KR102264326B1 - Touch sensor module - Google Patents

Abstract

The present invention relates to a touch sensor module, wherein the touch sensor module includes a spacer, a first coil part positioned on the spacer, and a first coil part including at least one coil layer and a lower part of the spacer, at least one coil layer It includes a second coil unit including a. As the distance between the first coil part and the second coil part changes, the inductance of the first coil part and the second coil part changes, and the touch sensor module detects the change in inductance and determines whether a touch is made. do.

Description

Touch sensor module {TOUCH SENSOR MODULE}

The present invention relates to a touch sensor module.

In general, a touch panel for outputting various operating states and inputting commands such as commands by a touch operation is provided to portable electronic devices such as smart phones and MP3 devices or home appliances such as refrigerators. is attached.

Accordingly, the touch panel may include only a touch sensor module for recognizing a user's touch operation, or a display device module for visually outputting information as well as the touch sensor module may be combined together.

In this case, the display module used in the touch panel is typically an OLED (organic light emitting diode) display device, particularly an active matrix organic light emitting diode (AMOLED) or a liquid crystal display (liquid crystal display). do.

In addition, the touch sensor module uses a two-dimensional touch sensing method that detects a touch point using the coordinates of the X and Y axes, as well as a three-dimensional touch sensing method that additionally detects the intensity of the touch applied in the Z-axis direction, which is the pressing direction. is becoming

For such a three-dimensional touch sensing method, conventionally, although the intensity of a touch is sensed using a pressure sensor or an image sensor, there is a problem in that a change in the touch intensity cannot be accurately detected.

In addition, depending on the installation position of the sensor for detecting the touch, there is a problem in that it is not accurately detected whether the touch.

Republic of Korea Patent No. 10-1777733 (Registration Date: September 06, 2017, Title of Invention: 3D Touch Device Using Image Sensor and Opaque Member)

The problem to be solved by the present invention is to improve the touch sensitivity of the touch sensor module.

Another problem to be solved by the present invention is to increase the degree of freedom in designing the touch sensor module.

A touch sensor module according to one aspect of the present invention for solving the above problems is a spacer, located on the spacer, a first coil part including at least one coil layer, and a lower part of the spacer, at least one and a second coil unit including a coil layer, wherein the inductance of the first coil unit and the second coil unit changes as the distance between the first coil unit and the second coil unit changes, and the inductance of the first coil unit and the second coil unit changes. Detect change.

A current in the same direction may flow through the first coil unit and the second coil unit.

As the distance between the first coil unit and the second coil unit decreases, the inductance may increase.

The first coil unit may include a first substrate, a first upper coil layer positioned above the first substrate, and a first lower coil layer positioned below the first substrate, and the second coil unit may include the It may include a second substrate different from the first substrate, a second upper coil layer positioned above the second substrate, and a second lower coil layer positioned below the second substrate.

A current in the same direction may flow through the first upper coil layer and the first lower coil layer.

Currents in the same direction may flow through the second upper coil layer and the second lower coil layer.

Currents in the same direction may flow through the first upper coil layer, the first lower coil layer, the second upper coil layer, and the second lower coil layer.

The touch sensor module according to the above feature may further include a connection substrate connecting the first substrate and the second substrate to each other.

The connection substrate may be formed in a folded or curved shape.

The touch sensor module according to the above feature may further include a connection pattern disposed on the connection substrate and electrically connecting the first coil unit and the second coil unit.

The first coil unit and the second coil unit may be located on one substrate.

The substrate may be formed in a folded or curved shape.

The touch sensor module according to the above feature may further include a connection pattern disposed on the substrate and electrically connecting the first coil unit and the second coil unit.

The touch sensor module according to the above feature may further include an electromagnetic shielding film positioned on at least one of an upper portion and a lower portion of at least one of the first coil portion and the second coil portion.

The spacer may be formed in the form of a flat plate positioned between the first coil part and the second coil part.

The spacer may be made of polyethylene, polyurethane, or polyolefin.

