KR102385034B1 - Method for manufacturing rfid label tag having excellent stress relaxation property) - Google Patents

Abstract

The present invention relates to a method for manufacturing an RFID label tag with excellent stress relaxation properties. According to the present invention, roll-to-roll processing can be applied, and thus process automation is possible in each step and productivity can be enhanced. The method includes the following steps of: supplying roll-type label paper; forming a first non-conductive adhesive layer on the upper surface of the label paper; attaching an inlay tag printed with an antenna including an RFID chip on the non-conductive adhesive layer; forming, on the inlay tag, a stress relaxation layer made of a substance relaxing stress with a conductive material constituting the antenna; forming a second non-conductive adhesive layer on the stress relaxation layer; and attaching a protective film on the second non-conductive adhesive layer.

Description

Manufacturing method of RFID label tag with excellent stress relaxation characteristics {METHOD FOR MANUFACTURING RFID LABEL TAG HAVING EXCELLENT STRESS RELAXATION PROPERTY}

The present invention relates to a method for manufacturing an RFID label tag, and more particularly, it is possible to apply a roll-to-roll processing method, so that productivity can be increased with automation of each step process, and an RFID label tag with excellent stress relief characteristics It relates to a manufacturing method.

In general, label paper consists of a label paper and a release paper, an adhesive component is applied to the bottom of the label paper, and a non-adhesive coating layer is formed on the surface of the release paper. In a state in which the label is attached to the surface of the release paper, the user prints characters or figures on the surface of the label, and then separates the label from the release paper and attaches it to the surface of the article. At this time, since a coating layer of a non-adhesive material is formed on the surface of the release paper, when the label paper coated with an adhesive component is separated from the release paper, the label paper is easily separated without being damaged.

In addition, in recent years, label paper inserts an RFID (Radio Frequency IDentification) tag inside in order to input more information about the product, and provides various information such as the date of production of the product, the place of production, and the producer to consumers or purchasers.

Since these RFID label tags can be read in a non-contact manner, information related to products to which the RFID label is attached and stored items can be read without damage to the RFID label. It is widely used for product inventory management.

However, the existing RFID label tag is expensive and is supplied in an individual sheet-to-sheet method due to the problem of thick thickness. and inefficiency of process time has always been pointed out as a problem.

KR 10-1202942 B1

Therefore, the present invention has been devised to solve the above problem, and an object of the present invention is to enable the application of a roll-to-roll method, so that the productivity can be increased with automation of each step process, and the RFID label with excellent stress relief characteristics To provide a method for manufacturing a tag.

Other objects and advantages of the present invention will be set forth below and will be learned by way of example of the present invention. Further, the objects and advantages of the present invention may be realized by means and combinations indicated in the claims.

In order to achieve the above object, according to the present invention, there is provided a method for manufacturing an RFID label tag having excellent stress relaxation characteristics, the method comprising: supplying a roll-type label paper; forming a first non-conductive adhesive layer on the upper surface of the label paper; attaching an antenna-printed inlay tag including an RFID chip on the non-conductive adhesive layer; forming a stress relieving layer made of a material for relieving stress with a conductive material constituting the antenna on the inlay tag; forming a second non-conductive adhesive layer on the stress relief layer; and attaching a protective film on the second non-conductive adhesive layer, wherein the stress relieving layer includes a filler increasing or decreasing the thermal expansion coefficient of the stress relieving layer, wherein the stress relieving layer has a thermal expansion coefficient of 20 to 30 A polyimide having a ppm/K or less and a glass transition temperature (Tg) of 300°C ≤ Tg ≤ 350°C may be used, and the filler is composed of expanded graphite, graphene, zinc oxide and zirconium oxide. containing a material selected from the group, wherein the filler is formed in a needle shape, a planar shape, a laminated planar shape or a spindle shape, and an ultraviolet curing resin layer for protection of the inlay tag between the stress relief layer and the second non-conductive adhesive layer further The method further includes forming the UV curable resin layer, wherein the step of forming the UV curable resin layer includes: coating an UV curable resin solution on the stress relieving layer; while spraying an inert gas between the UV curable resin solution and the transparent film, attaching and pressing the transparent film on the UV curable resin solution; and curing the ultraviolet curable resin solution by irradiating ultraviolet rays to form an ultraviolet curable resin layer.

