KR102402434B1 - Adhesive Chuck Using Adhesive with Pattern or Structure - Google Patents
Adhesive Chuck Using Adhesive with Pattern or Structure Download PDFInfo
- Publication number
- KR102402434B1 KR102402434B1 KR1020190111231A KR20190111231A KR102402434B1 KR 102402434 B1 KR102402434 B1 KR 102402434B1 KR 1020190111231 A KR1020190111231 A KR 1020190111231A KR 20190111231 A KR20190111231 A KR 20190111231A KR 102402434 B1 KR102402434 B1 KR 102402434B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- adhesive
- adhesive layer
- chuck
- chucking
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D9/00—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of wood or substitutes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
본 발명은 디스플레이, 반도체 등의 제조 공정에서 대면적 기판을 지지 및 고정하는 점착제를 이용한 척에 관련된 것으로 기존 패터닝되지 않은 일반 점착층이 적용된 대면적 점착 척에 패터닝된 점착층 또는 어떠한 형태의 구조의 점착층을 가진 점착제를 적용하여, 기존 대면적 기판을 지지 및 고정하는 기능은 동일하게 수행하되 기판을 떼어내는 디척킹 시 점착층이 뜯겨져 나가 기판으로 전이, 전사되는 현상을 줄이거나 없애고, 기판을 부착하는 척킹(Chucking)과 기판을 탈착하는 디척킹(De-Chucking) 시 기판 스트레스를 줄여 기판 파손을 예방한다.
또한 점착층이 기판과 붙는 면적이 줄어듦으로 기판 표면이 소수성으로 변하는 면적을 상대적으로 줄여 이 부분에 적용되는 공정의 불량감소 및 안정성을 제공하고자 한다.The present invention relates to a chuck using an adhesive for supporting and fixing a large-area substrate in a manufacturing process of a display, semiconductor, etc., and relates to an adhesive layer patterned on a large-area adhesive chuck to which a conventional non-patterned general adhesive layer is applied or a structure of any type. By applying an adhesive with an adhesive layer, it performs the same function of supporting and fixing the existing large-area substrate, but reduces or eliminates the phenomenon that the adhesive layer is torn off and transferred to and transferred to the substrate during dechucking to remove the substrate. It reduces substrate stress during chucking to attach and de-chucking to detach the substrate to prevent damage to the substrate.
In addition, as the area where the adhesive layer adheres to the substrate is reduced, the area where the surface of the substrate becomes hydrophobic is relatively reduced, thereby reducing defects and providing stability in the process applied to this part.
Description
본 발명은 디스플레이, 반도체 등을 제조 공정에서 기판을 지지 및 고정, 핸들링 하는 척에 대한 것으로 특히, 기판탈착(디척킹) 시 약점착 층이 기판으로 뜯겨 나가거나, 전이되는 현상을 줄이거나 없애고, 척킹(Chucking), 디척킹(De-Chucking) 시 기판의 스트레스를 줄여 기판 파손 요인을 감소시켜 양산성을 효과적으로 향상시킬 수 있는 방안에 대한 것이다.The present invention relates to a chuck for supporting, fixing, and handling substrates in the manufacturing process of displays, semiconductors, etc. In particular, it reduces or eliminates the phenomenon that the weakly adhesive layer is torn off or transferred to the substrate during substrate detachment (dechucking), It is about a method to effectively improve mass productivity by reducing the stress of the substrate during chucking and de-chucking, thereby reducing the cause of substrate damage.
디스플레이 산업에서 척의 일반적인 기능은 진공 장비 내부에서 패널 기판을 지지 및 고정하는 목적으로 사용되며, 실제 양산 제조 공정 시 사용 중이다. 기판 지지 운반체는 척 또는 트레이 등이 있으며 이 중 척은 점착 척, 마그넷 척, 정전 척 등 다양한 척킹 수단에 따라 분류 된다.A general function of the chuck in the display industry is to support and fix the panel substrate inside the vacuum equipment, and it is being used in the actual mass production process. The substrate support carrier includes a chuck or a tray, and among them, the chuck is classified according to various chucking means such as an adhesive chuck, a magnet chuck, and an electrostatic chuck.
