KR102332681B1 - Adhesive composition, adhesive film comprising same, backplate film comprising adhesive film and plastic organic light emitting display comprising backplate film - Google Patents

Abstract

The present application relates to an adhesive composition, an adhesive film including the same, a backplate film including the adhesive film, and a plastic organic light emitting display including the backplate film.

Description

Adhesive composition, adhesive film including same, backplate film including adhesive film, and plastic organic light emitting display including backplate film FILM}

The present specification relates to an adhesive composition, an adhesive film including the same, a backplate film including the adhesive film, and a plastic organic light emitting display including the backplate film.

The plastic organic light emitting display uses a plastic substrate instead of the glass substrate that is not easily bent in the conventional organic light emitting display, and has the advantage of being very flexible, not easily broken, and excellent in durability. Accordingly, research on plastic organic light emitting displays has been actively conducted as the types of displays have been diversified in recent years.

In such a plastic organic light emitting display, a back plate film is attached to the back side of the panel to protect the thin organic light emitting device and to support the TFE (Thin Film Encapsulation) layer. At this time, the back plate film should have strong adhesiveness as an adhesive film, and in particular, the plastic organic light emitting display panel is bendable, foldable, rollable, etc. beyond a simple curved shape. As the form evolves, a high degree of flexibility is required.

Therefore, it is necessary to develop an adhesive film for a backplate film of a plastic organic light emitting display having excellent flexibility and high adhesive strength.

Japanese Patent Laid-Open No. 2011-202161

Accordingly, the present specification provides a pressure-sensitive adhesive composition having excellent flexibility and high adhesive force, an adhesive film including the same, a back plate film including the adhesive film, and a pressure-sensitive adhesive composition for a back plate film of a plastic organic light emitting display including the adhesive film, and the same An object of the present invention is to provide an adhesive film.

An exemplary embodiment of the present specification _{includes two or more kinds of monomers (A) having a glass transition temperature (T g} ) of -95°C or more and -30°C or less, and the content of the monomer (A) is 100 of the total monomers It provides a pressure-sensitive adhesive composition of 93 parts by weight or more based on parts by weight.

Another exemplary embodiment of the present specification is a base film; And it provides an adhesive film comprising a pressure-sensitive adhesive layer comprising the above-described pressure-sensitive adhesive composition or a cured product thereof provided on one surface of the base film.

Another exemplary embodiment of the present specification provides a backplate film comprising the above-described adhesive film.

Finally, one embodiment of the present specification is the above-described back plate film; a plastic substrate provided on the adhesive film side of the back plate film; and an organic light emitting device provided on a surface opposite to the surface of the plastic substrate in contact with the pressure-sensitive adhesive film.

The pressure-sensitive adhesive film including the pressure-sensitive adhesive composition according to an exemplary embodiment of the present specification has improved flexibility due to a low glass transition temperature, and has high adhesive strength, so that it can be attached to various types of panels. In particular, it is advantageous for a flexible display that can be bent or folded.

1 is a view showing an exemplary laminated structure of a backplate film according to an embodiment of the present specification.
2 is a diagram illustrating an exemplary laminated structure of a plastic organic light emitting display according to an exemplary embodiment of the present specification.

Hereinafter, the present specification will be described in more detail.

An exemplary embodiment of the present specification relates to a pressure-sensitive adhesive composition, and the glass transition temperature (T _g ) includes two or more monomers (A) having a glass transition temperature (T g ) of -95°C or higher and -30°C or lower, and the monomer (A) It is characterized in that the content is 93 parts by weight or more based on 100 parts by weight of the total monomer.

The pressure-sensitive adhesive composition has a low glass transition temperature by including the monomer (A) as described above, and provides flexibility and adhesive strength required for a backplate film of a plastic organic light emitting display. In particular, it is possible to provide excellent flexibility and high adhesive strength required for a flexible display.

When the glass transition temperature of the monomer (A) is less than -95°C, it is impossible to prepare in a semi-cured state, so it is difficult to prepare a film form, and when it exceeds -30°C, the hardness of the pressure-sensitive adhesive composition increases and flexibility is reduced. there is

In the present specification, when a part "includes" a certain component, this means that other components may be further included rather than excluding other components unless otherwise stated.

In the present specification, "room temperature" is a temperature selected from 20 °C to 26 °C, for example, 23 °C.

