KR102362983B1 - LED module with electromagnetic wave blocking and heat dissipation technology applied - Google Patents

Abstract

The present invention relates to an LED module. According to the present invention, the LED module with applied electromagnetic wave blocking and heat dissipation technology includes: a first layer comprising a plurality of LED soldering pads and a grid-type copper pad formed of a copper material; and an LED installed by forming a plurality of vias on each of the plurality of LED soldering pads. The LED module has a structure, in which the heat generated at the junction of an LED is transferred to a second heat transfer path, which is a path including the lead frame, and the heat transferred to the second heat transfer path is conducted to a grid-type copper pad through the LED soldering pad, and at the same time, the grid-type copper pad of the first layer blocks and absorbs electromagnetic waves, and emits electromagnetic waves through dowels of a rear ejection plate.

Description

LED module with electromagnetic wave blocking and heat dissipation technology applied}

The present invention relates to an LED module, and more particularly, to an LED module to which electromagnetic wave blocking and heat dissipation technology is applied.

LED is used for indoor and outdoor electric signage field, general lighting, outdoor lighting, building exterior decoration lighting field, and backlight of LCD TV due to its advantages such as environment-friendly, long lifespan, and excellent color. The field of application is expanding day by day, such as for automobiles and ships. In addition, the characteristics required for the LED are becoming more demanding. In particular, the heat dissipation problem is becoming more important due to the high output of the LED chip. Electrical energy input to the LED chip is converted into light and heat at the p-n junction, and it is known that the conversion rate to light is generally less than 20%, and more than 80% of energy is converted into heat. If the heat generated from the pn junction of the LED chip is not sufficiently dissipated to the outside, the temperature of the junction rises to several hundred degrees, which lowers the light efficiency of the LED and changes color coordinates. cause failure of LED heat is dissipated by applying various heat dissipation technologies to lighting and LCD VT, but until now, there is only technology that dissipates heat by attaching a heat sink to the IC of the LED module and adding a heat dissipation material to injection.

The front part of the electric sign board consists of an LED module. As a technology for the heat dissipation of the LED module itself, various heat dissipation materials such as carbon-based materials and aluminum are used to attach a heat sink to an IC mounted on a PCB to dissipate heat, and a sun wire to block sunlight. There is a method in which sunshade is applied. Although it has good performance for heat dissipation, there is an increase in production cost, and most of the heat is dissipated to the rear of the LED module. In addition, the sun shade blocks sunlight, but it is insufficient for the source of heat dissipation.

Regarding the shielding technology according to the emission of electromagnetic waves generated from the SMPS and electronic control device inside the signboard to the front of the signboard, it is difficult in terms of the structure of the signboard and the LED module. In other words, it is a level that can satisfy the domestic broadcasting and communication equipment (electromagnetic compatibility) certification CLASS A by applying the shielding technology inside the electronic sign board.

Alternatively, an electromagnetic wave shielding sheet is applied to the LED module, and an electromagnetic wave shielding material is applied to the injection of the LED module, but there is no technology that blocks or absorbs electromagnetic waves and emits them. The absorbed electromagnetic waves are emitted and reflected again, which may rather cause disturbances in various electric and electronic fields inside the electronic sign board. In addition, production complexity and high production costs are required.

As a related prior art, a flexible circuit board of a mesh ground copper foil layer disclosed in Patent Document 1 is disclosed. However, it is judged that this technology is different from the present invention as a flexible circuit board for signal connection between devices without a built-in LED and various electronic components.

Korean Public Publication No. 10-2008-0012527 (2008.02.12.)

The present invention is to solve the problems of the prior art as described above, and the object to be solved in the present invention is to provide an LED module for an electric billboard that can block electromagnetic waves while effectively dissipating heat, thereby extending the life of the LED. have.

An LED module to which electromagnetic wave blocking and heat dissipation technology is applied according to the present invention for achieving the above technical problem includes: a first layer including a plurality of LED soldering pads and a grid-type copper pad formed of a copper material; LEDs installed on each of the plurality of LED soldering pads; including, a plurality of vias are formed on the LED soldering pad, so that heat generated from the junction of the LED is transmitted through the second heat transfer path to the LED soldering pad It has technical features in that it increases thermal conductivity, conducts and diffuses the conducted heat to the grid-type copper pad, and absorbs and emits electromagnetic waves generated from the SMPS and electronic control device inside the electronic sign board and emitted to the front from the grid-type copper pad. .

The LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied includes; The inside of each pad hole is copper-plated and connected to the lattice copper pad of the first layer through the pad hole of the first layer. It may be configured to be transferred to the fourth layer.

In the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied, the grid-type copper pad in the first layer may be formed such that the technical area, which is the area excluding the plurality of LED soldering pads, is 68% of the total area. have.

The LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied includes: a front ejection plate coupled from one side of the first layer; an ejection plate for a rear surface coupled from one side of the fourth layer; And it may be configured to further include; a module inboard plate coupled from one side of the injection plate for the rear side.

In the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied, one LED module in which the front ejection plate, the PCB having the first to fourth layers, and the rear ejection plate are combined is a module-included plate or electronic signboard enclosure It may be installed in the electronic display panel, and the electromagnetic wave generated by the SMPS and the electronic control device in the first layer may be configured to block, absorb, and emit electromagnetic waves of the first layer.

The LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied may be configured to transmit the electromagnetic waves cut off and absorbed by the LED module to the module inner plate or the electric sign box and to emit it through the ground connected to the electric sign box.

The LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied has the effect of prolonging the life of the LED because it is possible to effectively dissipate heat while being able to block the electromagnetic wave.

1 is a view showing the front, side, and back of an LED module to which electromagnetic wave blocking and heat dissipation technology is applied according to an embodiment of the present invention;
2 is a view showing a front side of a first layer according to an embodiment of the present invention;
3 is a view showing a rear surface of a fourth layer according to an embodiment of the present invention;
4 is a combined state diagram of an LED module to which electromagnetic wave blocking and heat dissipation technology according to the present invention is applied;
5 is a view showing an embodiment of a front ejection plate according to the present invention;
6 is a partially enlarged view of FIG. 5
7 is a view showing an embodiment of the injection plate for the rear according to the present invention
8 is a view showing an embodiment of the module in-plate according to the present invention;
9 is a view showing a heat transfer path in a state in which the LED package is mounted on the PCB for further explanation of the present invention;

1 is a view showing the front, side, and back of an LED module to which electromagnetic wave blocking and heat dissipation technology is applied according to an embodiment of the present invention, FIG. 2 is a front view of a first layer according to an embodiment of the present invention 3 is a view showing a rear surface of a fourth layer according to an embodiment of the present invention.

1 to 3, the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied includes a plurality of LED soldering pads 111 and a grid-type copper pad 112 formed of a copper material. a first layer 110; LEDs are installed by forming a plurality of vias on each of the plurality of LED soldering pads 111; including, a plurality of pad holes are formed in the grid-type copper pad 112, and a plurality of pad holes are formed in each of the plurality of pad holes A plurality of vias may be formed.

The present invention has a structure in which the heat generated at the junction of the LED is transferred to the second heat transfer path 620 to the grid-type copper pad 112 through the LED soldering pad 111 .

For reference, the main cause of heat generation in the LED package is the RGB chip PN junction inside the LED package, but there is no way to improve the heat generated inside the LED package itself from the perspective of users using the LED package. none. Therefore, as shown in FIG. 9 , the lifespan of the LED can be extended by spreading heat transferred to the second heat transfer path 620 , which is a path including a lead-frame, to the surroundings to lower the temperature.

In the present invention, the heat generated from the LED mounted on each LED soldering pad 111 has a structure in which the LED soldering pad and the grid-type copper pad 112 are transferred through the second heat transfer path 620, Since the type copper pad 112 is formed of a copper material having a very high thermal conductivity of 401W/(mk), heat emitted through the second heat transfer path 620 of the LED can be efficiently and quickly absorbed.

In addition, the lattice-type copper pad 112 is capable of natural air-cooling heat dissipation, and since heat conduction occurs rapidly over the entire surface of the lattice-type copper pad 112, efficient heat dissipation of the LED module becomes possible.

In the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied, the area excluding the plurality of LED soldering pads 111 in the area of the first layer 110 can be viewed as the technical area of the grid-type copper pad 112. have. That is, the area excluding the LED soldering pad 111 where the LED is installed may be a technical area. In the present invention, such a technical area may be configured to be 68% of the total area.

For example, if the width and height of the PCB 100 of the LED module 10 is 96 mm × 96 mm, the total area is 9,216 mm ² , and the first layer 110 performing the electromagnetic wave blocking and heat dissipation function is a grid-type copper The pad 112 may have a technical area of 6,241 mm ² , which is 68% of the total area. And the LED soldering pad 111 in which a plurality of LEDs are installed in an area of 1,766mm ² of the remaining area, and the electrical insulation area between the grid-type copper pad 112 and the LED soldering pad 111 is 1,208mm ² . That is, the grid-type copper pad 112 is formed to have an area 3.5 times larger than the area of the LED soldering pad 111, so that the heat conducted to the LED soldering pad 111 through the LED heat transfer path-2 (620) is rapidly transferred. It can conduct heat to the grid-type copper pad 112 to dissipate heat over a large area.