대면적 유리 기판을 생산하기 위해 다양한 운송방식 중 현재 가장 양산화된 기술은 점착 척으로써, 점착 척의 경우, 본 출원인에 의해 출원되어 있다(대한민국 등록특허 제10-0541856호 참조). Among various transportation methods for producing large-area glass substrates, the most mass-produced technology currently is an adhesive chuck.
종래 기술의 기판 홀딩 장치의 경우, 진공 흡입력을 이용하여 기판을 당겨 기판 면이 점착 척의 상면의 점착제에 닿아 부착되는 구조를 설명하고 있다. 기판의 부착 단계 이후 안정적인 부착 상태를 유지하여야 하며, 외부 요인에 상관없이 항시 안정적인 척킹과 디척킹이 이루어질 수 있는 효율적인 척킹 시스템은 필수적이다.In the case of the prior art substrate holding device, a structure in which the substrate surface is attached to the adhesive on the upper surface of the adhesive chuck by pulling the substrate using vacuum suction is described. It is necessary to maintain a stable attachment state after the step of attaching the substrate, and an efficient chucking system capable of performing stable chucking and de-chucking at all times regardless of external factors is essential.
상기 특허공보에 기재된 기판 홀딩 장치의 경우, 기판을 진공 흡입력을 이용하여 기판과 점착 척 상면의 점착제와 결합하는 구조에 대해 설명하고 있다. 상기와 같은 기판 홀딩 장치는 기판과 점착제가 결합 되었다가 디척킹(De-Chucking)되는 과정에서 기판이 분리 되는데, 이때 점착층의 점착물질이 기판으로 전이, 전사되어 기판 표면을 소수성으로 만들어 후공정 진행을 방해하여 생산 불량을 발생 시키며, 반복적인 결합-분리 과정을 거치면서 점착제층이 기판으로 전이, 전사 됨에 따라 점착제 수명에 악영향을 끼치게 된다.In the case of the substrate holding device described in the above patent publication, a structure in which the substrate is bonded to the substrate and the adhesive on the upper surface of the adhesive chuck using vacuum suction is described. In the above-described substrate holding device, the substrate and the adhesive are combined and then the substrate is separated in the process of de-chucking. At this time, the adhesive material of the adhesive layer is transferred and transferred to the substrate to make the substrate surface hydrophobic and post-process It interferes with the progress and causes production defects, and as the pressure-sensitive adhesive layer is transferred and transferred to the substrate through the repeated bonding-separation process, it adversely affects the life of the pressure-sensitive adhesive.
또한, 척킹(Chucking), 디척킹(De-Chucking)되는 과정에서 기판의 변형에 따른 스트레스는 기판 파손에 기여하며, 기판 파손은 생산 불량 및 생산라인 가동에 큰 차질을 발생시킨다.In addition, during the chucking and de-chucking, the stress caused by the deformation of the substrate contributes to substrate breakage, and the substrate breakage causes production defects and large setbacks in production line operation.
이에 따라 점착제층의 점착층의 전이, 전사가 적거나 없으며, 또한 기판 스트레스를 줄이고, 나아가 점착층의 수명을 향상시켜 보다 효율적인 양산공정을 진행 할 수 있는 방안이 필요한 실정이다.Accordingly, there is a need for a method for a more efficient mass-production process by reducing the transfer or transfer of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive layer or not, and reducing the substrate stress and further improving the lifespan of the pressure-sensitive adhesive layer.
본 발명의 목적은 디척킹(De-Chucking) 시 발생되는 상부 점착제층의 기판 전이, 전사 현상과 척킹(Chucking), 디척킹(De-Chucking) 시 기판의 변형 스트레스를 줄여 전-후공정의 생산 손실(Loss)을 효율적으로 줄일 수 있는 점착 척을 제공하고자 하는 것이다.An object of the present invention is to reduce the deformation stress of the substrate during the substrate transfer, transfer, and chucking and de-chucking of the upper pressure-sensitive adhesive layer that occurs during de-chucking to produce the pre-post process An object of the present invention is to provide an adhesive chuck capable of effectively reducing loss.