In the present specification, the glass transition temperature means a temperature at which a polymer material is converted from a hard solid state such as glass to a rubber state having elasticity. The glass transition temperature is determined according to the structural properties of the monomer, and therefore, the polymer has an intrinsic glass transition temperature according to the type of the polymerized monomer. The lower the glass transition temperature, the higher the flexibility of the material, and the higher the glass transition temperature, the stronger the material. Since the monomer itself cannot measure the glass transition temperature, in general, the glass transition temperature is measured by polymerizing a homopolymer of the monomer.

According to an exemplary embodiment of the present specification, the monomer (A) is a (meth)acrylate-based monomer.

In the present specification, (meth) acrylate is meant to include both acrylate and methacrylate.

In the exemplary embodiment of the present specification, examples of the monomer (A) are described below, but are not limited thereto.

According to an exemplary embodiment of the present specification, the monomer (A) is n-butyl acrylate (T _g : -54 ℃), isodecyl acrylate (T _g : -55 ℃), isooctyl acrylate (T _g : -70 ° C), n-dodecyl (meth) acrylate (T _g : -55 ° C), 2-ethylhexyl acrylate (T _g : -50 ° C), 2-propylheptyl acrylate (T _g : -68 ℃), 2-methoxyethyl acrylate (T _g : -50 ℃), 2-(2-ethoxyethoxy) ethyl acrylate (T _g : -70 ℃), heptadecyl acrylate (T _g :- 64°C), lauryl (meth)acrylate (T _g : -50°C), stearyl polyethylene glycol (meth)acrylate (T _g : -58°C) or ethyldiglycol acrylate (T _g : -53°C) )am.

According to an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition includes two or more kinds of the monomer (A). The monomer (A) may be divided into a main monomer and a comonomer based on the content. A monomer (A) having a relatively equal or larger content is a main monomer, and a monomer (A) having a relatively equal or smaller content is a comonomer. The content ratio of the main monomer and the comonomer may be expressed as 1:1, 2:1, or 3:1.

The content of the main monomer is 49 parts by weight or more based on 100 parts by weight of the total monomers, and the content of the comonomer is 49 parts by weight or less based on 100 parts by weight of the total monomers.

Specifically, the content of the main monomer is 49 parts by weight or more and 97 parts by weight or less based on 100 parts by weight of the total monomer, preferably 55 parts by weight or more and 85 parts by weight or less, more preferably 65 parts by weight or more and 85 parts by weight or less. , more preferably 65 parts by weight or more and 75 parts by weight or less.

The content of the comonomer is 1 part by weight or more and 49 parts by weight or less based on 100 parts by weight of the total monomer, preferably 10 parts by weight or more and 40 parts by weight or less, more preferably 10 parts by weight or more and 30 parts by weight or less, more preferably may be 20 parts by weight or more and 30 parts by weight or less.

The comonomer generally has a lower glass transition temperature than the main monomer, thereby lowering the glass transition temperature of the pressure-sensitive adhesive composition and improving adhesive strength.

In an exemplary embodiment of the present specification, the glass transition temperature of the main monomer may be -60°C or more and -30°C or less, and preferably -55°C or more and -40°C or less.

The glass transition temperature of the comonomer may be -95°C or more and less than -60°C, preferably -85°C or more and -65°C or less.

According to an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition includes 93 parts by weight or more of the monomer (A) based on 100 parts by weight of the total monomer, preferably 93 parts by weight or more and 98 parts by weight or less, more preferably 94 parts by weight or more. It may be not less than 98 parts by weight and not more than 98 parts by weight.

According to an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition further comprises a functional monomer. The functional monomer is a monomer containing a crosslinkable functional group, serves to crosslink between chains, and is mainly bonded to an epoxy or isocyanate composition. The type of the functional monomer is not particularly limited, but may include, for example, one of a hydroxyl group-containing monomer and a carboxyl group-containing monomer.

Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acryl a rate, 8-hydroxyoctyl (meth)acrylate, 2-hydroxyethylene glycol (meth)acrylate, or 2-hydroxypropylene glycol (meth)acrylate, etc. are mentioned.

Examples of the carboxyl group-containing monomer include (meth)acrylic acid, 2-(meth)acryloyloxyacetic acid, 3-(meth)acryloyloxypropyl acid, 4-(meth)acryloyloxybutyric acid, acrylic acid double Sieve, itaconic acid, maleic acid, or maleic anhydride, etc. are mentioned.

