KR102298760B1 - Method of printing wiring and apparatus for printing wiring - Google Patents

Abstract

SUMMARY One embodiment of the present invention provides a wiring printing method and a wiring printing apparatus capable of forming wiring on various types of substrates and improving wiring quality. Here, the wiring printing method comprises the steps of providing a supply substrate coated with copper compound nanoparticles mixed with copper particles and organic material on the upper surface, and providing a target substrate made of a light-transmitting material on which wiring is to be formed on the upper side of the supply substrate; , the step of heating the copper compound nanoparticles by allowing light irradiated from the upper side of the target substrate to pass through the target substrate, and photochemically reacting the copper compound nanoparticles to separate copper particles and produce polymer particles, and to separate copper particles and polymer particles. It includes the steps of flying by a gas generated from a photochemical reaction and depositing it on the lower surface of the target substrate, and curing the polymer particles deposited on the lower surface of the target substrate to form a wiring including copper particles.

Description

Wiring printing method and wiring printing apparatus

The present invention relates to a wiring printing method and a wiring printing apparatus, and more particularly, to a wiring printing method and a wiring printing apparatus capable of forming wiring on various types of substrates and improving wiring quality.

Printed electronics technology is a technology that manufactures only a desired wiring part as if printing it with conductive ink on a substrate or film.

Existing circuit board (PCB, FPCB) manufacturing technology is wasteful because it requires a method of plating copper or aluminum on the entire board, leaving only the necessary parts and removing the rest, that is, deposition process, photoresist fixing and etching process. The amount of conductive material that becomes available is large.

On the other hand, printed electronics technology can produce wiring at a relatively low price by reducing the process, eco-friendly production is possible, wiring can be formed on thin and small objects, Due to various advantages such as the ability to be formed, for example, it is applied to various industrial fields such as memory, display, battery, lighting, and sensor. In addition, printed electronic technology is expected to create high value-added industries by converging with industries such as smart IT, display, and solar power in addition to existing industrial fields.

As a conductive ink currently used in printed electronic technology, silver ink or silver paste mainly containing silver is common. However, since silver is reduced at the sintering temperature, sintering is easy, but there is a problem in that price competitiveness is low because of the high price.

Accordingly, in recent years, a technique using copper, which is cheaper than silver, is being pursued. However, when copper is used, it is difficult to make small copper particles, and since copper is easily oxidized at a sintering temperature and sintering is difficult, there are problems such as a reducing agent for preventing oxidation is required. The process difficulty is high.

In addition, when the substrate for forming the wiring is thick, there is a problem in that it is difficult to maintain the sintering temperature because the amount of heat energy supplied to the substrate for sintering the copper paste printed on the substrate increases.

Also, when using a polymer substrate that deforms at a temperature lower than the melting point of copper (eg, PET (polyethylene terephthalate)), the substrate may deform during the sintering process. As such, in the conventional printed electronic technology using copper, there is a problem in that the thickness and type of the substrate are limited.

In addition, copper paste contains additives along with copper particles. During the sintering process, the additives are vaporized and decomposed or gasified, and as these are discharged, pores are generated in the wiring formed on the substrate, so it is difficult to obtain dense wiring. have.

1 is a photograph of a wiring manufactured by a conventional printed electronic method. Referring to the FESEM (scanning electron microscope) photograph of FIG. 1 (a), it can be confirmed that many pores 11 are formed between the copper particles 10. In addition, referring to the FESEM photograph of FIG. 1B , it can be seen that a large number of wide pores 11a are formed in the copper film 10a.

Republic of Korea Patent Publication No. 2015-0077675 (published on Jul. 8, 2015)

In order to solve the above problems, it is an object of the present invention to provide a wiring printing method and a wiring printing apparatus capable of forming wiring on various types of substrates and improving wiring quality.

The technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

In order to achieve the above technical object, an embodiment of the present invention provides a supply substrate preparation step of preparing a supply substrate coated with copper compound nanoparticles mixed with copper particles and organic material on the upper surface; a target substrate preparation step of providing a target substrate made of a light-transmitting material on which wiring is to be formed on an upper side of the supply substrate; a heating step in which light irradiated from an upper side of the target substrate passes through the target substrate to heat the copper compound nanoparticles; a deposition step of separating copper particles and generating polymer particles by photochemically reacting the copper compound nanoparticles, and depositing the copper particles and the polymer particles on the lower surface of the target substrate by flying the copper particles and the polymer particles by the gas generated by the photochemical reaction; and curing the polymer particles deposited on the lower surface of the target substrate to form a wiring including the copper particles.

