KR102339263B1 - Wafer Prober Bridge CCD Module - Google Patents

Abstract

The present invention relates to a camera module placed on an alignment bridge among wafer test facility components to recognize an image of a wafer surface and, more specifically, to a CCD module for a wafer prober bridge, capable of making an upgrade such that replacement and maintenance by CCD module can become easier in order to solve an issue about an increase in wafer alignment errors due to degraded PCB components and sensors in a module, while making a structural improvement to a module type applicable as a pattern matching scheme so as to be employed universally for both old and new pieces of equipment. In accordance with the present invention, the CCD module for a wafer prober bridge includes: a body having an inner housing part and a front combination part; a cap combined with the front combination part, and having an exposure hole and an upper coupling part; and a camera housed in the housing part of the body, and confined and coupled with the upper coupling part such that a lens part can be ejected to the exposure hole of the cap.

Description

CCD Module for Wafer Prober Bridge {Wafer Prober Bridge CCD Module}

The present invention relates to a CCD module for a wafer prober bridge,

More specifically, it is a camera module that is placed on the alignment bridge among the wafer test equipment parts and recognizes the image of the wafer surface. ) to solve the problem of increasing CCD module unit, while upgrading so that replacement and maintenance are easy, the structure has been improved to a module type so that it can be applied universally to both old and new equipment. It relates to a CCD module for wafer prober bridges.

As a technology related to a camera applied to conventional wafer equipment or wafer test equipment, there is Patent Registration No. 10-0333183 (April 08, 2002) [Semiconductor chip wafer and pattern film alignment device],

This patent is a device for accurately aligning and arranging a pattern film having a chip wiring function and a ball grid array mounting function attached to each integrated circuit chip formed on a semiconductor wafer during the semiconductor device manufacturing process on the wafer. is about,

When manufacturing a semiconductor device, it accurately measures the misalignment state between the integrated circuit formed on the wafer and the pattern film that is placed on the integrated circuit to perform the chip wiring function and the ball grid contact function. By automatically correcting the value corresponding to the error through the comparison of coordinate values, it is suggested to provide equipment that can improve the yield of semiconductor devices and remarkably reduce the rate of defective products.

In addition, there is Patent Registration No. 10-2032403 (October 08, 2019) [Device and method for positioning semiconductor wafer using image],

This registered patent relates to a device and method for aligning the position of a semiconductor wafer, which allows the position of the center point of the semiconductor wafer to be confirmed using an image of the semiconductor wafer and corrected using a wafer handler,

A wafer handler that loads or unloads the semiconductor wafer from a cassette in which a semiconductor wafer is loaded in a plurality of slots, and is provided with a support part at one end in contact with a bottom surface of the semiconductor wafer to support the semiconductor wafer ; a wafer chuck on which the semiconductor wafer is mounted by the wafer handler; a camera for photographing a semiconductor wafer seated on the wafer chuck; And connected to the camera, detecting a flat zone of the semiconductor wafer from the image taken by the camera, by comparing the detected flat zone with a reference horizontal line stored in advance to confirm the rotation offset of the semiconductor wafer, the confirmed rotation and a detection unit configured to rotate the semiconductor wafer by controlling the wafer chuck to rotate according to an offset, wherein the detection unit confirms a center point position of the semiconductor wafer from the image, and controls the wafer handler to set the center point position to the support unit Align with the reference position on the top,

Through this, it is possible to check the center point position information of the semiconductor wafer obtained from the image and control the wafer handler for loading or unloading the semiconductor wafer to quickly and accurately align the center point position of the semiconductor wafer.

