JP7233856B2 - Position detection sensor - Google Patents

Description

The present invention relates to a position detection sensor mounted in a position detection device that performs an input operation using, for example, a pen-type position indicator, and particularly to a position detection sensor that performs position detection by electromagnetic action.

2. Description of the Related Art As an input device for an information processing apparatus such as a personal computer, there is a so-called pen tablet that accepts operation input with an electronic pen. This pen tablet is equipped with a position detection sensor for detecting the position indicated by the electronic pen. The position detection sensor is composed of a sensor substrate body and a cable portion (lead wire portion). The sensor substrate main body is a portion where a plurality of X-axis direction electrodes and a plurality of Y-axis direction electrodes are arranged. In order to facilitate the connection to the electronic circuit (position detection circuit), the cable part pulls out the multiple X-axis direction electrodes and the multiple Y-axis direction electrodes that are arranged on the sensor substrate body. part.

In the electromagnetic induction type position detection sensor, each of the above-described X-axis direction electrodes and Y-axis direction electrodes is configured as a loop coil. Then, the electromagnetic induction type position detection sensor alternately has a transmission period in which power is sequentially supplied to the plurality of coils to generate a magnetic field, and a reception period in which the power supply is stopped and the magnetic field from the outside is received. It has a configuration to be provided. The electronic pen corresponding to the position detection sensor includes a resonance circuit consisting of a coil and a capacitor, and generates a signal by flowing current through the coil according to the magnetic field from the position detection sensor and transmits the signal to the position detection sensor. It has a configuration to

As a result, the electromagnetic induction position detection device supplies power to the electronic pen during the transmission period to enable the electronic pen to be driven. By receiving the oscillation signal from the electronic pen during the reception period, the electromagnetic induction type position detection device can detect the position indicated by the electronic pen and the writing pressure applied to the electronic pen. In the case of an electromagnetic induction type position detection sensor having such a configuration, a problem may arise if the position detection sensor and the electronic circuit are placed close to each other so as to overlap each other.

For example, during the transmission period, the magnetic field output to the electronic pen from the X-axis direction electrodes and the Y-axis direction electrodes configured as loop coils of the position detection sensor is attenuated by the influence of the metal parts of the electronic circuit. A problem arises in that the magnetic field that can be received by the electronic pen is weakened. In addition, noise generated by the electronic circuit may affect the X-axis direction electrodes and the Y-axis direction electrodes, causing a problem that the coordinates of the electronic pen cannot be detected accurately.

Therefore, Patent Document 1, which will be described later, discloses an invention relating to a position detection device or the like in which a magnetic path plate provided between a position detection sensor and an electronic circuit is devised. The invention disclosed in Patent Document 1 has the performance as an electromagnetic shield, does not attenuate the magnetic field generated by the X-axis direction electrode and the Y-axis direction electrode of the electronic pen and the position detection sensor, and prevents external magnetic noise. It uses a magnetic path plate that is less susceptible to the influence of The magnetic path plate has an amorphous metal layer and a non-amorphous metal layer.

JP-A-2009-3796

Mobile terminals such as so-called smart phones and tablet PCs (Personal Computers) are also equipped with position detection devices as input devices. 2. Description of the Related Art In recent years, portable terminals use a position detection sensor of a flexible substrate, which is lightweight. Also in the case of the position detection sensor of the flexible substrate, the sensor substrate main body and the cable portion are integrally formed. Since the flexible substrate is oxidized if the electrodes are left exposed, the electrodes are covered with a surface sheet or a functional sheet. The functional sheet is formed by laminating a coverlay (base film), a magnetic powder material layer, an electromagnetic shield layer, and a protective sheet, and also realizes the function as the magnetic path plate described above. Normally, the functional sheet is attached to the integrally formed sensor substrate main body and the cable section with a thermosetting resin.

When a mobile terminal equipped with an LCD (Liquid Crystal Display) is equipped with a flexible substrate position detection sensor, the position detection sensor is placed over the entire display screen of the LCD so that the entire display screen of the LCD is used as an instruction input area. correspond to the main body of the sensor board. Since operation buttons, a speaker as a handset, a camera lens, and the like are arranged in a portion other than the LCD display screen of the mobile terminal, the cable portion of the position detection sensor is bent so that the cable portion of the sensor substrate main body is bent. It is positioned on the back side and connected to the circuit board on the back side of the sensor substrate main body.

However, since the functional sheet is attached to the position detection sensor of the flexible substrate with thermosetting resin as described above, the hardened thermosetting resin and coverlay (base film) cannot be restored to their original state. to act as a restoring force. The cable part is bent and attached to the back side of the sensor board body with double-sided tape or the like, and then pressed to prevent it from returning to its original shape. inflate that part. In other words, there is a concern that the bent cable portion of the position detection sensor will swell after many years of use, adding stress to the surrounding circuitry, etc., and causing problems such as a decrease in the accuracy of position detection around that portion. be.

In view of the above, the present invention provides a position detection sensor for a flexible substrate consisting of a sensor substrate main body and a cable portion. It is an object of the present invention to realize a position detection sensor that is suitable for the case where a cable portion that is bent and used is provided, in addition to noise countermeasures for the cable portion that is used as a cable.