And, in order to achieve the above technical problem, one embodiment of the present invention is a supply substrate preparation step of preparing a supply substrate of a light-transmitting material coated with copper compound nanoparticles mixed with copper particles and organic material on the upper surface; a target substrate preparation step of providing a target substrate on which wiring is to be formed on an upper side of the supply substrate; a heating step in which light irradiated from the lower side of the supply substrate passes through the supply substrate to heat the copper compound nanoparticles; a deposition step of separating copper particles and generating polymer particles by photochemically reacting the copper compound nanoparticles, and depositing the copper particles and the polymer particles on the lower surface of the target substrate by flying the copper particles and the polymer particles by the gas generated by the photochemical reaction; and curing the polymer particles deposited on the lower surface of the target substrate to form a wiring including the copper particles.

In an embodiment of the present invention, the supply substrate and the target substrate may be flexible films.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention is a first supply unit for supplying a supply substrate coated with copper compound nanoparticles mixed with copper particles and organic material on the upper surface; a second supply unit for supplying a target substrate made of a light-transmitting material on which wiring is to be formed to an upper side of the supply substrate; and a light source provided on the upper side of the target substrate and irradiating light to heat the copper compound nanoparticles through the target substrate, wherein the copper compound nanoparticles heated by the light irradiated from the light source unit are photochemical The copper particles are separated and polymer particles are generated by the reaction, and the copper particles and the polymer particles fly by the gas generated by the photochemical reaction and are deposited on the lower surface of the target substrate, and the polymer particles are cured to form the copper particles It provides a wiring printing apparatus, characterized in that for forming a wiring comprising a.

And, in order to achieve the above technical problem, an embodiment of the present invention is a first supply unit for supplying a supply substrate of a light-transmitting material coated with copper compound nanoparticles mixed with copper particles and organic material on the upper surface; a second supply unit for supplying a target substrate on which wiring is to be formed to an upper side of the supply substrate; and a light source located below the supply substrate and irradiating light to heat the copper compound nanoparticles through the supply substrate, wherein the copper compound nanoparticles heated by the light irradiated from the light source unit are photochemical The copper particles are separated and polymer particles are generated by the reaction, and the copper particles and the polymer particles fly by the gas generated by the photochemical reaction and are deposited on the lower surface of the target substrate, and the polymer particles are cured to form the copper particles It provides a wiring printing apparatus, characterized in that for forming a wiring comprising a.

In an embodiment of the present invention, a guide part provided between the supply substrate and the target substrate and guiding the flow of the gas to the target substrate so that the copper compound nanoparticles are moved to the target substrate may be further included. have.

In an embodiment of the present invention, it may further include a suction unit provided on the outside of the target substrate for sucking the gas so that the copper particles and the polymer particles are moved to the target substrate.

In an embodiment of the present invention, the supply substrate and the target substrate may be formed of a flexible film to be supplied roll-to-roll.

According to an embodiment of the present invention, the copper particles deposited on the target substrate are formed as wires as the polymer particles are thermally cured. In this case, the thermal curing of the polymer particles may be performed in a temperature region lower than the sintering temperature of the copper particles. That is, in the present invention, since wiring is not formed by sintering copper particles that are easily oxidized, but wiring is formed using chemically stable copper compound particles, the manufacturing cost can be greatly reduced.

In addition, according to an embodiment of the present invention, since the thermosetting of the polymer particles can be made in a temperature region lower than the sintering temperature of the copper particles, various polymers including PET that can be deformed at a temperature lower than the sintering temperature of copper A material substrate may be used as a target substrate.

In addition, according to the embodiment of the present invention, since the temperature range at which the polymer particles deposited on the target substrate are thermally cured is sufficiently low, wiring can be formed even on a substrate made of a material that has poor adhesion to copper, such as glass or polyimide. . Accordingly, restrictions on the type and thickness of the target substrate may be lowered.

In addition, according to an embodiment of the present invention, since the wiring is deposited on the target substrate by flying in a mixed form of copper particles and polymer particles, unlike conventional printed electronics, a dense wiring can be formed with few or no pores. have.

