KR102354866B1 - Complex sheet having improved heat insulation ability and electronic device having the same - Google Patents

Abstract

The heat insulation composite sheet includes a porous layer having pores, a heat resistance layer including polyimide, and a heat absorption layer including a phase change material and an adhesive material.

Description

COMPLEX SHEET HAVING IMPROVED HEAT INSULATION ABILITY AND ELECTRONIC DEVICE HAVING THE SAME comprising the same

The present invention relates to an insulating sheet. More particularly, it relates to a composite sheet having improved thermal insulation performance and an electronic device including the same.

In recent years, the use of electronic devices that generate a lot of heat, such as an electronic cigarette and a smart phone, are increasing.

Such heat may adversely affect the performance or reliability of the electronic device and shorten the lifespan. In addition, when the electronic device is in direct contact with the human body, it is necessary to block heat transferred to the human body.

Accordingly, the importance of thermal management and thermal isolation design is growing.

One object of the present invention is to provide a composite sheet having improved thermal insulation performance.

Another object of the present invention is to provide an electronic device including the composite heat insulating sheet.

However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present invention.

Insulation composite sheet according to exemplary embodiments of the present invention for achieving the above-described object of the present invention, a porous layer having pores, a heat resistant layer including polyimide, and heat including a phase change material and an adhesive material an absorbent layer.

According to an embodiment, the porous layer is disposed between the heat resistance layer and the heat absorption layer, and has a thickness greater than that of the heat absorption layer.

According to an embodiment, the composite heat insulating sheet further includes a graphite layer disposed between the porous layer and the heat absorption layer.

According to one embodiment, the thickness of the porous layer is 150 to 250㎛, the thickness of the heat absorption layer is 50 to 150㎛, the thickness of the heat resistance layer is 10 to 50㎛, the thickness of the graphite layer is 10 to 100 μm.

According to an embodiment, the heat absorbing layer is disposed between the heat-resistant layer and the porous layer, and has a thickness greater than that of the porous layer.

According to an embodiment, the composite insulating sheet further includes a graphite layer disposed between the porous layer and the heat absorption layer.

According to one embodiment, the thickness of the heat absorption layer is 150 to 250㎛, the thickness of the porous layer is 50 to 150㎛, the thickness of the heat resistance layer is 10 to 50㎛, the thickness of the graphite layer is 10 to 100 μm.

According to an embodiment, the heat absorption layer includes microcapsules dispersed in the adhesive material and accommodating the paraffinic compound therein.

According to one embodiment, the total thickness of the composite insulating sheet is 500㎛ or less.

An electronic device according to exemplary embodiments of the present invention includes the composite heat insulating sheet and a heat source coupled to the composite heat insulating sheet so that the heat source is adjacent to the heat resistant layer of the composite heat insulating sheet.

The thermal insulation composite sheet according to embodiments of the present invention has excellent heat diffusion effect (direction perpendicular to the thickness) and heat blocking effect (thickness direction). Accordingly, it is possible not only to reduce the user's discomfort, but also to prevent damage due to heat of the electronic device including the heat source.

In addition, the thermal insulation composite sheet according to the embodiments of the present invention includes a graphite layer, so that thermal insulation performance can be greatly improved, and a peeling phenomenon can be prevented by minimizing the deviation in adhesive strength between both surfaces of the graphite layer.

1 to 4 are cross-sectional views illustrating thermal insulation composite sheets according to embodiments of the present invention.
5A and 5B are cross-sectional views illustrating an insulating composite sheet and a heat source coupled thereto according to embodiments of the present invention.
6A is a graph showing the temperature of the thermal insulation composite sheet according to Examples 1 and 2;
6B is a graph showing the temperature of the insulating composite sheet according to Examples 3 and 4 and the graphite sheet of Comparative Example 1. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Since the present invention may have various changes and may have various forms, specific embodiments will be illustrated and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, element, or combination thereof described in the specification exists, and includes one or more other features or numbers , it should be understood that it does not preclude the possibility of the presence or addition of steps, operations, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

1 to 4 are cross-sectional views illustrating thermal insulation composite sheets according to embodiments of the present invention.