In order to solve the above problems,
An electromagnetic induction type position detection sensor that is used together with a position indicator and has a sensor substrate main body that includes a coil for electromagnetic coupling with the position indicator, and a cable section configured by pulling out the coil,
The sensor substrate main body is
A main body insulating substrate is provided, and a first surface of the main body insulating substrate on the side indicated by the position indicator and a second surface of the main body insulating substrate opposite to the first surface. and a conductor forming the coil is formed,
A magnetic powder material layer is coated on the entire second surface of the main body insulating substrate so as to cover the coil formed on the second surface of the main body insulating substrate,
The cable portion
a cable portion insulating substrate continuous with the body portion insulating substrate and provided so as to protrude from the body portion insulating substrate;
A first surface of the cable section insulating substrate continuous with the first surface of the main body insulating substrate, and a second surface of the cable section insulating substrate continuous with the second surface of the main body insulating substrate. A coil formed on the first surface of the main body insulating substrate and the second surface of the main body insulating substrate is drawn out to one or both of and
By bending the cable portion insulating substrate toward the second surface side of the main body portion insulating substrate, the second surface of the main portion insulating substrate and the cable portion insulating substrate sandwich the magnetic powder material layer. It is fixed in a state of facing the second surface,
A solid electrode is disposed on the first surface of the cable section insulating substrate that is continuous with the first surface of the body section insulating substrate and exposed to the outside.

The magnetic powder material layer reduces the attenuation of the magnetic field generated by the coil of the sensor substrate body due to eddy currents, and also reduces the contamination of noise from the outside. Further, the solid electrode prevents noise from being mixed in the signal output through the cable section. In this case, the magnetic powder material layer is provided directly on the sensor substrate main body without attaching the coverlay to the second surface of the cable portion with a thermosetting resin. Even if it is bent and fixed, the force acting to return it can be greatly reduced.

1A and 1B are diagrams for explaining an example of a position detection device configured using an electromagnetic induction type position detection sensor according to an embodiment and an example of an electronic pen as a position indicator; FIG. 1 is a diagram for explaining a specific configuration example of an electromagnetic induction type position detection sensor according to an embodiment; FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view for explaining a specific example of an electromagnetic induction type position detection sensor according to an embodiment; FIG. 4 is a diagram for explaining characteristics of a magnetic powder material layer used in the electromagnetic induction type position detection sensor of the embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a position detection sensor according to the present invention will be described below with reference to the drawings.

[Configuration Example of Position Detection Device Equipped with Position Detection Sensor]
FIG. 1 is a diagram for explaining an example of a position detection device configured using the position detection sensor of this embodiment, and an example of an electronic pen as a position indicator used in the position detection device. . The position detection device 100 and the electronic pen 200 of this embodiment are of the electromagnetic induction type. As shown in the upper left of FIG. 1, the electronic pen 200 as a position indicator includes a coil L used for signal transmission/reception, a writing pressure detection unit Cv which is a variable capacitor, a resonance capacitor Cf, and the like, which are connected in parallel. and a resonant circuit configured by

The position detection device 100 includes a position detection sensor 1 formed by stacking an X-axis direction loop coil group 12X and a Y-axis direction loop coil group 12Y. Each of the loop coils X ₁ , X ₂ , . . . , X _{40 of} the X-axis loop coil group 12X and the loop coils Y ₁ , Y ₂ , . , There are cases of multiple turns of 2 turns or more. Note that the position detection sensor 1 is shown in a simplified manner in FIG. 1, and the detailed configuration of the position detection sensor 1 will be described later. By connecting the position detection sensor 1 to the position detection circuit 102, the position detection device 100 is configured as a whole.

The position detection circuit 102 includes an oscillator 104 , a current driver 105 , a selection circuit 106 , a switching connection circuit 107 , a reception amplifier 108 , a position detection circuit 109 , a writing pressure detection circuit 110 , and a processing control section 111 . Consists of As shown in FIG. 1, the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y of the position detection sensor 1 are connected to the selection circuit . The selection circuit 106 sequentially selects one loop coil from the two loop coil groups 12X and 12Y under the control of the processing control unit 111 .

The processing control unit 111 is composed of a microprocessor. The processing control unit 111 controls the selection of the loop coil in the selection circuit 106 and the switching of the switching connection circuit 107 , and also controls the processing timing in the position detection circuit 109 and the writing pressure detection circuit 110 .

Oscillator 104 generates an AC signal of frequency f0. The oscillator 104 supplies the generated AC signal to the current driver 105 and the writing pressure detection circuit 110 . The current driver 105 converts the AC signal supplied from the oscillator 104 into a current and sends the current to the switching connection circuit 107 . The switching connection circuit 107 switches connection destinations (transmitting terminal T, receiving terminal R) to which the loop coil selected by the selection circuit 106 is connected under the control of the processing control unit 111 . Of these connection destinations, the transmission side terminal T is connected to the current driver 105, and the reception side terminal R is connected to the reception amplifier 108, respectively.

An induced voltage generated in the loop coil selected by the selection circuit 106 is sent to the reception amplifier 108 via the selection circuit 106 and the switching connection circuit 107 . The reception amplifier 108 amplifies the induced voltage supplied from the loop coil and sends it to the position detection circuit 109 and the pen pressure detection circuit 110 .