Since the grid-type copper pad 112 in the present invention is formed of a copper material having a very high thermal conductivity of 401W/(mk), proper heat dissipation must be made while the LED soldering pad 111 absorbs heat. That is, it operates efficiently when the heat absorption/heat dissipation ratio is properly made. At this time, one of the structures to achieve a suitable heat absorption/heat dissipation ratio is that the technical area of the grid-type copper pad 112 is 68% of the total area. It is structured to be

In other words, since the present invention has a structure in which the heat absorption / heat dissipation ratio of the grid-type copper pad 112 is appropriately made, it is possible to absorb the heat generated by the LED to the maximum, and to dissipate the absorbed heat as efficiently as possible. It becomes possible to achieve a heat dissipation effect of a different level than that of the prior art.

In addition, in the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied, the size of the LED soldering pad 111 can be maximized, and a connection part (via) is formed in the LED soldering pad 111 to transfer the second heat of the LED. The heat emitted through the path 620 may be absorbed by the LED soldering pad 111 , and the absorbed heat may be transferred to the grid-type copper pad 112 .

For reference, the connection part (via) may be configured to have a size of 0.2 mm to 0.5 mm depending on the size of the pad, and the connection part (via) fill may be configured to have a high conductivity structure filled with copper or lead.

In addition, the grid-type copper pad 112 can be configured to be close to the LED soldering pad 111 by making the insulation width as narrow as possible in the range where there is no electric/electronic signal interference, and by this configuration, the grid-type copper pad 112 is formed. Heat transfer can be made easier.

In addition, the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied is installed to be spaced apart from the first layer 110 by a predetermined distance, and a fourth layer 140 in which a plurality of pad holes 140a are formed; is configured to include can be

At this time, the inside of each of the plurality of pad holes 140a is plated with copper, the fastening member 50 is coupled to each of the plurality of pad holes 140a, and the heat transferred to the lattice-type copper pad 112 and the absorbed electromagnetic waves may be configured to be transmitted to the fourth layer 140 through the pad hole 140a.

In the present invention, electronic components are mounted on the fourth layer 140 , and signal patterns, VCC, and GND patterns may be formed, and may be configured to include a plurality of pad holes 140a.

For reference, a signal control pattern and a VCC and GND pattern may be formed in the second layer (not shown) and the third layer (not shown). Since this is a generally known technique, a detailed description thereof will be omitted.

In the present invention, the first layer 110 , the second layer, and the third to fourth layers 140 may be combined to form a single PCB 100 structure.

A plurality of pad holes 110a may be formed in the first layer 110 to correspond to the plurality of pad holes 140a of the fourth layer 140 , and a plurality of pad holes 140a of the fourth layer 140 may be formed. ) and the inside of the plurality of pad holes 110a of the first layer 110 are connected by copper plating, and a plurality of connection parts ( via) can be formed to become another transmission path for heat and electromagnetic waves.

Figure 4 is a state diagram of the LED module to which electromagnetic wave blocking and heat dissipation technology according to the present invention is applied, Figure 5 is an embodiment of the front injection plate according to the present invention, Figure 6 is a partial enlarged view of Figure 5, Figure 7 is an embodiment of the injection plate for the rear according to the present invention, Figure 8 is a view showing an embodiment of the module in the plate according to the present invention.

Referring to FIG. 4, the LED module to which the electromagnetic wave blocking and heat dissipation technology according to the present invention is applied includes: a front ejection plate 200 coupled from one side of the first layer 110; a rear ejection plate 300 coupled from one side of the fourth layer; and a module-in-plate 400 coupled from one side of the injection plate for the rear surface; may be configured to further include.

The front ejection plate 200 is a component coupled to one side of the first layer 110 , that is, the front surface of the PCB 100 .

Referring to FIG. 5 , a hole 210 for LEDs may be formed in the front ejection plate 200 . As the LED holes 210 are formed, the frame 220 of the front ejection plate 200 has a lattice structure. can have a form. The frame 220 of the front ejection plate 200 may have a trough structure recessed by a predetermined depth in the vertical, left, and right directions. Such a bone structure may be formed at an angle of, for example, about 60 degrees.

By the rib structure of the frame 220 of the front ejection plate 200, sunlight is diffusely reflected to minimize the interference of sunlight to the LED output, thereby further improving the LED output contrast ratio.

The ejection plate 300 for the second part is a component coupled to one side of the fourth layer 140 , that is, on the rear surface of the PCB 100 . Referring to FIG. 7 , the ejection plate 300 for the rear part is formed in a rectangular frame shape. and a heterogeneous nut-type dowel 310 may be formed at a position coincident with the pad hole 140a of the fourth layer 140 .

The module inboard plate 400 is coupled from one side of the injection plate 300 for the rear side, and may be formed in a shape as shown in FIG. 8 .

