KR102332994B1

KR102332994B1 - Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof

Info

Publication number: KR102332994B1
Application number: KR1020140161416A
Authority: KR
Inventors: 양태허
Original assignee: 양태허
Priority date: 2014-11-19
Filing date: 2014-11-19
Publication date: 2021-11-29
Also published as: KR20160059660A

Abstract

본 발명은 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치가 자체에 마련된 유체관로를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물(103)의 외부 표면 및/또는 내부 표면과 더불어 동일한 온도의 열을 전달하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제시한다.The present invention provides that an attachable isothermal device having one or more heat transfer bonding surfaces is identical with the outer surface and/or inner surface of the target 103 bonded to the bonding surface by a heat transfer fluid passing through a fluid conduit provided therein. A temperature control system and application device with an attached isothermal device and heat transfer fluid for transferring heat of temperature are presented.

Description

TEMPERATURE CONTROL SYSTEM HAVING ADJACENTLY-INSTALLED TEMPERATURE EQUALIZER AND HEAT TRANSFER FLUID AND APPLICATION DEVICE THEREOF

본 발명은 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치가 자체에 마련된 유체관로를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물의 외부 표면 및/또는 내부 표면과 더불어 동일한 온도의 열을 전달하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제시한다.The present invention relates to an attachable isothermal device having one or more heat transfer junction surfaces by means of a heat transfer fluid passing through a fluid conduit provided therein to generate heat at the same temperature as the external surface and/or internal surface of a target bonded to the junction surface. A temperature control system and application with an attachable isothermal device and a heat transfer fluid that transfers are presented.

종래의 전기모터, 발전기 혹은 변압기는 부하 증가에 따른 구리 손실 또는 철 손실로 인해 온도가 상승하여 효율이 떨어지거나 소각되는 현상이 초래되고, 종래의 정밀기계 혹은 다차원측정기는 환경 온도 변화 혹은 작동 중인 기계 부품의 열손실로 인해 열에 의한 확장과 냉각에 의한 축소에 따른 변형이 초래되며, 재질의 비균등 혹은 기하학적 형상의 비대칭으로 인해 온도 분포와 설정 상태의 변화가 증가하는 경우, 이에 따른 변형량이 더욱 심화되어 정밀도에 영향을 미쳐 종래의 반도체 유닛, 태양 전지판(Photovoltaic, PV), 발광다이오드(LED), 축방전 전지 혹은 액정 표시 장치(LCD)가 과열 또는 온도가 과도하게 낮아짐으로 인해 작동상의 성능이 떨어지는 문제점이 초래되며, 만약 주변 환경에 대한 일정 온도 조절을 통해 이러한 문제점을 개선하려 하는 경우에는, 이에 따른 고가의 설비 구매 비용과 막대한 전기 에너지 소모를 감안하지 않을 수 없는 문제점이 있다.Conventional electric motors, generators or transformers have a temperature rise due to copper loss or iron loss due to an increase in load, resulting in a decrease in efficiency or incineration. Deformation due to expansion due to heat and shrinkage due to cooling due to heat loss of the part is caused, and if the change in temperature distribution and setting state increases due to non-uniformity of material or asymmetry of geometric shape, the amount of deformation becomes more severe It affects the precision, and the conventional semiconductor unit, solar panel (Photovoltaic, PV), light emitting diode (LED), accumulator or liquid crystal display (LCD) is overheated or the operating performance is deteriorated due to excessively low temperature. Problems arise, and if an attempt is made to improve these problems through constant temperature control for the surrounding environment, there is a problem in that it is inevitable to consider expensive equipment purchase costs and enormous electrical energy consumption.

본　발명은　전술한 바와 같은　문제점을 해결하기 위하여 창출된 것으로서, 본 발명의 목적은, 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치가 자체에 마련된 유체관로를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물의 외부 표면 및/또는 내부 표면과 더불어 동일한 온도의 열을 전달하고, 온도 제어를 위한 표적물은 축방전 전지, 또는 액정 표시 장치, 반도체기판, 열발산기, 에어컨 열교환기, 또는 정밀기계 혹은 다차원측정기의 케이스, 또는 케이스 외부 및/또는 내부에 선정된 위치를 포함하며, 외부의 펌핑을 통해 뜨거워지거나 차가워진 열전달 유체에 의해 접합된 표적물에 대하여 뜨거워지거나 차가워지도록 하는 열전달을 수행하여 반도체 유닛, 태양 전지판(Photovoltaic, PV), 발광다이오드(LED) 혹은 축방전 전지 혹은 액정 표시 장치(LCD) 등과 같은 장치가 과열 또는 온도가 과도하게 낮아짐으로 인해 작동상의 성능이 떨어지는 문제점을 예방하고, 그리고/또는 전기모터, 발전기 혹은 변압기 등의 전기 기계 장치에 적용하는 경우, 부하가 증가하거나 환경 온도가 상승할 때 과열로 인해 효율이 떨어지고 심지어 소각되는 것을 예방하고, 그리고 정밀기계 혹은 다차원측정기의 기계 몸체에 적용하는 경우, 구조상의 기하학적 형상의 안정성과 정밀도를 유지토록 하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제공하는데 있다.The present invention was created to solve the above-mentioned problems, and an object of the present invention is to provide an attached isothermal device having one or more heat transfer joint surfaces by means of a heat transfer fluid passing through a fluid conduit provided therein. Transfers heat at the same temperature together with the outer surface and/or inner surface of the target bonded to the target, and the target for temperature control is a storage discharge battery, a liquid crystal display device, a semiconductor substrate, a heat spreader, an air conditioner heat exchanger, or Including a case of a precision machine or a multidimensional measuring instrument, or a selected location outside and/or inside the case, the heat transfer is performed to heat or cool the bonded target by a heat transfer fluid that is heated or cooled through external pumping. This prevents the problem of deterioration in operational performance of devices such as semiconductor units, solar panels (Photovoltaic, PV), light emitting diodes (LEDs) or accumulators or liquid crystal displays (LCDs) due to overheating or excessively low temperature. , and/or when applied to electromechanical devices such as electric motors, generators or transformers, when the load increases or the environmental temperature rises, to prevent loss of efficiency and even incineration due to overheating, and to prevent incineration of precision machines or multidimensional measuring instruments. An object of the present invention is to provide a temperature control system and application device having an attached isothermal device and a heat transfer fluid to maintain the stability and precision of structural geometry when applied to a machine body.

본 발명에 따르면, 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치가 자체에 마련된 유체관로를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물의 외부 표면 및/또는 표적물의 내부 표면과 더불어 동일한 온도의 열을 전달하고, 온도 제어를 위한 표적물은 축방전 전지, 또는 액정 표시 장치, 반도체기판, 열발산기, 에어컨 열교환기, 또는 정밀기계 혹은 다차원측정기의 케이스, 또는 케이스 외부 및/또는 내부에 선정된 위치를 포함하며, 외부의 펌핑을 통해 뜨거워지거나 차가워진 열전달 유체가 유체관 입구, 상기 유체관로 및 다른 한쪽의 유체관 입구를 통해 접합된 표적물에 대하여 뜨거워지거나 차가워지도록 하는 열전달을 수행하여 반도체 유닛, 태양 전지판, 발광다이오드 혹은 축방전 전지 혹은 액정 표시 장치 등과 같은 장치가 과열 또는 온도가 과도하게 낮아짐으로 인해 작동상의 성능이 떨어지는 문제점을 예방하고, 그리고/또는 전기모터, 발전기 혹은 변압기 등의 전기 기계 장치에 적용하는 경우, 부하가 증가하거나 환경 온도가 상승할 때 과열로 인해 효율이 떨어지고 심지어 소각되는 것을 예방하고, 그리고 정밀기계 혹은 다차원측정기의 기계 몸체에 적용하는 경우, 구조상의 기하학적 형상의 안정성과 정밀도를 유지토록 하는 것;According to the present invention, an attachable isothermal device having one or more heat transfer bonding surfaces is identical with the external surface of the target and/or the interior surface of the target bonded to the bonding surface by a heat transfer fluid passing through a fluid conduit provided therein. The heat of temperature is transferred, and the target for temperature control is a storage discharge battery, or a liquid crystal display device, a semiconductor substrate, a heat generator, an air conditioner heat exchanger, or a case of a precision machine or a multi-dimensional measuring instrument, or outside and/or inside the case Including a location selected in the, heat transfer fluid that has been heated or cooled through external pumping performs heat transfer so that it becomes hot or cold with respect to the bonded target through the fluid pipe inlet, the fluid pipe, and the other fluid pipe inlet to prevent the problem of deterioration in the operational performance of devices such as semiconductor units, solar panels, light emitting diodes or accumulators or liquid crystal displays due to overheating or excessively low temperature, and/or electric motors, generators or transformers, etc. Structural geometry when applied to the electromechanical device of a precision machine or multidimensional measuring machine, when the load increases or the environmental temperature increases to maintain the stability and precision of

상기 부착식 등온장치는 상기 표적물의 열전도성을 갖는 표면에 부착 설치되어 상기 표적물에 대하여 열에너지를 전송할 뿐 아니라, 상기 부착식 등온장치의 상기 유체관로를 통과하는 유체는 추가로 유량제어장치 및/또는 흐름 방향 제어장치 및/또는 온도감지기 및/또는 전기제어장치 및/또는 입력제어장치 및/또는 전원공급장치 및/또는 온도 작동 유체밸브를 결합하여 상기 부착식 등온장치의 상기 유체관로를 통과하는 유체의 열림과 닫힘 그리고 유량, 흐름 방향을 제어하는 것;을 특징으로 하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제공한다.The attached isothermal device is attached to the surface having thermal conductivity of the target to transmit thermal energy to the target, and the fluid passing through the fluid line of the attached isothermal device is additionally a flow control device and / or a flow direction control device and/or a temperature sensor and/or an electrical control device and/or an input control device and/or a power supply and/or a temperature actuated fluid valve to pass through the fluid conduit of the attachable isothermal device. To provide a temperature control system and application device having an attached isothermal device and a heat transfer fluid, characterized in that opening and closing of the fluid, and controlling the flow rate and flow direction.

전술한 바와 같이, 본 발명에 따르면, 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치가 자체에 마련된 유체관로를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물의 외부 표면 및/또는 내부 표면과 더불어 동일한 온도의 열을 전달하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제공할 수 있다.As described above, in accordance with the present invention, an attachable isothermal device having one or more heat transfer bonding surfaces has an external surface and/or an internal surface of a target bonded to the bonding surface by a heat transfer fluid passing through a fluid conduit provided therein. In addition, it is possible to provide a temperature control system and application device having an attached isothermal device and a heat transfer fluid for transferring heat of the same temperature.

