KR102337239B1 - Double sided adhesive tape and electronic component including the same - Google Patents

Abstract

Disclosed are a double-sided adhesive tape and an electronic component including the same. The double-sided adhesive tape is a polyphenylene sulfide (PPS) base; A pressure-sensitive adhesive layer located on at least one side of the substrate: and a release layer located on one side of the pressure-sensitive adhesive layer on the opposite side of the substrate, wherein the substrate and the pressure-sensitive adhesive layer are heated at 10° C./min in a temperature range of 30 to 150° C. to have a weight loss ratio of less than 0.5% by weight compared to the initial weight when heated.

Description

Double sided adhesive tape and electronic component including the same

It relates to a double-sided adhesive tape and an electronic component including the same.

Recently, as semiconductor chips are highly integrated, their size is gradually decreasing, and market demand for thinner die packages is increasing. In line with this trend, electronic component manufacturers manufacture electronic components by thinning a silicon die or mounting it in a package substrate.

For example, the operation of mounting a silicon die in a substrate is a process of mounting and molding a die formed from a silicon wafer in a space where the die can be mounted using a package substrate made of a printed circuit board (PCB). is manufactured This may bring about an effect of improving productivity compared to the manufacturing process of molding based on the thinned wafer.

In this case, a double-sided adhesive tape is used. For improving the handling workability of the package substrate and protecting the package during the manufacturing process, it is possible to suppress the adhesion and bubble generation between the core substrate and the package substrate, and to physically separate it in the debonding process. There is a demand for a double-sided adhesive tape having physical properties capable of preventing a pressure-sensitive adhesive residue from being generated between two substrates, and an electronic component including the same.

One side has sufficient adhesion between the core substrate and the package substrate, the generation of bubbles generated during the manufacturing process is suppressed, and physical separation is possible in the debonding process of separating the package substrate from the package substrate, and the adhesive residue is generated between the two substrates. A double-sided adhesive tape capable of preventing development is provided.

Another aspect provides an electronic component including the double-sided adhesive tape.

According to one aspect,

polyphenylene sulfide (PPS) based;

An adhesive layer located on at least one surface of the substrate: and

Including; a release layer located on one side of the adhesive layer opposite to the substrate;

The base material and the adhesive layer have a weight loss ratio of less than 0.5% by weight compared to the initial weight when heated to 10 ℃ / min in a temperature range of 30 ~ 150 ℃, a double-sided adhesive tape is provided.

The melting point (Tm) of the substrate may be 280 °C or higher.

The water absorption according to the following formula 1 of the substrate may be 0.1% or less:

<Equation 1>

Absorption rate (%) = [{(weight of substrate after absorption for 24 hours at 30°C/55% RH) - (weight of substrate after drying and pretreatment at 110°C for 1 hour)}/(110°C, dried for 1 hour Weight of substrate after pretreatment) x 100]

The thickness of the substrate may be 5 to 100 μm.

The adhesive layer is a silicone network resin including structural units represented by the following Chemical Formulas 1 and 2, a silicone polymer including a polymer represented by the following Chemical Formula 3, and a polyetherimide-siloxane copolymer resin. It is a cargo layer, and the content of the polyetherimide-siloxane copolymer resin may be 5 to 25 parts by weight based on 100 parts by weight of the silicone polymer:

delete

<Formula 1>

In Formula 1,

R may be a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof.

<Formula 2>

The silicone polymer may include a polymer represented by the following Chemical Formula 3:

<Formula 3>

In Formula 3,

R ₁ may be a hydroxy group, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof;

R ₂ may be a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof.

A weight ratio of the silicone network resin to the silicone polymer may be 3:1 to 1:3.

delete

The adhesive strength of the adhesive layer may be 100 gf/inch to 500 gf/inch.

The thickness of the adhesive layer may be 5 to 50 μm.

According to the other aspect,

An electronic component including the above-described double-sided adhesive tape is provided.

The electronic component may include a Fan Out Wafer level package (FO-WLP) or a Fan Out Panel level package (FO-PLP).

The double-sided adhesive tape according to one aspect satisfies the adhesive force required during temporary bonding between substrates for an electronic component package using a core substrate attached to one surface and a package substrate attached to the other surface, and during the electronic component manufacturing process. It may have an effect of inhibiting the generation of generated bubbles. In addition, the double-sided adhesive tape can be physically separated in a debonding process for separating it from the package substrate, and after the double-sided adhesive tape is removed, a phenomenon in which an adhesive residue is generated between the two substrates can be improved.

