KR102334287B1 - Construction method of flooring - Google Patents

Abstract

The present invention relates to a flooring construction method, and to a flooring construction method for preventing cracks on the floor from being transferred to the flooring surface or from generating crack waves on the flooring surface during floor heating.

Description

Construction method of flooring

The present invention relates to a flooring construction method, and to a flooring construction method for preventing cracks on the floor from being transferred to the flooring surface or from generating crack waves on the flooring surface during floor heating.

If the floor surface of the interior part of a building structure is exposed as it is, the aesthetics of the exterior is inevitably reduced. For this reason, in the interior process, the floor surface of the interior part of the building structure is finished with flooring.

As an example of the flooring material, a long flooring material made of polyvinyl chloride (hereinafter referred to as 'PVC'), which is relatively inexpensive, easy to construct, and has excellent decorative effects, is used as a residential flooring material. .

As an example, the PVC long flooring material is disclosed in Korean Patent Application Laid-Open No. 10-2011-0130061 (published date: 2011.12.05.).

However, when the above PVC flooring is constructed as a residential flooring material, the lower edge of the flooring material is adhered to the floor surface. Since the material of the flooring material is soft, the cracks on the floor are transferred to the surface of the flooring or rise from the cracks on the floor during floor heating. There was a problem in that wave patterns (hereinafter referred to as 'crack waves') appeared on the surface of the flooring due to the hot air coming in.

Accordingly, as an example, in Korean Patent Laid-Open Publication No. 10-2002-0041856 (published on June 5, 2002), a level repair material for cement floors and The construction method is disclosed. However, the construction method as described above is cumbersome and has a problem in that construction time and construction cost increase.

Therefore, in order to solve the above problems, a flooring construction method that reduces the construction time and construction cost while preventing the cracks on the floor from being transferred to the surface of the flooring or the generation of crack waves on the surface of the flooring when heating the floor is urgently required. the current situation.

KR 10-2011-0130061 A (2011.12.05.) KR 10-2002-0041856 A (2002.06.05.)

The present invention has been devised to solve the above problems, and an object of the present invention is to provide a flooring construction method that prevents cracks on the floor from being transferred to the surface of the flooring or from generating crack waves on the surface of the flooring during floor heating.

In order to achieve the above object, the present invention comprises the steps of removing foreign substances from the bottom surface (S1); Covering a sheet having a thermal conductivity of 1W/mK or less on the cracked portion of the bottom (S3); And it provides a flooring construction method comprising the step (S5) of bonding the flooring.

The flooring construction method of the present invention is effective in preventing cracks on the floor from being transferred to the surface of the flooring or from generating crack waves on the surface of the flooring during floor heating.

1 is a flowchart schematically illustrating a flooring construction method of the present invention.
FIG. 2 is a photograph showing that crack waves did not occur when heated at 46° C. for 22 hours after flooring was installed on the floor in Example 1. FIG.
3 is a photograph showing that crack waves occurred when heating at 46° C. for 22 hours after flooring was installed on the floor in Comparative Example 1. FIG.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings of the present invention.

Referring to Figure 1, the present invention comprises the steps of removing foreign substances from the bottom surface (S1); Covering a sheet having a thermal conductivity of 1W/mK or less on the cracked portion of the bottom (S3); And it relates to a flooring construction method comprising the step (S5) of bonding the flooring.

In the present invention, as an example, a long PVC flooring material for residential use (ie, a floor board) will be described as an example, but the present invention is not limited thereto, and it is also possible to construct a tile flooring material, a flooring material, and the like.

The step (S1) may be to smooth the floor surface by removing foreign substances from the floor surface so as to prevent the occurrence of irregularities due to foreign substances when the floor material is installed on the floor surface.

The foreign material removal may be, for example, removing the foreign material present on the floor using one or more selected from the group consisting of an air gun and a vacuum cleaner, but is not limited thereto.

The step (S3) may be to cover a sheet having a thermal conductivity of 1W/mK or less on the cracked portion of the bottom surface.

In the present invention, the crack (crack) means a crack in the bottom surface.

The sheet may block direct contact between the crack portion of the bottom surface and the flooring material, and may reduce the step difference between the crack portion on the floor surface.

