KR102361474B1 - Apparatus and method for treating a substrate and an apparatus for treating a substrate - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. According to an embodiment, a substrate processing apparatus includes: a housing providing a processing space; a support unit for supporting the substrate in the processing space; a processing liquid supply unit supplying a processing liquid to a processing surface of a substrate supported by the support unit; and a cleaning unit for cleaning the processing surface of the substrate to which the processing liquid has been supplied, the cleaning unit comprising: a body provided to be in contact with the processing liquid supplied to the processing surface while the substrate is being cleaned; a vibration generator provided on the body to apply vibration to the processing liquid on the substrate; And it may include a cleaning liquid supply nozzle provided inside the body to supply the cleaning liquid to the processing surface of the substrate.

Description

Substrate processing apparatus and method

The present invention relates to a substrate processing apparatus and method, and more particularly, to a substrate processing apparatus and method for cleaning a substrate.

Substrates such as semiconductor wafers and flat panel displays are exposed to various types of contaminants during a series of manufacturing processes. That is, any material present during the manufacturing process of the substrate becomes a potential source of contaminants. Contaminants may be deposited on the surface of the substrate in the form of particles, and if the particles are not removed, process defects may occur.

Therefore, there is a need to clean the particles from the surface of the substrate without damaging the nanostructures formed on the substrate. The size of the particle is generally about the critical dimension size of the nanostructure fabricated on the substrate. However, it is not easy to remove these small particles without adversely affecting the nanostructures on the substrate with the conventional cleaning technology.

For example, as a technique for cleaning particles, conventional methods such as brush cleaning and ultrasonic cleaning have been mainly used.

Brush cleaning is a contact cleaning method using frictional force, and is effective in removing relatively large particles.

However, in this method, as the size of the structure is continuously reduced, the probability of damage to the structure due to the application of a physical force to the substrate surface may increase. For example, a structure having a high aspect ratio has a problem in that it may be easily damaged by a physical force.

Ultrasonic cleaning is a method of cleaning using the cavitation phenomenon generated by ultrasonic waves, and is a technology of cleaning with the energy as the growth and destruction of bubbles are repeated while the cavitation phenomenon continues.

Specifically, when cavitation is generated inside the cleaning fluid by the ultrasonic wave oscillated from the ultrasonic oscillation means, some bubbles grow as spherical uniform nuclei while repeating expansion and contraction, and some bubbles grow in an asymmetric shape. destroy without When such bubble collapse occurs, a pressure wave is generated at the time of the bubble's disappearance, and the deposits on the substrate surface are removed by this pressure wave.

Such a technique applies high-frequency vibrations directly to the fluid to transfer energy and flow in the form of generating and destroying air bubbles. This type of energy transfer method consumes more energy than necessary, and the amount of energy transferred to the substrate is quite large. In addition, as shown in FIG. 1 , when a shear stress is applied to the nanostructures 10 to remove the particles 20 present between the nanostructures 10 , since it may cause damage to the nanostructures 10 . There is a problem in that the substrate on which the structure 10 is formed is not suitable for use.

The present invention provides a substrate cleaning apparatus and a substrate cleaning method capable of efficiently removing contaminants such as particles without damage to a fine pattern or structure on a substrate surface.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides an apparatus for processing a substrate. According to one embodiment, a substrate processing apparatus includes a housing providing a processing space; a support unit for supporting the substrate in the processing space; a processing liquid supply unit supplying a processing liquid to a processing surface of a substrate supported by the support unit; and a cleaning unit for cleaning the processing surface of the substrate to which the processing liquid has been supplied, the cleaning unit comprising: a body provided to be in contact with the processing liquid supplied to the processing surface while the substrate is being cleaned; a vibration generator provided on the body to apply vibration to the processing liquid on the substrate; And it may include a cleaning liquid supply nozzle provided inside the body to supply the cleaning liquid to the processing surface of the substrate.

