KR20210073961A - Display device - Google Patents

Abstract

A display device according to an embodiment of the present invention includes: a substrate divided into a display area and a non-display area; an encapsulation substrate disposed on the substrate; a back cover attached to the encapsulation substrate; a plurality of pads provided in a pad area of the non-display area of the substrate; and at least one flexible film connected to the plurality of pads and disposed on one surface of the back cover. The encapsulation substrate may be disposed on the entire surface of the substrate exposing the pad. Accordingly, the present invention can solve the problems of poor driving and reliability of a display panel by minimizing cracks in the display panel and damage to the flexible film.

Description

display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a rollable display device capable of displaying an image even when rolled.

Display devices used in computer monitors, TVs, and mobile phones include organic light emitting displays (OLEDs) that emit light by themselves, and liquid crystal displays (LCDs) that require a separate light source. have.

A display device is being applied to a personal portable device as well as a computer monitor and TV, and research on a display device having a large display area and reduced volume and weight is being conducted.

Also, in recent years, a rollable display device, in which a display element and wiring are formed on a flexible substrate such as plastic, which is a flexible material, and can display images even when rolled, attracting attention as a next-generation display device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a display device in which cracks are minimized during rolling in a rollable display device using a flexible substrate.

Another object of the present invention is to provide a display device in which defects due to a micro-sealing layer are removed from a rollable display device using a flexible substrate.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, a display device according to an embodiment of the present invention includes a substrate divided into a display area and a non-display area, an encapsulation substrate disposed on the substrate, a back cover attached to the encapsulation substrate, and a portion of the substrate. a plurality of pads provided in the pad area of the non-display area and at least one flexible film connected to the plurality of pads and disposed on one surface of the back cover, the encapsulation substrate may be disposed on the entire surface of the substrate exposing the pad .

In order to solve the above problems, a display device according to another embodiment of the present invention includes a substrate divided into a display area and a non-display area, a pixel unit disposed on the substrate, and including a plurality of light emitting devices and circuits; An adhesive layer and an encapsulation substrate disposed to cover the pixel unit, a back cover disposed on the encapsulation substrate, an adhesive layer interposed between the back cover and the encapsulation substrate, a plurality of pads and a plurality of pads provided in a pad area of a non-display area of the substrate at least one flexible film connected to and disposed on one surface of the back cover, wherein the adhesive layer and the encapsulation substrate are disposed to expose the pad and extend from the display area to the non-display area of the substrate, and the adhesive layer to the pad area of the substrate It may be disposed on the entire surface of the encapsulation substrate except for .

The details of other embodiments are included in the detailed description and drawings.

According to the present invention, it is possible to minimize cracks in the display panel and damage to the flexible film that occur during rolling in a rollable display device using a flexible substrate.

Accordingly, it is possible to solve the problems of driving failure and reliability of the display panel.

According to the present invention, by removing the micro-sealing layer in a rollable display device using a flexible substrate, cracks and contact pad opening defects due to the micro-sealing layer can be prevented. In addition, the module process can be simplified by removing the micro-sealing layer.

The effect according to the present invention is not limited by the contents exemplified above, and more various effects are included in the present invention.

1A and 1B are perspective views of a display device according to a first exemplary embodiment of the present invention.
2 is a perspective view of a display device according to a first exemplary embodiment of the present invention.
3 is a schematic cross-sectional view of a display device according to a first exemplary embodiment of the present invention.
4 is a plan view of a display unit of the display device according to the first exemplary embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along line I-I' of FIG. 4 .
6A and 6B are plan views schematically illustrating a display unit of a display device according to a first exemplary embodiment of the present invention.
FIG. 7 is an enlarged perspective view along the box B1 of FIG. 6B .
8A and 8B are plan views illustrating a display unit according to a comparative example.
9 is an enlarged perspective view taken along the box B2 of FIG. 8B .
10 is a cross-sectional view taken along line A-A' of FIG. 6B.
11 is a cross-sectional view taken along line C-C' of FIG. 6B.
12 is a plan view of a display unit of a display device according to a second exemplary embodiment of the present invention.
13 is a plan view of a display unit of a display device according to a third exemplary embodiment of the present invention.
14 is a plan view of a display unit of a display device according to a fourth exemplary embodiment of the present invention.
15 is a plan view of a display unit of a display device according to a fifth exemplary embodiment.
16 is a plan view of a display unit of a display device according to a sixth exemplary embodiment.

Advantages and features of the present invention, and a method of achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different shapes, only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'include', 'have', 'consists of', etc. mentioned in the present invention are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'next to', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

Reference to an element or layer “on” another element or layer includes any intervening layer or other element directly on or in the middle of another element.

In addition, although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Like reference numerals refer to like elements throughout.

The area and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the area and thickness of the illustrated component.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The rollable display device may be referred to as a display device capable of displaying an image even when it is rolled up. A rollable display device may have high flexibility compared to a conventional display device. The shape of the rollable display device may be freely changed depending on whether the rollable display device is used. Specifically, when the rollable display device is not in use, the rollable display device may be rolled up to reduce its volume and stored. Conversely, when a rollable display device is used, the rolled rollable display device can be unfolded and used again.

1A and 1B are perspective views of a display device according to a first exemplary embodiment of the present invention. 1A and 1B , the display device 100 according to the first exemplary embodiment may include a display unit DP and a housing unit HP.

The display unit DP is configured to display an image to a user, and for example, a display element and a circuit, wiring, and components for driving the display element may be disposed.

Since the display device 100 according to the first embodiment of the present invention is a rollable display device, the display unit DP may be configured to be wound or unwinded. The display unit DP may include a display panel having flexibility to be wound or unwound, and a back cover. A more detailed description of the display unit DP will be described later with reference to FIGS. 4 to 7 .

The housing unit HP is a case in which the display unit DP can be accommodated. The display unit DP may be wound to be accommodated inside the housing unit HP, and the display unit DP may be unwound and disposed outside the housing unit HP.

An opening HPO is disposed in the housing unit HP so that the display unit DP can move in and out of the housing unit HP. The display unit DP may move vertically through the opening HPO of the housing unit HP.

Meanwhile, the display unit DP may be switched from a full unwinding state to a full winding state, or from a full winding state to a full unwinding state.

1A illustrates a state in which the display unit DP of the display device 100 is fully unwound, and the display unit DP of the display device 100 that is fully unwound is disposed outside the housing unit HP. . That is, in order for a user to view an image through the display device 100 , the display unit DP is unwound and is disposed outside the housing unit HP as much as possible. state can be defined.

1B illustrates a state in which the display unit DP of the display device 100 is fully wound, and the display unit DP of the display device 100 that is fully wound is accommodated in the housing unit HP, and is no longer wound. it is impossible That is, when the user does not view an image through the display device 100 , it is advantageous in terms of appearance that the display unit DP is not disposed outside the housing unit HP, so that the display unit DP is wound to form the housing unit. (HP) The state housed inside can be defined as a fully wound state. Also, when the display unit DP is in a fully wound state accommodated in the housing unit HP, the volume of the display device 100 may be reduced and transportation may be facilitated.

Meanwhile, a driving unit for winding or unwinding the display unit DP in order to convert the display unit DP to a fully unwound state or a fully wound state may be disposed.

2 is a perspective view of a display device according to a first exemplary embodiment of the present invention.

3 is a schematic cross-sectional view of a display device according to a first exemplary embodiment of the present invention.

3 is a schematic cross-sectional view illustrating the roller 171 and the display unit DP of the display device 100 according to the first embodiment of the present invention. Accordingly, for convenience of description, only the housing unit HP, the roller 171 and the display unit DP are illustrated in FIG. 3 .

Referring to FIG. 2 , the driving unit MP may include a roller unit 170 and a lifting unit 180 .

The roller unit 170 rotates in a clockwise or counterclockwise direction, and may wind or unwind the display unit DP fixed to the roller unit 170 . The roller unit 170 may include a roller 171 and a roller support unit 172 .

The roller 171 is a member on which the display unit DP is wound. The roller 171 may have, for example, a cylindrical shape. A lower edge of the display unit DP may be fixed to the roller 171 . When the roller 171 rotates, the display unit DP having a lower edge fixed to the roller 171 may be wound around the roller 171 . On the other hand, when the roller 171 rotates in the opposite direction, the display portion DP wound on the roller 171 may be unwound from the roller 171 .

Referring to FIG. 3 , the roller 171 may have a cylindrical shape in which a portion of the outer circumferential surface is flat, and the remaining portion of the outer circumferential surface is curved. The roller 171 has a cylindrical shape as a whole, but a portion may be made of a flat surface. That is, a portion of the outer circumferential surface of the roller 171 may be formed to be flat, and the remaining portion of the outer circumferential surface may be formed as a curved surface.

The flat portion of the roller 171 may be a portion on which the printed circuit board of the display unit DP is seated. However, the roller 171 may have a complete cylindrical shape or any shape capable of winding the display unit DP, but is not limited thereto.

At this time, the printed circuit board may be mounted in the flat portion of the roller 171 . That is, at least one receiving groove is formed inside the flat portion of the roller 171 , and the printed circuit board of the display unit DP is inserted and seated in the receiving groove. The number of receiving grooves may correspond to the number of printed circuit boards.

Referring to FIG. 2 , the roller support 172 may support the roller 171 on both sides of the roller 171 . Specifically, the roller support 172 is disposed on the bottom surface HPF of the housing unit HP, and the upper side of the roller support 172 may be coupled to both ends of the roller 171 . Accordingly, the roller support unit 172 may support the roller 171 to be spaced apart from the bottom surface HPF of the housing unit HP. The roller 171 may be rotatably coupled to the roller support 172 .

The lifting unit 180 may move the display unit DP in the vertical direction in accordance with the driving of the roller unit 170 . The lifting unit 180 may include a link unit 181 , a head bar 182 , a slide rail 183 , a slider 184 , a motor 185 , and a rotating unit 186 .

The link unit 181 of the lifting unit 180 may include a plurality of links 181a and 181b and a hinge unit 181c connecting each of the plurality of links 181a and 181b. Specifically, the plurality of links 181a and 181b includes a first link 181a and a second link 181b, and the first link 181a and the second link 181b have a scissor shape. Crossing it, it may be rotatably fastened via the hinge portion 181c. Accordingly, when the link unit 181 moves in the vertical direction, each of the plurality of links 181a and 181b may rotate in a direction away from or closer to each other.

