KR102334553B1 - Flexible display device - Google Patents

Abstract

In the present embodiments, a flexible substrate including a display area and a non-display area extending from the display area, a display panel located in the display area of one surface of the flexible substrate, and a cover layer made of tape are formed in the non-display area of one surface of the flexible substrate. and wherein at least a portion of the non-display area of the flexible substrate and the cover layer are bent in a bending direction. ,

Description

Flexible display device {FLEXIBLE DISPLAY DEVICE}

The present embodiments relate to a flexible display device that displays an image.

Liquid crystals that require a separate light source such as organic light emitting displays (OLEDs) and plasma display panels (PDPs) that emit light by themselves in display devices used in computer monitors, TVs, and cell phones There is a liquid crystal display (LCD) and the like.

Also, in recent years, a flexible display device that is manufactured to display an image even if it is bent like paper by forming a display panel and wiring on a flexible substrate such as plastic, which is a flexible material, is attracting attention as a next-generation display device.

The range of application of the flexible display device to not only a computer monitor and TV but also a personal portable device is diversifying, and research on a flexible display device having a reduced volume and weight while having a large display area is being conducted.

In such a flexible display device, cracks may occur in the flexible substrate or wiring during bending due to various causes. Cracks occurring in such a flexible substrate or wiring may cause defects in the flexible display device.

An object of the present exemplary embodiments is to prevent cracks from occurring in a flexible substrate or wiring when bending in a flexible display device.

Another object of the present exemplary embodiments is not to cause defects in the flexible display device.

In one embodiment, a flexible substrate including a display area and a non-display area extending from the display area, a display panel positioned in the display area of one surface of the flexible substrate, and a cover layer made of tape are formed in the non-display area of one surface of the flexible substrate. and wherein at least a portion of the non-display area of the flexible substrate and the cover layer are bent in a bending direction. ,

Another embodiment provides a flexible substrate including a display area and a non-display area extending from the display area, a display panel positioned in the display area of the flexible substrate, wiring disposed on the flexible substrate, and a non-display area of one surface of the flexible substrate a cover layer positioned on a wiring positioned in at least a partial region and including at least one layer identical to at least one of the layers constituting the display panel; The layer may provide a flexible display device that is bent in a bent shape in a bending direction.

According to the present exemplary embodiments as described above, it is possible to prevent cracks from occurring in the flexible substrate or wiring during bending in the flexible display device.

According to the present exemplary embodiments, defects in the flexible display device may be prevented or minimized.

1 is a plan view of an unbent state of a flexible display device according to an exemplary embodiment.
2 is a cross-sectional view of a bent state of a flexible display device according to another exemplary embodiment.
3 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member of the flexible display device of FIG. 2 in an unbent state.
4A to 4C are cross-sectional views of modified examples of the flexible display device of FIG. 2 .
FIG. 5 illustrates a process for manufacturing the cover layer of FIG. 2 .
6 is a cross-sectional view of a flexible display device according to another exemplary embodiment.
7 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member of the flexible display device of FIG. 6 in an unbent state.
FIG. 8 illustrates forming a neutral plane between at least a partial area of the non-display area of the flexible substrate of FIG. 6 and the cover layer.
9A to 9C are cross-sectional views of modified examples of the flexible display device of FIG. 6 .
10 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member in an unbent state of the flexible display device according to another exemplary embodiment.
11A, 11B, and 12 are cross-sectional views of modified examples of the flexible display device of FIG. 10 .

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but other components may be interposed between each component. It should be understood that each component may be “interposed” or “connected”, “coupled” or “connected” through another component.

In the present specification, a flexible display device refers to a display device to which flexibility is imparted, and includes a bendable display device, a rollable display device, an unbreakable display device, and a foldable display device. (foldable) may be used in the same meaning as a display device. In the present specification, the flexible organic light emitting diode display is an example of various flexible display devices.

In the present specification, a display device includes a display area and a non-display area. The display area is an area in which an image is displayed, and the non-display area is an area in which no area is displayed, such as a bezel.

1 is a plan view of an unbent state of a flexible display device according to an exemplary embodiment.

Referring to FIG. 1 , the flexible display device 100 includes a flexible substrate 110 , a wiring 120 , and a display panel 130 .

The flexible substrate 110 is a substrate for supporting various elements of the flexible display device 100 and is a substrate to which flexibility is imparted. The flexible substrate 110 may also be referred to as a flexible substrate, a first flexible substrate, or a flexible member. When the flexible substrate 110 is made of plastic, it may also be referred to as a plastic film, a plastic substrate, or a first flexible substrate. . The flexible substrate 110 may be formed in a rectangular parallelepiped shape, but is not limited thereto and may be formed in various shapes.

The flexible substrate 110 may be made of a flexible material, for example, a polyester-based polymer, a silicone-based polymer, an acrylic polymer, a polyolefin-based polymer, and a film including one selected from the group consisting of copolymers thereof. can Specifically, the flexible substrate 110 is polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polysilane (polysilane), polysiloxane (polysiloxane), polysilazane (polysilazane), polycarbosilane (polycarbosilane), Polyacrylate, polymethacrylate, polymethylacrylate, polymethylmethacrylate, polyethylacrylate, polyethylmethacrylate, between Click Olefin Copolymer (COC), Cyclic Olefin Polymer (COP), Polyethylene (PE), Polypropylene (PP), Polyimide (PI), Polymethylmethacrylate (PMMA), Polystyrene (PS), Polyacetal ( POM), polyether ether ketone (PEEK), polyester sulfone (PES), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride (PVDF), purple It may include one selected from the group consisting of fluoroalkyl polymer (PFA), styrene-acrylnitrile copolymer (SAN), and combinations thereof. In some embodiments, when the flexible display device 100 is implemented as a transparent flexible display device, the flexible substrate 110 may be made of a transparent and flexible material.

The flexible substrate 110 includes a display area DA and a non-display area NA. The display area DA of the flexible substrate 110 refers to an area that displays an actual image, and the non-display area NA of the flexible substrate 110 refers to an area where an image is not displayed.

The non-display area NA of the flexible substrate 110 is an area extending from the display area DA of the flexible substrate 110 . The non-display area NA of the flexible substrate 110 extends from one side of the display area DA of the flexible substrate 110 . For example, the display area DA of the flexible substrate 110 is formed in a polygonal shape, and the non-display area NA of the flexible substrate 110 is one side of the display area DA of the flexible substrate 110 . can be extended from 1 illustrates that the non-display area NA of the flexible substrate 110 extends from one side of the display area DA of the flexible substrate 110 for convenience of explanation, but the present invention is not limited thereto, and the flexible substrate is not limited thereto. The non-display area NA of 110 may extend from a plurality of sides of the display area DA of the flexible substrate 110 .