According to one embodiment, the vibration generator may be provided on the bottom surface of the body.

According to an embodiment, the body may further include a first block disposed between the vibration generator and the cleaning liquid supply nozzle and protruding downward from the vibration generator.

According to one embodiment, the first block may be provided in a porous material.

According to an embodiment, the body is disposed between the vibration generator and the first block, and a second block protruding downward than the vibration generator may be formed.

According to one embodiment, a third block protruding downward than the vibration generator is formed at the end of the body, and the third block, the vibration generator, and the cleaning liquid supply nozzle may be provided in this order.

According to one embodiment, the third block may be provided with an inner surface inclined downward in a direction away from the vibration generator.

According to an embodiment, the cleaning unit includes: a support arm on which a body is installed; It may further include a moving member for moving the support arm.

According to an embodiment, the support unit includes: a vacuum line for vacuum adsorbing the substrate; It may further include a pressure reducing member for providing a vacuum pressure to the vacuum line.

According to an embodiment, the treatment liquid and the cleaning liquid may be provided as the same type of liquid.

The present invention also provides a method for processing a substrate. According to one embodiment, a substrate processing method includes: a housing providing a processing space; a support unit for supporting the substrate in the processing space; a processing liquid supply unit supplying a processing liquid to a processing surface of a substrate supported by the support unit; and a cleaning unit for cleaning the processing surface of the substrate to which the processing liquid has been supplied, the cleaning unit comprising: a body provided to be in contact with the processing liquid supplied to the processing surface while the substrate is being cleaned; a vibration generator provided on the body to apply vibration to the processing liquid on the substrate; and supplying the processing liquid to the processing surface of the rotating substrate by using a substrate processing apparatus including a cleaning liquid supply nozzle provided inside the body and supplying the cleaning liquid to the processing surface of the substrate; a cleaning step of cleaning the treatment surface of the substrate to which the treatment liquid has been supplied, wherein in the cleaning step, the body is brought into contact with the treatment liquid supplied on the substrate and the vibration generator vibrates the bubbles of the treatment liquid on the rotating substrate for treatment The liquid may flow, and the cleaning liquid supply nozzle may supply the cleaning liquid onto the substrate.

According to an embodiment, in the cleaning step, the substrate may be provided to be rotated slower than the speed at which the substrate is rotated in the processing liquid supply step.

According to an embodiment, in the cleaning step, the vibration generator may be provided to linearly move the central region of the substrate and the edge region of the substrate.

According to an embodiment, the body may further include a first block disposed between the vibration generator and the cleaning liquid supply nozzle, protruding downward from the vibration generator, and provided in a porous manner.

According to one embodiment, a third block protruding downward than the vibration generator is formed at the end of the body, and the third block, the vibration generator, and the cleaning liquid supply nozzle may be provided in this order.

According to an embodiment of the present invention, the bubbles vibrating by sound waves generate a microfluidic field in the cleaning fluid, and the microfluidic field can remove particles present on the surface of the substrate on which the nanostructure is formed without damaging the nanostructure.

Effects of the present invention are not limited to the above-described effects, and effects not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and accompanying drawings.

1 is a view schematically showing a general substrate processing apparatus.
2 is a plan view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention.
3 is a cross-sectional view schematically illustrating an embodiment of the liquid processing chamber of FIG. 2 .
4 is a cross-sectional view illustrating a cleaning unit according to an embodiment of the present invention.
5 is a view showing a flowchart of a substrate processing method according to an embodiment of the present invention.
6 to 11 are views sequentially showing a substrate processing method of the present invention, respectively.
12 to 13 are cross-sectional views each showing a cleaning unit according to another embodiment of the present invention.
14 is a cross-sectional view schematically illustrating a liquid processing chamber according to another embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Therefore, the shape of the element in the drawings is exaggerated to emphasize a clearer description.

