KR102340011B1 - Wire bonder clamp for high-density and ultra-thin LED substrates - Google Patents

Abstract

Disclosed is a wire bonder clamp, which can improve the reliability of work by securing a working space for wire bonding work while minimizing the clamping loss section and the bonding area invasion section due to deviation in the process of transferring the high-density ultra-thin LED substrate, and significantly increase productivity.

Description

Wire bonder clamp for high-density and ultra-thin LED substrates

The present invention is seated on a high-density ultra-thin LED substrate in which a plurality of lead frame strips in which a plurality of light emitting device packages are arranged in a matrix or in a line are provided at regular intervals, and the LED chip of the light emitting device package and the capillary A wire bonder clamp having an open work area formed on one side to perform wire bonding between lead frames, the clamp comprising: a first compartment formed in the longitudinal direction at the inner center of the work area; a plurality of second partition pieces arranged at regular intervals along the width direction from both edges of the first partition piece; a plurality of windows arranged in a lattice form by the first and second partitions in the working area and having widths and lengths corresponding to the lead frame strips; In order to increase the area in contact with the periphery of the wire bonding area inside the window to prevent shaking of the LED substrate during wire bonding, the inner circumferential surface on both sides of the width direction of the work area and both edges of the second compartment are spaced apart from each other. A plurality of protrusions are formed so as to improve reliability of work while securing a work space for wire bonding work by minimizing a clamping loss section and a section encroaching on the bonding area due to deviations occurring in the process of transferring the LED substrate. It relates to a wire bonder clamp for a high-density ultra-thin LED substrate comprising a; pressing pieces that are alternately arranged.

The LED package process is largely a pre-process of forming an LED (light emitting diode) chip on the surface of a wafer and a post-process of assembling each LED chip into an individual device such as a package (Assembly) ) can be distinguished.

The post process again includes a die bonding process for attaching the LED chip onto a member such as a lead frame, a wire bonding process for electrically connecting each LED chip and the lead frame, and an electrical connection area including the LED chip It can be divided into a molding process, etc. in which the resin is sealed with a molding resin such as an epoxy molding compound (EMC).

Among them, the wire bonding process separates the product on which the die bonding process is completed, which is a process of attaching the LED chip to the lead frame, from the magazine state, and then moves the lead frame to the working position to obtain the unit package state of the LED chip and the lead frame. It is a process that makes a path of electrical flow by connecting with a conductive gold wire to make the product work.

1a) is a diagram schematically illustrating an LED wire bonding apparatus used in a wire bonding process of an LED chip. In the wire bonding process, as shown in FIG. 1A ), heat is applied in the pre heater zone 20 , which is the entire area where heat is applied to the lead frame 10 on which a plurality of LED chips are seated, in a heater zone ), the window clamp 40 is pressed so that the lead frame 10 is in contact with the upper surface of the heater 30 located in the heater zone. The reason for bringing the lead frame 10 into contact with the heater 30 is to improve wire bonding performance of the LED chip. The window clamp 40 supports the lead frame 10 to be fixed without being separated during the wire bonding process. The capillary 50 is a wire bonding device that connects the LED chip and the lead with a wire by inserting a wire. Accordingly, when the lead frame 10 is in contact with the heater 30 by the window clamp 40 , the capillary 50 is a wire connecting the LED chip seated on the lead frame 10 and the lead with a wire. perform bonding work.

On the other hand, in the manufacture of LED packages, it was common to secure the substrate with a clamp using this empty space by leaving a gap between the packages, and then perform the w-bonder. However, such an empty space leads to material loss and increases the movement path of equipment operation, thereby acting as a cause of lowering productivity.

Due to the recent technological development, the size of the light source is also slimming and ultra-thin in line with the trend of miniaturization of display devices and lighting devices, and therefore, the use of high-density and ultra-thin substrates is increasing compared to the existing ones.

Accordingly, it was necessary to secure technology for a wire bonder clamp for a high-density and ultra-thin substrate.