In addition, there is Patent Registration No. 10-0195103 (February 11, 1999) [Method of pre-aligning wafers using a charge-coupled device camera],

This patent registration relates to a wafer prealignment method using a charge-coupled device camera for wafer prealignment operation in semiconductor inspection equipment,

The pre-alignment method of the wafer using the charge-coupled device camera of this registered patent uses the charge-coupled device camera for both wafer model number recognition and pre-alignment operation. Putting on a chuck, receiving a wafer shape with a charge-coupled device camera, analyzing the input wafer shape with calculation and determination means to calculate the center and cut surface of the wafer, and connecting with calculation and determination means The operation efficiency of the wafer inspection equipment is increased and unnecessary expenses, including the steps of operating the handler robot through the controller of the probe machine to correct the center of the wafer and aligning the cut surface of the wafer in one direction by operating the rotation axis seeking savings.

Furthermore, Patent Registration No. 10-0945443 (February 25, 2010) [Wafer Level Camera Module]

This registered patent relates to a wafer level camera module in which a step portion corresponding to a recognition mark formed on a wafer lens is formed on the upper surface of a spacer that is adhered to an image sensor, and an adhesive layer is applied only to the upper surface of the spacer except for the step portion,

an image sensor equipped with a light receiving unit; and a spacer bonded to a lower surface of the image sensor and provided with a window exposing the light receiving unit, a spacer having a stepped portion formed on an edge of the upper surface, and a spacer bonded to the lower surface of the spacer and positioned corresponding to the stepped portion for alignment with the image sensor Provides a wafer-level camera module comprising; a lens assembly including a wafer lens having a recognition mark formed thereon,

Through this, according to the wafer level camera module, a step portion corresponding to the recognition mark formed on the wafer lens is formed on the upper surface of the spacer to be bonded to the image sensor, and an adhesive layer is not applied to the step portion, so that the recognition mark is formed by the adhesive layer can be prevented from being covered, and eventually the alignment between the lens assembly and the image sensor can be accurately and easily made to improve the productivity of the product.

However, the prior art, including these prior art documents, are far from the concept of the present invention because they are not related to camera or CCD module replacement and maintenance easiness.

Accordingly, the present invention is to solve the problem that the wafer alignment error increases due to the aging PCB components and sensors in the camera module for wafer surface imaging disposed on the alignment bridge of the wafer test facility. In order to solve the problem of increasing wafer alignment errors due to PCB components and sensors, it is easy to replace and maintain the CCD module unit, and the module can be applied in a pattern matching method for universal adoption in both old and new equipment. An object of the present invention is to provide a CCD module for wafer prober bridges with improved structure.

In addition, the present invention provides a CCD module for wafer prober bridges in which the lens part of the camera embedded in the body and mounted on the upper fastening part of the cap is constrained to the upper fastening part so that fine adjustment is possible by protruding into the exposure hole of the cap. intended to provide

Furthermore, the present invention provides a CCD module for wafer prober bridges in which upper fastening parts are provided on both sides of the exposure hole of the cap, and the fastening hole provided in the roof of the camera is fixed by bolts to the upper fastening part to enable fine adjustment of the appearance and inclines of the lens part. aim to do

Another object of the present invention is to provide a CCD module for a wafer prober bridge that is easy to maintain by allowing easy access to the camera through a cover coupled to the upper coupling part of the body.

Further, in the present invention, when the round part on one side of the cap contacts through the two upper and lower position fixing pins provided on one side of the front coupling part of the body, the cap and the front bolt hole of the body coincide, so that assembly is possible easily, and the body's A CCD module for wafer prober bridges, which is equipped with a first observation part on one side wall of both sides of the front coupling part, makes it possible to easily check problems such as connection failure of simple cable connectors without disassembling it even when it is mounted on the alignment bridge. aim to

In order to achieve the above object, the CCD module for a wafer prober bridge according to the present invention is

a body having an internal receiving part and a pre-engaging part;

a cap coupled to the front coupling part and having an exposed hole and an upper fastening part; and

The camera is built in the receiving part of the body, and the camera is fastened to the upper fastening part so that the lens part protrudes and protrudes toward the exposure hole side of the cap.