2 is a plan view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 2 , the substrate processing apparatus includes an index module 10 and a processing module 20 . According to an embodiment, the index module 10 and the processing module 20 are disposed along one direction. Hereinafter, a direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction 92 , and a direction perpendicular to the first direction 92 when viewed from the top is referred to as a second direction 94 . and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96 .

The index module 10 transfers the substrate W from the accommodated container 80 to the processing module 20 , and accommodates the substrate W that has been processed in the processing module 20 into the container 80 . The longitudinal direction of the index module 10 is provided in the second direction 94 . The index module 10 has a load port 12 and an index frame 14 . With reference to the index frame 14 , the load port 12 is located on the opposite side of the processing module 20 . The container 80 in which the substrates W are accommodated is placed on the load port 12 . A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be disposed along the second direction 94 .

As the container 80, an airtight container such as a Front Open Unified Pod (FOUP) may be used. The vessel 80 may be placed in the load port 12 by a transfer means (not shown) or an operator, such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. can

The index frame 14 is provided with an index robot 120 . A guide rail 140 having a longitudinal direction in the second direction 94 is provided in the index frame 14 , and the index robot 120 may be provided to be movable on the guide rail 140 . The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 moves forward and backward, rotates about the third direction 96 , and moves in the third direction 96 . It may be provided to be movable along with it. A plurality of hands 122 are provided to be vertically spaced apart, and the hands 122 may move forward and backward independently of each other.

The processing module 20 includes a buffer unit 200 , a transfer chamber 300 , and a liquid processing chamber 400 . The buffer unit 200 provides a space in which the substrate W brought into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process of liquid-processing the substrate W by supplying a liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400 .

The transfer chamber 300 may be provided in the first direction 92 in its longitudinal direction. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300 . The liquid processing chamber 400 may be disposed on the side of the transfer chamber 300 . The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction 94 . The buffer unit 200 may be located at one end of the transfer chamber 300 .

According to an example, the liquid processing chambers 400 are disposed on both sides of the transfer chamber 300 , and the liquid processing chambers 400 are disposed on one side of the transfer chamber 300 in the first direction 92 and the third direction 96 . ) may be provided in an array of AXB (A and B are each 1 or a natural number greater than 1), respectively.

The transfer chamber 300 has a transfer robot 320 . A guide rail 340 having a longitudinal direction in the first direction 92 is provided in the transfer chamber 300 , and the transfer robot 320 may be provided to be movable on the guide rail 340 . The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 moves forward and backward, rotates about the third direction 96 , and moves in the third direction 96 . It may be provided to be movable along with it. A plurality of hands 322 are provided to be vertically spaced apart, and the hands 322 may move forward and backward independently of each other.

The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be disposed to be spaced apart from each other in the third direction 96 . The buffer unit 200 has an open front face and a rear face. The front surface is a surface facing the index module 10 , and the rear surface is a surface facing the transfer chamber 300 . The index robot 120 may access the buffer unit 200 through the front side, and the transfer robot 320 may access the buffer unit 200 through the rear side.

3 is a diagram schematically illustrating an embodiment of the liquid processing chamber 400 of FIG. 2 . Referring to FIG. 3 , the liquid processing chamber 400 includes a housing 410 , a cup 420 , a support unit 440 , a processing liquid supply unit 460 , and an elevation unit 450 .

The housing 410 is provided in a generally rectangular parallelepiped shape. The cup 420 , the support unit 440 , and the treatment liquid supply unit 460 are disposed in the housing 410 .

The cup 420 has a processing space with an open top, and the substrate W is liquid-processed in the processing space. The support unit 440 supports the substrate W in the processing space. The processing liquid supply unit 460 supplies the liquid onto the substrate W supported by the support unit 440 . The liquid may be provided in a plurality of types, and may be sequentially supplied onto the substrate (W). The lifting unit 450 adjusts the relative height between the cup 420 and the support unit 440 .

