KR102339050B1 - Fiber sheet device cover with anti-humidification function - Google Patents

Abstract

The present invention relates to a device cover with a moisture-proof function. The device cover of the present invention is based on a device cover composed of an absorbent fiber or a paper sheet layer and a plastic layer, and absorbs and hardens a liquid resin along the edge portion of the sheet layer exposed to the outside from the cover, thereby forming a moisture-proof belt on the edge portion of the sheet layer. The device cover according to the present invention has the effect that the end side of the sheet layer is further strengthened and cleaned due to the moisture-proof belt, thereby implementing waterproofing and moisture-proofing as a whole. In another embodiment, the other device cover of the present invention is composed entirely of an absorbent fiber or paper sheet layer that is cured after being impregnated with resin and a decoration layer formed on the surface thereof, has the effect of implementing a perfect moisture-proof function and remarkably increasing strength by impregnating a sheet with resin and then curing the sheet, and has the effect of being able to manufacture a cover of a thin film by implementing the decoration layer in a transfer manner without including a substrate such as a film, etc.

Description

Device cover using a fiber sheet having a moisture-proof function {Fiber sheet device cover with anti-humidification function}

The present invention relates to a back cover of a device, and more particularly, to a device cover member configured to have a waterproof and moisture-proof function when an absorbent sheet such as fiber or paper is used in its manufacture.

In general, liquid crystal displays and other electronic components provided as display devices of portable information and communication devices such as smart phones and tablet PCs are easily damaged or damaged by impact such as dropping the device. Accordingly, protective and finishing panels are provided as back-covers on the back of IT devices, and various decorations such as specific logos, characters, symbols, and patterns are generally implemented through this.

In terms of shape, a so-called 3D panel in which the edge of the flat panel is curved in order to improve the three-dimensional effect and grip of the device is mainly applied as the back-cover.

The cover panel used in early smartphones was mainly a plastic injection panel using PC resin, which has the advantage of being inexpensive and easy to manufacture. There were metal panels such as aluminum and magnesium, but they were expensive and heavy, and they were difficult to apply because they interfered with the realization of wireless communication performance. It is difficult and the unit cost is high, and there is a problem that productivity is lowered.

What has been proposed is a so-called 'PMMA/PC composite sheet' structure in which two or more sheets are laminated. This composite sheet structure generally has the purpose of pursuing the high hardness of PMMA and the high strength of PC. However, this composite sheet has problems such as being thick and weak in strength compared to the glass, and forming a price three times higher than that of general PC or PMMA.

On the other hand, an exterior cover constructed using a fabric fabric sheet has been proposed, and is disclosed in, for example, Patent Publication No. 10-2014-0088259. Referring to FIG. 1, the disclosed cover 1 includes at least one layer of a textile fabric 2 and a molded resin part 3 formed on one or both sides of the fabric 2, CNC cutting, etc. It is provided in a certain size and shape through

This type of exterior cover 1 has an advantage in that it can express the texture and design of the fabric 2 on the exterior, and has been widely discussed and tested recently. However, this cover (1) is:

a problem in which all of the corner ends of the textile fabric (2) come loose;

Even if the surface of the fabric (2) is treated with a waterproof coating of the resin (3) or other material, external moisture and moisture penetrate into the fiber fabric (2) from the end side (4) thereof;

The problem that the thickness of the cover (1) increases a lot due to the addition of the upper and lower resin parts to the thickness of the fabric, which goes against the trend of thinning IT devices;

etc.

In particular, when moisture enters the textile fabric 2 , aside from the fact that the physical properties of the cover 1 itself may change, marks or stains due to moisture appear unsightly when viewed from the outside of the molded resin part 3 . Once in, it cannot be easily removed.

Therefore, when an absorbent sheet such as fiber is used for an IT device cover, it is necessary to specially consider waterproofing and moisture-proofing of the end side.

