TWM393745U - Structure for removing failure type RFID tag - Google Patents

Structure for removing failure type RFID tag Download PDF

Info

Publication number
TWM393745U
TWM393745U TW99212838U TW99212838U TWM393745U TW M393745 U TWM393745 U TW M393745U TW 99212838 U TW99212838 U TW 99212838U TW 99212838 U TW99212838 U TW 99212838U TW M393745 U TWM393745 U TW M393745U
Authority
TW
Taiwan
Prior art keywords
radio frequency
layer
surface layer
printed antenna
printed
Prior art date
Application number
TW99212838U
Other languages
Chinese (zh)
Inventor
tai-hua Liu
Yong-Shu Yang
Original Assignee
Epc Solutions Taiwan Inc
Polychem Uv Eb Internat Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45082566&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWM393745(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Epc Solutions Taiwan Inc, Polychem Uv Eb Internat Corp filed Critical Epc Solutions Taiwan Inc
Priority to TW99212838U priority Critical patent/TWM393745U/en
Publication of TWM393745U publication Critical patent/TWM393745U/en

Links

Landscapes

  • Credit Cards Or The Like (AREA)

Description

M393745 五、新型說明: 【新型所屬之技術領域】 本創作係錢-種無線_觸電子職結構,可 止無線射頻辨識電子標籤的功能遭到轉移,尤其是具移除 便會使無線射頻辨識電子標籤失效的結構。 【先前技術】 近年來,隨著半導體產業進步以及相電子技術的開 發,使得利用無線射頻識別(Radi〇 FrequencyM393745 V. New Description: [New Technology Field] This creation is a kind of wireless-touch electronic structure, which can prevent the function of RFID tags from being transferred, especially if it is removed, it will make RFID. The structure of the electronic tag failure. [Prior Art] In recent years, with the advancement of the semiconductor industry and the development of phase electronic technology, the use of radio frequency identification (Radi〇 Frequency)