Radio waves transmitted from the electronic pen 200 generate induced voltages in the loop coils of the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y. The position detection circuit 109 detects the induced voltage generated in the loop coil, that is, the received signal, converts the detected output signal into a digital signal, and outputs the digital signal to the processing control unit 111 . The processing control unit 111 determines the coordinates of the indicated position of the electronic pen 200 in the X-axis direction and the Y-axis direction based on the digital signal from the position detection circuit 109, that is, the level of the voltage value of the induced voltage generated in each loop coil. Calculate the value.

On the other hand, the writing pressure detection circuit 110 synchronously detects the output signal of the reception amplifier 108 with the AC signal from the oscillator 104, obtains a signal having a level corresponding to the phase difference (frequency shift) therebetween, and A signal corresponding to the phase difference (frequency shift) is converted into a digital signal and output to the processing control unit 111 . The processing control unit 111 applies to the electronic pen 200 based on the level of the digital signal from the pen pressure detection circuit 110, that is, the signal level corresponding to the phase difference (frequency shift) between the transmitted radio wave and the received radio wave. Detects the pen pressure being applied.

[Configuration example of position detection sensor]
2A and 2B are diagrams for explaining a specific configuration example of the space-saving position detection sensor 1. FIG. 2A is a plan view, FIG. 2(C) is a cross-sectional view of the sensor layer 1X where the coil is provided. As shown in FIG. 2A, the position detection sensor 1 has a large rectangular sensor substrate main body when viewed from the side of the first surface (operation surface) 1S1, which is the surface on which the position is indicated by the electronic pen 200. 1S and a small rectangular cable portion 1C projecting from the sensor substrate main body 1S. In addition, the cable portion 1C may be formed, for example, in a trapezoidal shape, and there are various shapes.

The sensor substrate main body 1S includes a coil for electromagnetically coupling with the electronic pen 200, and is a portion that receives a position indication from the electronic pen 200. FIG. The cable portion 1C draws out the coil provided on the sensor substrate main body 1S and constitutes a connection end portion with the position detection circuit 102 described with reference to FIG. That is, the cable portion 1C is a portion for facilitating connection between the coil provided on the sensor substrate body 1S and the position detection circuit 102. FIG.

The sensor substrate main body 1S of the position detection sensor 1 is configured to be slightly larger than the display screen of a display device such as an LCD (Liquid Crystal Display) when mounted on a mobile terminal such as a smartphone or a tablet PC. It is designed to correspond. Further, when the position detection sensor 1 is mounted on a mobile terminal, as shown in FIG. It is bent toward a second surface (rear surface) 1S2 opposite to the first surface 1S1 of the sensor substrate body 1S, and connected to a circuit board on which the position detection circuit 102 is configured on the lower side of the sensor substrate main body 1S.

Therefore, when the position detection sensor 1 is mounted on a mobile terminal or the like, the second surface 1S2 of the sensor substrate main body 1S and the second surface 1C2 of the cable portion 1C come to face each other. Therefore, in the state shown in FIG. 2A, the first surface 1S1 of the sensor substrate main body 1S and the first surface 1C1 of the cable portion 1C, which are surfaces in the same direction, are bent. Therefore, the surfaces are opposite to each other.

Thus, in this embodiment, the surface of the sensor substrate main body 1S and the surface of the cable portion 1C are distinguished. That is, as shown in FIG. 2(B), the surface of the cable portion 1C connected to the first surface 1S1 of the sensor substrate body 1S is defined as the first surface 1C1 of the cable portion 1C, and the second surface 1C1 of the sensor substrate body 1S. The surface of the cable portion 1C that continues to the surface 1S2 of the cable portion 1C is the second surface 1C2 of the cable portion 1C.

As described above with reference to FIG. 1, the X-axis direction loop coil group 12X and the Y direction loop coil group 12Y are laminated on the sensor substrate main body 1S of the position detection sensor 1 . As shown in FIG. 2C, the sensor layer 1X, which is the part where the coils are provided, is provided with the X-axis direction loop coil group 12X on the second surface (lower surface) of the insulating substrate 11, and the first A Y-axis direction loop coil group 12Y is provided on the surface (upper surface) of . A surface sheet is provided on the Y-axis direction loop coil group 12Y to protect the Y-axis direction loop coil group 12Y.

In the cable section 1C, the X-axis direction loop coil group 12X, the insulating substrate 11, the Y-axis direction loop coil group 12Y, and the surface sheet are stacked in this order from the bottom side, which is the same as the sensor substrate main body 1S. However, the loop coils of the X-axis loop coil group 12X and the loop coils of the Y-axis direction loop coil group 12Y are arranged in an outward direction (sensor substrate body 1S) in order to facilitate connection to the position detection circuit 102. is pulled out in the direction opposite to the direction in which the Further, when each loop coil of the X-axis loop coil group 12X and each loop coil of the Y-axis direction loop coil group 12Y are pulled out on the same plane, and the connection ends of all the loop coils are configured on one plane. There is also

As shown in FIG. 2C, the position detection sensor 1 has a structure in which an X-axis direction loop coil group 12X and a Y-direction loop coil group 12Y are stacked. It is necessary to attenuate the magnetic fields generated by the loop coils of the loop coil groups 12X and 12Y by the metal parts of electronic circuits arranged nearby, and to prevent magnetic noise from entering from the outside. be. For this reason, conventionally, a functional sheet is provided on the second surface side, that is, below the X-axis loop coil group 12X in the case of the example shown in FIG. 2(C).