도 1은 본 발명에 따른 부착식 등온장치가 표적물(103)의 외부 표면에 접합된 실시예를 도시한 사시도이다.
도 2는 본 발명에 따른 부착식 등온장치가 표적물(103)의 내부 표면에 접합된 실시예를 도시한 사시도이다.
도 3은 오픈면이 단열성을 갖는 부착식 등온장치의 구조를 입체적으로 도시한 사시도이다.
도 4는 오픈면이 열전도성을 갖는 부착식 등온장치의 구조를 입체적으로 도시한 사시도이다.
도 5는 본 발명에 따른 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 6은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 7은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 각각의 유체밸브와 직렬로 연결된 다음 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 8은 본 발명에 따른 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 유체밸브(120b)와 직렬 연결되고, 그리고 부착식 등온장치(1000c, 1000d)가 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결된 다음 이 둘은 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 9는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c) 및 유체밸브(120a, 120b)가 파이프라인(1004)을 통해 직렬로 연결되고, 그리고 유체밸브(120c, 120d)는 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.
도 10은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d) 및 유체밸브(120a)가 파이프라인(1004)을 통해 부착식 등온장치(1000a) 및 부착식 등온장치(1000b) 사이에 직렬로 연결되고, 유체밸브(120c)가 부착식 등온장치(1000c)와 부착식 등온장치(1000d) 사이에 직렬로 연결되고, 유체밸브(120a)와 유체밸브(120c)는 서로 통하는 파이프라인이 구비되어 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.
도 11은 본 발명에 따른 온도감지기(TS120)가 설치된 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 12는 본 발명에 따른 온도감지기(TS120a, TS120b)가 개별적으로 설치된 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 13은 본 발명에 따른 부착식 등온장치(1000a, 1000b)는 온도감지기(TS120a, TS120b)가 각각 설치되는데, 여기서 부착식 등온장치(1000a)는 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결되고, 그리고 부착식 등온장치(1000b)는 파이프라인(1004)을 통해 유체밸브(120b)와 직렬로 연결되며 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 14는 본 발명에 따른 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되는데, 여기서 부착식 등온장치(1000a)와 부착식 등온장치(1000b) 및 유체밸브(120b)는 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 부착식 등온장치(1000c)와 부착식 등온장치(1000d) 및 유체밸브(120d)는 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 15는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c)에 온도감지기(TS120a, TS120b, TS120c)가 각각 설치되는데, 여기서 부착식 등온장치(1000a), 유체밸브(120a), 부착식 등온장치(1000b), 유체밸브(120b), 부착식 등온장치(1000c)는 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 그리고 유체밸브(120c, 120d)가 병렬로 연결된 다음 유체 입력단 및 출력단 사이에 병렬로 연결되며, 유체밸브(120c)와 유체밸브(120a) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있고, 그리고 유체밸브(120d)와 유체밸브(120b) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있음에 따라 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 16은 본 발명에 따른 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되는데, 파이프라인(1004)을 통해 부착식 등온장치(1000a), 유체밸브(120a), 부착식 등온장치(1000b)는 순서에 따라 직렬로 연결되고, 그리고 부착식 등온장치(1000c), 유체밸브(120c), 부착식 등온장치(1000d)는 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되며, 유체밸브(120a)와 유체밸브(120c) 사이에는 서로 통하는 파이프라인이 구비됨에 따라 유체밸브(120a, 120b)는 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 17은 본 발명에 따른 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 18은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 19는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 각각 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120a, TV120b)에 의해 다시 병렬로 연결되어 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 20은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120b, TV120d)에 의해 제어된 다음 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.
도 21은 본 발명에 따른 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b), 온도 작동 유체밸브(TV120b), 부착식 등온장치(1000c)가 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 온도 작동 유체밸브(TV120c, TV120d)가 직렬로 연결된 다음 다시 파이프라인(1004)의 유체 입력단과 유체 출력단 사이에 병렬로 연결되고, 온도 작동 유체밸브(TV120a)와 온도 작동 유체밸브(TV120c) 간에는 서로 통하는 파이프라인이 구비되고, 온도 작동 유체밸브(TV120b)와 온도 작동 유체밸브(TV120d) 간에는 서로 통하는 파이프라인이 구비되며, 이에 따라 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.
도 22는 본 발명에 따른 여러 개의 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b)가 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 부착식 등온장치(1000c), 온도 작동 유체밸브(TV120c), 부착식 등온장치(1000d)가 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되어 파이프라인(1004)의 유체 입력단과 유체 출력단으로 이어지며, 온도 작동 유체밸브(TV120a)와 온도 작동 유체밸브(TV120c)는 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.
도 23은 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 회전 전기기기(2000) 표면에 부착 설치한 적용예를 도시한 것이다.
도 24는 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 공작기 몸체(3000) 표면에 부착 설치한 적용예를 도시한 것이다.
도 25는 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 변압기(4000) 표면에 부착 설치한 적용예를 도시한 것이다.
도 26은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 회전 전기기기(2000) 표면에 부착 설치한 적용예를 도시한 것이다.
도 27은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 공작기 몸체(3000) 표면에 부착 설치한 적용예를 도시한 것이다.
도 28은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 변압기(4000) 표면에 부착 설치한 적용예를 도시한 것이다.1 is a perspective view showing an embodiment in which an attachable isothermal device according to the present invention is bonded to an outer surface of a target 103 .
2 is a perspective view showing an embodiment in which the attachment isothermal device according to the present invention is bonded to the inner surface of the target 103. As shown in FIG.
3 is a perspective view three-dimensionally illustrating the structure of an attached isothermal device having an open surface having thermal insulation properties.
4 is a perspective view three-dimensionally illustrating the structure of an attached isothermal device having an open surface having thermal conductivity.
5 is a perspective view illustrating a temperature control system configured in a structure in which one attachable isothermal device 1000 according to the present invention is installed in series with the fluid valve 120 through a pipeline 1004 .
6 shows a temperature control system in which a plurality of attached isothermal devices 1000a and 1000b according to the present invention are connected in series through a pipeline 1004 and then installed in series with the fluid valve 120 again. is a perspective view.
7 is a perspective view showing a temperature control system in which a plurality of attached isothermal devices 1000a and 1000b according to the present invention are connected in series with each fluid valve through a pipeline 1004 and then connected in parallel again. am.
8 shows that the attached isothermal devices 1000a and 1000b according to the present invention are connected in series with the fluid valve 120b through a pipeline 1004, and the attached isothermal devices 1000c and 1000d are connected in series with the pipeline 1004. It is a perspective view showing a temperature control system having a structure in which the fluid valve 120a is connected in series and then the two are connected in parallel again.
9 shows several attachable isothermal devices 1000a, 1000b, 1000c and fluid valves 120a, 120b according to the present invention are connected in series through a pipeline 1004, and the fluid valves 120c and 120d are It is a perspective view showing a temperature control system configured to enable bypass bypass control.
10 shows several attached isothermal devices 1000a, 1000b, 1000c, 1000d and a fluid valve 120a in accordance with the present invention through a pipeline 1004 through an attached isothermal device 1000a and an attached isothermal device 1000b. ), a fluid valve 120c is connected in series between the attached isothermal device 1000c and the attached isothermal device 1000d, and the fluid valve 120a and the fluid valve 120c communicate with each other. It is a perspective view showing a temperature control system provided with a pipeline to enable bypass bypass control.
11 shows that one attachable isothermal device 1000 in which a temperature sensor TS120 according to the present invention is installed is installed in series with the fluid valve 120 through a pipeline 1004, and is installed in an electrical control device (ECU100). It is a perspective view showing a temperature control system composed of a structure controlled by
12 shows a plurality of attached isothermal devices 1000a and 1000b respectively installed with temperature sensors TS120a and TS120b according to the present invention are connected in series through a pipeline 1004 and then again in series with the fluid valve 120 It is a perspective view showing a temperature control system having a structure that is installed and controlled by an electric control unit (ECU100).
13 is an attached isothermal device (1000a, 1000b) according to the present invention is equipped with temperature sensors (TS120a, TS120b), respectively, where the attached isothermal device (1000a) is a fluid valve (120a) through a pipeline (1004) is connected in series with, and the attached isothermal device 1000b is connected in series with the fluid valve 120b through a pipeline 1004 and the two are again connected in parallel, and by the electric control unit ECU100 It is a perspective view showing a temperature control system configured with a controlled structure.
14 shows that temperature sensors TS120a, TS120b, TS120c, and TS120d are respectively installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d according to the present invention, where the attached isothermal device 1000a and the attached isothermal device are installed. 1000b and the fluid valve 120b are connected in series in order through the pipeline 1004, and the attached isothermal device 1000c, the attached isothermal device 1000d, and the fluid valve 120d are connected to the pipeline ( 1004) is a perspective view showing a temperature control system configured in a structure that is connected in series in order, the two are again connected in parallel, and is controlled by the electric control unit (ECU100).
15 shows temperature sensors TS120a, TS120b, and TS120c respectively installed in a plurality of attached isothermal devices 1000a, 1000b, and 1000c according to the present invention, wherein an attached isothermal device 1000a, a fluid valve 120a, The attached isothermal device 1000b, the fluid valve 120b, and the attached isothermal device 1000c are connected in series through the pipeline 1004 in order, and then the fluid valves 120c and 120d are connected in parallel. It is connected in parallel between the fluid input terminal and the output terminal, and between the fluid valve 120c and the fluid valve 120a, an operation that communicates with each other can be performed under the control of the electric control device (ECU100), and the fluid valve 120d and the fluid Between the valves 120b, an operation that communicates with each other can be performed by the control of the electric control unit (ECU100), so that bypass bypass control is possible, and can be controlled by the electric control unit (ECU100) It is a perspective view showing a temperature control system composed of a structure.
16 shows temperature sensors TS120a, TS120b, TS120c, and TS120d respectively installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d according to the present invention, and the attached isothermal device 1000a through a pipeline 1004 ), the fluid valve 120a, and the attached isothermal device 1000b are connected in series in this order, and the attached isothermal device 1000c, the fluid valve 120c, and the attached isothermal device 1000d are connected in this order Connected in series, these two are again connected in parallel, and as a pipeline communicating with each other is provided between the fluid valve 120a and the fluid valve 120c, the fluid valves 120a and 120b are bypassed to the side. It is a perspective view showing a temperature control system configured to enable control and to be controlled by an electric control unit (ECU100).
17 shows a temperature control system in which one attachable isothermal device 1000 according to the present invention is installed in series through a pipeline 1004 and is controlled by a temperature operating fluid valve TV120. is a perspective view.
18 is a structure in which several attachable isothermal devices 1000a and 1000b according to the present invention are connected in series through a pipeline 1004 and then installed in series again, and controlled by a temperature operating fluid valve TV120. It is a perspective view showing the configured temperature control system.
19 shows that several attached isothermal devices 1000a and 1000b according to the present invention are installed in series through a pipeline 1004, respectively, and are connected in parallel again by a temperature operating fluid valve TV120a, TV120b to control It is a perspective view showing a temperature control system composed of a structure.
Fig. 20 shows several attachable isothermal devices 1000a, 1000b, 1000c, 1000d according to the present invention connected in series through a pipeline 1004 and then installed in series again, and temperature operated fluid valves TV120b, TV120d It is a perspective view showing a temperature control system composed of a structure controlled by and then connected in parallel again.
21 shows an attached isothermal device 1000a, a temperature working fluid valve TV120a, an attached isothermal device 1000b, a temperature working fluid valve TV120b, and an attached isothermal device 1000c according to the present invention in order It is connected in series through the pipeline 1004, the temperature operated fluid valves TV120c and TV120d are connected in series, and then again connected in parallel between the fluid input end and the fluid output end of the pipeline 1004, and the temperature operated fluid valve (TV120c, TV120d) is connected in parallel. A pipeline communicating with each other is provided between TV120a) and the temperature working fluid valve TV120c, and a pipeline communicating with each other is provided between the temperature working fluid valve TV120b and the temperature working fluid valve TV120d. pass) is a perspective view showing a temperature control system configured to enable control.
22 shows several attached isothermal devices 1000a, temperature operated fluid valve TV120a, and attached isothermal devices 1000b according to the present invention connected in series through a pipeline 1004 in sequence, An isothermal device 1000c, a temperature-actuated fluid valve TV120c, and an attached isothermal device 1000d are connected in series in sequence through a pipeline 1004, which are again connected in parallel to the pipeline 1004 It leads to the fluid input terminal and the fluid output terminal of , and the temperature-operated fluid valve TV120a and the temperature-operated fluid valve TV120c are perspective views illustrating a temperature control system configured to enable bypass bypass control.
23 shows an application example in which an open surface according to the present invention is attached and installed on the surface of a rotating electric machine 2000 using an attached isothermal device having thermal insulation properties.
24 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the machine tool body 3000 using an attachment type isothermal device having thermal insulation properties.
25 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the transformer 4000 using an attached isothermal device having thermal insulation properties.
26 shows an application example in which an open surface according to the present invention is attached and installed on the surface of a rotating electric machine 2000 using an attached isothermal device having thermal conductivity.
27 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the machine tool body 3000 using an attached isothermal device having thermal conductivity.
28 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the transformer 4000 using an attached isothermal device having thermal conductivity.

본　발명은　전술한 바와 같은　문제점을 해결하기 위하여 창출된 것으로서, 본 발명의 목적은, 하나 혹은 그 이상의 열전달 접합면을 가진 부착식 등온장치(1000)가 자체에 마련된 유체관로(1001)를 통과하는 열전달 유체에 의해 접합면에 접합된 표적물의 외부 표면(5000) 및/또는 표적물의 내부 표면(5001)과 더불어 동일한 온도의 열을 전달하고, 온도 제어를 위한 표적물(103)은 축방전 전지, 또는 액정 표시 장치, 반도체기판, 열발산기, 에어컨 열교환기, 또는 정밀기계 혹은 다차원측정기의 케이스, 또는 케이스 외부 및/또는 내부에 선정된 위치를 포함하며, 외부의 펌핑을 통해 뜨거워지거나 차가워진 열전달 유체가 유체관 입구(1012), 상기 유체관로(1001) 및 다른 한쪽의 유체관 입구(1013)를 통해 접합된 표적물(103)에 대하여 뜨거워지거나 차가워지도록 하는 열전달을 수행하여 반도체 유닛, 태양 전지판(Photovoltaic, PV), 발광다이오드(LED) 혹은 축방전 전지 혹은 액정 표시 장치(LCD) 등과 같은 장치가 과열 또는 온도가 과도하게 낮아짐으로 인해 작동상의 성능이 떨어지는 문제점을 예방하고, 그리고/또는 전기모터, 발전기 혹은 변압기 등의 전기 기계 장치에 적용하는 경우, 부하가 증가하거나 환경 온도가 상승할 때 과열로 인해 효율이 떨어지고 심지어 소각되는 것을 예방하고, 그리고 정밀기계 혹은 다차원측정기의 기계 몸체에 적용하는 경우, 구조상의 기하학적 형상의 안정성과 정밀도를 유지토록 하는 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치를 제공하는데 있다.The present invention was created to solve the above-described problems, and an object of the present invention is to provide an attachment-type isothermal device 1000 having one or more heat transfer bonding surfaces through a fluid conduit 1001 provided therein. Transfer heat of the same temperature with the outer surface 5000 of the target and/or the inner surface 5001 of the target bonded to the bonding surface by a heat transfer fluid, and the target 103 for temperature control includes a discharge battery; or a liquid crystal display device, semiconductor substrate, heat exchanger, air conditioner heat exchanger, or a case of a precision machine or multi-dimensional measuring instrument, or a selected location outside and/or inside the case, and heat transfer that is heated or cooled through external pumping A semiconductor unit, a solar panel by performing heat transfer so that the fluid becomes hot or cold with respect to the bonded target 103 through the fluid pipe inlet 1012, the fluid pipe 1001, and the other fluid pipe inlet 1013 (Photovoltaic, PV), light emitting diode (LED) or storage discharge battery or liquid crystal display (LCD), etc. to prevent the problem that the operation performance is deteriorated due to overheating or excessively low temperature, and/or electric motor; , when applied to electric mechanical devices such as generators or transformers, when the load increases or the environmental temperature rises, to prevent efficiency loss and even incineration due to overheating, and when applied to the machine body of precision machines or multidimensional measuring instruments To provide a temperature control system and application device having an attached isothermal device and a heat transfer fluid to maintain the stability and precision of structural geometry.