According to one example, the cup 420 has a plurality of collection containers (422, 424, 426). The recovery barrels 422 , 424 , and 426 each have a recovery space for recovering a liquid used for substrate processing. Each of the collection bins 422 , 424 , and 426 is provided in a ring shape surrounding the support unit 440 . When the liquid treatment process is in progress, the treatment liquid scattered by the rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, and 426a of each of the collection tubes 422 , 424 , and 426 .

According to an example, the cup 420 includes a first collection container 422 , a second collection container 424 , and a third collection container 426 . The first waste container 422 is disposed to surround the support unit 440 , the second waste container 424 is disposed to surround the first waste container 422 , and the third waste container 426 is the second waste container 426 . It is disposed so as to surround the recovery container (424). The second inlet 424a for introducing the liquid into the second collection tube 424 is located above the first inlet 422a for introducing the liquid into the first collection tube 422, and the third collection tube 426. The third inlet 426a through which the liquid is introduced may be located above the second inlet 424a.

The support unit 440 supports and rotates the substrate W. The support unit 440 includes a support plate 442 , a rotation shaft 444 , and an actuator 446 . The support plate 442 is provided to have a circular plate shape. The substrate W is in contact with the upper surface of the support plate 442 . The support plate 442 is provided to have a smaller diameter than the substrate W. According to an example, a vacuum line 447 may be provided inside the support plate 442 to vacuum adsorb the substrate W. A pressure reducing member 448 that provides vacuum pressure to the vacuum line 447 may be installed. Accordingly, the support plate 442 may vacuum the substrate W to adsorb the substrate W. In another example, the support plate 442 may chuck the substrate W with a physical force.

When viewed from the top, the substrate W may be positioned so that its central axis coincides with the central axis of the support plate 442 . The rotation shaft 444 may support the support plate 442 under the support plate 442 . The rotation shaft 444 may be provided such that its longitudinal direction is up and down. The rotating shaft 444 may be provided to be rotatable about its central axis. The actuator 446 may provide a driving force to rotate the rotation shaft 444 . For example, the driver 446 may be a motor.

The lifting unit 450 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W is changed by the vertical movement of the cup 420 . Accordingly, since the recovery tubes 422 , 424 , and 426 for recovering the processing liquid are changed according to the type of the liquid supplied to the substrate W, the liquids can be separated and collected. Unlike the above, the cup 420 is fixedly installed, and the lifting unit 450 may move the support unit 440 in the vertical direction.

According to an example, the processing liquid supply unit 460 supplies various processing liquids on the substrate W. The treatment liquid may be a liquid having acid or basic properties, or a cleaning liquid. For example, the treatment solution may include diluted sulfuric acid (H2SO4, Diluted Sulfuric acid Peroxide), phosphoric acid (P2O5), hydrofluoric acid (HF), and ammonium hydroxide (NH4OH). The cleaning liquid may be a liquid that removes a film or foreign material remaining on the substrate W. For example, the cleaning liquid may be DIW (deionized water) or an organic solvent. The organic solvent may be isopropyl alcohol (IPA).

The processing liquid supply unit 460 includes a processing liquid supply nozzle 462 and an arm 461 . The processing liquid is supplied onto the substrate W from the processing liquid supply nozzle 462 . The treatment liquid supply nozzle 462 is supported by the arm 461 and may be moved by the arm 461 .

The cleaning unit 470 cleans the substrate W to which the processing liquid is supplied. The cleaning unit 470 includes a body 472 , a connecting member 471 , and a support arm 473 . The body 472 is connected to the support arm 473 by a connecting member 471 , and the support arm 473 may be moved by a moving member (not shown).

The controller 40 controls the processing liquid supply unit 460 , the cleaning unit 470 , and the support unit 440 .

4 is a cross-sectional view showing a cleaning unit 470 according to an embodiment of the present invention. Referring to FIG. 4 , the cleaning unit 470 includes a body 472 , a vibration generator 490 , and a cleaning liquid supply nozzle 482 .