According to this feature, instead of using a separate plate-shaped target metal, coil units facing each other are used to cause inductance change according to the touch operation to sense the touch operation.

For this reason, since the number of coil windings of the two coil portions facing each other is increased to increase the amount of inductance generated, the sensitivity of the touch sensor module is increased.

In addition, since a separate target metal is not required, the touch sensor module can be mounted at a desired location without difficulty in mounting the touch sensor module, thereby increasing the degree of freedom in designing the product having the touch sensor module.

1 is a conceptual cross-sectional view of a touch sensor module according to an embodiment of the present invention.
FIG. 2 is a schematic perspective view illustrating a coil winding state of the first coil unit and the second coil unit shown in FIG. 1 .
3 is a graph illustrating changes in inductance according to a change in distance between a target metal and a coil unit by a touch operation in a touch center module of a comparative example and a touch sensor module according to an embodiment of the present invention.
4 is a conceptual cross-sectional view of a touch sensor module according to another embodiment of the present invention.
FIG. 5 is a view showing the formation positions of the first coil part and the second coil part on the substrate in FIG. 4 .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, for techniques or configurations already known in the art,

If it is determined that adding a detailed description may obscure the gist of the present invention, a part thereof will be omitted from the detailed description. In addition, the terms used in this specification are terms used to properly express the embodiments of the present invention, which may vary according to a person or custom in the relevant field. Accordingly, definitions of these terms should be made based on the content throughout this specification.

The terminology used herein is for the purpose of referring to specific embodiments only, and is not intended to limit the invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. As used herein, the meaning of 'comprising' specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of

Hereinafter, a touch sensor module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, a touch sensor module 1 according to an embodiment of the present example will be described with reference to FIG. 1 .

As shown in FIG. 1 , the touch sensor module 1 of this example includes a first coil unit 10 , a second coil unit 20 facing in the opposite direction to the first coil unit 10 , and a first coil unit. A spacer 30 positioned between the 10 and the second coil part 20, the first adhesive layer 401 positioned on the first coil part 10, and the second coil part 20 under The second adhesive layer 402 positioned on the first adhesive layer 401, the first electromagnetic shielding film 501 positioned on the first adhesive layer 401, the second electromagnetic shielding film 502 positioned on the second adhesive layer 402, the first coil unit 10 and a third adhesive layer 601 positioned between the spacer 30 and the fourth adhesive layer 602 positioned between the spacer 30 and the second coil unit 20 .

An air gap, which is an interval between the first coil unit 10 and the second coil unit 20 , varies according to a user's touch operation performed on the upper portion of the first coil unit 10 , and this interval change Accordingly, the magnitude of the inductance generated between the first and second coil units 10 and 20 varies.

The first coil unit 10 and the second coil unit 20, as shown in FIG. 1, respectively, include substrates 11 and 21 made of a single-sided printed circuit board, a double-sided printed circuit board, or a multi-layer printed circuit board. Coil layers 12 , 13 , 22 , and 23 positioned on the upper and lower surfaces of the respective substrates 11 and 21 are provided.

Accordingly, the first coil unit 10 includes the first substrate 11 , the first upper coil layer 12 positioned above the first substrate 11 , and the first coil unit 10 positioned below the first substrate 11 . A lower coil layer 13 is provided.

In addition, the second coil unit 20 includes a second substrate 21 different from the first substrate 11 , a second upper coil layer 22 , and a second substrate 21 positioned on the second substrate 21 . ) and a second lower coil layer 23 positioned under the.

At this time, the first and second substrates 11 and 21 are each used for bonding the polyimide resin and the copper foil with FCCL (Flexible Copper Clad Laminate), and each of the first and second coil units 10 and 20 is It is also used to insulate the upper and lower parts.

The first and second upper coil layers 12 and 22 and the first and second lower coil layers 22 and 23 are respectively disposed on the upper and lower surfaces of the substrates 11 and 21 on the upper and lower surfaces of epoxy (epoxy), etc. The molding process may be performed using the . In this case, the coil layers 12 , 13 , 22 , and 23 are safely and securely positioned on the corresponding substrates 11 and 12 .

