KR102363890B1 - Infrared LED lighting device for infrared cameras with improved heat dissipation performance - Google Patents

Abstract

The present invention relates to an LED lighting device for an infrared camera, which is applied with an improved heat dissipation structure to reduce the generation of heat of an LED device to minimize energy waste due to the generation of heat of the LED device. The LED lighting device for an infrared camera with improved heat dissipation performance, which is provided at one side of a camera housing of an infrared camera to radiate infrared rays to improve the quality of a night monitoring image obtained by the infrared camera, comprises: a housing having open front and rear surfaces, and an air inlet hole formed on an upper surface; a first printed circuit board installed inside the housing, and having a structure in which a metal layer, a first insulating layer, and a first printed circuit layer are sequentially stacked; a plurality of infrared LED devices mounted on the first printed circuit layer; a second printed circuit board installed inside the housing, disposed at a lower part of the front of the first printed circuit board, and having a structure in which a second insulating layer and a second printed circuit layer are sequentially stacked, and the second printed circuit layer electrically connected to the first printed circuit layer; a main circuit device mounted on the second printed circuit layer; and a heat dissipation block installed inside the housing, located at the rear of the first printed circuit board, and having a front surface being in close contact with a rear surface of the metal layer to absorb heat generated at the infrared LED device from the front surface to emit the same to the outside through the rear surface.

Description

Infrared LED lighting device for infrared cameras with improved heat dissipation performance}

The present invention relates to an infrared LED lighting device for an infrared camera with improved heat dissipation performance that can minimize energy waste due to heat of the infrared LED element by applying an improved heat dissipation structure to reduce heat generation of the infrared LED element.

In general, an infrared camera is one to which a charge-coupled device having sufficient sensitivity to infrared light is applied.

Such an infrared camera has the advantage of being able to provide a clear photographed image in which an object can be clearly identified even at night when an infrared illuminator having excellent light collection properties and an infrared filter device are used together.

Due to the above advantages, infrared cameras are not only widely used in special industrial fields, but also widely applied in fields such as CCTV, IP cameras, smart cameras, front and rear cameras for vehicles, video control cameras, and video recognition cameras. .

In recent years, as LED-related technology develops at a tremendous speed, an infrared LED lighting device that emits infrared light is also used in a lighting device applied to an infrared camera, contributing greatly to improving the quality of images taken at night.

Here, the infrared LED lighting device applied to the infrared camera is composed of an infrared LED package composed of infrared LED elements with high output and high brightness.

Such an infrared LED device, like a normal LED device, consumes a lot of power and has a very large amount of current, so it has excellent luminous efficiency, but the amount of heat generated is high.

That is, when the infrared LED element generates heat above a certain temperature and causes deterioration, the luminous efficiency is very low and the lifespan is greatly shortened, power consumption is further increased, and the semi-permanent lifespan is not guaranteed.

Thus, the infrared LED device is provided with a heat dissipation means for minimizing heat generation by discharging heat generated from the infrared LED element to the atmosphere.

On the other hand, most of the heat dissipation means applied to the infrared LED device have a structure in which heat generated from the infrared LED element is indirectly transmitted and released to the atmosphere to exhibit heat dissipation performance.

That is, it is a structure in which the heat is indirectly transmitted through the heat dissipation block through the printed circuit board on which the infrared LED element is mounted, and is emitted to the atmosphere through the heat dissipation fins provided in the heat dissipation block to exhibit heat dissipation performance.

However, as the infrared LED element and the heat dissipation block are indirectly connected to each other with a printed circuit board between them, only a portion of the heat generated from the infrared LED element is indirectly transferred to the heat dissipation block, so the heat dissipation performance is greatly reduced and consumed There is a problem in that the effect of reducing power is insignificant and the deterioration phenomenon is not properly prevented.

Therefore, in order to effectively dissipate the heat generated from the infrared LED device to minimize power consumption and prevent deterioration, it is urgently necessary to improve the heat dissipation structure applied to the infrared LED lighting device.

Republic of Korea Patent Publication No. 10-1031650, 2011.04.29. Announcement. Korean Patent Publication No. 10-2016-0009749, published on January 27, 2016.