The functional sheet is configured by laminating, for example, a protective sheet, an electromagnetic shield layer, a magnetic powder material layer, and a coverlay (base film) in order from the bottom side, and the X-axis loop shown in FIG. It was adhered to the entire surface of the coil group 12X with a thermosetting resin. However, when the functional sheet is adhered with a thermosetting resin, the portion of the cable portion 1C that is bent and fixed acts so that the hardened thermosetting resin and the coverlay return to their original state.

That is, the thermosetting resin is cured by heating. Also, the coverlay is formed using a material having high strength such as polyimide. Therefore, both the thermosetting resin and the base film act to return to the state before being folded. Therefore, as described with reference to FIG. 2B, the cable portion 1C that is bent toward the second surface and fixed moves away from the second surface 1S2 of the sensor substrate main body 1S over time. , the cable portion 1C side of the sensor substrate main body 1S may be pushed up. In this case, there is a possibility that the detection sensitivity of the position detection sensor 1 is degraded in that portion.

Therefore, in the position detection sensor 1 of this embodiment, the conventionally used so-called coverlay (base film) and thermosetting resin for adhesion are not used. By devising the location and method of providing the magnetic powder material layer, the electromagnetic shield layer, and the solid electrode, the magnetic field generated by each loop coil of the loop coil groups 12X and 12Y can be prevented from being attenuated and can be generated from the outside. This realizes a space-saving position detection sensor that uses the cable portion 1C by bending so as to reduce the noise that is mixed in.

[Configuration example of position detection sensor]
FIG. 3 is a diagram for explaining a specific example of the position detection sensor 1 of this embodiment. FIG. 10 is a cross-sectional view of the case. Each layer constituting the position detection sensor 1 actually has a thickness of 1 mm or less, and as described with reference to FIG. It is bent to the side and fixed to the second surface 1S2 for use. However, in FIG. 3, in order to clearly show the laminated structure of the position detection sensor 1, each main layer is shown with a certain thickness.

For this reason, in FIG. 3, the bent portion of the position detection sensor 1 forms a curve, but actually, as shown in FIG. can be done. As described above, each layer constituting the position detection sensor 1 has a thickness of 1 mm or less. Therefore, as shown in FIG. It's nothing.

In addition, in FIGS. 3A to 3E, the uppermost sensor layer 1X has the laminated structure described with reference to FIG. 2C. In FIGS. 3A to 3E, a position P indicated by an arrow indicates a boundary position between the sensor substrate main body 1S and the cable portion 1C. Therefore, in FIGS. 3A to 3E, the left side of the position P is the sensor substrate main body 1S, and the right side of the position P (the bent portion) is the cable portion 1C.

<First Example of Position Detection Sensor 1>
FIG. 3A shows a first example of the position detection sensor 1. FIG. In the first example of the position detection sensor 1, the magnetic powder material layer 14 is provided so as to cover the X-axis direction loop coil group 12X formed on the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X. It is a thing. Therefore, the magnetic powder material layer 14 does not cover the second surface 1C2 of the cable portion 1C. Accordingly, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. 3A, the second surface 1S2 of the sensor substrate body 1S and the cable The second surface 1C2 of the portion 1C faces the magnetic powder material layer 14 therebetween. A solid electrode 15 is provided on the first surface 1C1 of the cable portion 1C.

The magnetic powder material layer 14 is obtained by mixing powder of a magnetic substance with high magnetic permeability, such as amorphous alloy powder, with a non-magnetic and non-conductive polymeric material, which is a resin in this example. In this embodiment, the magnetic powder material is configured in a form like paint, and the magnetic powder material in the form of paint is applied to the X-axis loop coil group formed on the second surface of the sensor layer 1X. A magnetic powder material layer can be formed by applying the magnetic powder material so as to cover the entire surface of 12X. In another example of the position detection sensor 1 described below, the magnetic powder material layers 14A, 14B, and 14C are constructed in the same manner as the magnetic powder material layer 14 described above.

As the magnetic powder material forming the magnetic powder material layer 14, permalloy or ferrite (iron oxide) powder can be used instead of the amorphous alloy powder. Moreover, the polymer material is not limited to resin, and may be either an organic polymer material or an inorganic polymer material. For example, organic polymer materials include proteins, nucleic acids, polysaccharides (cellulose, starch, etc.), natural polymer materials such as natural rubber, and synthetic polymer materials such as synthetic resins, silicon resins, synthetic fibers, and synthetic rubbers. can be used. Inorganic polymer materials that can be used include natural polymer materials such as silicon dioxide (crystal, quartz), mica, feldspar, and asbestos, and synthetic polymer materials such as glass and synthetic ruby.

The solid electrode 15 may be a single sheet-shaped electrode made of metal or various conductive materials, or may be a solid pattern of copper foil formed on one side of a double-sided substrate. There may be. The solid electrode 15 is provided over the entire portion overlapping the sensor substrate body 1S when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S. The solid electrode may be attached to the first surface 1C1 of the cable portion 1C by coating, vapor deposition, fusion bonding, adhesion using various adhesives, or placement of a solid pattern.