Identification,RFID)結合電子標籤(Label/Tag)而形成 ,線射頻辨識電子標籤⑽ID Tag)的技術已相當成熟,可 藉掃讀器(Reader)遠距讀取電子標籤的資料,比如密碼、 商品編碼或商品價格。利用先進半導體製程所生產的無線 射頻晶片(RFIC) ’不僅具有高度整合性的無線射頻識別功 能且體積非常小。電子標籤一般包含無線電收發功能的發 射窃及接收态,同時具有資訊儲存功能,比如儲存密碼、 商品編碼或商品價格。 與條碼(Barcode)比較,無線射頻辨識電子標籤具有 體積小、主動式提供資訊、耐久性佳、記憶資料容量大、 速度快與安全性高的優點,比如體積可達厚度僅有 0.1mm、面積為〇, 4mm X 0.4腿,以無線方式自動偵測並讀 取資料’適用於下雨、潮濕、搬運的惡劣環境,可重複使 用數十萬甚至數百萬次以上,辨識讀取速度每秒可達250 個標籤以上,且不容易被偽造。因此已廣泛的應用於許多 領域’具有逐步取代條碼的趨勢,朝向更加自動化的趨 3 勢’藉以提1¾管理效率、節省人力並避免人為的失誤。 目前,無線射頻辨識電子標籤依據不同無線頻段已成 功的應用於ό争夕領域’比如在低頻(l〇w Frequency,LF) 方面,有寵物、門禁管制和防盜追蹤,在中高頻(犯油 Frequency,HF)方面,有生產管制卡、會員卡、識別證、 飛機機票、建築物出入管理、智慧卡與圖書館管理系統, 在超高頻(Ultra High Frequency,UHF)方面,有供應鏈 管理,在微波(Mircowave)方面,有電子收費系統 (Electronic Toll Collection,ETC)與及時定位系統 (Real-Time Locating System , RTLS)。 然而,上述習用技缺點為,無線射頻辨識電子標 籤很容易受外力剝離開原物品而被黏貼到另一物品上繼 績使用辨4功能,比如具無線射頻職電子標籤的識別證 會因遺失而被他人將無線射頻辨識電子賴貼附到另一 識別證上以盜用原有者的身份進出管制場所或具有原產 地辨識碼的無線射頻辨識電子標籤被撕下後轉貼到仿冒 品上,藉以冒用原產品的產地證明。 口此$要雜有倾魏以防止無騎頻辨識電 子標籤被冒_結構,使無線射頻辨識電子標_益線射 頻辨識裝置的魏無法❹_,尤其是具村在被移除 後使無線射鑛識電子賴失_結構,赌決 技術的問題。 【新型内容】 本創作之主要目的在提供一種移除失效型無線射頻 M353745 Γ戠結構,包括表面層、印刷天線、無線射頻晶 面声上者二ΐ型層’其中印刷天線與無線射頻晶片在表 3亚相互电氣連接,接著層覆蓋表面層 ===離型層位於接著層上,因此印刷天線: j射頻4破夾在表面層與接著層之間。使 著層黏著在物品上,使印刷天線與無線 射1片所構成之絲棚辨贼鋼定在祕品上。告 除時,接著層黏著住印刷天線與無線:Identification, RFID) combined with electronic tags (Label/Tag), the technology of line radio frequency identification electronic tag (10) ID Tag) is quite mature, and can read the electronic tag data remotely by reader (Reader), such as password, commodity Coding or commodity price. Wireless RF wafers (RFICs) manufactured using advanced semiconductor processes are not only highly integrated, but also very small. Electronic tags generally contain the radio transmission and reception functions of the radio transmission and reception functions, as well as information storage functions such as storage passwords, commodity codes or commodity prices. Compared with Barcode, RFID tags have the advantages of small size, active information, durability, memory capacity, speed and safety. For example, the volume can reach only 0.1mm in thickness. For 〇, 4mm X 0.4 legs, wirelessly automatically detect and read data 'suitable for rain, humidity, handling harsh environment, can be reused hundreds of thousands or even millions of times, recognize reading speed per second Up to 250 tags and not easily forged. As a result, it has been widely used in many fields, with the trend of gradually replacing bar codes, towards a more automated trend to improve management efficiency, save manpower and avoid human error. At present, RFID tags have been successfully applied in the field of ό 夕 ' according to different wireless bands. For example, in the low frequency (LF), there are pets, access control and anti-theft tracking, in the middle and high frequency (Frequency of the oil) , HF), there are production control cards, membership cards, identification cards, airline tickets, building access management, smart cards and library management systems, in the ultra high frequency (UHF), there are supply chain management, In terms of microwave (Mircowave), there are Electronic Toll Collection (ETC) and Real-Time Locating System (RTS). However, the above-mentioned conventional technical disadvantage is that the RFID tag is easily peeled off by the external force and is pasted onto another item. The successor uses the function of distinguishing 4, for example, the identification card with the radio frequency occupational electronic tag is lost due to loss. Others attach the RFID card to another identification card to steal the identity of the original person. The RFID tag with the origin identification code is torn off and then posted to the counterfeit goods, thereby fraudulent use. Proof of origin of the original product. The mouth of this $ should be mixed with Wei to prevent the radio frequency identification of the electronic tag from being _ structure, so that the radio frequency identification electronic standard _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Mining knowledge electronics lost _ structure, gambling technology problems. [New content] The main purpose of this creation is to provide a structure for removing the failed radio frequency M353745, including surface layer, printed antenna, and radio frequency crystal surface acoustic layer. The printed antenna and the radio frequency chip are in the Table 3 sub-interconnects electrically, and then the layer covers the surface layer === the release layer is on the subsequent layer, so the printed antenna: j RF 4 is broken between the surface layer and the subsequent layer. The layer is adhered to the article, so that the printed antenna and the wireless frame of the wire frame are formed on the secret. When the advertisement is removed, the layer is adhered to the printed antenna and wireless:

