KR102259735B1 - Manufacturing method of the plasma nozzle - Google Patents

Abstract

According to one aspect of the present invention, there is provided a method of manufacturing a plasma nozzle having an ultrafine fluid tube.
The method of manufacturing the plasma nozzle includes: forming a plurality of fluid pipe parts on at least one surface of a first substrate using a photolithography process; forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and forming a plurality of unit nozzles by cutting the nozzle element module.

Description

Manufacturing method of the plasma nozzle

The present invention relates to a method of manufacturing a plasma nozzle, and more particularly, to a method of manufacturing a plasma nozzle having an ultrafine fluid tube.

A plasma nozzle is a component that forms plasma as applied to additive manufacturing and surface processing/modification/cleaning equipment using plasma. Plasma nozzles are configured in such a way that a cathode or earth is placed on a metal tip with an anode and a cathode facing the anode. At this time, when an electric field is applied to both electrodes, the injected gas or gas in the air is ionized to form plasma.

Conventionally, when manufacturing a plasma nozzle, as shown in FIG. 3, a fluid pipe was formed in the center of a circular metal nozzle. In order to form a fine plasma, the diameter of the fluid pipe at the center of the nozzle should be narrowed. Recently, as a method of manufacturing the fluid pipe, a method of forming a fluid pipe using a laser or cutting processing by mechanical milling in the center of a metal body is used.

However, this prior art has a problem in that microfabrication is difficult because the depth of the fluid pipe must be manufactured much deeper than the diameter. In general, when a fluid pipe having a depth of 10 mm or more is formed, a diameter of about 100 μm becomes the smallest size that can be processed. Therefore, it is practically difficult to form an ultrafine fluid tube of 50 μm or less in the prior art.

Accordingly, an object of the present invention is to solve various problems including the above problems, and an object of the present invention is to provide a method of manufacturing a plasma nozzle having an ultra-fine flow path that cannot be formed by a conventional processing method. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to one aspect of the present invention for solving the above problems, there is provided a method of manufacturing a plasma nozzle.

The method of manufacturing the plasma nozzle includes: forming a plurality of fluid pipe units on at least one surface of a first substrate using a photolithography process; forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and forming a plurality of unit nozzles by cutting the nozzle element module.

In the method of manufacturing the plasma nozzle, a plurality of fluid pipe parts may be formed on one surface of the second substrate to be symmetrical with the plurality of fluid pipe parts using a photolithography process.

In the manufacturing method of the plasma nozzle, before forming the plurality of fluid pipe parts, the method comprising: forming a plurality of electrode pattern parts on one surface of the first substrate; and depositing a metal in the electrode pattern portion to form a metal pattern including a positive electrode pattern and a negative electrode pattern as a pair, wherein the positive electrode pattern and the negative electrode pattern are symmetrical about the fluid pipe portion can

In the manufacturing method of the plasma nozzle, before forming the nozzle element module, forming a plurality of electrode pattern portions on one surface of the second substrate; and depositing a metal in the electrode pattern portion to form a metal pattern including a positive electrode pattern and a negative electrode pattern as a pair, wherein the positive electrode pattern and the negative electrode pattern are symmetrical about the fluid pipe portion can

In the manufacturing method of the plasma nozzle, before forming the plurality of fluid pipe parts, the method comprising: forming a plurality of electrode pattern parts on one surface of the first substrate; and depositing a metal in the electrode pattern portion to form a metal pattern having a positive electrode pattern, wherein the positive electrode pattern may be disposed in parallel with the fluid pipe portion.

In the manufacturing method of the plasma nozzle, before forming the nozzle element module, forming a plurality of electrode pattern portions on one surface of the second substrate; and depositing a metal in the electrode pattern portion to form a metal pattern having a positive electrode pattern, wherein the positive electrode pattern may be disposed in parallel with the fluid pipe portion.

In the method of manufacturing the plasma nozzle, the forming of the plurality of fluid pipe parts includes coating a photoresist (PR) on at least one surface of the first substrate, and performing an exposure process and an etching process using a mask. By doing so, forming the plurality of fluid pipe parts on one surface of the first substrate; may include.

