KR102262430B1 - Organic light emitting diode display - Google Patents

Abstract

An organic light emitting diode display according to an exemplary embodiment includes a first connection line extending in a first direction and connected to an organic light emitting device emitting light, and a repair line extending in a second direction crossing the first direction. and an insulating layer positioned between the first connection line and the repair line to insulate the first connection line and the repair line from each other, wherein the repair line protrudes in the first direction, and a portion of the A junction portion overlapping a portion of the first connection line may be formed.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DIODE DISPLAY}

The present invention relates to an organic light emitting display device, and to an organic light emitting display device that can be repaired in more detail.

Currently known flat panel displays include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting display (OLED), and a field effect display (field effect display). , FED), and an electrophoretic display device.

Among them, the organic light emitting diode display includes a pixel electrode, a common electrode, and an organic light emitting layer positioned therebetween. Electrons injected from one electrode and holes injected from another electrode combine in the organic light emitting layer. Forms an exciton, and the exciton emits energy and emits light.

At this time, in the organic light emitting display device, due to characteristic deviation of elements provided in each pixel or disconnection or short circuit in the pixel circuit, overcurrent greater than the normal driving current flows in some pixels, resulting in pixel defects expressed as bright spots. can

In addition, various pixel defects such as unevenness may occur due to inflow of foreign matter. In this case, a pixel defect is repaired by using a dummy line in the organic light emitting diode display.

An object of the present invention is to provide an organic light emitting diode display capable of easily repairing a defective pixel based on the above technical background.

Another object of the present invention is to provide an organic light emitting diode display capable of preventing an increase in resistance due to bonding different wires in a process of repairing a defective pixel.

An organic light emitting diode display according to an exemplary embodiment includes a first connection line extending in a first direction and connected to an organic light emitting device emitting light, and a repair line extending in a second direction crossing the first direction. and an insulating layer positioned between the first connection line and the repair line to insulate the first connection line and the repair line from each other, wherein the repair line protrudes in the first direction, and a portion of the A junction portion overlapping a portion of the first connection line may be formed.

The joint portion may have a rectangular shape.

At least half of a width of the junction portion in the second direction may overlap the first connection line.

The junction part and the repair line may be integrally formed.

The first connection line may be located below the repair line.

The first connection line may be positioned on the repair line.

a plurality of light emitting pixels including the organic light emitting element, the first connection line and a first pixel circuit connected to the organic light emitting element, and at least one dummy pixel spaced apart from the light emitting pixel and including a second pixel circuit; may include

The dummy pixel may further include a second connection line connected to the second pixel circuit to insulate and cross the repair line.

The repair line may be positioned on the same layer as a gate electrode of the thin film transistor included in each of the first and second pixel circuits, and the first connection line may be positioned on the same layer as the source and drain electrodes of the thin film transistor. can

The repair line may be positioned on the same layer as the source and drain electrodes of the thin film transistor included in the first and second pixel circuits, respectively, and the first connection line may be positioned on the same layer as the gate electrode of the thin film transistor. can

The light emitting pixel may be located in a display area displaying an image, and the dummy pixel may be located in a non-display area located around the display area.

In the insulating layer, a thickness of a region where the first connection line and the repair line overlap may be smaller than a thickness of a peripheral region of the overlapping region.

The insulating layer may be formed of at least one or more layers.

According to the organic light emitting display device as described above, it is possible to easily repair a defective pixel.

In addition, in order to repair a defective pixel, it is possible to prevent an increase in resistance as different wires are melted and joined to each other.

1 is a diagram schematically illustrating an organic light emitting display device according to an embodiment of the present invention.
2 is a diagram illustrating a connection structure of a light emitting pixel and a dummy pixel.
3 is a cross-sectional view illustrating a light emitting pixel and a dummy pixel of an organic light emitting diode display that are not repaired.
4 is a plan view illustrating a first connection line and a repair line of an organic light emitting diode display according to an exemplary embodiment.
FIG. 5 is a cross-sectional view taken along line V-V of FIG. 4 .
6 is a view illustrating a state in which the first connection line is covered by the junction part.
7 is a diagram illustrating a repair method of an organic light emitting diode display according to an exemplary embodiment.
8 is a diagram illustrating a light emitting pixel and a dummy pixel of a repaired organic light emitting diode display.