The head bar 182 of the lifting unit 180 may be fixed to the uppermost end of the display unit DP. The head bar 182 may be connected to the link unit 181 to move the display unit DP in the vertical direction according to the rotation of the plurality of links 181a and 181b of the link unit 181 . That is, the display unit DP may be moved in the vertical direction by the head bar 182 and the link unit 181 .

The head bar 182 covers only a portion of the surface adjacent to the uppermost edge of the display unit DP so as not to cover the image displayed on the front of the display unit DP. The display unit DP and the head bar 182 may be fixed with a screw, but is not limited thereto.

The slide rail 183 of the lifting unit 180 may provide a movement path of the plurality of links 181a and 181b. Some of the plurality of links 181a and 181b may be rotatably fastened to the slide rail 183 to guide movement along the trajectory of the slide rail 183 . Some of the plurality of links 181a and 181b are fastened to the slider 184 movably provided along the slide rail 183 to move along the trajectory of the slide rail 183 .

The motor 185 may be connected to a power generator such as a separate external power source or a built-in battery to receive power. In addition, the motor 185 may generate a rotational force to provide a driving force to the rotating unit 186 .

The rotating part 186 is connected to the motor 185 and is configured to convert the rotational motion from the motor 185 into a linear reciprocating motion. That is, the rotational motion of the motor 185 may be converted into a linear reciprocating motion of the structure fixed to the rotating unit 186 . For example, the rotating part 186 may be implemented as a ball screw including a shaft and a nut fastened to the shaft, but is not limited thereto.

The motor 185 and the rotating unit 186 may be interlocked with the link unit 181 to elevate the display unit DP. The link unit 181 is formed in a link structure, and by receiving driving force from the motor 185 and the rotating unit 186 , folding or unfolding operations may be repeatedly performed.

When the display unit DP is wound, the structure of the rotating unit 186 may linearly move as the motor 185 is driven. That is, a portion of the rotating part 186 to which one end of the second link 181b is connected may perform a linear motion. Accordingly, one end of the second link 181b may move toward the motor 185 , and the plurality of links 181a and 181b may be folded to reduce the height of the link unit 181 . In addition, while the plurality of links 181a and 181b are folded, the head bar 182 connected to the first link 181a is also lowered, and one end of the display unit DP connected to the head bar 182 is also lowered.

When the display unit DP is unwinding, as the motor 185 is driven, the structure of the rotating unit 186 may linearly move. That is, a portion of the rotating part 186 to which one end of the second link 181b is connected may perform a linear motion. Accordingly, one end of the second link 181b may move in a direction away from the motor 185 side, and the plurality of links 181a and 181b may be spread out to increase the height of the link unit 181 . In addition, while the plurality of links 181a and 181b is unfolded, the head bar 182 connected to the first link 181a also rises, and one end of the display unit DP connected to the head bar 182 also rises. .

Accordingly, when the display unit DP is fully wound on the roller 171 , the link unit 181 of the lifting unit 180 may maintain a folded state. That is, when the display unit DP is fully wound on the roller 171 , the lifting unit 180 may have the lowest height. When the display unit DP is fully unwound, the link unit 181 of the lifting unit 180 may maintain an unfolded state. That is, when the display unit DP is fully unwound, the lifting unit 180 may have the highest height.

Meanwhile, when the display unit DP is wound, the roller 171 may rotate, and the display unit DP may be wound around the roller 171 . Referring to FIG. 3 as an example, the lower edge of the display unit DP may be connected to the roller 171 . Also, when the roller 171 rotates in the second direction DR2 , that is, counterclockwise, the display unit DP may be wound while the rear surface of the display unit DP is in close contact with the surface of the roller 171 .

On the other hand, when unwinding the display unit DP, the roller 171 may rotate, and the display unit DP may be unwound from the roller 171 . Referring to FIG. 3 as an example, when the roller 171 rotates in the first direction DR1, that is, clockwise, the display unit DP wound on the roller 171 is unwound from the roller 171, and the housing unit It can be placed outside of (HP).

In some other embodiments, a driving unit MP having a structure other than the above-described driving unit MP may be applied to the display device 100 . That is, if the display unit DP can be wound and unwinded, the configuration of the above-described roller unit 170 and the elevating unit 180 may be changed, some components may be omitted, or other components may be further added. .

4 is a plan view of a display unit of the display device according to the first exemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along line I-I' of FIG. 4 .

6A and 6B are plan views schematically illustrating a display unit of a display device according to a first exemplary embodiment of the present invention.

FIG. 7 is an enlarged perspective view along the box B1 of FIG. 6B .

For example, FIG. 6A shows the flexible film 130 and the printed circuit board 150 before they are fastened to the display panel 120 , and FIG. 6B shows the flexible film 130 and the printed circuit board 150 on the display panel 120 . It shows after the circuit board 150 is fastened.

Hereinafter, the display device 100 according to the first embodiment of the present invention will be described as a bottom emission type.

4 to 7 , the display unit DP may include a back cover 110 , a display panel 120 , a flexible film 130 , and a printed circuit board 135 .

Hereinafter, the display device 100 according to the first embodiment of the present invention will be described with reference to FIGS. 4 to 7 , but with reference to the drawings showing detailed configurations thereof.

The display panel 120 according to the first exemplary embodiment includes a display area AA and a non-display area NA.

For convenience, the non-display area NA may be defined as an area excluding the display area AA.

The display area AA may be disposed in the central portion of the display panel 120 , and may be an area in which an image is displayed in the flexible display device 100 .

A display element and various driving elements for driving the display element may be disposed in the display area AA. For example, the display device may include a light emitting device 140 including a first electrode 141 , a light emitting layer 142 , and a second electrode 143 . In addition, various driving devices such as a transistor 150 , a capacitor, and a wiring for driving the display device may be disposed in the display area AA.

A plurality of sub-pixels PX may be included in the display area AA.

The sub-pixel PX is a minimum unit constituting a screen, and each of the plurality of sub-pixels PX may include a light emitting device 140 and a driving device. In addition, the driving device may include a switching transistor, a driving transistor 150 , and the like. The driving device may be electrically connected to a signal line such as a gate line or a data line connected to a gate driver and a data driver disposed in the non-display area NA. A more detailed structure of the sub-pixel PX will be described later with reference to FIG. 5 .

The plurality of sub-pixels PX may be defined as an intersection area of a plurality of gate lines disposed in a first direction and a plurality of data lines disposed in a second direction different from the first direction. Here, the first direction may be the horizontal direction of FIG. 4 , and the second direction may be the vertical direction of FIG. 4 , but is not limited thereto. The plurality of sub-pixels PX may include, but is not limited to, a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel that emit light of different wavelengths.

The non-display area NA is located at the edge of the display panel 120 and may be an area in which no image is displayed. The non-display area NA may be disposed to surround the display area AA. Various components for driving the plurality of sub-pixels PX disposed in the display area AA may be disposed in the non-display area NA. For example, a driving IC 132 that supplies signals for driving the plurality of sub-pixels PX, a driving circuit, a signal wire, and the flexible film 130 may be disposed. In this case, the driving IC 132 may include a gate driver, a data driver, and the like. The gate driver and the data driver may be implemented as transistors. The driving IC 132 and the driving circuit are GIP (Gate In Panel) method, COF (Chip On Film) method, TAB (Tape Automated Bonding) method, TCP (Tape Carrier Package) method, COG (Chip On Glass) method or display It may be arranged in a way such as to be integrated on the panel 120 .

The non-display area NA includes a pad area. For example, the pad area may be disposed at the lower end of the display panel 120 . The pad area may include a plurality of first pads P1 and a signal line connected to the plurality of first pads P1 . The driving IC 132 , the driving circuit, or the flexible film 130 may be connected to the pad region through the plurality of first pads P1 . The driving IC 132 , the driving circuit, or the flexible film 130 may transmit various driving signals, low potential voltages, high potential voltages, and the like to the plurality of first pads P1 .

The plurality of first pads P1 receives various driving signals for driving the flexible display device 100 and supplies them to components of the flexible display device 100 such as the plurality of sub-pixels PX, thereby providing a flexible display device. (100) can be driven.

In this case, the plurality of first pads P1 is a data pad for supplying a data signal to each of the plurality of sub-pixels PX, and a high voltage for supplying a high potential voltage to the first electrode 141 of the light emitting device 140 . The above power pad and a low potential power pad for supplying a low potential voltage to the second electrode 143 of the light emitting device 140 may be included.

In particular, referring to FIG. 4 , the back cover 110 may be disposed on the rear surface of the display panel 120 to support the display panel 120 , at least one flexible film 130 , and the printed circuit board 135 . have. The size of the back cover 110 may be larger than the size of the display panel 120 . The back cover 110 may protect other components of the display unit DP from the outside.

Although the back cover 110 is formed of a material having rigidity, at least a portion of the back cover 110 may have flexibility to be wound or unwound together with the display panel 120 . For example, the back cover 110 may be made of a metal material such as SUS (Steel Use Stainless) or Invar, or a material such as plastic. However, as long as the material of the back cover 110 satisfies physical property conditions such as thermal deformation, radius of curvature, and rigidity, it may be variously changed according to design, but is not limited thereto.

The back cover 110 may include a plurality of support areas PA and a plurality of flexible areas MA. The plurality of support areas PA is an area in which the plurality of openings 111 are not disposed, and the plurality of flexible areas MA is an area in which the plurality of openings 111 are disposed. Specifically, from the top of the back cover 110 , the first support area PA1 , the first flexible area MA1 , the second support area PA2 , the second flexible area MA2 , and the third support area PA3 ) These may be arranged sequentially. However, the present invention is not limited thereto. In this case, since the back cover 110 is wound or unwound in the column direction, the plurality of support areas PA and the plurality of flexible areas MA may be disposed along the column direction.

The first support area PA1 is an uppermost area of the back cover 110 , and is an area coupled to the head bar 182 . A first fastening hole AH1 may be formed in the first support area PA1 to be fastened to the head bar 182 . For example, the head bar 182 and the first support area PA1 of the back cover 110 may be coupled to each other through a screw passing through the head bar 182 and the first fastening hole AH1 . And, as the first support area PA1 is fastened to the head bar 182 , when the link unit 181 coupled to the head bar 182 rises or falls, the back cover 110 is also raised or lowered. Also, the display panel 120 attached to the back cover 110 may be raised or lowered together. Although it is illustrated in FIG. 4 that there are five first fastening holes AH1 , the number of first fastening holes AH1 is not limited thereto. In addition, although it has been described in FIG. 4 that the back cover 110 is fastened to the head bar 182 using the first fastening hole AH1, the present invention is not limited thereto, and the back cover 110 and the head without a separate fastening hole. The bar 182 may be fastened.