상기 목적에 따라 본 발명은 상부 점착층이 기판으로의 전이, 전사되는 현상을 줄이거나 없애고, 기판의 스트레스를 줄여 생산성을 올리기 위해 다음과 같은 해결방안을 제공한다. In accordance with the above object, the present invention provides the following solutions in order to reduce or eliminate the transfer and transfer of the upper adhesive layer to the substrate, and to increase productivity by reducing the stress on the substrate.
즉, 본 발명은 종래에 사용되던 평탄면의 상부 약 점착층을 가진 점착제의 표면을 일자형(Stripe), 격자형(Mesh) 등의 다양한 형태로 패터닝하여 기판과 점착되는 면적을 줄인 점착척을 제공하여, 디척킹(De-Chucking) 시 점착제의 전이 및 전사되는 현상을 줄이거나 없애고, 계단형(Stair), 경사형(Slope) 등의 구조를 가진 점착층을 이용하여 기판의 파손 요인중의 하나인 기판 변형 스트레스를 줄여 공정의 용이성을 확보한다.That is, the present invention provides an adhesive chuck that reduces the area adhered to the substrate by patterning the surface of the conventionally used pressure-sensitive adhesive having an upper weak adhesive layer of a flat surface in various shapes such as a stripe and a mesh. Thus, it reduces or eliminates the transfer and transfer of the adhesive during de-chucking, and uses an adhesive layer having a structure such as a stair or a slope, which is one of the causes of damage to the substrate. By reducing the phosphorus substrate deformation stress, the easiness of the process is ensured.
상부 점착층의 패턴 및 구조는 일자형(Stripe), 격자형(Mesh), 계단형(Stair), 경사형(Slope) 등 다양하게 적용이 가능하며, 패턴 및 구조를 구성하는 방안으로는 약 점착제 원료 도포 시 단일 노즐이 아닌 여러 개의 노즐을 이용하여 패터닝 하는 방법과 기 도포된 점착층 표면을 칼날, 레이져(LASER), 화학 식각액 등을 사용하여 물리적, 화학적인 방법 등으로 2차 가공처리하는 방법이 있다.The pattern and structure of the upper adhesive layer can be applied in a variety of ways, such as a straight type (Stripe), a grid type (Mesh), a staircase type (Stair), and a slope type (Slope). There is a method of patterning using multiple nozzles instead of a single nozzle during application, and a method of performing secondary processing on the surface of the pre-applied adhesive layer by physical or chemical methods using a knife, laser, or chemical etchant. have.
즉, 본 발명은, That is, the present invention is
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재로서,An adhesive chuck member provided on a chuck plate for holding a substrate, comprising:
기판과 접촉하는 약 점착층은 요철을 형성하는 패턴을 구비한 것을 특징으로 하는 점착척 부재를 제공한다.There is provided an adhesive chuck member, wherein the weak adhesive layer in contact with the substrate has a pattern for forming irregularities.
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재로서,An adhesive chuck member provided on a chuck plate for holding a substrate, comprising:
기판과 접촉하는 약 점착층은 계단형 또는 경사형 구조를 구비한 것을 특징으로 하는 점착척 부재를 제공한다.The weak adhesive layer in contact with the substrate has a stepped or inclined structure.
상기에 있어서, 요철을 형성하는 패턴은 스트라이프형 또는 메쉬형을 포함하는 것을 특징으로 하는 점착척 부재를 제공한다.In the above, the pattern for forming the unevenness provides an adhesive chuck member, characterized in that it includes a stripe shape or a mesh shape.
상기에 있어서, 계단형 또는 경사형 구조는 전체적으로 점착척 부재의 중심부로 갈수록 높은 형상을 나타내는 것을 특징으로 하는 점착척 부재를 제공한다.In the above, the stepped or inclined structure provides an adhesive chuck member, characterized in that it exhibits a higher shape toward the center of the adhesive chuck member as a whole.