본 발명의 그 밖의 목적, 특정한 장점들 및 신규한 특징들은　첨부된　도면들과 연관된　이하의 상세한 설명과 바람직한 실시예들로부터 더욱 분명해 질 것이다.　Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments associated with the accompanying drawings.

도 1은 본 발명에 따른 부착식 등온장치가 표적물(103)의 외부 표면에 접합된 실시예를 도시한 사시도이다.1 is a perspective view showing an embodiment in which an attachable isothermal device according to the present invention is bonded to an outer surface of a target 103 .

도 2는 본 발명에 따른 부착식 등온장치가 표적물(103)의 내부 표면에 접합된 실시예를 도시한 사시도이다.2 is a perspective view showing an embodiment in which the attachment isothermal device according to the present invention is bonded to the inner surface of the target 103. As shown in FIG.

본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치에 있어서, 표적물(103)에 부착되는 부착식 등온장치는 열전도성 재료로 구성되는데, 이는 오픈면이 단열성을 갖는 부착식 등온장치 및/또는 오픈면이 열전도성을 갖는 부착식 등온장치를 포함하여 구성되어 접착과 누름, 용접, 리베팅에 의한 접합 그리고 나사에 의한 조임에 의해 상기 표적물(103)의 열전달 성질을 갖는 구조면에 설치된다.In a temperature control system and application having an attached isothermal device and a heat transfer fluid according to the present invention, the attached isothermal device attached to the target 103 is made of a thermally conductive material, which is an attachment having an open surface having thermal insulation properties. It is composed of a type isothermal device and/or an attached type isothermal device whose open surface is thermally conductive, so that the heat transfer properties of the target 103 are improved by bonding, pressing, welding, bonding by riveting, and tightening by screws. installed on the structural surface with

도 3은 오픈면이 단열성을 갖는 부착식 등온장치의 구조를 입체적으로 도시한 사시도이다.3 is a perspective view three-dimensionally illustrating the structure of an attached isothermal device having an open surface having thermal insulation properties.

도 3에 도시된 바와 같이, 상기 부착식 등온장치(1000)는 금, 은, 구리, 알루미늄, 알루미늄-마그네슘 합금, 철 혹은 세라믹 재료 등과 같은 열전도성이 우수한 재질로 구성되고 유체관로(1001)가 구비되고, 그리고 상기 유체관로(1001)의 양쪽에는 파이프라인에 연결되는 유체 유입/유출구(1002)와 유체 유입/유출구(1003)가 구비되어 기체, 또는 액체, 또는 기체가 액체로 전환되거나 액체가 기체로 전환된 유체가 입력 및 출력되고, 아울러 상기 부착식 등온장치(1000)는 열에너지 전달면(1005)이 구비되고 상기 열에너지 전달면(1005) 외에 그 밖의 외부로 오픈된 표면에는 단열층(1010)이 구비되어 외부에 대한 방열, 전도 및 대류에 따른 열전달을 예방하거나 줄이며;As shown in FIG. 3 , the attachable isothermal device 1000 is made of a material having excellent thermal conductivity, such as gold, silver, copper, aluminum, an aluminum-magnesium alloy, iron, or a ceramic material, and the fluid pipe 1001 is and a fluid inlet/outlet 1002 and a fluid inlet/outlet 1003 connected to a pipeline are provided on both sides of the fluid conduit 1001 to convert gas, liquid, or gas into a liquid, or A fluid converted into a gas is input and output, and the attached isothermal device 1000 is provided with a heat energy transfer surface 1005, and a heat insulating layer 1010 is provided on other surfaces open to the outside in addition to the heat energy transfer surface 1005. is provided to prevent or reduce heat transfer due to heat dissipation, conduction and convection to the outside;

단일 상기 유체관로(1001)를 갖는 부착식 등온장치(1000)가 상기 표적물(103)에 부착 설치되는 방식은 접착, 압력, 용접, 리베팅에 의한 접합 방식과 나사 조임에 의한 고정 방식으로 상기 표적물(103)의 열전달 성질을 갖는 구조면에 설치된다.The method in which the attachment type isothermal device 1000 having the single fluid conduit 1001 is attached to the target 103 is a bonding method by bonding, pressure, welding, and riveting, and a fixing method by screwing. It is installed on the structural surface having the heat transfer properties of the target (103).

도 4는 오픈면이 열전도성을 갖는 부착식 등온장치의 구조를 입체적으로 도시한 사시도이다.4 is a perspective view three-dimensionally illustrating the structure of an attached isothermal device having an open surface having thermal conductivity.

도 4에 도시된 바와 같이, 상기 부착식 등온장치(1000)는 금, 은, 구리, 알루미늄, 알루미늄-마그네슘 합금, 철 혹은 세라믹 재료 등과 같은 열전도성이 우수한 재질로 구성되고 유체관로(1001)가 구비되고, 그리고 상기 유체관로(1001)의 양쪽에는 파이프라인에 연결되는 유체 유입/유출구(1002)와 유체 유입/유출구(1003)가 구비되어 기체, 또는 액체, 또는 기체가 액체로 전환되거나 액체가 기체로 전환된 유체가 입력 및 출력되고, 아울러 상기 유체관로(1001)는 열에너지 전달면(1005)이 구비되고 상기 열에너지 전달면(1005) 외에 그 밖의 외부로 오픈된 표면에는 외부에 대하여 열에너지 전달, 대류, 방열을 진행하기 위한 날개 시트(wing sheet) 구조의 방열 시트(1011)와 같은 구조를 가지며 외부에 대하여 열전달을 수행하며;As shown in FIG. 4 , the attachable isothermal device 1000 is made of a material having excellent thermal conductivity, such as gold, silver, copper, aluminum, an aluminum-magnesium alloy, iron, or a ceramic material, and the fluid pipe 1001 is and a fluid inlet/outlet 1002 and a fluid inlet/outlet 1003 connected to a pipeline are provided on both sides of the fluid conduit 1001 to convert gas, liquid, or gas into a liquid, or The fluid converted into gas is input and output, and the fluid conduit 1001 is provided with a heat energy transfer surface 1005, and in addition to the heat energy transfer surface 1005, other surfaces open to the outside transmit heat energy to the outside; It has the same structure as the heat dissipation sheet 1011 of a wing sheet structure for convection and heat dissipation and performs heat transfer to the outside;

상기 유체관로(1001)를 갖는 부착식 등온장치(1000)가 상기 표적물(103)에 부착 설치되는 방식은 접착, 압력, 용접, 리베팅에 의한 접합 방식과 나사 조임에 의한 고정 방식으로 상기 표적물(103)의 열전달 성질을 갖는 구조면에 설치된다.The method in which the attachment type isothermal device 1000 having the fluid conduit 1001 is attached to the target 103 is a bonding method by bonding, pressure, welding, and riveting and a fixing method by screwing the target. It is installed on the structural surface having the heat transfer properties of water (103).

본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치는, 부착식 등온장치(1000)를 표적물(103)의 열전도성을 가진 표면에 부착 설치하여 표적물(103)에 대하여 열에너지를 전송할 수 있을 뿐 아니라, 부착식 등온장치(1000)의 유체관로(1001)를 통과하는 유체는 추가로 유량제어장치 및/또는 흐름 방향 제어장치 및/또는 온도감지기 및/또는 전기제어장치 및/또는 입력제어장치 및/또는 전원공급장치 및/또는 온도 작동 유체밸브를 결합하여 부착식 등온장치(1000)의 유체관로(1001)를 통과하는 유체의 열림과 닫힘 그리고 유량, 흐름 방향을 제어한다.A temperature control system and application device having an attached isothermal device and a heat transfer fluid according to the present invention attaches the attached isothermal device 1000 to a surface having thermal conductivity of the target 103 and attaches it to the target 103. In addition to being able to transmit thermal energy to the attached isothermal device 1000 , the fluid passing through the fluid conduit 1001 may further include a flow control device and/or a flow direction control device and/or a temperature sensor and/or an electrical control device. And/or by combining the input control device and/or the power supply device and/or the temperature-operated fluid valve to control the opening and closing of the fluid passing through the fluid conduit 1001 of the attachable isothermal device 1000, and the flow rate and flow direction do.

도 5 내지 도 10은 본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치는, 표적물(103)의 열전도성을 가진 표면에 하나 혹은 그 이상의 유체밸브가 배치된 하나 혹은 그 이상의 부착식 등온장치가 설치된 온도제어 시스템의 적용예를 도시한 것이다.5 to 10 show a temperature control system and application device having an attached isothermal device and a heat transfer fluid according to the present invention, one or more fluid valves disposed on the thermally conductive surface of the target 103 or It shows an application example of a temperature control system in which more attached isothermal devices are installed.

도 5는 본 발명에 따른 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.5 is a perspective view illustrating a temperature control system configured in a structure in which one attachable isothermal device 1000 according to the present invention is installed in series with the fluid valve 120 through a pipeline 1004 .

도 5에 도시된 바와 같이, 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 유체밸브(120)는 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 상기 부착식 등온장치(1000)를 통과하는 유체의 유량을 조절함으로써 부착되는 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절한다.As shown in FIG. 5 , a temperature control system having a structure in which one attached isothermal device 1000 is installed in series with a fluid valve 120 through a pipeline 1004, wherein the fluid valve 120 is directly manipulated by manpower, or indirectly manipulated by mechanical force, electromagnetic force, atmospheric pressure, or liquid pressure controlled by manpower to control the opening and closing of the fluid valve, or by controlling the flow rate of the fluid, the attached isothermal device ( By controlling the flow rate of the fluid passing through 1000 , the thermal energy transferred with respect to the position of the target 103 to be attached is controlled.

도 6은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.6 shows a temperature control system in which a plurality of attached isothermal devices 1000a and 1000b according to the present invention are connected in series through a pipeline 1004 and then installed in series with the fluid valve 120 again. is a perspective view.

도 6에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 유체밸브(120)는 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 조절함으로써 부착되는 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절한다.As shown in FIG. 6, as a temperature control system consisting of a structure in which several attached isothermal devices 1000a and 1000b are connected in series through a pipeline 1004 and then installed in series with the fluid valve 120 again, Here, the fluid valve 120 is directly manipulated by manpower or indirectly manipulated by mechanical force, electromagnetic force, atmospheric pressure, or liquid pressure controlled by manpower to control the opening and closing of the fluid valve, or to control the flow rate of the fluid By controlling the flow rate of the fluid passing through the attachment isothermal device (1000a, 1000b) to adjust the thermal energy transmitted with respect to the position of the target 103 to be attached.

도 7은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 각각의 유체밸브와 직렬로 연결된 다음 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.7 is a perspective view showing a temperature control system in which a plurality of attached isothermal devices 1000a and 1000b according to the present invention are connected in series with each fluid valve through a pipeline 1004 and then connected in parallel again. am.

도 7에 도시된 바와 같이, 부착식 등온장치(1000a)가 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 설치되고, 그리고 부착식 등온장치(1000b)가 상기 파이프라인(1004)을 통해 유체밸브(120b)와 직렬로 연결된 다음 이 둘은 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템으로서, 여기서 각각의 상기 유체밸브(120a, 120b)는 개별 및/또는 공동으로 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 개별적으로 직렬 연결된 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 조절함으로써 부착되는 표적물(103)의 위치에 전송되는 열에너지를 조절한다.As shown in FIG. 7 , an attached isothermal device 1000a is installed in series with the fluid valve 120a through a pipeline 1004 , and an attached isothermal device 1000b connects the pipeline 1004 . It is a temperature control system configured to be connected in series with the fluid valve 120b through the two and then connected in parallel again, wherein each of the fluid valves 120a and 120b is individually and/or jointly operated directly by manpower. The attached isothermal device 1000a, which is individually connected in series by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by being indirectly operated by mechanical force, electromagnetic force, atmospheric pressure or liquid pressure controlled by manpower; By controlling the flow rate of the fluid passing through 1000b), the thermal energy transmitted to the position of the target 103 to be attached is controlled.