Republic of Korea Patent Publication No. 10-2010-0093983 (lead frame fixing device) Republic of Korea Patent Publication No. 10-2001-0010456 (Clamp for semiconductor package) Korean Utility Model Publication No. 20-2009-0010318 (Wire bonding kit for semiconductor package manufacturing)

The present invention was invented to solve the above problems, and it is sensitive to the position of the LED chip or the position of wire bonding due to the characteristics of the high-density ultra-small package substrate, so that the bonding area and the capillary movement path can be secured while realizing stable clamping. An object of the present invention is to provide a wire bonder clamp for high-density and ultra-thin LED substrates.

For the above purpose, the present invention is seated on a high-density ultra-thin LED substrate on which a plurality of lead frame strips in which a plurality of light emitting device packages are arranged in a matrix or in a line are provided in a plurality at regular intervals, and the light is emitted by a capillary. In the wire bonder clamp having an open working area formed on one side to perform wire bonding between an LED chip and a lead frame of a device package, a first compartment formed along the longitudinal direction in the inner center of the working area; ; a plurality of second partition pieces arranged at regular intervals along the width direction from both edges of the first partition piece; a plurality of windows arranged in a grid shape by the first and second partitions in the working area and having widths and lengths corresponding to those of the lead frame strip; In order to increase the area in contact with the periphery of the wire bonding area inside the window to prevent shaking of the LED substrate during wire bonding, a certain distance from both sides of the inner peripheral surface of the width direction of the work area and both edges of the second compartment A plurality of protrusions are formed so as to improve the reliability of the work while securing a work space for wire bonding work by minimizing the clamping loss section and the section encroaching on the bonding area due to deviations occurring in the process of transferring the LED substrate. It characterized in that it comprises a; pressing pieces that are alternately arranged with each other.

In addition, in the present invention, the pressing piece is characterized in that both sides are made of inclined surfaces to secure the wire bonding area and the movement path of the capillary.

In addition, the present invention provides a wire bonding area and a movement path of the capillary during wire bonding of a light emitting device package located at the outermost among a plurality of light emitting device packages constituting the lead frame strip, so that the working area can be secured. The inner peripheral surface of the outer surface is made of an upwardly diagonal inclined surface, the first compartment is characterized in that the vertical section is made of a triangular shape.

The present invention made as described above makes it possible to sufficiently pressurize the periphery of the wire bonding area of the LED substrate by a plurality of pressing pieces protruding forward from both sides of the outer circumferential surface of the second compartment, thereby preventing the shaking of the LED substrate during wire bonding. , it is possible to quickly and smoothly perform wire bonding through the capillary.

In particular, the present invention minimizes the clamping loss section and the bonding area encroachment section due to deviations occurring in the process of transferring the LED substrate by displacing the pressing pieces alternately on the opposite surfaces to secure a work space for wire bonding work. It is possible to improve the reliability of the product, significantly increase the productivity, and expand the range of packages that can be manufactured.

In addition, in the present invention, both sides of the pressing piece are formed with inclined surfaces to secure a wire bonding area and a movement path of the capillary during wire bonding, and through this, a wire loop having excellent durability and reliability can be formed.

In addition, in the present invention, the inner circumferential surface of the working area is made of an upwardly diagonal inclined surface, and the first compartment has a vertical cross-section in a triangular shape. It is possible to secure the wire bonding area and movement path of the pillar, thereby forming a wire loop with excellent durability and reliability.

1a) and 1b) are schematic illustrations of a wire bonding apparatus for manufacturing an LED package.
2 is a schematic illustration of a high-density ultra-thin LED substrate.
3a) to 3e) are schematic diagrams for explaining a wire bonder clamp according to the prior art and its problems.
4a) and 4b) are schematic illustrations of a wire bonder clamp for a high-density ultra-thin LED substrate according to an embodiment of the present invention.
5a) and 5b) are state diagrams of a wire bonder clamp for a high-density ultra-thin LED substrate according to an embodiment of the present invention.
6a) and 6b) are schematic diagrams for explaining a wire bonding operation of forming a wire loop connecting an LED chip and a lead frame.
Figure 6c) is a movement path of the capillary in which the durability of the ball and neck of the wire loop is reduced.
7a) to 7c) are schematic diagrams for explaining a pressing piece according to an embodiment of the present invention.