In this example, the first and second upper and lower coil layers 11 , 12 , 21 , and 22 of the first coil unit 10 and the second coil unit 20 are connected to one another using a via hole or the like. is formed of a conductive pattern such as a conductive wire or copper foil pattern, and the terminal of the corresponding conductive wire or copper foil pattern is connected to the sensing unit 200 that outputs an electrical signal of a corresponding size according to the inductance, as shown in FIG. 2 . .

At this time, since the first coil unit 10 located on the upper side of the first and second coil units 10 and 20 is located closer to the outside than the second coil unit 20 , the pressure is applied during the user's touch operation. will receive For this reason, the first coil unit 10 positioned above the first and second coil units 10 and 20 functions as a target metal that is affected by a user's touch operation.

For this reason, the degree of bending of the first coil part 10 is changed according to the degree of the physical force applied from the outside of the first coil part 10 , and when the applied physical force is removed, the elasticity of the spacer 30 is removed. Accordingly, the first coil unit 10 is restored to its initial state.

A state in which AC power is applied to the first coil unit 10 and the second coil unit 20 connected by a single conductive wire or copper foil pattern to form a magnetic field in the first coil unit 10 and the second coil unit 20 In , when the distance between the first coil unit 10 and the second coil unit 20 is changed according to a change in the position of the first coil unit 10 , the first coil unit 10 and the second coil unit 20 . The magnitude of the inductance generated by A change in inductance according to a change in the distance between the two coil units 10 and 20 corresponding to each other is sensed by the sensing unit 200 .

For this reason, the sensing unit 200 senses the degree of force applied to the first coil unit 10 positioned on the first substrate 11 , that is, the degree of pressing in the Z-axis direction, using the sensed inductance level. Thus, it is detected whether the touch sensor module 1 is touched.

In FIG. 1 , the first coil unit 10 and the second coil unit 20 are located on both the upper and lower surfaces of the corresponding first and second substrates 11 and 21 , respectively, but the present invention is not limited thereto. The first and second substrates 11 and 21 may be positioned on only one surface (eg, an upper surface).

When the first upper and lower coil layers 12 and 13 are positioned on the upper and lower portions of the first substrate 11 , the coil winding direction is the same, and the second upper portion is also located on the upper and lower portions of the second substrate 21 . and coil winding directions when the lower coil layers 22 and 23 are positioned are also the same. For this reason, a current in the same direction flows in the first upper coil layer 12 and the first lower coil layer 13 , and also in the second upper coil layer 22 and the second lower coil layer 23 in the same direction. current flows

In addition, the coil winding direction when the first coil unit 10 is formed and the coil winding direction when the second coil unit 20 is formed are the same, so that the first coil unit 10 and the second coil unit are the same. A current in the same direction also flows in (20).

For this reason, the direction of the current flowing in the coils of all the coil layers 11, 12, 21, 22 of each coil unit 10, 20 is the same, so that the coil layers 11, 12, 21, and 22 have the same direction. current will flow through Accordingly, due to a phenomenon in which current flows in opposite directions, a phenomenon of attenuation of magnetic fields generated in the first coil unit 10 and the second coil unit 20 does not occur.

In addition, the first coil unit 10 and the second coil unit 10 and the second coil unit by adjusting the number of turns of each coil layer (12, 13, 22, 23) formed in the first coil unit 10 and the second coil unit 20 The magnitude of the magnetic field generated in (20) can be increased. For this reason, the amount of change in inductance is greatly increased according to the change in the distance between the first and second coil units 10 and 20 , and thus the sensitivity of the touch sensor module 1 is improved.

As described above, as the distance between the first coil unit 10 and the second coil unit 20 becomes narrower in a state in which an alternating current is applied to the two coil units 10 and 20 adjacent to each other facing each other in opposite directions, the Although the magnitude of the generated frequency is decreased, the inductance is increased, and the inductance decreases as the distance between the first coil unit 10 and the second coil unit 20 increases.