도 8은 본 발명에 따른 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 유체밸브(120b)와 직렬 연결되고, 그리고 부착식 등온장치(1000c, 1000d)가 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결된 다음 이 둘은 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.8 shows that the attached isothermal devices 1000a and 1000b according to the present invention are connected in series with the fluid valve 120b through a pipeline 1004, and the attached isothermal devices 1000c and 1000d are connected in series with the pipeline 1004. It is a perspective view showing a temperature control system having a structure in which the fluid valve 120a is connected in series and then the two are connected in parallel again.

도 8에 도시된 바와 같이, 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 유체밸브(120b)와 직렬 연결되고, 그리고 부착식 등온장치(1000c, 1000d)가 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결된 다음 이 둘은 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 유체밸브(120b, 120d)는 개별 및/또는 공동으로 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 표적물(103)의 각기 다른 위치에 각각 설치된 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 유체의 유량을 조절함으로써 부착되는 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절한다.As shown in FIG. 8 , the attached isothermal devices 1000a and 1000b are connected in series with the fluid valve 120b through a pipeline 1004 , and the attached isothermal devices 1000c and 1000d are connected to the pipeline 1004 . ) as a temperature control system configured to be connected in series with the fluid valve 120a through Or, it is indirectly operated by mechanical force, electromagnetic force, atmospheric pressure or liquid pressure controlled by manpower to control the opening and closing of the fluid valve, or by controlling the flow rate of the fluid to be installed at different positions of the target 103, respectively. By controlling the flow rate of the fluid passing through the attachment isothermal device (1000a, 1000b, 1000c, 1000d), the thermal energy transmitted with respect to the position of the attached target 103 is controlled.

도 9는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c) 및 유체밸브(120a, 120b)가 파이프라인(1004)을 통해 직렬로 연결되고, 그리고 유체밸브(120c, 120d)는 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.9 shows several attachable isothermal devices 1000a, 1000b, 1000c and fluid valves 120a, 120b according to the present invention are connected in series through a pipeline 1004, and the fluid valves 120c and 120d are It is a perspective view showing a temperature control system configured to enable bypass bypass control.

도 9에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a, 1000b, 1000c) 및 유체밸브(120a, 120b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 상기 파이프라인(1004)의 두 개의 입/출력단과 상기 유체밸브(120a) 및 유체밸브(120b) 사이에서 직렬로 연결된 유체밸브(120c) 및 유체밸브(120d)에 연결되는데, 여기서 상기 유체밸브(120c) 및 유체밸브(120d)는 측로 바이패스(by pass)를 제어하는 구조로 구성된 온도제어 시스템으로서, 여기서 각각의 상기 유체밸브(120a, 120b, 120c, 120d)는 개별 및/또는 공동으로 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 표적물(103)의 각기 다른 위치에 설치된 상기 부착식 등온장치(1000a, 1000b, 1000c)를 통과하는 유체의 유량을 개별적으로 조절함으로써 부착되는 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절한다.As shown in FIG. 9 , several attached isothermal devices 1000a , 1000b , 1000c and fluid valves 120a , 120b are connected in series through a pipeline 1004 , and then again in two parts of the pipeline 1004 . It is connected to a fluid valve 120c and a fluid valve 120d connected in series between the input/output terminals and the fluid valve 120a and the fluid valve 120b, where the fluid valve 120c and the fluid valve 120d) is a temperature control system configured to control a bypass bypass (by pass), wherein each of the fluid valves (120a, 120b, 120c, 120d) is individually and/or jointly operated directly by manpower, or The attached isothermal device installed at different positions of the target 103 by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by being indirectly operated by mechanical force, electromagnetic force, atmospheric pressure or liquid pressure controlled by By individually adjusting the flow rate of the fluid passing through 1000a, 1000b, 1000c, the thermal energy transmitted with respect to the position of the target 103 to be attached is controlled.

도 10은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d) 및 유체밸브(120a)가 파이프라인(1004)을 통해 부착식 등온장치(1000a) 및 부착식 등온장치(1000b) 사이에 직렬로 연결되고, 유체밸브(120c)가 부착식 등온장치(1000c)와 부착식 등온장치(1000d) 사이에 직렬로 연결되고, 유체밸브(120a)와 유체밸브(120c)는 서로 통하는 파이프라인이 구비되어 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.10 shows several attached isothermal devices 1000a, 1000b, 1000c, 1000d and a fluid valve 120a in accordance with the present invention through a pipeline 1004 through an attached isothermal device 1000a and an attached isothermal device 1000b. ), a fluid valve 120c is connected in series between the attached isothermal device 1000c and the attached isothermal device 1000d, and the fluid valve 120a and the fluid valve 120c communicate with each other. It is a perspective view showing a temperature control system provided with a pipeline to enable bypass bypass control.

도 10에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d) 및 유체밸브(120a)가 파이프라인(1004)을 통해 부착식 등온장치(1000a) 및 부착식 등온장치(1000b) 사이에 직렬로 연결되고, 유체밸브(120c)가 부착식 등온장치(1000c)와 부착식 등온장치(1000d) 사이에 직렬로 연결되고, 유체밸브(120a)와 유체밸브(120c)는 서로 통하는 파이프라인이 구비되어 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템으로서, 여기서 각각의 상기 유체밸브(120a, 120c)는 개별 및/또는 공동으로 인력에 의해 직접 조작되거나, 인력에 의해 제어되는 기계력, 전자기력, 기압력 또는 액체압력에 의해 간접적으로 조작되어 유체밸브의 열림과 닫힘을 제어하거나, 유체의 유량을 제어하여 각기 다른 위치에 설치된 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 유체의 유량을 개별적으로 조절함으로써 부착되는 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절한다. As shown in FIG. 10, several attached isothermal devices 1000a, 1000b, 1000c, 1000d and a fluid valve 120a are connected through a pipeline 1004 to an attached isothermal device 1000a and an attached isothermal device ( 1000b), a fluid valve 120c is connected in series between the attached isothermal device 1000c and the attached isothermal device 1000d, and the fluid valve 120a and the fluid valve 120c are connected to each other. A temperature control system provided with a passing pipeline to enable bypass control, wherein each of the fluid valves 120a and 120c is individually and/or jointly operated directly by manpower, or The attachment isothermal devices 1000a, 1000b, 1000c installed in different positions by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by being indirectly operated by mechanical force, electromagnetic force, atmospheric pressure or liquid pressure controlled by , 1000d) by individually adjusting the flow rate of the fluid passing through it, the thermal energy transmitted relative to the position of the target 103 to be attached is controlled.

도 11 내지 도 16은 본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치는, 표적물(103)의 열전도성을 가진 표면에 하나 혹은 그 이상의 온도감지기, 전기제어장치 및 이들에 의해 제어되는 유체밸브가 배치된 하나 혹은 그 이상의 부착식 등온장치가 설치된 온도제어 시스템의 적용예를 도시한 것이다.11 to 16 show a temperature control system and application device having an attached isothermal device and a heat transfer fluid according to the present invention, one or more temperature sensors, an electric control device and An example of the application of a temperature control system in which one or more attached isothermal devices are arranged with fluid valves controlled by them is shown.

도 11은 본 발명에 따른 온도감지기(TS120)가 설치된 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.11 shows that one attachable isothermal device 1000 in which a temperature sensor TS120 according to the present invention is installed is installed in series with the fluid valve 120 through a pipeline 1004, and is installed in an electrical control device (ECU100). It is a perspective view showing a temperature control system composed of a structure controlled by

도 11에 도시된 바와 같이, 온도감지기(TS120)가 설치된 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120)에 의해 감지된 메시지를 전달 받아 상기 유체밸브(120)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 조절하여 상기 부착식 등온장치(1000)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 11 , one attachable isothermal device 1000 in which a temperature sensor TS120 is installed is installed in series with the fluid valve 120 through a pipeline 1004 , and an electric control device (ECU100) As a temperature control system configured to be controlled by The thermal energy transferred to the target 103 is changed by controlling the opening and closing of the or adjusting the flow rate of the passing fluid to control the flow rate of the fluid passing through the attachable isothermal device 1000, where,

상기 전기제어장치(ECU100)는 한 가지 혹은 그 이상의 장치로 구성되는데, 이는 1) 전기-기계식 회로장치, 2) 고체 전자회로장치, 3) 마이크로 프로세서 혹은 단일칩 제어장치, 소프트웨어, 작동 프로그램 및 주변 회로장치로 구성되는 것을 포함하고;The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;

상기 입력제어장치(IP100)는 인공 입력 혹은 입력 신호 혹은 조작 명령을 접수하는 휴먼 머신 인터페이스로 구성되고;the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;

그리고 전원공급장치(PS100)는 시스템 작동에 필요한 전기에너지를 공급한다.And the power supply device (PS100) supplies electrical energy required for system operation.

도 12는 본 발명에 따른 온도감지기(TS120a, TS120b)가 개별적으로 설치된 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.12 shows a plurality of attached isothermal devices 1000a and 1000b respectively installed with temperature sensors TS120a and TS120b according to the present invention are connected in series through a pipeline 1004 and then again in series with the fluid valve 120 It is a perspective view showing a temperature control system having a structure that is installed and controlled by an electric control unit (ECU100).

도 12에 도시된 바와 같이, 온도감지기(TS120a, TS120b)가 개별적으로 설치된 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 유체밸브(120)와 직렬로 설치되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120a, TS120b)에 의해 감지된 메시지를 참조하여 상기 유체밸브(120)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 조절하여 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 12 , a plurality of attached isothermal devices 1000a and 1000b respectively installed with temperature sensors TS120a and TS120b are connected in series through a pipeline 1004 and then again in series with the fluid valve 120 . A temperature control system installed in a furnace and configured to be controlled by an electric control unit (ECU100), wherein the electric control unit (ECU100) is a message of the input control unit (IP100) and the temperature sensors (TS120a, TS120b) By controlling the opening and closing of the fluid valve 120 with reference to the message sensed by the control or controlling the flow rate of the fluid passing through the attached isothermal device (1000a, 1000b) by controlling the flow rate of the passing through the target Let the thermal energy transferred to (103) change, where,

도 13은 본 발명에 따른 부착식 등온장치(1000a, 1000b)는 온도감지기(TS120a, TS120b)가 각각 설치되는데, 여기서 부착식 등온장치(1000a)는 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결되고, 그리고 부착식 등온장치(1000b)는 파이프라인(1004)을 통해 유체밸브(120b)와 직렬로 연결되며 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.13 is an attached isothermal device (1000a, 1000b) according to the present invention is equipped with temperature sensors (TS120a, TS120b), respectively, where the attached isothermal device (1000a) is a fluid valve (120a) through a pipeline (1004) is connected in series with, and the attached isothermal device 1000b is connected in series with the fluid valve 120b through a pipeline 1004 and the two are again connected in parallel, and by the electric control unit ECU100 It is a perspective view showing a temperature control system configured with a controlled structure.

도 13에 도시된 바와 같이, 부착식 등온장치(1000a, 1000b)는 온도감지기(TS120a, TS120b)가 각각 설치되는데, 여기서 상기 부착식 등온장치(1000a)는 파이프라인(1004)을 통해 유체밸브(120a)와 직렬로 연결되고, 그리고 상기 부착식 등온장치(1000b)는 상기 파이프라인(1004)을 통해 유체밸브(120b)와 직렬로 연결되며 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120a, TS120b)에 의해 감지된 메시지를 참조하여 상기 유체밸브(120a, 120b)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 개별적으로 조절하여 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 13, the attached isothermal devices 1000a and 1000b are provided with temperature sensors TS120a and TS120b, respectively, where the attached isothermal device 1000a is connected to a fluid valve through a pipeline 1004 ( 120a), and the attached isothermal device 1000b is connected in series with the fluid valve 120b through the pipeline 1004, which are again connected in parallel, and an electric control device ( A temperature control system configured to be controlled by ECU100), wherein the electric control unit (ECU100) refers to the message of the input control unit (IP100) and the message sensed by the temperature sensors (TS120a, TS120b). Controlling the opening and closing of the valves 120a and 120b or individually adjusting the flow rate of the passing fluid to control the flow rate of the fluid passing through the attachable isothermal devices 1000a and 1000b and deliver it to the target 103 It causes the heat energy to be changed, where,

도 14는 본 발명에 따른 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되는데, 여기서 부착식 등온장치(1000a)와 부착식 등온장치(1000b) 및 유체밸브(120b)는 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 부착식 등온장치(1000c)와 부착식 등온장치(1000d) 및 유체밸브(120d)는 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.14 shows that temperature sensors TS120a, TS120b, TS120c, and TS120d are respectively installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d according to the present invention, where the attached isothermal device 1000a and the attached isothermal device are installed. 1000b and the fluid valve 120b are connected in series in order through the pipeline 1004, and the attached isothermal device 1000c, the attached isothermal device 1000d, and the fluid valve 120d are connected to the pipeline ( 1004) is a perspective view showing a temperature control system configured in a structure that is connected in series in order, the two are again connected in parallel, and is controlled by the electric control unit (ECU100).

