KR102286480B1 - Apparatus for supplying organometallic compound with double structure - Google Patents

Abstract

The present invention relates to an organometallic compound supply device having a double structure, and to supply an organometallic compound having a stable concentration and vapor pressure by increasing thermal conductivity to a filling container containing a solid organometallic compound. The organometallic compound supply apparatus according to the present invention includes an external container having an installation space, a plurality of internal containers inserted into the installation space of the external container and connected to each other, and containing a solid organometallic compound therein, and an external container and a plurality of interiors It contains a filler made of a metal material with good thermal conductivity filled between the containers.

Description

Apparatus for supplying organometallic compound with double structure

The present invention relates to an organometallic compound supply device, and more particularly, to supply an organometallic compound having a stable concentration and vapor pressure by supplying a carrier gas to a charging container filled with a solid organometallic compound to supply an organometallic compound having a stable concentration and vapor pressure It's about the device.

Organometallic compounds are used as raw materials in the epitaxial growth of compound semiconductors. Organometallic compounds are often used for metalorganic chemical vapor deposition (MOCVD) with excellent mass productivity and controllability.

The organometallic compound supply device for supplying the organometallic compound includes a charging container filled with the organometallic compound, and supplies a carrier gas to the charging container containing the organometallic compound to generate a carrier gas containing the sublimated organometallic compound. and supplied to the vapor phase growth apparatus. That is, the organometallic compound is filled in a filling container and a carrier gas is flowed therein, so that the organometallic compound in contact with the carrier gas is introduced as a vapor into the carrier gas, and is taken out of the filling container along with the carrier gas and supplied to the vapor phase growth apparatus. do.

As a charging container for such an organometallic compound supply device, a cylindrical one made of a stainless material is generally used. In order to improve thermal efficiency, controllability of the concentration of an organometallic compound in a carrier gas, utilization rate, etc., a filling container having various characteristics, such as a structure of a bottom part of a filling container, a carrier gas introduction pipe, etc., is known. Moreover, as a filling container, a larger filling container is used from a viewpoint of productivity improvement.

Among the organometallic compounds used in the MOCVD method, when a solid organometallic compound such as trimethly indum (TMI) is charged as it is at room temperature, the organometallic compound in the portion in direct contact with the carrier gas is the organometallic compound in the other portion. The compound is consumed preferentially, ie introduced into the carrier gas.

Since the solid organometallic compound has poor fluidity, once partial consumption starts, the consumption of the portion is continuously promoted to form a flow path through which the carrier gas easily flows. When the flow path is formed, the contact area between the carrier gas and the organometallic compound is lowered, the concentration of the organometallic compound in the carrier gas discharged from the filling container is gradually lowered, and the vapor pressure is also lowered. As a result, there is a problem that the organometallic compound cannot be stably supplied to the reactor of the vapor phase growth apparatus.

Accordingly, the use of the organometallic compound is stopped when the concentration of the organometallic compound in the carrier gas is lowered, so that the unconsumed solid organometallic compound remains in the filling container. That is, there is a problem in that the use efficiency of the solid organometallic compound contained in the filling container is lowered.

In order to solve this problem, Patent Publication No. 10-1029894 (registered on Apr. 11, 2011) has a structure in which a plurality of spaces are formed by partitioning in the vertical direction with a partition wall in the filling container, and carrier gas moves through each space. A filling container for an organometallic compound having a

As described above, compared to the conventional filling container having one space, the filling container according to Korean Patent Publication No. 10-1029894 can improve the use efficiency of the solid organometallic compound.

However, although the inside of the filling container is divided into a plurality of spaces by the partition wall, a temperature difference is generated between the central portion and the outer portion of the filling container. Such a temperature difference may cause a difference in the amount of the solid organometallic compound used in the filling container. That is, in order to stably withdraw the organometallic compound from the filling container, the outer surface of the filling container is brought into contact with the heating medium. Since the heating medium contacts only the outer surface of the filling container, a temperature difference is inevitably generated between the central portion and the outer portion of the filling container.

Accordingly, an object of the present invention is to provide an organometallic compound supply device having a dual structure for supplying an organometallic compound having a stable concentration and vapor pressure by increasing thermal conductivity to a filling container.

In order to achieve the above object, the present invention is an external container having an installation space; a plurality of inner containers inserted into the installation space of the outer container and connected to each other and containing a solid organometallic compound therein; and a filler made of a metal material having good thermal conductivity filled between the outer container and the plurality of inner containers.