ϋ 部且娜在物品上,而被移除的部分 * ·,,、完整的_天線與無線射·片所構成可工作的無 線射頻辨識裝置’而不具有無線軸_魏,進而防止 =麵識裝置被惡意剝離而移置到另一物品上繼續ϋ Part and Na are on the item, and the removed part * ·,,, the complete _ antenna and the radio shot form a working radio frequency identification device' without the wireless axis _ Wei, and thus prevent The device is maliciously stripped and moved to another item to continue

本創作之^-目的在提供—種移除失效型無線射頻辨識 電子標籤結構’係包括表面層、印刷天線、無線射頻晶片及接 著層其巾印刷天線與無線射頻晶#位於表面層上,而接著層 可包括感壓朦(Pressure Sensitive Adhesive)、無基材型雙 面膠、熱熔膠、光硬化接著劑、常溫硬化接著劑、熱硬化接著 劑、雙液雖著舰溶翻接錢,係在朗前才㈣在表面 層、印刷天線及無線射頻晶片上,藉以黏接在物品上,使印刷 天線與無線射頻晶片固定在該物品上。當該結構被剝離開該物 品時’全部或一部分的印刷天線與無線射頻晶片所構成的無線 射頻辨識裝置會殘留在接著層上,並仍一起黏在該物品上,而 受到移除的表面層上因沒有或無完整由印刷天線與晶片所構 5 M3.93745 成可工叙鱗觀_妓,Μ料鱗棚顺功能, 使無線射麵識裝置的械無妓到轉移。喊·物品上的 無線射頻⑼與印刷天線會隨表面層與接著層被獅時而被 分離’因此印刷天線與無線射頻晶片之間的電氣連接被破壞, 而使無線射頻辨識裝置的功能失效。 【實施方式】The purpose of the present invention is to provide a method for removing a failed radio frequency identification electronic tag (including a surface layer, a printed antenna, a radio frequency chip, and a layer of a printed antenna and a radio frequency crystal on the surface layer, and The layer may include Pressure Sensitive Adhesive, non-substrate type double-sided tape, hot melt adhesive, photo-curing adhesive, room temperature hardening adhesive, heat hardening adhesive, and double-liquid. Before the front (4) on the surface layer, the printed antenna and the radio frequency chip, it is adhered to the article to fix the printed antenna and the radio frequency chip on the article. When the structure is peeled off, the RFID device consisting of all or part of the printed antenna and the radio frequency chip will remain on the adhesive layer and still adhere to the article together, and the removed surface layer Because there is no or no completeness, the 5 M3.93745 of the printed antenna and the wafer is made into a workable squad, and the shovel is used to make the wireless surface-detecting device inaccessible. The radio frequency (9) and the printed antenna on the item are separated from the lion by the surface layer and the subsequent layer. Therefore, the electrical connection between the printed antenna and the radio frequency chip is destroyed, and the function of the radio frequency identification device is disabled. [Embodiment]

以下配合圖式及元件符號對本創作之實施方式做更詳 細的制’俾使熟㈣·藝者麵讀本朗紐能據 TL^C Λ ^ ^ 谨m 失效___電子標籤結 構構的U,第-騎示,本創作的 細識電子標賴構包絲崎1Q、_ 線$ 口30、接著層40及離型層50,其中表面層^The following is a more detailed system for the implementation of this creation with the following diagrams and component symbols. 俾 熟 ( 四 四 四 四 四 四 纽 纽 纽 纽 ^ ^ ^ ^ ^ ^ ^ ^ The first-riding indication, the creation of the electronic identification of the electronic standard 构 丝 silk silk 1Q, _ line $ mouth 30, the next layer 40 and the release layer 50, of which the surface layer ^