또한, 본 발명은, In addition, the present invention,
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재 중 기판과 직접 접촉하는 약점착제 층에 패턴을 형성함에 있어서,In forming a pattern on the weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided on the chuck plate for holding the substrate,
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 양각부와 음각부를 갖는 패턴을 일체형으로 형성하거나,When applying the raw material of the weakly adhesive layer to the first substrate on which the weakly adhesive layer is formed, a pattern having an embossed part and an engraved part is integrally formed using several nozzles,
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 패턴을 식각하는 것을 특징으로 하는 점착 척 부재 패턴 형성 방법을 제공한다.Provided is a method for forming a pattern for an adhesive chuck member, characterized in that a weakly adhesive layer is formed on a first substrate in a flat surface and then the pattern is etched by a physical or chemical method.
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재 중 기판과 직접 접촉하는 약점착제 층에 구조를 형성함에 있어서,In forming a structure on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided in the chuck plate for holding the substrate,
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 계단형 구조 또는 경사형 구조를 일체형으로 형성하거나,When the raw material of the weak adhesion layer is applied to the first substrate on which the weak adhesion layer is formed, a step-type structure or an inclined structure is integrally formed by using several nozzles,
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 식각하여 계단형 구조 또는 경사형 구조를 만드는 것을 특징으로 하는 점착 척 부재 구조 형성 방법을 제공한다.Provided is a method of forming a structure for an adhesive chuck member, comprising forming a weakly adhesive layer on a first substrate with a flat surface and then etching it using a physical or chemical method to form a stepped structure or an inclined structure.
상기에 있어서, 양각부와 음각부의 두께와 폭, 계단형 구조를 이루는 각 계단의 두께와 폭, 또는 경사형 구조의 경사도를 조절하여 패턴 또는 구조 형상을 다양화하는 것을 특징으로 하는 점착 척 부재 패턴 형성 방법을 제공한다.In the above, the adhesive chuck member pattern, characterized in that the pattern or structure shape is diversified by adjusting the thickness and width of the embossed portion and the intaglio portion, the thickness and width of each step forming the stepped structure, or the inclination of the inclined structure. A method of forming is provided.
본 발명에 따르면, 본래의 점착 척의 순기능인 대면적 기판을 지지 및 고정하는 기능은 동일하게 수행하되 기판을 부착/탈착하는 척킹(Chucking), 디척킹(De-Chucking) 시 기판 스트레스를 줄여 기판 파손 요인을 줄일 수 있으며, 디척킹(De-Chucking) 시 점착층이 뜯겨져 나가 기판으로 전이 및 전사되는 현상을 줄이거나 없애고, 또한 점착층이 기판과 붙는 면적이 줄어듦으로 기판 표면이 소수성으로 변하는 면적을 상대적으로 줄여 이 부분에 적용되는 공정의 불량감소 및 안정성을 높일 수 있다. According to the present invention, the function of supporting and fixing a large-area substrate, which is the original function of the adhesive chuck, is performed in the same way, but the substrate is damaged by reducing the substrate stress during chucking and de-chucking to attach/detach the substrate. It is possible to reduce factors, and it reduces or eliminates the phenomenon that the adhesive layer is torn off during de-chucking and transfers and transfers to the substrate. It is possible to reduce defects and increase the stability of the process applied to this part by relatively reducing the
나아가 점착제의 수명을 증가시켜 점착층 교체 등에 소비되는 시간과 비용을 줄일 수 있게 한다.Furthermore, it is possible to reduce the time and cost of replacing the adhesive layer by increasing the lifespan of the adhesive.
또한, 상부 약 점착제의 점착 면적이 줄어들 경우 점착층의 전이 및 전사영역이 줄어들게 되어 그 영역에 적용되는 후공정(인쇄 등)에서 발생하는 불량을 효율적으로 줄일 수 있으며, 점착제의 수명을 높일 수 있는 효과가 있다.In addition, when the adhesive area of the upper weak adhesive is reduced, the transition and transfer area of the adhesive layer is reduced, so that defects occurring in the post-process (printing, etc.) applied to the area can be effectively reduced, and the lifespan of the adhesive can be increased. It works.