The first flexible area MA1 is an area extending from the first support area PA1 to the lower side of the back cover 110 . The first flexible area MA1 is an area in which the plurality of openings 111 may be disposed and the display panel 120 is attached. Specifically, the first flexible area MA1 is an area that is wound or unwound by the roller 171 together with the display panel 120 . The first flexible area MA1 may overlap at least the display panel 120 among other components of the display unit DP.

Also, the second support area PA2 is an area extending from the first flexible area MA1 to the lower side of the back cover 110 . At least one flexible film 130 and a printed circuit board 135 connected to one end of the display panel 120 and one end of the display panel 120 may be disposed in the second support area PA2 . 4 illustrates an example in which the plurality of flexible films 130 and the printed circuit board 135 are disposed on the upper surface of the second support area PA2, but the present invention is not limited thereto. Meanwhile, the printed circuit board 135 may be disposed on the rear surface of the back cover 110 .

In order to protect the at least one flexible film 130 and the printed circuit board 135 in the second support area PA2 of the present invention, the at least one flexible film 130 and the printed circuit board 135 are formed by a roller 171 . ) can be supported to keep it flat without being bent.

Also, when the second support area PA2 is wound around the roller 171 , a portion of the outer peripheral surface of the roller 171 in contact with the second support area PA2 may be flat. Accordingly, the second support area PA2 always maintains a flat state regardless of the state in which it is wound or unwound by the roller 171 , and at least one flexible film 130 disposed in the second support area PA2 . and the printed circuit board 135 may also maintain a flat state.

Also, the second flexible area MA2 is an area extending from the second support area PA2 to the lower side of the back cover 110 . The second flexible area MA2 is an area in which the plurality of openings 111 are disposed and the display area AA of the display panel 120 is extended to be disposed outside the housing unit HP. That is, for example, when the back cover 110 and the display panel 120 are in a fully unwound state, at least one flexible film 130 and Up to the second support area PA2 on which the printed circuit board 135 is disposed may be disposed inside the housing part HP, and the first flexible area MA1 to which the display panel 120 is attached may be disposed on the housing part HP. ) can be placed outside the That is, when the display panel 120 is in the fully unwound state, the third support area PA3 , the second flexible area MA2 , and the second support area PA2 fixed to the roller 171 are formed by the housing part ( HP).

If the length from the third support area PA3 to the second support area PA2 is shorter than the length from the third support area PA3 to the opening HPO of the housing unit HP, the display panel 120 ) to which a portion of the first flexible area MA1 is attached may be disposed inside the housing unit HP, and a portion of a lower portion of the display area AA of the display panel 120 may be disposed inside the housing unit HP. , video viewing may be difficult. Accordingly, the length from the third support area PA3 fixed to the roller 171 to the second flexible area MA2 and the second support area PA2 is the third support area PA3 fixed to the roller 171 . It may be designed to be the same as the length from to the opening HPO of the housing part HP. However, the present invention is not limited thereto.

Also, the third supporting area PA3 is an area extending from the second flexible area MA2 to the lower side of the back cover 110 . The third support area PA3 is a lowermost area of the back cover 110 and is an area coupled to the roller 171 . A second fastening hole AH2 may be formed in the third support area PA3 for fastening with the roller 171 . For example, a screw passing through the roller 171 and the second fastening hole AH2 may be disposed so that the roller 171 and the third support area PA3 of the back cover 110 may be fastened. Also, as the third support area PA3 is fastened to the roller 171 , the back cover 110 may be wound or unwound around the roller 171 . Although it is illustrated that there are two second fastening holes AH2 in FIG. 4 , the number of second fastening holes AH2 is not limited thereto.

Meanwhile, the plurality of openings 111 as formed in the plurality of flexible areas MA are not formed in the first support area PA1 , the second support area PA2 , and the third support area PA3 . Specifically, only the first fastening hole AH1 and the second fastening hole AH2 are formed only in the first support area PA1 and the third support area PA3, respectively, and the first support area PA1 and the second support area PA3 The plurality of openings 111 as formed in the plurality of flexible areas MA are not formed in the support area PA2 and the third support area PA3 . The shape of the first fastening hole AH1 and the second fastening hole AH2 is different from that of the plurality of openings 111 . The first support area PA1 is an area fixed to the head bar 182 , the second support area PA2 is an area where at least one flexible film 130 and the printed circuit board 135 are supported, and the third The support area PA3 is an area fixed to the roller 171 and may have more rigidity than the plurality of flexible areas MA.

As the first support area PA1 , the second support area PA2 , and the third support area PA3 have rigidity, the first support area PA1 and the third support area PA3 are formed by the head bar 182 . ) and the roller 171 may be firmly fixed. In addition, the second support area PA2 supports the at least one flexible film 130 and the printed circuit board 135 by keeping the at least one flexible film 130 and the printed circuit board 135 flat without being bent. can protect Accordingly, the display unit DP is fixed to the roller 171 and the head bar 182 of the driving unit MP, and may be moved to the inside or outside of the housing unit HP according to the operation of the driving unit MP, and at least One flexible film 130 and the printed circuit board 135 may be protected.

Meanwhile, in FIG. 4 , for example, it is illustrated that the plurality of support areas PA and the plurality of flexible areas MA of the back cover 110 are sequentially disposed along the column direction, but the back cover 110 is When winding in the row direction, the plurality of support areas PA and the plurality of flexible areas MA may be disposed along the row direction.

When the display unit DP is wound or unwound, the plurality of openings 111 disposed in the plurality of flexible areas MA of the back cover 110 may be deformed by stress applied to the display unit DP. Specifically, when the display unit DP is wound or unwound, the plurality of flexible areas MA of the back cover 110 may be deformed as the plurality of openings 111 contract or expand. Also, as the plurality of openings 111 contract or expand, the display panel 120 minimizes the slip phenomenon of the display panel 120 disposed on the plurality of flexible areas MA of the back cover 110 . The stress applied to it, that is, the stress can be minimized.

Meanwhile, when the display panel 120 and the back cover 110 are wound, the length of the display panel 120 wound around the roller 171 due to a difference in curvature radii between the display panel 120 and the back cover 110 . and the length of the back cover 110 is different. For example, when the back cover 110 and the display panel 120 are wound on the roller 171 , the length required for the back cover 110 and the display panel 120 to be wound around the roller 171 one turn is may be different. That is, since the display panel 120 is disposed outside the back cover 110 with respect to the roller 171 , for example, the length required for the display panel 120 to be wound around the roller 171 once is, The back cover 110 may be longer than a length required to be wound on the roller 171 once. As such, when the display unit DP is wound, the lengths of the back cover 110 and the display panel 120 are different due to the difference in the radius of curvature, and the display panel 120 attached to the back cover 110 is It can also slide and move from its original position. In this case, a phenomenon in which the display panel 120 slides from the back cover 110 due to the difference in the radius of curvature and the stress generated by the winding may be defined as a slip phenomenon. If the slip becomes excessively large, the display panel 120 may be detached from the back cover 110 , or defects such as cracks may occur.

In the display device 100 according to the first embodiment of the present invention, even when the display unit DP is wound or unwound and stress is applied to the display unit DP, the plurality of openings 111 of the back cover 110 are flexible. is deformed to relieve stress applied to the back cover 110 and the display panel 120 . For example, when the back cover 110 and the display panel 120 are wound on the roller 171 along the column direction, a stress that deforms the back cover 110 and the display panel 120 in the vertical direction may be applied. have. In this case, the plurality of openings 111 of the back cover 110 may extend in the vertical direction of the back cover 110 , and the length of the back cover 110 may also be flexibly deformed. Accordingly, the length difference between the back cover 110 and the display panel 120 due to the difference in the radius of curvature in the process of winding the back cover 110 and the display panel 120 is calculated by the plurality of openings 111 of the back cover 110 . can compensate. In addition, when the back cover 110 and the display panel 120 are wound, the plurality of openings 111 are deformed, so that stress applied from the back cover 110 to the display panel 120 may also be relieved.

4 to 7 , the display panel 120 may be disposed on the upper surface of the back cover 110 . For example, on the upper surface of the back cover 110 , the display panel 120 may be disposed in the first flexible area MA1 .

The display panel 120 is a panel for displaying an image to a user. In the display panel 120 , a display element for displaying an image, a driving element for driving the display element, the display element, and wiring for transmitting various signals to the driving element may be disposed.

The display element may be defined differently depending on the type of the display panel 120 . For example, when the display panel 120 is the organic light emitting display panel 120 , the display device is the organic light emitting device 140 including a first electrode 141 , a light emitting layer 142 , and a second electrode 143 . can be For example, when the display panel 120 is a liquid crystal display panel, the display device may be a liquid crystal display device. Hereinafter, it is assumed that the display panel 120 is an organic light emitting display panel, for example, but the display panel 120 is not limited to the organic light emitting display panel. Also, since the display device 100 according to the first exemplary embodiment is a rollable display device, the display panel 120 may be implemented as a flexible display panel to be wound or unwound on the roller 171 .

As described above, the display panel 120 may include a display area AA and a non-display area NA.

The display area AA is an area in which an image is displayed on the display panel 120 . A plurality of sub-pixels SPX constituting the plurality of pixels and a driving circuit for driving the plurality of sub-pixels SPX may be disposed in the display area AA.

The plurality of sub-pixels SPX is a minimum unit constituting the display area AA, and a display element may be disposed in each of the plurality of sub-pixels SPX. For example, the organic light-emitting device 140 including the first electrode 141 , the emission layer 142 , and the second electrode 143 may be disposed in each of the plurality of sub-pixels SPX, but is limited thereto. no. In addition, a driving circuit for driving the plurality of sub-pixels SPX may include a driving element and wiring. For example, the driving circuit may be formed of a thin film transistor, a storage capacitor, a gate line, a data line, and the like, but is not limited thereto.

The non-display area NA is an area in which an image is not displayed. Various wirings and circuits for driving the organic light emitting device of the display area AA may be disposed in the non-display area NA. For example, in the non-display area NA, a link wire for transferring signals to the plurality of sub-pixels SPX of the display area AA and a driving circuit, or a driving IC 132 such as a gate driver IC or a data driver IC , at least one flexible film 130 and the like may be disposed, but is not limited thereto. A pad part may be positioned in the non-display area NA under the display panel 120 .