In an exemplary embodiment of the present specification, the functional monomer is 2 parts by weight to 7 parts by weight, specifically 4 parts by weight to 6 parts by weight, based on 100 parts by weight of the total monomer.

According to an exemplary embodiment of the present specification, the functional monomer includes a hydroxyl group.

In an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition includes an additive for increasing adhesive strength. The additive for increasing the adhesive strength is added after the monomers included in the pressure-sensitive adhesive composition are polymerized to each other well and the monomers are polymerized to improve the adhesion level. When the additive for increasing the adhesive strength is post-added, the additive, which is a low molecular weight, is present in a floating form on the cross-linked acrylate coating film, so that it can be directly bonded to the adherend. When the additive for increasing adhesive strength is polymerized together with monomers, it does not float to the surface, so that the adhesive strength improvement effect is reduced by half.

The type of the additive for increasing the adhesive strength is not limited, for example, a silane coupling agent or a terpene-based material may be used. The content of the additive for increasing the adhesive strength is 0.5 to 2.0 parts by weight, preferably 1 to 2 parts by weight, based on 100 parts by weight of the pressure-sensitive adhesive composition.

According to an exemplary embodiment of the present specification, the additive for increasing adhesion is a silane coupling agent. The silane coupling agent is not particularly limited, but preferably contains an epoxy, for example, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl methyldiethoxysilane, 3-glycidoxypropyl trie oxysilane and 2-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane.

In an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition includes a curing agent. The curing agent may include at least one selected from the group consisting of an isocyanate-based curing agent and an epoxy-based curing agent.

Examples of the curing agent include toluene diisocyanate, 4,4'-methylene dicyclohexyl diisocyanate, isophorone diisocyanate, methylene diphenyl diisocyanate, and xylene diisocyanate.

The content of the curing agent is 0 parts by weight or more and 50 parts by weight or less, preferably 0.001 parts by weight or more and 30 parts by weight or less, more preferably 0.001 parts by weight or more and 10 parts by weight or less, based on 100 parts by weight of the solid content of the pressure-sensitive adhesive composition.

In one embodiment of the present specification, the pressure-sensitive adhesive composition may further include a solvent.

The solvent may be a ketone solvent such as acetone and methyl ethyl ketone (MEK) or an aromatic solvent such as toluene, but is not limited thereto, and a general organic solvent may be used.

The content of the solvent is 30 parts by weight or more and 99 parts by weight or less based on 100 parts by weight of the pressure-sensitive adhesive composition, preferably 40 parts by weight or more and 90 parts by weight or less, more preferably 50 parts by weight or more and 90 parts by weight or less.

According to an exemplary embodiment of the present specification, the glass transition temperature of the pressure-sensitive adhesive composition is -30°C or more and -10°C or less. Specifically, the glass transition temperature of the pressure-sensitive adhesive composition is -30°C or more and -10°C or less, and preferably -30°C or more and -20°C or less. The pressure-sensitive adhesive composition having a low glass transition temperature has excellent flexibility and increases adhesive strength.

The glass transition temperature of the pressure-sensitive adhesive composition was measured using ARES-G2 equipment by stacking the pressure-sensitive adhesive composition in the form of a layer having a thickness of 300 μm to 700 μm.

The room temperature adhesive strength and permanent adhesive strength were measured using a texture analyzer at a 180° angle and a peeling rate of 300 mm/min based on ASTM D3330 and D903.

According to an exemplary embodiment of the present specification, the pressure-sensitive adhesive composition is provided for a pressure-sensitive adhesive film of a back plate film of a plastic organic light emitting display.

In an exemplary embodiment of the present specification, a base film; And it provides an adhesive film comprising a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition or a cured product thereof provided on one surface of the base film. The base film is polyethylene terephthalate (PET), polyester, polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyether ether ketone. (polyether ether ketone, PEEK), polyarylate (PAR), polycyclicolefin (PCO), polynorbornene, polyethersulphone (PES) and cycloolefin polymer (COP) ) may be selected from the group consisting of.

According to an exemplary embodiment of the present specification, the base film may be polyethylene terephthalate (PET).

In an exemplary embodiment of the present specification, the thickness of the base film is 50 μm or more and 100 μm or less, and preferably 60 μm or more and 80 μm or less.

In addition, the base film is preferably transparent. The meaning that the base film is transparent here means that the light transmittance of visible light (400-700 nm) is 80% or more.