In describing the present invention, the advantages and features of the present invention, and a method for achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and that the spirit of the present invention may be sufficiently conveyed to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

Terms such as first and second may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

Terms such as top, bottom, top, bottom, or top, bottom, etc. are used to distinguish relative positions of components. For example, for convenience, when naming the upper part of the drawing as the upper part and the lower part of the drawing as the lower part, the upper part may be named lower without departing from the scope of the present invention, and the lower part may be named upper part. .

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, a wire bonder clamp for a high-density ultra-thin LED substrate according to the present invention will be described in more detail with reference to the accompanying drawings.

Figure 4 is an exemplary view of the present invention, Figures 5a) and 5b) is a state diagram in use according to a preferred embodiment of the present invention.

The wire bonder clamp according to the present invention is disposed on the high-density and ultra-thin LED substrate 10 and between the LED chip 12-1 and the lead frame 12-2 of the light emitting device package 12 by a capillary. It serves to fix the LED substrate 10 so that it does not move during the wire bonding operation.

Here, the high-density ultra-thin LED substrate refers to a substrate in which a plurality of lead frame strips in which a plurality of light emitting device packages are arranged in a matrix or in a line are provided at regular intervals as shown in FIG. 2 .

For the above purpose, the wire bonder clamp 100 according to the present invention is made of a substantially rectangular plate-shaped body having a predetermined area as shown in FIG. 4, and both ends of the flange ( 101) is formed with a step upward.

In addition, in the central portion of the wire bonder clamp 100, a working area 102 that is opened in a rectangular shape is formed so that a wire bonding operation by a capillary is performed.

A first partition piece 110 of a predetermined thickness is formed in the inner center of the work area along the longitudinal direction, and a plurality of second partition pieces 120 are formed at regular intervals along the width direction from both edges of the first partition piece. is formed

Here, the distance between the second partition piece 120 and the second partition piece 120 preferably corresponds to the width of the lead frame strip.

In addition, a plurality of windows 130 are arranged in a grid shape by the first partition and the second partition in the work area. The window 130 is formed in a substantially rectangular shape, and its width and length correspond to the lead frame strip.

In addition, the pressing piece 140 is formed to protrude forward from both sides of the inner peripheral surface of both sides of the width direction of the working area 102 according to the present invention and both sides of the second partition piece 120 .

The pressing piece 140 is disposed inside each window 130 to press the periphery of the wire bonding area of the lead frame strip 11 .

It is preferable that the pressing piece 140 is formed in plurality to increase the area in contact with the lead frame strip 11 .

The present invention can prevent the LED substrate 10 from shaking during wire bonding while the plurality of pressing pieces 140 are in contact with the lead frame strip 11, thereby improving workability and productivity, and reliability of the product. can be obtained

On the other hand, when the pressing pieces 140 formed on the outer peripheral surfaces facing each other of the second compartment pieces 120 on both sides are disposed in a form facing each other, the width of the window becomes narrow in proportion to the thickness of the pressing pieces 140 on both sides. It will affect the wire bonding work of the filler.

For example, when the high-density ultra-thin LED substrate 10 is transferred by a wire bonding device, if the lead package strip 11 and the window 130 do not correspond accurately due to deviation, the working space of the capillary may become narrower. In addition, the non-formed section of the pressing piece 140 is not preferable because the clamping function may be lost.

In order to solve the above-mentioned problems, in the present invention, it is preferable that the pressing pieces 140 are disposed to be alternately arranged on the opposite surfaces.

When the pressing pieces 140 are disposed to be staggered from each other on the opposite surfaces, it is possible to minimize the clamping loss section and the bonding area invasion section due to the deviation occurring in the process of transferring the LED substrate, and the deviation between the transfer of the LED substrate 10 can be minimized. Even if it occurs, it is possible to secure a working space for wire bonding work, thereby improving product reliability.

