KR102257815B1 - Solar cell module - Google Patents

Abstract

The present invention relates to a solar cell module.
A solar cell module according to an example of the present invention includes a solar cell having a semiconductor substrate and a first electrode and a second electrode formed to be spaced apart from each other on the rear surface of the semiconductor substrate; A first conductive wire disposed on the rear surface of the solar cell and connected to the first electrode and a second conductive wire connected to the second electrode; A conductive adhesive electrically connecting the first electrode and the first conductive wiring and the second electrode and the second conductive wiring to each other; And an insulating layer insulating each other between the first electrode and the second electrode, between the first conductive line and the second conductive line, between the first conductive line and the second electrode, or between the second conductive line and the first electrode. , The curing temperature of the insulating layer is different from the curing temperature of the conductive adhesive.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

A typical solar cell includes a substrate made of semiconductors of different conductive types, such as a p-type and an n-type, and an emitter unit, and an electrode connected to the substrate and the emitter unit, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter part.

As described above, solar cells using a semiconductor substrate can be classified into various types, such as a conventional type and a rear contact type, depending on the structure.

Here, in the conventional type, the emitter unit is located on the front surface of the substrate, the electrode connected to the emitter unit is located on the front surface of the substrate, and the electrode connected to the substrate is located on the rear surface of the substrate, and in the rear contact type, the emitter unit is located on the rear surface of the substrate. And all electrodes are located on the back side of the substrate.

Here, in the solar cell of the rear contact type, since all the electrodes are formed on the rear surface of the substrate, the electrodes formed on the rear surface of the substrate are connected in series to the electrodes of the adjacent solar cells through an interconnector or a separate conductive metal to form a solar cell module. I can.

An object of the present invention is to provide a solar cell module.

A solar cell module according to an example of the present invention includes a solar cell having a semiconductor substrate and a first electrode and a second electrode formed to be spaced apart from each other on the rear surface of the semiconductor substrate; A first conductive wire disposed on the rear surface of the solar cell and connected to the first electrode and a second conductive wire connected to the second electrode; A conductive adhesive electrically connecting the first electrode and the first conductive wiring and the second electrode and the second conductive wiring to each other; And an insulating layer insulating each other between the first electrode and the second electrode, between the first conductive line and the second conductive line, between the first conductive line and the second electrode, or between the second conductive line and the first electrode. , The curing temperature of the insulating layer is different from the curing temperature of the conductive adhesive.

Here, the curing temperature of the insulating layer may be lower than the curing temperature of the conductive adhesive. For example, the curing temperature of the insulating layer may be between 80°C and 120°C, and the curing temperature of the conductive adhesive may be between 130°C and 160°C. .

Here, the insulating layer may be a curable resin or a reactive resin, and for example, may include at least one of epoxy, polyimide, silicone, or polyethylene made of a curable material.

In addition, the conductive adhesive may include a metal material and an insulating resin surrounding the metal material.

Here, the metal material of the conductive adhesive may include first metal particles including tin (Sn) or second metal particles other than tin (Sn).

Here, the curing temperature of the first metal particles including tin (Sn) may be between 130°C and 160°C, and for example, may include at least one of SnIn and SnBi.

In addition, the second metal particles other than tin (Sn) may include at least one of Cu, Ni, Ag, or Au.

In addition, the curing temperature of the insulating resin may be between 130°C and 160°C. For example, the insulating resin may include an epoxy-based or silicon-based material.

In addition, the first and second conductive wires may be interconnectors for serially connecting solar cells adjacent to each other, or may be auxiliary electrodes connected to the first and second electrodes.

The solar cell module according to the present invention may further simplify the manufacturing process of the solar cell module and further improve the stability by differentiating the curing temperature of the conductive adhesive and the insulating layer.

1 to 9 are diagrams for explaining an example of a solar cell module according to a first embodiment of the present invention.
10 to 11 are diagrams for explaining an example of a solar cell module according to a second embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are attached to similar parts throughout the specification.

In the drawings, the thicknesses are enlarged in order to clearly express various layers and regions. When a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when one part is "directly above" another part, it means that there is no other part in the middle. In addition, when a part is "overall" formed on another part, it means that it is formed not only on the entire surface (or the entire surface) of the other part, but also not formed on a part of the edge.

In addition, hereinafter, the front surface may be a surface of the semiconductor substrate to which direct sunlight is incident, and the rear surface may be a surface opposite to the semiconductor substrate to which direct sunlight is not incident or reflected light other than direct sunlight may be incident.