The non-display area NA of the flexible substrate 110 is located in the periphery or edge portion of the display area DA of the flexible substrate 110, and various circuits for displaying an image are disposed, so that the peripheral area, the peripheral circuit area, It may also be referred to as an edge area or a bezel area.

The display panel 130 is disposed in the entire or partial area of the display area DA of the flexible substrate 110 . The display panel 130 is an element for displaying an actual image, and may also be referred to as a display panel or an image display panel. The display panel 130 is not limited as long as it can display an image, but in the present specification, the display panel 130 includes an organic light emitting device that displays an image through an organic light emitting layer and a thin film transistor that drives the organic light emitting device. It may be an organic light emitting display panel.

The thin film transistor may include an active layer, a gate insulating layer, a gate electrode, a gate electrode, an interlayer insulating film formed on the active layer, and a source electrode and a drain electrode electrically connected to the active layer. The organic light emitting device may include a first electrode electrically connected to one of the source electrode and the drain electrode, an organic light emitting layer formed on the first electrode, and a second electrode formed on the organic light emitting layer.

Various elements that do not display an image may be disposed in the non-display area NA of the flexible substrate 110 .

Elements disposed in the non-display area NA of the flexible substrate 110 may include various driving integrated circuits such as a gate driving integrated circuit or a data driving integrated circuit, and a driving circuit unit. Here, various driving integrated circuits and driving circuit units are mounted on the flexible substrate 110 as a GIP (Gate in Panel), or connected to the flexible substrate 110 by a TCP (Tape Carrier Package) or COF (Chip on Film) method. .

The wiring 120 is disposed on the flexible substrate 110 . The wiring 120 includes a driving circuit unit or a gate driving integrated circuit that may be formed in the display panel 130 formed in the display area DA of the flexible substrate 110 and the non-display area NA of the flexible substrate 110; A signal may be transmitted by electrically connecting the data driving integrated circuit.

The wiring 120 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility to minimize cracks from occurring when the flexible substrate 110 is bent. For example, the wiring 120 may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), or aluminum (Al). However, the material of the wiring 120 is not limited thereto, and may be formed of one of various conductive materials used in manufacturing the display panel 130 , and specifically, one of various materials used in manufacturing the display panel 130 . Phosphorus molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg) may also be formed. . In addition, the wiring 120 may be formed in a multi-layer structure including various conductive materials as described above, for example, to be formed in a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti). can, but is not limited thereto.

At least a portion of the non-display area NA of the flexible substrate 110 is formed to be bent in a bending direction.

Here, at least a portion of the non-display area NA of the flexible substrate 110 having a shape bent in the bending direction may be referred to as a bending area. Since the non-display area NA of the flexible substrate 110 is not an area in which an image is displayed, it is not necessary to be viewed from the upper surface of the flexible substrate 110 , and the non-display area NA of the flexible substrate 110 is not displayed. At least a partial area of . 1 illustrates that the entire non-display area NA of the flexible substrate 110 corresponds to the bending area for convenience of explanation, but the present invention is not limited thereto, and some of the non-display area NA of the flexible substrate 110 is not limited thereto. Only the region may correspond to the bending region. In FIG. 1 , for convenience of explanation, the non-display area NA of the flexible substrate 110 is shown to be slightly narrower than the display area DA of the flexible substrate 110 , but the non-display area NA of the flexible substrate 110 is shown. ) may correspond to a considerably narrower area than the display area DA of the flexible substrate 110 .

At least a partial area of the non-display area NA of the flexible substrate 110 is bent in a bending direction. In FIG. 1 , the bending direction is the horizontal direction of the flexible substrate 110 , and the bending area that is at least a partial area of the non-display area NA of the flexible substrate 110 is bent in the horizontal direction of the flexible substrate 110 . do.

Hereinafter, various embodiments of the flexible display device in a bent state will be described with reference to the drawings.

2 is a cross-sectional view of a bent state of a flexible display device according to another exemplary embodiment. 3 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member of the flexible display device of FIG. 2 in an unbent state.

2 and 3 , in the flexible display device 200 according to another exemplary embodiment, at least a partial area of the non-display area NA of the flexible substrate 210 is bent in a bending direction.

The display panel 230 is positioned in the display area DA of one surface 210a of the flexible substrate 210 .

A cover layer 240 is disposed in the non-display area NA of one surface 210a of the flexible substrate 210 to prevent moisture from permeating and cracking. The cover layer 240 is disposed in the bending region described with reference to FIG. 1 .

The driving integrated circuit connecting member 250 is connected to the non-display area NA of the one surface 210a of the flexible substrate 210 . Various driving integrated circuits such as gate driving integrated circuits or data driving integrated circuits and driving circuit units may be mounted on the driving integrated circuit connecting member 250 . The driving integrated circuit connecting member 250 may be at least one of a tape carrier package (TCP) and a chip on film (COF).

The wiring 120 illustrated in FIG. 1 is disposed on the flexible substrate 210 , but is not illustrated for the sake of simplicity of description.

The cover layer 240 is positioned between the display panel 230 and the driving integrated circuit connecting member 250 and covers the part 230a of the display panel 230 and the part 250a of the driving integrated circuit connecting member 250 . can

A polarizing plate 232 may be positioned on the display panel 230 , but is not limited thereto. The cover layer 240 is spaced apart from the polarizing plate 232 , but the cover layer 240 may be positioned on a portion of the polarizing plate 232 or between the polarizing plate 232 and the display panel 230 .

At least a portion of the non-display area DA of the flexible substrate 210 and the cover layer 240 are bent in a bending direction.

On the other surface 210b of the flexible substrate 210 , the first back plate 260a disposed to correspond to the display panel 230 and the flexible substrate 210 disposed to correspond to the driving integrated circuit connecting member 250 are provided. When positioned in a bent shape in the bending direction, the second back plate 260b positioned below the first back plate 260a may be disposed.

A support member 270 supporting the flexible substrate 210 in contact with the other surface 210b of the flexible substrate 210 in the bending area between the first back plate 260a and the second back plate 260b in the vertical direction is provided. Located. The head 270a of the support member 270 may have a semicircular shape with a radius smaller than the radius of the bent flexible substrate 210 . Accordingly, the head 270a of the support member 270 makes surface contact with the bending area of the other surface 210b of the flexible substrate 210 .