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and that the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Also, when a layer is said to be “on” another layer or substrate, it may be formed directly on the other layer or substrate, or a third layer may be interposed therebetween. Parts indicated with like reference numerals throughout the specification refer to like elements.

Hereinafter, an organic light emitting diode display according to an exemplary embodiment will be described with reference to FIGS. 1 to 4 .

1 is a diagram schematically illustrating an organic light emitting diode display according to an embodiment of the present invention, FIG. 2 is a diagram illustrating a connection structure between a light emitting pixel and a dummy pixel, and FIG. 3 is a light emission of an unrepaired organic light emitting display device It is a cross-sectional view illustrating a pixel and a dummy pixel, and FIG. 4 is a plan view illustrating a first connection line and a repair line of an organic light emitting diode display according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , an organic light emitting diode display according to an exemplary embodiment includes a substrate SUB, a plurality of scan lines SL1 to SLn, a plurality of data lines DL1 to DLm, and a plurality of repair lines ( RL1 to RLm), a plurality of light emitting pixels EP, and a plurality of dummy pixels DP. Here, the pixel means a minimum unit for displaying an image.

In FIG. 1 , only the substrate SUB, the scan line SLn, the data line DLm, the repair line RLm, the light emitting pixel EP, and the dummy pixel DP are illustrated, but the present invention is not limited thereto. The organic light emitting diode display according to an embodiment may further include a signal line such as a driving power line and an initialization power line.

The substrate SUB may be an insulating substrate including polyimide, polyamide, polyacrylates, glass or stainless steel. The substrate SUB includes a display area DA displaying an image and a non-display area NDA adjacent to the display area DA. A plurality of light emitting pixels EP are positioned in the display area DA of the substrate SUB, and a plurality of dummy pixels DP are positioned in the non-display area NDA of the substrate SUB.

Each of the plurality of scan lines SLn may extend in a first direction that is a row direction and may be disposed to be spaced apart from each other in a second direction that is a column direction. However, an extension direction and an arrangement direction of each of the plurality of scan lines SLn are not limited and may be formed in various directions.

In this case, the plurality of scan lines SLn may be connected to the thin film transistors of the light emitting pixel EP and the dummy pixel DP, respectively, and according to a signal of the scan line SLn, the organic light emitting element ( organic light emitting diodes) can emit light.

In the exemplary embodiment of the present invention, one scan line SLn is connected to each of one light emitting pixel EP and one dummy pixel DP, but the present invention is not limited thereto. may be connected to each of the light emitting pixel EP and one dummy pixel DP.

Meanwhile, each of the plurality of data lines DLm may extend in a second direction that is a column direction, and may be disposed to be spaced apart from each other in a first direction that is a row direction. Like the plurality of scan lines SLn, the extension direction and arrangement direction of each of the plurality of data lines DLm are not limited and may be formed in various directions.

Each of the plurality of data lines DLm insulates and crosses the plurality of scan lines SLn. Each of the plurality of data lines DLm may be connected to a thin film transistor of each of the light emitting pixel EP and the dummy pixel DP, and the organic light emitting device of the light emitting pixel EP emits light according to a signal of the data line DLm. can do.

In the exemplary embodiment of the present invention, one data line DLm is connected to each of one light emitting pixel EP and one dummy pixel DP, but the present invention is not limited thereto. may be connected to each of the light emitting pixel EP and one dummy pixel DP. In this case, the plurality of data lines DLm may include a data line and a driving power line.

According to an embodiment of the present invention, the plurality of repair lines RLm may extend in a second direction that is a column direction and are spaced apart from each other in a first direction that is a row direction. An extension direction and an arrangement direction of each of the plurality of repair lines RLm are not limited thereto, and may be formed in various directions.

Each of the plurality of repair lines RLm insulates and crosses each of the plurality of scan lines SLn. The plurality of repair lines RLm are adjacent to the light emitting pixel EP and the dummy pixel DP.

In this case, when a defect occurs in a specific light emitting pixel EP among a plurality of light emitting pixels EP adjacent to one repair line RLm, the defective light emitting pixel EP may be connected to the repair line RLm. The repair line RLm connected to the defective light emitting pixel EP may be connected to the dummy pixel DP. The connection between the specific light emitting pixel EP in which the defect has occurred and the repair line RLm and the connection between the repair line RLm and the dummy pixel DP will be described later.

