KR102342013B1 - Tile flooring and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a tile flooring material and a method for manufacturing the same, and specifically, by laminating HPL sheets on one or both sides of a board, excellent surface properties such as compression resistance, scratch resistance and abrasion resistance, and excellent floor transfer coverage The present invention relates to a tile flooring material that realizes the same hard feeling as a flooring product and has excellent dimensional stability and thus has improved gaps during floor heating, and a method for manufacturing the same.

Description

Tile flooring and method for manufacturing the same

The present invention relates to a tile flooring material and a method for manufacturing the same, and more specifically, by laminating HPL (High Pressure Laminate) sheets on one or both sides of a board, the surface properties such as compression resistance, scratch resistance and abrasion resistance are excellent, and the floor The present invention relates to a tile flooring material having excellent transfer coverage, realizing a hard feeling like a flooring product, and having excellent dimensional stability to improve gaps during floor heating and a method for manufacturing the same.

The floor of a building structure is generally made of concrete and cement.

At this time, when the floor of the building structure made of concrete and cement is exposed as it is, the aesthetic feeling is reduced as well as cold air is raised. It blocks the rising cold air.

As such flooring materials, there are flooring products such as solid wood flooring, ondol flooring, reinforced flooring, and steel flooring. In addition, the flooring products as described above mainly use an epoxy adhesive to suppress the shrinkage and expansion of the flooring products due to moisture to secure dimensional stability. There was a problem of damage, which made construction difficult, and repair or re-construction was difficult.

Therefore, in order to solve the above problems, a PVC tile flooring material, which is inexpensive and has a long curing time, can be used, so that it is easy to construct a PVC tile flooring material has been developed.

As an example, in Korean Patent Application Laid-Open No. 10-2007-0048831, a PVC tile-type flooring material comprising a balance layer, a second base layer, a dimension reinforcement layer, a first base layer, a printed layer, and a transparent layer from the bottom to the top is starting

However, since the PVC tile flooring material as described above contains a large amount of plasticizer for calendering molding of the transparent layer, surface properties such as compression resistance, scratch resistance and abrasion resistance are reduced, and the content of plasticizer in the first and second base layers Due to the high height, unevenness of the floor or Hera marks of adhesive are transferred, hard feeling like a flooring product cannot be realized, and dimensional stability is not good, so there are problems that the gap occurs during floor heating.

Therefore, it is inexpensive and easy to re-install, but it has excellent surface properties such as compression resistance, scratch resistance and abrasion resistance, excellent floor transfer coverage, and realization of a hard feeling like flooring products and excellent dimensional stability. There is an urgent need to develop a tile flooring material with improved gaps during heating.

KR 10-2007-0048831 A (2007.05.10)

In order to solve the problems of the prior art as described above, an object of the present invention is to have excellent surface properties such as compression resistance, scratch resistance and abrasion resistance, excellent floor transfer coverage, and a hard feeling like flooring products. An object of the present invention is to provide a tile flooring material having improved dimensional stability and improved gap opening during floor heating, and a method for manufacturing the same.

In order to achieve the above object, the present invention is one or both sides of a board comprising 10-30 wt% of PVC resin, 1-20 wt% of acrylic resin, 55-75 wt% of inorganic filler and 0.1-10 wt% of plasticizer To provide a tile flooring material in which HPL (High Pressure Laminate) sheets are laminated, and the surface hardness (Shore D hardness) is 90-100.

In addition, the present invention provides a method for manufacturing the tile flooring material, comprising 10-30% by weight of a PVC resin, 1-20% by weight of an acrylic resin, 55-75% by weight of an inorganic filler, and 0.1-10% by weight of a plasticizer. step (S1); Preparing an HPL sheet (S3); and laminating the HPL sheet on one or both sides of the board and then plying (S5), wherein the surface hardness (Shore D hardness) is 90-100.

The tile flooring material of the present invention has excellent surface properties such as compression resistance, scratch resistance and abrasion resistance, has excellent floor transfer coverage, and has a hard feel like a flooring product and has improved gapping during floor heating. It works.

1 is a cross-sectional view showing an embodiment of a tile flooring material of the present invention.
2 is a cross-sectional view showing another embodiment of the tile flooring of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings of the present invention.

1 and 2, the present invention is a board 10 comprising 10-30 wt% of a PVC resin, 1-20 wt% of an acrylic resin, 55-75 wt% of an inorganic filler, and 0.1-10 wt% of a plasticizer It relates to a tile flooring material (1) in which a High Pressure Laminate (HPL) sheet 30 is laminated on one or both sides, and the surface hardness (Shore D hardness) is 90-100.

The board 10 is the most basic layer, and may serve to provide volume and strength to the tile flooring 1 and cover the floor transfer.

The board 10 may include 10-30% by weight of PVC resin, 1-20% by weight of acrylic resin, 55-75% by weight of inorganic filler, and 0.1-10% by weight of plasticizer.

The PVC resin may have, for example, a polymerization degree of 600-1800 or 650-1000, but is not limited thereto. The degree of polymerization may be measured in accordance with JIS K6721-77. When the polymerization degree of the PVC resin is less than the above range, mechanical properties may be reduced, and if it exceeds the above range, workability may be reduced.

The PVC resin may be included in 10-30% by weight, 15-25% by weight, or 17-24% by weight in the board 10 . When the PVC resin is included below the above range, the tile flooring material 1 cannot achieve sufficient hardness as the content of the acrylic resin and plasticizer relatively increases, so the dimensions of the tile flooring material 1 including the board 10 Gaps may occur as the stability is lowered, and when the content exceeds the above range, the hardness may be too high and processability may be deteriorated as the content of the acrylic resin and the plasticizer is relatively decreased.