도 14에 도시된 바와 같이, 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되는데, 여기서 상기 부착식 등온장치(1000a)와 상기 부착식 등온장치(1000b) 및 유체밸브(120b)는 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 상기 부착식 등온장치(1000c)와 상기 부착식 등온장치(1000d) 및 유체밸브(120d)는 상기 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 이 둘은 다시 병렬로 연결되고, 그리고 전기제어장치(ECU100)에 의해 제어되는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120a, TS120b, TS120c, TS120d)에 의해 감지된 메시지를 접수하여 상기 유체밸브(120b, 120d)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 개별적으로 조절하여 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 14, temperature sensors TS120a, TS120b, TS120c, and TS120d are installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d, respectively, where the attached isothermal device 1000a and the attachment A type isothermal device 1000b and a fluid valve 120b are connected in series through a pipeline 1004 in sequence, and the attached isothermal device 1000c, the attached isothermal device 1000d, and the fluid valve 120d are connected in series. ) is connected in series in sequence through the pipeline 1004, the two are again connected in parallel, and a temperature control system configured to be controlled by an electric control unit (ECU100), wherein the electric control The device ECU100 receives the message of the input control device IP100 and the message sensed by the temperature sensors TS120a, TS120b, TS120c, TS120d to control or pass the opening and closing of the fluid valves 120b and 120d By individually adjusting the flow rate of the fluid to control the flow rate of the fluid passing through the attachment isothermal device (1000a, 1000b, 1000c, 1000d) to change the thermal energy transferred to the target 103, where,

도 15는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c)에 온도감지기(TS120a, TS120b, TS120c)가 각각 설치되는데, 여기서 부착식 등온장치(1000a), 유체밸브(120a), 부착식 등온장치(1000b), 유체밸브(120b), 부착식 등온장치(1000c)는 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 그리고 유체밸브(120c, 120d)가 병렬로 연결된 다음 유체 입력단 및 출력단 사이에 병렬로 연결되며, 유체밸브(120c)와 유체밸브(120a) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있고, 그리고 유체밸브(120d)와 유체밸브(120b) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있음에 따라 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.15 shows temperature sensors TS120a, TS120b, and TS120c respectively installed in a plurality of attached isothermal devices 1000a, 1000b, and 1000c according to the present invention, wherein an attached isothermal device 1000a, a fluid valve 120a, The attached isothermal device 1000b, the fluid valve 120b, and the attached isothermal device 1000c are connected in series through the pipeline 1004 in order, and then the fluid valves 120c and 120d are connected in parallel. It is connected in parallel between the fluid input terminal and the output terminal, and between the fluid valve 120c and the fluid valve 120a, an operation that communicates with each other can be performed under the control of the electric control device (ECU100), and the fluid valve 120d and the fluid Between the valves 120b, an operation that communicates with each other can be performed by the control of the electric control unit (ECU100), so that bypass bypass control is possible, and can be controlled by the electric control unit (ECU100) It is a perspective view showing a temperature control system composed of a structure.

도 15에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a, 1000b, 1000c)에 온도감지기(TS120a, TS120b, TS120c)가 각각 설치되는데, 여기서 부착식 등온장치(1000a), 유체밸브(120a), 부착식 등온장치(1000b), 유체밸브(120b), 부착식 등온장치(1000c)는 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 그리고 유체밸브(120c, 120d)가 병렬로 연결된 다음 유체 입력단 및 출력단 사이에 병렬로 연결되며, 유체밸브(120c)와 유체밸브(120a) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있고, 그리고 유체밸브(120d)와 유체밸브(120b) 간에는 전기제어장치(ECU100)의 제어에 의해 서로 통하는 작동을 수행할 수 있음에 따라 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템으로, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120a, TS120b, TS120c, TS120d)에 의해 감지된 메시지를 접수하여 상기 유체밸브(120a, 120b, 120c, 120d)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 개별적으로 조절하여 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 15, temperature sensors TS120a, TS120b, and TS120c are installed in a plurality of attached isothermal devices 1000a, 1000b, and 1000c, respectively, where the attached isothermal device 1000a and the fluid valve 120a are installed. , the attached isothermal device 1000b, the fluid valve 120b, and the attached isothermal device 1000c are sequentially connected in series through the pipeline 1004, and the fluid valves 120c and 120d are connected in parallel It is connected in parallel between the next fluid input terminal and the output terminal, and between the fluid valve 120c and the fluid valve 120a, an operation to communicate with each other can be performed under the control of the electric control unit (ECU100), and the fluid valve 120d and Between the fluid valves 120b, an operation to be communicated with each other can be performed by the control of the electric control device (ECU100), so that bypass bypass control is possible, and to be controlled by the electric control device (ECU100) A temperature control system having a structure that can Controlling the opening and closing of the valves 120a, 120b, 120c, and 120d or controlling the flow rate of the fluid passing through the attached isothermal device 1000a, 1000b, 1000c, 1000d by individually adjusting the flow rate of the passing fluid to change the thermal energy transferred to the target 103, where,

도 16은 본 발명에 따른 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되는데, 파이프라인(1004)을 통해 부착식 등온장치(1000a), 유체밸브(120a), 부착식 등온장치(1000b)는 순서에 따라 직렬로 연결되고, 그리고 부착식 등온장치(1000c), 유체밸브(120c), 부착식 등온장치(1000d)는 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되며, 유체밸브(120a)와 유체밸브(120c) 사이에는 서로 통하는 파이프라인이 구비됨에 따라 유체밸브(120a, 120b)는 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.16 shows temperature sensors TS120a, TS120b, TS120c, and TS120d respectively installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d according to the present invention, and the attached isothermal device 1000a through a pipeline 1004 ), the fluid valve 120a, and the attached isothermal device 1000b are connected in series in this order, and the attached isothermal device 1000c, the fluid valve 120c, and the attached isothermal device 1000d are connected in this order Connected in series, these two are again connected in parallel, and as a pipeline communicating with each other is provided between the fluid valve 120a and the fluid valve 120c, the fluid valves 120a and 120b are bypassed to the side. It is a perspective view showing a temperature control system configured to enable control and to be controlled by an electric control unit (ECU100).

도 16에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d)에 온도감지기(TS120a, TS120b, TS120c, TS120d)가 각각 설치되고, 파이프라인(1004)을 통해 상기 부착식 등온장치(1000a), 상기 유체밸브(120a), 상기 부착식 등온장치(1000b)는 순서에 따라 직렬로 연결되고, 그리고 상기 부착식 등온장치(1000c), 상기 유체밸브(120c), 상기 부착식 등온장치(1000d)는 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되며, 상기 유체밸브(120a)와 상기 유체밸브(120c) 사이에는 서로 통하는 파이프라인이 구비됨에 따라 상기 유체밸브(120a, 120b)는 측로 바이패스(by pass) 제어가 가능토록 하고, 그리고 전기제어장치(ECU100)에 의해 제어될 수 있는 구조로 구성된 온도제어 시스템으로서, 여기서 상기 전기제어장치(ECU100)는 입력제어장치(IP100)의 메시지 및 상기 온도감지기(TS120a, TS120b, TS120c, TS120d)에 의해 감지된 메시지를 접수하여 상기 유체밸브(120a, 120b)의 열림과 닫힘을 제어하거나 통과하는 유체의 유량 크기를 개별적으로 조절하여 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 유체의 유량을 제어하여 표적물(103)에 전달되는 열에너지가 바뀌도록 하는데, 여기서,As shown in FIG. 16 , temperature sensors TS120a, TS120b, TS120c, and TS120d are installed in several attached isothermal devices 1000a, 1000b, 1000c, and 1000d, respectively, and the attachment type through a pipeline 1004 The isothermal device 1000a, the fluid valve 120a, and the attached isothermal device 1000b are connected in series in this order, and the attached isothermal device 1000c, the fluid valve 120c, and the attached isothermal device are connected in series. The isothermal device 1000d is connected in series in order, the two are again connected in parallel, and as a pipeline communicating with each other is provided between the fluid valve 120a and the fluid valve 120c, the fluid valve ( 120a and 120b are temperature control systems configured to enable bypass bypass control and to be controlled by an electric controller ECU100, wherein the electric controller ECU100 controls input By receiving the message of the device IP100 and the message detected by the temperature sensors TS120a, TS120b, TS120c, TS120d, the opening and closing of the fluid valves 120a and 120b are controlled or the flow rate of the passing fluid is individually measured. to control the flow rate of the fluid passing through the attachable isothermal device 1000a, 1000b, 1000c, 1000d by adjusting to change the thermal energy delivered to the target 103, where,

도 17 내지 도 22는 본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치는, 표적물(103)의 열전도성을 가진 표면에 온도 작동 유체밸브가 배치된 하나 혹은 그 이상의 부착식 등온장치가 설치된 온도제어 시스템의 적용예를 도시한 것이다.17 to 22 show a temperature control system and application having an attached isothermal device and a heat transfer fluid according to the present invention, one or more temperature-actuated fluid valves disposed on the thermally conductive surface of the target 103 It shows an application example of a temperature control system in which an attached isothermal device is installed.

도 17은 본 발명에 따른 하나의 부착식 등온장치(1000)가 파이프라인(1004)을 통해 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.17 shows a temperature control system in which one attachable isothermal device 1000 according to the present invention is installed in series through a pipeline 1004 and is controlled by a temperature operating fluid valve TV120. is a perspective view.

도 17에 도시된 바와 같이, 상기 온도 작동 유체밸브(TV120)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 부착식 등온장치(1000) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 자신이 속하는 상기 부착식 등온장치(1000)를 통과하는 유체의 유량을 제어함으로써 상기 부착식 등온장치(1000)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 조절토록 한다.As shown in FIG. 17 , the temperature-operated fluid valve TV120 is a fluid valve having an open or close function or a function of changing the flow rate of a passing fluid according to the sensed temperature, and an attached isothermal device 1000 and / or installed on the target 103, the function of which is that each temperature-actuated fluid valve controls the flow rate of the fluid passing through the attached isothermal device 1000 to which it belongs according to the sensed temperature. The isothermal device 1000 controls the thermal energy transmitted with respect to the position of the target 103 to which it is attached.

도 18은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120)에 의해 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.18 is a structure in which several attachable isothermal devices 1000a and 1000b according to the present invention are connected in series through a pipeline 1004 and then installed in series again, and controlled by a temperature operating fluid valve TV120. It is a perspective view showing the configured temperature control system.

도 18에 도시된 바와 같이, 상기 온도 작동 유체밸브(TV120)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 부착식 등온장치(1000a, 1000b) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 자신이 속하는 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 제어함으로써 상기 부착식 등온장치(1000a, 1000b)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 개별적으로 조절토록 한다.As shown in FIG. 18 , the temperature-operated fluid valve TV120 is a fluid valve having an open or close function or a function of changing the flow rate of a passing fluid according to the sensed temperature, and is an attached isothermal device 1000a, 1000b. ) and/or installed on the target 103, the function of which is to control the flow rate of fluid passing through the attached isothermal device 1000a, 1000b to which each temperature-operated fluid valve belongs according to the sensed temperature. By doing so, the attached isothermal devices 1000a and 1000b individually control the thermal energy transmitted with respect to the position of the target 103 to which they are attached.

도 19는 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b)가 파이프라인(1004)을 통해 각각 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120a, TV120b)에 의해 다시 병렬로 연결되어 제어되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.19 shows that several attached isothermal devices 1000a and 1000b according to the present invention are installed in series through a pipeline 1004, respectively, and are connected in parallel again by a temperature operating fluid valve TV120a, TV120b to control It is a perspective view showing a temperature control system composed of a structure.

도 19에 도시된 바와 같이, 온도 작동 유체밸브(TV120a)와 부착식 등온장치(1000a)는 직렬로 연결되고, 그리고 온도 작동 유체밸브(TV120b)와 부착식 등온장치(1000b)는 직렬로 연결되고, 이 둘은 다시 병렬로 연결되며, 상기 온도 작동 유체밸브(TV120a)와 상기 온도 작동 유체밸브(TV120b)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 상기 부착식 등온장치(1000a) 및 상기 부착식 등온장치(1000b) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 자신이 속하는 상기 부착식 등온장치(1000a, 1000b)를 통과하는 유체의 유량을 제어함으로써 상기 부착식 등온장치(1000a, 1000b)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 개별적으로 조절토록 한다.19, the temperature-actuated fluid valve TV120a and the attached isothermal device 1000a are connected in series, and the temperature-actuated fluid valve TV120b and the attached isothermal device 1000b are connected in series, and , these two are again connected in parallel, and the temperature-operated fluid valve TV120a and the temperature-operated fluid valve TV120b have a function of opening or closing or changing the flow rate of a passing fluid according to the sensed temperature. As a valve, it is installed on the attached isothermal device 1000a and the attached isothermal device 1000b and/or the target 103, the function of which is that each temperature-actuated fluid valve has its own function depending on the sensed temperature. By controlling the flow rate of the fluid passing through the attached isothermal device (1000a, 1000b) belonging to the attached isothermal device (1000a, 1000b), the thermal energy transmitted with respect to the position of the target 103 to which it is attached to be adjusted individually.

도 20은 본 발명에 따른 여러 개의 부착식 등온장치(1000a, 1000b, 1000c, 1000d)가 파이프라인(1004)을 통해 직렬로 연결된 다음 다시 직렬로 설치되고, 그리고 온도 작동 유체밸브(TV120b, TV120d)에 의해 제어된 다음 다시 병렬로 연결되는 구조로 구성된 온도제어 시스템을 도시한 사시도이다.Fig. 20 shows several attachable isothermal devices 1000a, 1000b, 1000c, 1000d according to the present invention connected in series through a pipeline 1004 and then installed in series again, and temperature operated fluid valves TV120b, TV120d It is a perspective view showing a temperature control system composed of a structure controlled by and then connected in parallel again.

도 20에 도시된 바와 같이, 온도 작동 유체밸브(TV120b)와 부착식 등온장치(1000a, 1000b)는 직렬로 연결되고, 온도 작동 유체밸브(TV120d)와 부착식 등온장치(1000c, 1000d)는 직렬로 연결되고, 이 둘은 다시 병렬로 연결되며, 상기 온도 작동 유체밸브(TV120b) 및 상기 온도 작동 유체밸브(TV120d)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 상기 부착식 등온장치(1000b) 및 상기 부착식 등온장치(1000d) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 자신이 속하는 직렬로 연결된 상기 부착식 등온장치(1000a, 1000b) 및 직렬로 연결된 상기 부착식 등온장치(1000c, 1000d)를 통과하는 유체의 유량을 제어함으로써 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 개별적으로 조절토록 한다.As shown in FIG. 20 , the temperature operating fluid valve TV120b and the attached isothermal devices 1000a and 1000b are connected in series, and the temperature operating fluid valve TV120d and the attached isothermal devices 1000c and 1000d are connected in series. and the two are again connected in parallel, and the temperature working fluid valve (TV120b) and the temperature working fluid valve (TV120d) function to open or close or change the flow rate of the passing fluid according to the sensed temperature. A fluid valve with the attached isothermal device (1000b) and the attached isothermal device (1000d) and/or installed on the target (103), the function of which is that each temperature-operated fluid valve depends on the sensed temperature. By controlling the flow rate of the fluid passing through the series-connected isothermal device (1000a, 1000b) and the series-connected attached isothermal device (1000c, 1000d) to which they belong, the attached isothermal device (1000a, 1000b, 1000c, 1000d) to individually control the thermal energy transmitted with respect to the position of the target 103 to which it is attached.

도 21은 본 발명에 따른 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b), 온도 작동 유체밸브(TV120b), 부착식 등온장치(1000c)가 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 온도 작동 유체밸브(TV120c, TV120d)가 직렬로 연결된 다음 다시 파이프라인(1004)의 유체 입력단과 유체 출력단 사이에 병렬로 연결되고, 온도 작동 유체밸브(TV120a)와 온도 작동 유체밸브(TV120c) 간에는 서로 통하는 파이프라인이 구비되고, 온도 작동 유체밸브(TV120b)와 온도 작동 유체밸브(TV120d) 간에는 서로 통하는 파이프라인이 구비되며, 이에 따라 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.21 shows an attached isothermal device 1000a, a temperature working fluid valve TV120a, an attached isothermal device 1000b, a temperature working fluid valve TV120b, and an attached isothermal device 1000c according to the present invention in order It is connected in series through the pipeline 1004, the temperature operated fluid valves TV120c and TV120d are connected in series, and then again connected in parallel between the fluid input end and the fluid output end of the pipeline 1004, and the temperature operated fluid valve (TV120c, TV120d) is connected in parallel. A pipeline communicating with each other is provided between TV120a) and the temperature working fluid valve TV120c, and a pipeline communicating with each other is provided between the temperature working fluid valve TV120b and the temperature working fluid valve TV120d. pass) is a perspective view showing a temperature control system configured to enable control.

도 21에 도시된 바와 같이, 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b), 온도 작동 유체밸브(TV120b), 부착식 등온장치(1000c)가 순서에 따라 파이프라인(1004)을 통해 직렬로 연결되고, 온도 작동 유체밸브(TV120c, TV120d)가 직렬로 연결된 다음 다시 상기 파이프라인(1004)의 유체 입력단과 유체 출력단 사이에 병렬로 연결되고, 상기 온도 작동 유체밸브(TV120a)와 상기 온도 작동 유체밸브(TV120c) 간에는 서로 통하는 파이프라인이 구비되고, 상기 온도 작동 유체밸브(TV120b)와 상기 온도 작동 유체밸브(TV120d) 간에는 서로 통하는 파이프라인이 구비되며, 이에 따라 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템으로서, 여기서 상기 온도 작동 유체밸브(TV120a, TV120b, TV120c, TV120d)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 상기 부착식 등온장치(1000a, 1000b, 1000c) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 자신이 속하는 병렬로 연결된 상기 부착식 등온장치(1000a, 1000b, 1000c)를 통과하는 유체의 유량을 제어함으로써 상기 부착식 등온장치(1000a, 1000b, 1000c)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 개별적으로 조절토록 한다.As shown in FIG. 21 , an attached isothermal device 1000a, a temperature working fluid valve TV120a, an attached isothermal device 1000b, a temperature working fluid valve TV120b, and an attached isothermal device 1000c are in this order. is connected in series through the pipeline 1004, and the temperature operated fluid valves TV120c and TV120d are connected in series and then again connected in parallel between the fluid input end and the fluid output end of the pipeline 1004, the temperature actuation A pipeline communicating with each other is provided between the fluid valve TV120a and the temperature working fluid valve TV120c, and a pipeline communicating with each other between the temperature working fluid valve TV120b and the temperature working fluid valve TV120d is provided. As a temperature control system configured to enable bypass control according to A fluid valve having a changing function, which is installed on the attachable isothermal device (1000a, 1000b, 1000c) and/or the target (103), the function of which is that each temperature-operated fluid valve has its own function according to the sensed temperature. By controlling the flow rate of the fluid passing through the attached isothermal device (1000a, 1000b, 1000c) connected in parallel to which it belongs, the attached isothermal device (1000a, 1000b, 1000c) causes the target 103 to which it is attached The heat energy transferred for each position is individually controlled.

도 22는 본 발명에 따른 여러 개의 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b)가 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 부착식 등온장치(1000c), 온도 작동 유체밸브(TV120c), 부착식 등온장치(1000d)가 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되어 파이프라인(1004)의 유체 입력단과 유체 출력단으로 이어지며, 온도 작동 유체밸브(TV120a)와 온도 작동 유체밸브(TV120c)는 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템을 도시한 사시도이다.22 shows several attached isothermal devices 1000a, temperature operated fluid valve TV120a, and attached isothermal devices 1000b according to the present invention connected in series through a pipeline 1004 in sequence, An isothermal device 1000c, a temperature-actuated fluid valve TV120c, and an attached isothermal device 1000d are connected in series in sequence through a pipeline 1004, which are again connected in parallel to the pipeline 1004 It leads to the fluid input terminal and the fluid output terminal of , and the temperature-operated fluid valve TV120a and the temperature-operated fluid valve TV120c are perspective views illustrating a temperature control system configured to enable bypass bypass control.

도 22에 도시된 바와 같이, 여러 개의 부착식 등온장치(1000a), 온도 작동 유체밸브(TV120a), 부착식 등온장치(1000b)가 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되며, 부착식 등온장치(1000c), 온도 작동 유체밸브(TV120c), 부착식 등온장치(1000d)가 상기 파이프라인(1004)을 통해 순서에 따라 직렬로 연결되고, 이 둘은 다시 병렬로 연결되어 상기 파이프라인(1004)의 유체 입력단과 유체 출력단으로 이어지며, 상기 온도 작동 유체밸브(TV120a)와 상기 온도 작동 유체밸브(TV120c)는 측로 바이패스(by pass) 제어가 가능토록 구성된 온도제어 시스템으로서, 여기서 상기 온도 작동 유체밸브(TV120a, TV120c)는 감지된 온도에 따라 열림 혹은 닫힘 기능 또는 통과하는 유체의 유량을 변화시키는 기능을 가진 유체밸브로, 상기 부착식 등온장치(1000a, 1000b, 1000c) 및/또는 표적물(103)상에 설치되고, 그 기능은 각각의 온도 작동 유체밸브가 감지된 온도에 따라 배분된 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)를 통과하는 개별적인 지류의 유량을 제어함으로써 상기 부착식 등온장치(1000a, 1000b, 1000c, 1000d)로 하여금 자신이 부착되는 상기 표적물(103)의 위치에 대하여 전송되는 열에너지를 개별적으로 조절토록 한다.As shown in FIG. 22 , several attached isothermal devices 1000a , temperature operated fluid valves TV120a , and attached isothermal devices 1000b are sequentially connected in series through a pipeline 1004 and attached A type isothermal device 1000c, a temperature-actuated fluid valve TV120c, and an attached isothermal device 1000d are connected in series through the pipeline 1004 in sequence, the two being again connected in parallel to the pipeline Leading to the fluid input terminal and the fluid output terminal of ( 1004 ), the temperature operating fluid valve TV120a and the temperature operating fluid valve TV120c are temperature control systems configured to enable bypass bypass control, wherein the The temperature-operated fluid valves TV120a and TV120c are fluid valves having a function of opening or closing or changing the flow rate of a passing fluid according to the sensed temperature, and the attached isothermal devices 1000a, 1000b, 1000c and/or Installed on target 103, the function of which is to control the flow of individual tributaries through the attached isothermal devices 1000a, 1000b, 1000c, 1000d distributed according to the temperature sensed by each temperature-actuated fluid valve. This allows the attached isothermal devices 1000a, 1000b, 1000c, and 1000d to individually control the thermal energy transmitted with respect to the position of the target 103 to which it is attached.

본 발명에 의한 부착식 등온장치 및 열전달 유체를 가진 온도제어 시스템 및 응용장치는, 그 적용 범위가 매우 넓은데, 예를 들어, 축방전 전지, 또는 액정 표시 장치, 반도체기판, 열발산기, 에어컨 열교환기, 또는 정밀기계 혹은 다차원측정기의 케이스, 또는 케이스 외부 및/또는 내부에 선정된 위치에 적용될 수 있으며, 외부의 펌핑을 통해 뜨거워지거나 차가워진 열전달 유체에 의해 접합된 표적물(103)에 대하여 뜨거워지거나 차가워지도록 하는 열전달을 수행하여 반도체 유닛, 태양 전지판(Photovoltaic, PV), 발광다이오드(LED) 혹은 축방전 전지 혹은 액정 표시 장치(LCD) 등과 같은 장치가 과열 또는 온도가 과도하게 낮아짐으로 인해 작동상의 성능이 떨어지는 문제점을 예방하고, 그리고/또는 전기모터, 발전기 혹은 변압기 등의 전기 기계 장치에 적용하는 경우, 부하가 증가하거나 환경 온도가 상승할 때 과열로 인해 효율이 떨어지고 심지어 소각되는 것을 예방하고, 그리고 정밀기계 혹은 다차원측정기의 기계 몸체에 적용하는 경우, 구조상의 기하학적 형상의 안정성과 정밀도를 유지토록 하는데 그 목적이 있으며, 오픈면이 단열성을 갖는 부착식 등온장치를 사용하는 경우, 상기 표적물(103)에서 오픈면이 단열성을 갖는 부착식 등온장치가 부착 설치되는 표면은 (a) 열전도성을 갖는 구조, 또는 (b) 열전달, 방열, 대류에 따른 열전달 특성을 예방하거나 감소시킬 수 있은 단열층 혹은 단열 구조로 구성될 수 있다.The temperature control system and application device having an attached isothermal device and a heat transfer fluid according to the present invention has a very wide application range, for example, an accumulator battery, a liquid crystal display device, a semiconductor substrate, a heat spreader, an air conditioner. It can be applied to a heat exchanger, or a case of a precision machine or a multi-dimensional measuring instrument, or a predetermined position outside and/or inside the case, and for the target 103 joined by a heat transfer fluid that is heated or cooled through external pumping. It conducts heat transfer to make it hot or cold so that devices such as semiconductor units, solar panels (Photovoltaic, PV), light emitting diodes (LEDs) or accumulators, or liquid crystal displays (LCDs) operate due to overheating or excessively low temperature. To prevent the problem of poor performance of the phase, and/or when applied to an electromechanical device such as an electric motor, generator or transformer, to prevent efficiency loss and even incineration due to overheating when the load increases or the environmental temperature rises; , and when applied to the machine body of a precision machine or multi-dimensional measuring instrument, the purpose is to maintain the stability and precision of the structural geometric shape. In (103), the surface on which the attached isothermal device having thermal insulation properties is attached to the open surface is (a) a structure having thermal conductivity, or (b) an insulating layer capable of preventing or reducing heat transfer characteristics due to heat transfer, heat dissipation, and convection Alternatively, it may be configured as an insulating structure.

도 23은 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 회전 전기기기(2000) 표면에 부착 설치한 적용예를 도시한 것이다.23 shows an application example in which an open surface according to the present invention is attached and installed on the surface of a rotating electric machine 2000 using an attached isothermal device having thermal insulation properties.