1 is a schematic cross-sectional view of a double-sided adhesive tape according to an embodiment.

Hereinafter, a double-sided adhesive tape and an electronic component including the same will be described in detail with reference to embodiments and drawings of the present invention. It will be apparent to those of ordinary skill in the art that these examples are merely presented by way of example to explain the present invention in more detail, and that the scope of the present invention is not limited by these examples. .

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.

Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.

In the present specification, the term "included" means that other components may be further included, rather than excluding other components, unless otherwise stated.

As used herein, the term “and/or” is meant to include any and all combinations of one or more of the related listed items. As used herein, the term “or” means “and/or”. In this specification, the expression “at least one type” or “one or more” in front of a component does not mean that it can supplement the entire list of components and can complement individual components of the description.

In this specification, when it is mentioned that one component is disposed "on" another component, one component may be disposed directly on the other component or there may be components interposed between the components. have. On the other hand, when it is stated that one element is disposed "directly on" another element, intervening elements may not be present.

In general, a double-sided adhesive tape used by being attached between a core substrate and a package substrate in an electronic component manufacturing process may generate adhesive residue due to insufficient heat resistance of the adhesive layer. Also, due to the low melting point of the substrate (film), the substrate film is melted, or due to the high absorption rate of the substrate (film), delamination may occur between the substrate and the double-sided adhesive tape in a high-temperature process.

The inventors of the present invention intend to propose the following double-sided adhesive tape to improve the above problems.

Hereinafter, each substrate and layer constituting the double-sided adhesive tape will be described in detail.

<Reference>

As the substrate of the double-sided adhesive tape according to the exemplary embodiment, a film having excellent heat resistance that can withstand high temperatures during an electronic component manufacturing process may be used. The substrate of the double-sided adhesive tape according to the embodiment may be a polyphenylene sulfide (PPS) substrate. The polyphenylene sulfide (PPS) substrate has excellent heat resistance compared to polyethylene terephthalate, polyimide, polyester, polyamide, polyetherimide, and polyethylene naphthalate substrates.

The melting point (Tm) of the substrate may be 280 °C or higher. The substrate may be free from physical-chemical changes for several hours within a high temperature range due to sufficient heat resistance. If the melting point (Tm) is less than 280 ℃, the substrate is melted in the electronic component manufacturing process or crystallized at room temperature after the high-temperature process to cause the substrate to break, so it cannot be used.

The water absorption according to the following formula (1) of the substrate may be 0.1% or less:

<Equation 1>

Absorption rate (%) = [{(weight of substrate after absorption for 24 hours at 30°C/55% RH) - (weight of substrate after drying and pretreatment at 110°C for 1 hour)}/(110°C, dried for 1 hour Weight of substrate after pretreatment) x 100]

When the absorption rate of the substrate is 1% or more, moisture contained in the film substrate of the double-sided adhesive tape attached between the core substrate and the package substrate in the high-temperature process may be evaporated to generate bubbles.

The thickness of the substrate may be 5 μm to 100 μm. For example, the thickness of the substrate may be 5 to 50㎛. If the substrate has a thickness within the above range, wrinkles caused by external force may be suppressed, adequate heat resistance may be maintained, and handling may be easy.

<Adhesive layer>

The adhesive layer may include a pressure sensitive adhesive. For example, the pressure-sensitive adhesive layer may include a silicone-based pressure-sensitive adhesive.

The adhesive layer is a silicone network resin including structural units represented by the following Chemical Formulas 1 and 2, a silicone polymer including a polymer represented by the following Chemical Formula 3, and a polyetherimide-siloxane copolymer resin. It may be a cargo layer. For example, the adhesive layer includes a silicone network resin including structural units represented by the following Chemical Formulas 1 and 2, a silicone polymer including a polymer represented by the following Chemical Formula 3, and a polyetherimide-siloxane copolymer resin. It may be a thermosetting layer of a composition comprising:

delete

<Formula 1>

In Formula 1,

R may be a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof.

<Formula 2>

The silicone polymer may include a polymer represented by the following Chemical Formula 3:

<Formula 3>

In Formula 3,

R ₁ may be a hydroxy group, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof;

R ₂ may be a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof.

A weight ratio of the silicone network resin to the silicone polymer may be 3:1 to 1:3.