Thus, the magnetic powder material layer 14 is provided on the second surface 1S2 side of the sensor substrate body 1S of the sensor layer 1X so as to cover the X-axis loop coil group 12X of the sensor substrate body 1S of the sensor layer 1X. The magnetic powder material layer 14 forms a magnetic path that serves as a magnetic field path. As a result, the magnetic field generated by each loop coil of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y is attenuated due to the influence of the metal portion of the circuit board located on the lower side of the sensor substrate main body 1S. , the contamination of magnetic noise from the outside can be prevented.

A solid electrode is provided on the first surface 1C1 of the cable portion 1C. The cable portion 1C serves as a connection portion with the position detection circuit 102. Through this cable portion 1C, electrical noise from the outside mixes in, and electrical noise is emitted to the outside. You can make sure it doesn't happen.

<Second example of position detection sensor 1>
FIG. 3B shows a second example of the position detection sensor 1. As shown in FIG. The second example of the position detection sensor 1 is different from the first example of the position detection sensor described with reference to FIG. It is. That is, the electromagnetic shield layer 16 corresponds to the magnetic powder material layer 14, covers the second surface of the sensor substrate main body of the sensor layer 1X, and does not cover the second surface 1C2 of the cable section 1C. . As a result, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. 3B, the second surface 1S2 of the sensor substrate body 1S and the cable The second surface 1C2 of the portion 1C faces the magnetic powder material layer 14 and the electromagnetic shield layer 16 with the magnetic powder material layer 14 and the electromagnetic shield layer 16 interposed therebetween. Further, the point that the solid electrode 15 is provided on the first surface 1C1 of the cable portion 1C is the same as in the case of the first example shown in FIG. 3(A).

The electromagnetic shield layer 16 is non-magnetic and prevents electromagnetic noise from ICs and various circuits from entering each loop coil of the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y of the sensor layer 1X. . For this reason, the electromagnetic shield layer 16 is made of a metal material having low resistance (preferably almost zero electrical resistance) and high electrical conductivity, aluminum in this example.

As a method for attaching the electromagnetic shield layer 16 made of aluminum to the magnetic powder material layer 14, there is a method of adhering using an adhesive agent, a method of pressure bonding, or a method of vapor deposition of aluminum on the magnetic powder material layer 14. It is possible to use a method such as In the case of the press bonding method, the magnetic powder material layer 14 may be impregnated with an adhesive. In this embodiment, the electromagnetic shield layer 16 is deposited on the magnetic powder material layer 14 .

Thus, in the case of the second example, the second surface 1S2 side of the sensor substrate body 1S of the sensor layer 1X is provided so as to cover the X-axis loop coil group 12X of the sensor substrate body 1S of the sensor layer 1X. A magnetic powder material layer 14 and an electromagnetic shield layer 16 are provided. As a result, the magnetic field generated by each loop coil of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y leaks to the outside, and magnetic noise and electrical noise from the outside are mixed. can be prevented more reliably.

Further, since a solid electrode is provided on the first surface 1C1 of the cable portion 1C as in the case of the first example, electrical noise from the outside is prevented from entering through the cable portion 1C. Emission of electrical noise to the outside can be prevented.

<Third example of position detection sensor 1>
FIG. 3C shows a third example of the position detection sensor 1. As shown in FIG. In the first example described with reference to FIG. 3A, the magnetic powder material layer 14 is provided only on the second surface 1S2 portion of the sensor substrate main body 1S of the sensor layer 1X. In contrast, in the third example, both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto are coated with paint. A magnetic powder material layer 14A is provided by applying a magnetic powder material having a shape.

Accordingly, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. 3C, the second surface 1S2 of the sensor substrate body 1S and the cable The second surface 1C2 of the portion 1C faces each other with the magnetic powder material layer 14A having two layers (double the thickness) sandwiched therebetween. Further, the point that the solid electrode 15 is provided on the first surface 1C1 of the cable portion 1C is the same as in the first and second examples shown in FIGS.

In the case of the third example, as in the case of the first example, each loop coil of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y is generated by the function of the magnetic powder material layer 14A. Attenuation of the magnetic field and contamination of magnetic noise from the outside can be prevented. In addition, due to the function of the solid electrode 15 on the first surface 1C1 of the cable portion 1C, electrical noise from the outside is mixed through the cable portion 1C, and electrical noise is emitted to the outside. It is possible to prevent

In the case of the third example, magnetic powder is applied to both the second surface of the sensor layer 1X, that is, the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C. Since the material layer 14A may be applied, the manufacturing process can be simplified.

<Fourth example of position detection sensor 1>
FIG. 3D shows a fourth example of the position detection sensor 1. FIG. The fourth example of the position detection sensor 1, like the third example of the position detection sensor described with reference to FIG. A magnetic powder material layer 14B is provided on both the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto. The method of applying the magnetic powder material layer 14B is performed by applying the magnetic powder material in the form of paint, as described above.

Also in the fourth example, similarly to the second example shown in FIG. An electromagnetic shield layer 16 is further provided under the layer 14B. That is, the electromagnetic shield layer 16 covers the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X, but does not cover the second surface 1C2 of the cable section 1C. The method of adhering the electromagnetic shield layer 16 is performed by vapor-depositing aluminum on the portion of the magnetic powder material layer 14B corresponding to the second surface 1S2 of the sensor substrate main body 1S.