Figure 3a) is a schematic illustration showing a wire bonder clamp of an individual package pressing method according to the prior art, Figure 3b) is a schematic illustration showing a wire bonder clamp in the form of a fully open working area according to the prior art 3c) is a schematic illustration showing a wire bonder clamp of a type in which a plurality of windows in the form of long holes open in a straight line are arranged in a working area according to the prior art.

Conventionally, the wire bonding operation of the LED substrate was performed through the wire bonder clamp of the form shown in FIGS. 3a) to 3c). As shown in FIG. 3a), the wire bonder clamp of the individual package pressing method has excellent work stability and reliability, but , leaving a space between products, leading to material loss, and increasing the movement path of equipment operation, thereby significantly reducing productivity and economic feasibility.

In addition, as shown in Fig. 3b), the wire bonder clamp in which the working area is completely opened can secure the working space of the capillary, so that it is possible to perform wire bonding of the high-density integrated LED substrate. However, since the wire bonder clamp of the form as shown in FIG. 3b) has a remarkably narrow area in contact with the LED substrate, the portion that presses the substrate is unstable. , which caused many defects in the wire bonding process.

In addition, the wire bonder clamp of the form as shown in Fig. 3c) has a wider area in contact with the substrate than the form in which the working area is completely open as shown in Fig. 3b), but the clamping width that presses the substrate between the long hole is 100 μm. Since it is remarkably narrow as below, the substrate cannot be stably pressed and the operation is inevitably unstable.

This is a numerical value determined to prevent invasion of the wire bonding area and secure a moving space of the capillary, and is a part that cannot be arbitrarily expanded to simply fix the LED board. In particular, in the wire bonder clamp of the form shown in FIG. 3c), a clamping loss section and a bonding area invasion section are inevitably generated due to movement deviation of the LED substrate in the wire bonding device. This is due to the phenomenon that only the outermost part of the can only be pressed narrowly.

As in the present invention, when a plurality of pressing pieces 140 are arranged alternately on opposite surfaces inside the window 130 as in the present invention, the deviation of the movement of the LED substrate, which had an error limit of 100 μm, can be extended to a maximum of 300 μm, and thus wire bonding The effect of lowering the error rate in the device can be expected, and the effect of improving the quality through a stable wire bonding process can be expected.

Next, FIG. 6a) is a schematic exemplary diagram illustrating a wire loop connecting an LED chip and a lead frame during wire bonding.

6a), the capillary 20 is formed by bonding the ball 13-1 to the upper surface of the LED chip 12-1, and then vertically forming the neck 13-2 of a predetermined length. Thereafter, while moving along a predetermined path, a loop-shaped wire 13-3 blocking the upper portion of the insulating space between the LED chip 12-1 and the lead frame 12-2 is formed, and then the lead frame 12- 2) The stitches 13-4 are adhesively formed on the upper surface.

Here, the wire loop 13 electrically connects the LED chip 12-1 and the lead frame 12-2, and includes a control signal, a power signal, and a control signal for the operation of the LED chip 12-1; Alternatively, at least one of a ground signal is provided from the outside, and the ball 13-1, the neck 13-2, and the stitch 13-4 constituting the wire loop 13 are vulnerable parts of the wire loop. When the mold part of the light emitting device package contracts or expands due to heat, a short circuit may occur in the vulnerable region. In particular, when the neck 13-2 and the wire 13-3 do not secure a certain height and shape, the reliability of the wire loop 13 cannot be secured.

In order for the neck 13-2 to have an appropriate height in the vertical direction, the neck 13-2 moves vertically upward from the upper surface of the LED chip 12-1 as shown in FIG. 6b) as shown in FIG. 6b). ) is formed and then, in the forming step of the wire 13-3, it should move in an upward diagonal direction to the opposite side of the lead frame to form the stitch, and then move in a curved shape toward the lead frame.

If the capillary 20 forms the neck 13-2 and then moves toward the lead frame in a curved shape, the neck 13-2 is bent toward the lead frame, and this causes the ball 13 -1), the durability of the neck 13-2 may be reduced.