In the method of manufacturing the plasma nozzle, the forming of the metal pattern may include: depositing a metal on a surface on which the plurality of electrode patterns are formed; and forming the metal pattern on one surface of the first substrate or the second substrate by performing an etching process, except for the metal filled in the plurality of electrode patterns, and removing all remaining metals. have.

In the method of manufacturing the plasma nozzle, the first substrate and the second substrate may be bonded by a direct bonding method using an optical adhesive.

In the method of manufacturing the plasma nozzle, the first substrate and the second substrate may be directly bonded by the metal pattern using a heating and compression process.

In the method of manufacturing the plasma nozzle, the substrate may include any one of a ceramic material, a polymer material, and a metal material.

A plasma nozzle having an ultra-fine fluid tube of 50 μm or less can be provided by using the method of manufacturing the plasma nozzle of the present invention made as described above. The plasma nozzle is applicable to a device applied to a precise process such as a semiconductor process and 3D printing, and a portable plasma generator for medical use and sterilization/disinfection. Of course, the scope of the present invention is not limited by these effects.

1 is a diagram schematically illustrating a process sequence in order to explain a method of manufacturing a plasma nozzle according to an embodiment of the present invention.
2 is a diagram schematically illustrating a structure of a plasma nozzle manufactured using a method for manufacturing a plasma nozzle according to an embodiment of the present invention.
3 is a diagram schematically illustrating a method of manufacturing a plasma nozzle and a structure of a plasma nozzle using the same according to a comparative example of the present invention.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to more completely describe the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is as follows. It is not limited to the examples. Rather, these embodiments are provided to make the present disclosure more faithful and complete, and to completely convey the spirit of the present invention to those skilled in the art.

Hereinafter, a plasma nozzle having an ultrafine fluid tube according to an embodiment of the present invention uses a semiconductor process capable of precise process control and directization.

1 is a diagram schematically illustrating a process sequence in order to explain a method of manufacturing a plasma nozzle according to an embodiment of the present invention.

Referring to FIGS. 1A to 1C , a photoresist (PR; 12) solution is applied on the first substrate 10 and then a plurality of electrode pattern portions 14 are applied using a photolithography process. ) can be formed. The first substrate 10 may be made of, for example, silicon (Si), and in some cases, may include any one of a ceramic material, a polymer material, and a metal material. The photolithography is one of semiconductor processes, in which a photoresist 12 serving as a photosensitizer is applied on the first substrate 10 . After aligning the mask (not shown), light is irradiated (exposed). After development, etching (etching) is performed to form the electrode pattern portion 14 in the form of a trench on the first substrate 10 . Since the photolithography process is a known technique, a detailed description thereof will be omitted.

Referring to FIGS. 1D to 1E , a metal layer 16 is formed by depositing a metal on the upper surface of the first substrate 10 including the electrode pattern part 14 . The metal fills the empty space in the electrode pattern part 14 to function as an electrode. Thereafter, by using chemical mechanical polishing (CMP), only the metal buried in the electrode pattern portion 14 is left, and the metal layer 16 present on the surface of the first substrate 10 is removed to form the metal pattern 18 . do.

As an example, when a ceramic material such as silicon or a polymer material is used as the first substrate 10 , the metal pattern 18 may include a positive electrode pattern and a negative electrode pattern as a pair. The metal patterns 18 including the positive electrode pattern and the negative electrode pattern as a pair may be arranged at regular intervals.

Referring to FIGS. 1F and 1G , a plurality of fluid pipe units 19 may be formed on the first substrate 10 on which the metal pattern 18 is formed by using a photolithography process. . The content of the photolithography is the same as described above with reference to FIGS. 1 (b) and (c), and thus will be omitted.

Referring to FIG. 2A , the plasma nozzle 100 has a metal pattern 18 that functions as a positive electrode and a negative electrode, and a microfluidic tube part 19 . In some cases, the number of metal patterns 18 may be different. In this figure, the metal pattern 18 and the fluid pipe part 19 are shown in the shape of a rectangular parallelepiped, but through control of the photolithography process conditions, various shapes such as a circle or an oval can be manufactured.