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In addition, the antenna is composed of a metal component made of electronic ink, copper or aluminum material formed by a printing method, and the material of the inlay tag including the antenna is selected from paper, PET (polyethylene terephthalate) and PI (polyimide). characterized by being

As described above, according to the manufacturing method of the RFID label tag according to the present invention, the roll-to-roll processing method can be applied, so that the productivity can be increased along with the automation of each step-by-step process, and there is an excellent effect of stress relaxation characteristics.

1 is a separation schematic diagram for explaining an RFID label tag according to the present invention;
2 is a schematic diagram showing the shape of an RFID label tag according to the present invention;
3 is a schematic diagram showing a state in which the RFID label tag according to the present invention is attached to the label paper;
4 is a flowchart for explaining a method of manufacturing an RFID label tag according to the present invention;
5 is a view for explaining the step of attaching the protective film according to the present invention.

Details of other embodiments are included in the detailed description and drawings.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in a variety of different forms, and in the following description, when a part is connected to another part, it is not only directly connected It includes cases where other media are interposed in between. In addition, in the drawings, parts not related to the present invention are omitted to clarify the description of the present invention, and the same reference numerals are assigned to similar parts throughout the specification.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 is a separation schematic for explaining an RFID label tag according to the present invention, FIG. 2 is a schematic diagram showing the shape of an RFID label tag according to the present invention, and FIG. 3 is an RFID label tag according to the present invention attached to the label paper It is a schematic diagram showing the state of the present invention, FIG. 4 is a flowchart for explaining a method of manufacturing an RFID label tag according to the present invention, and FIG. 5 is a view for explaining the step of attaching a protective film according to the present invention.

Referring to FIG. 1 , the RFID label tag 100 according to the present invention includes a label paper 110 , an adhesion prevention layer 120 , a first non-conductive adhesive layer 130 , an inlay tag 140 , and a stress relief layer. 150 , a second non-conductive adhesive layer 160 , and a protective film 170 .

Label paper 110 may be supplied in the form of a continuous label strips in a roll. A barcode, etc. may be additionally printed on the front side of the label paper 110 if necessary.

The anti-adhesive layer 120 may be formed after providing the non-conductive adhesive layer 130 on the label paper 110 so that the RFID label tag 100 is removable, that is, detachable, if necessary. The anti-adhesion layer 120 may be excluded as an optional configuration.

The first non-conductive adhesive layer 130 is formed on the anti-adhesive layer 120 , and an inlay tag 140 and other members are attached to the upper surface thereof, and thereafter, it is removable on the label paper 110 via the anti-adhesive layer 120 . form can be produced.

The non-conductive adhesive layer 130 is formed by laminating a non-conductive adhesive film selected from an acrylic double-sided adhesive film, a hot melt type EVA (vinyl acetate resin) double-sided adhesive film, and a butyl rubber adhesive film, or an acrylic adhesive, a hot melt type EVA (vinyl acetate resin) ) by spraying a non-conductive adhesive selected from adhesives and butyl rubber-based spray-type adhesives.

The inlay tag 140 includes an RFID chip 141 and an antenna 142 . The RFID chip 141 included in the inlay tag 140 is connected to the antenna 142 to demodulate the radio signal transmitted from the wireless reader, and according to the demodulated signal, product data stored inside or an externally connected sensor ( (not shown) and transmits the received information to the reader.

The antenna 142 may be formed by processing or printing a metal layer in a pattern of a specific shape, and has an approximately zigzag shape to increase reception sensitivity.

The inlay tag 140 may be a means for protecting and covering the RFID chip 141 and the antenna 142 from the outside, and may be formed of a member capable of having adequate flexibility and resiliency to be protected.

The stress relieving layer 150 may be made of a material for relieving stress with a conductive material forming the inlay tag 140 , in particular, the antenna 142 .

The RFID label tag 100 is frequently used in a situation where the temperature difference is severe depending on the type. In such a case, for example, stress is applied to the resin layer having a large coefficient of thermal expansion due to a difference in the coefficient of thermal expansion between the antenna 142 for communication and the resin layer formed around it, and there is a fear that the resin layer may be damaged. This may cause deterioration of the lifespan and reliability of the RFID label tag 100 .

In consideration of this point, in the present invention, by providing the stress relieving layer 150, even if a sudden temperature difference occurs in the RFID label tag 100, the stress caused by the difference in expansion rate between the conductive material and the resin material is reduced. is alleviating

As the stress relieving layer 150 , a resin material such as epoxy, polyimide (PI), acryl, or polyamide may be used. In this case, since the coefficient of thermal expansion may be greater than that of the conductive material, by including the filler in the stress relieving layer 150 , the thermal expansion coefficient of the resin can be approximated to that of the conductive material to relieve stress.