As described above, at least one flexible film 130 may be disposed on the second support area PA2 of the back cover 110 . In the at least one flexible film 130 , various components such as a driving IC 132 are disposed on a flexible base film 131 to transmit signals to a plurality of sub-pixels SPX and a driving circuit of the display area AA. As a film for supplying, it may be electrically connected to the display panel 120 .

One end of the at least one flexible film 130 is disposed in the non-display area NA of the display panel 120 to transmit a power voltage, a data voltage, etc. to the plurality of sub-pixels SPX and a driving circuit of the display area AA. can supply

A driving IC 132 such as a gate driver IC and a data driver IC may be disposed on the flexible film 130 . The driving IC 132 is a component that processes data for displaying an image and a driving signal for processing the data. The driving IC 132 may be disposed in a manner such as a Chip On Glass (COG), a Chip On Film (COF), a Tape Carrier Package (TCP), etc. depending on a mounting method. have. However, for convenience of description, it has been described that the driving IC 132 is a chip-on-film method mounted on at least one flexible film 130 , but is not limited thereto.

The printed circuit board 135 may be disposed on the rear surface of the second support area PA2 of the back cover 110 to be connected to the at least one flexible film 130 . The printed circuit board 135 is a component that supplies a signal to the driving IC 132 . Various components for supplying various signals such as a driving signal and a data signal to the driving IC 132 may be disposed on the printed circuit board 135 .

Meanwhile, an additional printed circuit board connected to the printed circuit board 135 may be further disposed. For example, the printed circuit board 135 is referred to as a source printed circuit board (S-PCB) on which the data driver is mounted, and the additional printed circuit board connected to the printed circuit board 135 is a timing controller (timing controller). controller) may be referred to as a control printed circuit board (C-PCB) on which the like is mounted. For example, the additional printed circuit board may be disposed in the roller 171 , in the housing unit HP outside the roller 171 , or directly in contact with the printed circuit board 135 .

In particular, referring to FIG. 5 , the display panel 120 according to the first embodiment of the present invention may include a substrate 112 , a transistor 150 , a light emitting device 140 , and an encapsulation unit 115h.

The substrate 112 is a substrate for supporting various components of the display panel 120 . The substrate 112 may be made of a plastic material having flexibility. When the substrate 112 is made of a plastic material, it may be made of polyimide, but is not limited thereto.

A buffer layer 113 may be disposed on the substrate 112 . The buffer layer 113 may improve adhesion between the layers formed on the buffer layer 113 and the substrate 112 , and block alkali components leaking from the substrate 112 .

The buffer layer 113 may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or multiple layers of silicon nitride (SiNx) and silicon oxide (SiOx). However, the buffer layer 113 may be omitted. For example, the buffer layer 113 may be omitted based on the type and material of the substrate 112 , the structure and type of the transistor 150 , and the like.

The light blocking pattern LS may be disposed on the buffer layer 113 , but is not limited thereto. The light blocking pattern LS may serve to block light incident to the active layer 154 of the transistor 150 from below. The light blocking pattern LS may be omitted.

A first insulating layer 115a may be disposed on the light blocking pattern LS.

The first insulating layer 115a may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or multiple layers of silicon nitride (SiNx) and silicon oxide (SiOx).

The transistor 150 may be disposed on the first insulating layer 115a.

The transistor 150 may include an active layer 154 , a gate electrode 151 , a drain electrode 153 , and a source electrode 152 . For example, the transistor 150 illustrated in FIG. 5 is a driving transistor and a thin film transistor having a top gate structure in which the gate electrode 151 is disposed on the active layer 154 . However, the present invention is not limited thereto, and the transistor 150 may be implemented as a thin film transistor having a bottom gate structure.

The active layer 154 may be formed of an oxide semiconductor, amorphous silicon, or polycrystalline silicon, but is not limited thereto. In this case, polycrystalline silicon has better mobility than amorphous silicon, so it has low energy consumption and excellent reliability, so it can be applied to a driving transistor in a pixel.

Oxide semiconductors have excellent mobility and uniformity. The oxide semiconductor is an indium tin gallium zinc oxide (InSnGaZnO)-based material as a quaternary metal oxide, an indium gallium zinc oxide (InGaZnO)-based material as a ternary metal oxide, an indium tin zinc oxide (InSnZnO)-based material, and a tin gallium zinc oxide (SnGaZnO)-based material. )-based material, aluminum gallium zinc oxide (AlGaZnO)-based material, indium aluminum zinc oxide (InAlZnO)-based material, tin aluminum zinc oxide (SnAlZnO)-based material, binary metal oxide indium zinc oxide (InZnO)-based material, tin zinc Oxide (SnZnO)-based material, aluminum zinc oxide (AlZnO)-based material, zinc magnesium oxide (ZnMgO)-based material, tin magnesium oxide (SnMgO)-based material, indium magnesium oxide (InMgO)-based material, indium gallium oxide (InGaO)-based material It may be composed of a material, an indium oxide (InO)-based material, a tin oxide (SnO)-based material, or a zinc oxide (ZnO)-based material, and the composition ratio of each element is not limited.

The active layer 154 may include a source region including p-type or n-type impurities, a drain region, and a channel region between the source and drain regions, and a channel region. A lightly doped region may be further included between the source region and the drain region adjacent to the region.

In this case, the source region and the drain region are regions doped with a high concentration of impurities, and the source electrode 152 and the drain electrode 153 of the transistor 150 may be connected to each other.

The impurity ion may use a p-type impurity or an n-type impurity, and the p-type impurity may be one of boron (B), aluminum (Al), gallium (Ga), and indium (In), and the n-type impurity is phosphorus ( P), arsenic (As) and antimony (Sb) may be one.

The active layer 154 may be doped with an n-type impurity or a p-type impurity depending on the structure of the NMOS or PMOS transistor, and the transistor included in the flexible display device 100 according to the first exemplary embodiment of the present invention. is applicable to NMOS or PMOS transistors.

The second insulating layer 115b is a gate insulating layer made of a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or multiple layers thereof, and the current flowing through the active layer 154 flows to the gate electrode 151 . It may be disposed on the active layer 154 so as not to go there. Silicon oxide has lower ductility than metal, but has superior ductility compared to silicon nitride, and may be formed in a single layer or in multiple layers depending on its characteristics.

The gate electrode 151 serves as a switch that turns on or off the transistor 150 based on an electric signal transmitted from the outside through the gate line, and is a conductive metal. Copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd) It may be composed of multiple layers, but is not limited thereto.

The source electrode 152 and the drain electrode 153 are connected to the data line, and serve to transmit an external electric signal from the transistor 150 to the light emitting device 140 . The source electrode 152 and the drain electrode 153 are conductive metals such as copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and a metal material such as neodymium (Nd) or an alloy thereof may be configured as a single layer or multiple layers, but is not limited thereto.

In order to insulate the gate electrode 151, the source electrode 152, and the drain electrode 153 from each other, a third insulating layer 115c composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) is gated. The electrode 151 may be disposed between the source electrode 152 and the drain electrode 153 .

In this case, the second insulating layer 115b and the third insulating layer 115c have a contact for electrically connecting the drain electrode 153 and the source electrode 152 to the drain region and the source region of the active layer 154 , respectively. A hole may be formed.

A passivation layer including an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the transistor 150 .

The passivation layer may serve to prevent unnecessary electrical connection between components disposed above and below the passivation layer and to prevent contamination or damage from the outside, and the configuration and characteristics of the transistor 150 and the light emitting device 140 . may be omitted accordingly.

The transistor 150 may be classified into an inverted staggered structure and a coplanar structure according to positions of components constituting the transistor 150 . For example, in the transistor of the inverted staggered structure, the gate electrode may be positioned opposite the source electrode and the drain electrode with respect to the active layer. Meanwhile, as shown in FIG. 5 , in the transistor 150 having a coplanar structure, the gate electrode 151 may be positioned on the same side as the source electrode 152 and the drain electrode 153 with respect to the active layer 154 .

For convenience of description, only a driving transistor is illustrated among various transistors that may be included in the flexible display device 100 , and other switching transistors and capacitors may also be included in the flexible display device 100 .

In this case, when a signal is applied from the gate line, the switching transistor transfers the signal from the data line to the gate electrode 151 of the driving transistor 150 . The driving transistor 150 may transmit a current transmitted through the power wiring according to a signal received from the switching transistor to the first electrode 141 , and may control light emission by the current transmitted to the first electrode 141 . .

In addition, a parasitic capacitance generated between the transistor 150 and the gate line and the data line and the light emitting device 140 is protected by protecting the transistor 150 and reducing a step caused by the transistor 150 . In order to reduce , planarization layers 115d and 115e may be disposed on the transistor 150 .

The planarization layers 115d and 115e are made of acrylic resin, epoxy resin, polyamides resin, polyimides resin, and unsaturated polyesters resin. , phenolic resin, polyphenylenesulfides resin, polyphenylene resin, and benzocyclobutene may be formed of at least one material selected from the group consisting of, but not limited to.

The flexible display device 100 according to the first exemplary embodiment may include a first planarization layer 115d and a second planarization layer 115e sequentially stacked. That is, the first planarization layer 115d may be disposed on the transistor 150 , and the second planarization layer 115e may be disposed on the first planarization layer 115d.

A buffer layer may be disposed on the first planarization layer 115d. The buffer layer may be composed of multiple layers of silicon oxide (SiOx) to protect the components disposed on the first planarization layer 115d, and may be omitted depending on the configuration and characteristics of the transistor 150 and the light emitting device 140 . can

The light emitting device 140 may be disposed on the first planarization layer 115d.

Meanwhile, FIG. 5 illustrates an example in which the intermediate electrode 125 is electrically connected to the transistor 150 through a contact hole formed in the first planarization layer 115d, but is not limited thereto. . In this case, the intermediate electrode 125 may be stacked to be connected to the transistor 150 so that the data line may also have a multilayer structure. However, the present invention is not limited thereto.

In this case, the data line may be formed in a structure in which a lower layer made of the same material as the source electrode 152 and the drain electrode 153 and an upper layer made of the same material as the intermediate electrode 125 are connected. That is, the data line may be implemented in a structure in which two layers are connected in parallel to each other, and in this case, wiring resistance of the data line may be reduced.