The present invention was invented to solve the above problems, and effectively dissipates heat generated from the infrared LED device to reduce power consumption to maximize luminous efficiency and prevent deterioration to ensure semi-permanent lifespan. An object of the present invention is to provide an infrared LED lighting device for an infrared camera with improved heat dissipation performance having a structure that can receive heat from an element directly and quickly radiate heat to the atmosphere.

The object of the present invention is not limited to the object mentioned above, and other objects not mentioned can be clearly understood from the description below and can be sufficiently included in the object of the present invention.

An LED lighting device for an infrared camera with improved heat dissipation performance according to the present invention for achieving the above object is provided on one side of the camera housing of the infrared camera to emit infrared rays to improve the quality of night surveillance images obtained by the infrared camera; a housing having front and rear open sides and an air inlet hole formed on the upper surface; a first printed circuit board installed inside the housing and having a structure in which a metal layer, a first insulating layer, and a first printed circuit layer are sequentially stacked; a plurality of infrared LED devices mounted on the first printed circuit layer; It is installed inside the housing and is disposed below the front of the first printed circuit board, has a structure in which a second insulating layer and a second printed circuit layer are sequentially stacked, and the second printed circuit layer is the first printed circuit layer and a second printed circuit board electrically connected to; a main circuit device mounted on the second printed circuit layer; A heat dissipation block installed inside the housing and located at the rear of the first printed circuit board, the front side is in close contact with the back side of the metal layer to absorb heat generated from the infrared LED device from the front side, and then radiate it to the outside through the rear side ; may be included.

The LED lighting device for an infrared camera with improved heat dissipation performance according to the present invention according to the above configuration can expect the following effects.

First, as the first printed circuit board is provided with a metal layer and the heat dissipation block is installed to be in contact with the metal layer, heat generated when the infrared LED device is driven can be effectively transferred to the heat dissipation block through the metal layer. Heat dissipation performance may be improved.

And as the FG terminal connected to the first printed circuit layer on the first printed circuit board is connected to be in contact with the heat dissipation block through the connecting member, a portion of the heat transferred to the first printed circuit layer when the infrared LED device is driven is the heat dissipation block Since it can be transmitted directly to the heat dissipation block and cooling fan, the heat dissipation performance can be further improved.

1 is a perspective view illustrating an LED lighting device for an infrared camera with improved heat dissipation performance according to a preferred embodiment of the present invention.
2 is an exploded perspective view showing an LED lighting device for an infrared camera with improved heat dissipation performance according to a preferred embodiment of the present invention.
3 is a perspective view illustrating an assembling state of the first printed circuit board, the second printed circuit board, and the heat dissipation block of the LED lighting device for an infrared camera with improved heat dissipation performance according to a preferred embodiment of the present invention.
4 is a side view showing an assembly state of the first printed circuit board, the second printed circuit board, and the heat radiation block of the LED lighting device for an infrared camera with improved heat radiation performance according to a preferred embodiment of the present invention.

The present invention relates to an infrared LED lighting device for an infrared camera with improved heat dissipation performance that emits infrared rays with excellent light collection properties for the infrared camera.

In particular, the LED lighting device for an infrared camera with improved heat dissipation performance according to the present invention effectively dissipates heat generated from the infrared LED element to reduce power consumption to maximize luminous efficiency and prevent deterioration to ensure semi-permanent lifespan. It is characterized by

This feature can be achieved by a structure that can receive heat from the infrared LED element and quickly radiate heat to the atmosphere.

Hereinafter, an LED lighting device for an infrared camera with improved heat dissipation performance according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The LED lighting device for an infrared camera with improved heat dissipation performance according to a preferred embodiment of the present invention is separately installed on one side of the camera housing of the infrared camera to emit infrared rays to improve the quality of night surveillance images obtained by the infrared camera, 1 to 4, the connection bracket 10, the rotation bracket 20, the housing 30, the first printed circuit board 40, the infrared LED element 50, the LED driving element 60, the second 2 It may be composed of a printed circuit board 70 , a main circuit element 80 , a heat dissipation block 90 , a front cover 100 , a filter member 110 , a rear cover 120 , and a cooling fan 130 .

First, the connection bracket 10 may be installed on one side of the camera housing of the infrared camera.