有=-表面及第二表面,且互為相對面,在此第—表面朝上 朝下,印刷天線20與無線射頻晶片30在表面層 面上’並相互電氣連接而形成無線射頻辨識 (RFIDU置’接者層4G覆蓋表面層1G的第—表面印刷天 線20及無線射頻晶片3〇,離型層5()位於接著層別上 此印刷天線20與無線射頻晶片3〇位於表面層^盘接著芦 40之間。無線射頻晶片可為含無線射頻晶片之帶型⑽/ 血即),另—方式是,無線射頻晶片可為印刷式RFICY 在。使用時’可剝離開離型層5〇,直接利用接著層4〇黏著 在物°口上,使印刷天線20與無線射頻晶片30所形成的無線 6 射頻辨識裝置固定在該物品上。 接著層為顏膠(P職ure Sensitive Adhesive)且接著 層的接著強度需滿足以下條件的至少其中之一: 1.大於或等於該表面層的材料強度; 2‘大於或等於該印刷天線的材料強度; 3.大於或等於該印刷天線對該表面層的附著強度; 4·大於或等於該無線射頻晶㈣該表面層_著強度; 5.大於或等於s亥無線射頻晶片對該印刷天線的附著強度。 表面層包括植物纖維、人造纖維及塑料所製成之材料 ,其中之一 ’且表面層可進一步包括印刷條碼、數字、文 字或圖形。無線射頻晶片的工作頻率包括高頻㈣、超高 頻(UHF)以及微波的其中之_。 ° 印刷天線係使用導電油墨,以印刷以及塗佈方式的其 中之-而形成,且導電油墨可包括含銀之熱固型導電油墨 以及紫外線固化型導電油墨的其中之一。離型紙包括且有 離型效果之塑㈣膜,比如聚對苯二曱酸乙二醇醋(pE、 薄膜。 本創作的主要特點是’當該移除失效型無線射頻辨識 電子標籤結構受外力而移除時,接著層、印刷天線與無線 射頻晶片所構成的無線射_識裝置的全部或一部分仍 黏著在该物品的表面上’而受到移除的表面層沒有或無完 整由印刷天線與晶片所構柄可工作之無線射頻辨識裝 置而不具有無線射頻辨識功能,而殘留於物品上的無線射 頻晶片與_天線會隨表面層無著賴姆時而被分 離,因此印刷天線與無線射頻晶片之間的電氣連接被破 壞,而使無線射頻辨識裝置的功能失效,進而防止無線射 頻辨識裝置被惡意剝離而移置到另一物品上繼續使用。 參閱第二圖’本創作另一實施例移除失效型無線射頻 辨識電子標籤結構的示意圖。如第二圖所示,本創作另一 實施例的移除失效型無線射頻辨識電子標籤結構包括表 面層10、印刷天線20、無線射頻晶片30及接著層42,其 中表面層10、印刷天線20及無線射頻晶片30係類似於第 一圖的實施例’而接著層42為接著劑,可包括感廢膠 (Pressure Sensitive Adhesive)、無基材型雙面膠、熱 熔膠、光硬化接著劑、常溫硬化接著劑、熱硬化接著劑、 雙液型接劑以及溶劑型接著劑的其中之一。 接著層42係在使用本實施例的移除失效型無線射頻 辨識電子標籤結構前,才塗佈在表面層1〇的第一表面、 印刷天線20及無線射頻晶片30上,藉以黏著在物品上, 使印刷天線2G與歸侧晶# 30卿朗無線射頻辨識 裝置固定在該物品上。黏著在物品上,使印刷天線2〇與 無線射頻晶片30所形成的無線射頻辨識裝置固定在該 品上。 μ 如果本實施例的移除失效型無線射頻辨識電子桿籤 結構受外力而移除時’接著層會黏住印概線與晶/的全 ϋ部分並黏在物品的表面上,而受到移除的表面 又有或無完整的刷天線與絲射頻以所構成的可 工作之無線射頻辨識裝置而不具有無線射頻辨識^能/進 而防止無線_靡^置被惡_麵移朗另 上_使用。而殘⑽物品上的無線射頻晶^與印刷天線 M3P3745 會隨表面層與接著層被剝離時而被分離,因此印刷天線與 無線射頻晶片之間的電氣連接被破壞,而使無線射頻晶片 的功能失效。 以上所述者僅為用以解釋本創作之較佳實施例,並 非企圖據以對本創作做任何形式上之限制,是以,凡有 在相同之創作精神下所作有關本創作之任何修飾或變 更,皆仍應包括在本創作意圖保護之範疇。There are =-surface and second surface, and opposite sides, where the first surface is facing up, the printed antenna 20 and the radio frequency chip 30 are 'on the surface level' and are electrically connected to each other to form a radio frequency identification (RFIDU set) The connector layer 4G covers the first surface printed antenna 20 of the surface layer 1G and the radio frequency chip 3, and the release layer 5 () is located on the subsequent layer. The printed antenna 20 and the radio frequency chip 3 are located on the surface layer. Between the 40. The radio frequency chip can be a band type (10)/blood containing a radio frequency chip, and the other way, the radio frequency chip can be a printed RFICY. In use, the peelable open-type layer 5 is directly adhered to the object by the adhesive layer 20, and the wireless antenna device formed by the printed antenna 20 and the radio frequency chip 30 is fixed on the article. Then the layer is ure Sensitive Adhesive and the bonding strength of the bonding layer is required to satisfy at least one of the following conditions: 1. greater than or equal to the material strength of the surface layer; 2' greater than or equal to the material of the printed antenna 3. The intensity is greater than or equal to the adhesion strength of the printed antenna to the surface layer; 4· is greater than or equal to the radio frequency crystal (4) the surface layer _ the strength; 5. greater than or equal to the shai radio frequency wafer for the printed antenna Adhesion strength. The surface layer comprises a material made of plant fibers, rayon and plastic, one of which' and the surface layer may further comprise printed barcodes, numbers, text or graphics. The operating frequency of the radio frequency chip includes high frequency (four), ultra high frequency (UHF) and microwave. The printed antenna is formed using a conductive ink, which is formed by printing and