The plurality of repair lines RLm are positioned on the same layer as the scan line SLn, on the same layer as the data line DLm, or on a different layer from each of the scan line SLn and the data line DLm. can be located in

The plurality of light emitting pixels EP are positioned in the display area DA of the substrate SUB and display an image. The light emitting pixel EP includes a first pixel circuit including a plurality of thin film transistors and one or more capacitors, and an organic light emitting device connected to the first pixel circuit. Each of the plurality of light emitting pixels EP is connected to the scan line SLn and the data line DLm, and may emit light in response to a signal passing through each of the scan line SLn and the data line DLm.

The plurality of dummy pixels DP are spaced apart from the plurality of light emitting pixels EP and are positioned in the non-display area NDA of the substrate SUB. The dummy pixel DP includes a second pixel circuit including a plurality of thin film transistors and one or more capacitors. Each of the plurality of dummy pixels DP is connected to the scan line SLn and the data line DLm, and the same signal as the light emitting pixel EP is transmitted through each of the scan line SLn and the data line DLm. can

2 and 3 , the light emitting pixel EP includes a first pixel circuit PC1 , an organic light emitting diode connected to the first pixel circuit PC1 , and an organic light emitting diode connected to the OLED. and a first connection line CL1 that insulates and crosses the repair line RLm.

The first connection line CL1 may be integrally formed with the source electrode SE and the drain electrode DE of the thin film transistor TFT. However, the present invention is not limited thereto, and the first connection line CL1 may be formed of a layer different from that of the source electrode SE and the drain electrode DE.

A repair line RLm is positioned below the first connection line CL1 . As described above, the repair line RLm is positioned below the first connection line CL1 to insulate and cross the first connection line CL1 . When a defect occurs in the light emitting pixel EP, the repair line RLm may be connected to the first connection line CL1 . A detailed description thereof will be given in detail in a repair method to be described later.

The repair line RLm is positioned on the same layer as the gate electrode GE of the thin film transistor TFT constituting each of the first pixel circuit PC1 and the second pixel circuit PC2 , but is not limited thereto. (GE) and may be located on a different floor.

The dummy pixel DP includes a second pixel circuit PC2 and a second connection line CL2 connected to the second pixel circuit PC2 and insulated from the repair line RLm. The second connection line CL2 is integrally formed with the source electrode SE and the drain electrode DE of the thin film transistor TFT, but is not limited thereto and is different from the source electrode SE and the drain electrode DE. It can be formed in layers.

The aforementioned repair line RLm is positioned below the second connection line CL2 . When a defect occurs in the light emitting pixel EP, the repair line RLm may be connected to the second connection line CL2 . A detailed description thereof will be given in detail in a repair method to be described later.

Each of the first pixel circuit PC1 of the light emitting pixel EP and the second pixel circuit PC2 of the dummy pixel DP includes an active layer AC, a gate electrode GE, a source electrode SE, and a drain electrode. a plurality of thin film transistors (TFTs) comprising (DE) and one or more capacitors. The first insulating layer IL1 is positioned between the gate electrode GE and the active layer AC, the second insulating layer IL2 is positioned between the gate electrode GE and the source electrode SE, and the source electrode The SE and the drain electrode DE are covered by the third insulating layer IL3 . Each of the first insulating layer IL1 , the second insulating layer IL2 , and the third insulating layer IL3 may be formed as a single layer or a multilayer including an organic material or an inorganic material.

The organic light emitting diode OLED includes a first electrode E1 connected to a thin film transistor TFT, an organic light emitting layer EL positioned on the first electrode E1, and a first electrode ( and a second electrode E2 positioned on E1). At least one of the first electrode E1 and the second electrode E2 is formed as a light-transmitting electrode, and light emitted from the organic light emitting layer EL is directed toward at least one electrode of the first electrode E1 and the second electrode E2. can be released as That is, the organic light emitting diode display may be formed as a top emission type or a bottom emission type.