To this end, the connection bracket 10 has a mounting surface 11 having a shape corresponding to one side of the camera housing so as to be in close contact with one side of the camera housing at the lower portion, and fixing holes 12 are formed through front and rear respectively on both sides, and a flat upper portion It has a surface and a pair of through-holes 13 may be formed vertically through the upper portion.

That is, the connection bracket 10 is fixed to the camera housing by passing the first fixing member (not shown) through the fixing hole 12 in a state where the mounting surface 11 is attached to one side of the camera housing, thereby firmly to the camera housing. can be connected

Next, the rotation bracket 20 may be connected to the upper side of the connection bracket 10 so that the angle can be adjusted in the left and right directions.

To this end, the rotation bracket 20 may be composed of a seating plate 21 mounted on the upper surface of the connection bracket 10 and a shaft plate 22 vertically installed at both ends of the seating plate 21 .

In addition, a pair of first angle-controlling long holes 21a having an arc shape may be formed vertically through the seating plate 21 at positions facing each other. In addition, the shaft plate 22 may be formed with a second angle adjusting long hole 22b having an arc shape together with the rotation shaft hole 22a left and right.

That is, the rotation bracket 20 passes the pair of second fixing members 23 through the first angle adjustment long hole 21a and the through hole 13 of the connection bracket 10 in turn to adjust the desired left and right angles. It can be fixed to the upper part of the connection bracket 10 by fixing it after.

Next, the housing 30 may be connected to the upper portion of the rotation bracket 20 so that the angle can be adjusted in the vertical direction.

To this end, the housing 30 has a rectangular frame shape, the front and rear surfaces are open, the connection plate 31 is installed along the inner circumferential surface, and a pair of connection holes 32 for connection with the rotating bracket 20 on both lower sides. ) are horizontally through-formed, and the air inlet hole 33 on the upper surface may be vertically penetrated.

That is, in the housing 30 , a pair of third fixing members 34 make a pair of connection holes 32 and a rotation shaft hole 22a and a second angle adjustment long hole 22b of the rotation bracket 20 in turn, respectively. It can be fixed to the upper part of the rotation bracket 20 by penetrating it and adjusting it to a desired vertical angle and then fixing it.

On the other hand, connection nuts 35 having a predetermined length may be respectively installed on both sides of the housing 30 .

Next, the first printed circuit board 40 is installed inside the housing 30 and has a structure in which a metal layer 41, a first insulating layer 42, and a first printed circuit layer 43 are sequentially stacked. can have

That is, the edge of the first printed circuit board 40 is fixed to the connecting plate 31 of the housing 30 by a plurality of fourth fixing members (not shown) so that the first printed circuit layer 43 moves forward. It may be installed in a vertical direction inside the housing 30 to face.

Next, the infrared LED device 50 and the LED driving device 60 may be respectively mounted on the first printed circuit layer 43 of the first printed circuit board 40 .

In this case, the infrared LED device 50 is a light source that emits infrared light, and may be mounted in a matrix form on the upper side of the first printed circuit layer 43 of the first printed circuit board 40 .

In addition, the LED driving device 60 is a circuit device for driving the infrared LED device 50 , and may be mounted on the lower side of the first printed circuit layer 43 of the first printed circuit board 40 .

Here, since the first printed circuit board 40 includes the metal layer 41, heat generated when the infrared LED device 50 is driven is generated by the first printed circuit layer 43, the first insulating layer 42, and the metal layer ( 41 ) and may be collected in the metal layer 41 while being sequentially transferred.

Next, the second printed circuit board 70 may be installed inside the housing 30 and fixed to the lower front side of the first printed circuit board 40 .

In this case, the second printed circuit board 70 has a structure in which the second insulating layer 71 and the second printed circuit layer 72 are sequentially stacked, and the second printed circuit layer 72 is the first printed circuit board 40 . ) may be electrically connected to the first printed circuit layer 43 .

Next, the main circuit device 80 is mounted on the second printed circuit layer 72 of the second printed circuit board 70 to control the power supplied to the infrared LED device 50 and the LED driving device 60 . And it is possible to control the operation of the infrared LED element 50 and the LED driving element (60).