Preferably, polyimide may be used for the stress relieving layer 150. In this case, the polyimide has a coefficient of thermal expansion of 20 to 30 ppm/K or less, and a glass transition temperature (Tg) of 300° C. ≤ Tg ≤ 350° C. As a result, it may be lower than the maximum curing temperature.

In particular, a filler 152 for increasing or decreasing the coefficient of thermal expansion of the stress relieving layer 150 may be included in the stress relieving layer 150 .

The filler 152 may contain a material selected from the group consisting of expanded graphite, graphene, carbon fiber, carbon nanofiber, zinc oxide, zirconium oxide and silica. can

Further, the filler 152 may be formed in a spherical shape, a rod shape, a needle shape, a planar shape, a laminated planar shape, or a spindle shape.

The second non-conductive adhesive layer 160 may be formed of the same material as the first non-conductive adhesive layer 130 .

The protective film 160 is attached to be removable.

Referring to FIG. 2 , the RFID label tag 100 may be formed to include an inlay tag 140 therein. As described above, the inlay tag 140 includes an RFID chip 141 capable of inputting product information and an antenna 142 as shown in FIG. 2 .

Referring to FIG. 3 , the RFID label tag 100 may be attached to the label paper 110 and manufactured in the form of a roll. As shown in FIG. 3 , a plurality of RFID label tags 100 are attached to the label paper 110 , and the label paper 110 is wound in a roll shape so that it can be easily attached using an auto labeler or the like in the subsequent distribution process. can

A method of manufacturing an RFID label tag according to the present invention will be described with reference to FIG. 4 as follows.

First, the roll-shaped label paper 110 is supplied (S110).

Next, a first non-conductive adhesive layer 130 is formed on the upper surface of the label paper 110 (S130).

Next, the antenna 142 including the RFID chip 141 is attached to the printed inlay tag 140 on the non-conductive adhesive layer 130 (S140). Here, the RFID chip 141 is encoded using a predetermined RF device.

For example, the antenna 142 is made of a metal component made of electronic ink, copper, or aluminum formed by a printing method, and the material of the inlay tag 140 including the antenna 142 is paper or PET (polyethylene terephthalate). ) and PI.

Forming the first non-conductive adhesive layer 130 is to laminate a non-conductive adhesive film selected from an acrylic double-sided adhesive film, a hot melt type EVA double-sided adhesive film, and a butyl rubber adhesive film, or an acrylic adhesive, a hot melt type EVA adhesive, butyl It can be achieved by spraying a non-conductive adhesive selected from rubber-based spray-type adhesives.

In particular, the RFID label tag 100 may be attached after forming the anti-adhesive layer 120 on the label paper 110 so that it can be removed, that is, detachable. To this end, the step ( S120 ) of forming the anti-adhesion layer 120 between the anti-adhesion layer 120 and the inlay tag 140 may be included.

Next, a stress relieving layer 150 made of a material for relieving stress with a conductive material constituting the antenna 142 is formed on the inlay tag 140 ( S150 ).

As described above, the stress relieving layer 150 may include a filler 152 for increasing or decreasing the thermal expansion coefficient of the stress relieving layer 150 .

The filler 152 may contain a material selected from the group consisting of expanded graphite, graphene, carbon fiber, carbon nanofiber, zinc oxide, zirconium oxide, and silica.

Also, the filler 152 may be formed in a spherical shape, a rod shape, a needle shape, a planar shape, a laminated planar shape, or a spindle shape.

Next, a second non-conductive adhesive layer 160 is formed on the stress relief layer 150 (S160).

Next, a protective film 170 is attached on the second non-conductive adhesive layer 160 (S170).

After the protective film 170 is removed, it may be deposited on the product for product inventory management and the like.

In another embodiment, an ultraviolet curing resin layer 180a for protecting the inlay tag 140 may be additionally formed between the stress relieving layer 150 and the second non-conductive adhesive layer 160 .

The process of forming the ultraviolet curing resin layer 180a will be described with reference to FIG. 5 as follows.

First, an ultraviolet curable resin solution 180 is coated on the stress relieving layer 150 ( FIG. 5A ).