1 to 9 are diagrams for explaining an example of a solar cell module according to a first embodiment of the present invention.

Specifically, FIG. 1 is a view from above of a state in which a plurality of solar cells included in a solar cell module are connected to an interconnector (IC), and FIG. 2 is a view when a solar cell connected in series as shown in FIG. 1 is modularized. It shows a cross section along the first direction (x) of the illustrated area A.

1 and 2, an example of a solar cell module according to the present invention is an insulating member 200 in which first and second solar cells C1 and C2 and first and second conductive wires EC1 and EC2 are formed. ) And interconnectors (ICs).

Here, in each of the first and second solar cells C1 and C2, the semiconductor substrate 110 and the insulating member 200 may be individually connected to each other to form a single integrated individual device. However, the present invention is not necessarily limited thereto, and only the insulating member 200 may be omitted in the integrated individual device.

Here, a p-n junction may be formed in the semiconductor substrate 110 to convert incident light into electricity, and a plurality of first electrodes C141 and a plurality of second electrodes C142 may be formed on a rear surface.

In addition, the insulating member 200 may include a first conductive line EC1 and a second conductive line EC2. Here, as shown in FIG. 2, each of the first conductive wire EC1 and the second conductive wire EC2 is connected to the first electrode C141 and the second electrode C142 described as shown in FIG. 2. Can be.

That is, the first conductive wiring EC1 may be connected to the first electrode C141, and the second conductive wiring EC2 may be connected to the second electrode C142.

Here, between the first electrode C141 and the first conductive line EC1 and between the second electrode C142 and the second conductive line EC2 may be electrically connected to each other by a conductive adhesive CA.

In addition, although not shown in FIGS. 1 and 2, an insulating layer IL is provided between the first electrode C141 and the second electrode C142 and between the first conductive wiring EC1 and the second conductive wiring EC2. Can be insulated from each other by This will be described in detail below in FIG. 3.

In addition, the interconnector IC includes a conductive metal material and functions to electrically connect the first solar cell C1 and the second solar cell C2 to each other, and accordingly, as shown in FIG. 1, The first solar cell C1 and the second solar cell C2 may be connected by an interconnector IC to be arranged in a first direction x.

Specifically, as an example, as shown in FIG. 2, each of both ends of the interconnector IC is a first conductive wire EC1 of the first solar cell C1 and a second conductive wire of the second solar cell C2. It can be connected to (EC2). However, differently, both ends of the interconnector IC may be connected to the second conductive wiring EC2 of the first solar cell C1 and the first conductive wiring EC1 of the second solar cell C2. Do.

In this case, between the interconnector IC and the first conductive line EC1 and between the interconnector IC and the second conductive line EC2 may also be connected to each other by a conductive adhesive CA.

In this way, the first and second solar cells C1 and C2 connected in series with each other by the interconnector IC may be modularized and formed as shown in FIG. 2.

That is, a plurality of solar cells connected in series to each other by a plurality of first and second conductive wirings EC1 and EC2 are positioned on the first encapsulant EVA1 applied on the transparent substrate FG, and then the plurality of solar cells ( It can be modularized as shown in FIG. 2 by a lamination process in which the second encapsulant (EVA2) and the rear sheet (BS) are disposed on C1 and C2) and thermally compressed. In this case, the heat treatment temperature in the lamination process may be between 160°C and 170°C.

Here, the transparent substrate (FG) may be a light-transmitting glass or plastic material, and the first and second encapsulants (EVA1, EVA2) are a material having elasticity and insulation, for example, EVA (ethylene vinyl acetate). Can include. In addition, the rear sheet BS may be formed of an insulating material having a moisture-proof function.

Meanwhile, in such a solar cell module, the curing temperature of the insulating layer IL may be different from the curing temperature of the conductive adhesive CA. This will be described together while describing one integrated individual element in which each of the first and second solar cells C1 and C2 according to the present invention and the insulating member 200 are connected individually.

3 to 9 are diagrams for explaining an example of an integrated individual device applied to the solar cell module shown in FIG. 1.

3 is an example for explaining an integrated individual device according to an example of the present invention, FIG. 3 (a) is an example of a partial perspective view of the integrated individual device, and FIGS. As an enlarged view, FIG. 3B is a view for explaining another example of the conductive adhesive CA, and FIG. 3C is a view for explaining another example of the conductive adhesive CA.