Meanwhile, a passivation layer including an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the first planarization layer 115d and the intermediate electrode 125 . The passivation layer may serve to prevent unnecessary electrical connection between components and to prevent contamination or damage from the outside, and may be omitted depending on the configuration and characteristics of the transistor 150 and the light emitting device 140 .

When the intermediate electrode 125 and the second planarization layer 115e are provided, the light emitting device 140 may be disposed on the second planarization layer 115e.

The light emitting device 140 may include a first electrode 141 , a light emitting unit 142 , and a second electrode 143 .

The first electrode 141 serving as an anode may be disposed on the second planarization layer 115e.

The first electrode 141 is an electrode serving to supply holes to the light emitting unit 142 , and is electrically connected to the transistor 150 by being connected to the intermediate electrode 125 through a contact hole in the second planarization layer 115e. can be connected to

The first electrode 141 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), or the like, which are transparent conductive materials, but is not limited thereto.

When the flexible display device 100 is a top emission type in which light is emitted to an upper portion on which the second electrode 143 is disposed, the emitted light is reflected from the first electrode 141 to more smoothly the second electrode 143 . A reflective layer may be further included so that the electrode 143 may be emitted in an upper direction.

That is, the first electrode 141 may have a two-layer structure in which a transparent conductive layer and a reflective layer made of a transparent conductive material are sequentially stacked, or a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked, and the reflective layer is It may be silver (Ag) or an alloy containing silver.

The bank 115f disposed on the first electrode 141 and the second planarization layer 115e may define a sub-pixel PX by dividing an area that actually emits light. After photoresist is formed on the first electrode 141 , the bank 115f may be formed by photolithography. The photoresist refers to a photosensitive resin whose solubility in a developer is changed by the action of light, and a specific pattern can be obtained by exposing and developing the photoresist.

In order to form the light emitting part 142 of the light emitting device 140 , a fine metal mask (FMM) that is a deposition mask may be used.

In addition, in order to prevent damage that may be caused by contact with the deposition mask disposed on the bank 115f and to maintain a constant distance between the bank 115f and the deposition mask, a spacer 115g is disposed on the bank 115f. ) can also be placed. The spacer 115g may be formed of any one of polyimide, photoacryl, and benzocyclobutene (BCB), which are transparent organic materials.

The light emitting part 142 may be disposed between the first electrode 141 and the second electrode 143 .

The light emitting unit 142 serves to emit light, and includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL), and an electron injection layer. At least one layer of an Electron Injection Layer (EIL) may be included, and some components may be omitted depending on the structure or characteristics of the flexible display device 100 . Here, it is also possible to apply an electroluminescent layer and an inorganic light emitting layer as the light emitting layer.

The hole injection layer is disposed on the first electrode 141 to facilitate hole injection.

The hole transport layer is disposed on the hole injection layer to smoothly transfer holes to the light emitting layer.

The light emitting layer is disposed on the hole transport layer and includes a material capable of emitting light of a specific color to emit light of a specific color. In addition, the light emitting material may be formed using a phosphorescent material or a fluorescent material.

An electron injection layer may be further disposed on the electron transport layer. The electron injection layer is an organic layer that facilitates injection of electrons from the second electrode 143 , and may be omitted depending on the structure and characteristics of the flexible display device 100 .

On the other hand, by disposing an electron blocking layer or a hole blocking layer that blocks the flow of holes or electrons in a position adjacent to the light emitting layer, when electrons are injected into the light emitting layer, they move from the light emitting layer to the hole transport layer When passing or holes are injected into the light emitting layer, the light emitting efficiency can be improved by preventing a phenomenon from moving in the light emitting layer and passing through the electron transport layer.

The second electrode 143 serving as a cathode is disposed on the light emitting unit 142 and serves to supply electrons to the light emitting unit 142 . Since the second electrode 143 needs to supply electrons, it may be made of a metal material such as magnesium (Mg), silver-magnesium (Ag:Mg), which is a conductive material having a low work function, but is not limited thereto.

When the flexible display device 100 is a top emission type, the second electrode 143 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), or zinc oxide. It may be a transparent conductive oxide of (Zinc Oxide; ZnO) and Tin Oxide (TO) series.

An encapsulation part 115h may be disposed on the light emitting device 140 . The encapsulation part 115h may serve to prevent the light emitting device 140 and the transistor 150 underneath it from being oxidized or damaged due to moisture, oxygen, or impurities introduced from the outside.

5 to 7 , as an example, the encapsulation unit 115h may include an adhesive layer 128 and an encapsulation substrate 129 .

The adhesive layer 128 may be disposed on the inorganic insulating layer.

The adhesive layer 128 prevents the penetration of moisture from the outside, or even if moisture penetrates into the adhesive layer 128 , the light emitting device 140 formed on the substrate 112 by the moisture absorption properties of the adhesive layer 128 is protected from moisture. can protect The adhesive layer 128 may have a single-layer structure or a multi-layer structure.

The encapsulation substrate 129 also serves to prevent penetration of external moisture or air. The encapsulation substrate 129 may be a PET substrate, a metal foil, or the like.

The barrier film 126 may be disposed under the display panel 120 configured as described above. Also, a polarizing plate 127 may be disposed under the barrier film 126 .

The polarizing plate 127 may suppress reflection of external light on the display panel 120 . When the flexible display device 100 is used outside, external natural light is introduced and reflected by the reflective layer included in the first electrode 141 of the light emitting device 140 or disposed under the light emitting device 140 . It can be reflected by electrodes made of metal. An image of the flexible display device 100 may not be easily recognized by the reflected lights. The polarizing plate 127 polarizes light introduced from the outside in a specific direction, and prevents the reflected light from being emitted to the outside of the flexible display device 100 again.

The polarizing plate 127 may be a polarizing plate composed of a polarizer and a protective film protecting it, or may be formed by coating a polarizing material for flexibility.

Meanwhile, a plurality of first pads P1 may be disposed on the substrate 112 in the non-display area NA. In this case, the plurality of first pads P1 are conductive components for transmitting various signals from the flexible film 130 to the display unit DP and the driving unit.

The plurality of first pads P1 may transmit various signals such as a data signal, a high potential voltage, a low potential voltage, and a clock signal through wiring. The plurality of first pads P1 may be formed on various insulating layers that may be disposed in the non-display area NA, for example, an inorganic insulating layer.

The flexible film 130 may be disposed in the non-display area NA of the substrate 112 . The flexible film 130 is a film in which various components such as a driving IC 132 are disposed on a flexible base film 131 . The flexible film 130 is a film for supplying signals to a plurality of sub-pixels SP and circuits of the display area AA, and the second pad P2 of the flexible film 130 is disposed on the substrate 112 . It may be electrically connected to the first pad P1. The flexible film 130 is disposed at one end of the non-display area NA and supplies a data signal, a high potential voltage, a low potential voltage, and a clock signal to the plurality of sub-pixels SP and circuits of the display area AA. .

A conductive adhesive layer 117 may be disposed between the substrate 112 and the flexible film 130 . At this time, the conductive adhesive layer 117 fixes the substrate 112 and the flexible film 130 , and electrically connects the first pad P1 on the substrate 112 and the second pad P2 of the flexible film 130 . can be connected The conductive adhesive layer 117 may, for example, be formed in a form in which a plurality of conductive particles 118 are dispersed in an adhesive material, and may be formed of an anisotropic conductive film (ACF). The substrate 112 and the flexible film 130 may be fixed by the adhesive material of the conductive adhesive layer 117 , and the first pad P1 and the second pad P2 through an electrical path formed by the conductive particles 118 . ) can be electrically connected.

Meanwhile, in the rollable display device using a flexible substrate, the display device 100 according to the first embodiment of the present invention minimizes cracks in the display panel 120 during rolling and reduces defects caused by the micro-sealing layer. In order to prevent this in advance, extending the encapsulation parts 128 and 129 to the non-display area NA of the substrate 112 on which the first pad P1 is positioned and exposing the first pad P1 to the outside is prevented. characterized. Accordingly, according to the present invention, it is possible to minimize cracks in the display panel 120 and damage to the flexible film 130 that occur during rolling, thereby solving the problems of driving failure and reliability of the display panel 120 .

Also, according to the present invention, by removing the micro-sealing layer in a rollable display device using a flexible substrate, cracks and contact pad opening defects due to the micro-sealing layer can be prevented. In addition, the module process can be simplified by removing the micro-sealing layer, which will be described in detail through the following comparative example.

8A and 8B are plan views illustrating a display unit according to a comparative example.

9 is an enlarged perspective view taken along the box B2 of FIG. 8B .

8A, 8B, and 9 show a comparative example in which the sealing parts 28 and 29 open the first pad P1. For convenience, the same reference numerals are used for the same components, and descriptions thereof will be omitted. In addition, illustration of the micro-sealing layer 19 is omitted in FIGS. 8A and 8B for convenience.

8A, 8B, and 9 , in the display unit according to the comparative example, since the encapsulation units 28 and 29 are provided only in the display area of the display panel 20 , the non-display area of the substrate 112 is exposed to the outside. will become

That is, in order to realize a rollable display device using a flexible substrate, the encapsulation units 28 and 29 are applied to the upper portion of the display panel 20 , and the substrate 112 exposed to the outside of the encapsulation units 28 and 29 is curled. A micro-sealing layer 19 is applied to the space between the flexible film 30 and the encapsulation parts 28 and 29 in order to prevent .

For reference, in the flexible film 30 , various components such as the driving IC 32 are disposed on the flexible base film 31 .

The metal encapsulation substrate 29 blocks moisture permeation to the front surface of the encapsulation substrate 29 at a level at which the WVTR (Water Vapor Transmission Rate) characteristic, which is a moisture permeability resistance, converges to 0, and by securing a long side vapor permeation path, the upper moisture permeability reliability can be ensured.

Due to the characteristics of the CTE (Coefficient of Thermal Expansion) of the transparent PI material, thermal expansion occurs during a high-temperature TFT process. For this reason, when the PI substrate 112 is separated from the glass through the laser lift-off process, there is a problem in that the PI substrate 112 located outside the encapsulation substrate 29 has a radius of curvature of several R levels and is dried. Therefore, in order to solve this problem, a liquid seal material is applied and UV-cured on the substrate 112 located outside the encapsulation substrate 29 by applying a micro seal process after the TAB attachment process.

In addition, when the area of the substrate 112 outside the encapsulation substrate 29 is too narrow, curling occurs even when the micro-sealing layer 19 is formed, so the bezel printing process and the film lamination process after the laser lift-off process This may be impossible.