도 23에 도시된 바와 같이, 회전 전기기기(2000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면에는 전체 혹은 일부에 단열층(1010)이 추가로 설치될 수 있다.As shown in FIG. 23 , a heat insulating layer 1010 may be additionally installed on all or part of the outer surface of the case surface of the rotating electric machine 2000 in addition to the excellent thermal conductivity possessed by the attached isothermal device.

도 24는 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 공작기 몸체(3000) 표면에 부착 설치한 적용예를 도시한 것이다.24 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the machine tool body 3000 using an attached isothermal device having heat insulation properties.

도 24에 도시된 바와 같이, 공작기 몸체(3000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면에는 전체 혹은 일부에 단열층(1010)이 추가로 설치될 수 있다.As shown in Figure 24, the case surface of the machine tool body 3000, in addition to the excellent thermal conductivity of the attached isothermal device, other external surfaces may be provided with a heat insulating layer 1010 in whole or in part.

도 25는 본 발명에 따른 오픈면이 단열성을 갖는 부착식 등온장치를 사용하여 변압기(4000) 표면에 부착 설치한 적용예를 도시한 것이다.25 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the transformer 4000 using an attached isothermal device having heat insulation properties.

도 25에 도시된 바와 같이, 변압기(4000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면에는 전체 혹은 일부에 단열층(1010)이 추가로 설치될 수 있다.As shown in FIG. 25 , a heat insulating layer 1010 may be additionally installed on all or part of the outer surface of the case surface of the transformer 4000 in addition to the excellent thermal conductivity possessed by the attached isothermal device.

도 26은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 회전 전기기기(2000) 표면에 부착 설치한 적용예를 도시한 것이다.26 shows an application example in which an open surface according to the present invention is attached and installed on the surface of a rotating electric machine 2000 using an attached isothermal device having thermal conductivity.

도 26에 도시된 바와 같이, 회전 전기기기(2000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면은 전체가 외부에 대하여 열전도성, 방열 혹은 대류 기능을 갖는 구조로 구성될 수 있다.As shown in FIG. 26, the case surface of the rotating electric machine 2000 has a structure having a thermal conductivity, heat dissipation or convection function to the outside in addition to the excellent thermal conductivity of the attached isothermal device. can be configured.

도 27은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 공작기 몸체(3000) 표면에 부착 설치한 적용예를 도시한 것이다.27 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the machine tool body 3000 using an attached isothermal device having thermal conductivity.

도 27에 도시된 바와 같이, 공작기 몸체(3000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면은 전체가 외부에 대하여 열전도성, 방열 혹은 대류 기능을 갖는 구조로 구성될 수 있다.As shown in FIG. 27, the case surface of the machine tool body 3000 has excellent thermal conductivity of the attached isothermal device, and all other external surfaces have a structure having thermal conductivity, heat dissipation or convection function with respect to the outside. can be configured.

도 28은 본 발명에 따른 오픈면이 열전도성을 갖는 부착식 등온장치를 사용하여 변압기(4000) 표면에 부착 설치한 적용예를 도시한 것이다.28 shows an application example in which the open surface according to the present invention is attached and installed on the surface of the transformer 4000 using an attached isothermal device having thermal conductivity.

도 28에 도시된 바와 같이, 변압기(4000)의 케이스 표면은 부착식 등온장치가 지니고 있는 우수한 열전도성 외에 그 밖의 외부 표면은 전체가 외부에 대하여 열전도성, 방열 혹은 대류 기능을 갖는 구조로 구성될 수 있다.As shown in FIG. 28, the case surface of the transformer 4000 has excellent thermal conductivity of the attached isothermal device, and the other external surfaces have a structure having thermal conductivity, heat dissipation or convection function to the outside. can

103: 표적물
120, 120a, 120b, 120c, 120d: 유체밸브
1000, 1000a, 1000b, 1000c, 1000d: 부착식 등온장치
1001: 유체관로
1002, 1003: 유체 유입/유출구
1004: 파이프라인
1005: 열에너지 전달면
1010: 단열층
1011: 방열 시트
1012, 1013: 유체관 입구
2000: 회전 전기기기
3000: 공작기 몸체
4000: 변압기
5000: 표적물의 외부 표면
5001: 표적물의 내부 표면
TS120, TS120a, TS120b, TS120c, TS120d: 온도감지기
TV120, TV120a, TV120b, TV120c, TV120d: 온도 작동 유체밸브
ECU100: 전기제어장치
IP100: 입력제어장치
PS100: 전원공급장치103: target
120, 120a, 120b, 120c, 120d: fluid valve
1000, 1000a, 1000b, 1000c, 1000d: Attachable isothermal device
1001: fluid line
1002, 1003: fluid inlet/outlet
1004: pipeline
1005: heat energy transfer surface
1010: insulation layer
1011: heat dissipation sheet
1012, 1013: fluid pipe inlet
2000: rotating electric machine
3000: machine tool body
4000: transformer
5000: outer surface of the target
5001: inner surface of target
TS120, TS120a, TS120b, TS120c, TS120d: Temperature sensor
TV120, TV120a, TV120b, TV120c, TV120d: Temperature operated fluid valve
ECU100: Electric Control Unit
IP100: input control device
PS100: Power supply

Claims

Attachable isothermal device 1000 having one or more heat transfer bonding surfaces has an outer surface 5000 of a target bonded to the bonding surface by a heat transfer fluid passing through a fluid conduit 1001 provided therein and/or an interior of the target The heat of the same temperature is transferred together with the surface 5001, and the target 103 for temperature control is a storage discharge battery, a liquid crystal display device, a semiconductor substrate, a heat exchanger, an air conditioner heat exchanger, or a precision machine or a multi-dimensional measuring device. of the case, or a selected location outside and/or inside the case, and the heat transfer fluid heated or cooled through external pumping is transferred to the fluid pipe inlet 1012, the fluid pipe 1001, and the other fluid pipe inlet. A semiconductor unit, a solar panel (Photovoltaic, PV), a light emitting diode (LED) or a storage discharge cell, or a liquid crystal display device (LCD) by performing heat transfer to the target 103 bonded through 1013 Prevents the problem of poor operational performance due to overheating or excessively low temperature, and/or when applied to electromechanical devices, when the load increases or the environment temperature rises, resulting in reduced efficiency and even incineration due to overheating. to prevent and maintain the stability and precision of structural geometry when applied to the machine body of a precision machine or multidimensional measuring machine;
The attached isothermal device 1000 is attached to the surface having thermal conductivity of the target 103 to transmit thermal energy to the target 103 as well as the fluid of the attached isothermal device 1000 . The fluid passing through the conduit 1001 is further combined with at least one of a flow control device, a flow direction control device, a temperature sensor, an electrical control device, an input control device, a power supply device, and a temperature-operated fluid valve to provide the attachment isothermal Controls the opening and closing, flow rate, and flow direction of the fluid passing through the fluid conduit 1001 of the device 1000, and transmission for each position of the target 103 to which the attached isothermal device 1000 is attached individually controlling the heat energy to be produced; A temperature control system comprising an attached isothermal device, characterized in that

The method of claim 1,
The attached isothermal device 1000 is configured to include an attached isothermal device with an open surface having thermal insulation properties, wherein the attached isothermal device 1000 is made of a material having excellent thermal conductivity and has a fluid conduit 1001 and a fluid inlet/outlet 1002 and a fluid inlet/outlet 1003 connected to a pipeline are provided on both sides of the fluid conduit 1001 to convert gas, liquid, or gas to a liquid, or to convert a liquid into a gas The converted fluid is input and output, and the attached isothermal device 1000 is provided with a heat energy transfer surface 1005, and a heat insulating layer 1010 is provided on the surface open to the outside other than the heat energy transfer surface 1005. It is provided to prevent or reduce heat transfer due to heat dissipation, conduction and convection to the outside;
The method in which the attachment type isothermal device 1000 having the single fluid conduit 1001 is attached to the target 103 is a bonding method by bonding, pressure, welding, and riveting and a fixing method by screwing. being installed on a structural surface having heat transfer properties of the target (103); A temperature control system comprising an attached isothermal device, characterized in that

The method of claim 1,
The attached isothermal device 1000 is configured to include an attached isothermal device having an open surface having thermal conductivity, wherein the attached isothermal device 1000 is made of a material having excellent thermal conductivity and the fluid conduit 1001 is and a fluid inlet/outlet 1002 and a fluid inlet/outlet 1003 connected to a pipeline are provided on both sides of the fluid conduit 1001 to convert gas, liquid, or gas into a liquid, or The fluid converted into gas is input and output, and the fluid conduit 1001 is provided with a heat energy transfer surface 1005, and in addition to the heat energy transfer surface 1005, other surfaces open to the outside transmit heat energy to the outside; Having a wing sheet structure for convection and heat dissipation and performing heat transfer to the outside;
The method in which the attachable isothermal device 1000 having the fluid conduit 1001 is attached to the target 103 is a bonding method by bonding, pressure, welding, and riveting and a fixing method by screwing. A temperature control system including an attached isothermal device, characterized in that it is installed on a structural surface having heat transfer properties of the target (103).

The method of claim 1,
A temperature control system in which one or more attached isothermal devices with one or more fluid valves disposed on the thermally conductive surface of the target 103 are installed, the main components of which are:
A temperature control system having a structure in which one attached isothermal device 1000 is installed in series with a fluid valve 120 through a pipeline 1004, wherein the fluid valve 120 is directly operated by manpower, The flow rate of the fluid passing through the attached isothermal device 1000 by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by being indirectly manipulated by mechanical force, electromagnetic force, atmospheric pressure or liquid pressure controlled by manpower. adjusting the thermal energy transmitted with respect to the position of the target 103 to be attached by adjusting the ; or
A temperature control system having a structure in which a plurality of attached isothermal devices (1000a, 1000b) are connected in series through the pipeline (1004) and then installed in series with the fluid valve (120), wherein the fluid valve (120) is directly manipulated by manpower, or indirectly manipulated by mechanical force, electromagnetic force, atmospheric pressure, or liquid pressure controlled by manpower to control the opening and closing of the fluid valve, or by controlling the flow rate of the fluid, the attached isothermal device ( regulating the thermal energy transferred relative to the position of the target 103 to be attached by regulating the flow rate of the fluid passing through 1000a, 1000b; or
Attached isothermal device 1000a is installed in series with fluid valve 120a via pipeline 1004 , and attached isothermal device 1000b is installed in series with fluid valve 120b via pipeline 1004 . A temperature control system composed of a structure in which the two are connected in parallel and then connected in parallel, wherein each of the fluid valves 120a and 120b is individually and/or jointly operated directly by manpower, or mechanical force controlled by manpower , electromagnetic force, atmospheric pressure or liquid pressure to control the opening and closing of the fluid valve, or the flow rate of the fluid passing through the attached isothermal devices 1000a and 1000b individually connected in series by controlling the flow rate of the fluid adjusting the thermal energy transmitted to the position of the target 103 to be attached by adjusting the ; or
Attached isothermal devices 1000a, 1000b are connected in series with fluid valve 120b through pipeline 1004, and attached isothermal devices 1000c, 1000d are connected to fluid valve 120a through pipeline 1004. A temperature control system consisting of a structure connected in series and then connected in parallel again, wherein the fluid valves 120b and 120d are individually and/or jointly operated directly by manpower, or mechanical force controlled by manpower , electromagnetic force, atmospheric pressure or liquid pressure to control the opening and closing of the fluid valve, or by controlling the flow rate of the fluid, the attached isothermal device 1000a installed at different positions of the target 103, regulating the thermal energy transmitted relative to the position of the target 103 to be attached by regulating the flow rate of the fluid passing through 1000b, 1000c, 1000d; or
A plurality of attached isothermal devices 1000a, 1000b, 1000c and fluid valves 120a and 120b are connected in series through a pipeline 1004, and then again two input/output terminals of the pipeline 1004 and the fluid valve It is connected to a fluid valve 120c and a fluid valve 120d connected in series between 120a and the fluid valve 120b, where the fluid valve 120c and the fluid valve 120d are bypassed by a bypass (by pass). A temperature control system configured to control The attachment isothermal devices 1000a, 1000b, 1000c installed at different positions of the target 103 by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by indirectly operating by pressure or liquid pressure. adjusting the thermal energy transferred relative to the position of the target (103) to which it is attached by individually adjusting the flow rate of the fluid passing therethrough; or
A plurality of attached isothermal devices 1000a, 1000b, 1000c, 1000d and a fluid valve 120a are connected in series between the attached isothermal device 1000a and the attached isothermal device 1000b via a pipeline 1004 and , the fluid valve 120c is connected in series between the attached isothermal device 1000c and the attached isothermal device 1000d, and the fluid valve 120a and the fluid valve 120c are provided with a pipeline that communicates with each other. A temperature control system configured to enable by-pass control, wherein each of the fluid valves (120a, 120c) is individually and/or jointly operated directly by manpower or controlled by manpower, electromagnetic force, mechanical force, The fluid passing through the attached isothermal devices 1000a, 1000b, 1000c, 1000d installed in different positions by controlling the opening and closing of the fluid valve or controlling the flow rate of the fluid by indirectly operated by pressure or liquid pressure adjusting the thermal energy transferred relative to the position of the target (103) being attached by individually adjusting the flow rate;
A temperature control system including an attached isothermal device, characterized in that it comprises a.