FIG. 4 is an example of a partial perspective view of the solar cell shown in FIG. 3, and FIG. 5 is a pattern of the first and second electrodes C141 and C142 formed on the rear surface of the solar cell shown in FIG. 4 and the insulating properties shown in FIG. 3. As a diagram for explaining an example of a pattern of the first and second conductive wirings EC1 and EC2 formed on the member 200, FIG. 5A is a first electrode disposed on the rear surface of the semiconductor substrate 110 ( It is a diagram for explaining an example of a pattern of C141 and the second electrode C142, and FIG. 5B is a cross-sectional view taken along lines 5(b)-5(b) in FIG. 5(a), and FIG. (c) is a diagram for explaining an example of a pattern of the first conductive wiring EC1 and the second conductive wiring EC2 disposed on the front surface of the insulating member 200, and FIG. 5(d) is a diagram of FIG. 5(c). ) To 5(d)-5(d).

Referring to FIG. 3A, an example of an integrated individual device according to the present invention is a semiconductor substrate 110, an antireflection film 130, an emitter part 121, and a back surface field (BSF, 172). , Including a solar cell provided with a plurality of first electrodes C141 and a plurality of second electrodes C142, and an insulating member 200 provided with a first conductive wire EC1 and a second conductive wire EC2, , In addition, an insulating layer IL and a conductive adhesive CA for connecting the insulating member 200 to the solar cell may be included.

As shown in FIG. 4, the solar cell according to the present invention includes, for example, a semiconductor substrate 110, an antireflection film 130, an emitter part 121, a back surface field (BSF, 172), and a plurality of A first electrode C141 and a plurality of second electrodes C142 may be included.

Here, the anti-reflection film 130 and the rear electric field part 172 may be omitted, but hereinafter, as shown in FIG. 4, it will be described that the anti-reflection film 130 and the rear electric field part 172 are included as an example.

The semiconductor substrate 110 may be a semiconductor substrate 110 made of silicon of a first conductivity type, for example, an n-type conductivity type. Such a semiconductor substrate 110 is an n-type impurity of a pentavalent element such as phosphorus (P), arsenic (As), antimony (Sb), etc., in a semiconductor wafer formed of a crystalline silicon material. It may be formed by doping with impurities of a conductivity type.

A plurality of emitter units 121 are located in the rear surface of the semiconductor substrate 110 facing the front surface, spaced apart from each other, and extend in a first direction x parallel to each other. The plurality of emitter units 121 are of a second conductivity type opposite to that of the semiconductor substrate 110, for example, an impurity of a trivalent element such as boron (B), gallium (Ga), and indium (In). Impurities of a p-type conductivity type may be included.

Accordingly, a p-n junction may be formed by the semiconductor substrate 110 and the emitter part 121.

However, unlike the foregoing, it is also possible for the semiconductor substrate 110 to contain impurities of the p-type conductivity type and the emitter unit 121 to include impurities of the n-type conductivity type.

A plurality of rear electric field units 172 are located inside the rear surface of the semiconductor substrate 110 to be spaced apart from each other, and extend in a first direction x parallel to the plurality of emitter units 121. Accordingly, as shown in FIG. 4, a plurality of emitter units 121 and a plurality of rear electric field units 172 may be alternately positioned on the rear surface of the semiconductor substrate 110.

The plurality of rear electric field portions 172 may be n++ impurity portions in which impurities of the same first conductivity type as the semiconductor substrate 110 are contained in a higher concentration than the semiconductor substrate 110.

For reference, the illustration of the emitter unit 121 and the rear electric field unit 172 is omitted in FIGS. 5A and 5B for convenience of understanding the drawings.

As shown in FIG. 4, the first electrode C141 may be physically and electrically connected to the emitter unit 121, respectively, and may be formed on the rear surface of the semiconductor substrate 110 along the emitter unit 121.

In addition, the second electrode C142 is formed on the rear surface of the semiconductor substrate 110 along the plurality of rear electric field units 172, and is physically and electrically connected to the semiconductor substrate 110 through the rear electric field unit 172, respectively. I can.

As shown in FIGS. 4 and 5A, there may be a plurality of first electrodes C141, and the plurality of first electrodes C141 are spaced apart from each other to be disposed on the rear surface of the semiconductor substrate 110. It may be elongated in the first direction (x).

In addition, as shown in FIGS. 4 and 5(a), there may be a plurality of second electrodes C142, and the plurality of second electrodes C142 are spaced apart from each other and are disposed on the rear surface of the semiconductor substrate 110. It may be elongated in the first direction (x).

Here, the first and second electrodes C141 and C142 may be separated from each other, electrically isolated, and may be alternately disposed.