The acrylic resin is mixed to increase the glass transition temperature of the board 10 , and as a specific example, polymethyl methacrylate having a relatively high glass transition temperature and excellent impact resistance may be used, but is not limited thereto.

The polymethyl methacrylate may be, for example, a homopolymer of methyl methacrylate or a copolymer of methyl methacrylate and an acrylic monomer other than methyl methacrylate.

The acrylic monomer may be, for example, an alkyl acrylate monomer, an alkyl methacrylate monomer, or a mixture of an alkyl acrylate monomer and an alkyl methacrylate monomer.

The alkyl acrylate monomer is, for example, methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, sec- butyl acrylate, tert- butyl acrylate , methylbutyl acrylate, amyl acrylate, isoamyl acrylate, n-hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, pentadecyl acrylate, dodecyl acrylate, isobornyl acrylate, It may be at least one selected from the group consisting of phenyl acrylate, benzyl acrylate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 2-methoxyethyl acrylate, glycidyl acrylate and allyl acrylate. .

The alkyl methacrylate monomer is, for example, ethyl methacrylate except methyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl Methacrylate, tert-butyl methacrylate, amyl methacrylate, isoamyl methacrylate, n-hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, pentadecyl methacrylate, dodecyl methacrylate, isobornyl methacrylate, phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, 2-hydroxyethyl methacrylate, 2-methoxyethyl methacrylate, glycy It may be at least one selected from the group consisting of dil methacrylate and allyl methacrylate.

The polymethyl methacrylate may further include other monomers in addition to the methyl methacrylate and the acrylic monomer.

-메틸스티렌, p-메틸스티렌, m-메틸스티렌 등의 방향족 비닐 화합물; 아세트산 비닐; 비닐피리딘; 아크릴로니트릴, 메타크릴로니트릴 등의 불포화 니트릴; 비닐케톤; 염화 비닐, 염화 비닐리덴, 불화 비닐리덴 등의 할로겐 함유 단량체; 아크릴아미드, 메타크릴아미드의 불포화 아미드로 이루어진 군으로부터 선택되는 1종 이상일 수 있다.The other monomers include, for example, unsaturated carboxylic acids such as methacrylic acid, acrylic acid, and maleic anhydride; olefins such as ethylene, propylene, 1-butene, isobutylene, and 1-octene; conjugated diene compounds such as 1,3-butadiene, isoprene and myrcene; styrene,

-Aromatic vinyl compounds, such as methylstyrene, p-methylstyrene, and m-methylstyrene; vinyl acetate; vinylpyridine; unsaturated nitriles such as acrylonitrile and methacrylonitrile; vinyl ketone; halogen-containing monomers such as vinyl chloride, vinylidene chloride, and vinylidene fluoride; It may be at least one selected from the group consisting of unsaturated amides of acrylamide and methacrylamide.

In the present invention, a specific example of the polymethyl methacrylate may be a copolymer of methyl methacrylate and methyl acrylate, or a copolymer of methyl methacrylate, methyl acrylate and methacrylic acid.

The acrylic resin may have, for example, a glass transition temperature (Tg) of 70-130°C or 80-110°C. The glass transition temperature may be measured with a Differential Scanning Calorimeter (DSC). When the glass transition temperature of the acrylic resin is less than the above range, the effect of increasing the glass transition temperature may be insignificant, and if it exceeds the above range, workability may be reduced.

The acrylic resin may have a molecular weight (Mw) of 5,000-300,000 g/mol or 10,000-150,000 g/mol. When the molecular weight of the acrylic resin is less than the above range, it may not function as a resin, and when it exceeds the above range, processability may be reduced.

The acrylic resin may have a melt flow index of 0.1-20 g/10 min (230° C., 3.8 kg) or 0.1-10 g/10 min (230° C., 3.8 kg). If the melt flow index of the acrylic resin is less than the above range, the flowability may be too low to reduce processability, and if it exceeds the above range, processability may be reduced as the viscosity increases.

The acrylic resin may have a density of 1.0-1.4 g/cm ³ or 1.1-1.3 g/cm ³ . The density may be measured according to ASTM D792. The density of the acrylic resin may implement excellent processability by having the above range.

The acrylic resin may be included in 1-20 wt%, 5-15 wt%, or 7-13 wt% in the board 10 . When the acrylic resin is included below the above range, the effect of increasing the glass transition temperature may be insignificant. Efficiency may be reduced.

The inorganic filler is, for example, at least one selected from the group consisting of calcium carbonate, amorphous silica, talc, zeolite, magnesium carbonate, calcium sulfate, calcium phosphate, magnesium phosphate, aluminum oxide, kaolin, ATH (Alumina trihydrate) and talc. can In a specific example, the inorganic filler may be calcium carbonate.

The inorganic filler may be included in the board in an amount of 55-75% by weight, 60-70% by weight, or 62-68% by weight. When the inorganic filler is included in less than the above range, physical properties may decrease and manufacturing cost may increase, and if included in more than the above range, workability may decrease.

The plasticizer may be, for example, at least one selected from the group consisting of a phthalate-based plasticizer, a terephthalate-based plasticizer, a benzoate-based plasticizer, a citrate-based plasticizer, a phosphate-based plasticizer, and an adipate-based plasticizer.