The sheet may have a thermal conductivity of 1 W/mK or less, or 0.8 W/mK or less, or 0.5 W/mK or less. Here, thermal conductivity refers to the intrinsic property of a material that exhibits heat transfer. The lower the thermal conductivity, the lower the value, the better the sheet exhibits excellent thermal barrier properties. Since the sheet has a thermal conductivity within the above range, hot air from a cracked portion of the floor is prevented from coming into direct contact with the flooring, thereby preventing crack waves from being generated on the surface of the flooring during floor heating.

In the present invention, a crack wave refers to a wave pattern generated on the surface of the flooring material due to hot air rising from cracks on the floor surface during floor heating (see FIG. 3 ).

In addition, the sheet may be made of a material having a relatively low rate of dimensional change according to changes in temperature and humidity, for example, made of one or more materials selected from the group consisting of paper, fabric, film, and adhesive tape. can

The paper may be, for example, at least one selected from the group consisting of operating paper, wrapping paper, printing paper, thin paper, kraft paper, high-quality paper, linter paper, barita paper, and sulfuric paper.

The fabric may be at least one selected from the group consisting of a non-woven fabric (不織布) and a woven fabric (織布).

The non-woven fabric is an example, polyester, polypropylene (Polypropylene, PP), polyethylene (Polyethylene, PE), polyvinyl alcohol (Polyvinyl alcohol, PVA), polyamide (Polyamide, PA), polyurethane (Polyurethane, It may be made of at least one thermoplastic resin selected from the group consisting of PU) and polyvinylidene chloride (PVDC).

The woven fabric may be formed using, for example, yarn, and the yarn refers to, for example, a yarn made by twisting one or more fibers selected from natural fibers, regenerated fibers and synthetic fibers. .

The natural fiber may be, for example, cotton fiber, hemp fiber, wool fiber, silk fiber or wool fiber, and the regenerated fiber may be, for example, rayon fiber or cupra fiber, and the synthetic fiber may be, for example, poly Polyester fiber, Nylon fiber, Polyolefin (PO) fiber, Polyvinyl alcohol (PVA) fiber, Polyamide (PA) fiber, Polyurethane (PU) fiber or poly It may be a polyvinylidene chloride (PVDC) fiber.

The film is an example, polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP), polyethylene terephthalate (Polyethylene terephthalate, PET), polybutylene terephthalate (Polybutylene terephthalate, PBT), polyethylene naphthalate (Polyethylene naphthalate, PEN) and polyvinyl chloride (Polyvinyl chloride, PVC) may be made of one or more selected from the group consisting of.

As a specific example, the sheet may be a PET film having low oxygen permeability and water vapor permeability, which prevents crack waves from occurring on the surface of the flooring material during floor heating, and has a small average coefficient of linear expansion and thus excellent dimensional stability.

The sheet has a oxygen transmission rate can be less than 80cc / m ² / day or less, or 50cc / m ² / day. Here, the oxygen permeability refers to the oxygen transmission rate (OTR) for a given sheet thickness. The oxygen permeability may be measured by the method of ASTM D 3985. As the oxygen permeability is lower, it means that the sheet exhibits excellent blocking ability against oxygen, and thus the lower limit thereof is not particularly limited, but ^{may be, for example, 0 cc/m 2} /day or more.

The sheet may have a water vapor transmission rate of 40 cc/m ² /day or less, or 30 cc/m ² /day or less. Here, the water vapor transmission rate means a water vapor transmission rate (WVTR) for a given sheet thickness. The water vapor permeability may be measured by the method of ASTM F1249. As the water vapor permeability is lower, it means that the sheet exhibits excellent barrier properties against water vapor, so the lower limit thereof is not particularly limited, but ^{may be, for example, 0 cc/m 2} /day or more.

Since the sheet has oxygen permeability and water vapor permeability within the above ranges, it can be prevented that moisture remaining on the floor surface during floor heating comes up with heat and comes into contact with the lower portion of the flooring, thereby preventing crack waves from occurring on the surface of the flooring.

The sheet may have an average coefficient of linear expansion of 100-200°C of 1.0×10 ^-5 -10×10 ^-5 /°C or 1.0×10 ^-5 -2.0×10 ^-5 /°C. Here, the coefficient of linear expansion means a change in the length per unit length of the sheet when the temperature changes by 1 ° C. In the present invention, the average coefficient of linear expansion is the MD direction (Machine Direction) and TD direction (Transverse Direction) of the material. It means the average of the measured coefficients of thermal expansion at 100-200°C. The sheet may implement excellent dimensional stability by having an average coefficient of linear expansion in the above range.