The capillary is made in the form of a cylindrical horn having a certain thickness. If the pressing piece 140 is simply formed to protrude in the form of a square or rectangular shape as in FIG. 7c), the capillary 20 is formed in the neck 13- 2) after forming, it is impossible to move in the diagonal direction opposite to the lead frame due to interference by the side surface of the pressing piece 140 . That is, since the capillary 20 cannot move along an ideal path as shown in FIG. 6b), the reliability of the wire 13-3 is inevitably low, and the ball 13-1 and the neck 13-2 durability may be reduced.

In order to solve the above problems, it is preferable that both sides of the pressing piece 140 according to the present invention are formed of inclined surfaces.

For example, the pressing piece 140 may have a triangular or trapezoidal shape such that both sides thereof are inclined. As such, when both sides of the pressing piece 140 are inclined surfaces, the wire bonding area and movement path of the capillary 20 can be secured as much as possible in a narrow substrate space, so through the formation of a reliable wire 13-3 The durability of the ball 13-1, the neck 13-2, and the stitch 13-4 can be secured.

Preferably, the side surface of the pressing piece 140 with respect to the second compartment piece 120 may be formed at an inclination angle of about 70°, and it is made of a curved surface concave inward rather than a simple plane, so that the capillary in the air It is also possible to secure additional space for Lee's movement.

In addition, in the present invention, the inner circumferential surface of the working area 101 is formed as an upwardly diagonal inclined surface, and the first compartment 110 has a triangular shape in a vertical cross-section. Provided on the high-density ultra-thin LED substrate 10 Among the plurality of light emitting device packages 12 to be used, when a wire bonding operation is performed on the outermost light emitting device package 12 opposite to the inner circumferential surface of the working area, the wire bonding area and movement path of the capillary can be secured. .

The present invention described above is merely exemplary, and those of ordinary skill in the art to which the present invention pertains will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, it will be well understood that the present invention is not limited to the form mentioned in the above detailed description. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims. Moreover, it is to be understood that the present invention covers all modifications, equivalents and substitutions falling within the spirit and scope of the invention as defined by the appended claims.

10: LED board
11: Lead frame strip
12: light emitting device package
12-1: LED chip 12-2: lead frame
13 : wire loop
13-1: Ball 13-2: Neck
13-3: wire 13-4: stitch
20: capillary (capillary)
100: wire bonder clamp
101: flange 102: work area
110: Section 1
120: Section 2
130: window
140: press piece

Claims (3)

A plurality of light emitting device packages are seated on a high-density ultra-thin LED substrate in which a plurality of lead frame strips arranged in a matrix or in a line are provided at regular intervals, and between the LED chip of the light emitting device package and the lead frame by a capillary. In the wire bonder clamp in which an open work area is formed on one side so that a wire bonding operation is made,
a first partition piece 110 formed along the longitudinal direction in the inner center of the work area;
a plurality of second partition pieces 120 arranged at regular intervals along the width direction from both edges of the first partition piece;
a plurality of windows 130 arranged in a lattice form by the first and second partitions in the working area and having widths and lengths corresponding to the lead frame strips;
In order to increase the area in contact with the periphery of the wire bonding area inside the window to prevent shaking of the LED substrate during wire bonding, the inner circumferential surface on both sides of the width direction of the work area and both edges of the second compartment are spaced apart from each other. A plurality of protruding surfaces are provided so that a working space for wire bonding can be secured and reliability of work can be improved by minimizing a clamping loss section and a section encroaching on the bonding area due to deviations occurring in the process of transferring the LED substrate. The pressing pieces 140 that are alternately arranged in the;
A wire bonder clamp for a high-density ultra-thin LED substrate comprising a.
The wire bonder clamp of claim 1, wherein both sides of the pressing piece are inclined surfaces to secure the wire bonding area and movement path of the capillary.
The method according to claim 1, wherein the wire bonding area and movement path of the capillary can be secured during wire bonding of the light emitting device package located at the outermost among the plurality of light emitting device packages constituting the lead frame strip. A wire bonder clamp for high-density ultra-thin LED substrates, characterized in that the inner peripheral surface of the region is formed as an upwardly diagonal inclined surface to the outside, and the first compartment has a vertical cross-section in a triangular shape.

Images