When the flexible substrate 210 is bent in the bending direction, the flexible substrate 210 receives a tensile force. The flexible substrate 210 receives the greatest tensile force in the same direction as the bending direction, and cracks may be generated by itself or due to an external impact or the generated cracks may propagate in the direction of the display panel 230 . The crack of the flexible substrate 210 may cause disconnection of a wiring (not shown) disposed in the non-display area NA. By applying the cover layer 240 to position the wiring (not shown) on the neutral plane during bending, it is possible to prevent the occurrence of cracks in the wiring.

In the flexible display device 200 , bending of the display panel 230 is required to reduce the bezel area, and a cover layer 240 is formed in the bending area to prevent penetration of moisture and cracks, and the head of the support member 270 is The 270 contacts the bending area of the other surface 210b of the flexible substrate 210 to support the bending area of the flexible substrate 210 to prevent cracks.

However, in order to improve the stability and curvature reliability of the support member 270 in the flexible display device 200 according to the above-described other embodiment, as shown in FIGS. 4A and 4B , the head 270a of the support member 270 is In a semicircular shape having the same radius as the radius of the bent flexible substrate 210, the head 270a of the support member 270 is in full surface contact with the bending area of the other surface 210b of the flexible substrate 210, so the support member ( 270) can improve the stability and curvature reliability. Accordingly, the effect of preventing wiring cracks in the entire bending region of the other surface 210b of the flexible substrate 210 by the support member 270 may be improved.

In addition, as shown in FIG. 4C , the support member 270 does not include a head 270a that makes surface contact with the bending area of the other surface 210b of the flexible substrate 210 as a whole, so wiring by impact with the support member 270 is not included. Cracks can be eliminated.

The cover layer 240 may be formed of various materials through various processes. For example, as shown in FIG. 5 , the cover layer 240 may be formed by applying a resin, for example, an organic resin (eg, acrylic resin) through a jetting process. A display panel 230 and a wiring (not shown) are formed in each of the display area DA and the non-display area NA on the flexible substrate 210 . Thereafter, one end 230a of the display panel 230 and one end 250a of the driving integrated circuit connection part 250 are connected to the flexible substrate 210 and the driving integrated circuit connecting member 250 on which the driving integrated circuit is mounted is connected. The cover layer 240 may be formed by coating the organic resin 410 with a jetting apparatus 400 therebetween and then curing with ultraviolet (UV) light or the like.

In terms of process, an area to which the cover layer 240 is not applied may occur due to the jetting process, and thus an open defect may occur. If, for example, the speed of applying the organic resin to the jetting device 410 is reduced, the tact time may increase. In addition, due to the nature of the jetting process, it may be difficult to apply with a uniform thickness because there is a large application tolerance (eg, ㅁ100um) due to the impossibility of fine extrusion control. In terms of material, when an acrylic resin is used as the material of the cover layer 240 , a burnt defect of the cover layer 240 may occur due to the low Tg (eg, 60 to 100°C) of the acrylic resin.

When an acrylic resin is used as the material of the cover layer 240 and polyimide is used as the material of the flexible substrate 210, the flexible substrate 210 and the wiring (not shown) ) cracks may occur. The difference in modulus characteristic value can be compensated for with thickness, but cracks may still occur because it is difficult to make the thickness uniform through the jetting process.

Hereinafter, embodiments in which a cover layer is formed on a flexible substrate without using a jetting process will be described with reference to the drawings.

6 is a cross-sectional view of a flexible display device according to another exemplary embodiment. 7 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member of the flexible display device of FIG. 6 in an unbent state.

6 and 7 , a flexible display device 610 according to another exemplary embodiment includes a flexible substrate 610 including a display area DA and a non-display area NA extending from the display area DA; The display panel 630 positioned in the display area DA of the flexible substrate 610 , the first back plate 660a disposed in correspondence with the display panel 630 on the other surface 610b of the flexible substrate 610 and the flexible A second back plate 660b is provided on the other surface 610b of the substrate 610 to be spaced apart from the first backplate 660a.

The flexible display device 610 according to another exemplary embodiment includes a support member 670 positioned between the first back plate 660a and the second back plate 660b in the vertical direction and spaced apart from the flexible substrate 610 . . As shown in FIG. 6 , the head 670a of the support member 670 is larger than the body and has a semicircular shape having the same radius as the radius of the bent flexible substrate 610, and the head 670a of the support member 670 is Since the entire surface contact with the bending area of the other surface 610b of the flexible substrate 610, stability and curvature reliability of the support member 670 can be improved. In this case, the head 670a of the support member 670 may have the same shape as shown in FIGS. 2 and 4B . Also, the support member 670 may not include the head 670a as shown in FIG. 4C .

A wiring 620 is disposed on the flexible substrate 610 as shown in FIG. 1 . The wiring 620 is a driving circuit unit or a gate driving integrated circuit that may be formed in the display panel 630 formed in the display area DA of the flexible substrate 610 and the non-display area NA of the flexible substrate 610, A signal may be transmitted by electrically connecting the data driving integrated circuit.

The wiring 620 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility to minimize cracks from occurring when the flexible substrate 610 is bent.

At least a portion of the non-display area NA of the flexible substrate 610 may be bent in a bending direction.

The flexible display device 610 according to another embodiment includes a cover layer 640 that is disposed in the non-display area NA of one surface 610a of the flexible substrate 610 and is bent in a bending direction. The cover layer 640 may also be disposed in a bent shape in the bending direction in the same manner as at least a partial area of the non-display area NA of the flexible substrate 610 .

The cover layer 640 is formed of a tape in the non-display area NA of one surface 610a of the flexible substrate 610 . The tape is coated with an organic material. The organic material may be one selected from the group consisting of polyester-based polymers, silicone-based polymers, acrylic polymers, polyolefin-based polymers, and copolymers thereof.