In addition, according to an embodiment of the present invention, in the conventional printed electronic technology, a process of coating and drying a conductive ink according to the characteristics of a substrate is required to form a desired wiring, whereas according to the present invention, copper compound nanoparticles are supplied It may be prepared in a pre-coated and dried state on the substrate. Accordingly, in the present invention, the process of printing the conductive ink on the substrate may be omitted.

It should be understood that the effects of the present invention are not limited to the above-described effects, and include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a photograph of a wiring manufactured by a conventional printed electronic method.
2 is a flowchart illustrating a wiring printing method according to the first embodiment of the present invention.
3 is an exemplary view showing a wiring printing process according to the first embodiment of the present invention.
FIG. 4 is a photograph of wiring printed by the method of FIG. 2 .
5 is a front view showing the wiring printing apparatus according to the first embodiment of the present invention.
6 is a side view showing a wiring printing apparatus according to a first embodiment of the present invention.
7 is a flowchart illustrating a wiring printing method according to a second embodiment of the present invention.
8 is an exemplary diagram illustrating a wiring printing process according to a second embodiment of the present invention.
9 is a front view showing a wiring printing apparatus according to a second embodiment of the present invention.
10 is a side view showing a wiring printing apparatus according to a second embodiment of the present invention.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in several different forms, and thus is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is “connected (connected, contacted, coupled)” with another part, it is not only “directly connected” but also “indirectly connected” with another member in between. “Including cases where it is In addition, when a part "includes" a certain component, this means that other components may be further provided without excluding other components unless otherwise stated.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “have” are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, and one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a flowchart illustrating a wiring printing method according to a first embodiment of the present invention, and FIG. 3 is an exemplary diagram illustrating a wiring printing process according to the first embodiment of the present invention.

2 and 3 , the wiring printing method according to this embodiment includes a supply substrate preparation step (S110), a target substrate preparation step (S120), a heating step (S130), a deposition step (S140), and a wiring forming step. (S150) may be included.

The supply substrate preparation step ( S110 ) may be a step of preparing the supply substrate 210 on which the copper compound nanoparticles 220 including the copper particles 221 and the organic material 222 are coated.

The copper particles 221 may have a size of 30 nm or less, and the organic material 222 may include carbon (C), hydrogen (H), and oxygen (O). In the copper compound nanoparticles 220 , the copper particles 221 may be bound by the organic material 222 . In addition, the copper compound nanoparticles 220 may be entirely coated on the supply substrate 210 .

The supply substrate 210 is PET (polyethylene terephthalate), PE (polyethylene), PVC (polyvinyl chloride), PC (polycarbonate), PP (polypropylene), PMMA (polymethyl methacrylate), PS (polystyrene) ) and may be formed of at least one material of ABS resin.

The step of preparing the target substrate ( S120 ) may be a step of providing the target substrate 230 of a light-transmissive material on which the wiring is to be formed on the upper side of the supply substrate 210 .

The supply substrate 210 may have a lower light transmittance than the light transmittance of the target substrate 230 , and further, the supply substrate 210 may be formed of a light non-transmissive material.

The target substrate 230 is made of at least one of PE (polyethylene), PET (polyethylene terephthalate), PI (polyimide), glass, PP (polypropylene), PVC (polyvinyl chloride), and PC (polycarbonate). can be formed with

The supply substrate 210 and the target substrate 230 may be in the form of a plate or a flexible film.

The heating step ( S130 ) may be a step in which the light 331 irradiated from the upper side of the target substrate 230 passes through the target substrate 230 to heat the copper compound nanoparticles 220 .

The light 331 may be irradiated from the light source unit 330 provided above the target substrate 230 . It is preferable that the light 331 can transmit high light energy in a short time, and a laser or a xenon lamp may be used as the light source 330 to irradiate the light 331 . The light 331 may be irradiated to correspond to the pattern of the wiring to be formed.

In the deposition step (S140), the copper compound nanoparticles 220 are photochemically reacted to separate the copper particles 221 and polymer particles 225 are generated, and the copper particles 221 and the polymer particles 225 are photochemically reacted. It may be a step of depositing on the lower surface of the target substrate 230 by flying by the gas 227 .

When the light 331 is irradiated to the copper compound nanoparticles 220 , a photochemical reaction may occur, and accordingly, the organic material 222 may be decomposed. Then, the copper particles 221 bound by the organic material 222 may be separated. In addition, as the organic material 222 is decomposed, the polymer particles 225 may be generated.

