KR102375418B1 - Epoxy Molding Compound for Electromagnetic Shielding and Shielding Device including the same - Google Patents

Abstract

The present invention, in order to achieve the above object, the surface of the magnetic material is coated with an insulating layer (insulation layer) a magnetic filler; binders; additive; And it provides an EMC (epoxy moiding compound) composition for shielding EMI comprising a filler.
According to the present invention, by using the magnetic powder with surface insulation in the EMC molding material, the EMC composition that increases the EMI dispersion and scattering effect from the EMI source reduces performance through electromagnetic EMI shielding for each device and reduces performance. It is possible to provide an electronic shielding device that minimizes malfunctions, and at the same time, it is possible to obtain light weight, process simplification, cost reduction and high-functional shielding effect compared to the existing process.

Description

EMC composition for EMI shielding and electronic shielding device including the same

An embodiment of the present invention relates to an EMC (epoxy moiding compound) composition for shielding EMI (Electro Magnetic Interference) and an electronic shielding device including the same.

The semiconductor encapsulant is a material that seals semiconductor devices such as silicon chips, gold wires, and lead frames to protect them from heat and moisture shock, and EMC (Epoxy Molding Compound) is the most used. EMC is a composite material that uses 10 kinds of raw materials such as silica, epoxy resin, phenol resin, carbon black, and flame retardant. Its main use is as an encapsulant for transistors, diodes, microprocessors, and semiconductor memories. Although EMC is small compared to the price of semiconductors, it has a very important effect on the functions of semiconductors because it is a structural material that protects semiconductor devices.

In particular, EMC compounding technology belongs to the core technology to the extent that it influences the quality of semiconductors. In the semiconductor memory field, Korea has global competitiveness and occupies more than 30% of the global market. Considering the size of the market, the domestic EMC market is a major market with a size that cannot be ignored. However, recently, as devices (parts) in electronic products are integrated and processing speed is increased, the performance of each part is maximized, and malfunctions, performance degradation, and deterioration due to electromagnetic interference with adjacent parts occur.

The embodiment of the present invention has been devised to solve the above problems, and it is possible to provide an EMC composition that enhances the EMI dispersion and scattering effect from the EMI source using magnetic powder that has been subjected to surface insulation in the EMC molding material. make it possible

In addition, in an embodiment of the present invention, an EMC composition having a primary shielding and dispersion effect in the EMC material to complement the current technology in which EMI (Electro Magnetic Interference) shielding is not perfect with only a metal can or plating to be able to provide

Furthermore, in an embodiment of the present invention, it is possible to provide an electronic shielding device that minimizes performance degradation and malfunction through electromagnetic EMI shielding for each device.

In order to achieve the above object, in an embodiment of the present invention, the surface of the magnetic material is coated with an insulating layer (insulation layer) a magnetic filler; binders; additive; And it provides an EMC (epoxy moiding compound) composition for shielding EMI comprising a filler.

In addition, in order to achieve the above object, the present invention provides an electronic shielding device including the EMC composition for EMI shielding.

According to an embodiment of the present invention, by using the magnetic powder with surface insulation in the EMC molding material, the EMC composition that increases the EMI dispersion and scattering effect from the EMI source enables electromagnetic EMI shielding for each device. It is possible to provide an electronic shielding device that minimizes performance degradation and malfunction, and at the same time, it is possible to obtain weight reduction, process simplification, cost reduction and high-functional shielding effect compared to the existing process.

1 is a diagram schematically illustrating the reason why the electronic shielding device of the present invention can have superior shielding performance compared to the electronic shielding device manufactured by the prior art.
2 is an image showing a result of a molding test according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment in which a person of ordinary skill in the art to which the present invention pertains can easily practice the present invention will be described in detail. However, it should be understood that the configuration shown in the embodiments and drawings described in this specification is only a preferred embodiment of the present invention, and there may be various equivalents and modifications that can be substituted for them at the time of the present application. . In addition, in the detailed description of the operating principle of the preferred embodiment of the present invention, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. The terms described below are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the content throughout this specification. The same reference numerals are used throughout the drawings to refer to parts having similar functions and functions.

An embodiment of the present invention is a magnetic filler coated with an insulating layer (insulation layer) on the surface of the magnetic material; binders; additive; And it provides an EMC (epoxy moiding compound) composition for shielding EMI comprising a filler.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The concept of the present invention is to increase the shielding performance of EMC materials by applying a magnetic material as a filler. to minimize it.

For this purpose, the present invention includes the following materials as components constituting the EMC composition.

magnetic filler

The magnetic filler includes a magnetic material, and its content includes 3 to 50 parts by weight based on 100 parts by weight of the composition. If the content is less than 3wt%, there is no great shielding effect compared to the existing EMC, and if it is 50wt% or more, it is not preferable because there is a high possibility of problems in reliability evaluation.

Types of magnetic materials include iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), aluminum (Al), zinc (Zn), copper (Cu), barium (Ba), titanium (Ti) , tin (Sn), strontium (Sr), phosphorus (P), boron (B), nitrogen (N), carbon (C), tungsten (W), chromium (Cr), bismuth (Bi), lithium (Li) , iridium (Y), cadmium (Cd), and oxygen (O), or an alloy or material consisting of a combination of one or more elements.

The magnetic material may be in the form of a powder, and may be at least one selected from the group consisting of flaked, spherical, rod-shaped, and cone-shaped (chestnut-shaped or protrusion-shaped) powder. The constituent particle size ranges from 0.01 to 100 μm, and in the case of flake powder, the thickness is preferably from 0.3 to 5 μm, and the diameter is preferably from 0.01 to 100 μm.

In the case of spherical powder, if the particle size is less than 0.01 μm, the shielding rate is lowered due to loss of magnetic properties, and if it is more than 100 μm, there is a high possibility of an electrical short due to contact with the EMC internal electrode. In the case of flake powder, the thickness and diameter are limited within appropriate values for the same reason.

If flake magnetic particles are used instead of spherical magnetic particles, the effective surface area can be increased even with a small amount, so the possibility of an electric short can be eliminated much more easily.

surface insulating layer

In order to cover the surface of the magnetic material powder with an insulating layer, the following surface treatment is performed. Oxide film treatment, phosphate treatment, anodizing treatment, parkerizing treatment, silane treatment, polymer treatment, electrolytic plating, electroless plating, etc. can be performed, and insulation and Thermal conductivity can be improved.

The thickness of the insulating layer is preferably 100 Å to 1 μm. If the thickness of the insulating layer is less than 100 Å, it is too thin and the insulating properties are poor.

filler

At least one material selected from the group consisting of SiO ₂ , Al ₂ O ₃ , Fe ₂ O ₃ , Na ₂ O, BaSO ₄ , CaO, and MgO may be used, and the particle size range is 0.5 nm to 200 μm, spherical, bar-shaped , horn type (chestnut type or protrusion type), flake type powder, etc. can be used. The included content is preferably 3 to 90 parts by weight based on 100 parts by weight of the composition. If the content is less than 3wt%, the mechanical and thermal properties of EMC are lowered, and if it is more than 90wt%, EMC formation is not good.

bookbinder

The binder contains 3 to 50 parts by weight based on 100 parts by weight of the composition, and consists of a material consisting of a combination of one or more materials selected from PVA, silicone, epoxy, acrylate, urethane, polyamide, polyimide, phenol, and resin. It can be, and it can be used without limitation as long as it is a binder generally used in the technical field of the present invention.

additive

In order to improve the function of the EMC composition of the present invention or to impart additional functions, additives conventionally used in the art of the present invention may be used without limitation, for example, a coupling agent, a plasticizer, an antifoaming agent, It can be used by adding a curing agent, an accelerator, and the like.

The content is based on 100 parts by weight of the composition, 0.1 to 2 parts by weight of a coupling agent, 0.2 to 10 parts by weight of a plasticizer (Flexibilizer), 0.2 to 10 parts by weight of an antifoaming agent, 2 to 15 parts by weight of a curing agent, and an accelerator (Accelerator) 0.1 to 2 parts by weight may be included.

An embodiment of the present invention relates to an electronic shielding device manufactured from an EMC composition including the above components.

1 is a diagram schematically illustrating the reason why the electronic shielding device of the present invention can have superior shielding performance compared to the electronic shielding device manufactured by the prior art.

As shown, it can be seen that EMI dispersion and scattering are performed by the magnetic filler on which the surface included in the EMC composition of the present invention is insulated, so that the effect of improving the shielding performance for each device can be obtained.

Hereinafter, the present invention will be described in more detail through examples. These examples are only for illustrating the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples according to the gist of the present invention. .

[Example]

Metal and non-metal powders were applied to form an EMC material, and the post cure was about 2 hr, the transfer molding cure was about 2 minutes at 180°C, and molding was performed at 100 kgf/cm2.