Next, the heat dissipation block 90 is installed inside the housing 30 and the front surface is fixed to the rear surface of the first printed circuit board 40 in close contact to remove heat generated when the infrared LED element 50 is driven. 1 It can be transmitted through the printed circuit board 40 and discharged to the outside.

To this end, the heat dissipation block 90 is a heat dissipation plate 91 whose front is in close contact with the metal layer 41 of the first printed circuit board 40, and a plurality of heat dissipation fins 92 installed on the rear surface of the heat dissipation plate 91. can

That is, the heat dissipation block 90 absorbs heat generated when the infrared LED element is driven and collected in the metal layer 41 of the first printed circuit layer 43 of the first printed circuit board 40 through the heat sink 91 . The heat dissipation performance may be improved by discharging to the outside through the rear heat dissipation fins 92 .

On the other hand, the first printed circuit board 40 has a structure connected to the first printed circuit layer 43 , but an FG (Frame Ground) terminal 44 that is not directly electrically connected to the first printed circuit layer 43 is provided. may be included.

And the FG terminal 44 may be connected to one side of the heat sink 91 that is the front side of the heat dissipation block 90 through the connecting member 44a made of a heat conductor material.

That is, heat generated when the infrared LED device 50 is driven and transferred to the first printed circuit layer 43 is directly transferred to the heat dissipation block 90 through the FG terminal 44, so that the heat dissipation performance can be further improved. .

Next, the front cover 100 may be installed on the front surface of the housing 30 to be opened and closed, and the front surface of the infrared LED device 50 may be exposed to the outside.

To this end, one side of the front cover 100 may be connected to one side of the front side of the housing 30 through a hinge 103 . In addition, locking members 104 coupled to or separated from each other may be provided on the other sides of the front cover 100 and the housing 30 .

In addition, the front cover 100 may have an open hole 101 exposing the front surface of the infrared LED device 50 to the outside on the upper side through front and back. In addition, a transparent window 102 may be further installed in the open hole 101 to protect the infrared LED device 50 .

Next, at least one of the filter member 110 is installed between the front cover 100 and the infrared LED element 50 to filter the infrared rays generated when the infrared LED element 50 is driven to effectively emit light. .

Next, the rear cover 120 may be installed to cover the upper and lower surfaces, both sides and rear surfaces of the housing 30 with a ventilation space on the rear surface of the housing 30 .

That is, the rear cover 120 has a larger area than the rear surface of the housing 30 and is installed on the rear surface of the housing 30 to be spaced apart from the rear plate 121, and at the top, left and right ends of the rear plate 121, respectively. It may be composed of a shielding plate 122 installed horizontally toward the front, and an air exhaust hole 123 penetrating through the rear plate 121 in front and back.

In addition, coupling holes 124 are provided on the shielding plates 122 on both sides at positions corresponding to the connection nut 35 of the housing 30 , and pass through the coupling hole 124 to be fastened to the connection nut 35 . The rear cover 120 may be fixed to the housing 30 by the fixing member 125 to ensure a ventilation space between the housing 30 and the housing 30 .

Finally, the cooling fan 130 is installed on the front surface of the rear plate 121 of the rear cover 120 to flow the internal air of the housing 30 to rapidly cool the heat dissipation block 90 .

That is, the cooling fan 130 is installed at a position corresponding to the position of the air exhaust hole 123 on the front surface of the rear plate 121 to dissipate the internal air of the housing 30 to the air exhaust hole 123 of the rear plate 121 . ) to the outside, and by introducing external air into the inside of the housing 30 through the air inlet hole 33 of the housing 30, the heat dissipation block 90 can be rapidly cooled.

The above-described embodiments are merely exemplary, and those of ordinary skill in the art can variously modified other embodiments therefrom.

Accordingly, the true technical protection scope of the present invention should include not only the above embodiments but also other variously modified embodiments by the technical spirit of the invention described in the claims below.