<Prior art literature>

Laid-open Patent Publication No. 10-2004-0019204

Unexamined Patent Publication No. 10-2010-0038844

Laid-open Patent Publication No. 10-2016-0081831

Laid-open Patent Publication No. 10-2014-0088259

Registered Patent Publication No. 10-1609129

The present invention has been proposed to solve the problems of the prior art. Accordingly, in the present invention, in a plastic member using a sheet such as absorbent fiber, the end side is structurally reinforced and at the same time has a waterproof/moisture-proof function, or by impregnating the fiber sheet with a resin to increase the strength and thickness as well as waterproof/moisture-proof function This is to provide a cover for IT devices that minimizes

The device cover of the present invention comprises:

A device cover comprising an absorbent fiber or paper sheet layer not impregnated with a resin, and a plastic layer on one or both sides thereof,

by absorbing and curing the liquid resin along the edge portion of the sheet layer exposed to the outside of the cover;

forming a moisture-proof belt at an edge portion of the sheet layer;

is characterized by

Of course, when the plastic layer is formed on only one side of the absorbent sheet, a waterproofing coating layer may be formed on the surface of the sheet layer opposite to the plastic layer.

On the other hand, the moisture-proof belt portion of the sheet layer may be discolored due to resin absorption and curing, and a difference in color may occur from other portions.

Accordingly, the device cover is:

In order to prevent the color difference from being expressed as it is, the sheet layer, the plastic layer, or the waterproof coating layer opposite to the plastic layer may be color-treated in a predetermined manner.

Preferably, the plastic layer comprises:

those formed by plastic injection, plastic film, FRP, or a combination of a material selected therefrom;

is characterized by

Another device cover of the present invention is:

In the device cover comprising an absorbent fiber or paper sheet layer that is cured after being impregnated with a resin as a whole,

that the decoration layer of a thin film implemented by the transfer method is formed on the surface of the sheet layer;

is characterized by

In this case, by impregnating the sheet in the resin, the perfect waterproof/moisture-proof function is realized and the strength is also significantly increased.

The device cover of the present invention is composed of a reinforced plastic member including an absorbent fiber or paper sheet layer and a plastic layer not impregnated with resin, and at the same time includes a moisture-proof belt formed by absorption and curing of liquid resin at the edge of the sheet layer is composed by Therefore, the end side of the sheet layer is further strengthened and the end side is cleaned after the end processing, and thereby, there is an effect that waterproof and moisture-proof is implemented as a whole.

Another device cover of the present invention is composed of an absorbent fiber or paper sheet layer formed on the surface and a layer of absorbent fiber or paper sheet hardened after being impregnated with resin as a whole, and by impregnating in resin, a perfect moisture-proof function is realized and strength is significantly increased. , it is possible to manufacture a thin-film cover by implementing the decoration layer in a transfer method without including a substrate such as a film.

As a result, it is possible to provide a device cover that can express the texture and design of the sheet layer naturally in appearance, but does not need to worry about the structural stability of the cover product, waterproof, moisture-proof, and thin film properties.

1 is a configuration cross-sectional view of an IT device cover according to the prior art.
2 is a configuration cross-sectional view of a device cover according to an embodiment of the present invention.
Fig. 3 is a plan view of Figs. 2 and 4;
4 is a cross-sectional view of a device cover according to another embodiment of FIG.
5 is a configuration cross-sectional view of another device cover according to an embodiment of the present invention.
6 is a configuration cross-sectional view showing a more specific embodiment of FIG.
7 is a 3D cross-sectional view of the device cover according to the present invention.
8 is a configuration cross-sectional view of another device cover according to an embodiment of the present invention.
9 is a configuration cross-sectional view showing a more specific embodiment of FIG.
10 is a configuration cross-sectional view of another device cover according to an embodiment of the present invention.

The features and effects of the 'device cover using a fiber sheet having a moisture-proof function' (hereinafter, 'device cover') of the present invention that have not been described or described above are described in detail below with reference to the accompanying drawings. It will be more obvious. 2 or less, reference numeral 10 denotes a device cover according to the present invention.