또한, 계단형(Stair), 경사형(Slope) 등의 구조는 척킹(Chucking) 시 진공 흡입력에 의해 발생되는 기판의 변형 스트레스를 완화 시키고, 디척킹(De-Chucking) 시 기판과 점착제가 분리될 때 점착제의 경사면을 따라 필오프(Peel Off)현상이 보다 쉽게 발생하여 기판이 분리되기 때문에 기판이 받는 변형 스트레스가 줄어 기판 파손을 방지 할 수 있다.In addition, a structure such as a staircase type or a slope type relieves the deformation stress of the substrate caused by vacuum suction force during chucking, and the substrate and the adhesive are separated during de-chucking. When the peel-off phenomenon occurs more easily along the inclined surface of the adhesive, the substrate is separated, so the deformation stress on the substrate is reduced, thereby preventing substrate damage.
도 1은 종래 기술에 따른 점착척 부재의 구성을 보여주는 단면도이다.
도 2는 본 발명에 따라 상면이 패터닝 된 구조를 갖는 점착척 부재의 구성을 보여주는 단면도이다.
도 3은 본 발명에 따라 상면의 패터닝이 스트라이프형으로 구성된 점착척 부재의 평면도와 사시도 이다.
도 4는 본 발명에 따라 상면의 패터닝이 메쉬형으로 구성된 점착척 부재의 평면도와 사시도 이다.
도 5는 본 발명에 따라 상면의 패터닝이 계단형으로 구성된 점착척 부재의 단면도 및 평면도이다.
도 6은 본 발명에 따라 상면의 패터닝이 계단형으로 구성된 점착척 부재의 사시도이다.
도 7은 본 발명에 따라 상면의 패터닝이 경사형으로 구성된 점착척 부재의 단면도이다.
도 8은 본 발명에 따라 상면의 패터닝이 경사형으로 구성된 점착척 부재의 평면도와 사시도 이다. 1 is a cross-sectional view showing the configuration of an adhesive chuck member according to the prior art.
2 is a cross-sectional view showing the configuration of an adhesive chuck member having a structure in which an upper surface is patterned according to the present invention.
3 is a plan view and a perspective view of an adhesive chuck member having an upper surface patterned in a stripe shape according to the present invention.
4 is a plan view and a perspective view of an adhesive chuck member whose upper surface is patterned in a mesh shape according to the present invention.
5 is a cross-sectional view and a plan view of an adhesive chuck member whose upper surface is patterned in a stepped shape according to the present invention.
6 is a perspective view of an adhesive chuck member whose upper surface is patterned in a stepped shape according to the present invention.
7 is a cross-sectional view of an adhesive chuck member in which the upper surface is patterned in an inclined shape according to the present invention.
8 is a plan view and a perspective view of an adhesive chuck member whose upper surface is patterned in an inclined shape according to the present invention.
이하, 첨부도면을 참조하여 본 발명의 바람직한 실시예에 대해 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따라 상면이 패터닝 된 구조를 갖는 점착척 부재의 구성을 보여주는 단면도이다. 2 is a cross-sectional view showing the configuration of an adhesive chuck member having a structure in which an upper surface is patterned according to the present invention.