In addition, the ratio of the width WC to the thickness TC of each of the first and second electrodes C141 and C142 may be between 1: 200 and 1500.

That is, as an example, referring to (b) of FIG. 5, the thickness TC of each of the plurality of first and second electrodes C141 and C142 may be formed between 0.2 μm and 1 μm, and the plurality of first and second electrodes C141 and C142 may be formed between 0.2 μm and 1 μm. Each of the 2 electrodes C141 and C142 may have a width WC of 200 μm to 300 μm.

In this way, by setting the ratio of the width WC to the thickness TC of each of the first and second electrodes C141 and C142 to be between 1: 200 and 1500, manufacturing cost of a solar cell can be minimized.

In this case, the cross-sectional area of each of the first and second electrodes C141 and C142 is excessively reduced, so that resistance of each of the first and second electrodes C141 and C142 may be a problem. It is connected to each of (C141, C142), and can be eliminated by the first and second conductive wirings EC1 and EC2 serving as auxiliary electrodes.

That is, by forming the thickness TC of each of the first and second electrodes C141 and C142 very thin, it is possible to reduce the manufacturing time and manufacturing cost of the solar cell, and the relatively increased first and second electrodes C141 and C142 ) Resistance can be eliminated by connecting the first and second conductive wirings EC1 and EC2 through a conductive adhesive CA.

Such a plurality of first and second electrodes C141 and C142 may be manufactured by a sputtering method, for example.

The solar cell applied to the solar cell module according to the present invention is not necessarily limited to FIG. 4, except that the first and second electrodes C141 and C142 provided in the solar cell are formed only on the rear surface of the semiconductor substrate 110. Other components can be changed anytime.

For example, in the solar cell module of the present invention, a part of the first electrode C141 and the emitter part 121 are located on the front surface of the semiconductor substrate 110, and a part of the first electrode C141 is located on the semiconductor substrate 110. An MWT type solar cell connected to the rest of the first electrode C141 formed on the rear surface of the semiconductor substrate 110 through the formed hole may also be applied.

Holes collected through the first electrode C141 and electrons collected through the second electrode C142 in the solar cell according to the present invention manufactured with such a structure will be used as power of an external device through an external circuit device. I can.

The first conductive wiring EC1 includes a first connection part EC1-F and a first pad part EC1-B, as shown in FIG. 5C, and the first connection part EC1-F Is formed to be elongated in the first direction (x) and connected to the plurality of first electrodes (C141) through a conductive adhesive (CA), and the first pad portion EC1-B is formed to be elongated in the second direction (y). , One end may be connected to the end of the first connection part EC1-F, and the other end may be connected to the interconnector IC.

The first connection part EC1-F may be formed in plural and each may be connected to a plurality of first electrodes C141, or alternatively, it is formed as one tubular electrode, and a plurality of first connecting portions EC1-F are formed in one tubular electrode. The electrode C141 may be connected.

In addition, when a plurality of first connection parts EC1-F are formed, as shown in FIG. 5, the first connection part EC1-F may be formed in the same direction as the plurality of first electrodes C141, but differently, It is also possible to be formed in an intersecting direction. In this case, the first connection parts EC1-F may be electrically connected to each other at a portion overlapping the first electrode C141.

The second conductive wiring EC2 includes a second connection part EC2-F and a second pad part EC2-B, as shown in FIG. 5C, and the second connection part EC2-F Is spaced apart from the first connection part EC1-F and is formed to be elongated in the first direction x, is connected to the plurality of second electrodes C142 through a conductive adhesive CA, and is connected to the second pad part EC2-B. ) Is formed to be elongated in the second direction y, one end is connected to the end of the second connection part EC2-F, and the other end may be connected to the interconnector IC.

As shown, the second connection part EC2-F may also be formed in plural and each may be connected to a plurality of second electrodes C142, or as shown in FIG. A plurality of second electrodes C142 may be connected to the barrel electrode.

Here, when a plurality of second connection parts EC2-F are formed, as shown in FIG. 5, the second connection part EC2-F may be formed in the same direction as the plurality of second electrodes C142, but differently, It is also possible to be formed in an intersecting direction. In this case, the second connection part EC2-F may be electrically connected to each other at a portion overlapping the second electrode C142.

Here, the first connection part EC1-F and the second pad part EC2-B may be spaced apart from each other, and the second connection part EC2-F and the first pad part EC1-B may also be spaced apart from each other, On the front surface of the insulating member 200, a first pad part EC1-B may be formed at one end of both ends in the first direction x, and a second pad part EC2-B may be formed at the other end. .