Referring to FIG. 2 , the device cover 10 of the present invention includes an absorbent sheet layer 11 such as fiber or paper that is not impregnated with resin, and a plastic layer 12 formed on one side thereof. and may be an IT device cover comprising the sheet layer 11 not impregnated with resin and the plastic layer 12 formed on both sides as shown in FIG. 4, and FIG. 3 is shown in FIGS. 2 and 4 This is a plan view of the cover. In general, a plastic panel manufactured including such a fabric has a strong impact resistance, and at the same time it is possible to express the texture or design of the sheet fabric in appearance. Reference numeral 15 in the drawing denotes a coating layer for waterproofing the surface of the sheet layer 11 .
In the present invention, 'absorbent' refers to a property of absorbing water or moisture in a dictionary sense, and for example, 'absorbent fiber' means a fiber material or fabric fabric having such a property according to social norms.

Here, the manufactured panel may be formed in a predetermined size and shape through end processing. However, as explained above, at the end side 4 of the sheet layer 11 exposed to the outside in this case:

problems with loose fibers or other damage; and

The problem of moisture and moisture permeating into the sheet layer 11;

etc.

For example, the surface treatment of the fabric by the plastic layer 12 or the waterproof coating layer 15 may be possible, but the above problems occurring on the end side 4 thereof are the plastic layer 12 or the coating layer 15 ) is a separate issue that cannot be resolved by The present invention provides a countermeasure against this.

The device cover 10 of the present invention has a structure including the sheet layer 11 not impregnated with resin and a plastic layer 12 formed on one or both sides of the sheet layer 11 exposed to the outside of the structure. By absorbing and curing the liquid resin along the edge portion, the cured moisture-proof belt 13 is formed on the edge portion of the sheet layer 11 . For example, the outer peripheral surface cut-processing of the sheet layer 11 or the device cover 10 may be performed on the moisture-proof belt 13 .

Accordingly, the end side surface 4 of the sheet layer 11 is filled with voids by the cured resin and the material density is increased, so that the fibers from the side surface 4 escape or damage occurs. In particular, it is possible to prevent external moisture or moisture from penetrating into the sheet layer 11 .

On the other hand, the moisture-proof belt 13 part of the sheet layer 11 may be discolored due to the absorption and curing of the resin, and thus a difference in color compared to other parts may occur. For this purpose, the sheet layer 11 or the plastic layer 12 or the waterproof coating layer 15 may be color-treated in a predetermined manner.

Specifically:

- Coloring the entire sheet layer 11 so that the liquid resin does not discolor compared to before, even when the liquid resin is absorbed and cured;

- Coloring only a certain area including the absorbent portion so that the liquid resin does not discolor compared to the previous one even if it is absorbed and cured;

- Color treatment on the plastic layer 12 or the waterproof coating layer 15 to cover the discolored part due to absorption and curing of the liquid resin;

- As an example, processing the discolored part by darkening and other gradation methods to blur the periphery;

etc. are examples of this.

2 and 6, in the device cover 10, the plastic layer 12 may be formed by plastic injection 18, plastic film 17, FRP 16, or a combination of selected materials. can

Injection(18)

The sheet layer 11 material is put into a mold, a high-temperature and high-pressure plastic resin is injected thereon, and then cooled to obtain a device cover 10 constructed by using the injection 18 as the plastic layer 12 . . At this time, for a firm adhesion between the two layers 11 and 12, a conventional primer treatment may be performed on the material of the sheet layer 11 in advance.

As a material of the plastic injection 18, PC (polycarbonate), PET (polyethylene terephthalate), PMMA {poly(methyl methacrylate)}, ABS (acrylonitrile butadiene styrene), epoxy, etc. may be applied without limitation. On the other hand, for example, by reducing the size of the material of the sheet layer 11, the resin for the injection 18 may finish the end side 4 of the sheet layer 11. In this case, the moisture-proof belt 13 may not be configured. This is shown in FIG. 5 .

Meanwhile, another plastic material may be interposed between the sheet layer 11 and the plastic injection molding 18 , such as the plastic film 17 or the FRP 16 , for example.

Referring to FIG. 6 , specifically, after laminating the FRP 16 or plastic film 17 on the sheet layer 11 , the injection 18 is performed on the FRP 16 or plastic film 17 . can However, in other combinations, for example, after laminating the FRP 16 and the plastic film 17 on the sheet layer 11, the injection 18 on the surface of the FRP 16 or plastic film 17 disposed on the outermost side. may proceed.