Referring to FIG. 1 , the thermal insulation composite sheet 10 includes a porous layer 110 , a heat absorption layer 120 , and a heat resistance layer 130 . The thermal insulation composite sheet 10 may be combined with a heat source such as an electronic cigarette to provide thermal insulation performance. The thermal insulation composite sheet 10 may further include an adhesive layer 140 for bonding to a heat source such as an electronic device. According to an embodiment, the heat absorption layer 120 may be disposed between the porous layer 110 and the heat resistance layer 130 .

The porous layer 110 may include a plurality of pores. For example, the porous layer 110 may include pores formed by a chemical foaming agent, or may include expanded particles having pores. The porous layer 110 may absorb an external shock and may have thermal insulation performance.

For example, the porous layer 110 may be formed from a foaming composition including a foaming agent, an acryl-based binder resin, a curing agent, and a solvent.

According to one embodiment, the blowing agent may include pre-expanded particles. The pre-expanded particles may have a microsphere shape. For example, the pre-expanded particles may have the form of microspheres having a diameter ranging from about 5 micrometers (μm) to about 15 μm.

For example, the pre-expanded particles may include a foaming seed and an elastic shell coating the foamed seed surface.

According to an embodiment, the expanded seed may include a hydrocarbon-based material such as butane or pentane. In one embodiment, the foam seed may include the hydrocarbon-based material in the liquid phase. The resilient shell may comprise a polymeric material such as, for example, an acrilonitrile copolymer.

According to another embodiment, the blowing agent may include a chemical blowing agent. The chemical blowing agent may form hollow expanded particles by heating or generating gas by reaction with other components.

For example, the chemical foaming agent may include inorganic foaming agents such as ammonium carbonate, sodium carbonate, sodium bicarbonate, potassium hydroxide, sodium hydroxide, and the like, organic foaming agents such as azo compounds, nitro compounds, and sulfonyl compounds, water, and the like. The chemical blowing agent may generate a gas such as carbon dioxide gas, ammonia gas, nitrogen gas, or the like.

The acrylic binder resin is obtained by addition polymerization of monomers. The monomer mixture forming the acrylic resin is ethyl acrylate (EA), methyl methacrylate (MMA), n-butyl acrylate (n-BA), methoxy polyethylene glycol methacrylate (methoxy polyethylene glycol methacrylate, MPEGMA) and acrylamide.

The ethyl acrylate increases the softness of the foam structure formed from the foam composition, thereby increasing the shock absorption performance at room temperature. However, when the content of the ethyl acrylate is excessive, the reliability of the foam structure at a high temperature may be deteriorated. For example, the content of the ethyl acrylate is preferably 15 wt% to 35 wt% of the total weight of the monomer mixture.

The methyl methacrylate may increase the hardness of the foam structure, thereby increasing the reliability of the foam structure at high temperatures. However, when the content of the methyl methacrylate is excessive, the impact absorption performance of the foam structure may be deteriorated. For example, the content of the methyl methacrylate is preferably 15 wt% to 35 wt% of the total weight of the monomer mixture.

The n-butyl acrylate may increase the flexibility of the foam structure and increase the bonding force between the binder and the foam. However, when the content of the n-butyl acrylate is excessive, high temperature adhesion between the foam structure and the adhesive layer may be reduced. For example, the content of the n-butyl acrylate is preferably 15% to 30% by weight of the total weight of the monomer mixture.

The methoxypolyethylene glycol methacrylate may increase the repulsive force and restoring force against the impact of the foam structure. However, when the content of the methoxypolyethylene glycol methacrylate is excessive, the impact absorption performance of the foam structure and the bonding strength with the adhesive layer at room temperature may be reduced. For example, the content of the methoxypolyethylene glycol methacrylate is preferably 10% to 20% by weight of the total weight of the monomer mixture. The methoxypolyethylene glycol methacrylate is a polymeric monomer, and when the molecular weight is excessively large, the high temperature adhesion between the foam structure and the adhesive layer may be reduced, and when too little, the shock absorption performance of the foam structure and at room temperature The bonding strength with the adhesive layer may be reduced. Preferably, the weight average molecular weight of the methoxypolyethylene glycol methacrylate may be about 30,000 to 50,000.

The acrylamide may increase the elasticity of the foam structure, but when the content is excessive, the impact absorbing performance and adhesion at room temperature of the foam structure may be reduced. For example, the content of the acrylamide is preferably 1 wt% to 5 wt% of the total weight of the monomer mixture.