본 발명의 점착척 부재는 패터닝 점착제 층(300)이 강접 시이트(200) 상에 합지되어 구성된다. The pressure-sensitive adhesive member of the present invention is configured by laminating a patterned pressure-sensitive
패터닝 점착제 층(300)은 제1 기재의 하면에는 강 점착층이 형성되고 제1 기재 상면에는 약 점착층이 형성되어 있다. 종래와 달리 약 점착층은 패터닝되어 요철 구조를 갖는다. 제1 기재의 강 점착층은 강접 시이트(200)에 합지되며, 강접 시이트는 제2 기재의 상하면 모두 강 점착층이 형성된 시이트이다. The patterning
도 3은 패터닝 점착제 층(300)의 상면 패터닝이 스트라이프형 패턴(400)으로 구성된 스트라이프형 점착척 부재(500)를 보여준다. 약점착층이 스트라이프형(Stripe) 패터닝 양각부(401)와 음각부(402)가 교대로 반복되면서 요철을 형성하고 이를 통해 기판과의 접촉면적이 줄어들고 비접촉부가 교대로 존재하여 디척킹시 점착제가 기판에 전이 및 전사되는 현상을 줄이거나 없애고, 기판의 파손 요인중의 하나인 기판 변형 스트레스를 감소시킬 수 있다. 3 shows a stripe-type
도 4는 상면의 패터닝이 메쉬형으로 구성된 점착척 부재의 평면도와 사시도이다.4 is a plan view and a perspective view of an adhesive chuck member whose upper surface is patterned in a mesh shape;
패터닝 점착제 층이 메쉬형 패턴(600)을 구비한 점착척 부재(700)으로, 양각부(601)와 음각부(602)가 균일하게 형성된다. 스트라이프형에 비해 좀 더 균일하게 점착력을 발휘하면서도 디척킹도 용이하게 이루어질 수 있다. The patterned adhesive layer is an
도 5는 패터닝 점착제 층 상면의 패터닝이 계단형으로 구성된 점착척 부재(1000)의 단면도와 평면도이고 도 6은 그 사시도이다.5 is a cross-sectional view and a plan view of the
약점착층이 계단형(Stair) 구조(900)로 형성되며, 중심부가 가장 높은 계단의 정상부를 이루며 외곽으로 갈수록 한계단씩 낮아지는 형상을 갖는다. 이러한 계단형 구조(900)의 약 점착층은 기판의 중심부를 가장 강하게 척킹하여 기판의 처짐 현상을 효율적으로 방지하면서 디척킹도 용이하게 이루어질 수 있다. The weakly adhesive layer is formed in a
도 7은 경사면 구조(1200)를 형성한 점착척 부재(1300)를 보여준다. 7 shows the
이 경우도 도 5의 것과 같은 효과를 나타내며, 계단형 구조가 아닌 경사형 구조이기 때문에 척킹 및 디척킹 시 기판변형 스트레스 측면에서 더 우수할 수 있다. In this case as well, the same effect as that of FIG. 5 is exhibited, and since it is a slanted structure rather than a stepped structure, it may be better in terms of substrate deformation stress during chucking and dechucking.
패턴 또는 계단형, 경사면 구조는 다양한 사이즈의 패턴으로 형성될 수 있다. 예를 들면, 스트라이프형 패턴은 직선 외에 물결형과 같은 곡선으로 형성될 수도 있고, 메쉬 패턴은 양각부의 단면 형상이 원형, 타원형, 다각형을 포함할 수 있다. The pattern or step-like, inclined surface structure may be formed in a pattern of various sizes. For example, the stripe pattern may be formed in a curve such as a wavy shape in addition to a straight line, and the mesh pattern may include a circular shape, an oval shape, and a polygonal shape in cross-section of the embossed part.
한편, 양각부의 두께, 폭, 음각부의 두께, 폭 또한 자유자재로 변경 가능하다.On the other hand, the thickness and width of the embossed part, the thickness of the engraved part, and the width can also be freely changed.
계단형(Stair), 경사형(Slope) 등의 구조의 경우 각 층의 두께, 폭, 경사의 각도 또한 자유자재로 변경이 가능하다. In the case of a structure such as a stair type or a slope type, the thickness, width, and angle of the slope of each layer can also be freely changed.
상기 패턴 또는 구조들은 모두 척킹과 디척킹의 용이성 및 기판에 대한 점착제 전이 방지, 점착척의 수명 장기화, 기판 스트레스 완화 등의 효과를 나타낸다.All of the above patterns or structures exhibit effects such as ease of chucking and de-chucking, prevention of adhesive transfer to the substrate, prolongation of the lifespan of the adhesive chuck, and alleviation of substrate stress.
약점착제 층에 상술한 패턴 또는 계단형 또는 경사형 구조를 형성하는 방법은 다음과 같다.A method of forming the above-described pattern or step-type or inclined structure on the weak adhesive layer is as follows.