The phthalate-based plasticizer is, for example, dioctyl phthalate, diethylhexyl phthalate, diisononyl phthalate, diisodecyl phthalate, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diheptyl phthalate, dinonyl phthalate and ditridecyl phthalate. It may be at least one selected from the group consisting of.

The terephthalate-based plasticizer may be, for example, dioctyl terephthalate.

The benzoate-based plasticizer is, for example, 2-(2-(2-phenylcarbonyloxyethoxy)ethoxy)ethyl benzoate, glyceryl tribenzoate, trimethylolpropane tribenzoate, isononyl benzoate, 1 -methyl-2-(2-phenylcarbonyloxypropoxy)ethyl benzoate, 2, 2, 4-trimethyl-1, 3-pentanediol dibenzoate, n-hexyl benzoate and trimethylol propanetribenzoate It may be at least one selected from the group consisting of.

The citrate-based plasticizer may be, for example, at least one selected from the group consisting of acetyl tributyl citrate and tributyl citrate.

The phosphate-based plasticizer may be, for example, at least one selected from the group consisting of tricresyl phosphate and tributyl phosphate.

The adipate-based plasticizer may be, for example, at least one selected from the group consisting of bis(2-ethylhexyl) adipate, dimethyl adipate, monomethyl adipate and dioctyl adipate diisononyl adipate.

The plasticizer may be included in 0.1-10 wt%, 0.5-5 wt%, or 1-3 wt% in the board. When the plasticizer is included in less than the above range, workability and physical properties may be reduced, and when included in more than the above range, it may be difficult to achieve mechanical properties as a board.

The board 10 may further include a thermal stabilizer.

The heat stabilizer may be, for example, at least one selected from the group consisting of epoxidized soybean oil, metal salt, calcium-zinc-based and barium-zinc-based.

The heat stabilizer may be included in 0.1-10 wt% or 0.1-5 wt% in the board 10, but is not limited thereto.

The board 10 may further include other additives for selectively controlling physical properties.

The other additives include, for example, melt strength enhancers, lubricants, antistatic agents, ultraviolet absorbers, flame retardants, natural waxes, antioxidants, lubricants, colorants, stabilizers, wetting agents, thickeners, foaming agents, defoamers, coagulants, gelling agents, anti-settling agents, and It may be one or more selected from the group consisting of antioxidants, but the types and contents thereof are not limited.

The board 10 may be manufactured by, for example, one or more methods selected from the group consisting of calendering and extrusion methods. As a specific example, the board 10 may be manufactured by a calendering method with excellent productivity.

The board 10 may have a thickness of 0.5-5.0 mm or 1.0-3.0 mm. The board 10 can give the tile flooring 1 excellent volume and strength by having a thickness in the above range and cover the floor transfer.

The thermal deformation temperature of the board 10 may be 50 °C or higher, 55 °C or higher, or 60 °C or higher. The thermal deformation temperature of the board 10 may be measured based on the standard of ISO 75-1. In this case, the upper limit of the thermal deformation temperature is not particularly limited, but may be, for example, 100° C. or less or 80° C. or less. The board 10 may have excellent heat resistance by having a thermal deformation temperature within the above range.

In addition, the board 10 may have a glass transition temperature of 50-100°C, 55-95°C, or 58-88°C. The glass transition temperature of the board 10 may be measured using differential scanning calorimetry (DSC). The board 10 may have excellent dimensional stability under general heating conditions by having a glass transition temperature in the above range higher than the glass transition temperature (about 30° C.) of a board made of a resin composition including a conventional PVC resin alone. .

In addition, the dimensional change rate of the board 10 may be 0.13% or less or 0.10% or less in length, and 0.10% or less in width or 0.07% or less in width. The dimensional change rate may be calculated by measuring length and width dimensions after leaving the board 10 at 80° C. for 6 hours. The lower limit of the dimensional change rate is not particularly limited, but may be, for example, a length of 0% or more and a width of 0% or more. The board 10 can implement excellent dimensional stability by having a dimensional change rate within the above range.

The HPL sheet 30 may serve to improve surface properties such as compression resistance, scratch resistance, and abrasion resistance of the tile flooring material 1 .

The HPL sheet 30 may be laminated on one or both sides of the board 10 , and the board 10 may come into contact with a monochromatic film layer 31 to be described later of the HPL sheet 30 during lamination. At this time. When the HPL sheet 30 is laminated on both sides of the board 10 , the HPL sheet 30 improves the surface properties of the tile flooring material 1 and serves to balance the entire tile flooring material 1 . can do.

In general, HPL (High Pressure Laminate) is used as a surface layer of flooring products such as reinforced flooring, and refers to a plate-like material in which a thermosetting resin is impregnated into paper and fibrous substrates and molded under appropriate heat and pressure.

In the prior art, the HPL sheet was adhered to a wood-based substrate such as MDF (Medium Density Fiberboard), HDF (High Density Fiberboard), or plywood using an adhesive, but the HPL sheet 30 of the present invention is a monochromatic film layer 31 at the bottom. Including, it is possible to implement excellent adhesion with the board 10 made of the synthetic resin material without the use of an adhesive.

The HPL sheet 30 of the present invention may include, for example, a monochromatic film layer 31 , a patterned paper layer 32 and an overlay layer 33 from the bottom to the top.

The monochromatic film layer 31 is a layer of white or other color, which clearly shows the pattern or pattern of the patterned paper layer 32 laminated thereon, and between the patterned paper layer 32 and the board 10 . It may be to serve to improve the adhesion of the.