coating, and the conductive ink may include one of a silver-containing thermosetting conductive ink and an ultraviolet curable conductive ink. The release paper includes a plastic (4) film with a release effect, such as polyethylene terephthalate (pE, film. The main feature of this creation is 'When the removal of the failed radio frequency identification electronic tag structure is subjected to external forces When removed, all or a portion of the wireless imaging device formed by the layer, the printed antenna and the radio frequency chip is still adhered to the surface of the article' and the removed surface layer is not or completely intact by the printed antenna and The radio frequency identification device in which the handle of the wafer is operable does not have the radio frequency identification function, and the radio frequency chip and the _ antenna remaining on the article are separated when the surface layer is free of ray, so the printed antenna and the radio frequency The electrical connection between the wafers is broken, and the function of the RFID device is disabled, thereby preventing the RFID device from being maliciously stripped and being displaced to another item for continued use. Referring to the second figure, another embodiment of the present creation A schematic diagram of removing a failed radio frequency identification electronic tag structure. As shown in the second figure, another embodiment of the present invention removes the failed wireless The frequency identification electronic tag structure comprises a surface layer 10, a printed antenna 20, a radio frequency chip 30 and an adhesive layer 42, wherein the surface layer 10, the printed antenna 20 and the radio frequency chip 30 are similar to the embodiment of the first figure and the layer 42 As an adhesive, it may include Pressure Sensitive Adhesive, non-substrate double-sided tape, hot melt adhesive, photo-curing adhesive, room temperature hardening adhesive, heat hardening adhesive, two-liquid adhesive, and solvent type. One of the subsequent agents. The layer 42 is applied to the first surface of the surface layer 1 , the printed antenna 20 , and the radio frequency wafer 30 before using the removal-type radio frequency identification electronic tag structure of the present embodiment. In order to adhere to the article, the printed antenna 2G and the side-side crystal radio frequency identification device are fixed on the article, and the radio frequency formed by the printed antenna 2 and the radio frequency chip 30 is adhered to the article. The identification device is fixed on the product. μ If the structure of the removal-type radio frequency identification electronic pole sign of the embodiment is removed by an external force, the adhesive layer adheres to the printed line and the crystal/ The ϋ part is adhered to the surface of the article, and the removed surface has or does not have a complete brush antenna and wire RF to form a working radio frequency identification device without radio frequency identification. _靡^ Placed by 恶 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The electrical connection between the two is broken, and the function of the radio frequency chip is disabled. The above is only a preferred embodiment for explaining the present invention, and is not intended to impose any form restrictions on the present creation. Any modification or alteration of the creation made in the same creative spirit should still be included in the scope of protection of this creation.