In addition, since the current flow direction in all the coil layers 11 , 12 , 21 , 22 of each coil unit 10 , 20 is the same, as already described, the magnetic field is canceled according to the current flow in opposite directions. Since the phenomenon does not occur, the sensitivity reduction of the touch sensor module 1 is prevented.

The spacer 30 is formed in the form of a flat plate positioned entirely between the first coil unit 10 and the second coil unit 20 , and is positioned between the first coil unit 10 and the second coil unit 20 . to separate

At this time, since the third adhesive layer 601 and the fourth adhesive layer 602 are respectively coated on the entire upper part and the lower part of the spacer 30 , the first coil part 10 and the second coil part 20 are the spacer material. It is safely positioned on the upper and lower surfaces of the 30 , and the spacer 30 is positioned between the entire lower surface of the first coil unit 10 and the entire upper surface of the second coil unit 20 .

The spacer 30 is made of a material having elasticity excellent in restoring force and compressibility, for example, polyethylene or polyurethane, polyolefin, etc., and may have a waterproof and dustproof function. .

Therefore, due to the spacer 30 , the first coil unit 10 and the second coil unit 20 are spaced apart by the thickness of the spacer 30 , so that the touch operation of the touch sensor module 1 is smooth. this is done

In addition, the first coating portion 10 located on the spacer 30 is stably maintained in the initial state without bending when the touch operation is not performed by the support operation by the spacer 30 to maintain the touch sensor module. The reliability of operation for (1) is improved and the lifespan is extended.

However, in an alternative example, the spacer 30 is not in contact with the entire first coil unit 10 and the second coil unit 20, but the edge of the first coil unit 10 and the second coil unit 20 ) can be located only on the edge of

The first electromagnetic shielding film 501 positioned on the first coil part 10 and the second electromagnetic shielding film 502 positioned below the second coil part 20 are respectively positioned above the first coil part 10 . Performs an electromagnetic shielding function with a metal plate (eg, an external case) 701 and a metal plate 702 such as a circuit board or a battery positioned below the second coil unit 20, and a film can be made in the form

In general, generation of eddy current is prevented by the operation of the first and second coil units 10 and 20 like the metal plates 701 and 702 in at least one of the first coil unit 10 and the second coil unit 20 . When the formed member exists, it is positioned in the first coil unit 10 and the second coil unit 20 to affect inductance generated in the coil layers 12 , 13 , 22 , and 23 .

Accordingly, when an eddy current is generated in a member other than a component for sensing a user's touch operation, the inductance generated in the coil is reduced regardless of the user's touch operation, and the sensing unit 200 detects an accurate touch state. It does not work, and the sensitivity of the touch sensor module is reduced.

However, in this example, since the first and second electromagnetic shielding films 501 and 502 exist between the corresponding metal plates 701 and 702 and the first and second coating portions 10 and 20, the corresponding metal plates 701 and 702 ) to suppress the generation of eddy currents so as not to affect the operation of the first and second coating units 10 and 20 .

Therefore, the sensing unit 200 of the touch sensor module 1 accurately detects the amount of change in inductance according to the degree of touch of the touch sensor module 1 without the influence of eddy currents generated in the metal plates 701 and 702 located on the upper or lower portions. and the magnitude of the generated inductance also does not decrease.

In an alternative example, when at least one of the first and second metal plates 701 and 702 is omitted, the corresponding electromagnetic shielding films 501 and 502 may also be omitted.

This touch sensor module 1 is performed on the first coil unit 10 by positioning the first coil unit 10 and the second coil unit 20 on the upper and lower portions, respectively, with the spacer 30 as the center. detects the user's touch action.

As such, since the first coil unit 10 functions as a target metal to which a user's touch operation is performed, a separate target metal made of metal is unnecessary on the upper portion of the touch sensor module 1 .

Accordingly, since a separate target metal is not required, it is much easier to secure an installation location for installing the touch sensor module 1 . In addition, since the material of a component that is made of metal like the outer case and adversely affects the electromagnetic operation of the product can be changed to a non-conductive material, the reliability of the operation of the product is improved and the weight of the product is realized.