The metal pattern 18 is composed of a pair of a positive electrode pattern and a negative electrode pattern, and one fluid pipe unit 19 is formed between the pair of positive electrode patterns and negative electrode patterns. The positive electrode pattern and the negative electrode pattern are arranged side by side with the fluid pipe part 19, and are arranged in a left-right symmetrical form with the fluid pipe part 19 as the center.

Referring to (h) of FIG. 1 , when the formation of the plurality of metal patterns 18 and the plurality of fluid pipe portions 19 on the first substrate 10 is completed, the second substrate ( 20) may be disposed and joined to form the nozzle element module 110 .

The second substrate 20 forms a plurality of metal patterns 18 and a plurality of fluid pipe units 19 on the second substrate 20 through the same process as those shown in FIGS. 1 (b) to 1 (g). can do. The method of forming the plurality of metal patterns 18 and the plurality of fluid pipe portions 19 is the same as described above, and thus is omitted.

Referring to FIG. 2A , after arranging the plurality of metal patterns 18 and the plurality of fluid pipe portions 19 respectively formed on the first substrate 10 and the second substrate 20 to face each other, can be joined.

As another example, referring to FIG. 2B , the second substrate 20 in a flat state is formed without forming the plurality of metal patterns 18 and the fluid pipe part 19 on the second substrate 20 . It can also be bonded on one substrate 10 . In this case, the sizes and structures of the plurality of metal patterns 18 and the fluid pipe unit 19 to be formed on the first substrate 10 may be controlled differently depending on an applied device.

As another example, referring to FIG. 2C , only the anode pattern may be formed in the metal pattern 18 . In this case, since the metal pattern 18 serves as an anode, a substrate (not shown) requiring plasma treatment may act as a cathode or serve as a ground. If the metal pattern 18 is composed of only the positive electrode pattern, the fluid pipe unit 19 is arranged in parallel with the positive electrode pattern. In this case, the metal pattern 18 may be disposed irrespective of the left side or the right side with respect to the fluid pipe unit 19 .

As another example, referring to FIG. 2D , when a metal material is used as the first substrate 10 , only the fluid pipe part 19 may be formed without the metal pattern 18 . Since the first substrate 10 itself is a conductor, the nozzle serves as a positive electrode, and the metal pattern 18 is unnecessary. In this case, the step of forming the metal pattern 18 (FIG. 1 (b) to (e)) is omitted.

The first substrate 10 and the second substrate 20 may be directly bonded by the metal pattern 18 using a heating and compression process. As another example, when there is no metal pattern 18 on the first substrate 10 and the second substrate 20 , the first substrate 10 and the second substrate 20 are directly bonded using an optical adhesive. (20) may be bonded to each other. Here, in the case of the optical adhesive, as a known technique, a detailed description thereof will be omitted.

Referring to (i) of FIG. 1 , the inside of the nozzle element module 110 includes a plurality of metal patterns 18 and a fluid pipe part 19 . The fluid pipe unit 19 is an empty space formed by bonding the first substrate 10 and the second substrate 20 to each other, and may be understood as a fluid pipe through which a gas generating plasma flows in and out. Thereafter, the nozzle element module 110 may be cut along the cutting line 35 to form a plurality of unit nozzles 100 .

Referring to FIG. 3 , the conventional plasma nozzle 50 has a fluid pipe 52 at the center of a circular metal tip. In this case, the plasma nozzle 50 itself acts only as an anode, and the substrate acts as a cathode. For example, when the gas G for plasma generation is supplied through the fluid pipe part 52 of the plasma nozzle 50, the plasma P is generated between the plasma nozzle 50 of the anode and the substrate of the cathode. When the plasma nozzle 50 moves, it is difficult to control the distance between the two electrodes, so it is difficult to obtain a plasma of uniform quality. It has the advantage of being able to form