제1기재에 약점착층의 원재료를 도포(주입) 할 때, 여러 노즐을 사용하여 패터닝 구조를 원바디로 형성하거나, 평탄한 구조의 약점착 층을 형성한 다음, 칼날, 레이저(LASER), 화학 식각액 등을 사용하여 물리적, 및/또는 화학적인 방법으로 패터닝 또는 구조를 형성할 수 있다.When applying (injecting) the raw material of the weakly adhesive layer to the first substrate, using several nozzles to form a patterning structure as a single body or to form a weakly adhesive layer with a flat structure, then use a knife, laser, or chemical Patterning or structure may be formed by a physical and/or chemical method using an etchant or the like.
본 발명의 권리는 위에서 설명된 실시 예에 한정되지 않고 청구범위에 기재된 바에 의해 정의되며, 본 발명의 분야에서 통상의 지식을 가진 자가 청구범위에 기재된 권리범위 내에서 다양한 변형과 개작을 할 수 있다는 것은 자명하다.The rights of the present invention are not limited to the above-described embodiments, but are defined by the claims, and those of ordinary skill in the art can make various modifications and adaptations within the scope of the claims. it is self-evident
100: 기존 점착제 층
200: 강접 시이트
300, 1100: 패터닝 점착제 층
400: 스트라이프형 패턴
500: 스트라이프형 점착척 부재
401, 601: 양각부
402, 602: 음각부
600: 메쉬형 패턴
700, 1000, 1300: 점착척 부재
900: 계단형(Stair) 구조
1200: 경사면 구조100: conventional adhesive layer
200: steel welding sheet
300, 1100: patterning adhesive layer
400: stripe pattern
500: stripe type adhesive chuck member
401, 601: embossed
402, 602: intaglio
600: mesh pattern
700, 1000, 1300: adhesive chuck member
900: Stair structure
1200: slope structure
Claims (7)
기판과 접촉하는 약 점착층은 계단형 구조를 구비한 것을 특징으로 하는 점착척 부재.
An adhesive chuck member provided on a chuck plate for holding a substrate, comprising:
The adhesive chuck member, characterized in that the weak adhesive layer in contact with the substrate has a stepped structure.
The adhesive chuck member according to claim 2, wherein the step-like structure as a whole exhibits a higher shape toward the center of the adhesive chuck member.
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 계단형 구조를 일체형으로 형성하거나,
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 식각하여 계단형 구조를 만드는 것을 특징으로 하는 점착 척 부재 구조 형성 방법.In forming a structure on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided in the chuck plate for holding the substrate,
When applying the raw material of the weak adhesion layer to the first substrate on which the weak adhesion layer is formed, a step-like structure is integrally formed by using several nozzles,
A method for forming a structure for an adhesive chuck member, characterized in that a step-like structure is formed by forming a weakly adhesive layer on a first substrate to have a flat surface and then etching using a physical or chemical method.
The method of claim 6 , wherein the structure shape is diversified by adjusting the thickness and width of each step forming the step-like structure.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190111231A KR102402434B1 (en) | 2019-09-09 | 2019-09-09 | Adhesive Chuck Using Adhesive with Pattern or Structure |
| CN202021586742.4U CN213139417U (en) | 2019-09-09 | 2020-08-03 | Adhesive chuck member and substrate chucking system |
| CN202010768218.7A CN112455857B (en) | 2019-09-09 | 2020-08-03 | Adhesive chuck member, pattern forming method thereof, substrate chucking method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190111231A KR102402434B1 (en) | 2019-09-09 | 2019-09-09 | Adhesive Chuck Using Adhesive with Pattern or Structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210029936A KR20210029936A (en) | 2021-03-17 |
| KR102402434B1 true KR102402434B1 (en) | 2022-05-26 |
Family
ID=74832834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190111231A KR102402434B1 (en) | 2019-09-09 | 2019-09-09 | Adhesive Chuck Using Adhesive with Pattern or Structure |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102402434B1 (en) |
| CN (2) | CN112455857B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102402434B1 (en) * | 2019-09-09 | 2022-05-26 | 주식회사 야스 | Adhesive Chuck Using Adhesive with Pattern or Structure |
| CN113629217A (en) * | 2021-07-19 | 2021-11-09 | 武汉华星光电半导体显示技术有限公司 | Preparation method of display panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101317790B1 (en) * | 2011-06-07 | 2013-10-15 | 주식회사 에스에프에이 | Adhesive Chuck and Method for Manufacturing the same |