Specifically, the organic material may include one selected from the group consisting of polyester-based polymers, silicone-based polymers, acrylic polymers, polyolefin-based polymers, and copolymers thereof. Specifically, the organic material is polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polysilane (polysilane), polysiloxane (polysiloxane), polysilazane (polysilazane), polycarbosilane (polycarbosilane), polyacrylate (polyacrylate), polymethacrylate, polymethylacrylate, polymethylmethacrylate, polyethylacrylate, polyethylmethacrylate, cyclic olefin Polymer (COC), Cyclic Olefin Polymer (COP), Polyethylene (PE), Polypropylene (PP), Polyimide (PI), Polymethylmethacrylate (PMMA), Polystyrene (PS), Polyacetal (POM), Polyetheretherketone (PEEK), polyestersulfone (PES), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride (PVDF), perfluoroalkyl It may include one selected from the group consisting of polymer (PFA), styrene-acrylnitrile copolymer (SAN), and combinations thereof.

As shown in FIG. 8 , between at least a partial area of the non-display area NA of the flexible substrate 610 positioned in a bent shape in the bending direction and the cover layer 640 may be positioned on a neutral plane. Specifically, the wiring 620 positioned in the non-display area NA of the flexible substrate 610 may form a neutral plane by the flexible substrate 610 and the cover layer 640 . At least a partial area of the non-display area DA of the flexible substrate 610 and at least a partial area of the non-display area DA of the flexible substrate 610 when the cover layer 640 is bent in a bending direction In the cover layer 640 , a position at which strain becomes substantially zero due to bending is referred to as a neutral plane.

The cover layer 640 may be made of the same material as the flexible substrate 610 , but is not limited thereto. For example, when the cover layer 640 is polyimide, the cover layer 640 may also be polyimide, but is not limited thereto.

For example, when the cover layer 640 is made of the same material as the flexible substrate 610 , the wiring 620 positioned in the non-display area NA of the relatively flexible substrate 610) is the flexible substrate 610 . It may be advantageous to form a neutral plane by at least a partial area of the non-display area DA and the cover layer 640 .

The cover layer 640 may be made of a material different from that of the flexible substrate 610 . In this case, the wiring 620 positioned in the non-display area NA of the flexible substrate 610 forms a neutral plane by at least a partial area of the non-display area DA of the flexible substrate 610 and the cover layer 640 . The length, thickness, and modulus of elasticity of the flexible substrate 610 and the cover layer 640 may be formed to form the flexible substrate 610 . For example, although the thickness of the cover layer 640 is greater than the thickness of the flexible substrate 610, the elastic modulus of the cover layer 640 is lower than the elastic modulus of the flexible substrate 610, so the non-display area NA of the flexible substrate 610) ) may form a neutral plane by at least a partial area of the non-display area DA of the flexible substrate 610 and the cover layer 640 .

The driving integrated circuit connecting member 650 is connected to the non-display area NA of the flexible substrate 610 , and the cover layer 640 is positioned between the display panel 630 and the driving integrated circuit connecting member 650 . As shown in FIG. 7 , the cover layer 640 is positioned between the display panel 630 and the driving integrated circuit connecting member 650 , and is positioned between the side surface 630b of the display panel 630 and the driving integrated circuit connecting member 650 . may be in contact with the side surface 630b of Also, as shown in FIGS. 9A to 9C , the cover layer 640 is positioned between the display panel 630 and the driving integrated circuit connecting member 650 and is connected to a part 630a of the display panel 630 and the driving integrated circuit. One or both of the portions 650a of the member 650 may be covered.

As described above, the driving integrated circuit connecting member 650 may be at least one of a tape carrier package (TCP) and a chip on film (COF). A polarizing plate 632 may be positioned on the display panel 630 , but is not limited thereto.

A polarizing plate 632 may be positioned on the display panel 630 , but is not limited thereto. Although the cover layer 640 is spaced apart from the polarizing plate 632 , the cover layer 640 may be positioned on a portion of the polarizing plate 632 or between the polarizing plate 632 and the display panel 630 .

10 is a cross-sectional view of a flexible substrate, a display panel, and a driving integrated circuit connecting member in an unbent state of the flexible display device according to another exemplary embodiment.

Referring to FIG. 10 , the flexible display device 1000 includes a flexible substrate 1010 , a wiring 1020 , and a display panel 1030 .

The flexible substrate 1010 is a substrate for supporting various elements of the flexible display device 1000 , and is a substrate to which flexibility is imparted. The non-display area NA of the flexible substrate 1010 includes a bending area. In FIG. 10 , for convenience of explanation, the entire non-display area NA of the flexible substrate 1010 is illustrated as a bending area, but only a portion of the non-display area NA of the flexible substrate 1010 is bent. It may correspond to an area. Although FIG. 10 illustrates a state in which the flexible substrate 1010 is not bent for convenience of explanation, the non-display area NA, which is a bending area of the flexible substrate 1010, may be bent in the bending direction as shown in FIG. 10 . can

A wiring 1020 is formed on the flexible substrate 1010 . The wiring 1020 may include the first to third patterns 1021 , 1022 , and 1023 as necessary, but is not limited thereto.

The wiring 1020 includes a driving circuit unit or a gate driving integrated circuit that may be formed in the display panel 1030 formed in the display area DA of the flexible substrate 1010 and the non-display area NA of the flexible substrate 1010; A signal may be transmitted by electrically connecting the data driving integrated circuit. The wiring 1020 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility to minimize cracks from occurring when the flexible substrate 1010 is bent.

The display panel 1030 is disposed on all or a part of the display area DA of the flexible substrate 1010 . The display panel 1030 is an element for displaying an actual image, and may also be referred to as an image display unit.

The flexible display device 1000 includes a cover layer 1040 positioned on the wiring 1020 positioned in at least a partial region of the non-display area NA of the one surface 1010a of the flexible substrate 1010 . The cover layer 1040 may include the same layer as at least one of the layers constituting the display panel 1030 . In this specification, the same layer as the layer constituting the display panel 1030 means that it is formed of the same material on the same layer as the layer constituting the display panel 1030 . In this case, the same layer as the layer constituting the display panel 1030 includes not only the same thickness as the layer constituting the display panel 1030 but also a different thickness. The layers constituting the cover layer 1040 may have the same thickness as the layers constituting the display panel 1030 , but may be different.

In terms of process, since the cover layer 1040 is formed using the manufacturing process of the display panel 1030 , it is possible to prevent an open defect from occurring due to an uncoated area. In addition, since the cover layer 1040 is formed using the manufacturing process of the display panel 1030 , the cover layer 1040 can be applied to a uniform thickness.

In terms of material, since the cover layer 1040 is formed of a material having the same or similar properties as the material of the flexible substrate 210 as a material of the cover layer 1040, for example, a material having a modulus property value, the flexible substrate 1010 and It is possible to prevent cracks in the wiring 1020 between the cover layers 1040 from occurring.