In this way, the first and second conductive wires EC1 and EC2 are connected to the first and second electrodes C141 and C142 to further lower the resistance of the first and second electrodes C141 and C142 to serve as auxiliary electrodes. I can.

The material of the first conductive line EC1 and the second conductive line EC2 may be formed of at least one of Cu, Au, Ag, and Al.

In this way, on the rear surface of the solar cell as shown in FIGS. 4 and 5 (a) and (b), the insulating member 200 as shown in FIGS. 5 (c) and (d) is a conductive adhesive ( CA) and the insulating layer (IL) may be individually connected to each other to form a single individual device. That is, one insulating member 200 may be attached to one semiconductor substrate 110 to be formed as one integrated individual device.

When the first conductive wire EC1 and the second conductive wire EC2 are bonded to the first electrode C141 and the second electrode C142 formed on the rear surface of the semiconductor substrate 110, the insulating member 200 In addition, it can play a role of helping the process more easily.

In this way, when the solar cell and the insulating member 200 are connected individually, as shown in FIG. 3, the conductive adhesive CA is formed between the first electrode C141 and the first conductive wiring EC1 and It is positioned between the second electrode C142 and the second conductive line EC2 and may serve to electrically connect to each other.

In addition, the insulating layer IL is positioned between the first electrode C141 and the second electrode C142 and between the first conductive wiring EC1 and the second conductive wiring EC2, as shown in FIG. 3. It can serve to insulate each other.

Here, the curing temperature of the insulating layer IL may be different from the curing temperature of the conductive adhesive CA.

In this way, by differentiating the curing temperature of the insulating layer IL and the conductive adhesive CA, the temperature range of the process of connecting the first and second conductive wirings EC1 and EC2 to the rear surface of the solar cell can be widened.

For example, the curing temperature of the insulating layer IL may be lower than the curing temperature of the conductive adhesive CA. In this case, in a state where the paste forming the insulating layer IL and the back surface of the semiconductor substrate forming the conductive adhesive CA are first applied, the insulating layer is performed in one heat treatment process in the connection process while preventing the alignment from being disturbed. (IL) and a conductive adhesive (CA) can be formed.

That is, when the curing temperature of the insulating layer IL and the conductive adhesive CA is the same, when the heat treatment process is performed in the connection process, the first and second conductive wirings EC1 and EC2 are not fixed. Alignment of the first and second conductive wires EC1 and EC2 may be disturbed due to thermal expansion and thermal contraction of the first and second conductive wires EC1 and EC2 and the first and second electrodes C141 and C142.

However, when the curing temperature of the insulating layer IL is lower than the curing temperature of the conductive adhesive CA as in the present invention, the first and second conductive wirings EC1 and EC2 and the first and second electrodes C141 and C142 Before this thermal expansion or thermal contraction, since the insulating layer IL is first cured at a relatively low temperature, the insulating member 200 and the first and second conductive wires EC1 and EC2 are adhered to the rear surface of the semiconductor substrate. Can be fixed. Therefore, in order to connect the first and second conductive wirings EC1 and EC2 later, even if the process temperature is increased, it is possible to prevent the alignment of the first and second conductive wirings EC1 and EC2 from being disturbed.

Here, as an example, the curing temperature of the insulating layer IL may be between 80°C and 120°C, and the curing temperature of the conductive adhesive CA may be between 130°C and 160°C.

This sets the curing temperature of the insulating layer (IL) and the curing temperature of the conductive adhesive (CA) to a range lower than the lamination process temperature between 160°C and 170°C. ) And the connection process of curing the conductive adhesive (CA) is performed together. This can further simplify the manufacturing process of the solar cell module.

Here, as the insulating layer IL, a curable resin or a reactive resin may be used. This is because such a curable resin or reactive resin, once cured by heat treatment, does not soften even if heat at the same temperature is applied again.

Therefore, even if heat such as a hot spot is generated while driving the solar cell module, it is possible to prevent the adhesion of the insulating layer IL from being weakened, and to further improve the stability of the solar cell module.

The curable resin or reactive resin of the insulating layer IL may include, for example, at least one of epoxy, polyimide, silicone, or polyethylene.

In addition, the conductive adhesive (CA) may include a metallic material (SR or PA) and an insulating resin (IR) surrounding the metallic material (SR or PA), as shown in (b) and (c) of FIG. 3. have.

Here, the metal material may include first metal particles SR including tin (Sn) or second metal particles PA other than tin (Sn).