In particular, in the case of a 5G antenna used in a smartphone, etc., there is a problem that the performance of the 5G antenna is greatly deteriorated due to a metallic material located in the vicinity.

However, in this example, since a separate target metal made of metal is unnecessary, the performance of the 5G antenna is not weakened. In addition, due to the electromagnetic shielding films 501 and 502 , noise generated by the operation of the antenna is prevented from adversely affecting the operation of the touch sensor module 1 .

In addition, as shown in FIG. 3, a separate target metal is provided to use the eddy current generated in the target metal according to the change in the distance between the target metal and the coil part (eg, 20) located in the opposite direction of the target metal. In the case of the touch sensor module according to the comparative example, as the distance (ie, air gap) between the target metal and the corresponding coil part gets closer, the generated inductance L11 decreases, whereas, as already described, the first coil part 10 ) as the target metal, the inductance L12 increases as the distance between the first coil unit 10 and the second coil unit 20 increases.

In addition, by increasing the number of coil turns of the first coil unit 10 and the first coil unit 20 , the range of change in the size of the inductance can be greatly increased.

With reference to Table 1 below, the amount of change in inductance according to the change in the air gap between the target metal and the coil unit in the comparative example and the present embodiment will be described.

Air gap (mm) comparative example Inductance (uH) ΔInductance (uH) (0.1mm to 0.4mm) 0.1 3.13 2.93 0.2 4.35 0.3 5.26 0.4 6.06 Air gap (mm) Example 1 Inductance (uH) ΔInductance (uH) (0.1mm to 0.4mm) 0.1 30.96 -14.9 0.2 23.83 0.3 19.21 0.4 16.06 Air gap (mm) Example 2 Inductance (uH) ΔInductance (uH) (0.1mm to 0.4mm) 0.1 92.66 -36.01 0.2 75.19 0.3 64.48 0.4 56.65

In [Table 1], the air cap varies between 0.1 mm and 0.4 mm.

In Table 1, the comparative example is a case in which a separate target metal and a coil unit corresponding thereto are provided with a spacer therebetween, and in Example 1, only a coil layer is disposed on one of the upper and lower parts with the spacer interposed therebetween. This is a case in which a total of two coil layers are provided by providing the first coil unit and the second coil unit. Further, Embodiment 2 is a case in which a total of four coil layers are provided by providing a first coil part and a second coil part each having a coil layer on the upper part and the lower part with the spacer interposed therebetween.

In the case of the comparative example, the amount of change in inductance occurring as the air cap was changed from 0.1 mm to 0.4 mm was 2.93 uH.

On the other hand, in the case of Examples 1 and 2, the amount of change in inductance generated by changing the air cap to 0.1 mm to 0.4 mm was -14,9 uH and -36.01 uH. It was found that the sensitivity of the touch sensor module was improved by about 5 times or more.

At this time, in the case of Example 2, since the amount of change in inductance generated is more than twice that of Example 1, as the number of coil layers increases, the range of change in inductance according to the change in the air gap gap increases, so that the sensitivity of the touch sensor module was found to increase.

For this reason, the touch sensitivity of the touch sensor module 1 of this example is greatly increased compared to the case where a separate target metal is provided and the touch is sensed using the eddy current generated in the target metal. operation reliability is improved.

Next, a touch sensor module 1a according to another embodiment of the present invention will be described with reference to FIGS. 4 and 5 .

The touch sensor module 1 shown in FIGS. 1 and 2 includes first and second upper and lower coil layers 12, 13, 22, 23), has the same structure as the touch sensor module 1, except that the first coil part 10a and the second coil part 20a are formed on one substrate.