10: Connection bracket
11: Mounting side
12: fixing hole
13: through hole
20: rotation bracket
21: seating plate
21a: first angle adjustment long hole
22: shaft plate
22a: rotation shaft hole
22b: second angle adjustment long hole
23: second fixing member
30: housing
31: connection plate
32: connection hole
33: air inlet hole
34: third fixing member
35: connecting nut
40: first printed circuit board
41: metal layer
42: first insulating layer
43: first printed circuit layer
44: FG terminal
44a: connecting member
50: infrared LED device
60: LED driving element
70: second printed circuit board
71: second insulating layer
72: second printed circuit layer
80: main circuit element
90: heat dissipation block
91: heat sink
92: heat sink fin
100: front cover
101: open hall
102: transparent window
103: hinge
104: locking member
110: filter member
120: back cover
121: back panel
122: blanking board
123: air exhaust hole
124: coupling hole
125: fourth fixing member
130: cooling fan

Claims (5)

As provided on one side of the camera housing of the infrared camera to radiate infrared rays to improve the quality of the night surveillance image obtained by the infrared camera;
a connection bracket connected to one side of the camera housing;
a rotation bracket connected to the connection bracket;
a housing connected to the upper side of the rotating bracket, the front and rear surfaces of which are open, and an air inlet hole formed on the upper surface;
a first printed circuit board installed inside the housing and having a structure in which a metal layer, a first insulating layer, and a first printed circuit layer are sequentially stacked;
a plurality of infrared LED devices mounted on the first printed circuit layer;
It is installed inside the housing and is disposed below the front of the first printed circuit board, has a structure in which a second insulating layer and a second printed circuit layer are sequentially stacked, and the second printed circuit layer is the first printed circuit layer and a second printed circuit board electrically connected to;
a main circuit device mounted on the second printed circuit layer; and
A heat dissipation block installed inside the housing and located at the rear of the first printed circuit board, the front side is in close contact with the back side of the metal layer to absorb heat generated from the infrared LED device from the front side, and then radiate it to the outside through the rear side consists of ;
The heat dissipation block is composed of a heat sink having a front surface in close contact with the metal layer, and a plurality of heat radiation fins installed on the rear surface of the heat sink. Exhibits heat dissipation performance while emitting to the outside through heat dissipation fins,
The first printed circuit board includes an FG terminal connected to the first printed circuit layer but not directly electrically connected to the first printed circuit layer,
The FG terminal is physically connected to one side of the heat sink through a connection member made of a heat conductor material so that heat generated when the infrared LED device is driven is transferred to the front surface of the heat dissipation block through the first printed circuit layer. It exhibits heat dissipation performance,
An arc-shaped first angle adjustment hole for connection with the connection bracket is formed on one side of the rotation bracket, and an arc-shaped second angle adjustment length hole and a rotation shaft hole for connection with the housing are formed on the other side of the rotation bracket. Infrared camera with improved heat dissipation performance, characterized in that the rotation brackets are respectively formed so as to be angle-adjustably connected in the left and right directions from the upper part of the connection bracket, and the housing is connected in an angle-adjustable direction from the top of the rotation bracket in the vertical direction. for LED lighting devices. delete According to claim 1,
a front cover which is installed on the front surface of the housing so as to be opened and closed and through which a light emitting hole for exposing the infrared LED element to the outside is formed through front and rear;
at least one filter member installed between the front cover and the infrared LED element;
a rear plate installed on the rear surface of the housing and spaced apart from the rear surface of the housing by a predetermined distance so as to cover the upper and lower surfaces, both sides and rear surfaces of the housing, and having a larger area than the rear surface of the housing; a rear cover comprising a shielding plate installed horizontally toward the front at the upper end, the left end, and the right end, respectively, and an air exhaust hole formed through the rear plate in front and back; and
The infrared camera with improved heat dissipation performance, characterized in that it further comprises a; a cooling fan installed on the front side of the rear plate to discharge the heat existing in the vicinity of the heat dissipation block to the air exhaust hole for cooling the heat dissipation block. for LED lighting devices. delete 4. The method of claim 3,
The rear cover
It is configured to be relatively larger than the size of the housing so as to surround the upper surface and both sides of the housing with a ventilation space at the rear surface of the housing,
Connection nuts having a predetermined length are installed horizontally on both sides of the housing to ensure the ventilation space, respectively, and on both sides of the rear cover, a fastening hole through which a fixing member fastened to the connection nut from the outside of the rear cover passes through An LED lighting device for an infrared camera with improved heat dissipation, characterized in that it is formed through each of the left and right horizontally.

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