When the weight ratio of the silicone network resin to the silicone polymer is greater than 1:3 and the weight of the silicone polymer is large, the crosslinking density is lowered, so that after debonding, an adhesive layer residue may be generated. In addition, when the weight ratio of the silicone network resin to the silicone polymer is less than 3:1 and the weight of the silicone polymer is small, surface wettability between the substrate and the adhesive layer may not be obtained, so that the double-sided adhesive tape may not be properly attached.

The content of the polyetherimide-siloxane copolymer resin may be 5 to 25 parts by weight based on 100 parts by weight of the silicone polymer. For example, the content of the polyetherimide-siloxane copolymer resin may be 5 to 24 parts by weight based on 100 parts by weight of the silicone polymer.

When the content of the polyetherimide-siloxane copolymer resin is less than 5 parts by weight, the heat resistance of the adhesive layer may be lowered, so that residues of the adhesive layer may occur at room temperature after the high-temperature process. When the content of the polyetherimide-siloxane copolymer resin is 25 parts by weight or more, crosslinking with the silicone network resin may not be sufficient, so that the appearance of the adhesive layer may be non-uniform or a residual phenomenon of the adhesive layer may occur.

The adhesive layer may further include a silicone crosslinking agent and a curing catalyst.

The silicone crosslinking agent may be a polyorganosiloxane containing SiH groups.

The amount of the silicone crosslinking agent may be 0.1 to 5.0 parts by weight based on 100 parts by weight of the total silicone network resin and the silicone polymer. When the silicone crosslinking agent is within the above content range, the crosslinking reaction does not proceed rapidly while sufficiently occurring, so that the durability of the adhesive layer is maintained high, so that adhesive residue may not occur.

The curing catalyst may be a platinum (Pt) catalyst.

The content of the curing catalyst may be 0.1 to 5.0 parts by weight based on 100 parts by weight of the total silicone network resin and the silicone polymer. If the curing catalyst is within the above content range, adhesive residue at a high temperature does not occur due to non-curing, and adhesive strength may not decrease due to excessive curing.

The adhesive strength of the adhesive layer may be 100 gf/inch to 500 gf/inch.

When the adhesive strength of the adhesive layer is less than 100 gf/inch, the adhesive strength with the substrate is insufficient, so that the double-sided adhesive tape may fall off during the process, and when the adhesive strength exceeds 500 gf/inch, the substrate in the debonding process A phenomenon in which the adhesive tape and the adhesive tape cannot be separated may occur.

The thickness of the adhesive layer may be 5 to 50 μm.

<Release film>

The double-sided adhesive tape may further include a release film on the adhesive layer. The release film may be detachably attached to the adhesive layer and serve to protect them.

The release film may include a polyester film, and a release layer selected from a silicone-based release layer disposed on at least one surface of the polyester film, a fluorine-based release layer, a non-silicone-based release layer, or a combination thereof.

The thickness of the release film may be, for example, 5 μm to 100 μm. If the thickness of the release film is 100 μm or more, it may be difficult to use because handling is not easy.

1 is a schematic cross-sectional view of a double-sided adhesive tape according to an embodiment.

Referring to FIG. 1 , the double-sided adhesive tape 10 according to an embodiment includes a first release film 11 , a first adhesive layer 12 , a substrate (film) 13 , a second adhesive layer 14 and The second release film 15 may have a structure in which they are sequentially disposed.

<Electronic parts>

The electronic component according to another exemplary embodiment may include the above-described double-sided adhesive tape.

The electronic component may include a Fan Out Wafer level package (FO-WLP) or a Fan Out Panel level package (FO-PLP).

Hereinafter, the configuration of the present invention and its effects will be described in more detail through Examples and Comparative Examples. However, it will be apparent that these examples are for illustrating the present invention in more detail, and that the scope of the present invention is not limited to these examples.

[Example]

Example 1: Double-sided adhesive tape

75 g of silicone resin (Dow Corning, SD4560), 25 g of silicone polymer (Dow Corning, DC7656), and 6 g of polyetherimide-siloxane copolymer resin (Sabic, SILTEM) were dissolved in 50 g of toluene, and a crosslinking agent (Dow Corning, SO7689) 0.8 g and 0.5 g of a platinum catalyst (Dow Corning, NC25) were added and stirred for 1 hour to obtain a composition for forming an adhesive layer.