For example, in FIG. 10 , the cover layer 1040 is made of the same material as the overcoat layer 1064 positioned on the thin film transistor between the organic light emitting device 1050A and the thin film transistor 1040A included in the display panel 1030 to be described later. A first layer 1064b may be included.

In this case, for the cover layer 1040 , the same first layer 1064b as the overcoat layer 1064 may be manufactured while the overcoat layer 1064 is manufactured during the manufacturing process of the display panel 1030 . For example, the cover layer 1040 may be formed in the same process as the process of manufacturing the overcoat layer 1064 by changing the shape of the opening of the mask used to form the overcoat layer 1064 .

11A illustrates that the cover layer 1040 includes the overcoat layer 1064 included in the display panel 1030 and the same first and second layers 1064a and 1065a as the bank layer 1065 .

Cover with the same first and second layers 1064a and 1065a as the overcoating layer 1064 and the bank layer 1065 while the overcoating layer 1064 and the bank layer 1065 are manufactured during the manufacturing process of the display panel 1030 . Layer 1040 may be prepared. For example, the same process as the process of manufacturing the coat layer 1064 and the bank layer 1065, respectively, by changing the shape of the opening of the mask used to form the overcoat layer 1064 and the bank layer 1065, respectively. to form the cover layer 1040 .

11B , an overcoat layer 1064 and a bank layer 1065 including a cover layer 1040 included in the display panel 1030 , a spacer 1080 serving as pillars of the display panel 1030 , and first to third layers (1064a, 1065a, 1080a) is shown.

During the manufacturing process of the display panel 1030 , the overcoat layer 1064 , the bank layer 1065 , and the spacer 1080 are manufactured during the manufacturing process of the overcoat layer 1064 , the bank layer 1065 , and the first to the same first to the spacers 1080 . The cover layer 1040 may be manufactured using the third layers 1064a, 1065a, and 1080a. For example, by changing the shape of the opening of the mask used to form the overcoat layer 1064, the bank layer 1065, and the spacer 1080, respectively, the coat layer 1064, the bank layer 1065, and the spacer ( The cover layer 1040 may be formed in the same process as the process of manufacturing 1080 , respectively.

Hereinafter, the structure of the display panel 1030 and the structure of the cover layer 1040 will be described in detail with reference to FIGS. 10 to 12 . 10 to 12 , some layers of the display panel 1030 are exemplarily described as the cover layer 1040 is the same layer as at least one of the layers constituting the display panel 1030 . ) may also be included in the cover layer 1040 .

Referring to FIG. 10 , the display panel 1030 includes an organic light emitting device 1050A and a thin film transistor 1040A.

A buffer layer 1061 is formed on the flexible substrate 1010 . The buffer layer 1061 may prevent penetration of moisture or impurities through the flexible substrate 1010 and may planarize the surface of the flexible substrate 1010 . However, the buffer layer 1061 is not a necessary configuration, and may be adopted depending on the type of the flexible substrate 1010 or the type of the thin film transistor 1040A used in the flexible display device 1000 . When the buffer layer 1061 is used as shown in FIG. 10 , the buffer layer 1061 may be formed of a silicon oxide film, a silicon nitride film, or a multilayer thereof.

A silicon oxide film and a silicon nitride film constituting the buffer layer 1061 have inferior ductility compared to metal. Accordingly, in the flexible display device according to another exemplary embodiment of the present invention, in order to secure ductility of the non-display area NA of the flexible substrate 1010 , the buffer layer 1061 is formed only in the display area DA of the flexible substrate 1010 . it might be However, when the buffer layer 1061 is formed only in the display area DA of the flexible substrate 1010 and the buffer layer 1061 is not formed in the non-display area NA of the flexible substrate 1010, the flexible substrate 1010 An element positioned above the non-display area NA of , may be vulnerable to moisture and oxygen penetrating from a lower portion of the non-display area NA of the flexible substrate 1010 . Accordingly, the buffer layer 1061 formed in the non-display area NA of the flexible substrate 1010 may be thinner than the buffer layer 1061 formed in the display area DA of the flexible substrate 1010 , and the display of the flexible substrate 1010 is After forming the buffer layer 1061 of the same thickness in the area DA and the non-display area NA, a portion of the buffer layer 1061 formed in the non-display area NA of the flexible substrate 1010 is etched. (1061) can be formed.

In addition, the silicon oxide film constituting the buffer layer 1061 has lower ductility than the metal, but has excellent flexibility compared to the silicon nitride film. Accordingly, in the flexible display device according to another embodiment of the present invention, moisture and oxygen penetrate from the lower portion of the non-display area NA of the flexible substrate 1010 to the upper portion of the non-display area NA of the flexible substrate 1010 . In order to protect positioned elements, only a silicon oxide layer among materials constituting the buffer layer 1061 may be formed in the non-display area NA of the flexible substrate 1010 .

An active layer 1041 is formed on the flexible substrate 1010 . When the buffer layer 1061 is not formed, the active layer 1041 may be directly formed on the flexible substrate 1010 . The active layer 1041 may include a channel region in which a channel is formed, and a source region and a drain region in contact with the source electrode 1043 and the drain electrode 1044 , respectively.

The active layer 1041 may include an oxide semiconductor, but is not limited thereto, and may include an inorganic semiconductor such as amorphous silicon or polysilicon. As a constituent material of the oxide semiconductor included in the active layer 1041 , a quaternary metal oxide indium tin gallium zinc oxide (InSnGaZnO)-based material, a ternary metal oxide indium gallium zinc oxide (InGaZnO)-based material, and indium tin zinc oxide (InSnZnO)-based material, indium aluminum zinc oxide (InAlZnO)-based material, tin gallium zinc oxide (SnGaZnO)-based material, aluminum gallium zinc oxide (AlGaZnO)-based material, tin aluminum zinc oxide (SnAlZnO)-based material, ten-membered metal oxide Indium zinc oxide (InZnO) based material, tin zinc oxide (SnZnO) based material, aluminum zinc oxide (AlZnO) based material, zinc magnesium oxide (ZnMgO) based material, tin magnesium oxide (SnMgO) based material, indium magnesium oxide ( InMgO)-based material, indium gallium oxide (InGaO)-based material, indium oxide (InO)-based material, tin oxide (SnO)-based material, zinc oxide (ZnO)-based material, or the like can be used. The composition ratio of each element included in each oxide semiconductor material described above is not particularly limited and may be variously adjusted. In the present specification, it is described that the active layer 1041 includes an oxide semiconductor for convenience of description, but is not limited thereto.