As an example, when the conductive adhesive (CA) is formed by including the first metal particles (SR) containing tin (Sn) and the insulating resin (IR), as shown in Figure 3 (b), the first metal particles (SR) ) May be formed in a structure that is lumped together in the insulating resin (IR).

As shown in (b) of FIG. 3, the structure in which the first metal particles SR are aggregated in the insulating resin IR is heat treated in the connection process and the lamination process, while the first metal particles SR are softened and the original particles. This is because they lose their shape and clump together in the insulating resin (IR) by the attractive force.

Here, the curing temperature of the first metal particles SR including tin (Sn) may be between 130°C and 160°C, and for example, may include at least one of SnIn and SnBi. In this case, the connection process and the lamination process can be simultaneously performed in one heat treatment process, thereby simplifying the manufacturing process.

For example, among metal particles containing tin, such as SnCuAg, SnCu, or SnPb, there may be cases where the curing temperature is 160°C or higher, but in this case, the connection process and the lamination process cannot be performed simultaneously in one heat treatment process, so they will be excluded. I can.

However, this is not essential, and when the lamination process is separately performed, metal particles such as SnCuAg, SnCu, or SnPb may also be used.

In addition, when the conductive adhesive (CA) is formed by including at least one of the second metal particles (PA) other than tin (Sn), for example, Cu, Ni, Ag, or Au, Figure 3 (c) As such, it may be distributed in the insulating resin (IR). In this case, the second metal particles PA may contact each other or be spaced apart from each other in the insulating resin IR.

Since the curing temperature of the second metal particles PA is much higher than the lamination process temperature, the original particle shape can be preserved, and thus may be formed as shown in (c) of FIG. 3.

In addition, the curing temperature of the insulating resin IR included in the conductive adhesive CA may be between 130°C and 160°C.

The insulating resin IR may be cured during the heat treatment process of the connection process, and for example, may include an epoxy-based or silicon-based material.

A more detailed description of one integrated individual device in which the solar cell and the insulating member 200 are individually connected by the conductive adhesive CA and the insulating layer IL will be described in more detail below.

6 is a diagram for explaining a state in which the semiconductor substrate 110 and the insulating member 200 shown in FIG. 5 are connected to each other, and FIG. 7 is a cross-sectional view of the line cy1-cy1 in FIG. 6, and FIG. 8 6 shows a cross-section of the cx1-cx1 line in FIG. 6, and FIG. 9 shows a cross-section of the cx2-cx2 line in FIG. 6.

As shown in FIG. 6, one semiconductor substrate 110 may be completely overlapped with one insulating member 200 to form one solar cell individual element.

For example, as shown in FIG. 7, the first electrode C141 formed on the rear surface of the semiconductor substrate 110 and the first connection part EC1-F formed on the front surface of the insulating member 200 overlap each other, It may be electrically connected to each other by a conductive adhesive (CA).

In addition, the second electrode C142 formed on the rear surface of the semiconductor substrate 110 and the second connection part EC2-F formed on the front surface of the insulating member 200 are also overlapped with each other, and are electrically connected to each other by a conductive adhesive CA. Can be connected.

In addition, the insulating layer IL may be filled in a space spaced apart from each other between the first electrode C141 and the second electrode C142, and between the first connection part EC1-F and the second connection part EC2-F. The insulating layer IL may also be filled in the space spaced apart from each other.

In addition, as shown in FIG. 8, the insulating layer IL may also be filled in the spaced apart space between the second connection part EC2-F and the first pad part EC1-B, as shown in FIG. 9. Likewise, the insulating layer IL may be filled in a space spaced apart between the first connection part EC1-F and the second pad part EC2-B.

In addition, as shown in FIGS. 6, 8, and 9, each of the first pad part EC1-B and the second pad part EC2-B is exposed to the exposed area PS1 that does not overlap the semiconductor substrate 110. , PS2).

In this way, in the exposed area PS1 of the first pad part EC1-B and the exposed area PS2 of the second pad part EC2-B provided to secure a space that can be connected to the interconnector IC Interconnector (IC) can be connected.

Each of the first pad portion EC1-B and the second pad portion EC2-B according to the present invention has exposed areas PS1 and PS2, so that the interconnector IC can be more easily connected. , When connecting the interconnector IC, it is possible to minimize thermal expansion stress on the semiconductor substrate 110.

In addition, as described above, the interconnector IC may be connected to the first pad portion EC1-B or the second pad portion EC2-B to connect a plurality of solar cells.

