KR102244597B1 - Solar cell module - Google Patents

Abstract

The present invention relates to a solar cell module.
An example of the solar cell module according to the present invention includes a plurality of solar cells each having a semiconductor substrate and a plurality of first electrodes and a plurality of second electrodes formed to be spaced apart from each other on the rear surface of the semiconductor substrate; A plurality of first wirings overlapping and connected to a plurality of first electrodes provided in any one of two solar cells immediately adjacent to each other among the plurality of solar cells; And a plurality of second wirings overlapping and connected to a plurality of second electrodes provided in the remaining one of the two immediately adjacent solar cells. And a third wiring disposed between the first and second solar cells and connected to the plurality of first wirings and the plurality of second wirings.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

A typical solar cell includes a substrate made of semiconductors of different conductive types, such as a p-type and an n-type, and an emitter unit, and an electrode connected to the substrate and the emitter unit, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter part.

As described above, solar cells using a semiconductor substrate can be classified into various types, such as a conventional type and a rear contact type, depending on the structure.

Here, in the conventional type, the emitter unit is located on the front surface of the substrate, the electrode connected to the emitter unit is located on the front surface of the substrate, and the electrode connected to the substrate is located on the rear surface of the substrate, and in the rear contact type, the emitter unit is located on the rear surface of the substrate. And all electrodes are located on the back side of the substrate.

Here, in the solar cell of the rear contact type, since all the electrodes are formed on the rear surface of the substrate, the electrodes formed on the rear surface of the substrate are connected in series to the electrodes of the adjacent solar cells through an interconnector or a separate conductive metal to form a solar cell module. I can.

An object of the present invention is to provide a solar cell module with improved efficiency and structural stability.

An example of the solar cell module according to the present invention includes a plurality of solar cells each having a semiconductor substrate and a plurality of first electrodes and a plurality of second electrodes formed to be spaced apart from each other on the rear surface of the semiconductor substrate; A plurality of first wirings overlapping and connected to a plurality of first electrodes provided in any one of two solar cells immediately adjacent to each other among the plurality of solar cells; And a plurality of second wirings overlapping and connected to a plurality of second electrodes provided in the remaining one of the two immediately adjacent solar cells. And a third wiring disposed between the first and second solar cells and connected to the plurality of first wirings and the plurality of second wirings.

Here, in each of the plurality of solar cells, each of the plurality of first and second electrodes is formed to be elongated in the first direction within the rear surface of the semiconductor substrate, and the plurality of solar cells are connected in series by first, second, and third wirings, A single string extending in a second direction crossing the first direction may be formed.

Here, each of the plurality of first and second wirings may be elongated in the second direction, and the third wiring may be elongated in the first direction.

Here, the third wiring is disposed between semiconductor substrates provided in each of the plurality of solar cells, and may be spaced apart from the semiconductor substrate provided in each of the plurality of solar cells.

In addition, the end of the first wire and the end of the second wire located at the portion overlapping the third wire are separated from each other, or the first wire and the second wire are not spaced apart from each other at the portion overlapping with the third wire. Can be formed.

Here, there may be one or a plurality of third wires.

For example, the third wiring may be formed of a single metal pad extending in the first direction, and the width of the third wiring may be greater than the widths of the first and second wirings.

In addition, the third wiring may include a core formed of a conductive first metal material, a first coating portion coated and positioned on the incident surface side of the core, and a second coating portion coated on the rear surface of the core and positioned. have.

Here, a plurality of irregularities are provided on the surface of the first coating unit, and the first coating unit may include a second metal material having a higher surface reflectivity than the first metal material.

In addition, the second coating unit may include a third metal material having a lower melting point than that of the first and second metal materials, and the second coating unit may include a plurality of grooves into which the first and second wires are inserted.

In addition, at least a portion of the third wiring may be disposed to overlap with some of the semiconductor substrates provided in the plurality of solar cells.

In addition, a plurality of third wires may be spaced apart from each other and extend long in the first direction, and the width of the third wire may be the same as the width of the first and second wires.