A gate insulating layer 1045 is formed on the active layer 1041 . The gate insulating layer 1045 insulates the active layer 1041 from the gate electrode 1042 . The gate insulating layer 1045 may be formed of a silicon oxide film, a silicon nitride film, or a multilayer thereof, but is not limited thereto, and may be formed of various materials. The gate insulating layer 1045 may be formed over the entire surface of the flexible substrate 1010 including the active layer 1041 , but the gate insulating layer 1045 only insulates the active layer 1041 and the gate electrode 1042 . Therefore, it may be formed only on the active layer 1041 , but may be formed over the entire surface of the flexible substrate 1010 , and as shown in FIG. 10 , the gate insulating layer 1045 is formed on the flexible substrate 1010 . It may be formed only in the display area DA. In this case, the gate insulating layer 1045 may be formed to have a contact hole opening a partial region of the active layer 1041 , and the contact hole may be formed to open a partial region of the source region and the drain region of the active layer 1041 . can

The silicon oxide film constituting the gate insulating layer 1045 has lower ductility than the metal, but superior ductility compared to the silicon nitride film. Accordingly, in the flexible display device according to another embodiment of the present invention, moisture and oxygen penetrate from the lower portion of the non-display area NA of the flexible substrate 1010 to the upper portion of the non-display area NA of the flexible substrate 1010 . In order to protect positioned elements, only a silicon oxide layer among materials constituting the buffer layer 1061 may be formed in the non-display area NA of the flexible substrate 1010 .

A gate electrode 1042 is formed on the gate insulating layer 1045 . The gate electrode 1042 at least partially overlaps the active layer 1041 , in particular, the channel region of the active layer 1041 .

An interlayer insulating film 1046 is formed on the gate electrode 1042 . The interlayer insulating layer 1046 may be formed of the same material as the gate insulating layer 1045 , and may be formed of a silicon oxide layer, a silicon nitride layer, or a multilayer thereof, but is not limited thereto, and may be formed of various materials. The interlayer insulating layer 1046 may be formed to have a contact hole opening a partial region of the active layer 1041 , and the contact hole may open a partial region of a source region and a drain region of the active layer 1041 . The interlayer insulating layer 1046 may be formed only in the display area DA of the flexible substrate 1010 as shown in FIG. 10 , but similarly to the buffer layer 1061 and the gate insulating layer 1045 , It may be formed in both the display area DA and the non-display area NA, and among the materials constituting the interlayer insulating layer 1046 , only a material having excellent ductility such as a silicon oxide layer is the non-display area NA of the flexible substrate 1010 . ) may be formed.

A source electrode 1043 and a drain electrode 1044 are formed on the interlayer insulating film 1046 . Each of the source electrode 1043 and the drain electrode 1044 may be electrically connected to each of the source region and the drain region of the active layer 1041 through a contact hole formed in the interlayer insulating layer 1046 and/or the gate insulating layer 1045 . have.

A passivation film 1062 is formed on the source electrode 1043 and the drain electrode 1044 . The passivation layer 1062 may be formed to have a contact hole exposing the source electrode 1043 or the drain electrode 1044 . The passivation film 1062 is a protective layer, and may be formed of the same material as the interlayer insulating film 1046 and/or the gate insulating layer 1045 , and a single layer or a plurality of materials such as a silicon oxide film and a silicon nitride film. It may be formed as a layer, but is not limited thereto, and may be formed of various materials. Although the flexible display 1000 is illustrated as including the passivation film 1062 in FIG. 10 , the passivation film 1062 is not a necessary configuration, so it is also possible to omit the passivation film 1062 . As shown in FIG. 10 , the passivation layer 1062 may be formed in both the display area DA and the non-display area NA of the flexible substrate 1010 , and is formed on the wiring 1020 and the wiring 1020 . ) can be protected from the outside.

An overcoat layer 1064 is formed on the source electrode 1043 and the drain electrode 1044 . The overcoat layer 1064 may also be referred to as a planarization layer or a planarization layer. When the passivation film 1062 is formed, the overcoat layer 1064 may be formed on the passivation film 1062 . The overcoat layer 1064 planarizes an upper portion of the flexible substrate 1010 . In addition, the overcoat layer 1064 may be formed to have a contact hole exposing the source electrode 1043 or the drain electrode 1044 .

The overcoating layer 1064 may include acrylic resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyester resin (Unsaturated polyesters resin), polyphenylene resin (poly-phenylenethers resin), polyphenylene sulfides (poly-phenylenesulfides resin), and benzocyclobutene (benzocyclobutene) may be formed of at least one material, but is not limited thereto. and may be formed of various materials.

As described above, the cover layer 1040 may include the same first layer 1064b as the overcoat layer 1064 . Accordingly, the first layer 1064b is made of the same material as the over-gating layer 1064, that is, polyacrylates resin, epoxy resin, phenolic resin, polyamides resin, Polyimides resin, unsaturated polyesters resin, poly-phenyleneethers resin, poly-phenylenesulfides resin, and benzocyclobutene ) may be formed of one or more materials, but is not limited thereto, and may be formed of various materials.

In this case, the cover layer 1040 may be made of the same material 1064b as the overcoat layer 1064 while the overcoat layer 1064 is manufactured during the manufacturing process of the display panel 1030 . For example, the cover layer 1040 may be formed in the same process as the process of manufacturing the overcoat layer 1064 by changing the shape of the opening of the mask used to form the overcoat layer 1064 .

The thin film transistor 1040A includes an active layer 1041 , a gate insulating layer 1045 , a gate electrode 1042 , an interlayer insulating film 1046 , a source electrode 1043 , and a drain electrode 1044 formed as described above. . The thin film transistor 1040A may be formed on the flexible substrate 1010 for each pixel area or each sub-pixel area of the display area DA, and enables independent driving of each pixel area or each sub-pixel area can do it The configuration of the thin film transistor 1040 is not limited to the example described above, and can be variously modified into a known configuration that can be easily implemented by those skilled in the art.

The thin film transistor 1040A may be formed on the flexible substrate 1010 to emit light from the organic light emitting layer 1054 of the organic light emitting device 1050A. In general, a switching thin film transistor and a driving thin film transistor are used to emit light from the organic light emitting layer 1054 according to image information of a data signal input according to a scan signal.