Then, the gas 227 is generated by the photochemical reaction. The copper particles 221 and the polymer particles 225 can fly and move toward the target substrate 230 by the pressure of the gas 227, and the target It may be deposited on the lower surface of the substrate 230 .

The distance between the target substrate 230 and the supply substrate 210 may be sufficiently narrow, and the copper particles 221 and the polymer particles 225 may fly vertically upward by the pressure of the gas 227 .

Since the light 331 may be irradiated to correspond to the pattern of the wiring to be formed, the region where the photochemical reaction occurs may correspond to the pattern of the wiring. Accordingly, the region in which the flying copper particles 221 and the polymer particles 225 are deposited on the target substrate 230 may correspond to the wiring pattern.

In addition, by appropriately controlling the flight time of the copper particles 221 and the polymer particles 225 by the gas 227 , the thickness of the copper particles 221 and the polymer particles 225 deposited on the target substrate 230 is increased. can be adjusted, and through this, the thickness of the wiring can be adjusted.

The wiring forming step S150 may be a step of curing the polymer particles 225 deposited on the lower surface of the target substrate 230 to form a wiring including the copper particles 221 .

In a state in which the copper particles 221 and the polymer particles 225 are deposited on the lower surface of the target substrate 230 , the light 331 may be irradiated to pass through the target substrate 230 . Then, the copper particles 221 may be heated by the light 331 energy, and the polymer particles 225 may be heated by heat generated from the copper particles 221 to be thermoset. Here, the temperature at which the polymer particles 225 are thermally cured may be lower than the sintering temperature of the copper particles 221 .

The polymer particles 225 may be adhered to the target substrate 230 while being thermally cured, and the copper particles 221 may be bonded to each other at the same time. Through this, the wiring 229 having a desired pattern including the copper particles 221 may be formed.

FIG. 4 is a photograph of wiring printed by the method of FIG. 2 .

Referring to the FESEM photograph of FIG. 4A , it can be seen that the copper particles 221 forming the wiring are densely bonded, so that the pores are hardly visible.

And, referring to the FESEM photograph of FIG. 4 (b), it can be seen that the thickness of the wiring formed on the target substrate 230 made of glass is 200 nm or less. If the flight time of the particles 221 and the polymer particles 225 is appropriately controlled, the thickness of the wiring may be formed to be 50 nm or less. Since such a reduction in the thickness of the wiring 229 may lead to a reduction in residual stress in the wiring 229 , durability of the wiring 229 may be improved.

As described above, since copper is easily oxidized at a sintering temperature and sintering is difficult, it is difficult to apply in printed electronic technology despite a lower price than silver. And, in the conventional printed electronics technology, copper paste is directly printed on the substrate on which the wiring is to be formed and then sintered to form the wiring. A polymer substrate that is difficult to maintain and deforms at a temperature lower than the sintering temperature is difficult to use. In addition, in the conventional printed electronic technology, as the copper paste additive is vaporized and discharged, a lot of pores are generated in the wiring, and the quality of the wiring is deteriorated.

However, according to the present invention, the copper particles 221 deposited on the target substrate 230 are formed as wires as the polymer particles 225 are thermally cured. 221) may be made in a temperature region lower than the sintering temperature. That is, in the present invention, since wiring is not formed by sintering copper particles that are easily oxidized, but wiring is formed using chemically stable copper compound particles, the manufacturing cost can be greatly reduced.

And, according to the present invention, since the thermal curing of the polymer particles 225 can be made in a temperature region lower than the sintering temperature of the copper particles 221, including PET, which can be deformed at a temperature lower than the sintering temperature of copper. A substrate made of various polymer materials may be used as the target substrate 230 .

In addition, according to the present invention, since the temperature region at which the polymer particles 225 deposited on the target substrate 230 are thermally cured is sufficiently low, wiring is formed even on a substrate made of a material having poor adhesion to copper, such as glass or polyimide. can do. Accordingly, restrictions on the type and thickness of the target substrate 230 may be lowered.

In addition, according to the present invention, since the wiring 229 is a method in which copper particles 221 and polymer particles 225 fly in a mixed form and are deposited on the target substrate 230 unlike the conventional printed electronics, the pores are Dense wiring can be formed with little or no.