In addition, in order to implement a rollable display device, reliability must be secured even for tens of thousands of rolling, but in the case of the comparative example, cracks occur in the PI substrate 112 and the inorganic film in the routing part and the GIP part of the display panel 20 . confirmed that.

This causes a sudden change in stress at the boundary between the encapsulation substrate 29 and the adhesive layer 28, and propagates a strong tensile stress to the substrate 112 and the inorganic film on which the most brittle inorganic film is located in the region. Doing so will cause cracks.

In addition, due to the characteristics of the rollable display device, the PI substrate 112 has a thickness of 10 μm, and has very weak properties compared to the encapsulation substrate 29 applied as the encapsulation parts 28 and 29 thereon. Therefore, after the glass under the substrate 112 is detached through the laser lift-off process, the substrate 112 exposed to the outside of the encapsulation substrate 29 is highly likely to be bent or damaged during handling or transport, and As a result, cracks are induced in the substrate 112 and the inorganic layer in the outer region of the encapsulation substrate 29 .

In addition, due to the structure of the rollable display device, in a glass ledger state, organic material deposition and a cutting process are performed on the substrate to which the encapsulation parts 28 and 29 are attached to separate cells in units of cells. Since the 112 is formed, the cutting process first cuts the substrate 112 and then cuts the lower glass secondarily. However, there is a tolerance in these processes, and cracks already exist in the state of the cell in which the two processes are finally completed, which acts as a crack that continues to propagate even after the post process and the module is completed, thereby reducing the reliability of the display panel 20 . will degrade

In addition, in the micro seal process, it is impossible to completely remove the air bubbles of the liquid seal material, and it is impossible for the coated and cured shape to have perfect flatness. Therefore, when the film lamination process is performed, cracks are generated from the cured region while the micro seal material has air bubbles, and the cracks are continuously propagated.

In addition, when the micro-seal process is performed on the substrate on which the TAB is attached, a defect in which the micro-seal is not applied to the lower area covered by the COF may occur. If there is a region where the micro seal is not applied, the substrate 112 in the region is dried after glass desorption through the laser lift-off process, and the bezel printing and film lamination processes, which are subsequent processes, are impossible.

Accordingly, an object of the present invention is to secure crack reliability during rolling by changing the structure of an encapsulation unit in a rollable display device using a flexible substrate, and to fundamentally prevent defects caused by the micro-sealing layer.

To this end, in the display device 110 according to the first embodiment of the present invention, the encapsulation parts 128 and 129 are extended to the non-display area NA of the substrate 112 on which the first pad P1 is located. , characterized in that the first pad P1 is exposed and connected to the flexible film 130 for driving. Accordingly, it is characterized in that the PI substrate 112 is not exposed to the outer regions of the encapsulation units 128 and 129 , for example, at least the pad region.

In addition, in the display device 110 according to the first embodiment of the present invention, a micro-sealing layer is not applied, and a groove or trench pattern for connection with the flexible film 130 is provided in the encapsulation portions 128 and 129 of the pad area. It is characterized in that it is provided with (T). Although the trench pattern T is illustrated in FIG. 7 as an example, the present invention is not limited thereto, and a groove may be provided.

Accordingly, according to the present invention, crack reliability of the rollable display device 100 can be secured. In addition, the present invention has the effect of improving edge cracks of the encapsulation units 128 and 129 of the rollable display device 100 and preventing crack propagation in the substrate 112 .

In addition, according to the present invention, encapsulation reliability of the rollable display device 100 is improved and a bezel size is reduced.

In addition, the present invention can prevent cracks and contact pad opening defects due to the micro-sealing layer by eliminating the micro-sealing process. In addition, as the micro-sealing layer is removed, the module process can be simplified.

10 is a cross-sectional view taken along line A-A' of FIG. 6B.

11 is a cross-sectional view taken along line C-C' of FIG. 6B.

10 illustrates, for example, a cross-section of the display unit in a state in which the back cover 110 is attached to the display panel 120 .

11 illustrates a cross-section of a pad area of the display panel 120 as an example.

10 and 11 , the display device 100 according to the first embodiment of the present invention includes a back cover 110 , a display panel 120 , a flexible film 130 , and a printed circuit board (not shown). can do.

The display panel 120 according to the first exemplary embodiment includes a display area AA and a non-display area NA.

For convenience, the non-display area NA may be defined as an area excluding the display area AA.

The display area AA may be disposed in the central portion of the display panel 120 , and may be an area in which an image is displayed in the flexible display device 100 .

A display element and various driving elements for driving the display element may be disposed in the display area AA.

The non-display area NA is located at the edge of the display panel 120 and may be an area in which no image is displayed. The non-display area NA may be disposed to surround the display area AA. Various components for driving the plurality of sub-pixels PX disposed in the display area AA may be disposed in the non-display area NA.

The non-display area NA includes a pad area. For example, the pad area may be disposed at the lower end of the display panel 120 . The pad area may include a plurality of first pads P1 and a signal line connected to the plurality of first pads P1 . The driving IC 132 , the driving circuit, or the flexible film 130 may be connected to the pad region through the plurality of first pads P1 . The driving IC 132 , the driving circuit, or the flexible film 130 may transmit various driving signals, low potential voltages, high potential voltages, and the like to the plurality of first pads P1 .

The back cover 110 may be disposed on the rear surface of the display panel 120 to support the display panel 120 . The size of the back cover 110 may be larger than the size of the display panel 120 . The back cover 110 may protect other components of the display unit DP from the outside.

Although the back cover 110 is formed of a material having rigidity, at least a portion of the back cover 110 may have flexibility to be wound or unwound together with the display panel 120 .

The back cover 110 may include a plurality of support areas PA and a plurality of flexible areas MA. The plurality of support areas PA is an area in which the plurality of openings 111 are not disposed, and the plurality of flexible areas MA is an area in which the plurality of openings 111 are disposed.

Meanwhile, the display panel 120 may include a substrate 112 , an adhesive layer 128 , an encapsulation substrate 129 , a barrier film 126 , and a polarizing plate 127 .

The substrate 112 is a base member for supporting various components of the display panel 120 , and may be formed of an insulating material. The substrate 112 may be made of a material having flexibility so that the display panel 120 is wound or unwound. For example, the substrate 112 may be made of a plastic material such as polyimide (PI).

A pixel unit 123 may be disposed on the upper surface of the substrate 112 . The pixel unit 123 may include a plurality of light emitting devices 140 and a circuit for driving the light emitting devices 140 . The pixel unit 123 may be disposed to correspond to the display area AA.

Depending on the direction in which the light emitted from the light emitting device 140 is emitted, the display panel 120 may be configured in a top emission method or a bottom emission method.

Hereinafter, for convenience of description, it is assumed that the display device 100 is a bottom-emission display device, but the present invention is not limited thereto.

An encapsulation layer 124 may be disposed to cover the pixel unit 123 .

The encapsulation layer 124 seals the light emitting device 140 of the pixel unit 123 .

The encapsulation layer 124 may serve to protect the light emitting device 140 of the pixel unit 123 from external moisture, oxygen, impact, and the like. The encapsulation layer 124 may be formed by alternately stacking a plurality of inorganic layers and a plurality of organic layers. For example, the inorganic layer may be made of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (AlOx), etc., and the organic layer may be an epoxy-based or acrylic-based polymer. It is not limited thereto.

An encapsulation substrate 129 may be disposed on the encapsulation layer 124 .

For example, the encapsulation substrate 129 may be disposed between the encapsulation layer 124 and the back cover 110 . The encapsulation substrate 129 may seal and protect the light emitting device 140 of the pixel unit 123 together with the encapsulation layer 124 .

The encapsulation substrate 129 may protect the light emitting device 140 of the pixel unit 123 from external moisture, oxygen, impact, or the like. For example, the encapsulation substrate 129 may be formed of a material having a high modulus of about 200 MPa to about 900 MPa.

The encapsulation substrate 129 has strong corrosion resistance and is made of a metal material such as aluminum (Al), nickel (Ni), chromium (Cr), an alloy of iron (Fe) and nickel, which is easy to process in a foil or thin film form. can be made with As the encapsulation substrate 129 is formed of a metallic material, the encapsulation substrate 129 can be implemented in an ultra-thin film form, and strong protection against external impact and scratches can be provided.

An adhesive layer 128 may be disposed between the encapsulation layer 124 and the encapsulation substrate 129 .

The adhesive layer 128 may adhere between the encapsulation layer 124 and the encapsulation substrate 129 . The adhesive layer 128 is made of a material having an adhesive property, and may be a thermosetting type or natural curing type adhesive. For example, the adhesive layer 128 may be formed of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), or the like, but is not limited thereto.

In this case, the adhesive layer 128 may be disposed to surround the encapsulation layer 124 and the pixel unit 123 . That is, the pixel unit 123 may be sealed by the encapsulation layer 124 , and the encapsulation layer 124 and the pixel unit 123 may be sealed by the adhesive layer 128 . The adhesive layer 128 may protect the light emitting device 140 of the pixel unit 123 from external moisture, oxygen, impact, etc. together with the encapsulation layer 124 and the encapsulation substrate 129 . In this case, the adhesive layer 128 may further include a moisture absorbent. The desiccant may be a particle having hygroscopicity, and may minimize penetration of moisture and oxygen into the pixel unit 123 by absorbing moisture and oxygen from the outside.

The adhesive layer 128 and the encapsulation substrate 129 are formed to extend from the display area AA to the non-display area NA except for the area where the first pad P1 is located.

That is, the adhesive layer 128 and the encapsulation substrate 129 according to the first embodiment of the present invention are formed to extend to the non-display area NA of the substrate 112 on which the first pad P1 is located, and the second 1 It is characterized in that the pad P1 is exposed to the outside. Accordingly, the adhesive layer 128 and the encapsulation substrate 129 may be formed on the entire surface of the display panel 120 excluding the region where the first pad P1 is located.

A groove H or a trench pattern exposing the first pad P1 may be formed in the pad area. Although the groove H is illustrated as an example in FIGS. 10 and 11 , the present invention is not limited thereto.

The flexible film 130 may be disposed in the non-display area NA of the display panel 120 on the encapsulation substrate 129 .