When a scan signal is applied from the gate line to the switching thin film transistor, the data signal from the data line is transferred to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits a current transmitted through the power wiring to the first electrode by a data signal received from the switching thin film transistor, and controls the emission of the organic light emitting layer of the corresponding pixel or sub-pixel by the current transmitted to the first electrode do.

The flexible display device 1000 may additionally include a thin film transistor for a compensation circuit designed to prevent abnormal driving of the flexible display device 1000 .

In this specification, only the driving thin film transistor 1040A is illustrated among various thin film transistors that may be included in the flexible display device 1000 for convenience of description.

The thin film transistor may be classified into an inverted staggered structure and a coplanar structure according to positions of elements constituting the thin film transistor. The thin film transistor of the inverted staggered structure refers to a thin film transistor having a structure in which the gate electrode is positioned on opposite sides of the source electrode and the drain electrode with respect to the active layer, and the thin film transistor of the coplanar structure is based on the active layer This means a thin film transistor having a structure in which the gate electrode is positioned on the same side as the source electrode and the drain electrode. In the present specification, the thin film transistor 1040A having a coplanar structure is illustrated for convenience of description, but the present disclosure is not limited thereto, and a thin film transistor having an inverted staggered structure may also be used.

An organic light emitting diode 1050A including a first electrode 1051 , an organic light emitting layer 1054 , and a second electrode 1055 is formed on the flexible substrate 1010 . The organic light emitting device 1050A is driven on the principle that a hole supplied from the first electrode 1051 and an electron supplied from the second electrode 1055 are combined in the organic light emitting layer 1054 to emit light. and form an image.

The flexible display device 1000 is an independent driving display device and is driven for each sub-pixel area of the display area DA. Accordingly, the above-described thin film transistor 1040A and the organic light emitting device 1050A are disposed for each sub pixel area of the display area DA, and the thin film transistor 1040A disposed in each sub pixel area is the organic light emitting device ( 1050A) can be driven independently.

A first electrode 1051 is formed on the overcoat layer 1064 . The first electrode 1051 may also be referred to as an anode, a pixel electrode, or an anode. The first electrode 1051 may be formed separately for each sub-pixel area of the display area DA.

The first electrode 1051 may be connected to the source electrode 1043 of the thin film transistor 1040A through a contact hole formed in the overcoat layer 1064 . In this specification, it has been described that the first electrode 1051 is connected to the source electrode 1043 on the assumption that the thin film transistor 1040A is an N-type thin film transistor, but the thin film transistor 1040A is a P-type thin film transistor In the case of , the first electrode 1051 may be connected to the drain electrode 1044 . The first electrode 1051 may directly contact the organic emission layer 1054 or may be electrically connected to the organic emission layer 1054 with a conductive material interposed therebetween.

A bank layer 1065 is formed on the first electrode 1051 and the overcoat layer 1064 . The bank layer 1065 may serve to distinguish between adjacent sub-pixel areas, and may be disposed between adjacent sub-pixel areas. Also, the bank layer 1065 may be formed to open a portion of the first electrode 1051 . The bank layer 1065 may be formed of any one of an organic insulating material, for example, polyimide, photo acryl, or benzocyclobutene (BCB). The bank layer 1065 may be formed in a tapered shape. When the bank layer 1065 is formed in a tapered shape, the bank layer 1065 may be formed using a positive type photoresist. The bank layer 1065 may be formed to a thickness for distinguishing adjacent sub-pixel regions.

As shown in FIG. 11A , the cover layer 1040 may include the same first layer 1064a as the overcoat layer 1064 and the same second layers 1064a and 1065a as the bank layer 1065 .

During the manufacturing process of the display panel 1030, the same second layer 1065a as the bank layer 1065 is formed on the same first layer 1064a as the overcoat layer 1064 while the bank layer 1065 is manufactured. A cover layer 1040 may be manufactured. For example, the second layer 1065a may be formed on the first layer 1064a by changing the shape of the opening of a mask used to form the overcoat layer 1064 .

A method in which a flexible organic light emitting display displays an image by forming and using an organic light emitting layer emitting red, green, and blue itself in each sub pixel area, and forming an organic light emitting layer emitting white light in all sub pixel areas A method of using color filters together is being used.

10 shows the flexible display device 1000 using an organic light emitting layer 1054 that emits red, green, and blue itself for each sub pixel area for convenience of explanation, and the organic light emitting layer ( 1054) is not connected, but is not limited thereto.

A second electrode 1055 is formed on the organic emission layer 1054 . The second electrode 1055 may also be referred to as a cathode, a common electrode, or a cathode. The second electrode 1055 may be connected to a separate voltage line 1020 to apply the same voltage to all sub-pixel areas of the display area DA.

An encapsulation portion 1070 is formed on the organic light emitting diode 1050A including the second electrode 1055 as a sealing member covering the organic light emitting element 1050A. The encapsulation part 1070 may protect internal elements of the flexible display device 1000 , such as the thin film transistor 1040A and the organic light emitting diode 1050A, from external moisture, air, impact, and the like. The encapsulation unit 1070 may be formed in the display area DA of the flexible display device 1000 to protect internal elements of the flexible display device 1000 .

As shown in FIG. 11B , a spacer 1080 serving as a pillar of the display panel 1030 may be included on the encapsulation layer 1070 , but is not limited thereto.

As shown in FIG. 11A , the cover layer 1040 includes a first layer 1064a identical to the overcoat layer 1064 and second layers 1064a and 1065a identical to the bank layer 1065). 3s 1080a may be included.

During the manufacturing process of the display panel 1030 , the spacer 1080 is formed on the same first layer 1064a as the overcoat layer 1064 and the second layer 1065a as the bank layer 1065 while the spacer 1080 is manufactured. ) and the same third 1080a may be formed to manufacture the cover layer 1040 . For example, the third layer 1080a may be formed on the first layer 1064a and the second layer 1065a by changing the shape of the opening of a mask used to form the spacer 1080 .

A pad part 1066 is formed on the flexible substrate 1010 . The pad part 1066 may be formed in the display area DA of the flexible substrate 1010 . In FIG. 10 , for convenience of explanation, the pad part 1066 is illustrated as being formed on the gate insulating layer 1045 in the display area DA of the flexible substrate 1010 , but the present invention is not limited thereto. ) may be formed on the flexible substrate 1010 or on the buffer layer 1061 .