The sheet may have a thickness of 10-500 μm, 10-300 μm, or 20-100 μm. When the thickness of the sheet is less than the above range, it may be difficult to implement the effect of preventing cracks on the floor from being transferred to the flooring surface or from generating crack waves on the flooring surface during floor heating. As it is formed, the construction cost may rise.

The step (S5) may be to close the floor surface with the floor material by bonding the floor material to the floor surface.

In the step (S5), for example, an adhesive may be applied to the edge of the bottom of the flooring to prevent the flooring from being pushed or lifted to adhere to the floor. In the present invention, when the adhesive is partially applied to the lower part of the flooring material by covering the crack area of the floor with a sheet having a thermal conductivity of 1W/mK or less, the problem of crack waves occurring on the surface of the flooring during floor heating is solved, so the adhesive required for flooring construction can reduce the amount of

Since the bonding is only a simple operation of pressing the flooring material to which the adhesive is applied after it is seated on the floor surface, a detailed description of the bonding of the flooring material will be omitted.

The flooring construction method of the present invention can simply prevent cracks on the floor from being transferred to the surface of the flooring or the generation of crack waves on the surface of the flooring during floor heating by covering the cracked area of the floor with a sheet having a thermal conductivity of 1 W/mK or less. . Accordingly, there is no need to perform a process of filling the cracks in the cracks using a curable material as in the prior art, and then using a grinder to remove the steps in the cracks, thereby eliminating the hassle.

In the flooring construction method of the present invention, after the flooring is constructed, the difference in the level of cracks when the crack transfer occurs on the floor to the surface of the flooring may be 0.7mm or more, 0.9mm or more, or 1.0mm or more. Here, the upper limit of the step difference of the crack is not particularly limited, but may be, for example, 5.0 cm or less, 3.0 cm or less, or 2.5 cm or less. The level of the crack was measured with a tape measure. In the flooring construction method, the crack transfer prevention effect of the flooring surface may be excellent because the crack level when the crack transfer occurs on the flooring surface to the flooring material has the above range.

In addition, in the flooring construction method of the present invention, crack waves may not occur when heated at 46°C for 22 hours after flooring construction. The occurrence of the crack wave was visually evaluated. The flooring construction method can be excellent in preventing crack waves from occurring on the surface of the flooring material during floor heating because crack waves do not occur even after heating at 46° C. for 22 hours after flooring construction.

Hereinafter, preferred examples are presented to help the understanding of the present invention, but the following examples are merely illustrative of the present invention, and it will be apparent to those skilled in the art that various changes and modifications are possible within the scope and spirit of the present invention, It goes without saying that changes and modifications fall within the scope of the appended claims.

[Example]

<Example 1>

The surface of the floor was smoothed by removing foreign substances from the floor using an air gun.

Then, this is 0.29W / mK thermal conductivity of the crack areas of the bottom surface, and the oxygen transmission rate 40cc / m ² / day, and the water vapor transmission rate 20cc / m ² / day, an average coefficient of linear expansion of 1.5 × 10 ^-5 / ℃ A 50 μm thick PET film (Kolon) was covered.

After that, an adhesive was applied to the rim of the lower part of the flooring material, and the flooring material was seated on the floor surface and pressurized to construct the flooring material.

[Comparative example]

<Comparative Example 1>

The flooring was constructed in the same manner as in Example 1, except that the sheet was not covered on the cracks on the floor.

<Comparative Example 2>

In the crack area of the bottom, the thermal conductivity is 237W/mK, not the PET sheet, the oxygen permeability is ^{less than 0.1cc/m 2} /day, the water vapor transmission rate is less than 0.1cc/m ² /day, and the average coefficient of linear expansion is 1.8×10 ^A flooring material was constructed in the same manner as in Example 1, except that an aluminum foil (Lotte Corporation) having a thickness of 200 μm at -4 /°C was covered.

[Reference example]

<Reference Example 1>

Thermal conductivity of 0.06W/mK, oxygen permeability ^{less than 100cc/m 2} /day, water vapor permeability ^{greater than 100cc/m 2} /day, and average coefficient of linear expansion of 1.9×10 ^-4 /℃ at the crack site of the bottom surface The flooring was constructed in the same manner as in Example 1, except that the 200㎛ thick operating paper (GM Tech) was covered.