In the present invention, M1 bolts are used on the side of the injection plate 200 for the front side, and M4 bolts are used on the side of the module in-board plate 400 and may be combined. This bolt coupling serves to firmly fix the front ejection plate 200, PCB 100, sequel ejection plate 300, and module inner plate 400, and at the same time absorb electromagnetic waves and heat absorbed by the LED module into the module inner plate. It serves as a connecting medium that emits to 400.

In the present invention, the front ejection plate 200, the first layer 110 to the fourth layer 140 are combined, the PCB 100, and the rear ejection plate 300 are combined to form one LED module 10. It can be configured, and these LED modules 10 can be coupled to the module in-board plate or the electronic signboard housing 500 .

Therefore, the lattice-type copper pad 112 of the first layer 110 can block, absorb, and emit electromagnetic waves generated from the SMPS and electronic control device inside the electronic signboard, and the electromagnetic waves transmitted to the module-in-plate 400 are reflected in the electronic signboard enclosure. It can be configured to emit through the ground of 500 .

In the present invention, a fastening member serving as a medium for emitting electromagnetic waves absorbed in the first layer 110 to the module inner plate 400 may be further included, and the fastening member may be composed of a heterogeneous nut-type dowel 310. have. Since the module-in-plate 400 is coupled to the electric sign housing 500, it has a structure in which the electromagnetic wave absorbed in the first layer 110 is efficiently emitted through the electric sign housing 500 and the ground.

In conclusion, the present invention generates electromagnetic waves in the SMPS and electronic control device inside the electronic sign board → the grid-type copper pad 112 of the first layer 110 absorbs electromagnetic waves → the pad hole of the fourth layer 140 → the back ejection plate It is a technology having a mechanism for efficiently emitting electromagnetic waves absorbed through multiple stages in the order of moving to the electronic signboard housing 500 through the path of the heterogeneous nut-type dowel 310 of 300 → grounding.

The detailed description of the preferred embodiments of the present invention disclosed as described above is provided to enable any person skilled in the art to make and practice the present invention. Although the above has been described with reference to preferred embodiments of the present invention, it will be understood by those skilled in the art that various modifications and changes can be made to the present invention without departing from the scope of the present invention. For example, a person skilled in the art may use each configuration described in the above-described embodiments in a way that is combined with each other. Accordingly, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The present invention may be embodied in other specific forms without departing from the essential characteristics of the present invention. Accordingly, the above detailed description should not be construed as restrictive in all respects but as exemplary. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included in the scope of the present invention. The present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. In addition, claims that are not explicitly cited in the claims may be combined to form an embodiment or may be included as a new claim by amendment after filing.

10: LED module
100: PCB
110: first layer
110a: pad hole
111: LED soldering pad
112: grid-type copper pad
140: fourth layer
140a: pad hole
200: front ejection plate
210: hall for LED
220: frame
300: injection plate for the back
310: heterogeneous nut type dowel
400: module plate
500: electronic board enclosure
600: LED heat transfer path
610: first heat transfer path
620: second heat transfer path

Claims (6)

Including; a PCB having a first layer to a fourth layer;
The first layer includes a plurality of LED soldering pads and a grid-type copper pad formed of a copper material,
A plurality of pad holes are formed in the fourth layer,
The inside of each of the plurality of pad holes is copper-plated and connected to the lattice copper pad through the pad hole of the first layer,
Includes;
The heat generated at the junction of the LED is transferred to the second heat transfer path, which is a path including the lead frame,
It has a structure in which heat transferred to the second heat transfer path is conducted to the grid-type copper pad through the LED soldering pad,
The heat transferred to the lattice-type copper pad and the absorbed electromagnetic waves are configured to be transferred to the fourth layer through the plurality of pad holes,
a front ejection plate coupled from one side of the first layer;
an ejection plate for a rear surface coupled from one side of the fourth layer; and
It is formed in a position coincident with the pad hole of the fourth layer in the rear ejection plate, and a heterogeneous nut-type dowel that serves as a medium for emitting electromagnetic waves absorbed in the first layer to the inner plate of the module; includes;
One LED module in which the front ejection plate, the PCB having the first to fourth layers, and the rear ejection plate are combined is installed in the module in-board plate or in the electric sign box, and the SMPS and electronic control inside the signboard housing The lattice-type copper pad of the first layer is configured to block, absorb and emit electromagnetic waves generated by the device,
The LED module to which electromagnetic wave blocking and heat dissipation technology is applied, characterized in that it is configured to transmit the electromagnetic wave that is blocked and absorbed by the LED module to the module inner plate or the electronic signboard housing and to emit it through the ground connected to the electric signboard housing.
According to claim 1,
In the first layer, the grid-type copper pad is an LED module to which electromagnetic wave blocking and heat dissipation technology is applied, characterized in that the technology area, which is the area excluding the plurality of LED soldering pads, is 68% of the total area.
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