In addition, in the CCD module for wafer prober bridges according to the present invention

Upper fastening parts are provided on both sides of the exposed hole of the cap, and the camera has a loop having two fastening holes on both sides that are bolted to the upper fastening parts, respectively,

The body further includes an upper coupling part, and a cover is coupled to the upper coupling part to cover the camera built in the receiving part,

An upper and lower position fixing pin is provided on one side of the front coupling part of the body,

One or both sides of the cap have a round part, and either round part is fixed to the front coupling part on the body in a state in contact with the positioning pin,

It is preferable that a first observation part is provided on one side wall of both side walls of the front coupling part of the body.

The camera module for wafer surface imaging, that is, the CCD module, disposed on the alignment bridge of the wafer test facility of the present invention, is embedded in the body and the lens part of the camera mounted on the upper fastening part of the cap protrudes into the exposure hole of the cap and fine-tunes it It is constrained to the upper fastening part so that maintenance is easy, and the upper fastening parts are provided on both sides of the exposure hole of the cap. The camera can be easily accessed through the cover coupled to the upper coupling part of the body, so it is easy to check the primary condition and maintain it immediately. When the round part on one side of the cap contacts through the two positioning pins, the front bolt hole of the cap and the body coincides, making assembly easy. It is convenient because it is convenient to check problems such as poor connection of simple cable connectors without disassembling even when mounted in the In order to solve the problem of increasing wafer alignment errors due to this, in order to solve the problem of increasing wafer alignment errors caused by aging PCB components and sensors of the camera module, that is, the CCD module, replacement and maintenance are made easy in units of CCD modules, and The structure can be improved as a module type so that it can be applied universally to all equipment in a pattern matching method.

1 and 2 are various views of a CCD module for a wafer prober bridge according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Since the present invention can have various changes and can have various forms, implementation examples (態樣, aspects) (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In each drawing, the same reference sign, particularly the number of the tens and one digit, or the reference numerals having the same tens, one, and alphabet, indicates a member having the same or similar function, and, unless otherwise specified, each The member indicated by the reference sign may be regarded as a member conforming to these standards.

In addition, in each drawing, components are expressed in exaggeratedly large (or thick), small (or thin) or simplified in size or thickness in consideration of convenience of understanding, but the protection scope of the present invention is limited by this. it shouldn't be

The terminology used herein is only used to describe a specific embodiment (aspect, aspect, aspect) (or embodiment), and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as comprises or consists of are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

If it is determined in the present specification that detailed descriptions of well-known functions and configurations may unnecessarily obscure the gist of the present invention, the description thereof may be omitted.

~1~, ~2~, etc. described in the present specification are only to be referred to to distinguish different components, etc., and are not limited by superiority or inferiority or order of manufacture, and in the detailed description and claims of the invention, The names may not match.

When describing the CCD module (M) for the wafer prober bridge according to the present invention, an approximate direction reference that is not strict for convenience is specified with reference to FIGS. 1 and 2 ,

Set the cover (C10) side as the top and the opposite side as the bottom,

Set the lens part 31 side of the camera 30 to the front, and the opposite side to the rear,

Determine the left and right in the state looking at the lens unit 31,

In the detailed description and claims of the invention related to other drawings, unless otherwise specified, directions are specified and described according to this standard.

First, as shown in the downward observation perspective view of FIG. 1 and the upward observation perspective view of FIG. 2 , the CCD module (M) for a wafer prober bridge according to the present invention has a body 10, a cap 20, and a camera 30 ) is composed of

The body 10 has an inner receiving portion 10s and a pre-engaging portion 11 . The accommodating part 10s is surrounded by both side walls 10W and 10w, and the front coupling part 11 is provided in front of the side walls 10W and 10w.

In addition, the body 10 further includes an upper coupling portion 13_, which is also provided on the upper portion of the sidewalls 10W and 10w, and the upper coupling portion 13 includes a bolt B3. The cover C10 is coupled through the accommodating part 10s to cover and protect the built-in camera 30.