The composition for forming an adhesive layer was applied to a thickness of about 30 μm on the upper surface of a polyphenylene sulfide (PPS) base film, and then dried in a dryer at 150° C. for about 3 minutes to form a first adhesive layer. A fluorine-based release film (Toray Advanced Materials, thickness: 50 μm) was laminated on the first additive to prepare an adhesive tape.

Then, the composition for forming an adhesive layer was applied to a thickness of about 30 μm on the lower surface of a polyphenylene sulfide (PPS) base film, and dried in a dryer at 150° C. for about 3 minutes to form a second adhesive layer. A double-sided adhesive tape was prepared by laminating a fluorine-based release film (Toray Advanced Materials, thickness: 50 μm) on the second adhesive.

Example 2: Double-sided adhesive tape

75 g silicone resin (Dow Corning, SD4560), 25 g silicone polymer (Dow Corning, DC7656), and 50 g silicone resin (Dow Corning, SD4560) instead of 6 g polyetherimide-siloxane copolymer resin (Sabic, SILTEM), silicone polymer (Dow Corning, DC7656) and 10 g of polyetherimide-siloxane copolymer resin (Sabic, SILTEM) were dissolved in 50 g of toluene to prepare a double-sided adhesive tape in the same manner as in Example 1.

Comparative Example 1: Double-sided adhesive tape

75 g silicone resin (Dow Corning, SD4560), 25 g silicone polymer (Dow Corning, DC7656), and 80 g silicone resin (Dow Corning, SD4560) instead of 6 g polyetherimide-siloxane copolymer resin (Sabic, SILTEM), silicone polymer (Dow Corning, DC7656) 20 g, and polyetherimide-siloxane copolymer resin 1 g (Sabic, SILTEM) was used to obtain a composition for forming an adhesive layer, and a polyethylene naphthalate base film was used instead of a polyphenylene sulfide (PPS) base film. Except that, a double-sided adhesive tape was prepared in the same manner as in Example 1.

Comparative Example 2: Double-sided adhesive tape

A composition for forming an adhesive layer was obtained without adding 6 g of polyetherimide-siloxane copolymer resin (Sabic, SILTEM), and a polyethylene terephthalate base film was used instead of a polyphenylene sulfide (PPS) base film. A double-sided adhesive tape was prepared in the same manner as in Example 1.

Comparative Example 3: Double-sided adhesive tape

75 g silicone resin (Dow Corning, SD4560), 25 g silicone polymer (Dow Corning, DC7656), and 50 g silicone resin (Dow Corning, SD4560) instead of 6 g polyetherimide-siloxane copolymer resin (Sabic, SILTEM), silicone polymer (Dow Corning, DC7656) 50 g, and polyetherimide-siloxane copolymer resin 22 g (Sabic, SILTEM) was used to obtain a composition for forming an adhesive layer, and a polyimide base film was used instead of a polyphenylene sulfide (PPS) base film. Except that, a double-sided adhesive tape was prepared in the same manner as in Example 1.

Comparative Example 4: Double-sided adhesive tape

75 g silicone resin (Dow Corning, SD4560), 25 g silicone polymer (Dow Corning, DC7656), and 6 g polyetherimide-siloxane copolymer resin (Sabic, SILTEM) instead of silicone resin (Dow Corning, SD4560) 10 g, silicone polymer (Dow Corning, DC7656), and polyetherimide-siloxane copolymer resin 6g (Sabic, SILTEM) to obtain a composition for forming an adhesive layer using the same method as in Example 1 to prepare a double-sided adhesive tape. .

Evaluation Example 1: Evaluation of the physical properties of the substrate (film)

The physical properties of the substrates (films) used in Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated as follows. The results are shown in Table 1 below.

(1) Measurement of water absorption of the substrate (film)

Only the substrate (film) from each of the double-sided adhesive tapes was prepared as a measurement sample. The measurement samples were sampled in a film size of 100 x 100 mm, dried in an oven at 110 ° C. for 1 hour, pre-treated, and weighed, and the weight was measured after absorption for 24 hours under 30 ° C/55% RH constant temperature and humidity conditions. The rate of change of the weight of the base material (film) before and after was measured according to Equation 1 below.