Until now, the case where only the first pad part EC1-B and the second pad part EC2-B are formed to be long in the second direction y has been described as an example. However, differently, the first pad part EC1-B and the second pad part EC2-B are formed as one. A plurality of B) and second pad portions EC2-B may be formed, respectively.

A plurality of first connection parts EC1-F or a plurality of second connection parts EC2-F may be connected to each of the plurality of first pad parts EC1-B or EC2-B.

In addition, the conductive adhesive (CA) according to the present invention may be applied to a case where a plurality of solar cells are connected in series by connecting wires or ribbons. This will be described with reference to FIGS. 10 and 11.

In the description of FIGS. 10 and 11 below, the insulating layer IL and the conductive adhesive CA will be described on the assumption that they are the same as those described above.

10 is a plan view illustrating an example of a solar cell module according to a second embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along the line CX3-CX3 in FIG. 10.

As shown in FIG. 10, the solar cell module according to the second embodiment of the present invention includes a plurality of solar cells (C1 to C3), first and second conductive wires (EC1, EC2), and a conductive adhesive (CA). do.

Here, the plurality of solar cells C1 to C3 may include, for example, first, second, and third solar cells C1 to C3, as shown in FIG. 10, and a plurality of solar cells C1 to C3 ) Each may include a semiconductor substrate 110 on which a pn junction is formed and a plurality of first and second electrodes C141 and C142 formed to be spaced apart from each other on the rear surface of the semiconductor substrate 110.

Since the solar cell applied to the solar cell module according to the second embodiment is the same as the solar cell applied to the solar cell module according to the second embodiment, a description of the specific structure of the solar cell will be omitted and other parts will be mainly described. .

For example, in each of the plurality of first, second, and third solar cells C1 to C3, each of the plurality of solar cells C1 to C3 may be sequentially arranged in the first direction x, and the semiconductor substrate 110 The plurality of first and second electrodes C141 and C142 formed on the rear surface of) may be elongated in a second direction y crossing the first direction x.

Each of the first and second conductive wires (EC1, EC2) is connected to one of the plurality of first and second electrodes (C141, C142) formed on each of the plurality of solar cells (C1 to C3). As a result, the plurality of solar cells C1 to C3 can be connected in series to each other.

Accordingly, in the second embodiment, the first and second conductive wires EC1 and EC2 may serve as interconnectors IC connecting adjacent solar cells in series.

Here, the first and second conductive wires EC1 and EC2 may be connected to each of the plurality of solar cells C1 to C3 in a state of being previously patterned on the insulating member 200 as shown in FIGS. 10 and 11. have.

The first and second conductive wires EC1 and EC2 may be formed to be elongated in the first direction x crossing the plurality of first and second electrodes C141 and C142, as shown in FIG. 10. have.

In this way, alignment can be facilitated by arranging the first and second conductive wires EC1 and EC2 in the first direction x intersecting the plurality of first and second electrodes C141 and C142. , When connecting the first and second conductive wires (EC1, EC2) to any one of the cell electrodes (C141 or C142), the contraction direction of the interconnector (IC) according to the thermal expansion coefficient and the contraction direction of the cell electrode (C141 or C142) By making these cross and staggered, it is possible to minimize the degree of bending of the semiconductor substrate 110 provided in each solar cell.

Here, the first conductive wiring EC1 may connect the first solar cell C1 and the second solar cell C2 in series, and the second conductive wiring EC2 is the second solar cell C2 and the second solar cell C2. 3 Solar cells (C3) can be connected in series with each other.

More specifically, as shown in FIGS. 10 and 11, the first conductive wiring EC1 is formed with a plurality of first electrodes C141 provided in the second solar cell C2 through a conductive adhesive CA. 1 It can be connected to the plurality of second electrodes (C142) provided in the solar cell (C1), the second conductive wiring (EC2) is provided in the second solar cell (C2) through a conductive adhesive (CA). The second electrode C142 and the plurality of first electrodes C141 provided in the third solar cell C3 may be connected.

In addition, in each of the first, second, and third solar cells (C1 to C3), a plurality of first and second electrodes C141 and C142 that are not connected to the first and second conductive wirings EC1 and EC2 and the first and second conductive wires An insulating layer IL may be positioned between the wirings EC1 and EC2.

In a more specific example, as shown in FIGS. 10 and 11, the insulating layer IL in the second solar cell C2 is between the first conductive wiring EC1 and the plurality of second electrodes C142 or the second It may be positioned between the conductive wiring EC2 and the plurality of first electrodes C141.