The body 472 is provided to be in contact with the treatment liquid supplied to the treatment surface while the substrate is being cleaned. In one example, the body 472 is provided in a rectangular parallelepiped shape.

The vibration generator 490 is provided in the body 472 to apply vibration to the processing liquid on the substrate. In one example, the vibration generator 490 is provided on the bottom surface of the body 472 . In one example, the length of the vibration generator 490 is provided equal to the length of the body 472 . The vibration generator 490 removes particles on the substrate by using vibrations of microbubbles.

The cleaning liquid supply nozzle 482 is provided inside the body 472 to supply the cleaning liquid onto the substrate. The cleaning liquid supply line 484 supplies the cleaning liquid from a cleaning liquid supply source (not shown) to the cleaning liquid supply nozzle 482 . The cleaning liquid supply control valve controls the amount of the cleaning liquid supplied to the cleaning liquid supply nozzle 482 from a cleaning liquid supply source (not shown).

The body 472 is provided with a first block 610 and a third block 630 .

The first block 610 is disposed between the vibration generator 490 and the cleaning solution supply nozzle 482 and protrudes below the vibration generator 490 . The first block 610 reduces the flow rate of the fluid flowing in the direction of the vibration generator 490 . In one example, the first block 610 is provided in a porous material.

The third block 630 is formed at the end of the body 472 . The third block 630 reduces the flow velocity of the bottom surface of the vibration generator 490 in the opposite direction with respect to the first block 610 and the vibration generator 490 . In one example, the third block 630 , the vibration generator 490 and the cleaning liquid supply nozzle 482 are provided in this order. The first block 610 and the third block 630 formed below the vibration generator 490 are formed on both sides of the vibration generator 490 to reduce the flow rate of the fluid located on the bottom surface of the vibration generator 490 .

Hereinafter, a substrate processing method of the present invention will be described with reference to FIGS. 5 to 11 . 5 is a flowchart of a substrate processing method of the present invention, and FIGS. 6 to 11 are views sequentially showing the substrate processing method of the present invention, respectively.

Referring to FIG. 5 , the substrate processing method of the present invention includes a processing liquid supply step ( S10 ) and a cleaning step ( S20 ). In one example, the treatment liquid and the cleaning liquid are provided as the same type of liquid. Hereinafter, it will be described that the treatment liquid and the cleaning liquid are provided as the same type of liquid. In one example, the cleaning liquid is DIW (deionized water) or isopropyl alcohol (iso propyl alcohol).

In the processing liquid supply step S10 , the processing liquid is supplied to the processing surface of the rotating substrate W as shown in FIG. 5 . At this time, the substrate W placed on the support plate is rotated at a speed of V1. In one example, the processing liquid supply nozzle 462 supplies the processing liquid onto the substrate W in a region where the substrate W faces the center.

As the substrate W rotates, the processing liquid spreads to the edge region of the substrate W by centrifugal force as shown in FIG. 6 . When the supply of the treatment liquid is completed, the substrate W placed on the support plate is rotated at a speed of V2 to form a film of the treatment liquid on the substrate W. In one example, V2 is provided at a lower rate than V1.

During the cleaning step (S20), the substrate (W) is rotated to prevent the particles from sinking on the substrate (W). However, when the substrate W is rotated at a high speed during the cleaning step S20 , micro-flow is not generated in the fluid on the substrate W by the vibration generator 490 , and the vibration generator 490 The pattern on the substrate W may be destroyed by the generated vibration. Accordingly, V2 is provided at a low speed in order to prevent the destruction of the pattern on the substrate W.

When the supply of the treatment liquid is completed, the cleaning step S20 is performed as shown in FIGS. 7 to 9 . In the cleaning step S20 , the processing surface of the substrate W is cleaned.