<Reference Example 2>

300㎛ with thermal conductivity of 0.16W/mK, oxygen permeability of 200cc/m ² /day, water vapor permeability of 46cc/m ² /day, and average coefficient of linear expansion of 0.7×10 ^-3 /℃ at the crack site of the bottom surface A flooring was constructed in the same manner as in Example 1, except that a thick PVC sheet (LG Hausys) was covered.

<Reference Example 3>

150㎛ with thermal conductivity of 0.22W/mK, oxygen permeability of 100cc/m ² /day, water vapor permeability of 30cc/m ² /day, and average coefficient of linear expansion of 0.2×10 ^-3 /℃ at the crack site of the bottom surface The flooring was constructed in the same manner as in Example 1, except that a thick PP (Polypropylene) tape (3M) was covered.

[Test Example]

1. Thermal Conductivity

The thermal conductivity of each sheet of Example 1, Comparative Example 2, and Reference Example 1-3 was measured using a normal method thermal conductivity measuring apparatus (Ulvac-Riko Inc., GH-1). Each sheet was picked up by an aluminum plate having a diameter of 50 mm, set in a measuring device, and thermal conductivity was measured by the method of ASTM E1530, and is shown in Table 1.

2. Oxygen Permeability

The oxygen permeability of each sheet of Example 1, Comparative Example 2, and Reference Example 1-3 is the Oxygen Transmission Rate (OTR) for a given sheet thickness, which is oxygen at 23° C., 0% relative humidity and 1 atm pressure. It was measured with a transmittance measuring device (MOCON, OX-TRAN 2/20). The instrument was calibrated with National Institute of Standards and Technology certified Mylar film with _{known O 2 transport properties.} Then, the oxygen permeation rate of each sheet was measured by the method of ASTM D 3985. The results are shown in Table 1.

3. Water vapor permeability

The water vapor transmission rate of each sheet of Example 1, Comparative Example 2 and Reference Example 1-3 was the Water Vapor Transmission Rate (WVTR) for a given material thickness, at 38°C, 100% relative humidity and 1 atm pressure. It was measured with the water vapor transmission rate measuring apparatus (MOCON, Permatran-W 3/31). The instrument was calibrated with a National Institute of Standards and Technology certified 25 μm-thick polyester film with known water vapor transport properties. Then, the water vapor transmission rate of each sheet was measured by the method of ASTM F1249. The results are shown in Table 1.

4. Average coefficient of linear expansion

Each sheet of Example 1, Comparative Example 2, and Reference Example 1-3 was cut to a width of 3 mm and a length of 10 mm to prepare a sample. Then, each sample was once heated to 0° C. to 460° C. in a tensile mode with a load of 29.4 mN by a thermomechanical analysis device (SII Nanotechnology Co., Ltd., TMA/SS6100), then cooled to 10° C., and then cooled to 10° C./ The temperature was further raised by min, and the average value of the coefficient of thermal expansion measured in the MD direction (Machine Direction) and TD direction (Transverse Direction) of each sample within the range of 100 to 200 ° C at the time of the second temperature increase was obtained. The results are shown in Table 1.

5. Step of cracks when transferring cracks on the floor to the surface of the flooring material

After the construction of the flooring material, the difference in crack level when the crack transfer occurred on the floor surface was measured with a tape measure. The results are shown in Table 1.

6. Whether or not crack waves occur on the surface of the flooring material during floor heating and the height of crack waves

After the flooring was installed, the occurrence of crack waves was visually evaluated when heating at 46° C. for 22 hours. When crack waves occurred, the height of the crack waves was measured using a tape measure, and the results are shown in Table 1.