The monochromatic film layer 31 may include, for example, 5-40 parts by weight of a plasticizer, 1-30 parts by weight of an inorganic filler, and 1-50 parts by weight of a pigment, based on 100 parts by weight of the PVC resin, and may be prepared by calendering. have.

The plasticizer may be included in an amount of 5-40 parts by weight or 10-30 parts by weight based on 100 parts by weight of the PVC resin. Since the plasticizer is included in the above range, the processability of the monochromatic film layer 31 may be excellent.

The inorganic filler may be included in an amount of 1-30 or 3-20 parts by weight based on 100 parts by weight of the PVC resin. By being included in the above range, the inorganic filler may implement excellent physical properties and processability at a low manufacturing cost.

The types of the plasticizer and inorganic filler are the same as the plasticizer and inorganic filler used in the board 10 , and overlapping descriptions are omitted.

The pigment may be, for example, at least one selected from the group consisting of titanium dioxide, carbon black, water-based epoxy, and alcohol-based compounds. As a specific example, the pigment may be titanium dioxide in order to clearly show the pattern or pattern of the patterned paper layer 32 laminated thereon.

The pigment may be included in an amount of 1-50 parts by weight or 1-40 parts by weight based on 100 parts by weight of the PVC resin. The pigment may be included in the above range to clearly show the pattern or pattern of the patterned paper layer 32 laminated thereon.

The monochromatic film layer 31 may have a thickness of 0.01-1mm or 0.05-0.5mm. The monochromatic film layer 31 has a thickness in the above range, so that the pattern or pattern of the patterned paper layer 32 laminated thereon is clearly displayed, and excellent adhesion between the patterned paper layer 32 and the board 10 is realized. And, the HPL sheet 30 can be prevented from being rolled up toward the overlay layer 33 to be described later.

The patterned paper layer 32 serves to provide a visual effect, and may be laminated on the monochromatic film 31 layer.

The overlay layer 33 serves to protect the surface of the tile flooring 1 of the present invention by implementing abrasion resistance and stain resistance while protecting the patterned paper layer 32, and to be laminated on the patterned paper layer 32. can

The patterned paper layer 32 and the overlay layer 33 are impregnated with a resin impregnating solution and then dried, and the patterned paper layer 32 and the overlay layer 33 form one layer through curing of the resin during thermocompression. can

The patterned paper layer 32 may be, for example, a copy paper impregnated with a resin impregnated liquid for the patterned paper layer 32 and then dried. The resin included in the resin impregnating liquid for the patterned paper layer 32 may be, for example, at least one selected from the group consisting of a urea resin, a melamine resin, a phenol resin, a polyester resin, and an epoxy resin. As a specific example, the resin may be a melamine resin having excellent flame retardancy.

The resin in the resin impregnated liquid for the patterned paper layer 32 may be included in an amount of 50-90% by weight or 60-80% by weight. When the resin in the resin impregnation solution is included in less than the above range, the adhesive force with the monochromatic film layer 31 laminated on the lower side or the overlay layer 33 laminated on the upper part may be reduced, and when the resin is included in the above range It takes a lot of time for impregnation and drying, and when drying, it must be exposed to high temperatures for a long time, so deformation may occur.

The resin impregnated liquid for the patterned paper layer 32 may further include a thermoplastic polyurethane (TPU) resin in order to improve the adhesion between the patterned paper layer 32 and the monochromatic film layer 31 .

The thermoplastic polyurethane resin in the resin impregnated liquid for the patterned paper layer 32 may be included in an amount of 1-20% by weight or 5-15% by weight. When the thermoplastic polyurethane resin in the resin impregnated liquid for the patterned paper layer 32 is included in less than the above range, the effect of improving adhesion with the monochromatic film layer 31 may not be realized, and when included in the above range, the patterned paper layer As the elasticity of (32) increases, it becomes flexible and the cured resin may break.

The patterned layer 32 may have a thickness of 0.01-1mm or 0.03-0.5mm. The shape paper layer 32 can implement an excellent visual effect by having a thickness within the above range.

The overlay layer 33 may be, for example, impregnated with a resin impregnating liquid for the overlay layer 33 and then drying high-quality paper made of pulp material.

The type of the resin is the same as that described in the patterned paper layer, and the overlapping description is omitted.

The resin in the resin impregnating liquid for the overlay layer 33 may be included in an amount of 40-80 wt% or 50-70 wt%. When the resin in the resin impregnated liquid for the overlay layer 33 is included in less than the above range, the adhesive force with the patterned paper layer 32 laminated below is reduced, and the overlay layer 33 for the patterned paper layer 32 is ) is lowered, scratches or cracks may occur, and if it is included in excess of the above range, it takes a lot of time for impregnation and drying, and deformation may occur because it must be exposed to high temperature for a long time during drying.

The overlay layer 33 may have a thickness of 0.01-1.0 mm or 0.01-0.5 mm. The overlaid layer 33 may have a thickness within the above range, thereby implementing excellent protection against the patterned paper layer 32 and implementing excellent abrasion resistance and stain resistance.

The HPL sheet 30 may have a peel strength of 2 kgf/inch or more with the board 10 . The peel strength is measured by peeling both ends of the board 10 and the HPL sheet 30 at a rate of 200 mm/min using a high-speed adhesion tester (Instruments, UTM) in accordance with KS M 3802 standard, and the HPL sheet 30 ) may be a measure of the strength it takes to peel. The upper limit of the peel strength is not particularly limited, but may be, for example, 10 kgf/inch or less or 8 kgf/inch or less. The HPL sheet 30 may have excellent adhesion to the board 10 by having a peel strength within the above range.