When the base film has the above range, the laminated pressure-sensitive adhesive film has a property capable of thinning.

In an exemplary embodiment of the present specification, the thickness of the adhesive layer may be 10 μm or more and 20 μm or less, preferably 10 μm or more and 15 μm or less.

When the thickness of the pressure-sensitive adhesive layer is within the above range, the rework property is excellent during mis-attachment, and in particular, when the pressure-sensitive adhesive sheet is removed, foreign substances are not left behind.

In one embodiment of the present specification, the thickness of the pressure-sensitive adhesive film provides an pressure-sensitive adhesive film of 60 μm or more and 120 μm or less.

In another exemplary embodiment, the thickness of the pressure-sensitive adhesive film is 60 μm or more and 120 μm or less, preferably 60 μm or more and 90 μm or less.

Since the pressure-sensitive adhesive film has the above range, the thickness as a back plate is suitable when applied to a plastic organic light emitting display in the future, and the rework property is excellent when mis-attached, and in particular, when removing the pressure-sensitive adhesive sheet, foreign substances are It has a characteristic that does not remain.

A method of applying the pressure-sensitive adhesive composition on the base film includes a comma coater, a lip coater, a slot die coater, a comma reverse coater, a bar coater, and There is a gravure coater (Gravure Coater), but is not limited thereto.

According to an exemplary embodiment of the present specification, the adhesive film is laminated so that the adhesive layer of the adhesive film is in contact with one surface of the polyimide (PI) film, and the adhesive film at room temperature measured after leaving it for 3 hours is 1000 gf/inch or more and 2000 gf/inch or less. provides

According to another exemplary embodiment of the present specification, the adhesive layer of the adhesive film is laminated on one side of the polyimide (PI) film so that it is in contact, and maintained for 20 minutes at a temperature of 50° C. and a pressure of 0.5 MPa in an autoclave. Then, to provide an adhesive film having a permanent adhesive strength of 1100 gf/inch or more and 2100 gf/inch or less, measured after being left at room temperature for 1 hour.

According to another exemplary embodiment of the present specification, the pressure-sensitive adhesive film is laminated so that the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film is in contact with one surface of the glass, and the pressure-sensitive adhesive film at room temperature measured after standing for 3 hours is 900 gf/inch or more and 1800 gf/inch or less. .

According to another exemplary embodiment of the present specification, the adhesive layer of the adhesive film is laminated on one side of the glass so that the adhesive layer is in contact, and maintained for 20 minutes at a temperature of 50° C. and a pressure of 0.5 MPa in an autoclave, and then 1 hour It provides an adhesive film having a permanent adhesive force of 900 gf/inch or more and 1900 gf/inch or less measured after being left at room temperature for a while.

The room temperature adhesive strength and permanent adhesive strength were measured using a texture analyzer at a 180° angle and a peeling rate of 300 mm/min based on ASTM D3330 and D903.

In the process of measuring the adhesive force, the autoclave may be further performed to improve adhesion. The conditions of the autoclave are a temperature of 30° C. to 60° C., a pressure of 0.1 MPa to 1.0 MPa, and a time of 1 minute to 30 minutes. After performing the autoclave, the adhesive strength is measured after leaving it at room temperature for 30 minutes to 1 hour.

According to an exemplary embodiment of the present specification, the adhesive film is used for a back plate film of a plastic organic light emitting display.

In an exemplary embodiment of the present specification, there is provided an adhesive film further comprising a release film provided on the opposite surface of the surface in contact with the base film of the adhesive layer.

As the release film, a hydrophobic film may be used, and as a layer for protecting a very thin adhesive layer, it refers to a transparent layer attached to one surface of the adhesive sheet, and a film excellent in mechanical strength, thermal stability, moisture shielding property, isotropy, etc. can be used For example, acetate-based, polyester-based, polyethersulfone-based, polycarbonate-based, polyamide-based, polyimide-based, polyolefin-based, cycloolefin-based, polyurethane-based and acrylic resin films such as triacetyl cellulose (TAC) may be used, but is not limited thereto, as long as it is a commercially available silicone-treated release film.

In one embodiment of the present specification, there is provided a backplate film including the adhesive film. The backplate film may constitute the pressure-sensitive adhesive film alone, or an additional film may be further included. The additional film is not particularly limited, but may be, for example, a protective film. The protective film serves to protect the pressure-sensitive adhesive film so that foreign substances or scratches do not occur during transport or process of the back plate film.