Accordingly, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. 3D, the second surface 1S2 of the sensor substrate body 1S and the cable The second surface 1C2 of the portion 1C faces each other with the magnetic powder material layer 14B and the electromagnetic shield layer 16 interposed therebetween. Further, the point that the solid electrode 15 is provided on the first surface 1C1 of the cable portion 1C is different from that of the first, second, and third examples shown in FIGS. It is the same as the case.

In the case of the fourth example, the functions of the magnetic powder material layer 14B and the electromagnetic shield layer 16 can provide the same effects as in the case of the second example. That is, the magnetic field generated by the loop coils of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y may leak to the outside, or may be mixed with external magnetic noise or electrical noise. can be prevented more reliably.

Further, since the solid electrode 15 is provided on the first surface 1C1 of the cable portion 1C as in the case of the first example, electrical noise from the outside may enter through the cable portion 1C. and the emission of electrical noise to the outside can be prevented.

<Fifth example of position detection sensor 1>
FIG. 3E shows a fifth example of the position detection sensor 1. FIG. In the fifth example of the position detection sensor 1, the second surface 1S2 of the sensor substrate main body 1S of the sensor layer 1X and the A magnetic powder material layer 14C is provided on both the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto. The method of adhesion is the same as in the above example, the magnetic powder material in the form of paint is applied to the second surface 1S2 of the sensor substrate main body 1S of the sensor layer 1X and the second surface 1S2 of the cable portion 1C of the sensor layer 1X connected thereto. It is carried out by applying to both the surface 1C2 of .

Further, as shown in FIG. 3E, an electromagnetic shield layer 16A is provided under the magnetic powder material layer 14C corresponding to the magnetic powder material layer 14C. In other words, the electromagnetic shield layer 16A also includes the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto, similarly to the magnetic powder material layer 14C. and both. The method of adhesion is the same as the above-described example, and aluminum is applied to both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto. This is done by evaporating aluminum onto the magnetic powder material layer 14C.

As a result, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. The second surface 1C2 of the portion 1C faces the magnetic powder material layer 14C with two layers and the electromagnetic shield layer 16A with two layers in between. Further, the first surface 1C1 of the cable portion 1C is provided with the solid electrode 15 in the first, second, and second positions shown in FIGS. 3. Same as in the fourth example.

Also in the case of this fifth example, the same effect as in the case of the second example can be obtained by the functions of the magnetic powder material layer 14C and the electromagnetic shield layer 16A. That is, the magnetic field generated by the loop coils of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y may leak to the outside, or may be mixed with external magnetic noise or electrical noise. can be prevented more reliably.

Further, since a solid electrode is provided on the first surface 1C1 of the cable portion 1C as in the case of the first example, electrical noise from the outside is prevented from entering through the cable portion 1C. Emission of electrical noise to the outside can be prevented.

In the case of the fifth example, magnetic powder is applied to both the second surface of the sensor layer 1X, that is, the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C. A material layer 14C and an electromagnetic shield layer 16A may be provided. Therefore, the manufacturing process can be simplified.

[Effects of Embodiment]
In the case of the position detection sensor 1 of this embodiment, as explained with reference to FIG. The adhesive sheet is not affixed with a thermosetting resin. In the example of FIGS. 3A and 3B, neither the magnetic powder material layer nor the electromagnetic shield layer is adhered to the second surface 1C2 of the cable portion 1C. 3(C), (D), and (E), the magnetic powder material layer and the electromagnetic shield layer are formed on the sensor layer 1X without using a thermosetting resin and without interposing a coverlay. It is covered against.

Therefore, even if the cable portion 1C of the position detection sensor 1 is bent toward the second surface 1S2 of the sensor substrate main body 1S and fixed, the coverlay is not attached like the conventional position detection sensor using the coverlay. The so-called springback phenomenon does not occur due to the influence of the thermosetting resin and coverlay. Therefore, even if the cable portion 1C of the position detection sensor 1 is bent toward the second surface 1S2 of the sensor substrate main body 1S and fixed, the cable portion 1C will not return to its original position due to long-term use. A high-precision position detection sensor whose detection performance does not deteriorate can be realized.

It should be noted that lead wires from each loop coil of the Y-axis direction loop coil group 12 arranged on the first surface of the sensor layer 1X are routed through a through-hole or the like near the connection between the sensor substrate main body 1S and the cable portion 1C. 2 and arranged on the second surface 1C2 of the cable portion 1C. Therefore, only solid electrodes can be arranged on the first surface 1C1 of the cable portion. Also, the solid electrode is normally connected (grounded) to the ground, which is the reference potential of the sensor substrate.

[Modification]
<Method of Adhering Magnetic Powder Material Layer and Electromagnetic Shield Layer>
In the embodiments described above, the magnetic powder material layers 14, 14A, 14B, and 14C are formed by coating the magnetic powder material in the form of paint. Moreover, the electromagnetic shield layers 16 and 16A were formed by vapor-depositing aluminum. However, it is not limited to this. For example, in the case of the first example shown in FIG. 3A and the second example shown in FIG. Neither an electromagnetic shield layer nor an electromagnetic shield layer is provided.