Therefore, the material combination can be selectively performed according to the required characteristics, and for example, when the plastic film 17 is used, there is an advantage that decoration work such as logo printing or translucent printing can be relatively easily added on the film 17. .

Plastic Film(17)

By laminating the sheet layer 11 and the plastic film 17 , the device cover 10 composed of the sheet layer 11 and the plastic layer 12 can be obtained. That is, the plastic film 17 is used as the plastic layer 12 . Two or more of the plastic film 17 may be laminated as needed, and decorations may be formed on the film 17 .

The plastic film 17 is generally a polycarbonate (PC), polyethylene terephthalate (PET), or poly(methyl methacrylate) (PMMA) film.

FRP(16)

By laminating the material of the sheet layer 11 to the surface of the FRP 16 , the device cover 10 composed of the sheet layer 11 and the plastic layer 12 can be obtained. That is, the FRP 16 is used as the plastic layer 12 .

The device cover 10 obtained by using the plastic film 17 and the FRP 16 as the plastic layer 12 in the above can be processed into a required shape through a 3D process. Here, 3D processing is a method of forming a part into a three-dimensional shape through a thermal forming process using a mold. In general, as shown in FIG. 7, in the back cover for IT devices, the edge part is mainly rounded (R). It is processed into a shape, but it may be in other shapes.

The 3D processing method may be slightly different depending on the composition or state of the material. In particular, when the plastic layer 12 is FRP 16 or includes FRP 16, FRP 16 is in a semi-hardened state. It is better to put it into a mold and make it molded. This is because, in the fully cured state, the hardness is high, which makes molding difficult, and the restoring force is strong, so defects are easy to occur.

On the other hand, in the process, the moisture-proof belt 13 may be processed before, after, or after 3D molding of the plastic layer 12 . That is, it is possible at any time as long as the sheet layer 11 is exposed to the outside. In addition, if necessary, an appropriate end processing may be performed.

As described above, the IT device cover 10 of the present invention is composed of a reinforcing member including a sheet layer 11 and a plastic layer 12 such as fibers, and includes a moisture-proof belt 13 made of liquid resin. It is configured to have a waterproof and moisture-proof function on the side of the end. Accordingly, the device cover 10 has an advantage in that it can maintain its original shape, design, and shape for a long time without being affected by the external environment.

On the other hand, referring to FIG. 8 , another device cover 10 of the present invention has a structure in which the entire fiber or paper sheet layer 11 is completely impregnated with resin and then cured to increase the waterproof/moisture-proof effect and strength. A decoration layer 21 is formed on the outer surface of the layer 11 . In general, epoxy, polyester, or vinyl ester resin is used as the sheet impregnating resin, and the hardened sheet layer 11 after impregnation can significantly increase the strength even though it is thin. In the present invention, the decoration layer 21 of the cover uses a transfer method to implement it with a minimum thickness without including a substrate such as a film.

That is, the decoration layer 21 is formed with the minimum thickness possible through the transfer method, and the strength of the cover 10 has a structure that is reinforced by the impregnated sheet layer 11 having a waterproof property. In general, the outermost shell of the cover 10 is implemented with a high hardness coating layer 22 to protect the cover from various external impacts.

In the manufacturing process of final molding of the device cover 10, the curing process of the high-hardness coating layer, or the high-temperature use environment, the texture of the sheet layer 11 may be exposed on the high-hardness coating layer 22. In order to compensate for this, the high-hardness coating layer (22) can be implemented by adding a matte pattern instead of a glossy mirror surface. A simple sanding pattern may be generally used as the matte pattern, but a pattern having a complex structure may also be used. Although the high hardness coating layer 22 may be implemented by a separate process such as flow or spray, it is more ideal if it is transferred together with the decoration layer 21 in the transfer process.