【圖式簡單說明】 第一圖為本創作移除失效型無線射頻辨識電子標籤咭構 的示意圖。 、’'σ 弟t圖為本創作另一實施例移除失效型無線射頻辨識電 子榡籤結構的示意圖。 要元件符號說明】 表面層 20印刷天線 30無線射頻晶片(RFIC) 40接著層 42接著層 5〇離型層 9[Simple description of the diagram] The first figure is a schematic diagram of the structure of the failed radio frequency identification electronic tag removed. The ''σ t t diagram is a schematic diagram of another embodiment for removing the invalid radio frequency identification electronic signature structure. Description of the symbol of the component] Surface layer 20 Printed antenna 30 Radio frequency chip (RFIC) 40 Next layer 42 Next layer 5〇 Release layer 9

Claims (1)

六、申請專利範圍: 1. 一種移除失效型無線射頻辨識電子標籤結構,包括: 一表面層,具有-第-表面及-第二表面,且互為相對面’· 一印刷天線,位於該表面層的第一表面上; 一無線射頻晶以RFIC),位於該表面層的第—表面上,並電氣 連接至該印刷天線,以形成一無線射頻辨識(_)裝置;电乳 一接著層’係覆蓋縣面層㈣-表面、該_天線及該 射頻晶片;以及 & 一離型層,位於該接著層上; 其中該接著層的接著強度滿足以下條件的其中之一: 大於或專於該表面層的材料強度; 大於或等於該印刷天線的材料強度; 大於或等於該印刷天線對該表面層的附著強度; 大於或等_絲麵^賴表面層_著強度; 大於或等於絲線義晶片_印獻線_著強度。 2·依射請專利翻第丨項所述之結構,其中該接著層為感麵 (Pressure Sensitive Adhesive) 〇 3.依據申請專利範圍第1項所述之結構,其中該表面層包括植物 纖維、人造纖維及塑料其中之一所構成。 4沒據f __第1摘述之結構,其f無線誦晶片為含 無線射頻晶片之帶型(RFIC strap)。 5·依據申請專利細第丨項所述之結構,其中該無線賴晶片的 工作頻率包括高頻(HF)、超高頻(UHF)以及微波(Micr〇wave)的 其中之一。 6. 依據申請專利細第1 _述之結構,其t該印刷天線係使用 導電油墨,以印刷以及㈣方式的齡之—而形成。 7. 依據申請專利範圍第6項所述之結構,其令該導電油墨包括含 銀之熱固型導電油墨以及紫外線固化型導電油墨的其中之一。 &依據申請糊顧第丨柄述之結構,其㈣_層包括具有 離型效果之塑膠薄膜。 9.依據中請專概_丨綱狀結構,射無線賴晶片為印 刷式RFIC。 10· -種移除纽型鱗射頻辨識電子顧結構,包括: 一表面層,具有-第-表面及—第二表面,且互為相對面; 一印刷天線,位於該表面層的第—表面上; :無線棚晶片,位於該表面層㈣—表面上,並電氣連接至 S亥印刷天線,以形成一無線射頻辨識裝置;以及 -接著層,储佈在絲㈣的第—表面、該印獻線及該無 線射頻晶片上,' 其中該接著層的接著強度滿足以下條件的其中之一: 大於或等於該表面層的材料強度; 大於或等於该印刷天線的材料強度; 大於或等於該印刷天線對該表面層的附著強度; 大於或等於該無線表面層的附^強度; M393745 大於或等於該無線射頻“對該印刷天線_著強度; 。亥和除失效型無線揀辨識電子標籤結構在使用前塗佈 δ亥接著層,且黏著在一物品的表面上。 11.依據申請專利範圍第1G項所述之結構,其找接著層為接著 劑’而該接著劑包括感塵雜職咖^沿⑽邊㈣⑻、 . 鱗膠、光硬化接著劑、常溫硬化接、熱硬化接著劑、雙 • 液型接劑以及溶劑型接著劑的其中之一。 籲I2·依據申請專利範圍第10項所述之結構,其中該表面層包括植 物纖維、人造纖維及塑料的其中之一所構成。 13. 依據申請專纖圍第1Q項所述之結構,其中無線射頻晶片為 含無線射頻晶片之帶型。 14. 依據申請專利範圍第1Q項所述之結構,其t該無線射頻晶片 的工作頻率包括高頻、超高頻以及微波的其中之—。 .15.依射請專利範圍第10項所述之結構,其中該印刷天線係使 鲁用含銀之熱固型導電油墨以及紫外線固化型導電油累、的其中 之一,以印刷以及塗佈方式的其中之一而形成。 16.依據申請專利範圍第10項所述之結構,其中無線射頻晶片為 印刷式RFIC。 ' 12Sixth, the scope of application for patents: 1. A structure for removing a failed radio frequency identification electronic tag, comprising: a surface layer having a -first surface and a second surface and opposite sides of each other'· a printed antenna located at the a first surface of the surface layer; a radio frequency crystal (RFIC), located on the first surface of the surface layer, and electrically connected to the printed antenna to form a radio frequency identification (_) device; a system covering the county surface layer (four)-surface, the antenna and the radio frequency wafer; and < a release layer on the subsequent layer; wherein the adhesion strength of the adhesion layer satisfies one of the following conditions: The material strength of the surface layer; greater than or equal to the material strength of the printed antenna; greater than or equal to the adhesion strength of the printed antenna to the surface layer; greater than or equal to the surface of the surface of the printed surface _ the strength; greater than or equal to the thread Yi wafer _ printed line _ with strength. 2. The structure of the invention according to the third aspect of the invention, wherein the adhesive layer is a pressure sensitive surface (Pressure Sensitive Adhesive). The structure according to claim 1, wherein the surface layer comprises plant fibers, Made up of one of man-made fibers and plastics. 