The material of the outer container and the inner container is stainless steel.

The filler is an aluminum material.

The filler is formed by injecting a liquid aluminum material into the outer container and the inner container.

The organometallic compound supply apparatus according to the present invention may further include a connection pipe connecting the plurality of inner containers in series.

The organometallic compound supply apparatus according to the present invention includes a supply pipe for supplying a carrier gas to an inner container located at one end of the plurality of inner containers; and a discharge pipe connected to an inner container located at the other end of the plurality of inner containers connected by the connection pipe, and for discharging a carrier gas containing an organometallic compound generated while passing through the plurality of inner containers to the outside of the outer container; may include more.

The outer container may include: a container body having the installation space and an opening formed thereon; a mounting plate coupled to the upper portion of the container body to cover the opening, and having a plurality of mounting holes through which the plurality of inner containers are inserted and mounted; and a cover plate coupled to the mounting plate to collectively seal the plurality of inner containers, and to which the supply pipe and the discharge pipe are installed.

And the container body, both sides are open, has a tube shape with the installation space formed therein, the mounting plate and the cover plate are coupled to the upper body, the liquid filler is injected into the installation space through the lower body; and a bottom plate coupled to a lower portion of the body.

The organometallic compound supply device according to the present invention has a double structure in which the filling container includes an outer container and a plurality of inner containers inserted into the outer container, and a metal having good thermal conductivity between the outer container and the plurality of inner containers Since the material has a filled structure, it is possible to supply an organometallic compound having a stable concentration and vapor pressure by increasing the thermal conductivity to the plurality of inner containers.

And while the carrier gas passes through the plurality of inner vessels connected in series, the organometallic compound is sublimed while in contact with the solid organometallic compound filled in the plurality of inner vessels. Therefore, since the sublimated organometallic compound is saturated with the carrier gas and discharged through the discharge pipe, the organometallic compound supply device according to the present invention can supply the organometallic compound having a stable concentration and vapor pressure.

1 is a perspective view showing an organometallic compound supply device having a double structure according to a first embodiment of the present invention.
FIG. 2 is a plan view of FIG. 1 .
3 is a cross-sectional view taken along line AA of FIG. 2 .
4 is a cross-sectional view taken along line BB of FIG. 2 .
5 is a perspective view showing an organometallic compound supply device having a double structure according to a second embodiment of the present invention.
6 is a plan view of FIG. 5 .
7 is a cross-sectional view taken along line CC of FIG. 6 .

It should be noted that, in the following description, only the parts necessary for understanding the embodiments of the present invention will be described, and descriptions of other parts will be omitted in the scope not disturbing the gist of the present invention.

The terms or words used in the present specification and claims described below should not be construed as being limited to their ordinary or dictionary meanings, and the inventors have appropriate concepts of terms in order to best describe their inventions. It should be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined in Accordingly, the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and do not represent all of the technical spirit of the present invention, so various equivalents that can be substituted for them at the time of the present application It should be understood that there may be variations and variations.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[First embodiment]

1 is a perspective view showing an organometallic compound supply device having a double structure according to a first embodiment of the present invention. FIG. 2 is a plan view of FIG. 1 . 3 is a cross-sectional view taken along line A-A of FIG. 2 . And FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2 .

1 to 4 , the organometallic compound supply apparatus 100 according to the first embodiment includes an outer container 10 , a plurality of inner containers 20 , and a filler 30 . The outer container 10 has an installation space 11 . The plurality of inner containers 20 are inserted into the installation space 11 of the outer container 10 and connected to each other, and contain a solid organometallic compound therein. And the filler 30 is a metal material having good thermal conductivity filled between the outer container 10 and the plurality of inner containers 20 .

In addition, the organometallic compound supply device 100 according to the first embodiment further includes a connection pipe 40 , a supply pipe 50 , and a discharge pipe 60 .