Therefore, the magnetic powder material layer 14 and the electromagnetic shield layer 16 are provided corresponding to the second surface 1S2 of the sensor substrate main body 1S of the sensor layer 1X, and the sensor substrate main body 1S is not bent for use. Therefore, it can be applied by any method. For example, in the case of the first example shown in FIG. 3A and the second example shown in FIG. The material layer 14 and the electromagnetic shield layer 16 may be adhered to the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X. Alternatively, a coverlay (base film) having the magnetic powder material layer 14 provided on one surface and the electromagnetic shield layer 16 provided on the other surface may be provided on the sensor substrate main body 1S portion using a thermosetting resin. good.

Further, in the case of the third example shown in FIG. 3C and the fourth example shown in FIG. 2 surface 1S2 and the second surface 1C2 of the cable portion 1C. For this reason, at least for the bending portion of the second surface 1C2 of the cable portion 1C, as long as the thermosetting resin is not used or the coverlay is not interposed, any method can be used to form the magnetic powder material layer 14A. may be applied.

In the case of the third and fourth examples shown in FIGS. 3(C) and 3(D), for example, a magnetic powder material formed into a sheet is coated with a thermosetting resin on the sensor substrate main body 1S of the sensor layer 1X. A magnetic powder material layer is formed by coating the entire surface of the second surface 1S2. In the cable portion 1C, if the thermosetting resin is not used for the bending portion, for example, the thermosetting resin is partially used, such as only the ends, to adhere the magnetic powder material to form a magnetic powder material layer. It is also possible to form

Further, in the case of the fifth example shown in FIG. 3(E), the magnetic powder material layer 14C and the electromagnetic shield layer 16A are connected to the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the cable. It is formed on both of the second surfaces 1C2 of the portion 1C. For this reason, unless the magnetic powder material layer 14A and the electromagnetic shield layer are adhered to at least the bent portion of the second surface 1C2 of the cable portion 1C using a thermosetting resin, what kind of method can be used to achieve the magnetic properties? A powder material layer 14A and an electromagnetic shield layer may be applied.

In the case of the fifth example shown in FIG. 3(E), for example, a magnetic powder material or aluminum formed into a sheet is coated with a thermosetting resin on the second surface 1S2 of the sensor substrate main body 1S of the sensor layer 1X. to form a magnetic powder material layer and an electromagnetic shield layer. In the cable portion 1C, if the thermosetting resin is not used for the bent portion, the thermosetting resin is partially used, for example, only the end portion, and the magnetic powder material or aluminum is adhered to the magnetic powder. It is also possible to form material layers and electromagnetic shield layers.

In addition, according to the form of the material to be adhered and the characteristics of the object to be coated, various methods such as coating, vapor deposition, fusion bonding, and pressure bonding can be used to form a magnetic powder material layer and a magnetic powder material layer on the sensor layer 1X. An electromagnetic shield layer can be applied. In addition, since the magnetic powder material layer and the electromagnetic shield layer need not be displaced from the sensor layer 1X, the entire surface of the magnetic powder material layer and the electromagnetic shield layer need not be adhered to the adherend. . Therefore, when using a sheet-shaped magnetic powder material or sheet-shaped aluminum, fix the sheet-shaped magnetic powder material or sheet-shaped aluminum at some parts such as the edge of the object to be adhered. You should leave it.

Further, in the case of the second example shown in FIG. 3B and the third example shown in FIG. In this case, the portions of the magnetic powder material layer 14 and the magnetic powder material layer 14C corresponding to the sensor substrate body 1S may be impregnated with an adhesive.

The point is that the portion of the cable portion 1C that is used after being bent should not be made of a material such as a thermosetting resin or a coverlay (base film) that acts to return to its original shape.

<Characteristics of magnetic powder material layer>
FIG. 4 is a diagram for explaining the characteristics of the magnetic powder material layers 14, 14A, 14B, and 14C used in the electromagnetic induction type position detection sensor of the embodiment. Specifically, FIG. 4 is a schematic diagram for explaining that the magnetization direction of the magnetic powder 14P in the magnetic powder material layers 14, 14A, 14B, 14C is changed before and after the magnetic field generator 300. FIG. . Therefore, the relationship between the size of the oblate elliptical magnetic powder 14P and the thickness and width of the magnetic powder material layers 14, 14A, 14B, and 14C differs from the actual one.

By aligning the magnetization directions of all the magnetic powder contained in the magnetic powder material layers 14, 14A, 14B, and 14C in the direction parallel to the operation surface of the position detection sensor 1, the magnetic powder material layers 14, 14A, 14B, and 14C Leakage magnetic flux from 14B and 14C can be easily prevented. In addition, it becomes easier to control the magnetic permeability of the magnetic powder material layers 14, 14A, 14B, and 14C, and it becomes easier to control the thickness of the magnetic powder material layers 14, 14A, 14B, and 14C for optimum magnetic permeability. have the effect of saying Therefore, in the position detection sensor 1 of this embodiment, the direction of magnetization is aligned by passing the position detection sensor 1 formed with the magnetic powder material layers 14, 14A, 14B, and 14C through the magnetic field generator 300. may

FIG. 4A shows the magnetic powder material layers 14, 14A, 14B, and 14C formed on the position detection sensor 1 when viewed from a direction orthogonal to the operation surface of the position detection sensor 1 operated by the electronic pen 200. 2 is a diagram for explaining the direction of magnetization (the direction connecting the magnetic poles) of the magnetic powder 14P in FIG. FIG. 4B shows the direction of magnetization of the magnetic powder 14P (the direction connecting the magnetic poles) when the magnetic powder material layers 14, 14A, 14B, and 14C are viewed from the direction perpendicular to the thickness direction. It is a figure for explaining. 4A and 4B, the magnetic powder material layers 14, 14A, 14B, and 14C pass through the magnetic field generator 300 from left to right.