When the device cover 10 is implemented in a 3D form, the semi-hardened sheet layer 11 is inserted into the heat forming mold after impregnation with resin, and the transfer film on which the decoration layer 21 is formed is placed and high temperature · Apply high pressure to mold the cover (10). The device cover 10 obtained after the molding may implement a final shape through end processing if necessary. On the other hand, the final decoration of the device cover 10 may be all implemented in the transferred decoration layer 21, but the decoration layer 21 is implemented as a transparent or semi-transparent layer such as UV pattern or offset printing and impregnated underneath The unique texture or color of the sheet layer 11 may be exposed to the outside. At this time, since the resin layer used for impregnation may be exposed to external UV to cause yellowing, a UV attenuation layer 27 is formed on the sheet layer 11 to prevent yellowing.

In FIG. 9, the decoration layer 21 under the high hardness coating layer 22 implemented in a pattern is a translucent printed layer 23, a UV pattern layer 24, a metal deposition layer 25, and a shielding printed layer 26 from above. is formed, and a sheet layer 11 impregnated with a resin is laminated thereunder and is molded into a 3D shape.

10 is a structure applied to the structure of FIG. 8, a transparent fiber sheet layer 11 completely impregnated with resin, a high hardness coating layer 22 and a UV attenuation layer 27 implemented as a pattern thereon, and a decoration film below. (28) and a second fibrous sheet layer (29). Here, glass fiber was used as the transparent fiber sheet layer 11, and it was impregnated with epoxy to make it waterproof and moisture-proof, and it was used to increase the strength of the device cover 10 as a thin film.

In order to prevent bending of the cover 10 due to a difference in thermal expansion coefficient between the sheet layer 11 and the decoration film 28, the second fiber sheet layer 29 having the same physical properties as the sheet layer 11 is bent-balance. It was used symmetrically with the decoration film 28 interposed therebetween. The decoration film 28 may be replaced with a decoration film or other sheet available for decoration. For example, it may be replaced with a colorful fiber sheet. The high hardness coating layer 22 and the UV attenuation layer 27 may be formed separately, or may be formed as a single layer of the high hardness coating layer 22 having a UV attenuation function.

4. End side
10. Instrument cover
11. sheet layer
12. Plastic layer
13. Moisture-Proof Belt
15. Waterproof coating layer
16. FRP
17. Plastic Film
18. Injection
21. Decoration Layer
22. High hardness coating layer
23. Translucent Printed Layer
24. UV pattern layer
25. Metal Deposited Layer
26. Charpe Printed Layer
27. UV Attenuation Layer
28. Decoration Film
29. Second fibrous sheet layer
'R'. round

Claims (24)