| JP2018078132A (en) * | 2016-11-07 | 2018-05-17 | 信越ポリマー株式会社 | Holding jig for precision part, and method for manufacturing the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4334883B2 (en) * | 2003-02-20 | 2009-09-30 | 大日本印刷株式会社 | Adhesive sheet |
| JP4447386B2 (en) * | 2004-03-29 | 2010-04-07 | 日東電工株式会社 | Method for removing phosphor on partition wall upper surface of plasma display panel rear substrate, and method for manufacturing plasma display panel rear substrate |
| KR200468950Y1 (en) * | 2011-08-02 | 2013-11-27 | (주)마스오카제작소 | Adhesion pad and glass transporting apparatus having the same |
| US10109612B2 (en) * | 2013-12-13 | 2018-10-23 | Taiwan Semiconductor Manufacturing Company | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices |
| KR102032025B1 (en) * | 2017-09-22 | 2019-10-14 | 주식회사 야스 | Efficient Adhesive Cuck and Dechuck System |
| KR102402434B1 (en) * | 2019-09-09 | 2022-05-26 | 주식회사 야스 | Adhesive Chuck Using Adhesive with Pattern or Structure |
-
2019
- 2019-09-09 KR KR1020190111231A patent/KR102402434B1/en active IP Right Grant
-
2020
- 2020-08-03 CN CN202010768218.7A patent/CN112455857B/en active Active
- 2020-08-03 CN CN202021586742.4U patent/CN213139417U/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101317790B1 (en) * | 2011-06-07 | 2013-10-15 | 주식회사 에스에프에이 | Adhesive Chuck and Method for Manufacturing the same |
| JP2018078132A (en) * | 2016-11-07 | 2018-05-17 | 信越ポリマー株式会社 | Holding jig for precision part, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN213139417U (en) | 2021-05-07 |
| CN112455857A (en) | 2021-03-09 |
| KR20210029936A (en) | 2021-03-17 |
| CN112455857B (en) | 2023-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5029523B2 (en) | GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT, PANEL FOR DISPLAY DEVICE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | |
| KR102402434B1 (en) | Adhesive Chuck Using Adhesive with Pattern or Structure | |
| JP4125776B1 (en) | Adhesive chuck device | |
| KR102648921B1 (en) | Imprint master template and method of manufacturing the same | |
| TW200603247A (en) | SOI substrate and method for manufacturing the same | |
| WO2003088340A3 (en) | Method for the production of structured layers on substrates | |
| TW201308471A (en) | Extended life textured chamber components and method for fabricating same | |
| JP2011148227A5 (en) | Substrate for mask blank and method for manufacturing the same, mask blank for imprint mold and method for manufacturing the same, and imprint mold and method for manufacturing the same | |
| CN103681484A (en) | Flexible display device manufacturing method and carrier substrate for manufacturing same | |
| US10773505B2 (en) | Method of attaching substrate and apparatus for attaching substrate | |
| CN107195658A (en) | Flexible base board and preparation method thereof | |
| JP2013237159A (en) | Glass film laminate and method of manufacturing the same | |
| US20130105089A1 (en) | Method for separating substrate assembly | |
| TW201318488A (en) | Method for separating substrate assembly | |
| EP3689593A2 (en) | Patterned film for transferring display pixels and method for preparing display using same | |
| KR101422449B1 (en) | Adhesive chuck with masking area limited | |
| KR101317790B1 (en) | Adhesive Chuck and Method for Manufacturing the same | |
| KR102133780B1 (en) | Method for processing laminated sheet and processed laminated sheet | |
| CN113437234B (en) | Method for peeling flexible substrate, flexible substrate and display panel | |
| KR20190033835A (en) | Efficient Adhesive Cuck and Dechuck System | |
| JP2004260153A5 (en) | ||
| KR20180035988A (en) | Substrate structure for lift off | |
| JP2022533955A (en) | Multi-chip carrier structure | |
| WO2018093653A1 (en) | Apparatus and method for processing the apparatus | |
| KR20190136182A (en) | carrier substrate and manufacturing method for organic electronic device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |