KR102366703B1 - Transparent conductive film comprising polycarbonate substrate - Google Patents

Abstract

The present invention relates to a polycarbonate-based transparent conductor, comprising: a polycarbonate substrate; a hard coating layer formed on a polycarbonate substrate and formed from a composition including a photocurable compound exhibiting non-erosion to the polycarbonate substrate; And it provides a transparent conductor comprising a conductive layer formed on the hard coating layer.

Description

Transparent conductive film comprising polycarbonate substrate

The present invention relates to a transparent conductor comprising a polycarbonate (PC) substrate.

1 shows a structure of a liquid crystal cell (LC cell), a liquid crystal layer including a liquid crystal (LC) compound and a dye, an alignment layer formed on the upper and lower portions of the liquid crystal layer, and an electrode layer (ITO) formed on each alignment layer A sealant is formed on the side of the laminate consisting of layers, etc.), and a hard coating (HC) layer, a substrate (PC, etc.) and an AB (anti-blocking) layer are sequentially formed on the upper and lower portions of the laminate, respectively. These can be stacked. In such a film cell structure, liquid crystal compound leakage may occur due to interfacial peeling between the hard coating layer and the substrate.

Since a primer layer does not exist on the surface of a general PC (polycarbonate) substrate, it is disadvantageous in interfacial adhesion with the HC (hard coating) layer.

PC base material has weak solvent resistance, so it is corrosive to organic solvents such as ketone series, acetate series, toluene, xylene, and tetrahydrofuran (THF) except alcohol series. indicates.

Adhesion can be secured by forming an inter-diffusion interface with an HC solution partially applied with an organic solvent or resin exhibiting erosion to the PC substrate.

However, when an erosive solvent or resin is used, there is a difference in the degree of erosion depending on the PC substrate manufacturing method (extrusion, solution casting, etc.), PC molecular structure, and PC molecular weight. A significant difference can be induced in the adhesion force.

In addition, when an erosive solvent or resin is used, the appearance of the substrate may be damaged depending on the set coating process conditions.

Accordingly, it is an object of the present invention to provide a transparent conductor including a hard coat layer that secures adhesion by using a resin (compound) that exhibits non-erosion properties to a PC substrate.

The present invention to achieve the above object, a polycarbonate substrate; a hard coating layer formed on a polycarbonate substrate and formed from a composition including a photocurable compound exhibiting non-erosion to the polycarbonate substrate; And it provides a transparent conductor comprising a conductive layer formed on the hard coating layer.

The photocurable compound of the hard coating layer in the present invention may include a (meth)acrylate compound having an N amine group bonded to a carbonyl group, specifically, a (meth)acrylate compound having a nitrogen atom bonded to a carbon atom of the carbonyl group.

In the present invention, the nitrogen atom bonded to the carbon atom of the carbonyl group is an isocyanate group (C(O)-NR), a urethane bond (OC(O)-NH), a urea bond (HN-C(O)-NH), an amide bond (C (O)-NH), an isocyanurate skeleton (3C(O)-NR), and an imide bond (C(O)-NC(O)) may be included in at least one selected from the group consisting of .

In the present invention, the content of the (meth)acrylate compound having a nitrogen atom bonded to a carbon atom of the carbonyl group may be 70 to 100% by weight based on the total weight of the photocurable compound.

In the present invention, the photocurable compound may further include a (meth)acrylate compound having a polar group, wherein the polar group may be a hydroxyl group, a carboxyl group, or an amino group.

In the present invention, the interfacial peel force of the hard coating layer may be 5 N/6 mm (sealant width 6 mm) or more when measured at room temperature, peel angle 90 degrees, and peel rate 300 mm/min.

In the present invention, the haze of the hard coating layer may be less than 1% when measured using a standard light source simulating natural sunlight with D65.

In the present invention, the refractive index of the hard coating layer may be 1.45 to 1.70 when measured at a wavelength of 632.8 nm using a prism coupler.

In the present invention, the thickness of the hard coating layer may be 0.2 to 8 μm.

In the present invention, the composition of the hard coating layer may further include inorganic particles, wherein the inorganic particles are MgF ₂ , SiO ₂ , ZrO _x , TiO _x , Al ₂ O ₃ It may be at least one selected from the group consisting of, The x may be 1 to 5.

In the present invention, the conductive layer may be an amorphous or crystalline transparent conductive layer, the thickness of the conductive layer may be 15 to 50 nm, and the resistance of the conductive layer may be 40 to 500 Ω/□.

In addition, the present invention provides a liquid crystal display including the above-described transparent conductor.

According to the present invention, by using a specific compound exhibiting non-erosion to the PC substrate, physical properties such as adhesion, interfacial peeling force, and haze can be secured.

1 shows the structure of a liquid crystal cell.
2 shows the erosion properties of PC substrates to various resins.

Hereinafter, the present invention will be described in detail.

The transparent conductor according to the present invention may be composed of a substrate, a hard coating layer, a conductive layer, and the like.

The substrate is a polycarbonate (PC) substrate, and the polycarbonate substrate is a transparent substrate. The transparent substrate may mean a substrate having a light transmittance of 70% or more. The light transmittance of the transparent substrate may be preferably 80% or more, particularly 90% or more. The PC substrate may be manufactured by extrusion, solution casting, or the like, and is preferably manufactured by solution casting in order to improve peel strength. The thickness of the substrate is not particularly limited, and may be, for example, 20 to 300 μm, preferably 100 to 300 μm.

The hard coating layer is formed on a polycarbonate substrate, and may be formed from a composition including a photocurable compound exhibiting non-erosion to the polycarbonate substrate. Figure 2 shows the erosion properties of the PC substrate to various resins, and after the resin is dropped on the PC substrate, heat treatment is performed to visually confirm whether erosion has occurred.

The non-erodible photocurable compound may include a (meth)acrylate compound having an N amine group bonded to a carbonyl group, specifically a (meth)acrylate compound having a nitrogen atom bonded to a carbon atom of the carbonyl group (the first photocurable compound). . (meth)acrylate may mean acrylate or methacrylate. In addition, the bond between the carbon atom and the nitrogen atom of the carbonyl group may be a single bond or a double bond.

The nitrogen atom bonded to the carbon atom of the carbonyl group is an isocyanate group (C(O)-NR), a urethane bond (OC(O)-NH), and a urea bond (HN-C(O)-NH) ), amide bond (C(O)-NH), isocyanurate backbone (3C(O)-NR) and imide bond (C(O)-NC(O)) It may be included in one or more selected from the group consisting of.

As the (meth)acrylate compound having an isocyanate group, for example, an isocyanate group-containing aliphatic, alicyclic and/or aromatic (meth)acrylate compound can be used, specifically (meth)acryloyl isocyanate, 2- (meth)acryloyloxyethyl isocyanate, 2-(meth)acryloyloxypropyl isocyanate, etc. can be used.

As the (meth)acrylate compound having a urethane bond, for example, an aliphatic, alicyclic and/or aromatic (meth)acrylate compound containing a urethane bond can be used, and specifically, polyester urethane (meth)acrylate, Polybutadiene urethane (meth)acrylate, polyether urethane (meth)acrylate, caprolactone-modified urethane (meth)acrylate, pentaerythritol tetraacrylate utilizing hexafunctional urethane (meth)acrylate, etc. may be used.

As the (meth)acrylate compound having a urea bond, for example, an aliphatic, alicyclic and/or aromatic (meth)acrylate compound containing a urea bond can be used, and specifically, methacryloxyethyl ethylene urea, 2- (meth)acrylate derivatives of hydroxyethyl ethylene urea, (meth)acrylamide derivatives of 2-aminoethylethylene urea, and the like can be used.

As the (meth)acrylate compound having an amide bond, for example, an amide bond-containing aliphatic, alicyclic and/or aromatic (meth)acrylate compound can be used, and specifically (meth)acrylamide, N,N -Dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-methylol (meth)acrylamide, diacetone (meth)acrylamide, N- Vinylacetoamide, N,N-methylenebis(meth)acrylamide, N,N-dimethylaminopropyl(meth)acrylamide, N,N-dimethylaminopropylmethacrylamide, etc. can be used.

As the (meth)acrylate compound having an isocyanurate skeleton, for example, an isocyanurate skeleton-containing aliphatic, alicyclic and/or aromatic (meth)acrylate compound can be used, and specifically, tris(2 -Hydroxyethyl) isocyanurate triacrylate, tris (2-hydroxyalkyl) isocyanurate triepoxide, triallyl isocyanurate, isophorone diisocyanurate, alkyl diisocyanurate, An alicyclic diisocyanurate compound, an alkyldiisocyanurate trimer, etc. can be used. The alkyl in the compound may be a linear or branched C1-C14 alkyl, specifically C1-C8 alkyl.

The first photocurable compound may be used alone or in combination of two or more. For example, a (meth)acrylate compound having an isocyanurate skeleton can be used alone, and a (meth)acrylate compound having an isocyanurate skeleton and a (meth)acrylate compound having a urethane bond Can be used in combination. In particular, when a (meth)acrylate compound having an isocyanurate skeleton is used, interfacial peel strength can be greatly improved.

When two or more types of photocurable compounds are combined, the content of each photocurable compound may be independently 20 to 70 weight based on the total weight of the photocurable compound. For example, 45 to 65% by weight of a (meth)acrylate compound having a urethane group and 20 to 40% by weight of a (meth)acrylate compound having an isocyanurate group may be used.

The content of the first photocurable compound may be 70 to 100% by weight, preferably 80 to 100% by weight, based on the total weight of the photocurable compound. The content of the first photocurable compound is preferably 80% by weight or more to ensure adhesion, and when it is less than 80% by weight, sufficient adhesion may not be ensured. The photocurable compound may be used alone (100% by weight) of the first photocurable compound, or may be used in combination with other photocurable compounds such as a second photocurable compound to be described later.

The photocurable compound may further include a (meth)acrylate compound that exhibits non-erosion to the PC substrate in addition to the first photocurable compound, for example, a (meth)acrylate compound having a polar group (second photocurable compound) compound) may be further included. The polar group may be an -OH group (hydroxy group), a carboxyl group, an amino group, or the like. Here, the amino group is different from the nitrogen atom bonded to the carbon atom of the carbonyl group included in the first photocurable compound.

Examples of the (meth)acrylate compound having a hydroxyl group include pentaerythritol triacrylate, pentaerythritol tetraacrylate, 2-hydroxyethyl (meth)acrylate, and 2-hydroxypropyl (meth)acrylate. , 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 2-hydroxyethylene glycol (meth)acrylate or 2-hydroxy Propylene glycol (meth) acrylate and the like can be used.

As a (meth)acrylate compound which has a carboxy group, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, etc. can be used, for example.

As the (meth)acrylate compound having an amino group, for example, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, etc. can be used

The content of the second photocurable compound may be less than 30 wt%, preferably less than 20 wt%, based on the total weight of the photocurable compound. When the content of the second photocurable compound exceeds 20% by weight, sufficient adhesion may not be ensured.

The content of the photocurable compound may be 40 to 98% by weight based on the total weight of the hard coating layer composition. For example, in order to form the high refractive index hard coating layer, 150 parts by weight of the high refractive inorganic particles relative to 100 parts by weight of the photocurable compound may be applied.

The composition of the hard coating layer may further include inorganic particles to match the target refractive index. The inorganic particles may be at least one selected from the group consisting of MgF ₂ , SiO ₂ , ZrO _x , TiO _x , and Al ₂ O ₃ , where x may be 1 to 5. The diameter of the inorganic particles is not particularly limited, and may be, for example, 10 to 100 nm. The content of the inorganic particles may be 0 to 60% by weight based on the total weight of the hard coating layer composition. There is also a composition without the addition of inorganic particles.

In addition, the composition of the hard coating layer may further include a photoinitiator, a solvent and an additive. Photoinitiators include acetophenone, dimethyl anino acetylphenone, 2,2-dimethoxy-2-phenyl acetophenone, 2,2-diethoxy-2-phenyl acetophenone, benzophenone, 4,4-diethylamino benzophenone , benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl- 1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, methylbenzoylformate, α,α-dimethoxy-α-phenyl Acetophenone, 2-benzoyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-methyl-1-[4-(methylthio)phenyl] -2-(4-morpholinyl)-1-propanone diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, etc. but is not limited thereto.

In addition, photoinitiator products currently on the market include Irgacure 127, Irgacure 184, Irgacure 500, Irgacure 651, Irgacure 369, Irgacure 754, Irgacure 907, Darocur 1173, Darocur MBF, Irgacure 819, Darocur TPO, Esacure KIP 100F, Irgacure TPO, Irgacure 907, etc. can be heard These photoinitiators may be used alone or in mixture of two or more different types. The content of the photoinitiator may be 0.1 to 10% by weight based on the total weight of the hard coating layer composition.

As the solvent, a solvent that exhibits non-deposition on the PC substrate, for example, an alcohol-based solvent such as methanol, ethanol, isopropyl alcohol, or butanol, may be used, and an alkoxy alcohol solvent such as 1-methoxy-2-propanol may be used. can be used The content of the solvent is not particularly limited, and the solvent content can be adjusted according to the target coating thickness. Since the solvent evaporates and disappears during the coating process, it may be independent of the final coating composition. Therefore, the solvent content may not be considered with respect to the total weight of the hard coating layer including the photocurable compound, inorganic particles and/or initiator.

Additives include, for example, dyes, fillers, reinforcing agents, flame retardants, plasticizers, lubricants, stabilizers (antioxidants, ultraviolet absorbers, heat stabilizers, etc.), mold release agents, antistatic agents, surfactants, dispersants, flow modifiers, leveling agents, defoamers, surface Modifiers, stress reducing agents (silicone oil, silicone rubber, various plastic powders, etc.), heat resistance improving agents, etc. can be used. The content of the additive may be 0.01 to 10% by weight based on the total weight of the hard coating layer composition.

The hard coat layer may be formed by applying a hard coat layer composition comprising the above-described components to a PC substrate and photocuring by irradiating ultraviolet rays. The application method is, for example, bar coating, gravure coating, knife coating, roll coating, blade coating, die coating, comma coating, slot die coating, dip coating, spray coating, solution casting method, reverse roll coating, reverse gravure coating, micro A gravure coating or the like can be used.

The irradiation amount of ultraviolet rays may be, for example, 10 to 1000 mJ/cm 2 . As an ultraviolet light source, a high pressure mercury lamp, a metal halide lamp, a black light fluorescent lamp, etc. can be used, for example. The UV irradiation time is not particularly limited, and the irradiation time may vary depending on the intensity of the UV lamp. In the case of roll-to-roll curing, the UV irradiation time may be very short depending on the driving speed.

The hard coating layer may be a transparent layer having a light transmittance of 70% or more, 80% or more, or 90% or more. The refractive index of the hard coating layer is not particularly limited, and may be, for example, 1.45 to 1.70 when measured at a wavelength of 632.8 nm using a prism coupler. Since the refractive index of the photocurable compound is in the range of 1.50 to 1.60, the refractive index of the hard coating layer may be adjusted by adding inorganic particles to adjust the refractive index lower or higher than this. In addition, the refractive index of the hard coating layer may be adjusted at a level at which outgassing does not increase during deposition or surface roughness does not increase.

The thickness of the hard coating layer may be 0.2 to 8 μm. If the thickness of the hard coating layer is too thin, mechanical properties such as scratch resistance and hardness may be reduced. can

The interfacial peel force of the hard coating layer is 5 N/6 mm (sealant width 6 mm) or more, preferably 8 N/6 mm or more, when measured at room temperature, peel angle 90 degrees, and peel rate 300 mm/min. and more preferably 10 N/6mm or more. The upper limit of the interfacial peel force may be, for example, 14 N/6 mm or 12 N/6 mm. When the peeling force reaches 10 N/6 mm or more, the substrate itself is torn and can be evaluated as over-range. The interfacial peel force may mean the interfacial peel force between the hard coating layer and the encapsulant or the interfacial peel force between the hard coating layer and the PC substrate.

The haze of the hard coating layer may be less than 1%, preferably 0.5% or less, more preferably 0.3% or less when measured using a standard light source simulating natural sunlight with D65. Since hazemeter equipment may display to one decimal place, the lower limit of haze may be, for example, 0.1% or 0%.

The conductive layer may be formed on the hard coating layer. The conductive layer may include metals such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin and alloys thereof; metal oxides such as indium oxide, tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; and the like. In addition, the conductive layer may include a multi-component metal oxide, specifically aluminum (Al), zinc (Zn), cerium (Ce), silicon (Si), tin (Sn), titanium (Ti), iron (Fe) ) may include an oxide of two or more metals selected from the group consisting of, but is not limited thereto. Typically, the conductive layer is formed using indium tin oxide (ITO), but is not limited thereto.

The conductive layer may be formed by, for example, thermal vapor deposition, electron beam deposition, sputtering, physical vapor deposition (PVD), thermal CVD, PECVD, chemical vapor deposition (CVD), or atomic layer deposition (CVD). Layer Deposition (ALD), etc. can be used.

The conductive layer may be an amorphous or crystalline transparent conductive layer. The light transmittance of the conductive layer may be 70% or more, 80% or more, or 90% or more. The thickness of the conductive layer may be 15 to 50 nm. When the thickness of the conductive layer is too thin, sheet resistance may increase, and if too thick, light transmittance may decrease.

The resistance of the conductive layer is not particularly limited, and may be, for example, 40 to 500 Ω/□. When the touch panel display area increases, the touch sensitivity can be maintained only when the sheet resistance is lowered. The resistance range is a specification to which a capacitive touch method is generally applied. Since the sheet resistance is related to the deposition thickness, the sheet resistance can be adjusted according to the formation thickness. There is no problem because the sheet resistance is low, and if it is too high, the touch sensitivity may deteriorate.

Hereinafter, the present invention will be described in more detail by way of Examples.

[Example 1]

Preparation of composition for hard coating layer

The composition for the hard coating layer was composed of 100 parts by weight of a photocurable compound, 3 parts by weight of a photoinitiator, and an appropriate amount of a solvent. As the photocurable compound, 100 wt% of tris(2-hydroxyethyl)isocyanurate triacrylate (M370, Miwon Specialty Chemical) was used as the first photocurable compound (Compound A). Irgacure® 184 was used as a photoinitiator. As a solvent, 1-methoxy-2-propanol was used.

Manufacturing of transparent conductors

By coating and drying the composition for a hard coating layer on a PC substrate having a thickness of 150 μm prepared by an extrusion method to form a coating layer having a thickness of 4 μm, and irradiating UV rays with an irradiation amount of 800 mJ/cm 2 to UV curing, on the PC substrate A hard coat layer was formed. Then, ITO was deposited on the hard coating layer by sputtering to form a conductive layer having a thickness of 30 nm.

[Example 2]

The photocurable compound includes 55 wt% of a urethane acrylate oligomer (PU2200, Miwon) and 30 wt% of M370 as the first photocurable compound (Compound A), and pentaerythritol triacrylate as the second photocurable compound (Compound B) (PETA) was prepared in the same manner as in Example 1, except that 15% by weight was used.

[Example 3]

It was prepared in the same manner as in Example 2, except that the PC substrate prepared by the solution casting method was used.

[Comparative Example 1]

The photocurable compound was Example 1 except that 100 wt% of trimethylolpropane triacrylate (TMPTA), an erosive resin, was used without using the first photocurable compound (Compound A) and the second photocurable compound (Compound B). was prepared in the same way as

[Comparative Example 2]

The photocurable compound did not use the first photocurable compound (Compound A), and as the second photocurable compound (Compound B), 55 wt% of an epoxy acrylate-based oligomer (CN110, sartomer) and 45 wt% of PETA were used. Except it was prepared in the same manner as in Example 1.

[Comparative Example 3]

It was prepared in the same manner as in Comparative Example 2, except that a PC substrate prepared by a solution casting method was used.

[Test Example]

Adhesion force, interfacial peel force, and haze were measured for Examples and Comparative Examples, and the results are shown in Tables 1 and 2.

1. Adhesion

Adhesion was evaluated according to ASTM D3359, and specifically, after forming 10 × 10 cross-cuts on the hard coating layer, it was confirmed whether the hard coating layer was peeled off with respect to the Nichiban tape. In the table, OK indicates no peeling and NG indicates peeling.

2. Interfacial peel force

The interfacial peel force is measured by laser scribing the ITO surface, then applying FB4175 sealant (width 6 mm, length 7 cm) between the two HC coated surfaces for lamination, followed by UV LED. After curing at 400 nm, a 90-degree peel test was performed (long-axis peel, room temperature, peel angle 90 degrees, peel rate 300 mm/min), and measured three times to record the average value.

3. Haze

Haze was measured using a haze meter (HM150). In the table, OK indicates less than 1.0% haze, and NG indicates more than 1.0% haze.

Example 1 Example 2 Example 3 Substrate (substrate manufacturing method) PC (extrusion) PC (extrusion) PC (Solution Casting) hard coating layer
Furtherance compound A M370
= 100 wt% PU2200/M370
= 55/30 wt% PU2200/M370
= 55/30 wt% compound B - PETA = 15 wt% PETA = 15 wt% erodible resin - - - Thickness (㎛) 4 4 4 Properties adhesion
(cross-cut) OK OK OK interfacial peel force
(peel test) 10.2 N/6mm
(sealant/HC
interfacial peel) 8.7 N/6mm
(sealant/HC
interfacial peel) 9.8 N/6mm
(sealant/HC
interfacial peel) Haze (%) OK(0.3) OK(0.2) OK(0.2)

Comparative Example 1 Comparative Example 2 Comparative Example 3 Substrate (substrate manufacturing method) PC (extrusion) PC (extrusion) PC (Solution Casting) HC layer
Furtherance compound A - - - compound B - CN110/PETA
= 55/45 wt% CN110/PETA
= 55/45 wt% erodible resin TMPTA = 100 wt% - - Thickness (㎛) 4 4 4 Properties adhesion
(cross-cut) OK NG NG interfacial peel force
(peel test) 4.2 N/6mm
(sealant/HC
interfacial peel) 1.2 N/6mm
(HC/substrate
interfacial peel) 2.3 N/6mm
(HC/substrate
interfacial peel) Haze (%) NG(1.3) OK(0.2) OK(0.2)

According to Tables 1 and 2, in the case of Examples 1 to 3 using the first photocurable compound (Compound A), both the adhesive force (not peeled) and the interfacial peel force (5 N/6 mm or more) were high, and the haze (1%) less than) was low to an appropriate level. In particular, in Example 1 in which the (meth)acrylate compound (M370) having an isocyanurate group was used alone, the interfacial peeling force was the highest.

In addition, the interfacial peeling force was higher when the PC substrate prepared by the solution casting method (Example 3) was used than when the PC substrate prepared by the extrusion method (Example 2) was used.

In Comparative Example 1, since only the erosive resin was used, the adhesion was good, but the interfacial peel force was less than 5 N/6 mm, which was lower than that of the Example (about 41% compared to Example 1, about 48% compared to Example 2), and haze It was also higher than 1%.

In Comparative Examples 2 and 3, since only the second photocurable compound (resin B) was used, the haze was good, but peeling occurred in the adhesion test, and unlike other examples, peeling occurred at the interface between the hard coating layer and the substrate, The interfacial peeling force was significantly lower than that of Example (in the case of Comparative Example 2, about 11% compared to Example 1 and about 13% compared to Example 2, and in the case of Comparative Example 3, about 22% compared to Example 1 and about 2 compared to Example 2) 26%).

Claims (11)

polycarbonate substrate;
a hard coating layer formed from a composition comprising a (meth)acrylate compound formed on a polycarbonate substrate and having a nitrogen atom bonded to a carbon atom of a carbonyl group as a photocurable compound; and
It includes a conductive layer formed on the hard coating layer,
The content of the (meth)acrylate compound having a nitrogen atom bonded to the carbon atom of the carbonyl group is 70 to 100% by weight based on the total weight of the photocurable compound,
A transparent conductor whose interfacial peel strength of the hard coating layer is 5 N/6 mm or more. The method of claim 1,
The nitrogen atom bonded to the carbon atom of the carbonyl group is an isocyanate group (C(O)-NR), a urethane bond (OC(O)-NH), a urea bond (HN-C(O)-NH), an amide bond (C(O) -NH), an isocyanurate skeleton (3C(O)-NR), and an imide bond (C(O)-NC(O)) A transparent conductor included in at least one selected from the group consisting of. delete The method of claim 1,
The photocurable compound is a transparent conductor further comprising a (meth)acrylate compound having a polar group. 5. The method of claim 4,
A transparent conductor whose polar group is a hydroxyl group, a carboxyl group, or an amino group. delete The method of claim 1,
A transparent conductor with a haze of less than 1% of the hard coating layer. The method of claim 1,
The refractive index of the hard coating layer is 1.45 to 1.70, and the thickness of the hard coating layer is 0.2 to 8 μm. The method of claim 1,
The composition of the hard coating layer further comprises inorganic particles, and the inorganic particles are at least one selected from the group consisting of MgF ₂ , SiO ₂ , ZrO _x , TiO _x and Al ₂ O ₃ , wherein x is 1 to 5 transparent conductor. The method of claim 1,
The conductive layer is an amorphous or crystalline transparent conductive layer, the thickness of the conductive layer is 15 to 50 nm, and the resistance of the conductive layer is 40 to 500 Ω/□. A liquid crystal display comprising the transparent conductor according to claim 1 .

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