The UV-curable resin solution 180 is not particularly limited in its components or content, but may have a water-soluble or water-dispersible (emulsion) form composed of an acrylic oligomer, a reactive diluent, and a photoinitiator.

Next, while spraying an inert gas 181 between the UV curable resin solution 180 and the transmissive film 190, the transmissive film 190 is attached and compressed on the UV curable resin solution 180 (FIG. 5b). Here, the transmissive film 190 may attach and compress the transmissive film 190 on the UV curable resin solution 180 using a pressing roll, and between the UV curable resin solution 180 and the transmissive film 190 . By increasing the adhesion, it is possible to prevent contact between the UV-curable resin solution 180 and oxygen. The compression roll may be a metal roll or a rubber roll. Specifically, a rubber roll may be used, which can flexibly pressurize the UV curable resin liquid 180 compared to a metal roll.

The inert gas 181 may mean a chemically inert gas, a dilution gas containing nitrogen may be used, and may be sprayed between the ultraviolet curable resin solution 180 and the transmissive film 190 . Accordingly, an inert gas may be filled between the ultraviolet curable resin liquid 180 and the transmissive film 190 to form an inert gas layer, and through this, the ultraviolet curable resin liquid 180 and oxygen during ultraviolet curing while moving at a high speed contact can be prevented.

Since the transmissive film 190 has to transmit ultraviolet rays during UV curing, a film having a light transmittance of 70% or more may be used, for example, 80% or more or 90% or more.

Next, the ultraviolet curable resin liquid 180 is cured by irradiating ultraviolet rays to form the ultraviolet curable resin layer 180a ( FIG. 5C ).

After the step of forming the ultraviolet curing resin layer 180a, the step of removing the transmissive film 190 may be further included (FIG. 5D).

In this way, by injecting the inert gas 181 between the ultraviolet curable resin liquid 180 and the transmissive film 190, contact between the ultraviolet curable resin liquid 180 and oxygen during ultraviolet curing can be prevented, and thus the surface hardness is increased. An improved ultraviolet curing resin layer 180a may be formed. That is, the oxygen concentration of the ultraviolet curing resin layer 180a is low, so that high surface hardness can be realized. This makes it possible to prevent damage to the RFID label tag 100 even when the RFID label tag 100 is used in a serious environment.

Those of ordinary skill in the art to which the present invention pertains will understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention. should be interpreted

110: label paper
120: anti-adhesion layer
130: first non-conductive adhesive layer
140 : inlay tag
150: stress relief layer
160: second non-conductive adhesive layer
170: protective film

Claims (6)

supplying a roll-type label paper;
forming a first non-conductive adhesive layer on the upper surface of the label paper;
attaching an antenna-printed inlay tag including an RFID chip on the non-conductive adhesive layer;
forming a stress relieving layer made of a material for relieving stress with a conductive material constituting the antenna on the inlay tag;
forming a second non-conductive adhesive layer on the stress relief layer; and
and attaching a protective film on the second non-conductive adhesive layer,
A filler for increasing or decreasing the coefficient of thermal expansion of the stress relieving layer is included in the stress relieving layer,
Polyimide having a coefficient of thermal expansion of 20 to 30 ppm/K or less and a glass transition temperature (Tg) of 300° C. ≤ Tg ≤ 350° C. may be used for the stress relieving layer,
The filler contains a material selected from the group consisting of expanded graphite, graphene, zinc oxide and zirconium oxide,
The filler is formed in a needle shape, a planar shape, a laminated planar shape or a spindle shape,
The method further comprising the step of further forming an ultraviolet curable resin layer for protection of the inlay tag between the stress relief layer and the second non-conductive adhesive layer, wherein the further forming of the ultraviolet curable resin layer comprises:
coating an ultraviolet curable resin solution on the stress relieving layer;
while spraying an inert gas between the UV curable resin solution and the transparent film, attaching and pressing the transparent film on the UV curable resin solution; and
A method of manufacturing an RFID label tag having excellent stress relieving properties, comprising the step of curing the ultraviolet curable resin solution by irradiating ultraviolet rays to form an ultraviolet curable resin layer. delete delete delete delete According to claim 1,
The antenna is composed of a metal component made of electronic ink, copper or aluminum material formed by a printing method,
The method of manufacturing an RFID label tag having excellent stress relieving properties, characterized in that the material of the inlay tag including the antenna is selected from paper, polyethylene terephthalate (PET), and polyimide (PI).

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