The flexible film 130 is a film for supplying signals to a plurality of sub-pixels SP and circuits of the display area AA, and the second pad P2 of the flexible film 130 is disposed on the substrate 112 . It may be electrically connected to the first pad P1. The flexible film 130 is disposed at one end of the non-display area NA and supplies a data signal, a high potential voltage, a low potential voltage, and a clock signal to the plurality of sub-pixels SP and circuits of the display area AA. .

A conductive adhesive layer 117 may be disposed between the substrate 112 and the flexible film 130 . At this time, the conductive adhesive layer 117 fixes the substrate 112 and the flexible film 130 , and electrically connects the first pad P1 on the substrate 112 and the second pad P2 of the flexible film 130 . can be connected The conductive adhesive layer 117 may, for example, be formed in a form in which a plurality of conductive particles 118 are dispersed in an adhesive material, and may be formed of an anisotropic conductive film (ACF). The substrate 112 and the flexible film 130 may be fixed by the adhesive material of the conductive adhesive layer 117 , and the first pad P1 and the second pad P2 through an electrical path formed by the conductive particles 118 . ) can be electrically connected.

Since the ACF has a structure in which current flows while the upper and lower conductive particles 118 contact each other, a short circuit does not occur even when the ACF contacts the side surface of the encapsulation substrate 129 .

In addition, a stress relief layer 134 that is an insulating material may be provided on the rear surface of the flexible film 130 . The stress reducing layer 134 may be provided on the rear surface of the flexible film 130 except for the second pad P2 .

That is, the flexible film 130 may be coated on the rear surface of the flexible film 130 with the stress reduction layer 134, which is an insulating material, except for the area connected to the second pad P2 and the printed circuit board connected to the first pad P1. have. Accordingly, even when the encapsulation substrate 129 extending to the pad area is positioned under the flexible film 130 , a short circuit does not occur due to the stress reducing layer 134 made of an insulating material.

The stress reducing layer 134 may be provided on at least the rear surface of the flexible film 130 in contact with the encapsulation substrate 129 .

To improve cracks, the printed circuit board is positioned on the front or rear surface of the back cover 110 , and the flexible film 130 positioned in the pad area can be folded to connect to the printed circuit board. In addition, by extending the adhesive layer 128 and the encapsulation substrate 129 to the non-display area NA of the substrate 112 on which the first pad P1 is positioned, a region in which the stacked structure changes rapidly inside the display panel 120 . can be minimized. In addition, since the area of the PI substrate 112 exposed to the outside is minimized, the possibility of being bent or damaged during handling or transport can be significantly reduced.

Accordingly, according to the present invention, it is possible to minimize cracks of the display panel 120 and damage to the flexible film 130 that occur during rolling and handling, thereby solving the problem of driving failure and reliability of the display panel 120 . to provide.

According to the present invention, by removing the micro-sealing layer in the rollable display device 100 using the flexible substrate, cracks and contact pad opening defects due to the micro-sealing layer can be prevented. In addition, the removal of the micro-sealing layer provides the effect that the module process can be simplified.

Meanwhile, an adhesive layer AD may be disposed between the encapsulation substrate 129 and the back cover 110 .

The adhesive layer AD may adhere between the encapsulation substrate 129 and the back cover 110 . The adhesive layer AD is made of a material having an adhesive property, and may be a heat-curable adhesive or a natural-curable adhesive. For example, the adhesive layer AD may be formed of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), or the like, but is not limited thereto.

Although FIG. 10 illustrates that the adhesive layer AD is not filled in the plurality of openings 111 of the back cover 110 , the adhesive layer AD is formed on some or all of the plurality of openings 111 of the back cover 110 . can be filled If the adhesive layer AD is filled inside the plurality of openings 111 of the back cover 110 , the contact area between the adhesive layer AD and the back cover 110 increases and the adhesive layer AD and the back cover ( 110) can be prevented from peeling.

A polarizing plate 127 may be disposed on the rear surface of the display panel 120 . The polarizing plate 127 selectively transmits light to reduce reflection of external light incident on the display panel 120 . Specifically, the display panel 120 may include various metal materials applied to semiconductor devices, wirings, organic light emitting devices, and the like. Accordingly, the external light incident on the display panel 120 may be reflected from the metal material, and the visibility of the display device 100 may be reduced due to the reflection of the external light. However, when the polarizing plate 127 is disposed, the polarizing plate 127 may prevent reflection of external light to increase outdoor visibility of the display device 100 . However, the polarizing plate 127 may be omitted depending on the embodiment of the display device 100 .

An adhesive layer may be provided on one surface of the polarizing plate 127, but is not limited thereto.

Meanwhile, a barrier film 126 may be interposed between the display panel 120 and the polarizing plate 127 , but is not limited thereto. The barrier film 126 may serve to block moisture permeation through the polarizing plate 127 .

Depending on the design of the display device 100 , the polarizing plate 127 may be omitted or another optical member may be added.

Meanwhile, the adhesive layer 128 and the encapsulation substrate 129 of the present invention extend to the pad area, and at least the first pad P1 of the display panel 120 is opened. A portion of the substrate 112 in the display area may be exposed, which will be described in detail through the following second to sixth embodiments.

12 is a plan view of a display unit of a display device according to a second exemplary embodiment of the present invention.

For example, FIG. 12 shows the display panel 220 before the flexible film and the printed circuit board are fastened.

The display device 200 according to the second embodiment of the present invention shown in FIG. 12 is substantially the same as the display device 100 according to the first embodiment of the present invention, except for the configuration of the adhesive layer and the encapsulation substrate 229 . consists of composition. Accordingly, the same reference numerals refer to the same components, and descriptions thereof will be omitted.

Referring to FIG. 12 , the display panel 220 according to the second exemplary embodiment includes a display area and a non-display area.

The display area may be disposed in the central portion of the display panel 220 , and may be an area in which an image is displayed in the flexible display device 200 .

The non-display area is located at the edge of the display panel 220 and may be an area in which an image is not displayed. The non-display area may be disposed to surround the display area.

The non-display area includes a pad area. The pad area may be disposed at the lower end of the display panel 220 . A plurality of first pads P1 may be disposed on the substrate 112 in the pad area. In this case, the plurality of first pads P1 are conductive components for transmitting various signals from the flexible film to the display unit and the driving unit.

The substrate 112 is a base member for supporting various components of the display panel 220 , and a pixel unit may be disposed on the upper surface of the substrate 112 .

An encapsulation layer may be disposed to cover the pixel unit.

An encapsulation substrate 229 may be disposed on the encapsulation layer.

The encapsulation substrate 229 may protect the light emitting device of the pixel unit from external moisture, oxygen, impact, and the like.

The encapsulation substrate 229 has strong corrosion resistance and is made of a metal material such as aluminum (Al), nickel (Ni), chromium (Cr), an alloy of iron (Fe) and nickel, which is easy to process in the form of a foil or a thin film. can be made with As the encapsulation substrate 229 is formed of a metal material, the encapsulation substrate 229 can be implemented in an ultra-thin film form, and strong protection against external impact and scratches can be provided.

An adhesive layer may be disposed between the encapsulation layer and the encapsulation substrate 229 .

The adhesive layer may adhere between the encapsulation layer and the encapsulation substrate 229 . The adhesive layer is made of a material having an adhesive property, and may be a thermosetting type or natural curing type adhesive. For example, the adhesive layer may be made of OCA (Optical Clear Adhesive), PSA (Pressure Sensitive Adhesive), or the like, but is not limited thereto.

The adhesive layer and the encapsulation substrate 229 according to the second embodiment of the present invention may be formed to extend from the display area to the non-display area except for the area where the first pad P1 is located.

In particular, in the display device 200 according to the second embodiment of the present invention, the adhesive layer and the encapsulation substrate 229 do not extend to the upper non-display area, so that the substrate 112 in the upper non-display area is exposed. characterized.

That is, the adhesive layer and the encapsulation substrate 229 according to the second embodiment of the present invention are formed to extend to a non-display area other than an upper non-display area, and expose the first pad P1 to the outside in the pad area. characterized by doing. Accordingly, the adhesive layer and the encapsulation substrate 229 may be formed on the front surface of the display panel 220 excluding the area where the first pad P1 is located and the non-display area thereon.

13 is a plan view of a display unit of a display device according to a third exemplary embodiment of the present invention.

For example, FIG. 13 shows the display panel 320 before the flexible film and the printed circuit board are fastened.

The display device 300 according to the third embodiment of the present invention shown in FIG. 13 is substantially the same as the display device 100 according to the first embodiment of the present invention, except for the configuration of the adhesive layer and the encapsulation substrate 329 . consists of composition. Accordingly, the same reference numerals refer to the same components, and descriptions thereof will be omitted.

Referring to FIG. 13 , the adhesive layer and the encapsulation substrate 329 according to the third embodiment of the present invention may be formed to extend from the display area to the non-display area except for the area where the first pad P1 is located.

In particular, in the display device 300 according to the third exemplary embodiment of the present invention, the adhesive layer and the encapsulation substrate 329 do not extend to the upper and side non-display areas of the substrate 112 in the upper and side non-display areas. It is characterized in that it is exposed. However, the present invention is not limited thereto, and since the adhesive layer and the encapsulation substrate 329 do not extend to the non-display area of the upper and one side, the substrate 112 of the non-display area of the upper and one side may be exposed.

That is, the adhesive layer and the encapsulation substrate 329 according to the third embodiment of the present invention are formed to extend to the lower non-display area except for the upper and side non-display areas, and the first pad P1 is formed in the pad area. It is characterized in that it is exposed to the outside. Accordingly, the adhesive layer and the encapsulation substrate 329 may be formed on the entire surface of the display panel 320 except for the area where the first pad P1 is located and the non-display area on the top and side.

14 is a plan view of a display unit of a display device according to a fourth exemplary embodiment of the present invention.

For example, FIG. 14 shows the display panel 420 before the flexible film and the printed circuit board are fastened.

The display device 400 according to the fourth embodiment of the present invention shown in FIG. 14 is substantially the same as the display device 100 according to the first embodiment of the present invention described above except for the configuration of the adhesive layer and the encapsulation substrate 429 . consists of composition. Accordingly, the same reference numerals refer to the same components, and descriptions thereof will be omitted.

Referring to FIG. 14 , in the display device 400 according to the fourth exemplary embodiment of the present invention, the adhesive layer and the encapsulation substrate 429 do not extend to the side non-display area of the substrate 112 in the non-display area. It is characterized in that it is exposed.

