STEPPING MOTOR, and GEARED MOTOR.

Next, as shown in FIG. 7 , the movement interval of the lenticular lens may be within a minimum of 0.1 times and a maximum of 10 times based on the height of the lenticular lens (H).

In addition, the radius of curvature (R) of the lenticular lens may be within a minimum of 1mm to a maximum of 50mm.

On the other hand, the stacked lenticular lens may include a support (not shown) that protects the outer edge and a housing (not shown) that surrounds the support and is fixed and movable inside the body. In more detail, the housing can be moved or fixed through the rail, and the fixing with the rail can be implemented with rivets, bolts, etc., and the movement on the rail can be implemented with wheels, which are a shape corresponding to the shape of the rail. can

Meanwhile, the variable beam shaping opti module 500 may include an optical unit 540 that reflects the laser beam output to the beam shaper 530 to adjust the optical path. Here, the optical unit may finally determine the magnification and the like from the distance to the product.

In addition, the present invention is not limited only by the above-described embodiment, and since the same effect can be created even when the detailed configuration, number, and arrangement of the device are changed, those of ordinary skill in the art will It is specified that addition, deletion, and modification of various configurations are possible within the scope of the technical idea.

500: variable beam shaping optic module 510: body part
520: light source 530: beam shaper
540: optical unit 550: driving control unit

Claims (10)

A laser reflow apparatus for bonding or debonding an electronic component to a substrate, the laser reflow apparatus comprising:
a body portion having an accommodating space therein;
a laser light source provided inside the body and irradiating a laser beam;
a beam shaper for receiving the laser beam irradiated from the laser light source and adjusting the shape of the laser beam;
Includes; an optical unit for adjusting the optical path by reflecting the laser beam output from the light source;
The beam shaper is configured by separately stacking a plurality of lenticular lenses, and adjusts the output beam size by moving and variable some of the separately stacked lenticular lenses,
The separately laminated lenticular lens is composed of a laminated plate-type cylindrical lens array module,
and a predetermined adjustment device capable of coherence between the corresponding plate-shaped cylindrical lenses in the X1 module and the X2 module disposed in the same direction,
and a predetermined adjusting device capable of coherence between the respective plate-shaped cylindrical lenses in the Y1 module and the Y2 module disposed in a different direction from the X1 and X2 modules,
The tunable beamshaping optics module of the laser reflow device. According to claim 1,
The variable movement of the stacked lenticular lenses is performed by the uppermost lenticular lens and the lowermost lenticular lens,
Variable beamshaping optics module in laser reflow device. According to claim 1,
The stacked lenticular lenses consist of X1 and X2 lenses arranged in the same direction and Y1 and Y2 lenses arranged in different directions from these lenses, respectively,
Variable beamshaping optics module in laser reflow device. According to claim 1,
Further comprising a driving control unit for variable movement of the stacked lenticular lenses,
The drive control unit includes any one of DC MOTOR, CORELESSD MOTOR, UNIVERSAL MOTOR, STEPPING MOTOR, GEARED MOTOR,
Variable beamshaping optics module in laser reflow device. According to claim 1,
The shape of the laser beam through the beam shaper is a rectangular plane,
Variable beamshaping optics module in laser reflow device. According to claim 1,
The interval of variable movement of the lenticular lens is within a minimum of 0.1 times to a maximum of 20 times based on the height of the lenticular lens,
Variable beamshaping optics module in laser reflow device. The method of claim 1,
The radius of curvature of the lenticular lens is within a minimum of 1mm to a maximum of 50mm,
The tunable beamshaping optics module of the laser reflow device. According to claim 1,
The separately stacked lenticular lens includes a support for protecting an outer edge and a housing to surround the support and to be fixed and movable within the body,
Variable beamshaping optics module in laser reflow device. According to claim 1,
A laser beam mask having a diameter of 10 mm to 50 mm in the through hole for transmitting the laser beam in the center is installed at the input end,
Variable beamshaping optics module in laser reflow device. delete

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