<Equation 1>

Absorption rate (%) = [{(weight of substrate after absorption for 24 hours at 30°C/55% RH) - (weight of substrate after drying and pretreatment at 110°C for 1 hour)}/(110°C, dried for 1 hour Weight of substrate after pretreatment) x 100]

(2) Measurement of the melting point (Tm, ℃) of the substrate (film)

Only the substrate (film) from each of the double-sided adhesive tapes was prepared as a measurement sample. The measurement samples were collected using a Differential Scanning Calorimeter (DSC, Q200, TA Instruments, USA) in a single cantilever mode, a temperature range of 30 to 350 ° C, a temperature increase rate of 10.0 ° C./min. The melting point (Tm, ℃) was measured as a peak value of the furnace heat flow. At this time, the weight of the measured sample was 5 mg or more.

Evaluation Example 2: Evaluation of physical properties of double-sided adhesive tape

The physical properties of each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated as follows. The results are shown in Table 1 below.

(1) Adhesion (gf/inch)

Samples were obtained by cutting each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4 to a width of 1 inch X a length of 15 cm. After removing the release film of the sample, the adhesive tape was attached to the package substrate cut to 2 inches in width X 20 cm in length using a 2 kg roll and left at room temperature for more than 30 minutes. Then, the sample was measured for adhesion when the adhesive tape was separated from the package substrate at a rate of 300 mm/min and a peeling angle of 90 degrees using AR-1000 (Cheminstrument).

(2) Weight loss rate (%)

After removing the release film of each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4, 10 mg of a sample of the adhesive layer applied on both sides of the substrate (film) was taken through TGA (thermogravimetric analyzer), The weight loss rate (%) was evaluated by analyzing the weight after thermal analysis compared to the initial weight by analyzing the temperature range of 30 ~ 150 ℃, the temperature increase rate of 10.0 ℃ / min.

(3) Check adhesive residue after debonding

After attaching the upper surface of each double-sided adhesive tape prepared in Examples 1 to 2 and Comparative Examples 1 to 4 to the core substrate, the lower surface was attached to CCL (copper clad laminate) instead of the package substrate in an oven at 230 ° C. After heat treatment for 30 minutes, it was taken out and left at room temperature for 30 minutes, and the CCL and the core substrate were removed. At this time, when the first and second adhesive layers were not separated cleanly and were torn off while leaving a dot or planar adhesive on the surface of the core substrate or CCL, it was determined that there was a residue. In addition, even when the first and second pressure-sensitive adhesive layers are not separated cleanly and are torn off while leaving a portion of the adhesive on the surface of the core substrate or the CCL surface along with the pressure-sensitive adhesive, it was determined that there is an adhesive residue.

(4) Check the debonding process

The upper surface of each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4 was attached to the core substrate, and the lower surface was attached to the package substrate to pass the manufacturing process. Thereafter, a space was made between the core substrate and the package substrate using a knife, and air was blown into the space to visually check whether the adhesive tape between the core substrate or the package substrate could be separated.

(5) Whether the substrate (film) is damaged

After attaching the upper surface of each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4 to the core substrate, the lower surface was heat-treated in an oven at 230 ° C. for 60 minutes while attached to the CCL instead of the package substrate. , it was taken out and left at room temperature for 30 minutes to remove CCL. At this time, if the base material (film) of the double-sided adhesive tape was torn or melted, it was judged that it was damaged.

(6) Check for delamination

After attaching the upper surface of each of the double-sided adhesive tapes prepared in Examples 1 to 2 and Comparative Examples 1 to 4 to the core substrate, the lower surface was attached to the CCL instead of the package substrate and heat-treated in an oven at 230 ° C. for 30 minutes. , it was taken out and CCL was removed at room temperature. Thereafter, it was checked whether delamination occurred between each of the double-sided adhesive tapes and the core substrate. At this time, when bubbles were generated, it was determined by the number of bubbles generated.

division Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Substrate (film) polyphenylene
sulfide polyphenylene
sulfide polyethylene
naphthalate polyethylene
terephthalate polyimide polyphenylene
sulfide Silicone Reticulated Resin (g) 75 50 80 75 50 10 Silicone Polymer (g) 25 50 20 25 50 90 Polyetherimide-siloxane copolymer resin (g) 6 10 One - 22 6 Crosslinking agent (g) 0.8 0.8 0.8 0.8 0.8 0.8 Platinum catalyst (g) 0.5 0.5 0.5 0.5 0.5 0.5 Substrate (film)
Absorption rate (%) 0.05 0.05 0.5 0.3 1.1 0.05 melting point
(Tm,℃) 280 280 260 250 none 280 adhesiveness
(gf/inch) 430 160 600 520 90 50 weight loss rate
(%) 0.2 0.4 1.0 0.8 1.6 0.5 After debonding,
adhesive residue none none none has exist none has exist debonding process Good Good inseparable Good Good can not be used Substrate (film)
Whether damage none none fracture some recordings none has exist bubble generation
number (EA) none none 10 15 30 30