The tile flooring material 1 of the present invention may have a surface hardness (Shore D hardness) of 90 or more, 92 or more, or 93 or more. The surface hardness may be measured with a Shore D hardness meter (ASKER, Kobunshi keiki). The upper limit of the surface hardness is not particularly limited, but may be, for example, 100 or less. The tile flooring material 1 has an excellent effect on surface properties such as compression resistance, scratch resistance and abrasion resistance by having a surface hardness in the above range.

In addition, the tile flooring material (1) of the present invention may have compression resistance of 0.125 mm or less or 0.100 mm or less and 2.5% or less or 2.0% or less. The compression resistance may be measured by ASTM F970. The lower limit of the compression resistance is not particularly limited, but may be, for example, 0 mm or more and 0% or more. The tile flooring material 1 may have excellent compression resistance by having a value in the above range.

In addition, in the tile flooring 1 of the present invention, the load value required to scratch the surface of the tile flooring 1 using the Ericsson diamond tip scratch test method may be 4N or more or 6N or more. The load value may be measured by the 3.15 method of KS M3332. The upper limit of the load value is not particularly limited, but may be, for example, 10N or less. The tile flooring material 1 may have excellent scratch resistance by having a load value within the above range.

In addition, the tile flooring (1) of the present invention is F _v This value can be not more than 2.5mm ³ or less, or 2.0mm ^3. said F _v The value can be determined according to the EN 660-2 test method. said F _v The lower limit of the value is not particularly limited, but as an example, it may be ^{0 mm 3 or more.} The tile flooring 1 may implement excellent wear resistance by having _{an F v value within the above range.}

In addition, in the tile flooring material 1 of the present invention, unevenness of the floor or Hera marks of the adhesive may not be transferred. This may be visually evaluated after leaving the tile flooring material at 40° C. for 168 hours. The tile flooring material 1 can implement excellent floor transfer coverage by not transferring unevenness of the floor or the scuff marks of the adhesive.

In addition, the tile flooring 1 of the present invention may have a dimensional change rate of 0.15% or less or 0.10% or less in length, 0.12% or less in width, or 0.10% or less in width. The dimensional change rate may be calculated by measuring length and width dimensions after leaving the tile flooring material at 80° C. for 6 hours. The lower limit of the dimensional change rate is not particularly limited, but may be, for example, a length of 0% or more and a width of 0% or more. The tile flooring 1 can implement excellent dimensional stability by having a dimensional change rate within the above range.

In addition, the tile flooring material (1) of the present invention may have a gap gap of 0.20mm or less or 0.18mm or less. The gap gap may be measured by using a loupe to measure the gap gap between the tile flooring materials 1 after floor heating at 45° C. for 24 hours. The lower limit of the degree of gap gap is not particularly limited, but as an example, may be 0 mm or more. The tile flooring material 1 has the effect of improving the gap gap by having a gap gap in the above range.

In addition, the present invention is a PVC resin 10-30% by weight, acrylic resin 1-20% by weight, inorganic filler 55-75% by weight and plasticizer 0.1-10% by weight to prepare a board (10) comprising the steps (S1); Preparing the HPL sheet 30 (S3); and a step (S5) of laminating the HPL sheet 30 on one or both sides of the board 10 and then plying, wherein the surface hardness (Shore D hardness) is 90-100 tile flooring (1) It relates to a manufacturing method of

The step (S1) is, for example, 10-80 parts by weight or 20-70 parts by weight of an acrylic resin, 100-500 parts by weight or 150-450 parts by weight of an inorganic filler, and 1-10 parts by weight of a plasticizer based on 100 parts by weight of the PVC resin. Alternatively, the composition comprising 3-8 parts by weight is kneaded at 170 - 190 ° C. or 175-185 ° C. with a Banbari mixer, and then molded in a calendering method at 150 - 180 ° C. or 155-175 ° C. to prepare the board 10 may be doing

The composition may further include a heat stabilizer or other additives, the content of which is not limited.

As for the PVC resin, acrylic resin, inorganic filler, plasticizer, heat stabilizer and other additives included in the composition, repeated descriptions as described above will be omitted.

The step (S3) may be, for example, laminating the monochromatic film layer 31, the patterned paper layer 32 and the overlay layer 33 from the bottom to the top, and then plying.

As for the monochromatic film layer 31 , the patterned paper layer 32 and the overlay layer 33 as described above, repeated descriptions are omitted.

The plywood in step (S3) is, for example, 140-200 ℃ or 150-190 ℃ temperature and 120-180kgf / cm ² or 130-170kgf / cm ^{2 It} may be compressed at a pressure of, but is not limited thereto. .

The step (S5) may be to laminate the HPL sheet 30 on one or both sides of the board 10 and then thermally plywood, and the monochromatic film layer 31 of the HPL sheet 30 and the board at the time of lamination. (10) can be accessed.

The thermal plywood is, for example, 140-200 ℃ or 150-190 ℃ at 120-180kgf / cm ² or 130-170kgf / cm ² It may be compressed. When the thermal plywood is made at a temperature or pressure less than the above range, the plywood may not be formed, and when the thermal plywood is made at a temperature or pressure exceeding the above range, the cured resin of the overlay layer 33 may be broken, and the patterned paper layer 32 may be torn, and the thickness of the board 10 may be reduced by excessive pressure due to the PVC resin contained in the board 10 being flexible at high temperature.