According to an embodiment, the monomer mixture may further include styrene. The styrene may increase the high-temperature/high-humidity reliability of the foamed structure, but when the content is excessive, the impact absorbing performance of the foamed structure and bonding strength with the adhesive layer at room temperature may be reduced. For example, the content of the styrene is preferably 1 wt% to 3 wt% of the total weight of the monomer mixture.

Accordingly, according to one embodiment, the monomer mixture comprises 15 wt% to 35 wt% of ethyl acrylate, 15 wt% to 35 wt% of methyl methacrylate, 15 wt% to 30 wt% of n-butyl acrylate, 10 wt% to 20 wt% of oxypolyethylene glycol methacrylate, 1 wt% to 5 wt% of acrylamide, and 1 wt% to 3 wt% of styrene may be included.

The molecular weight of the acrylic binder resin may be controlled by polymerization temperature and reaction time. For example, the weight average molecular weight of the acrylic binder resin is preferably 200,000 to 300,000. When the weight average molecular weight of the acrylic binder resin exceeds 200,000, the viscosity is excessively increased to deteriorate fairness, and when it is less than 300,000, mechanical properties may decrease.

For example, the acrylic binder resin may have a glass transition temperature of about -50°C to 30°C depending on the composition. When the glass transition temperature of the acrylic binder resin is excessively low, the compressive load is reduced and the restoring force is lowered, and the high-temperature adhesion with the adhesive layer may be reduced. The room temperature adhesion with it may be lowered. Preferably, the glass transition temperature of the acrylic binder resin may be -30°C to 0°C, and more preferably, -20°C to 0°C. For example, the monomer mixture for obtaining a glass transition temperature of -20°C to 0°C is 20% to 30% by weight of ethyl acrylate, 25% to 30% by weight of methyl methacrylate, and n-butyl acrylic 15% to 25% by weight of the rate, 10% to 20% by weight of methoxypolyethylene glycol methacrylate, 1% to 5% by weight of acrylamide, and 1% to 3% by weight of styrene.

As the curing agent, an epoxy-based compound, a melamine-based compound, an isocyanate compound, a metal salt, or an amine-based compound may be used. These may be used alone or in combination of two or more. In one embodiment, an isocyanate compound may be used as the curing agent.

The solvent may be an organic solvent such as toluene, methyl ethyl ketone (MEK), ethyl acrylate (EA), and the like. The foaming composition may be adjusted to have an appropriate viscosity by the solvent, for example, the foaming composition may have a viscosity of about 1,600 cps to about 2,400 cps.

According to an embodiment, the foaming composition includes 1 part by weight to 10 parts by weight of the foaming agent, 0.5 parts by weight to 5 parts by weight of the curing agent, and 20 parts by weight to 30 parts by weight of the solvent, based on 100 parts by weight of the acrylic binder resin. can do.

According to an embodiment, the foaming composition may further include a pigment material such as carbon black or graphite powder. For example, the pigment may be mixed in an amount of 1 to 5 parts by weight based on 100 parts by weight of the acrylic binder resin.

In addition, the foaming composition may further include additional components for improving mechanical and physical reliability of the foamed structure, such as a silane coupling agent and an antifoaming agent.

The heat absorption layer 120 may include a phase change material. Accordingly, the heat absorption layer 120 may have heat storage performance.

For example, the phase change material may include a paraffin-based compound or an organic acid-based compound. For example, the paraffin-based compound may include eicosane, docosane, tetracosane, octacosane, or a combination thereof. The organic acid-based compound may include capric acid, lauric acid, palmitic acid, stearic acid, or a combination thereof.

According to an embodiment, the phase change material may be provided in the form of a capsule. For example, the heat absorption layer 120 may include a microcapsule having a shell accommodating a phase change material therein. The shell may include melamine.

According to an embodiment, the heat absorption layer 120 may further include an adhesive material. Accordingly, the heat absorption layer 120 may combine the porous layer 110 and the heat resistance layer 130 . For example, the adhesive material may include an acrylic resin. The phase change material or microcapsules including the phase change material may be dispersed in the adhesive material.

The content of the microcapsules containing the phase change material may be appropriately adjusted in consideration of the heat storage performance and dispersibility of the heat absorption layer 120 , for example, based on the total weight of the heat absorption layer 120 . It may be 1 wt% to 50 wt%.