4 According to the structure of f __1, the f wireless 诵 wafer is a RFIC strap containing a radio frequency chip. 5. The structure according to the application specification, wherein the operating frequency of the wireless ray wafer comprises one of high frequency (HF), ultra high frequency (UHF) and microwave (Micr 〇 wave). 6. According to the structure of the patent application 1st, the printed antenna is formed using conductive ink in the form of printing and (4). 7. The structure according to claim 6, wherein the conductive ink comprises one of a silver-containing thermosetting conductive ink and an ultraviolet curable conductive ink. & (4) _ layer includes a plastic film having a release effect, depending on the structure of the application. 9. According to the special _ 丨 状 structure, the wireless ray wafer is a printed RFIC. 10·- removing a neon-scale radio frequency identification electronic structure, comprising: a surface layer having a -first surface and a second surface opposite each other; a printed antenna located on the first surface of the surface layer : a wireless shed wafer on the surface layer (four) - surface, and electrically connected to the S Hai printed antenna to form a radio frequency identification device; and - an adhesive layer, stored on the first surface of the wire (four), the print On the wire and the radio frequency wafer, 'where the bonding strength of the bonding layer satisfies one of the following conditions: greater than or equal to the material strength of the surface layer; greater than or equal to the material strength of the printed antenna; greater than or equal to the printing The adhesion strength of the antenna to the surface layer; greater than or equal to the attachment strength of the wireless surface layer; M393745 is greater than or equal to the radio frequency "the intensity of the printed antenna"; Applying a layer of δH before use and adhering to the surface of an article. 11. According to the structure described in the scope of claim 1G, the adhesive layer is an adhesive. 'The binder includes a dusty miscellaneous coffee ^ along the side of the (10) side (four) (8), one of the scale rubber, the photohardening adhesive, the room temperature hardening joint, the heat hardening adhesive, the double liquid type bonding agent, and the solvent type adhesive. The structure according to claim 10, wherein the surface layer comprises one of plant fibers, man-made fibers and plastics. 13. According to the structure described in claim 1Q of the special fiber, The radio frequency chip is a belt type including a radio frequency radio chip. 14. According to the structure described in claim 1Q, the operating frequency of the radio frequency chip includes high frequency, ultra high frequency and microwave. .15. The structure of claim 10, wherein the printed antenna is used for printing and coating one of a silver-containing thermosetting conductive ink and an ultraviolet curable conductive oil. Formed according to one of the modes. 16. The structure according to claim 10, wherein the radio frequency chip is a printed RFIC. ' 12
TW99212838U 2010-07-06 2010-07-06 Structure for removing failure type RFID tag TWM393745U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99212838U TWM393745U (en) 2010-07-06 2010-07-06 Structure for removing failure type RFID tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99212838U TWM393745U (en) 2010-07-06 2010-07-06 Structure for removing failure type RFID tag