Hereinafter, preferred examples are presented to help the understanding of the present invention, but the following examples are merely illustrative of the present invention, and it will be apparent to those skilled in the art that various changes and modifications are possible within the scope and spirit of the present invention, It goes without saying that such changes and modifications fall within the scope of the appended claims.

[Example]

<Example 1>

Step of manufacturing the board (S1)

PVC resin (LG Chem, LS070) 100 parts by weight, polymethyl methacrylate ⁽¹⁾ (LG MMA, IF870S) 50 parts by weight, calcium carbonate (Kwangseong Chemical, A-60) 300 parts by weight, dioctyl terephthalate (LG) Chemical, GL520) 7 parts by weight, heat stabilizer (Songwon Industrial, SW-300) 3 parts by weight of a composition containing 3 parts by weight of a Banbari mixer after kneading at 180 ℃, and then molded at 165 ℃ in a calendering method to have a thickness of 2.0 mm The board was made.

Here, the PVC resin had a Tg of 80° C., a polymerization degree of 700, ^{a Tg of the polymethyl methacrylate (1)} of 92° C., and a Mw of 110,000 g/mol.

HPL Step of manufacturing the sheet (S3)

PVC resin (LG Chemical, LS100) 100 parts by weight, dioctyl terephthalate (LG Chemical, GL520) 20 parts by weight, calcium carbonate (Lexem, S1000) 8 parts by weight and titanium dioxide (Cosmo Chemical, TA100) 15 parts by weight The composition was kneaded at 160-180°C with a Banbari mixer, and then molded at 165°C by calendering to prepare a monochromatic film layer having a thickness of 0.065mm.

A 0.03mm copy paper was impregnated with a resin impregnated solution for a patterned layer containing 70% by weight of a melamine resin and 10% by weight of a thermoplastic polyurethane resin, and then dried to prepare a patterned paper layer having a thickness of 0.1mm.

A 0.2 mm high-quality paper was impregnated with a resin impregnating solution for an overlay layer containing 60 wt % of melamine resin, and then dried to prepare an overlay layer having a thickness of 0.1 mm.

Then, the monochromatic film layer, the patterned paper layer and the overlay layer were laminated from the bottom to the top, and then ^{pressed at 170° C. at 150 kgf/cm 2} and plywood to prepare an HPL sheet.

on one side of the board HPL sheet laminated After the step of plying (S5)

The monochromatic film layer of the HPL sheet and the board were laminated on the top of the board so that the board was in contact, and then ^{pressed at 170° C. at 150 kgf/cm 2} and laminated to prepare a tile flooring material.

<Example 2>

A tile flooring material was prepared in the same manner as in Example 1, except that polymethyl methacrylate ^{(2) (LG MMA, BA611) was used instead of polymethyl methacrylate (1)} in step (S1).

Here, the polymethyl methacrylate ^{(2) had} a Tg of 105° C. and a Mw of 40,000 g/mol.

<Example 3>

A tile flooring material was prepared in the same manner as in Example 1, except that in step (S5), the monochromatic film layer of the HPL sheet and the board were laminated on both sides of the board so that the board was in contact.

[Comparative example]

<Comparative Example 1>

650 parts by weight of calcium carbonate (Kwangseong Chemical, A-60), 40 parts by weight of plasticizer (LG Chemical, GL520), 1.5 parts by weight of fatty acid (LG Chemical, TH-100) based on 100 parts by weight of PVC resin (LG Chemical, LS100) The composition comprising the composition was kneaded at 180° C. with a Banbari mixer, and then molded at 165° C. by calendering to prepare a base layer having a thickness of 2.47 mm.

Then, 200 parts by weight of calcium carbonate (Lexem, S1000), 20 parts by weight of a plasticizer (LG Chemical, GL520) and 10 parts by weight of a colored pigment (Daewon Pigment, Black) with respect to 100 parts by weight of the PVC resin (LG Chemical, LS100) The composition was kneaded at 180° C. by a Banbari mixer, and then molded at 165° C. by calendering to prepare a balance layer having a thickness of 0.30 mm. Then, the balance layer was laminated by thermal plywood on the bottom surface of the base layer.

Then, 100 parts by weight of PVC resin (LG Chemical, LS100), 20 parts by weight of dioctyl terephthalate (LG Chemical, GL520), 8 parts by weight of calcium carbonate (Lexem, S1000), and 15 parts by weight of titanium dioxide (Cosmo Chemical, TA100) After kneading the composition containing the part at 180° C. with a Banbari mixer, it was molded at 165° C. by calendering to prepare a monochromatic film layer having a thickness of 0.065 mm. Then, the monochromatic film layer was laminated by thermal plywood on the base layer.

Thereafter, a composition comprising 30 parts by weight of dioctyl terephthalate (LG Chemical, GL520) and 5 parts by weight of a processing aid (LG Chemical, PA828) was mixed with a Banbari mixer in 180 parts by weight based on 100 parts by weight of the PVC resin (LG Chemical, LS100). After kneading at ℃, it was molded by calendering at 165℃ to prepare a transparent layer having a thickness of 0.015mm. Then, the transparent layer was laminated by thermal plywood on the monochromatic film layer.

Finally, a UV curable paint (Jogwang Paint, 7810) was applied to the top of the transparent layer, and then irradiated with ultraviolet rays to form a surface treatment layer having a thickness of 0.02 mm to prepare a tile flooring material.