Accordingly, unnecessary short circuits or shunts between the first conductive line EC1 and the plurality of second electrodes C142 or between the second conductive line EC2 and the plurality of first electrodes C141 are more effectively prevented. can do.

Such an insulating layer IL is formed by the semiconductor substrate 110 in advance before connecting the insulating member 200 provided with the first and second conductive wirings EC1 and EC2 to each of the plurality of solar cells C1 to C3. Can be applied to the back of the.

Materials of the conductive adhesive CA and the insulating layer IL according to the second embodiment may be the same as those described in the first embodiment, and the conductive adhesive CA and the insulating layer ( IL) can be applied as it is in the second embodiment.

Accordingly, even in the second embodiment, the curing temperature of the insulating layer IL may be different from the curing temperature of the conductive adhesive CA.

For example, the curing temperature of the insulating layer IL may be lower than the curing temperature of the conductive adhesive CA. For example, the curing temperature of the insulating layer IL is between 80°C and 120°C, and the conductive adhesive CA The curing temperature of) may be between 130°C and 160°C.

In addition, the insulating layer IL may use a curable resin or a reactive resin, and for example, may include at least one of epoxy, polyimide, silicone, and polyethylene.

In addition, the conductive adhesive CA may include a metal material (SR or PA) and an insulating resin (IR) surrounding the metal material (SR or PA).

Here, the metal material may include first metal particles SR including tin (Sn) or second metal particles PA other than tin (Sn).

Here, the curing temperature of the first metal particles SR including tin (Sn) may be between 130°C and 160°C, and for example, may include at least one of SnIn and SnBi.

In addition, when the conductive adhesive (CA) includes a second metal particle (PA) other than tin (Sn), the second metal particle (PA) is, for example, at least one of Cu, Ni, Ag, or Au. Can include.

In this way, the solar cell module according to the present invention can further simplify the manufacturing process of the solar cell module by making the curing temperature of the insulating layer IL different from the curing temperature of the conductive adhesive CA, and the stability of the solar cell module Can be further improved.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It belongs to the scope of rights of

Claims (13)

Transparent substrate;
Rear seat:
A solar cell disposed between the transparent substrate and the rear sheet and having a semiconductor substrate and a first electrode and a second electrode formed to be spaced apart from each other on a rear surface of the semiconductor substrate;
It is positioned between the transparent substrate and the solar cell and between the rear sheet and the solar cell, and is formed of a first insulating material that is cured at a first curing temperature, so that the transparent substrate, the solar cell, and the An encapsulant heat-compressed with the rear sheet;
A first conductive wire disposed on a rear surface of the solar cell and connected to the first electrode and a second conductive wire connected to the second electrode;
A conductive adhesive for electrically connecting between the first electrode and the first conductive wiring and between the second electrode and the second conductive wiring; And
Between the first electrode and the second electrode, between the first conductive line and the second conductive line, between the first conductive line and the second electrode, and between the second conductive line and the first electrode, respectively. Including; an insulating layer to insulate,
The conductive adhesive includes a metal particle and a second insulating material surrounding the metal particle and cured at a second curing temperature lower than the first curing temperature, and the insulating layer is at a third curing temperature lower than the second curing temperature. A solar cell module formed of a third insulating material that is cured. delete The method of claim 1,
The first curing temperature of the first insulating material forming the encapsulant is between 160°C and 170°C, and the second curing temperature of the second insulating material provided in the conductive adhesive is between 130°C and 160°C. And, the third curing temperature of the third insulating material forming the insulating layer is between 80°C and 120°C. The method of claim 1,
The third insulating material forming the insulating layer is a curable resin or a reactive resin. The method of claim 4,
The curable resin forming the third insulating material includes at least one of epoxy, polyimide, silicone, and polyethylene. delete The method of claim 1,
The metal particles of the conductive adhesive are solar cell modules including first metal particles including tin (Sn) or second metal particles other than tin (Sn). The method of claim 7,
The solar cell module wherein the first metal particles including tin (Sn) are cured at the second curing temperature of the second insulating material. The method of claim 7,
The first metal particle including tin (Sn) is a solar cell module including at least one of SnIn and SnBi. The method of claim 7,
The second metal particle other than the tin (Sn) is a solar cell module comprising at least one of Cu, Ni, Ag, or Au. delete The method of claim 1,
The second insulating material is a solar cell module including an epoxy-based or silicon-based material. The method of claim 1,
The first and second conductive wires are interconnectors for connecting adjacent solar cells in series or auxiliary electrodes connected to the first and second electrodes.

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