The heat-resistant layer 130 may include a heat-resistant polymer such as polyimide. The heat-resistant layer 130 may be disposed adjacent to a heat source.

For example, the porous layer 110 may have a thickness of 10 to 200 μm, the heat absorption layer 120 may have a thickness of 50 to 300 μm, and the heat resistance layer 130 may have a thickness of 10 to 50 μm. .

According to an embodiment, the thickness of the heat absorption layer 120 may be greater than the thickness of the porous layer 110 . For example, the porous layer 110 may have a thickness of 50 to 150 μm, the heat absorption layer 120 may have a thickness of 150 to 250 μm, and the heat resistance layer 130 may have a thickness of 10 to 50 μm. .

Referring to FIG. 2 , the thermal insulation composite sheet 20 includes a porous layer 210 , a heat absorption layer 220 , and a heat resistance layer 230 . The porous layer 210 may be disposed between the heat absorption layer 220 and the heat resistance layer 230 .

According to an embodiment, the thermal insulation composite sheet 20 may further include a protective layer 250 disposed under the heat absorption layer 220 . The heat absorption layer 220 has stickiness due to the adhesive material. Therefore, when the surface of the heat absorption layer 220 is exposed to the outside, there is a risk of contamination due to adhesion of foreign substances. For example, the protective layer 250 may include polyethylene terephthalate. Polyethylene terephthalate is a polymer with high heat resistance, and may increase the thermal insulation performance of the thermal insulation composite sheet 20 .

According to one embodiment, in the thermal insulation composite sheet 20 , the heat absorption layer 220 may be disposed to be closer to the outside than the porous layer 210 . Also, the thickness of the porous layer 220 may be greater than the thickness of the heat absorption layer 220 . Such a configuration may have an increased thermal insulation performance than a thermal insulation composite sheet having the same thickness and a different configuration, for example, the thermal insulation composite sheet 10 illustrated in FIG. 1 .

For example, the thickness of the porous layer 210 is 150 to 250 μm, the thickness of the heat absorption layer 220 is 50 to 150 μm, the thickness of the heat resistance layer 230 is 10 to 50 μm, and the The thickness of the protective layer 250 may be 1 to 10 μm.

Referring to FIG. 3 , the thermal insulation composite sheet 30 includes a porous layer 310 , a heat absorption layer 320 , a heat resistance layer 330 , and a graphite layer 360 . The heat absorption layer 320 and the graphite layer 360 may be disposed between the heat resistance layer 330 and the porous layer 310 , and the graphite layer 360 may include the heat absorption layer 320 and the porous layer 320 . It may be disposed between the layers 310 .

The heat absorption layer 320 may include a phase change material and an adhesive material. The heat absorption layer 330 may be disposed between the heat resistance layer 330 and the graphite layer 360 to couple the heat resistance layer 330 and the graphite layer 360 .

The heat-insulating composite sheet 30 includes a first adhesive layer 342 attached to the upper surface of the heat-resistant layer 330 and a second adhesive layer 344 bonding the graphite layer 360 and the porous layer 310 to each other. may include

The graphite layer 360 may reduce heat transfer in the vertical direction, that is, in the thickness direction of the thermal insulation composite sheet 30 by rapidly dispersing heat in the horizontal direction. For example, the thickness of the graphite layer 360 may be 10 to 100 μm. In addition, the thickness of the porous layer 310 may be 50 to 150 μm, the thickness of the heat absorption layer 320 may be 150 to 250 μm, and the thickness of the heat resistance layer 330 may be 10 to 50 μm.

Referring to FIG. 4 , the thermal insulation composite sheet 40 includes a porous layer 410 , a heat absorption layer 420 , a heat resistance layer 430 , a protective layer 450 , and a graphite layer 460 . The porous layer 410 may be disposed between the heat absorption layer 420 and the graphite layer 460 , and the heat absorption layer 420 is disposed between the graphite layer 460 and the protective layer 450 . can be

For example, the thickness of the porous layer 410 is 150 to 250 μm, the thickness of the heat absorption layer 420 is 50 to 150 μm, the thickness of the heat resistance layer 430 is 10 to 50 μm, The thickness of the protective layer 450 may be 1 to 10 μm, and the thickness of the graphite layer 460 may be 10 to 100 μm.