The laminated structure of the backplate film 103 can be confirmed in FIG. 1 , and may be provided by additionally stacking the protective film 101 as shown in FIG. 1 .

According to an exemplary embodiment of the present specification, a base film; and an adhesive layer provided on one surface of the base film, wherein the adhesive layer is laminated on a polyimide (PI) film, and the room temperature adhesive force measured after leaving it for 3 hours is 1000 gf/inch or more and 2000 gf/inch or less of a back plate film provides

According to another exemplary embodiment of the present specification, a base film; and an adhesive layer provided on one side of the base film, laminating the adhesive layer on a polyimide (PI) film, and maintaining it in an autoclave at a temperature of 50° C. and a pressure of 0.5 MPa for 20 minutes, To provide a backplate film having a permanent adhesive force of 1100 gf/inch or more and 2100 gf/inch or less after standing at room temperature for 1 hour.

According to another exemplary embodiment of the present specification, a base film; and an adhesive layer provided on one surface of the base film, wherein the adhesive layer is laminated on a polyimide (PI) film, and the room temperature adhesive force measured after leaving it for 3 hours is 1000 gf/inch or more and 2000 gf/inch or less, and the The adhesive layer was laminated on a polyimide (PI) film, maintained for 20 minutes at a temperature of 50° C. and a pressure of 0.5 MPa in an autoclave, and then left at room temperature for 1 hour. The measured permanent adhesive strength was 1100 gf/inch It provides a back plate film of more than 2100 gf / inch or less.

According to another exemplary embodiment of the present specification, a base film; and an adhesive layer provided on one surface of the base film, wherein the adhesive layer is laminated on glass, and the room temperature adhesive force measured after leaving it for 3 hours is 900 gf / inch or more and 1800 gf / inch or less It provides a backplate film.

According to another exemplary embodiment of the present specification, a base film; and an adhesive layer provided on one side of the base film, laminating the adhesive layer on glass, maintaining it for 20 minutes at a temperature of 50° C. and a pressure of 0.5 MPa in an autoclave, and then at room temperature for 1 hour Provided is a backplate film having a permanent adhesive strength of 900 gf/inch or more and 1900 gf/inch or less after standing.

The room temperature adhesive strength and permanent adhesive strength were measured using a texture analyzer at a 180° angle and a peeling rate of 300 mm/min based on ASTM D3330 and D903.

According to another exemplary embodiment of the present specification, the back plate film according to the present specification; a plastic substrate provided on the adhesive film side of the back plate film; and an organic light emitting device provided on a surface opposite to the surface of the plastic substrate in contact with the pressure-sensitive adhesive film.

For example, the laminated structure of the plastic organic light emitting display 106 can be seen in FIG. 2 . Specifically, the back plate film 103; plastic substrate 104; and organic light emitting devices 105 are sequentially stacked.

The laminated structure of the plastic organic light emitting display is not limited thereto, and may be provided as a laminated structure known in the art.

The pressure-sensitive adhesive composition will be described in detail in Examples below. However, the following examples are for illustrative purposes only, and the scope of the present specification is not limited thereto.

<Preparation Example> Preparation of pressure-sensitive adhesive composition

A pressure-sensitive adhesive composition having the composition shown in Table 1 was prepared. First, at least one monomer (A) and a functional monomer were polymerized together with a curing agent (xylene diisocyanate), and then an additive for increasing adhesion (3-glycidoxypropyl trimethoxysilane) was added.

The content ratio of the monomer (A) and the functional monomer is based on 100 parts by weight of the total monomer, and the content of the additive for increasing adhesive strength is based on 100 parts by weight of the pressure-sensitive adhesive composition.

In Table 1, EHA (ethylhexyl acrylate) was used as a main monomer having a glass transition temperature of -50°C, and a product of NIPPON Shoukubai was used.

In Table 1, IOA (isooctyl acrylate) was used as a comonomer having a glass transition temperature of -70°C, and a product of NIPPON Shoukubai was used.

In Table 1 above, HEA (2-hydroxyethyl (meth)acrylate) was used as a functional monomer manufactured by NIPPON Shoukubai.

<Experimental example>

After applying the pressure-sensitive adhesive composition of 10% to 50% (for example, 15%) of the solid content of Examples 1 to 10 prepared in Preparation Example on a base film (PET), it is dried at 80°C to 140°C using a dry oven. to prepare a backplate film.