In addition, in the conventional printed electronic technology, a process of coating and drying a conductive ink according to the characteristics of the substrate is required to form a desired wiring, whereas according to the present invention, the copper compound nanoparticles 220 are applied to the supply substrate 210 . It may be prepared in a pre-coated and dried state. Accordingly, in the present invention, the process of printing the conductive ink on the substrate may be omitted.

Hereinafter, a wiring printing apparatus for performing the above-described wiring printing method will be described.

5 is a front view showing a wiring printing apparatus according to a first embodiment of the present invention, and FIG. 6 is a side view showing a wiring printing apparatus according to the first embodiment of the present invention.

3 , 5 and 6 , the wiring printing apparatus according to the present embodiment may include a first supply unit 310 , a second supply unit 320 , and a light source unit 330 .

The first supply unit 310 may supply the supply substrate 210 on which the copper compound nanoparticles 220 including the copper particles 221 and the organic material 222 are coated.

The supply substrate 210 may be formed of a flexible film, and the first supply unit 310 may be configured such that the supply substrate 210 may be supplied in a roll-to-roll manner. To this end, the first supply unit 310 may have a first unwinding roller 311 and a first take-up roller 312 .

The supply substrate 210 may be in a state wound around the first unwinding roller 311, and the mixed copper compound nanoparticles 220 may be coated on the supply substrate 210 wound around the first unwinding roller 311. have. The supply substrate 210 supplied while being unwound by the first unwinding roller 311 may be wound around the first take-up roller 312 .

The second supply unit 320 may supply the target substrate 230 made of a light-transmitting material on which wiring is to be formed to the upper side of the supply substrate 210 .

The target substrate 230 may be formed of a flexible film, and the second supply unit 320 may be configured such that the target substrate 230 may be supplied in a roll-to-roll manner. To this end, the second supply unit 320 may have a second unwinding roller 321 and a second take-up roller 322 .

The target substrate 230 may be wound around the second unwinding roller 321 , and the target substrate 230 unwound by the first unwinding roller 311 may be wound on the second take-up roller 322 .

By allowing the supply substrate 210 and the target substrate 230 to be supplied on a roll-to-roll basis, the wiring printing process can be performed quickly.

The light source unit 330 may be provided on the upper side of the target substrate 230 , and may transmit light 331 passing through the target substrate 230 to heat the copper compound nanoparticles 220 . A laser or a xenon lamp may be used as the light source unit 330 .

The copper compound nanoparticles 220 heated by the light 331 irradiated from the light source 330 are photochemically reacted to separate the copper particles 221 to form polymer particles 225 , and the copper particles 221 and the polymer The particles 225 fly by the gas 227 generated by the photochemical reaction and are deposited on the lower surface of the target substrate 230 , and the polymer particles 225 are cured to form the wiring 229 including the copper particles 221 . can be formed

In addition, the wiring printing apparatus may further include a guide part 340 .

The guide part 340 may be provided between the supply substrate 210 and the target substrate 230 . In addition, the guide part 340 may be provided to include a region where the light 331 is irradiated to the copper compound nanoparticles 220 inside. That is, the guide part 340 may be provided so as to surround the region where the light 331 is irradiated to the copper compound nanoparticles 220 .

The guide part 340 may guide the flow of the gas 227 to the target substrate 230 by surrounding the area where the light 331 is irradiated to the copper compound nanoparticles 220, and through this, the copper compound nanoparticles ( 220 may be moved to the target substrate 230 .

In addition, the guide part 340 may be provided so that the upper portion is in close contact with the lower portion of the target substrate 230 , and the lower portion is in close contact with the upper portion of the supply substrate 210 . Through this, the guide part 340 may prevent the target substrate 230 from sagging, and the distance between the target substrate 230 and the supply substrate 210 may be kept constant.

Also, the wiring printing apparatus may further include a suction unit 350 .

The suction unit 350 may be provided outside the target substrate 230 . The suction unit 350 may suck in the gas 227 to move the copper particles 221 and the polymer particles 225 to the target substrate 230 . The suction unit 350 may be provided as a pair, and may be provided on the left and right sides based on the supply direction of the target substrate 230 . Through this, the gas 227 generated by the photochemical reaction can be symmetrically distributed to both sides of the target substrate 230 and uniformly moved, which means that the flying copper particles 221 and the polymer particles 225 are It can help you move upwards without being biased to one side.