7 to 8 , when the cleaning step S20 is started, the body 472 is moved closer to the treatment liquid film on the substrate W. The body 472 is completely in contact with the treatment liquid film or is finely aligned with a position higher than the treatment liquid film. Even if the body 472 does not completely contact the treatment liquid film, the body 472 and the treatment liquid film come into contact with each other due to the surface tension of the treatment liquid film.

The body 472 is positioned in the central region of the substrate W when the cleaning step S20 starts, and linearly moves to the edge region of the substrate W when the cleaning step S20 is completed. During the cleaning step ( S20 ), the bar body 472 on which the substrate W is rotated cleans the entire surface of the substrate W to which the processing liquid is applied. The body 472 is provided at a sufficiently low speed compared to V2 so that a micro flow can be generated in the fluid on the substrate W by the vibration generator 490 .

Referring to FIG. 9 , the vibration generator 490 generates vibration after the body 472 is brought into contact with the processing liquid supplied on the substrate W. The vibration generator 490 uses a microfluidic field induced by bubbles vibrating with stimulation of sound waves. In this case, the bubbles are generated in the process of supplying the processing liquid or the cleaning liquid to the substrate W. When the frequency of the sound wave generated by the vibration generator 490 matches the resonant frequency of the bubble, the vibration of the bubble is maximized.

The micro-streaming generated at this time pushes out fluids such as treatment liquid or cleaning liquid around the bubbles, and removes particles from the substrate W by the jet flow of the fluid.

When the bubble is exposed to the sound wave generated by the vibration generator 490, it vibrates by repeating contraction and expansion periodically due to its compressibility. It is proportional to the amplitude of the sound wave and is maximized when the frequency of the sound wave coincides with the resonant frequency of the bubble.

When a bubble vibrates while repeating contraction and expansion by sound waves, a microfluidic field is generated around the bubble and the cleaning fluid due to the difference in physical properties of the two materials forming the interface. The micro-flow field caused by sound waves and air bubbles induces a jet flow of the fluid on the substrate W, which applies a normal stress to the particles on the substrate W as shown in FIG. 10 . Accordingly, the substrate (W) cleaning apparatus according to the embodiment of the present invention implements a cleaning function to remove particles from the substrate (W). The vibration generated by the vibration generator 490 removes particles from the substrate W without destroying the pattern on the substrate W as a micro-flow.

In the cleaning step S20 , the cleaning liquid supply nozzle 482 provided inside the body 472 supplies the cleaning liquid onto the substrate W. Accordingly, the level of the liquid film of the processing liquid on the substrate W is prevented from being lowered. Also, the particles separated from the substrate W by the vibration generator 490 are moved to the outside of the substrate W without being reattached to the substrate W.

When the flow rate is too fast, a shape in which the pattern of the substrate W is destroyed occurs without micro-flow generated by the vibration generator 490 . To prevent this, the cleaning liquid discharged from the cleaning liquid supply nozzle 482 is guided to the porous first block 610 to reduce the flow rate flowing in the direction of the vibration generator 490 . In addition, the third block 630 stops the flow of the fluid on the bottom surface of the vibration generator 490 to reduce the flow rate of the fluid located on the bottom surface of the vibration generator 490, and to effectively remove particles from the bottom surface of the vibration generator 490 . do.

11 and 12 are cross-sectional views each showing a cleaning unit 470 according to another embodiment of the present invention. Referring to FIG. 11 , according to another embodiment of the present invention, the cleaning unit 470 of FIG. 9 may further include a second block 620 . The second block 620 is installed between the first block 610 and the third block 630 . In one example, the second block 620 is installed between the vibration generator 490 and the first block (610). The second block 620 functions to once again lower the flow rate of the fluid whose flow rate has been primarily lowered by the first block 610 .

Referring to FIG. 12 , the inner surface of the third block 630 is provided to be inclined downward in a direction away from the vibration generator 490 to prevent eddy currents that may occur on the inner surface of the third block 630 .