The pad part 1066 shown in FIG. 10 is a configuration for connecting the gate wiring 1020 and a gate driving integrated circuit that applies a gate signal to the gate wiring 1020, and is formed of the same material as the gate electrode 1042 on the same layer. is formed with When the pad unit 1066 is configured to connect the data line 1020 and a data driving integrated circuit that applies a data signal to the data line 1020 , the pad unit 1066 includes a source electrode 1043 and a drain electrode ( 1044) and may be formed of the same material on the same layer.

The wiring 1020 may transmit a signal by electrically connecting the pad part 1066 formed in the display area DA of the flexible substrate 1010 and the driving circuit part, the gate driving integrated circuit, or the data driving integrated circuit.

12 , all or part of the cover layer 1040 may be patterned in the same manner as the wiring 1020 . In other words, the cover layer 1040 includes a first layer 1064a identical to the overcoat layer 1064 and second layers 1064a and 1065a identical to the bank layer 1065) and third layers 1080a identical to the spacer 1080. However, the first to third layers 1064a , 1065a , and 1080a included in the cover layer 1040 may be patterned in the same manner as the wiring 1020 . 12 shows that the first to third layers 1064a, 1065a, and 1080a are patterned in the same way as the wiring 1020, but only some layers of the first to third layers 1064a, 1065a, and 1080a are patterned. and another partial layer may be formed on the entire surface of the cover layer 1040 .

During the manufacturing process of the display panel 1030 , the overcoat layer 1064 , the bank layer 1065 , and the spacer 1080 are formed while the overcoat layer 1064 , the bank layer 1065 , and the spacer 1080 are respectively manufactured. The first layer 1064a , the second layer 1065a , and the third layer 1080a may be patterned in the same manner as the wiring 1020 by changing the shape of the opening of the mask used to perform the pattern.

The flexible display device 1000 shown in FIG. 10 is in a bent state, among the first back plate 260a, the second back plate 260b, and the support member 270 as shown in FIGS. 2 and 4A to 4C . It may include at least one, but is not limited thereto, and the support structure of the other surface 1010a of the flexible substrate 1010 may be implemented in various structures.

According to the above-described embodiments, there is an effect of preventing cracks from occurring in the flexible substrate or wiring during bending in the flexible display device.

Also, according to the above-described exemplary embodiments, it is possible to prevent or minimize defects in the flexible display device.

The above description and the accompanying drawings are merely illustrative of the technical spirit of the present invention, and those of ordinary skill in the art to which the present invention pertains can combine configurations within a range that does not depart from the essential characteristics of the present invention. , various modifications and variations such as separation, substitution and alteration will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

1000, 600, 1100: flexible display device
1010, 610, 1110: flexible substrate
240, 640, 1140: cover layer
250, 650, 1150: a driving integrated circuit connecting member
260a, 660a, 1160a: first back plate
260b, 660b, 1160b: second back plate

Claims (13)

a flexible substrate including a display area and a non-display area extending from the display area;
a display panel positioned in a display area of one surface of the flexible substrate;
a cover layer made of a tape on a non-display area of one surface of the flexible substrate;
a driving integrated circuit connecting member positioned in a non-display area of one surface of the flexible substrate;
a first back plate disposed on the other surface of the flexible substrate and disposed to correspond to the display panel;
a second back plate disposed to correspond to the driving integrated circuit connecting member and positioned below the first back plate when the flexible substrate is bent in a bending direction; and
a support member positioned between the first back plate and the second back plate;
At least a partial area of the non-display area of the flexible substrate and the cover layer are bent in a bent shape in a bending direction;
The head of the support member has a semicircular shape having the same radius as the radius of the bent flexible substrate,
The head of the support member is in surface contact with the entire bending area of the other surface of the flexible substrate, and is in surface contact with one side of the first back plate and one side of the second back plate. According to claim 1,
The tape is a flexible display device coated with an organic material. 3. The method of claim 2,
The organic material is one selected from the group consisting of a polyester-based polymer, a silicone-based polymer, an acrylic polymer, a polyolefin-based polymer, and a copolymer thereof. According to claim 1,
The flexible substrate and the cover layer are made of the same material. According to claim 1,
The cover layer is positioned between the display panel and the driving integrated circuit connecting member and is in contact with a side surface of the display panel and a side surface of the driving integrated circuit connecting member. delete According to claim 1,
The driving integrated circuit connecting member is at least one of a tape carrier package (TCP) and a chip on film (COF) flexible display device. delete a flexible substrate including a display area and a non-display area extending from the display area;
a display panel positioned in a display area of the flexible substrate;
a wiring disposed on the flexible substrate; and
a cover layer positioned on a wiring positioned in at least a portion of a non-display area of one surface of the flexible substrate and including at least one layer identical to at least one of the layers constituting the display panel;
At least a partial area of the non-display area of the flexible substrate and the cover layer are bent in a bent shape in a bending direction;
The display panel is
An organic light emitting display panel comprising an organic light emitting device displaying an image through an organic light emitting layer, a thin film transistor driving the organic light emitting device, and an overcoat layer positioned on the thin film transistor between the organic light emitting device and the thin film transistor,
The organic light emitting device includes a first electrode electrically connected to one of a source electrode and a drain electrode of the thin film transistor, a bank layer opening the first electrode, an organic light emitting layer formed on the first electrode, and the organic light emitting layer. a second electrode formed therein;
The display panel further includes an encapsulation layer positioned on the second electrode and a spacer positioned on the encapsulation layer and serving as a pillar on the organic light emitting device;
and the cover layer includes a first layer identical to the overcoat layer, a second layer identical to the bank layer, and a third layer identical to the spacer layer. a flexible substrate including a display area and a non-display area extending from the display area;
a display panel positioned in a display area of the flexible substrate;
a wiring disposed on the flexible substrate;
a buffer layer positioned in contact with the flexible substrate; and
a cover layer positioned on a wiring positioned in at least a portion of a non-display area of one surface of the flexible substrate and including at least one layer identical to at least one of the layers constituting the display panel;
At least a partial area of the non-display area of the flexible substrate and the cover layer are bent in a bent shape in a bending direction;
A thickness of the buffer layer in the non-display area that is a bending area is thinner than a thickness of the buffer layer in the display area. delete delete 10. The method of claim 9,
A driving integrated circuit connecting member is connected to a non-display area of one surface of the flexible substrate;
The wiring located in at least a portion of the non-display area of one surface of the flexible substrate electrically connects the display panel and the driving integrated circuit located on the driving integrated circuit connecting member,
A portion of the cover layer is patterned in the same manner as the wiring.

Images