7 is a flowchart illustrating a wiring printing method according to a second embodiment of the present invention, and FIG. 8 is an exemplary diagram illustrating a wiring printing process according to the second embodiment of the present invention. In this embodiment, the supply substrate may be formed of a light-transmitting material, and since other configurations are the same as those of the first embodiment described above, repeated descriptions will be omitted as much as possible.

7 and 8, the wiring printing method according to the present embodiment includes a supply substrate preparation step (S410), a target substrate preparation step (S420), a heating step (S430), a deposition step (S440), and a wiring forming step. (S450) may be included.

The supply substrate preparation step (S410) may be a step of preparing the supply substrate 510 of a light-transmitting material coated with copper compound nanoparticles 220 including copper particles 221 and an organic material 222 on the upper surface.

The supply substrate 510 is SAN (styrene acrylonitrile), PET (polyethylene terephthalate), PS (polystyrene), PVC (polyvinyl chloride), PC (polycarbonate), SMA (styrene maleic anhydride), PMMA ( It may be formed of at least one material of polymethyl methacrylate).

The step of preparing the target substrate ( S420 ) may be a step of providing the target substrate 530 on which the wiring is to be formed on the upper side of the supply substrate 510 .

The target substrate 530 may have lower light transmittance than the light transmittance of the supply substrate 510 , and further, the target substrate 530 may be formed of a light opaque material. The supply substrate 510 and the target substrate 530 may be in the form of a plate or a flexible film.

The heating step ( S430 ) may be a step in which the light 631 irradiated from the lower side of the supply substrate 510 passes through the supply substrate 510 to heat the copper compound nanoparticles 220 .

In the deposition step (S440), the copper compound nanoparticles 220 are photochemically reacted to separate the copper particles 221 and polymer particles 225 are generated, and the copper particles 221 and the polymer particles 225 are photochemically reacted. It may be a step of depositing on the lower surface of the target substrate 530 by flying by the gas 227 .

The wiring forming step S450 may be a step of curing the polymer particles 225 deposited on the lower surface of the target substrate 530 to form a wiring including the copper particles 221 .

In this embodiment, the supply substrate 510 is formed of a light-transmitting material, and the light 631 passes through the supply substrate 510 from the lower side of the supply substrate 510 to heat the copper compound nanoparticles 220 . Although it is different from the first embodiment, it goes without saying that the same wiring as in the first embodiment can be formed through this method as well.

9 is a front view showing a wiring printing apparatus according to a second embodiment of the present invention, and FIG. 10 is a side view showing a wiring printing apparatus according to a second embodiment of the present invention.

As shown in FIGS. 9 and 10 together with FIG. 8 , the wiring printing apparatus according to the present embodiment may include a first supply unit 610 , a second supply unit 620 , and a light source unit 630 .

The first supply unit 610 may supply the supply substrate 510 made of a light-transmitting material coated with copper compound nanoparticles 220 including copper particles 221 and an organic material 222 on its upper surface.

The supply substrate 510 may be formed of a flexible film, and the first supply unit 610 is configured to have a first unwinding roller 611 and a first winding roller 612 so that the supply substrate 510 is roll-to-roll supply. can make it happen The supply substrate 510 may be in a state wound around the first unwinding roller 611 , and the mixed copper compound nanoparticles 220 may be coated on the supply substrate 510 wound around the first unwinding roller 611 . have. The supply substrate 510 supplied while being unwound by the first unwinding roller 611 may be wound around the first take-up roller 612 .

The second supply unit 620 may supply the target substrate 530 on which wiring is to be formed to the upper side of the supply substrate 510 . The second supply unit 620 may be configured to have a second unwinding roller 621 and a second take-up roller 622 so that the target substrate 530 may be supplied in a roll-to-roll manner. The target substrate 530 may be wound around the second unwinding roller 621 , and the target substrate 530 supplied while being unwound by the second unwinding roller 621 may be wound on the second winding roller 622 .

The light source unit 630 may be provided under the supply substrate 510 , and may radiate light 631 passing through the supply substrate 510 to heat the copper compound nanoparticles 220 .