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those of ordinary skill in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: first substrate
12, 13: photo register
14: electrode pattern part
16: metal layer
18: metal pattern
19, 52: fluid pipe part
20: second substrate
35: cut line
50: plasma nozzle (conventional)
100: unit nozzle (plasma nozzle)
110: nozzle element module

Claims (11)

A method of manufacturing a plasma nozzle having an ultra-fine fluid tube, comprising:
forming a plurality of fluid pipe units on at least one surface of the first substrate using a photolithography process;
forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and
forming a plurality of unit nozzles by cutting the nozzle element module;
Comprising the step of forming a plurality of fluid pipe parts using a photolithography process on one surface of the second substrate so as to be symmetrical with the plurality of fluid pipe parts
A method of manufacturing a plasma nozzle. delete A method of manufacturing a plasma nozzle having an ultra-fine fluid tube, the method comprising:
forming a plurality of fluid pipe units on at least one surface of the first substrate using a photolithography process;
forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and
forming a plurality of unit nozzles by cutting the nozzle element module;
Before the step of forming the plurality of fluid pipe parts,
forming a plurality of electrode pattern portions on one surface of the first substrate; and
depositing a metal in the electrode pattern portion to form a metal pattern including a positive electrode pattern and a negative electrode pattern as a pair;
The positive electrode pattern and the negative electrode pattern are symmetrical about the fluid pipe part,
A method of manufacturing a plasma nozzle. The method of claim 3,
Before forming the nozzle element module,
forming a plurality of electrode pattern portions on one surface of the second substrate; and
depositing a metal in the electrode pattern portion to form a metal pattern including a positive electrode pattern and a negative electrode pattern as a pair;
The positive electrode pattern and the negative electrode pattern are symmetrical about the fluid pipe part,
A method of manufacturing a plasma nozzle. A method of manufacturing a plasma nozzle having an ultra-fine fluid tube, comprising:
forming a plurality of fluid pipe units on at least one surface of the first substrate using a photolithography process;
forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and
forming a plurality of unit nozzles by cutting the nozzle element module;
Before the step of forming the plurality of fluid pipe parts,
forming a plurality of electrode pattern portions on one surface of the first substrate; and
Including; depositing a metal in the electrode pattern portion to form a metal pattern having a positive electrode pattern;
The positive electrode pattern is arranged in parallel with the fluid pipe part,
A method of manufacturing a plasma nozzle. The method of claim 5,
Before forming the nozzle element module,
forming a plurality of electrode pattern portions on one surface of the second substrate; and
Including; depositing a metal in the electrode pattern portion to form a metal pattern having a positive electrode pattern;
The positive electrode pattern is arranged in parallel with the fluid pipe part,
A method of manufacturing a plasma nozzle. A method of manufacturing a plasma nozzle having an ultra-fine fluid tube, comprising:
forming a plurality of fluid pipe units on at least one surface of the first substrate using a photolithography process;
forming a nozzle element module by arranging and bonding a second substrate to face one surface of the first substrate on which the plurality of fluid pipe portions are formed; and
forming a plurality of unit nozzles by cutting the nozzle element module;
The step of forming the plurality of fluid pipe parts,
Forming the plurality of fluid pipe parts on one surface of the first substrate by applying a photoresist (PR) on at least one surface of the first substrate, and performing an exposure process and an etching process using a mask; containing,
A method of manufacturing a plasma nozzle. 7. The method according to any one of claims 3 to 6,
The step of forming the metal pattern,
depositing a metal on the surface on which the plurality of electrode patterns are formed; and
By performing an etching process, except for the metal filled in the plurality of electrode patterns, and removing all remaining metals to form the metal pattern on one surface of the first substrate or the second substrate; including,
A method of manufacturing a plasma nozzle. The method of claim 1,
The first substrate and the second substrate are bonded in a direct bonding method using an optical adhesive,
A method of manufacturing a plasma nozzle. 7. The method according to any one of claims 3 to 6,
The first substrate and the second substrate are directly bonded by the metal pattern using a heating and pressing process,
A method of manufacturing a plasma nozzle. The method of claim 1,
The substrate includes any one of a ceramic, polymer, and metal material,
A method of manufacturing a plasma nozzle.

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