According to an embodiment of the present invention, as shown in FIG. 3 , the thickness of the second insulating layer IL2 positioned between the first connection line CL1 and the repair line RLm may vary depending on the location. have. In more detail, in the second insulating layer IL2, the region I where the first connection line CL1 and the repair line RLm overlap and the first connection line CL1 and the repair line RLm do not overlap It can be divided into area (II). In the second insulating layer IL2, the thickness T1 of the region I is smaller than the thickness T2 of the region II. Since the thickness T1 of the region I of the second insulating layer IL2 is formed to be small, the first connection line CL1 and the repair line RLm may be easily bonded using a laser during the repair process. That is, since the thickness of the second insulating layer IL2 between the first connection line CL1 and the repair line RLm is smaller than the thickness of the other portions, the first connection line CL1 and the repair line RLm are connected to each other. Easier to join

Also, as described above, the thickness of the second insulating layer IL2 positioned between the second connection line CL2 and the repair line RLm may vary depending on the location. That is, the thickness of the second insulating layer IL2 in the region where the second connection line CL2 and the repair line RLm overlap is equal to the thickness of the region where the second connection line CL2 and the repair line RLm do not overlap. It may be formed smaller than the thickness.

In this case, the second insulating layer IL2 may have different thicknesses of the insulating layer using a half-tone mask.

4 and 5 , a junction CN protruding in the first direction is formed on the repair line RLm. The junction CN is a region of the repair line RLm that is connected to the first connection line CL1 during a repair operation. The junction CN may have a rectangular shape. However, the shape of the junction CN is not limited thereto, and may be formed in a polygonal shape such as a semicircle shape, a circle shape, a triangle shape, or a pentagon shape.

According to an exemplary embodiment, a portion of the junction portion CN may overlap a portion of the first connection line CL1 . As will be described later in FIG. 6 , only a portion of the width of the first connection line CL1 in the second direction overlaps a portion of the junction portion CN. In more detail, at least half of the width W1 of the junction part CN may overlap the first connection line CL1 . That is, the overlapping width W2 of the junction part CN and the first connection line CL1 is more than half the width W1 of the junction part CN.

In the repair process, a laser is irradiated from the rear surface of the repair line RLm positioned below the first connection line CL1 to melt the repair line RLm and the first connection line CL1 to bond them together. However, as shown in FIG. 6 , in general, since the width of the first connection line CL1 is smaller than the width of the junction part CN of the repair line RLm, a portion of the first connection line CL1 and the junction part ( When a portion of the CN is not overlapped, the first connection line CL1 is not visible because the repair line RLm is covered. That is, when the entire first connection line CL1 overlaps a part of the repair line RLm, the first connection line CL1 is covered by the repair line RLm.

In FIG. 6 , when a laser is irradiated along the fourth bonding line WL4 , the first connection line CL1 and the repair line RLm may be safely bonded. However, on the rear surface of the repair line RLm, the first connection line CL1 is covered by the repair line RLm, so that bonding along the fourth bonding line WL4 is impossible. Also, in FIG. 6 , when the laser is irradiated along the third bonding line WL3 , there is a risk that the first connection line CL1 is cut by the laser.

Therefore, according to an embodiment of the present invention, as shown in FIG. 4 , when a part of the junction CN of the repair line RLm overlaps a part of the first connection line CL1, the first junction line ( The laser can be irradiated along WL1). In addition, the laser may be irradiated along the second bonding line WL2 . However, when bonding is performed along the second bonding line WL2 , the width of the bonding region is smaller than when bonding is performed along the first bonding line WL1 , so that resistance may increase. Accordingly, according to an embodiment of the present invention, when bonding along the first bonding line WL1 , an increase in resistance may be minimized to bond the first connection line CL1 and the repair line RLm.

Meanwhile, as the length of the protrusion of the junction part CN increases, the length of the first junction line WL1 increases. Accordingly, the resistance of the junction region can be reduced. That is, as the length of the junction portion CN in the first direction increases, the resistance of the junction region may be reduced.

Hereinafter, a process of repairing a defect in the light emitting pixel EP will be described with reference to FIGS. 7 and 8 .

7 is a diagram illustrating a repair method of an organic light emitting diode display according to an exemplary embodiment, and FIG. 8 is a diagram illustrating a light emitting pixel and a dummy pixel of the repaired organic light emitting display apparatus.