The copper compound nanoparticles 220 heated by the light 631 irradiated from the light source 630 are photochemically reacted to separate the copper particles 221 to form the polymer particles 225 , and the copper particles 221 and the polymer The particles 225 fly by the gas 227 generated by the photochemical reaction and are deposited on the lower surface of the target substrate 530 , and the polymer particles 225 are cured to form the wiring 229 including the copper particles 221 . can be formed

Also in this embodiment, the wiring printing apparatus may further include a guide part 640 and a suction part 650 .

The description of the present invention described above is for illustration, and those of ordinary skill in the art to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and likewise components described as distributed may be implemented in a combined form.

The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

210,510: supply substrate 220: copper compound nanoparticles
221: copper particles 222: organic matter
225: polymer particles 227: gas
229: wiring 230, 530: target substrate
310,610: first supply unit 320,620: second supply unit
330,630: light source unit 331,631: light
340,640: guide part 350,650: suction part

Claims (8)

A supply substrate preparation step of preparing a supply substrate coated with copper compound nanoparticles containing copper particles and an organic material on the upper surface;
a target substrate preparation step of providing a target substrate made of a light-transmitting material on which wiring is to be formed on an upper side of the supply substrate;
a heating step in which light irradiated from an upper side of the target substrate passes through the target substrate to heat the copper compound nanoparticles;
a deposition step of separating copper particles and generating polymer particles by photochemically reacting the copper compound nanoparticles, and depositing the copper particles and the polymer particles on the lower surface of the target substrate by flying the copper particles and the polymer particles by the gas generated by the photochemical reaction; and
and a wiring forming step of curing the polymer particles deposited on the lower surface of the target substrate to form a wiring including the copper particles. A supply substrate preparation step of providing a supply substrate made of a light-transmitting material coated with copper compound nanoparticles containing copper particles and an organic material on the upper surface;
a target substrate preparation step of providing a target substrate on which wiring is to be formed on an upper side of the supply substrate;
a heating step in which light irradiated from the lower side of the supply substrate passes through the supply substrate to heat the copper compound nanoparticles;
a deposition step of separating copper particles and generating polymer particles by photochemically reacting the copper compound nanoparticles, and depositing the copper particles and the polymer particles on the lower surface of the target substrate by flying the copper particles and the polymer particles by the gas generated by the photochemical reaction; and
and a wiring forming step of curing the polymer particles deposited on the lower surface of the target substrate to form a wiring including the copper particles. 3. The method of claim 1 or 2,
The wiring printing method, characterized in that the supply substrate and the target substrate are flexible films. a first supply unit for supplying a supply substrate coated with copper compound nanoparticles containing copper particles and an organic material on the upper surface;
a second supply unit for supplying a target substrate made of a light-transmitting material on which wiring is to be formed to an upper side of the supply substrate; and
It is provided on the upper side of the target substrate and includes a light source unit for irradiating light to heat the copper compound nanoparticles through the target substrate,
The copper compound nanoparticles heated by the light irradiated from the light source are photochemically reacted to separate copper particles and polymer particles are generated, and the copper particles and the polymer particles are blown away by the gas generated by the photochemical reaction, and the A wiring printing apparatus, which is deposited on a lower surface of a target substrate, and wherein the polymer particles are cured to form a wiring including the copper particles. a first supply unit for supplying a supply substrate made of a light-transmitting material coated with copper compound nanoparticles containing copper particles and organic material on the upper surface;
a second supply unit for supplying a target substrate on which wiring is to be formed to an upper side of the supply substrate; and
It is located on the lower side of the supply substrate and includes a light source unit for irradiating light to heat the copper compound nanoparticles through the supply substrate,
The copper compound nanoparticles heated by the light irradiated from the light source are photochemically reacted to separate copper particles and polymer particles are generated, and the copper particles and the polymer particles are blown away by the gas generated by the photochemical reaction, and the A wiring printing apparatus, which is deposited on a lower surface of a target substrate, and wherein the polymer particles are cured to form a wiring including the copper particles. 6. The method according to claim 4 or 5,
and a guide part provided between the supply substrate and the target substrate and guiding the flow of the gas to the target substrate so that the copper compound nanoparticles are moved to the target substrate. 6. The method according to claim 4 or 5,
and a suction unit provided outside the target substrate and for sucking the gas so that the copper particles and the polymer particles are moved to the target substrate. 6. The method according to claim 4 or 5,
The supply substrate and the target substrate are formed of a flexible film, and the wiring printing apparatus, characterized in that the roll-to-roll supply.

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