In the panel-type device cover (10) comprising an absorbent fiber or paper sheet layer (11) and a plastic layer (12) formed on at least one side of the sheet layer (11),
by absorbing and curing the liquid resin along the edge of the sheet layer 11 exposed to the outside of the device cover 10;
forming a moisture-proof belt 13 on the edge of the sheet layer 11;
Device cover having a moisture-proof function, characterized in that.
According to claim 1,
A device cover having a moisture-proof function, characterized in that the end processing is performed on the moisture-proof belt (13) side of the sheet layer (11).
According to claim 1,
A device cover having a moisture-proof function, characterized in that a waterproof coating layer (15) is formed on the surface of the sheet layer (11).
4. The method of claim 3,
In order to prevent the color difference between the moisture-proof belt 13 part and other parts of the sheet layer 11 from being expressed to the outside, the sheet layer 11 or the plastic layer 12 or the coating layer 15 Device cover having a moisture-proof function, characterized in that the color processing.
5. The method of claim 4,
Device cover having a moisture-proof function, characterized in that the entire sheet layer (11) is color-treated to prevent discoloration compared to before, even when the liquid resin is absorbed and cured.
5. The method of claim 4,
Device cover having a moisture-proof function, characterized in that only a certain portion including the absorbed portion of the sheet layer (11) is color-treated to prevent discoloration compared to before even when the liquid resin is absorbed and cured.
5. The method of claim 4,
Device cover having a moisture-proof function, characterized in that the plastic layer (12) or the coating layer (15) is color-treated to cover the discolored part due to absorption and curing of the liquid resin.
8. The method of claim 6 or 7,
The color processing is a device cover having a moisture-proof function, characterized in that the discolored part is darkened and the other peripheral parts are processed in a gradation method.
According to claim 1,
The plastic layer (12) is a device cover having a moisture-proof function, characterized in that formed by plastic injection (18), plastic film (17), FRP (16), or a combination of a material selected among them.
10. The method of claim 9,
The plastic injection (18) proceeds directly to the sheet layer (11); a plastic film 17 or FRP 16 is laminated on the sheet layer 11 and on the plastic film 17 or FRP 16; Alternatively, the FRP (16) and the plastic film (17) are laminated on the sheet layer (11) and the device cover having a moisture-proof function, characterized in that it proceeds on the outer surface.
11. The method of claim 9 or 10,
Device cover having a moisture-proof function, characterized in that a predetermined decoration is formed on the plastic film (17).
10. The method of claim 9,
When the plastic layer 12 is formed by combining the plastic film 17, the FRP 16, or a material selected among them, the device cover 10 is a 3D-shaped cover formed by a heat-forming method using a mold. In this case, when the plastic layer 12 is the FRP 16 or includes the FRP 16, the FRP 16 is put into the mold in a semi-hardened state. .
In the panel-type device cover (10) comprising an absorbent fiber or paper sheet layer (11) and a plastic layer (12) formed on at least one side of the sheet layer (11),
When the plastic layer 12 is the plastic injection 18 or includes the injection 18, the cross-sectional size of the sheet layer 11 is processed to be smaller than that of the cover 10, and the resin for injection is processed into the sheet layer 11. configured to finish the end side (4) of the;
Device cover having a moisture-proof function, characterized in that.
In the panel-type device cover (10) comprising an absorbent fiber or paper sheet layer (11),
impregnating the absorbent fiber or paper sheet layer 11 in a resin and curing it;
Forming a decoration layer 21 implemented in a transfer manner without including a film on the outer surface of the sheet layer 11;
Device cover having a moisture-proof function, characterized in that.
15. The method of claim 14,
The impregnation resin is a device cover having a moisture-proof function, characterized in that the epoxy, polyester, or vinyl ester resin.
15. The method of claim 14,
When the decoration layer 21 is implemented as a transparent layer or a translucent layer, the device cover having a moisture-proof function, characterized in that it includes a UV attenuation layer 27 on the sheet layer 11.
15. The method of claim 14,
Device cover having a moisture-proof function, characterized in that forming a high hardness coating layer (22) on the decoration layer (21).
18. The method of claim 17,
Device cover having a moisture-proof function, characterized in that the high hardness coating layer 22 is transferred like the decoration layer 21, or formed through a spray process or a flow process.
18. The method of claim 17,
Device cover having a moisture-proof function, characterized in that the high hardness coating layer 22 is implemented as a pattern layer instead of a glossy mirror surface.
15. The method of claim 14,
When the cover 10 is implemented in 3D form, the semi-hardened sheet layer 11 is inserted into the heat forming mold after impregnation with resin, and the transfer film on which the decoration layer 21 is formed is placed, high temperature and high pressure Device cover having a moisture-proof function, characterized in that the cover (10) is molded by applying.
15. The method of claim 14,
The device cover includes: a decoration layer 21 consisting of a high hardness coating layer 22 from the outside and a translucent printed layer 23, a UV pattern layer 24, a metal deposition layer 25, and a shielding printing layer 26 underneath. , A device cover having a moisture-proof function, characterized in that the sheet layer 11 impregnated with a resin is laminated thereunder.
In the panel-type device cover (10) comprising a transparent absorbent fiber sheet layer (11) impregnated with a resin,
A high hardness coating layer 22 having a UV attenuation function from the outside, the fiber sheet layer 11, a decoration film 28, and a second fiber sheet layer 29 impregnated with a resin. device cover.
In the panel-type device cover (10) comprising a transparent absorbent fiber sheet layer (11) impregnated with a resin,
Moisture-proof function, characterized in that it consists of a high hardness coating layer 22, a UV attenuation layer 27, the fiber sheet layer 11, a decoration film 28, and a second fiber sheet layer 29 impregnated with a resin from the outside device cover with
24. The method of claim 22 or 23,
Device cover having a moisture-proof function, characterized in that the decoration film (28) is replaced with a decoration film or sheet for decoration.

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