[Reference example]

<Reference Example 1>

^{Example except that the composition not containing polymethyl methacrylate (1)} in step (S1) was kneaded at 200° C. with a Banvari mixer, and then molded at 220° C. by calendering to prepare a board A tile flooring material was prepared in the same manner as in 1.

[Test Example]

1. Physical properties of the board or base layer

1-1. heat resistance

In order to confirm the heat resistance of the boards of Examples 1-3 and Reference Example 1 and the base layer of Comparative Example 1, each board or base layer was measured in length x width x thickness of 80 mm x 10 mm according to the standard of ISO 75-1. A specimen measuring x 3 mm was prepared, and the specimen was placed on a support in a heating bath containing oil so that the specimen was immersed in oil to a depth of at least 50 mm. After that, after setting the deformation value of the specimen to 0 after 5 minutes of applying a load of 80 g to the specimen, when the temperature of the heating bath is raised at a constant rate of 120±10° C./h, the specimen sags under the load. At this time, the temperature when the specimen was deformed by 0.3 mm was measured, and the measurement results are shown in Table 1 below.

The higher the heat deflection temperature, the better the heat resistance.

1-2. glass transition temperature

The glass transition temperatures of the boards of Examples 1-3 and Reference Example 1 and the base layer of Comparative Example 1 were DSC (differential scanning calorimetry), and the measurement results are shown in Table 1 below.

The higher the glass transition temperature, the better the heat resistance.

2. Physical properties of tile flooring

2-1. surface hardness

Shore D hardness tester (ASKER, Kobunshi keiki) was used to check the surface hardness of the tile flooring material. The measurement results are shown in Table 1 below.

The surface hardness is excellent, so that the value is large.

2-2. compression resistance

According to ASTM F970, by applying a load of 100 lb with a hemispherical steel bar with a diameter of 1.125 inches, the value obtained by subtracting the thickness of the tile flooring material after applying the load from the depth of indentation of the tile flooring and the initial thickness of the tile flooring material divided by the initial thickness of the tile flooring material, then 100 Compression resistance was indicated by a value calculated by multiplying. The results are shown in Table 1 below.

Compression resistance (%) = (initial thickness of tile flooring - thickness of tile flooring after application of load)/initial thickness of tile flooring × 100

The smaller the value, the better the compression resistance.

2-3. scratch resistance

After scratching the surface of the tile flooring material using the Ericsson diamond tip scratch test method, the load value (N) required for the surface of the tile flooring material to be scratched was measured by the method 3.15 of KS M3332. The measurement results are shown in Table 1 below.

The higher the load value (N), the better the scratch resistance.

2-4. wear resistance

_{The F v} value was measured by performing a wear test 5000 times according to the test method of EN 660-2 with a leather wheel (S-39 leather wheel) while spraying 35 g of aluminum oxide per 100 seconds on the tile flooring material. The measurement results are shown in Table 1 below.

F _v =

(F _v : worn volume after 100 wear tests (mm ³ ), F _m : average worn mass after 100 wear tests (mg), ρ: density of tile flooring (g/cm ³ )

The smaller the F _v value, the better the abrasion resistance.

2-5. floor transfer coverage

After the tile flooring was left at 40°C for 168 hours, it was visually evaluated whether the unevenness of the floor or the Hera marks of the adhesive were transferred. In the visual evaluation, if the unevenness of the floor or the spatula of the adhesive was not transferred, it was evaluated as "good", and when the transfer occurred, it was evaluated as "negative". The evaluation results are shown in Table 1 below.

2-6. Dimensional stability

After the tile flooring material was cut to a size of 920mm×150mm×3-5mm (width×length×thickness), the initial dimensions of the length and width of the cut tile flooring material were measured at room temperature of about 25°C. Then, after the cut tile flooring material was left at 80° C. for 6 hours, dimensions of length and width were measured. Then, the dimensional change rate (%) was derived by the following <Equation 1>. The measurement results are shown in Table 1 below.

<Equation 1>

Dimensional change rate (%) = (late dimension - initial dimension) / initial dimension x 100

The smaller the dimensional change (%) value, the better the dimensional stability.

2-7. gaping

The tile flooring specimen was cut to a size of 5cmХ25cm, and then the degree of gap between the tile flooring was measured using a tape measure after underfloor heating at 50°C for 24 hours. The measurement results are shown in Table 1 below.

The smaller the gap, the better the gap gap.

parts by weight Example 1 Example 2 Example 3 Comparative Example 1 Reference Example 1 board/base layer PVC 100 100 100 100 100 PMMA Tg(℃) 92 105 92 - - Mw (g/mol) 91,000 40,000 91,000 - - content 50 50 50 - 0 calcium carbonate 300 300 300 650 300 DOTP 7 7 7 40 7 Properties board/base layer Heat deflection temperature (℃) 60 55 70 5 45 Tg(℃) 64 59 74 9 49 tile
flooring Surface hardness (D) 95 94 96 72 92 Compression resistance (mm) 0.06 0.07 0.05 0.46 0.13 Compression resistance (%) 1.2 1.4 1.0 9.2 2.6 Scratch resistance (N) 8 8 8 One 8 Wear resistance (mm ³ ) 0.5 0.6 0.4 2.7 0.6 floor transfer coverage synthesis synthesis synthesis wealth synthesis Dimensional stability (length, %) 0.07 0.06 0.03 0.20 0.18 Dimensional stability (width, %) 0.05 0.06 0.04 0.15 0.20 Gaps (mm) 0.10 0.15 0.05 0.30 0.25

The board of Example 1-3 had a heat deflection temperature of 50° C. or higher and a glass transition temperature of 50° C. or higher, and thus had excellent heat resistance.