At this time, it was evaluated that as the height of the measured crack wave was increased, the effect of preventing crack waves from being generated on the surface of the flooring material during floor heating was reduced.

sheet covering the crack area matter flooring thermal conductivity
(W/mK) oxygen permeability
(cc/m ² /day) Water vapor permeability
(cc/m ² /day) Average coefficient of linear expansion
(/℃) Step difference of cracks when crack transfer occurs Height of crack wave when crack wave occurs Example 1 PET film 0.29 40 20 1.5× 10 ^-5 1.2 - Comparative Example 1 - - - - - 0.3 2.5 Comparative Example 2 aluminum foil 237 <0.1 <0.1 1.8×10 ^-4 0.6 2 Reference Example 1 operating site 0.06 <100 >>100 1.9×10 ^-4 0.6 2 Reference Example 2 PVC sheet 0.16 200 46 0.7×10 ^-3 0.4 1.5 Reference Example 3 PP tape 0.22 100 30 0.2× 10 ^-3 0.4 1.5 -Thermal conductivity: Measured by the method of ASTM E1530 using a normal method thermal conductivity measuring device (Ulvac-Riko Inc., GH-1).
-Oxygen permeability: Measured at 23 °C, 0% relative humidity and 1 atm pressure by the method of ASTM D 3985 using an oxygen permeability measuring device (MOCON, OX-TRAN 2/20).
-Water vapor permeability: Measured at 38 °C, 100% relative humidity and 1 atm pressure by the method of ASTM F 1249 using a water vapor permeability measuring device (MOCON, PERMATRAN-W-3/33).
-Average coefficient of linear expansion: After heating each sample once to 0°C to 460°C, cooling to 10°C, further raising the temperature at 10°C/min, each sample within the range of 100 to 200°C at the second temperature increase Measured by finding the average value of the coefficient of linear expansion measured in the MD and TD directions of
- Level of cracks when transferring cracks from the floor to the surface of the flooring: After the construction of the flooring, the level of cracks when transferring the cracks that exist on the surface of the flooring to the surface of the flooring is measured with a tape measure.
- Whether or not crack waves are generated on the surface of the flooring and the height of crack waves during floor heating Measure the height using a tape measure.

In the construction method of Example 1, the crack transfer prevention effect is excellent compared to Comparative Examples 1 and 2, and crack waves are generated by covering the crack area of the floor with a sheet having a thermal conductivity of 1W/mK or less and then bonding the flooring to the floor. I was able to confirm that it didn't.

On the other hand, the flooring construction method of Reference Examples 1 to 3 has a higher oxygen permeability, water vapor permeability, or average coefficient of linear expansion of the sheet compared to the construction method of Example 1, the effect of preventing crack transfer is lowered compared to Example 1, and the crack wave is also was able to confirm what was happening.

In particular, in the case of Reference Example 1, when the moisture content of the floor surface was high, the sheet (operating paper) was wetted, and in the case of Reference Examples 2 and 3, it was confirmed that deformation such as shrinkage/expansion due to heat occurred in the sheet during floor heating. could

On the other hand, it was confirmed through visual evaluation that the sheet used in Example 1 was also superior in durability to the sheets used in Comparative Example 2 and Reference Examples 1-3. Specifically, the sheet (PET film) used in Example 1 had a usable period of at least 2 years without damage to the sheet, and the sheet (aluminum foil) used in Comparative Example 2 had a usable period without damage to the sheet. 1 year, the sheet (operating paper) used in Reference Example 1 had a usable period of 6 months without damage to the sheet, and the sheet (PVC sheet) used in Reference Example 2 was usable without damage to the sheet. The period was 1 year, and the sheet (PP tape) used in Reference Example 3 had a usable period of 1 year without damage to the sheet, so the sheet (PET film) of Example 1 had the best durability.

Claims (15)

removing foreign substances from the bottom surface (S1); Covering a sheet having a thermal conductivity of 0.5 W/mK or less on the crack area of the bottom surface (S3); and bonding the flooring material (S5),
The sheet is the oxygen transmission rate 50cc / m ² / day or less, and the water vapor transmission rate 30cc / m ² / day or less, an average coefficient of linear expansion of the ^{100-200 ℃ 1.0 × 10 -5 -2.0 ×} 10 -5 / ℃ and , the thickness is 20-100㎛, made of PET film material
How to install flooring. delete delete delete delete delete delete delete delete delete delete delete delete The method of claim 1,
The flooring construction method is a flooring construction method that, after the construction of the flooring material, the step difference of the crack when the crack transfer occurs on the floor surface to the flooring surface is 0.7mm-5.0cm. The method of claim 1,
The flooring construction method is a flooring construction method that, after the flooring construction, the step difference of the cracks when the crack transfer of the floor surface to the flooring surface is 0.9mm-3.0cm.

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