In the above-described example, it has been described that one surface of the substrate W is cleaned. However, in another example, as shown in FIG. 13 , the substrate W is inverted after one surface is cleaned by the inversion unit 1300, so that the other surface that is not cleaned by the cleaning unit 470 of the present invention can be cleaned. have.

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

470: cleaning unit
471: connection member
472: body
482: cleaning solution supply nozzle
490: vibration generator
610: first block
620: second block
630: third block

Claims (15)

An apparatus for processing a substrate, comprising:
a housing providing a processing space;
a support unit for supporting a substrate in the processing space;
a processing liquid supply unit supplying a processing liquid to the processing surface of the substrate supported by the support unit; and
a cleaning unit for cleaning the processing surface of the substrate to which the processing liquid is supplied;
The cleaning unit is
a body provided to be in contact with the treatment liquid supplied to the treatment surface while the substrate is being cleaned;
a vibration generator provided on the body to apply vibration to the processing liquid on the substrate; and
a cleaning liquid supply nozzle provided inside the body to supply a cleaning liquid to the processing surface of the substrate;
The body includes a first block disposed between the vibration generator and the cleaning solution supply nozzle and protruding downward from the vibration generator. According to claim 1,
The vibration generator is a substrate processing apparatus provided on a bottom surface of the body. delete According to claim 1,
The first block is a substrate processing apparatus provided in a porous material. According to claim 1,
The body is
and a second block disposed between the vibration generator and the first block and protruding downward from the vibration generator.
An apparatus for processing a substrate, comprising:
a housing providing a processing space;
a support unit for supporting a substrate in the processing space;
a processing liquid supply unit supplying a processing liquid to the processing surface of the substrate supported by the support unit;
and
a cleaning unit for cleaning the processing surface of the substrate to which the processing liquid is supplied;
The cleaning unit is
a body provided to be in contact with the treatment liquid supplied to the treatment surface while the substrate is being cleaned;
A vibration generator provided on the body to apply vibration to the processing liquid on the substrate; And,
a cleaning liquid supply nozzle provided inside the body to supply a cleaning liquid to the processing surface of the substrate;
A third block protruding downward than the vibration generator is formed at the end of the body,
and the third block, the vibration generator, and the cleaning solution supply nozzle are sequentially provided.
7. The method of claim 6,
In the third block, an inner surface of the substrate processing apparatus is provided to be inclined downward in a direction away from the vibration generator. 8. The method of any one of claims 1, 2, and 4 to 7,
The cleaning unit is
a support arm on which the body is installed;
The substrate processing apparatus further comprising a moving member for moving the support arm. 8. The method of any one of claims 1, 2, and 4 to 7,
The support unit is
a vacuum line for vacuum adsorbing the substrate;
The substrate processing apparatus further comprising a pressure reducing member for providing a vacuum pressure to the vacuum line. 8. The method according to any one of claims 1, 2 and 4 to 7,
The substrate processing apparatus in which the processing liquid and the cleaning liquid are provided as the same type of liquid. 7. A method for processing a substrate using the apparatus of any one of claims 1 to 6, comprising:
a processing liquid supply step of supplying the processing liquid to the processing surface of the rotating substrate;
A cleaning step of cleaning the processing surface of the substrate to which the processing liquid is supplied,
In the washing step,
The body is brought into contact with the treatment liquid supplied on the substrate and the vibration generator vibrates the bubbles of the treatment liquid on the substrate rotating to flow the treatment liquid,
The substrate processing method, wherein the cleaning solution supply nozzle supplies a cleaning solution onto the substrate. 12. The method of claim 11,
In the washing step,
The substrate processing method is provided such that the substrate is rotated slower than the rotation speed of the substrate in the step of supplying the processing liquid. 12. The method of claim 11,
In the washing step,
wherein the vibration generator is provided to linearly move a central region of the substrate and an edge region of the substrate.

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