As shown in FIGS. 4A and 4B, the directions of magnetization of the magnetic powders 14P contained in the magnetic powder material layers 14, 14A, 14B, and 14C formed in the position detection sensor 1 ( ) are different, as shown by the arrows attached to the respective magnetic powders 14P. By passing through the magnetic field generator 300, the magnetic powder layers 14, 14A, 14B, and 14C are aligned in the same direction as the magnetic field 300F, which is perpendicular to the thickness direction.

Then, by the action of the magnetic field generator 300, the magnetization directions of all the magnetic powders 14P contained in the magnetic powder material layers 14, 14A, 14B, and 14C change as shown in FIG. Aligned in the direction parallel to the face. This makes it easier to prevent magnetic flux leakage from the magnetic powder material layers 14, 14A, 14B, and 14C. In addition, it becomes easier to control the magnetic permeability of the magnetic powder material layers 14, 14A, 14B, and 14C, and it becomes easier to control the thickness of the magnetic powder material layers 14, 14A, 14B, and 14C for optimum magnetic permeability. have the effect of saying

Needless to say, the flat shape of the magnetic powder 14P is not limited to an elliptical shape. Any shape can be used as long as the direction of magnetization can be maintained with directivity while allowing polarity reversal in a direction perpendicular to the thickness direction, and typically includes needle-like and rod-like shapes. For example, the magnetic powder is a soft magnetic material, and its shape is such that the vector component (principal component) in one direction orthogonal to the thickness direction is larger than the other vector component orthogonal to that direction. , may be

REFERENCE SIGNS LIST 1 position detection sensor 1S sensor substrate main body 1C cable portion 1S1 first surface of sensor substrate main body 1S2 second surface of sensor substrate main body 1C1 first surface of cable portion 1C2 Second surface of cable portion 11 Insulating substrate 12X X-axis loop coil group 12Y Y-axis loop coil group 13 Surface sheet 1X Sensor layer 14, 14A, 14B, 14C... Magnetic powder material layer 15 Solid electrode 16, 16A Electromagnetic shield layer 100 Position detection device 102 Position detection circuit 200 Electronic pen 300 Magnetic field generator

Claims (6)

An electromagnetic induction type position detection sensor that is used together with a position indicator and has a sensor substrate main body that includes a coil for electromagnetic coupling with the position indicator, and a cable section configured by pulling out the coil,
The sensor substrate main body is
A main body insulating substrate is provided, and a first surface of the main body insulating substrate on the side indicated by the position indicator and a second surface of the main body insulating substrate opposite to the first surface. and a conductor forming the coil is formed,
A magnetic powder material layer is coated on the entire second surface of the main body insulating substrate so as to cover the coil formed on the second surface of the main body insulating substrate,
The cable portion
a cable portion insulating substrate that is continuous with the body portion insulating substrate and protrudes from a portion of the body portion insulating substrate;
A first surface of the cable section insulating substrate continuous with the first surface of the main body insulating substrate, and a second surface of the cable section insulating substrate continuous with the second surface of the main body insulating substrate. A coil formed on the first surface of the main body insulating substrate and the second surface of the main body insulating substrate is drawn out to one or both of and
By bending the cable portion insulating substrate toward the second surface side of the main body portion insulating substrate, the second surface of the main portion insulating substrate and the cable portion insulating substrate sandwich the magnetic powder material layer. It is fixed in a state of facing the second surface,
A position detection sensor, wherein a solid electrode is disposed on the first surface of the cable section insulating substrate that is continuous with the first surface of the body section insulating substrate and exposed to the outside. The position detection sensor according to claim 1,
A position detection sensor, wherein an electromagnetic shield layer is coated so as to cover the entire surface of the magnetic powder material layer coated on the entire surface of the second surface of the main body insulating substrate. The position detection sensor according to claim 1,
A position detection sensor, wherein a magnetic powder material layer is provided on the entire second surface of the cable section insulating substrate without using a thermosetting resin on the entire surface. The position detection sensor according to claim 2,
A magnetic powder material layer is provided on the entire second surface of the cable section insulating substrate without using a thermosetting resin on the entire surface, and the magnetic powder material layer is covered so as to cover the magnetic powder material layer. A position detection sensor, wherein an electromagnetic shield layer is provided on the entire surface of a magnetic powder material layer without using a thermosetting resin. The position detection sensor according to any one of claims 1, 2, 3, and 4,
The position detection sensor, wherein the direction of magnetization of the magnetic powder in the magnetic powder material layer is aligned in a direction orthogonal to the thickness direction of the magnetic powder material layer. The position detection sensor according to claim 1,
The coils for electromagnetic coupling with the position indicator include a first plurality of loop coils arranged in a first direction and a second loop coil arranged in a second direction orthogonal to the first direction. consists of multiple loop coils of
The first plurality of loop coils are arranged on the first surface of the main body insulating substrate, and the second plurality of loop coils are arranged on the second surface of the main body insulating substrate. The position detection sensor according to claim 1, further comprising a loop coil.

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