Here, the organometallic compound is an indium compound, a zinc compound, an aluminum compound, a gallium compound, a magnesium compound, a hafnium compound, a zirconium compound, a titanium compound, a barium compound, a lanthanum compound, a strontium compound, a tungsten compound, a ruthenium compound, a tantalum compound, and the like. The indium compound is indium trichloride, indium trifluoride, indium iodide compound, trimethylindium, dimethylchloroindium, cyclopentadienylindium, trimethylindium trimethylarsine adduct, trimethylindium trimethylphosphine adduct, etc. . The zinc compound is ethylzinc iodide, ethylcyclopentadienylzinc, cyclopentadienylzinc and the like. The aluminum compound is methyldichloroaluminum or the like. Gallium compounds include gallium trichloride, methyldichlorogallium, dimethylchlorogallium, galliumtriiodide, dimethylbromogallium, and the like. The magnesium compound is biscyclopentadienylmagnesium or the like. Hafnium compounds include hafnium chloride, tetrakis(dimethylamino)hafnium, and the like. The zirconium compound is zirconium chloride, tetrakis(dimethylamino)zirconium, or the like. The barium compound is bis(2,2,6,6-tetramethyl-3,5-heptanedionato)barium and the like. The lanthanum compound includes tris(bis(trimethylsilyl)amido)lanthanum, tris(isopropylcyclopentadienyl)lanthanum, tris(ethylcyclopentadienyl)lanthanum, and tris(cyclopentadienyl)lanthanum. The strontium compound is bis(2,2,6,6-tetramethyl-3,5-heptanedionato)strontium and the like. The tungsten compound is tungsten hexachloride, tungsten pentachloride, or the like. These organometallic compounds are only exemplified for the purpose of explanation, and organometallic compounds applicable to the present invention are not limited to these examples.

The organometallic compound supply apparatus 100 according to the first embodiment has a double structure in which a plurality of inner containers 20 are inserted into the installation space 11 of the outer container 10 . Stainless steel (SUS) may be used as a material of the outer container 10 and the inner container 20 . The outer container 10 and the inner container 20 may be formed in a tube shape.

The outer container 10 includes a container body 12 , a mounting plate 13 , and a cover plate 17 . The container body 12 has an installation space 11 and an opening is formed in the upper part. The mounting plate 13 is coupled to the upper portion of the container body 12 to cover the opening, and a plurality of mounting holes 14 into which the plurality of inner containers 20 are inserted and mounted are formed. And the cover plate 17 is coupled to the mounting plate 13 to seal the plurality of inner containers 20 collectively, and the supply pipe 50 and the discharge pipe 60 are installed.

The container body 12 has an installation space 11 in which a plurality of inner containers 20 can be inserted and installed. The plurality of inner containers 20 are inserted into the installation space 11 through the opening.

This container body 12 includes a body 15 and a bottom plate 16 . The main body 15 is open on both sides and has a tubular shape with an installation space 11 formed therein, a mounting plate 13 and a cover plate 17 are coupled to the upper portion, and into the installation space 11 through the lower portion. A liquid filler is injected. And the bottom plate 16 is coupled to the lower portion of the body (15). That is, the mounting plate 13 and the cover plate 17 are coupled to the upper part with the main body 15 as the center, and the bottom plate 16 is coupled to the lower part to seal the installation space 11 .

The mounting plate 13 supports the plurality of inner containers 20 when the plurality of inner containers 20 are inserted into the container body 12 and installed. This guides the plurality of inner containers 20 to be inserted into the container body 12 to be installed at the correct positions in the installation space 11 .

And the cover plate 17 is coupled to the upper portion of the mounting plate 13 to collectively seal the plurality of inner containers 20 from the external environment. The supply pipe 50 and the discharge pipe 60 are respectively connected to the inner container 20 mounted on the mounting plate 13 through the cover plate 17 . A sealing O-ring 18 is interposed between the cover plate 17 and the mounting plate 13 . The O-ring 18 may be interposed around the mounting hole 14 on which the plurality of inner containers 20 are mounted.

The plurality of inner containers 20 are installed in the installation space 11 of the container body 12 via the mounting plate 13 . The plurality of inner containers 20 have a tube shape with an opening formed thereon. The plurality of inner containers 20 have a length greater than the inner diameter. The opening of the inner container 20 is exposed through the mounting hole 14 of the mounting plate 13 . The first embodiment exemplifies a structure in which four inner containers 21 , 22 , 23 , 24 are inserted into the installation space 11 of the container body 12 . The plurality of inner containers 20 includes a first inner container 21 , a second inner container 22 , a third inner container 23 , and a fourth inner container 24 .