Accordingly, compared to the touch sensor module 1 shown in FIGS. 1 and 2, components having the same structure and performing the same function are given the same reference numerals as in FIGS. 1 and 2, and detailed descriptions thereof are omit

Therefore, referring to FIG. 4 , the touch sensor module 1a of this example includes a first coil part 10a, a second coil part 20a facing in the opposite direction to the first coil part 10a, and the first The spacer 30 positioned between the coil part 10a and the second coil part 20a, the first adhesive layer 401 positioned on the first coil part 10a, and the second coil part 20a are positioned below The second adhesive layer 402, the first electromagnetic shielding film 501 for blocking EMI with the first metal plate 701 positioned on the upper part of the first adhesive layer 401, the second adhesive layer 402 lower The second electromagnetic shielding film 502, the first coil unit 10, and the spacer 30 to block EMI with the second metal plate 702 located below the first coil unit 10a. A third adhesive layer 601 for fixing the , and a fourth adhesive layer 602 for fixing the second coil unit 20a to the lower portion of the spacer 30 are provided.

At this time, the first and second coil units 10a and 20a are formed with first and second upper and lower coil layers 12, 13, 22, and 23 respectively located on the upper and lower surfaces of the substrate 11a, respectively. be prepared

As shown in FIG. 5 , the first and second coil units 10a and 20b are different portions of one substrate 11a, for example, first and second coil units located opposite to each other on the same plane. located in the part and the second part, respectively.

That is, by using one coil, the first upper and lower surfaces of the first coil unit 10a are respectively located on the upper and lower surfaces of the corresponding position of the substrate 11a made of an insulating material such as a flexible printed circuit board. The coil layers 12 and 13 and the second upper and lower coil layers 22 and 23 of the second coil unit 20a are formed, and the conductive wire or copper foil pattern constituting the coil layers 12, 13, 22 and 23 is formed. Both ends are connected to the sensing unit 200 .

At this time, when the respective coil layers 12 , 13 , 22 , and 23 of the first coil unit 10a and the second coil unit 20a are formed on the substrate 11a, the description has been made with reference to FIGS. 1 and 2 . Similarly to the coil layers 12, 13, 22, and 23 of the touch sensor module 1, a conductive wire or a copper foil pattern is wound in the same direction.

For this reason, in the same manner as in the touch sensor module 1 described with reference to FIGS. 1 and 2 , the directions of currents flowing in the first upper and lower coil layers 12 and 13 of the first coil unit 10a are mutually exclusive. The direction of the current flowing in the first upper and lower coil layers 22 and 23 of the second coil unit 20a is the same as each other. In addition, the direction of the current flowing through the first coil unit 10a and the direction of the current flowing through the second coil unit 10b are also the same, so that the first and second upper and lower coil layers 12, 13, 22, and 23 All currents flowing in the same direction

When the first coil part 10a and the second coil part 20a are formed at the corresponding positions of the substrate 11a, the middle part AR11 between the first and second coil parts 10a and 20a is used as the center. , the substrate 11a is rotated to be folded 180 degrees so that the first coil unit 10a is positioned above the second coil unit 20a.

For this reason, as shown in FIG. 4 , the corresponding portion AR11 of the substrate 11a has a folded or curved shape.

Accordingly, the substrate 11a may be formed of a circuit board capable of folding or bending, for example, a flexible printed circuit board. Before the 180-degree folding operation of the substrate 11a is performed, FIG. The spacer 30 is already positioned on the upper surface of the first coil unit 10a in 5 (that is, the lower surface of the first coil unit 10a in FIG. 4) or the upper surface of the second coil unit 10a. Also, the first and second electromagnetic shielding films 501 and 502 are formed by using the third and fourth adhesive layers 401 and 402 on the corresponding surfaces of the first coil unit 10a and the second coil unit 20a. can be located

However, in another example, at least one of the spacer 30 and the first and second electromagnetic shielding layers 501 and 502 may be positioned at a corresponding position after the 180 degree folding operation of the substrate 11a is performed.

In the case of FIG. 4 , the portion AR11 in which the folding operation or bending operation is performed is a part of the substrate 11a, but unlike the portion AR11 in which the folding operation or the bending operation is performed is a separate connection substrate connected to the substrate 11a. can be done

In this case, the connecting substrate AR11 may be made of the same material as the substrate 11a or may be made of a different material. Accordingly, the substrate 11a may be formed of a rigid printed circuit board and the connection substrate may be formed of a flexible printed circuit board.