Referring to Table 1, the double-sided adhesive tapes prepared in Examples 1 and 2 did not cause damage to the substrate (film) because the melting point of the substrate (film) was 280° C. or higher, and thus the heat resistance was excellent. In addition, there was no bubble generation due to the low weight loss ratio of the adhesive layer and the substrate (film) having excellent heat resistance used in the double-sided adhesive tapes prepared in Examples 1 and 2. For this reason, the double-sided adhesive tapes prepared in Examples 1 and 2 were adhered between the core substrate and the package substrate, and were separated well in the final debonding process, and there was no residual phenomenon. In comparison, in the double-sided adhesive tape prepared in Comparative Example 1, the film melted due to the low melting point of the substrate (film), and some bubbles were generated due to the high water absorption of the substrate (film). In addition, the double-sided adhesive tape prepared in Comparative Example 1 could not separate the substrate and the adhesive tape in the debonding process due to high adhesive strength. In the double-sided adhesive tape prepared in Comparative Example 2, the base film partially melted due to the low melting point of the base material (film), and the adhesive layer did not contain polyetherimide-siloxane copolymer resin, so the adhesive residue phenomenon was reduced due to lack of heat resistance. occurred. In the double-sided adhesive tape prepared in Comparative Example 3, a large amount of air bubbles were generated due to the high water absorption and weight loss ratio of the substrate (film) and the low adhesive strength of the adhesive layer. The double-sided adhesive tape prepared in Comparative Example 4 used the same substrate (film) used in Examples 1 and 2, but due to the low adhesive strength expression due to the high content of silicone polymer, the phenomenon of falling off from the substrate to which the double-sided adhesive tape was attached occurred. In addition, in the double-sided adhesive tape prepared in Comparative Example 4, a residue phenomenon in which the adhesive was applied to the substrate and the occurrence of bubbles occurred.

10: double-sided adhesive tape 11: first release film
12: first adhesive layer 13: substrate (film)
14: second adhesive layer 15: second release film

Claims (13)

polyphenylene sulfide (PPS) based;
An adhesive layer located on at least one surface of the substrate: and
Including; a release layer located on one side of the adhesive layer opposite to the substrate;
The substrate and the adhesive layer have a weight loss ratio of less than 0.5% by weight compared to the initial weight when heated at a temperature of 10 °C/min in a temperature range of 30 to 150 °C,
The adhesive layer is a silicone network resin including structural units represented by the following Chemical Formulas 1 and 2, a silicone polymer including a polymer represented by the following Chemical Formula 3, and a polyetherimide-siloxane copolymer resin. cargo floor,
A double-sided adhesive tape, wherein the content of the polyetherimide-siloxane copolymer resin is 5 to 25 parts by weight based on 100 parts by weight of the silicone polymer:
<Formula 1>

In Formula 1,
R is a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof.
<Formula 2>

<Formula 3>

In Formula 3,
R ₁ is a hydroxyl group, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof;
R ₂ is a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof. delete According to claim 1,
A double-sided adhesive tape having an absorption rate of 0.1% or less according to the following formula 1 of the substrate:
<Equation 1>
Absorption rate (%) = [{(weight of substrate after absorption for 24 hours at 30°C/55% RH) - (weight of substrate after drying and pretreatment at 110°C for 1 hour)}/(110°C, dried for 1 hour Weight of substrate after pretreatment) x 100] According to claim 1,
The thickness of the substrate is 5 ~ 100㎛, double-sided adhesive tape. delete delete delete According to claim 1,
The double-sided adhesive tape, wherein the weight ratio of the silicone reticulated resin to the silicone polymer is 3:1 to 1:3. delete According to claim 1,
The adhesive strength of the adhesive layer is 100gf / inch ~ 500gf / inch, double-sided adhesive tape. According to claim 1,
The thickness of the adhesive layer is 5 ~ 50㎛, double-sided adhesive tape. An electronic component comprising the double-sided adhesive tape according to any one of claims 1, 3, 4, 8, 10, and 11. 13. The method of claim 12,
The electronic component includes a Fan Out Wafer level package (FO-WLP) or a Fan Out Panel level package (FO-PLP).

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