The method of claim 1,
A temperature control system in which one or more temperature sensors, an electric control device, and one or more attached isothermal devices are disposed on the surface having a thermal conductivity of the target (103), and a fluid valve controlled by them is installed, the temperature control system comprising: The configuration method is
One attachable isothermal device 1000 in which the temperature sensor TS120 is installed is installed in series with the fluid valve 120 through the pipeline 1004, and the temperature configured in a structure controlled by the electric control device ECU100 As a control system, wherein the electric control unit (ECU100) receives the message of the input control unit (IP100) and the message sensed by the temperature sensor (TS120) to control or pass the opening and closing of the fluid valve (120) By controlling the flow rate of the fluid to control the flow rate of the fluid passing through the attachment-type isothermal device 1000 to change the thermal energy transferred to the target 103, where,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit device,
The input control device (IP100) is composed of an artificial input or a human machine interface that receives an input signal or a manipulation command,
And the power supply (PS100) is to supply the electrical energy required for system operation; or
A plurality of attached isothermal devices 1000a and 1000b in which temperature sensors TS120a and TS120b are individually installed are connected in series through a pipeline 1004 and then installed in series with the fluid valve 120 again, and an electric control device A temperature control system configured in a structure controlled by (ECU100), wherein the electric control unit (ECU100) refers to the message of the input control unit (IP100) and the message sensed by the temperature sensors (TS120a, TS120b). The thermal energy transferred to the target 103 by controlling the opening and closing of the fluid valve 120 or controlling the flow rate of the fluid passing through the attached isothermal device 1000a, 1000b by controlling the flow rate of the passing fluid to change, here,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;
the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;
And the power supply (PS100) is to supply the electrical energy required for system operation; or
Attached isothermal devices 1000a and 1000b are provided with temperature sensors TS120a and TS120b, respectively, wherein the attached isothermal device 1000a is connected in series with the fluid valve 120a through a pipeline 1004, And the attached isothermal device 1000b is connected in series with the fluid valve 120b through the pipeline 1004, these two are again connected in parallel, and controlled by the electric control unit (ECU100). A configured temperature control system, wherein the electric control unit (ECU100) opens the fluid valves (120a, 120b) with reference to the message of the input control unit (IP100) and the message sensed by the temperature sensors (TS120a, TS120b) The thermal energy transferred to the target 103 is changed by controlling the closure or individually adjusting the flow rate of the passing fluid to control the flow rate of the fluid passing through the attachable isothermal devices 1000a and 1000b, where ,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;
the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;
And the power supply (PS100) is to supply the electrical energy required for system operation; or
Temperature sensors TS120a, TS120b, TS120c, and TS120d are respectively installed in the attached isothermal devices 1000a, 1000b, 1000c, and 1000d, wherein the attached isothermal device 1000a, the attached isothermal device 1000b, and the fluid A valve 120b is connected in series in sequence through a pipeline 1004, and the attached isothermal device 1000c, the attached isothermal device 1000d, and the fluid valve 120d are connected to the pipeline 1004. A temperature control system configured to be serially connected in sequence through By receiving the message of (IP100) and the message sensed by the temperature sensors TS120a, TS120b, TS120c, and TS120d, the opening and closing of the fluid valves 120b and 120d are controlled or the flow rate of the passing fluid is individually measured. By adjusting the flow rate of the fluid passing through the attachment isothermal device (1000a, 1000b, 1000c, 1000d) to change the thermal energy delivered to the target 103, where,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;
the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;
And the power supply (PS100) is to supply the electrical energy required for system operation; or
Temperature sensors TS120a, TS120b, and TS120c are respectively installed in a plurality of attached isothermal devices 1000a, 1000b, and 1000c, where an attached isothermal device 1000a, a fluid valve 120a, and an attached isothermal device 1000b , the fluid valve 120b, the attached isothermal device 1000c are connected in series through the pipeline 1004 according to the sequence, and the fluid valves 120c and 120d are connected in parallel and then parallel between the fluid input end and the output end is connected to, and between the fluid valve 120c and the fluid valve 120a, an operation that communicates with each other can be performed by the control of the electric control device (ECU100), and between the fluid valve 120d and the fluid valve 120b, an electric control A temperature control system composed of a structure that enables the bypass bypass control to be possible and can be controlled by the electric control unit ECU100 as the operation can be performed by the control of the device ECU100 In this case, the electric control unit (ECU100) receives the message of the input control unit (IP100) and the message sensed by the temperature sensors (TS120a, TS120b, TS120c, TS120d) to receive the fluid valves (120a, 120b, 120c, Control the opening and closing of 120d) or control the flow rate of the fluid passing through the attachable isothermal device 1000a, 1000b, 1000c, 1000d by individually adjusting the flow rate of the passing fluid to control the flow rate of the fluid passing through and deliver it to the target 103 It causes the heat energy to be changed, where,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;
the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;
And the power supply (PS100) is to supply the electrical energy required for system operation; or
Temperature sensors TS120a, TS120b, TS120c, and TS120d are installed in a plurality of attached isothermal devices 1000a, 1000b, 1000c, and 1000d, respectively, and the attached isothermal device 1000a, the fluid, through a pipeline 1004 The valve 120a, the attached isothermal device 1000b are connected in series in order, and the attached isothermal device 1000c, the fluid valve 120c, and the attached isothermal device 1000d are connected in this order. are connected in series, and the two are again connected in parallel, and as a pipeline communicating with each other is provided between the fluid valve 120a and the fluid valve 120c, the fluid valves 120a and 120b are bypassed to the side. A temperature control system configured to enable (by-pass) control and to be controlled by an electric control unit (ECU100), wherein the electric control unit (ECU100) includes a message from the input control unit (IP100) and the By receiving the message sensed by the temperature sensors (TS120a, TS120b, TS120c, TS120d) and controlling the opening and closing of the fluid valves (120a, 120b) or by individually adjusting the flow rate of the passing fluid, the attached isothermal device By controlling the flow rate of the fluid passing through (1000a, 1000b, 1000c, 1000d) to change the thermal energy transferred to the target 103, where,
The electrical control unit (ECU100) consists of one or more devices, which include 1) an electro-mechanical circuit device, 2) a solid-state electronic circuit device, 3) a microprocessor or single-chip control device, software, operating program and peripherals. comprising a circuit arrangement;
the input control device IP100 is composed of an artificial input or a human machine interface for receiving an input signal or an operation command;
And the power supply device (PS100) is to supply electrical energy necessary for system operation; a temperature control system including an attached isothermal device, characterized in that it comprises a.

The method of claim 1,
A temperature control system in which one or more attached isothermal devices are disposed on the thermally conductive surface of the target (103), the main components of which are:
The temperature-actuated fluid valve TV120 is a fluid valve having a function of opening or closing or changing the flow rate of a passing fluid according to the sensed temperature, and is on the attached isothermal device 1000 and/or the target 103 . installed, and its function is to make the attached isothermal device 1000 self to adjust the thermal energy transmitted with respect to the position of the target (103) to be attached; or
The temperature-operated fluid valve TV120 is a fluid valve having an open or close function or a function of changing the flow rate of a passing fluid according to the sensed temperature. installed on, and its function is to control the flow rate of the fluid passing through the attached isothermal devices 1000a and 1000b to which each temperature-operated fluid valve belongs according to the sensed temperature by controlling the flow rate of the attached isothermal device 1000a, 1000b) to individually adjust the thermal energy transmitted relative to the position of the target 103 to which it is attached; or
The temperature working fluid valve TV120a and the attached isothermal device 1000a are connected in series, and the temperature working fluid valve TV120b and the attached isothermal device 1000b are connected in series, and they are again connected in parallel The temperature working fluid valve TV120a and the temperature working fluid valve TV120b are fluid valves having an opening or closing function or a function of changing the flow rate of a passing fluid according to the sensed temperature, and the attached isothermal device (1000a) and the attached isothermal device (1000b) and/or installed on the target (103), the function of which is the attached isothermal device (1000a) to which each temperature operating fluid valve belongs according to the sensed temperature. , 1000b) by controlling the flow rate of the fluid passing through the attachment isothermal device (1000a, 1000b) to individually adjust the thermal energy transmitted with respect to the position of the target 103 to which it is attached; or
The temperature working fluid valve TV120b and the attached isothermal device 1000a, 1000b are connected in series, the temperature working fluid valve TV120d and the attached isothermal device 1000c, 1000d are connected in series, and these two are again Connected in parallel, the temperature-operated fluid valve (TV120b) and the temperature-operated fluid valve (TV120d) are fluid valves having an opening or closing function or a function of changing the flow rate of a passing fluid according to the sensed temperature, and the attachment A type isothermal device (1000b) and the attached isothermal device (1000d) and/or installed on a target (103), the function of which is that each temperature-actuated fluid valve is connected in series to which it belongs depending on the sensed temperature. By controlling the flow rate of the fluid passing through the attached isothermal device (1000a, 1000b) and the attached isothermal device (1000c, 1000d) connected in series, the attached isothermal device (1000a, 1000b, 1000c, 1000d) makes itself to individually control the heat energy transmitted with respect to the position of the target 103 to be attached; or
The attached isothermal device 1000a, the temperature operated fluid valve TV120a, the attached isothermal device 1000b, the temperature operated fluid valve TV120b, and the attached isothermal device 1000c pass through the pipeline 1004 in this order. connected in series, the temperature-operated fluid valves TV120c and TV120d are connected in series and then again connected in parallel between the fluid input end and the fluid output end of the pipeline 1004, the temperature-actuated fluid valve TV120a and the temperature A pipeline communicating with each other is provided between the working fluid valves TV120c, and a pipeline communicating with each other is provided between the temperature working fluid valve TV120b and the temperature working fluid valve TV120d. A temperature control system configured to be controllable, wherein the temperature-operated fluid valves (TV120a, TV120b, TV120c, TV120d) are fluid valves having a function of opening or closing or changing the flow rate of a passing fluid according to the sensed temperature. , installed on the attached isothermal device 1000a, 1000b, 1000c and/or the target 103, the function of which is that each temperature-actuated fluid valve is connected in parallel to which it belongs according to the sensed temperature. By controlling the flow rate of the fluid passing through the isothermal device (1000a, 1000b, 1000c), the attached isothermal device (1000a, 1000b, 1000c) allows the thermal energy transmitted with respect to the position of the target 103 to which it is attached. individually controlled; or
A plurality of attached isothermal devices 1000a, temperature-actuated fluid valves TV120a, and attached isothermal devices 1000b are sequentially connected in series through pipeline 1004, attached isothermal device 1000c, temperature A working fluid valve TV120c and an attached isothermal device 1000d are sequentially connected in series through the pipeline 1004 , which are again connected in parallel to the fluid input end of the pipeline 1004 and the fluid Leading to an output stage, the temperature operating fluid valve TV120a and the temperature operating fluid valve TV120c are a temperature control system configured to enable bypass control, wherein the temperature operating fluid valve TV120a, TV120c ) is a fluid valve having a function of opening or closing or changing the flow rate of a passing fluid according to the sensed temperature, and is installed on the attached isothermal device (1000a, 1000b, 1000c) and/or the target 103 and its function is that each temperature-actuated fluid valve controls the flow rate of individual tributaries through the attached isothermal devices 1000a, 1000b, 1000c, 1000d distributed according to the sensed temperature, whereby the attached isothermal device 1000a , 1000b, 1000c, 1000d) to individually control the thermal energy transmitted with respect to the position of the target 103 to which it is attached; Temperature including an attached isothermal device characterized in that it comprises control system.

The method of claim 1,
It can be applied to a storage discharge battery, a liquid crystal display device, a semiconductor substrate, a heat exchanger, an air conditioner heat exchanger, or a case of a precision machine or a multi-dimensional measuring instrument, or a selected location outside and/or inside the case, through external pumping A semiconductor unit, a solar panel (Photovoltaic, PV), a light emitting diode (LED) or a storage discharge cell or a liquid crystal display device by performing heat transfer to heat or cool the bonded target 103 by the heated or cooled heat transfer fluid (LCD) to prevent the problem of poor operational performance due to overheating or excessively low temperature, and/or when applied to electromechanical devices, the efficiency decreases due to overheating when the load increases or the environmental temperature rises Even to prevent incineration, and to maintain the stability and precision of the structural geometry when applied to the machine body of a precision machine or multi-dimensional measuring instrument, when using an attached isothermal device with an open surface insulating property, In the target 103, the surface on which the attached isothermal device having thermal insulation properties is attached to the open surface is (a) a structure having thermal conductivity, or (b) a heat transfer characteristic due to heat transfer, heat dissipation, and convection. A temperature control system comprising an attached isothermal device, characterized in that it can be composed of an insulating layer or an insulating structure.