On the other hand, although the first embodiment discloses a structure in which four inner containers 21 , 22 , 23 , 24 are inserted into the installation space 11 of the container body 12 , the present invention is not limited thereto. For example, it may have a structure in which two or more inner containers 20 are inserted into the installation space 11 of the outer container 10 . In order to connect the plurality of inner containers 20 inserted into the outer container 10 in series, the number of the inner containers 20 inserted into the outer container 10 may be an even number. The shape of the outer container 10 may be determined according to the number of inner containers 20 inserted into the outer container 10 . In the first embodiment, an example in which the outer container 10 is implemented in a cylindrical shape is disclosed.

The plurality of inner containers 20 are connected in series with each other via a connecting pipe 40 . That is, the plurality of inner containers 20 are connected up and down through the connecting pipe 40 . For example, the first to fourth inner containers 21 , 22 , 23 , 24 may be connected in series as follows via the connecting pipe 40 . The lower portions of the first inner container 21 and the second inner container 22 are connected by a connecting pipe 40 . The upper portions of the second inner container 22 and the third inner container 23 are connected by a connecting pipe 40 . And the lower portions of the third inner container 23 and the fourth inner container 24 are connected by a connecting pipe 40 . The carrier gas is supplied to the upper part of the first inner container 21 through the supply pipe 50 . The carrier gas passes through the solid organometallic compound contained in the first to fourth inner vessels 21, 22, 23, and 24 connected in series, and contains the organometallic compound sublimed to the upper portion of the fourth inner vessel 24. create a carrier gas. And the carrier gas containing the sublimated organometallic compound is discharged out of the outer container 10 through the discharge pipe 60 connected to the upper portion of the fourth inner container (24).

The plurality of inner containers 20 are connected in series via the connecting pipe 40 to form a long flow path, thereby supplying an organometallic compound having a constant concentration and vapor pressure. In this case, the connection pipe 40 may be formed in the inner container 20 part under the mounting plate 13 . The inner diameter of the connecting tube 40 is smaller than the inner diameter of the inner vessel 20 so that the carrier gas can stably move between the inner containers 20 connected via the connecting tube 40 .

The filler 30 is filled between the outer container 10 and the plurality of inner containers 20 to uniformly and well transfer heat to the plurality of inner containers 20 . An aluminum material having good thermal conductivity may be used as the filler 30 . The filler 30 is formed by injecting a liquid aluminum material between the outer container 10 and the inner container 20 .

The filler 30 may be filled between the outer container 10 and the plurality of inner containers 20 in the following manner.

First, a plurality of inner containers 20 are inserted into the installation space 11 through the upper portion of the main body 15 using the mounting plate 13 and the cover plate 17 . The mounting plate 13 and the cover plate 17 are coupled to seal the upper part of the main body 15 .

Next, the liquid filler 30 is injected through the lower part of the opened main body 15 to fill the installation space 11 in which the plurality of inner containers 20 are installed.

And when the liquid filler 30 is hardened, the installation space 11 is sealed by coupling the bottom plate 16 to the lower part of the main body 15 . At this time, the lower portion of the main body 15 and the filler 30 so that the bottom plate 16 can be closely coupled to the lower portion of the main body 15 so that the lower portions of the main body 15 and the filler 30 are located on the same surface. A process of flat cutting or grinding can be performed.

The supply pipe 50 supplies the carrier gas to the inner container located at one end of the plurality of inner containers 20 connected by the connection pipe 40 . For example, the supply pipe 50 may be connected to the first inner container 21 located at one end of the first to fourth inner containers 21 , 22 , 23 , 24 connected in series through the cover plate 17 . Of course, the supply pipe 50 may be connected to the fourth inner container 24 instead of the first inner container 21 . A supply valve 51 for controlling the supply amount of the carrier gas is installed in the supply pipe 50 .

And the discharge pipe 60 is connected to the inner container located at the other end of the plurality of inner containers 20 connected by the connecting tube 40, the carrier containing the organometallic compound generated while passing through the plurality of inner containers (20) The gas is discharged out of the outer container (10). For example, the discharge pipe 60 may be connected to the fourth inner container 24 located at the other end among the first to fourth inner containers 21 , 22 , 23 and 24 connected in series through the cover plate 17 . If the supply tube is connected to the fourth inner vessel, the discharge tube is connected to the first inner vessel. The discharge pipe 60 is provided with a discharge valve 61 for controlling the discharge amount of the carrier gas containing the organometallic compound.