The room temperature adhesive strength was measured after laminating the prepared backplate film to the adherend substrate and leaving it for 3 hours, and the permanent adhesive force was laminated to the adherend substrate and then autoclaved at a temperature of 50° C. and a pressure of 0.5 MPa for 20 minutes. After maintaining, the adhesive strength was measured after standing at room temperature for 1 hour. The measurement results are shown in Table 2 below.

From the above results, it can be seen that the adhesive strength of the adhesive film containing the pressure-sensitive adhesive composition composed of two or more monomers (A) is higher than that of the comparative example in which only one type of monomer (A) is formed. In addition, higher adhesion was measured when the PI film was used than when glass was used as the adherend, and the adhesive force of the Examples in which the silane coupling agent was added as an additive for increasing adhesion was measured to be higher.

Therefore, the adhesive composition comprising two or more monomers (A) having a glass transition temperature of -95 ° C. or higher and -30 ° C. or lower, and wherein the content of the monomer (A) is 93 parts by weight or more based on 100 parts by weight of the total monomer, the adhesive strength is excellent was able to confirm

101: protective film
102: adhesive film
103: back plate film
104: plastic substrate
105: organic light emitting device
106: plastic organic light emitting display

Claims (20)

A pressure-sensitive adhesive composition comprising two types of monomers (A) having a glass transition temperature (T _{g ) of -95°C or higher and -30°C or lower,}
The content of the monomer (A) is 93 parts by weight or more based on 100 parts by weight of the total monomer,
The monomer (A) is one main monomer in an amount of 55 parts by weight or more and 85 parts by weight or less, based on 100 parts by weight of the total monomer; and 10 parts by weight or more and 40 parts by weight or less of one comonomer,
The comonomer has a lower glass transition temperature than the main monomer,
The main monomer is isodecyl acrylate, n-dodecyl (meth) acrylate, 2-ethylhexyl acrylate, lauryl (meth) acrylate, ethyl diglycol acrylate, or stearyl polyethylene glycol (meth) acrylate ego,
The comonomer is isooctyl acrylate, 2-propylheptyl acrylate, 2- (2-ethoxyethoxy) ethyl acrylate, or heptadecyl acrylate pressure-sensitive adhesive composition. delete delete delete The method according to claim 1,
The pressure-sensitive adhesive composition further comprises a functional monomer comprising a hydroxyl group or a carboxyl group. The method according to claim 1,
The pressure-sensitive adhesive composition further comprises an additive for increasing adhesive strength. 7. The method of claim 6,
The adhesive composition for increasing the adhesive strength is a silane coupling agent. The method according to claim 1,
The glass transition temperature of the pressure-sensitive adhesive composition is a pressure-sensitive adhesive composition that is -30 ℃ or more and -10 ℃ or less. The method according to claim 1,
The pressure-sensitive adhesive composition is a pressure-sensitive adhesive composition for the pressure-sensitive adhesive film of the back plate film of the plastic organic light emitting display. base film; and
A pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition according to any one of claims 1 and 5 to 9 or a cured product thereof provided on one surface of the base film;
Adhesive film comprising a. 11. The method of claim 10,
The adhesive film has a thickness of 60 μm or more and 120 μm or less. 11. The method of claim 10,
The adhesive film that is laminated so that the adhesive layer of the adhesive film is in contact with one surface of the polyimide (PI) film, and the adhesive force at room temperature measured after leaving it for 3 hours is 1000 gf/inch or more and 2000 gf/inch or less. 11. The method of claim 10,
After laminating one side of a polyimide (PI) film so that the adhesive layer of the adhesive film is in contact with it, and maintaining it for 20 minutes at a temperature of 50° C. and a pressure of 0.5 MPa in an autoclave, it is left at room temperature for 1 hour. An adhesive film having a measured permanent adhesive force of 1100 gf / inch or more and 2100 gf / inch or less. 11. The method of claim 10,
The adhesive film is an adhesive film for a back plate film of a plastic organic light emitting display. 11. The method of claim 10,
The adhesive film further comprising a release film provided on the opposite surface of the surface in contact with the base film of the adhesive layer. A backplate film comprising the adhesive film according to claim 10 . delete delete delete the backplate film according to claim 16;
a plastic substrate provided on the adhesive film side of the back plate film; and
an organic light emitting device provided on a surface opposite to the surface of the plastic substrate in contact with the pressure-sensitive adhesive film;
A plastic organic light emitting display comprising a.

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