Publications (1)

Publication Number Publication Date
TWM393745U true TWM393745U (en) 2010-12-01

Family

ID=45082566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99212838U TWM393745U (en) 2010-07-06 2010-07-06 Structure for removing failure type RFID tag

Country Status (1)

Country Link
TW (1) TWM393745U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556176B (en) * 2011-07-04 2016-11-01 Toyo Aluminium Kk RFID entry antenna and RFID for its use
TWI609329B (en) * 2016-12-19 2017-12-21 韋僑科技股份有限公司 Rfid device and method for making the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556176B (en) * 2011-07-04 2016-11-01 Toyo Aluminium Kk RFID entry antenna and RFID for its use
US10020568B2 (en) 2011-07-04 2018-07-10 Toyo Aluminium Kabushiki Kaisha RFID inlet antenna and RFID employing same
TWI609329B (en) * 2016-12-19 2017-12-21 韋僑科技股份有限公司 Rfid device and method for making the same
US10166707B2 (en) 2016-12-19 2019-01-01 Securitag Assembly Group Co., Ltd RFID device and method for making the same

Similar Documents

Publication Publication Date Title
US7843341B2 (en) Label with electronic components and method of making same
US9836688B2 (en) System, method, and apparatus for RFID hang tag
US20070095922A1 (en) Information carrier, information recording medium, sensor, commodity management method
WO2008079556A2 (en) A tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
US20230107502A1 (en) Composite merchandise label constructions
EP0827108B1 (en) Non-contact type data carrier label
JP2000105807A (en) Label type noncontact data carrier
US20020167407A1 (en) Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner
JP2000251046A (en) Noncontact ic tag
TWM393745U (en) Structure for removing failure type RFID tag
CN211979697U (en) Communication anti-counterfeiting verification electronic tag with shielding function
Adams Pharmaceutical manufacturing: RFID–reducing errors and effort
CN205721897U (en) RFID anti-metal electronic tag
CN210038851U (en) Ultrathin portable multilayer logistics electronic tag
CN205354087U (en) Electronic label
CN107451649A (en) Electronic tag and preparation method thereof
CN201576301U (en) Wireless radio frequency identification e-tag becoming invalid once removed
CN103662331B (en) A kind of packaging bag with dismantling-proof radio frequency identification tag
US20090153299A1 (en) Wrapping with Antenna
KR200461740Y1 (en) Rfid tag for a clothing
JP4482687B2 (en) IC tag and home delivery slip with IC tag
CN218768205U (en) NFC tag
CN105631506A (en) Anti-counterfeiting volume label structure and manufacturing method thereof
CN212208343U (en) RFID electronic tag based on thermal paper
JP2014160174A (en) IC tag label

Legal Events

Date Code Title Description
MC4K Revocation of granted utility model