The thermal insulation composite sheet according to embodiments of the present invention has excellent heat diffusion effect (direction perpendicular to the thickness) and heat blocking effect (thickness direction). Accordingly, it is possible not only to reduce the user's discomfort, but also to prevent damage due to heat of the electronic device including the heat source.

In addition, the thermal insulation composite sheet according to the embodiments of the present invention includes a graphite layer, so that thermal insulation performance can be greatly improved, and a peeling phenomenon can be prevented by minimizing the deviation in adhesive strength between both surfaces of the graphite layer.

5A and 5B are cross-sectional views illustrating an insulating composite sheet and a heat source coupled thereto according to embodiments of the present invention.

Referring to FIG. 5A , the thermal insulation composite sheet 10 according to an embodiment may be attached to one surface of the heat source 1 . Referring to FIG. 5B , the thermal insulation composite sheet 10 according to an embodiment may be combined with the heat source 1 so as to surround the outer circumferential surface of the cylindrical heat source 1 having a circular or elliptical cross-section. For example, the heat source 1 may be a circuit board of an electronic device, a battery, an electronic cigarette, a light source, or the like.

Therefore, the thermal insulation composite sheet 10 may be bent to have a certain curvature, and preferably has appropriate ductility so as not to be damaged by bending stress or separated from the heat source 1 .

For example, when the thickness of the thermal insulation composite sheet 10 is excessively large, the allowable curvature may increase and bending stress may increase. For example, the thickness of the insulating composite sheet 10 may be 2 mm or less, preferably 1 mm or less, and more preferably 500 µm or less.

Hereinafter, the effect of the thermal insulation composite sheet of the present invention will be described through specific experiments.

Example 1

A first composition for forming a porous layer was prepared by mixing 100 parts by weight of an acrylic binder, 0.1 parts by weight of a curing agent, 2.8 parts by weight of a foaming agent, 4 parts by weight of an ink, and 30 parts by weight of toluene.

A second composition for forming a heat absorption layer was prepared by mixing 100 parts by weight of an acrylic binder, 0.1 parts by weight of a curing agent, 15 parts by weight of a phase change material (paraffin accommodating microcapsule), and 25 parts by weight of toluene.

A third composition for forming an adhesive layer was prepared by mixing 100 parts by weight of an acrylic binder, 0.3 parts by weight of a curing agent, 10 parts by weight of an additive, and 30 parts by weight of toluene.

A porous layer having a thickness of 100 μm was formed on the base substrate by using the first composition. A heat absorption layer having a thickness of 200 μm was formed on the porous layer by using the second composition. A polyimide heat resistant layer having a thickness of 25 μm was formed on the heat absorption layer. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed on the heat-resistant layer by using the third composition.

In accordance with the above, a heat-insulating composite sheet having a configuration as shown in FIG. 1 was obtained.

Example 2

A heat absorption layer having a thickness of 100 μm was formed using the second composition on a PET film having a thickness of 4.5 μm. A porous layer having a thickness of 200 μm was formed on the heat absorption layer by using the first composition. A polyimide heat-resistant layer having a thickness of 25 μm was formed on the porous layer. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed on the heat-resistant layer by using the third composition.

According to the above, a heat-insulating composite sheet having a configuration as shown in FIG. 2 was obtained.

Example 3

A porous layer having a thickness of 100 μm was formed on the base substrate by using the first composition. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed on the porous layer by using the third composition. A graphite (graphite) sheet having a thickness of 40 μm was attached on the adhesive layer. A heat absorption layer having a thickness of 200 μm was formed on the graphite sheet by using the second composition. A polyimide heat resistant layer having a thickness of 25 μm was formed on the heat absorption layer. The third composition was coated on the heat-resistant layer, dried and cured to form an adhesive layer having a thickness of 10 μm.

According to the above, a heat-insulating composite sheet having a configuration as shown in FIG. 3 was obtained.

Example 4

A heat absorption layer having a thickness of 100 μm was formed using the second composition on a PET film having a thickness of 4.5 μm. A graphite (graphite) sheet having a thickness of 40 μm was attached on the heat absorption layer. An adhesive layer having a thickness of 10 μm was formed on the graphite sheet by using the third composition. A porous layer having a thickness of 200 μm was formed on the adhesive layer by using the first composition. A polyimide heat-resistant layer having a thickness of 25 μm was formed on the porous layer. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed on the heat-resistant layer by using the third composition.