In this way, as shown in FIG. 5 , in the corresponding portion AR11 or the connecting substrate AR11 of the substrate 11a positioned between the first coil portion 10a and the second coil portion 20a, first and second A connection pattern P11 for electrically and physically connecting the two coil units 10a and 20b is positioned.

In this way, when the first and second coil units 10a and 20a are formed using one substrate 11a, in addition to the effects already generated by FIGS. 1 and 2 , the first formed on the substrate 11a And since the forming process of the second coil parts 10a and 20a is simplified, an additional effect of reducing the manufacturing time and manufacturing cost of the touch sensor module 1a occurs.

Above, embodiments of the touch sensor module of the present invention have been described. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations will be possible from the point of view of those of ordinary skill in the art to which the present invention pertains. Accordingly, the scope of the present invention should be defined not only by the claims of the present specification, but also by those claims and their equivalents.

1, 1a: touch sensor module 10, 10a: first coil unit
20, 20a: second coil unit 11: first substrate
11a: substrate 21: second substrate
12: first upper coil layer 13: first lower coil layer
22: second upper coil layer 23: second lower coil layer
401, 402, 601, 602: adhesive layer 501, 502: electromagnetic shielding film
AR11: Connection board P11: Connection pattern

Claims (16)

In the touch sensor module,
a first coil unit including a first substrate, a first upper coil layer positioned above the first substrate, and a first lower coil layer positioned under the first substrate;
A second coil unit located under the first coil unit and including a second substrate, a second upper coil layer located above the second substrate, and a second lower coil layer located below the second substrate. ; and
The spacer is positioned between the entire lower surface of the first coil unit and the entire upper surface of the second coil unit to space the first coil unit and the second coil unit apart, and is made of a material having elasticity.
including,
Any one of the first upper coil layer and the first lower coil layer and any one of the second upper coil layer and the second lower coil layer are connected by a single conductive wire or a conductive pattern,
The first upper coil layer and the first lower coil layer are formed of a single conductive wire or conductive pattern and have the same winding direction,
The second upper coil layer and the second lower coil layer are formed in a single conductive wire or conductive pattern and have the same winding direction,
Inductance of the first coil part and the second coil part changes as the distance between the first coil part and the second coil part changes,
The touch sensor module detects a change in the inductance.
touch sensor module. According to claim 1,
A touch sensor module through which current in the same direction flows through the first coil unit and the second coil unit. According to claim 1,
The inductance increases as the distance between the first coil part and the second coil part becomes narrower. delete According to claim 1,
A touch sensor module through which current in the same direction flows in the first upper coil layer and the first lower coil layer. According to claim 1,
A touch sensor module through which current in the same direction flows in the second upper coil layer and the second lower coil layer. According to claim 1,
A touch sensor module through which currents in the same direction flow in the first upper coil layer, the first lower coil layer, the second upper coil layer, and the second lower coil layer. According to claim 1,
a connection substrate connecting the first substrate and the second substrate to each other
further comprising,
The first substrate and the second substrate are made of a rigid printed circuit board,
The connection board is made of a flexible printed circuit board, and is formed in a folded or curved shape.
touch sensor module. delete 9. The method of claim 8,
A connection pattern disposed on the connection substrate and electrically connecting the first coil unit and the second coil unit
A touch sensor module further comprising a. According to claim 1,
The first board and the second board are made of the same flexible printed circuit board, and the first coil part and the second coil part are respectively located on different surfaces of the flexible printed circuit board, and the flexible printed circuit board is A touch sensor module that is formed in a folded or curved shape. delete 12. The method of claim 11,
A connection pattern positioned on the substrate and electrically connecting the first coil unit and the second coil unit
A touch sensor module further comprising a. According to claim 1,
An electromagnetic shielding film positioned on at least one of an upper portion and a lower portion of at least one of the first coil unit and the second coil unit
A touch sensor module further comprising a. delete According to claim 1,
The spacer is a touch sensor module made of polyethylene, polyurethane, or polyolefin.

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