The metal powder used in Comparative Examples 2 and 1 was sendust (FeSiAl-based alloy), and the non-metal powder used in Examples 2 and 3 was ferrite. The surface of the magnetic material of Examples 1 to 3 was phosphated in the same way, and Comparative Examples 1 and 2 were not subjected to separate surface treatment.

weight% matter existing technology Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 bookbinder novolac resin,
bisphenol resin 5-20 8.3 8.3 8.3 8.3 8.3 filler Fused Silica, Fumed Silica, Crystal Silica 60-95 87 50.3 74 60.7 78.3 magnetic material Metal powder, non-metal powder - no added metal powder
36.7 metal powder
13 Non-metallic powder
26.3 Non-metallic powder
8.7 hardener phenolic, amine 2-15 2 2 2 2 2 coupling agent silane 0.1~2 0.5 0.5 0.5 0.5 0.5 accelerant imidazole 0.1~2 0.3 0.3 0.3 0.3 0.3 plasticizer 0.2 to 10 1.2 1.2 1.2 1.2 1.2 organic flame retardant 0.1~4 0.3 0.3 0.3 0.3 0.3 inorganic flame retardant 0.1~7 0.2 0.2 0.2 0.2 0.2 dispersant 0~1 0.1 0.1 0.1 0.1 0.1

[Experiment result]

According to JEDEC standards, MRT reliability Level2 evaluation and 85℃/85% RH 1day evaluation are carried out. The test conditions were Level2 soaking at 85℃/60% RH for 7 days, reflow at 260℃ peak temperature, soaking at 85℃/85% RH for 1 day, and then reflow at 260℃ peak temperature to increase reliability. Evaluate. In addition, gap-filling properties were evaluated through SAT, and shielding performance was measured to evaluate the material's own performance.

result Contents Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 reliability JEDEC level 2 Pass Fail Pass Pass Pass SAT (1-Void area/total area:%) 96.3 67 96.3 92.3 96.1 EMI shielding @2.5 GHz, 5.4 GHz, 1 GHz, 1.57 GHz 0.1dB shielding - 11dB shielding 10dB shielding 8dB shielding general review low shielding Low fairness, poor reliability Great Great Great

As shown in [Table 2], it can be seen that when surface-treated metal and non-metal powder are included, excellent EMI shielding ability is shown. Although there is a slight difference, it was found that the magnetic filler of metal powder showed slightly higher shielding ability than the magnetic filler of non-metal powder.

In the detailed description of the present invention as described above, specific embodiments have been described. However, various modifications are possible without departing from the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, and should be defined by the claims as well as the claims and equivalents.

Claims (13)

a magnetic filler in which the surface of the magnetic material is surface-treated with an insulating layer;
binders;
additive; and
fillers;
including,
The magnetic material is iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), aluminum (Al), zinc (Zn), copper (Cu), barium (Ba), titanium (Ti), tin (Sn), strontium (Sr), phosphorus (P), boron (B), nitrogen (N), carbon (C), tungsten (W), chromium (Cr), bismuth (Bi), lithium (Li), iridium (Y), cadmium (Cd) and oxygen (O) is at least one mixture selected from the group consisting of,
The magnetic material includes flaked powder,
The flake powder has a thickness of 0.3 to 5 μm, and a diameter of 0.01 to 100 μm,
The surface treatment thickness is, EMI shielding EMC (epoxy moiding compound) composition, characterized in that 100Å to 30㎛.

delete According to claim 1,
EMI shielding EMC (epoxy moiding compound) composition, characterized in that the particle size of the magnetic material is 0.01 to 100㎛.
4. The method of claim 3,
The magnetic material is an EMC (epoxy moiding compound) composition for EMI shielding, characterized in that it comprises at least one of a spherical powder, a rod-shaped powder, and a cone-shaped powder.
delete According to claim 1,
The insulating layer is an oxide film treatment, phosphate treatment, anodizing treatment, phosphate film treatment (Parkerizing), silane (silane) treatment, polymer (polymer) treatment, electroplating treatment and electroless plating treatment on the surface of the magnetic material EMI shielding EMC (epoxy moiding compound) composition, characterized in that it is constituted by performing at least one surface treatment selected from the group consisting of.
delete delete delete delete The method of claim 1,
The filler is an EMC (epoxy moiding compound) composition for EMI shielding, characterized in that the particle size of 0.5nm to 200㎛.
According to claim 1,
The content of the components of the composition is based on 100 parts by weight of the composition
3 to 50 parts by weight of magnetic filler;
EMI shielding EMC (epoxy moiding compound) composition, characterized in that it contains 3 to 90 parts by weight of a filler.
An electronic shielding device comprising the EMC composition for EMI shielding according to any one of claims 1, 3, 4, 6, 11 and 12.

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