In addition, the tile flooring material of Examples 1-3 had excellent surface hardness of 90 or more, and excellent compression resistance of 0.125 mm or less and 2.5% or less of compressibility, and the load value required to scratch the surface of the tile flooring material was Above 4N, the scratch resistance was excellent, the F _v value was 2.5mm ³ or less, so the abrasion resistance was excellent, the floor transfer coverage was excellent, and the dimensional change rate was 0.15% or less in length and 0.12% or less in width. , the gap gap was improved to 0.20 mm or less.

On the other hand, the base layer of Comparative Example 1 had a thermal deformation temperature of 5°C and a glass transition temperature of 9°C, confirming that the heat resistance was lowered.

In addition, the conventional PVC tile flooring material of Comparative Example 1 has a surface hardness of 72, compression resistance of 0.46mm, 9.2%, a load value required to scratch the surface of the tile flooring material is 1N, and an F _v value is 2.7mm ³ and the dimensional change rate was 0.20% in length and 0.15% in width, and the gap gap was 0.30 mm, so the surface hardness, compression resistance, scratch resistance, abrasion resistance and dimensional stability were very deteriorated, gap gap occurred, and the floor transfer cover It could be seen that the sexiness decreased.

On the other hand, the board of Reference Example 1 had a thermal deformation temperature of 45 °C and a glass transition temperature of 49 °C, confirming that the heat resistance was lowered.

In addition, the tile flooring material of Reference Example 1 had compression resistance of 0.13 mm and 2.6%, dimensional change rate of 0.18% of length and width of 0.20%, and the degree of gap gap of 0.25 mm, resulting in reduced compression resistance and dimensional stability, and gaps cracking occurred.

In addition, since the tile flooring material of Reference Example 1 did not contain an acrylic resin, it was impossible to mold it into a board at the same temperature as in Examples, so it had to be molded by significantly increasing the processing temperature. As this decreased, it was confirmed that deterioration occurred. In addition, it was confirmed that calendering molding was not performed well under industrial equipment conditions.

1: tile flooring 10: board
30: HPL sheet 31: monochromatic film layer
32: pattern layer 33: overlay layer
100: pedestal

Claims (15)

A High Pressure Laminate (HPL) sheet is laminated on one or both sides of a board containing 10-30% by weight of PVC resin, 1-20% by weight of acrylic resin, 55-75% by weight of inorganic filler and 0.1-10% by weight of plasticizer,
The acrylic resin is polymethyl methacrylate,
The HPL sheet sequentially includes a monochromatic film layer, a patterned paper layer and an overlay layer, wherein the monochromatic film layer is bonded to the board,
The patterned paper layer comprises 50-90% by weight of a melamine resin and 1-20% by weight of a thermoplastic polyurethane resin,
The monochromatic film layer contains 5-40 parts by weight of a plasticizer, 1-30 parts by weight of an inorganic filler, and 1-50 parts by weight of a pigment based on 100 parts by weight of the PVC resin,
The HPL sheet has a peel strength (KS M 3802) of 2-10 kgf/inch with the board,
A tile flooring material having a surface hardness (Shore D hardness) of 90-100. The method of claim 1,
The tile flooring material is a hemispherical steel bar having a diameter of 1.125inch, and the tile flooring material has a compression resistance of 0.125mm or less and 2.5% or less when a load of 100lb is applied. The method of claim 1,
The tile flooring material is a tile flooring material having a load value (KS M3332) of 4-10N required to scratch the surface of the flooring material using the Ericsson diamond tip scratch test method. The method of claim 1,
The tile flooring material is a tile flooring material having an F _v value (EN 660-2 test method) of 2.5 mm ³ or less. The method of claim 1,
The tile flooring material has a dimensional change rate of 0.15% or less in length and 0.12% or less in width after being left at 80° C. for 6 hours. The method of claim 1,
The tile flooring material is a tile flooring material of which the gap between the tile flooring material is 0.20mm or less after floor heating at 45°C for 24 hours. delete The method of claim 1,
The board is a tile flooring material comprising 15-25 wt% of a PVC resin, 5-15 wt% of an acrylic resin, 60-70 wt% of an inorganic filler, and 0.5-5 wt% of a plasticizer. The method of claim 1,
The board has a thermal deformation temperature (ISO 75-1) of 50-100 ℃ tile flooring. The method of claim 1,
The board has a glass transition temperature of 50-100 ℃ tile flooring. delete delete delete 10-30 wt% of PVC resin, 1-20 wt% of an acrylic resin, 55-75 wt% of an inorganic filler, and 0.1-10 wt% of a plasticizer (S1); Preparing an HPL sheet (S3); and laminating the HPL sheet on one or both sides of the board and then plying (S5),
The acrylic resin is polymethyl methacrylate,
The HPL sheet sequentially includes a monochromatic film layer, a patterned paper layer and an overlay layer, wherein the monochromatic film layer is bonded to the board,
The patterned paper layer comprises 50-90% by weight of a melamine resin and 1-20% by weight of a thermoplastic polyurethane resin,
The monochromatic film layer contains 5-40 parts by weight of a plasticizer, 1-30 parts by weight of an inorganic filler, and 1-50 parts by weight of a pigment based on 100 parts by weight of the PVC resin,
The HPL sheet has a peel strength (KS M 3802) of 2-10 kgf/inch with the board,
A method of manufacturing a tile flooring material having a surface hardness (Shore D hardness) of 90-100.
delete

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