According to the above, a heat-insulating composite sheet having a configuration as shown in FIG. 4 was obtained.

Experiment 1 - Evaluation of flat surface insulation performance

The insulating composite sheets of Examples 1 to 4 were cut to a predetermined size, and a heating element (100° C.) was attached to the center. After 10 minutes, the temperature of the front surface (heating element attachment surface) and the rear surface of the thermally insulating composite sheet was measured using a thermal imaging camera.

6A is a graph showing the temperature of the insulating composite sheet according to Examples 1 and 2, and FIG. 6B is a graph showing the temperature of the insulating composite sheet according to Examples 3 and 4 and the graphite sheet of Comparative Example 1 It is a graph. As Comparative Example 1, a graphite sheet having a thickness of 40 µm was used.

6A and 6B , in Examples 3 and 4 including the graphite layer, the front and rear temperatures were significantly lowered. Through this, it can be seen that the thermal insulation composite sheet including the graphite layer has significantly increased thermal diffusion performance and thermal barrier performance. In addition, in the case of Examples 3 and 4 including the graphite layer, it can be seen that the temperature can be further reduced than Comparative Example 1 using only the graphite sheet. In addition, as in Examples 2 and 4, when the heat absorbing layer is disposed on the outside and the thickness is greater than that of the porous layer, the thermal insulation effect may be more excellent.

The thermal insulation composite sheet according to the above-described exemplary embodiments may be used in various electronic devices having a heat source, for example, an electronic cigarette, a smart phone, a notebook computer, a pad-type computer, a game machine, and the like.

Although the above has been described with reference to the embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. You will understand that you can.

1: heat source
10, 20, 30, 40: thermal insulation composite sheet
110, 210, 310, 410: porous layer
120, 220, 320, 420: heat absorption layer
130, 230, 330, 430: heat-resistant layer
140, 240, 342, 344, 442, 444: adhesive layer
250, 450: protective layer
360, 460: graphite layer

Claims (11)

A porous layer comprising an acrylic binder resin and having pores;
a heat-resistant layer comprising polyimide; and
It is dispersed in an adhesive material containing an acrylic resin and includes a heat absorption layer including microcapsules containing a paraffinic compound therein,
The porous layer is a composite insulating sheet disposed between the heat-resistant layer and the heat-absorbing layer. According to claim 1, wherein the porous layer composite insulation sheet, characterized in that having a greater thickness than the heat absorption layer. [Claim 3] The composite heat insulating sheet according to claim 2, further comprising a graphite layer disposed between the porous layer and the heat absorption layer. According to claim 3, wherein the thickness of the porous layer is 150 to 250㎛, the thickness of the heat absorption layer is 50 to 150㎛, the thickness of the heat resistance layer is 10 to 50㎛, the thickness of the graphite layer is 10 to Composite insulation sheet, characterized in that 100㎛. A porous layer comprising an acrylic binder resin and having pores;
a heat-resistant layer comprising polyimide; and
It is dispersed in an adhesive material containing an acrylic resin and includes a heat absorption layer including microcapsules containing a paraffinic compound therein,
The heat-absorbing layer is disposed between the heat-resistant layer and the porous layer, the composite insulation sheet, characterized in that it has a greater thickness than the porous layer. [Claim 6] The composite thermal insulation sheet according to claim 5, further comprising a graphite layer disposed between the porous layer and the heat absorption layer. According to claim 6, wherein the thickness of the heat absorption layer is 150 to 250㎛, the thickness of the porous layer is 50 to 150㎛, the thickness of the heat resistance layer is 10 to 50㎛, the thickness of the graphite layer is 10 to Composite insulation sheet, characterized in that 100㎛. delete The composite thermal insulation sheet according to claim 1, wherein the total thickness is 500 µm or less. 10. The composite heat insulating sheet of any one of claims 1 to 7 and 9; and
and a heat source coupled to the composite thermal insulation sheet and dissipating heat;
An electronic device characterized in that the heat-resistant layer of the composite heat insulating sheet and the heat source are adjacent to each other. The electronic device according to claim 10, wherein the heat source has a cylindrical shape.

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