On the left and right outer sides of both side walls (10W, 10w) of the body, wing parts 17 are also provided, and the CCD module (M) is attached to the alignment bridge among the wafer test equipment parts through the mounting hole 17h. to have it installed.

In addition, as can be seen in Fig. 1 [A] and a series of dashed-dotted circles arranged vertically on the right side (plan view, front view, right view, left view, and rear view, respectively),

The body 10 is also provided with a first observation part 15A in the form of an incision on one side wall, particularly the right side wall 10w, of both side walls of the front coupling part 11, so that it can be easily disassembled without disassembling even in the state of being mounted on the alignment bridge. It is configured to check simple problems such as a connection failure of the simple cable 35a and the connector 35 (see FIG. 1 [A] and the third right view from the top right).

Furthermore, two upper and lower position fixing pins 11p are provided on one side of the front coupling part 11 of the body 10, in particular, on the left side wall 10W among the both sides of the wall, so that one round part of the cap 20 ( 21r) is in contact with the position fixing pin 11p, the front bolt holes of the cap and the body coincide so that assembly and fixation are possible easily with the bolt B1 (FIG. 1 [A] and the second from the top right) See front view and fourth left view).

In addition, as shown in the upward observation perspective view of FIG. 2 , the body 10 is configured to enable simple inspection of the camera and secure heat dissipation characteristics by configuring the bottom surface second observation portion 15B by opening the bottom portion from the front.

In addition, the rear side of the body 10 is partially opened to constitute the rear third observation unit 15C, so that a simple inspection of the camera is possible in the disassembled CCD module state, and the camera 30 at the time of assembly is optional in the receiving unit 10s. It is configured so that no separation occurs (refer to the fifth rear view from the top on the right of Fig. 1 [A]).

Next, the cap 20 is coupled to the front coupling part 11 of the body through a bolt B1, and has an exposed hole 21 (refer to FIG. 2 [A]) and an upper fastening part 23 .

The upper fastening part 23 of the cap 20 is provided on both sides of the exposure hole 21 (see FIG. 2 [B]),

The camera 30 has a loop 33 having two fastening holes 33h on both sides that are respectively bolted b1 to the upper fastening part 23 .

In addition, one or both sides of the cap 20, that is, at least one side, in particular, the left side has a round part 21r (to ensure manufacturing convenience and assembly characteristics, it has round parts on both sides),

The round part 21r is configured to secure assembly convenience by fixing the bolt B1 to the front coupling part 11 on the body in a state in which it is in contact with the position fixing pin 11p of the body 10 .

The position fixing pins 11p of the body 10 are arranged biasedly on the upper and lower ends of the left wall 10W, and the cap 20 has a size large enough to cover and cover the open front coupling portion 11 of the body 10. Round of Since it is in contact with the upper and lower portions of the portion 21r, the upper incision structure is introduced in the left wall 10W, unlike the right wall 10w, which is cut open to provide the first observation portion 15A in terms of assembly convenience and assembly state stability. It is preferable not to do so, and this is also suitable in terms of providing a compact CCD module (M) for a wafer prober bridge that is universally applicable to both old and new alignment bridges, that is, both old and new wafer test facilities.

Subsequently, the camera 30 is embedded in the receiving part of the body, and is disposed on an alignment bridge among wafer test equipment parts and is a core part for recognizing the image of the wafer surface,

In particular, it is composed of a CCD (Charged Coupled Device) module,

For example, this CCD module 30 has a sensor size of 1/2 inch or 1/3 inch, and a product having a pixel size of 8.4 μm × 9.8 μm (6.4 μm × 7.5 μm is also applicable). can

The camera module, especially the CCD module, which is disposed on an alignment bridge and recognizes the image of the wafer surface in the prior art, caused a problem in which the wafer alignment error increased due to the aging PCB components and sensors in the module. has been pointed out as

Therefore, while upgrading to facilitate replacement and maintenance in units of CCD modules, the structure of the module type was devised so that it can be applied universally to both old and new equipment by using a pattern matching method.