That is, the adhesive layer and the encapsulation substrate 429 according to the fourth embodiment of the present invention are formed to extend to the non-display area other than the non-display area at the side, and the first pad P1 is exposed outside in the pad area. characterized by doing. Accordingly, the adhesive layer and the encapsulation substrate 429 may be formed on the entire surface of the display panel 420 excluding the area where the first pad P1 is located and the non-display area on the side thereof.

15 is a plan view of a display unit of a display device according to a fifth exemplary embodiment.

For example, FIG. 15 shows the display panel 520 before the flexible film and the printed circuit board are fastened to each other.

The display device 500 according to the fifth embodiment of FIG. 15 is substantially the same as the display device 100 according to the first embodiment of the present invention described above, except for the configuration of the adhesive layer and the encapsulation substrate 529 . consists of composition. Accordingly, the same reference numerals refer to the same components, and descriptions thereof will be omitted.

Referring to FIG. 15 , in the display device 500 according to the fifth embodiment of the present invention, the adhesive layer and the encapsulation substrate 529 do not extend to the non-display area of the side, and thus the substrate 112 in the non-display area of the side. It is characterized in that it is exposed. In particular, the adhesive layer and the encapsulation substrate 529 according to the fifth embodiment of the present invention is characterized in that it is formed to extend even to the lower edge region compared to the fourth embodiment of the present invention described above.

That is, the adhesive layer and the encapsulation substrate 529 according to the fifth embodiment of the present invention are formed to extend to other non-display areas except for the non-display area on the side (other than the lower corner area), and the first pad in the pad area. (P1) is characterized in that it is exposed to the outside. Accordingly, the adhesive layer and the encapsulation substrate 529 may be formed on the entire surface of the display panel 520 except for the area where the first pad P1 is located and the non-display area on the side (other than the lower corner area).

16 is a plan view of a display unit of a display device according to a sixth exemplary embodiment.

For example, FIG. 16 shows the display panel 620 before the flexible film and the printed circuit board are fastened.

The display device 600 according to the sixth embodiment of the present invention shown in FIG. 16 is substantially the same as the display device 100 according to the first embodiment of the present invention described above except for the configuration of the adhesive layer and the encapsulation substrate 629 . consists of composition. Accordingly, the same reference numerals refer to the same components, and descriptions thereof will be omitted.

Referring to FIG. 16 , in the display device 600 according to the sixth embodiment of the present invention, the adhesive layer and the encapsulation substrate 629 do not extend to the upper and side non-display areas, so It is characterized in that the substrate 112 is exposed. In particular, the pressure-sensitive adhesive layer and the encapsulation substrate 629 according to the sixth embodiment of the present invention is characterized in that it is also formed to extend to the lower edge area as in the above-described fifth embodiment of the present invention.

That is, the adhesive layer and the encapsulation substrate 629 according to the sixth embodiment of the present invention are formed to extend to other non-display areas except for the non-display areas on the side (other than the upper and lower corner areas), and are formed in the pad area. 1 It is characterized in that the pad P1 is exposed to the outside. Accordingly, the adhesive layer and the encapsulation substrate 629 may be formed on the front surface of the display panel 620 except for the area where the first pad P1 is located and the non-display area on the side (other than the upper and lower corner areas). have.

Display devices according to embodiments of the present invention may be described as follows.

A display device according to an embodiment of the present invention includes a substrate divided into a display area and a non-display area, an encapsulation substrate disposed on the substrate, a back cover attached to the encapsulation substrate, and a pad area of the non-display area of the substrate. and a plurality of pads and at least one flexible film connected to the plurality of pads and disposed on one surface of the back cover, and the encapsulation substrate may be disposed on the entire surface of the substrate exposing the pads.

According to another aspect of the present invention, the display device may further include a roller disposed on the rear surface of the back cover, and on which the substrate and the back cover are wound or unwound.

According to another feature of the present invention, the display device may further include an adhesive layer disposed between the substrate and the encapsulation substrate.

According to another feature of the present invention, the adhesive layer may be disposed on the entire surface of the substrate exposing the pad.

According to another feature of the present invention, the adhesive layer and the encapsulation substrate may expose an upper non-display area among the non-display areas of the pad and the substrate.

According to another feature of the present invention, the adhesive layer and the encapsulation substrate may expose upper and side non-display areas among the non-display areas of the pad and the substrate.

According to another feature of the present invention, the adhesive layer and the encapsulation substrate may expose the non-display area of the side of the non-display area of the pad and the substrate.

According to another feature of the present invention, the adhesive layer and the encapsulation substrate may expose the non-display area of the side of the pad and the non-display area of the substrate except for the lower corner area.

According to another feature of the present invention, the adhesive layer and the encapsulation substrate may expose the non-display area of the side except for the upper non-display area and the lower corner area among the non-display areas of the pad and the substrate.

According to another feature of the present invention, the display device may further include a conductive adhesive layer disposed between the pad and the flexible film.

According to another feature of the present invention, the display device may further include a plurality of conductive particles dispersed in the conductive adhesive layer and electrically connecting the pad and the flexible film.

According to another feature of the present invention, the conductive adhesive layer may be provided in a groove or trench pattern between the adhesive layer and the encapsulation substrate.

According to another feature of the present invention, the display device may further include an insulating layer provided on the rear surface of the flexible film.

According to another feature of the present invention, the insulating layer may be provided on the rear surface of the flexible film except for the portion connected to the pad and the portion connected to the printed circuit board.

According to another feature of the present invention, the insulating layer may be provided on the rear surface of the flexible film in contact with the encapsulation substrate.

A display device according to another embodiment of the present invention includes a substrate divided into a display area and a non-display area, a pixel portion disposed on the substrate and including a plurality of light emitting devices and circuits, an adhesive layer disposed to cover the pixel portion, and An encapsulation substrate, a back cover disposed on the encapsulation substrate, an adhesive layer interposed between the back cover and the encapsulation substrate, a plurality of pads provided in a pad area of a non-display area of the substrate and a plurality of pads connected to the plurality of pads, and on one surface of the back cover at least one flexible film disposed thereon, wherein the adhesive layer and the encapsulation substrate are disposed to expose the pad and extend from the display area to the non-display area of the substrate, and the adhesive layer to be disposed on the front surface of the encapsulation substrate except for the pad area of the substrate. can

According to another feature of the present invention, the display device may further include a roller disposed on the rear surface of the back cover, and on which the substrate and the back cover are wound or unwound.

According to another feature of the present invention, the display device may further include an insulating layer provided on the rear surface of the flexible film.

According to another feature of the present invention, the insulating layer may be provided on the rear surface of the flexible film except for the portion connected to the pad and the portion connected to the printed circuit board.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to illustrate, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100, 200, 300, 400, 500, 600: display device
110: back cover
111: opening
112: substrate
116: tape
117: conductive adhesive layer
118: conductive particles
120, 220, 320, 420, 520, 620: display panel
123: pixel part
124: encapsulation layer
126: barrier film
127: polarizer
128: adhesive layer
129, 229, 329, 429, 529, 629: encapsulation substrate
130: flexible film
131: base film
132: driving IC
134: stress reduction layer
135: printed circuit board
AA: display area
NA: non-display area
P1: first pad
P2: second pad

Claims (20)

a substrate including a display area and a non-display area;
an encapsulation substrate disposed on the substrate;
a back cover attached to the encapsulation substrate;
a plurality of pads provided in a pad area of the non-display area of the substrate; and
and at least one flexible film connected to the plurality of pads and disposed on one surface of the back cover,
The encapsulation substrate is disposed on the entire surface of the substrate except for the pad. The method of claim 1,
and a roller disposed on the other surface opposite to one surface of the back cover, the roller being wound or unwound by the substrate and the back cover. The method of claim 1,
and an adhesive layer disposed between the substrate and the encapsulation substrate. 4. The method of claim 3,
The adhesive layer is disposed on the entire surface of the substrate exposing the pad. 4. The method of claim 3,
The adhesive layer and the encapsulation substrate expose an upper non-display area of the pad and the non-display area of the substrate. 4. The method of claim 3,
The adhesive layer and the encapsulation substrate expose upper and side non-display areas of the pad and the non-display area of the substrate. 4. The method of claim 3,
The adhesive layer and the encapsulation substrate expose a side non-display area of the pad and the non-display area of the substrate. 4. The method of claim 3,
The adhesive layer and the encapsulation substrate expose a side non-display area of the pad and the non-display area of the substrate except for a lower corner area. 4. The method of claim 3,
The adhesive layer and the encapsulation substrate expose a side non-display area of the pad and the non-display area of the substrate except for an upper non-display area and a lower corner area. The method of claim 1,
The flexible film is positioned between the encapsulation substrate and the back cover. 4. The method of claim 3,
The encapsulation substrate includes a groove or trench pattern exposing the plurality of pads. 12. The method of claim 11,
a conductive adhesive layer disposed between the pad and the flexible film; and
and a plurality of conductive particles dispersed in the conductive adhesive layer and electrically connecting the pad and the flexible film. 13. The method of claim 12,
The conductive adhesive layer is provided in a groove or trench pattern of the adhesive layer and the encapsulation substrate. The method of claim 1,
The display device further comprising an insulating layer provided on one surface of the flexible film. 15. The method of claim 14,
The insulating layer is provided on a rear surface of the flexible film except for a portion connected to the pad and a portion connected to the printed circuit board. 15. The method of claim 14,
The insulating layer is provided on one surface of the flexible film facing the encapsulation substrate. a substrate including a display area and a non-display area;
a pixel unit disposed on the substrate and including a plurality of light emitting devices and circuits;
an adhesive layer and an encapsulation substrate disposed to cover the pixel unit;
a back cover disposed on the encapsulation substrate;
an adhesive layer interposed between the back cover and the encapsulation substrate;
a plurality of pads provided in a pad area of the non-display area of the substrate; and
and at least one flexible film connected to the plurality of pads and disposed on one surface of the back cover,
the adhesive layer and the encapsulation substrate are disposed to expose the pad and extend from the display area of the substrate to the non-display area;
The adhesive layer is disposed on the entire surface of the encapsulation substrate except for the pad area of the substrate. 18. The method of claim 17,
and a roller disposed on the other surface opposite to one surface of the back cover, the roller being wound or unwound by the substrate and the back cover. 18. The method of claim 17,
The display device further comprising an insulating layer provided on one surface of the flexible film. 20. The method of claim 19,
The insulating layer is provided on one surface of the flexible film except for a portion connected to the pad and a portion connected to the printed circuit board.

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