As such, the organometallic compound supply device 100 according to the first embodiment has a double structure in which the filling container includes an outer container 10 and a plurality of inner containers 20 inserted into the outer container 10 . Since it has a structure in which the filler 30 with good thermal conductivity is filled between the outer container 10 and the plurality of inner containers 20, the thermal conductivity to the plurality of inner containers 20 is increased to obtain a stable concentration and vapor pressure. It is possible to supply an organometallic compound having

And while the carrier gas passes through the plurality of inner containers 20 connected in series, the organometallic compound is sublimated while in contact with the solid organometallic compound filled in the plurality of inner containers 20 . Therefore, since the sublimated organometallic compound is saturated with the carrier gas and discharged to the discharge pipe 60 , the organometallic compound supply apparatus 100 according to the first embodiment can supply the organometallic compound having a stable concentration and vapor pressure.

[Second embodiment]

Meanwhile, although the first embodiment discloses an example in which four inner containers 21 , 22 , 23 , and 24 are inserted into the outer container 10 , the present invention is not limited thereto. That is, as shown in FIGS. 5 to 7 , in the second embodiment, the two inner containers 21 and 22 can be inserted into the outer container 10 .

5 is a perspective view showing an organometallic compound supply device 200 having a double structure according to a second embodiment of the present invention. 6 is a plan view of FIG. 5 . And FIG. 7 is a cross-sectional view taken along line C-C of FIG. 6 .

5 to 7 , the organometallic compound supply apparatus 200 according to the second embodiment is an embodiment except for the structure in which two inner containers 21 and 22 are inserted into the outer container 10 It has the same structure as the organometallic compound supply device according to (100 in FIG. 1).

On the other hand, the embodiments disclosed in the present specification and drawings are merely presented as specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those of ordinary skill in the art to which the present invention pertains that other modifications based on the technical spirit of the present invention can be implemented in addition to the embodiments disclosed herein.

10: outer container
11: Installation space
12: container body
13: cradle plate
14: mounting hole
15: body
16: bottom plate
17: cover plate
18 : O-ring
20: inner container
21: first inner container
22: second inner container
23: third inner container
24: fourth inner container
30: filler
40 : connector
50: supply pipe
51: supply valve
60: discharge pipe
61: discharge valve
100, 200: organometallic compound supply device

Claims (8)

an outer container in the form of a tube having an installation space;
a plurality of inner containers in the form of tubes which are vertically inserted into the installation space of the outer container and contain a solid organometallic compound therein;
a connection pipe connecting the plurality of inner containers up and down to connect the plurality of inner containers in series;
a filler made of a metal material having good thermal conductivity, which is filled and hardened between the outer container and the plurality of inner containers;
a supply pipe for supplying a carrier gas to an inner container located at one end of the plurality of inner containers; and
It is connected to the inner container located at the other end of the plurality of inner containers connected to the connection pipe, and a discharge pipe for discharging the carrier gas containing the organometallic compound generated while passing through the plurality of inner containers to the outside of the outer container; includes; do,
The material of the outer container and the inner container is stainless steel,
The filler is formed by solidifying a liquid aluminum material between the outer container and the inner container,
Since it has a dual structure in which the plurality of inner containers are inserted into the outer container, and a filler made of an aluminum material having good thermal conductivity is filled between the outer container and the plurality of inner containers, the plurality of inner containers An organometallic compound supply device having a double structure, characterized in that it can supply an organometallic compound having a stable concentration and vapor pressure by increasing the thermal conductivity to the container. delete delete delete delete delete According to claim 1, wherein the outer container,
a container body having the installation space and an opening formed thereon;
a mounting plate coupled to the upper portion of the container body to cover the opening, and having a plurality of mounting holes through which the plurality of inner containers are inserted and mounted; and
a cover plate coupled to the mounting plate to collectively seal the plurality of inner containers, and to which the supply pipe and the discharge pipe are installed;
Organometallic compound supply device of the double structure, characterized in that it comprises a. According to claim 7, The container body,
a body in which both sides are open and having a tube shape in which the installation space is formed, the mounting plate and the cover plate are coupled to the upper part, and the liquid filler is injected into the installation space through the lower part; and
a bottom plate coupled to a lower portion of the body;
Organometallic compound supply device of the double structure, characterized in that it comprises a.

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