7 and 8 , first, when the first pixel circuit PC1 of one of the plurality of light emitting pixels EP is defective, the first pixel circuit PC1 and the organic light emitting device ( The cut area CA between the OLEDs is cut. Such cutting can be performed using a laser beam. For example, a conductive pattern positioned between the drain electrode DE of the thin film transistor TFT and the first electrode E1 of the organic light emitting diode OLED is cut using a laser beam to form the first pixel circuit PC1 and the organic material. Separate between the light emitting devices (OLED).

That is, the organic light emitting diode OLED is disconnected from the first pixel circuit PC1 , and such disconnection may be performed by a laser.

Next, as shown in FIGS. 7B and 8 , the repair line RLm is directly connected to the first connection line CL1 of the light emitting pixel EP and the junction CN of the repair line RLm. A repair line that connects the organic light emitting diode OLED of the light emitting pixel EP and the second connection line CL2 of the dummy pixel DP directly to the repair line RLm to connect the organic light emitting diode OLED The second pixel circuit PC2 of the dummy pixel DP is connected to RLm.

Accordingly, the organic light emitting diode OLED of one light emitting pixel EP among the plurality of light emitting pixels EP is connected to the second pixel of the dummy pixel DP through the repair line RLm connected to the first connection line CL1 . It is connected to the circuit PC2. In addition, the organic light emitting diode OLED connected to the second pixel circuit PC2 of the dummy pixel DP is disconnected from the first pixel circuit PC1 of the light emitting pixel EP.

As described above, the first pixel circuit PC1 and the organic light emitting diode OLED of the defective light emitting pixel EP are disconnected, and the organic light emitting diode (OLED) of the light emitting pixel EP is disconnected using the repair line RLm. OLED) is connected to the second pixel circuit PC2 of the dummy pixel DP, and the organic light emitting device OLED of the light emitting pixel EP emits light using the second pixel circuit PC2 of the dummy pixel DP. can be performed.

Meanwhile, the repair may be performed before the organic light emitting layer EL is formed or after the organic light emitting layer EL is formed.

In the organic light emitting display device according to an embodiment of the present invention, the first connection line CL1 is performed by laser during a repair process by disposing the junction CN of the repair line RLm and the first connection line CL1 . ) can be prevented from being cut, and an increase in resistance in the joined region can be prevented.

Although the preferred embodiment of the present invention has been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims are also present is within the scope of the

OLED organic light emitting device CL1 first connection line
RLm repair line CN junction
CA cleavage area EP emission pixel
DP dummy pixel PC1 first pixel circuit
PC2 second pixel circuit

Claims (13)

a first connection line extending in a first direction and connected to an organic light emitting device emitting light;
a repair line extending in a second direction crossing the first direction; and
an insulating layer positioned between the first connection line and the repair line to insulate the first connection line and the repair line from each other;
In the repair line,
and a junction portion protruding in the first direction and partially overlapping a portion of the first connection line is formed. In claim 1,
and the junction portion has a rectangular shape. In claim 1,
and at least half of a width of the junction portion in the second direction overlaps the first connection line. In claim 1,
and the junction part and the repair line are integrally formed. In claim 1,
and the first connection line is positioned below the repair line. In claim 1,
and the first connection line is positioned on the repair line. In claim 1,
a plurality of light emitting pixels including the organic light emitting element, the first connection line, and a first pixel circuit connected to the organic light emitting element;
and at least one dummy pixel spaced apart from the light emitting pixel and including a second pixel circuit. In claim 7,
The dummy pixel further includes a second connection line connected to the second pixel circuit and insulated from the repair line. In claim 7,
The repair line is positioned on the same layer as the gate electrode of the thin film transistor included in the first and second pixel circuits, respectively;
The first connection line is positioned on the same layer as the source and drain electrodes of the thin film transistor. In claim 7,
The repair line is positioned on the same layer as the source and drain electrodes of the thin film transistors included in the first and second pixel circuits, respectively;
and the first connection line is positioned on the same layer as a gate electrode of the thin film transistor. In claim 7,
The light emitting pixel is located in a display area for displaying an image,
and the dummy pixel is located in a non-display area located around the display area. In claim 1,
The insulating layer is
A thickness of a region where the first connection line and the repair line overlap each other is smaller than a thickness of a peripheral region of the overlapping region. In claim 1,
and the insulating layer includes at least one layer.

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