Specifically, the camera 30 is built in the receiving part 10s of the body 10 in which the cap 20 is assembled to the front coupling part 11 in the state in which the cable 35a and the connector 35 are assembled (or separated), and ,

The camera 30 is assembled to the upper fastening part 23 of the cap through the loop 33 coupled through the bolt B4 (see FIG. 1 [A]) to the upper part of the lens part 31 .

The exposure hole 21 of the cap 20 has left, right, and bottom surfaces blocked and opened upward. ) and the upper fastening portion 23 of the cap 20 is configured to be coupled with the bolt b1,

In a state in which the bolt (b1) is slightly loosened without fully tightening, the lens part 31 of the camera protrudes into the exposure hole 21 of the cap 20 and is constrained to the upper fastening part to enable fine adjustment such as focus adjustment or position adjustment. have.

The lens unit 31 is moved in and out, that is, the front and rear movement of the camera 30 is stably made through the fastening hole 33h of the loop 33 and the bolt b1 coupled thereto,

In addition, the roof 33 has a rail portion 33r protruding from the lower surface (see Fig. 2 [B]), and the rail portion is in close contact with the upper end of the wall on both sides of the exposed hole 21 of the cap 20 of the upwardly opened shape. It is configured to help the stable forward and backward movement of the camera 30,

After being displaced to the required degree from each [A] state in FIGS. 1 and 2 to each [B] state, the position adjusted state is fixed by tightening the bolt (b1).

In the above description, a known technology related to a wafer test facility, an alignment bridge, a CCD module, etc. is omitted, but those skilled in the art can easily guess, infer and reproduce it.

In addition, in the above description of the present invention, with reference to the accompanying drawings, a CCD module for a wafer prober bridge having a specific shape and structure has been mainly described, but the present invention is capable of various modifications, changes and substitutions by those skilled in the art, such modifications , changes and substitutions should be construed as falling within the protection scope of the present invention.

M: CCD module for wafer prober bridge
10: body 10s: receiving part
11: Former coupling part 13: Upper coupling part
15A, 15B, 15C: observation part 17: wing part
20: cap 21: exposure hole
23: upper fastening part 21r: round part
30: camera 31: lens unit
33: loop 35: connector

Claims (4)

a body having an internal receiving part and a pre-engaging part;
a cap coupled to the front coupling part and having an exposed hole and an upper fastening part; and
Built in the receiving part of the body, the camera is constrained to the upper fastening part so that the lens part protrudes and protrudes toward the exposure hole side of the cap;
The body further comprises an upper coupling part,

One side of the front coupling part of the body is provided with positioning pins arranged to be biased at the upper and lower ends, one or both sides of the cap have round parts, and either round part is fixed to the front coupling part on the body in contact with the positioning pins, and ,
A first observation part is provided on one side wall of both side walls of the front coupling part of the body,
The bottom part of the body has a bottom surface second observation part open to the front side,
The cap is coupled to the front coupling part of the body through bolts, has an exposed hole and an upper fastening part, and the upper fastening part is provided on both sides of the exposed hole, and the camera has a loop bolted to the upper fastening part ,
The exposure hole of the cap has the left, right, and bottom surfaces blocked and opened upward. In the state where the lens part of the camera is located in the exposure hole, the fastening hole of the loop and the upper fastening part of the cap are bolted together,
The loop has a rail part protruding from the lower surface, and the rail part is closely attached to the upper end of both side walls of the exposed hole of the cap with an upward opening, so that the camera can stably move back and forth. The method of claim 1,
CCD module for wafer prober bridge, characterized in that wings having long mounting holes are provided on the left and right outer sides of both sides of the front coupling part of the body. 3. The method according to claim 1 or 2,
The body of the wafer prober bridge, characterized in that the rear side is partially opened to constitute a rear third observation unit. 3. The method according to claim 1 or 2,
The first observation part is a CCD module for a wafer prober bridge, characterized in that it is formed by an upper cut-out structure of the right side wall of the body.

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