As described above, the solar cell module according to the present invention has a third wiring connected to the plurality of first and second wirings between the solar cells, further improving the light incident rate in the solar cell direction, and the plurality of first and second wirings. By fixing the wiring more stably, the efficiency of the solar cell module can be further improved, and the structural stability can be further improved.

1 to 6 are diagrams for explaining a first embodiment of a solar cell module according to the present invention.
7 and 8 are diagrams for explaining a second embodiment of the solar cell module according to the present invention.
9 and 10 are diagrams for explaining a third embodiment of the solar cell module according to the present invention.
11 and 12 are diagrams for explaining a fourth embodiment of the solar cell module according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. However, the present invention may be implemented in various forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are assigned to similar parts throughout the specification.

Hereinafter, the front surface may be one surface of the semiconductor substrate to which direct sunlight is incident, and the rear surface may be the opposite surface of the semiconductor substrate to which direct sunlight is not incident or reflected light other than direct sunlight may be incident.

In addition, in the following description, the meaning that the length or width of the two different components are the same means that they are the same within an error range of 10%.

Hereinafter, a solar cell module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 to 6 are diagrams for explaining a first embodiment of a solar cell module according to the present invention.

Here, FIG. 1 is a shape viewed from the rear of a string applied to a solar cell module according to a first embodiment of the present invention, and FIG. 2 is a partial perspective view showing an example of a solar cell applied to FIG. 1, and FIG. 3 is The pattern of the first and second electrodes C141 and C142 of the solar cell shown in FIG. 2 is shown, FIG. 4 is a cross-sectional view taken along the CSx1-CSx1 line in FIG. 1, and FIG. 5 is a third wiring IC3. 1 is a cross-sectional view illustrating a line CSy1-CSy1 in FIG. 1, and FIG. 6 is a diagram illustrating a light reflection effect of the third wiring IC3.

As shown in FIG. 1, the solar cell module according to the present invention includes a plurality of solar cells C1 and C2, and a plurality of first and second electrodes C141 and C142 formed on the rear surfaces of the plurality of solar cells C1 and C2. ) Connected to a plurality of first wires (IC1) and a plurality of second wires (IC2), and a plurality of first and second wires (IC1, IC2) to connect a plurality of solar cells (C1, C2) in series The third wiring IC3 is included.

Here, each of the plurality of solar cells C1 and C2 includes a plurality of first electrodes C141 and a plurality of second electrodes C142 formed to be spaced apart from each other on at least the semiconductor substrate 110 and the rear surface of the semiconductor substrate 110 It is equipped with.

More specifically, as shown in FIGS. 2 and 3, the solar cell according to the present invention includes, for example, a semiconductor substrate 110, an antireflection film 130, an emitter part 121, and a back surface. field; BSF, 172, a plurality of first electrodes C141, and a plurality of second electrodes C142.

Here, the anti-reflection film 130 and the rear electric field part 172 may be omitted, but hereinafter, as an example, the anti-reflection film 130 and the rear electric field part 172 are included as shown in FIGS. 2 and 3. Explain.

The semiconductor substrate 110 may be a semiconductor substrate 110 made of silicon of a first conductivity type, for example, an n-type conductivity type. The semiconductor substrate 110 may be formed by doping a first conductivity type impurity, for example, an n-type conductivity type impurity, on a semiconductor wafer formed of a crystalline silicon material.

A plurality of emitter units 121 are located in the rear surface of the semiconductor substrate 110 facing the front surface, spaced apart from each other, and extend in a first direction x parallel to each other. The plurality of emitter units 121 may include a second conductivity type opposite to that of the semiconductor substrate 110, for example, impurities of a p-type conductivity type.

Accordingly, a p-n junction may be formed by the semiconductor substrate 110 and the emitter part 121.

A plurality of rear electric field units 172 are located inside the rear surface of the semiconductor substrate 110 to be spaced apart from each other, and extend in a first direction x parallel to the plurality of emitter units 121. Accordingly, as shown in FIGS. 2 and 3, a plurality of emitter units 121 and a plurality of rear electric field units 172 may be alternately positioned on the rear surface of the semiconductor substrate 110.

The plurality of rear electric field portions 172 may be n++ impurity portions in which impurities of the same first conductivity type as the semiconductor substrate 110 are contained in a higher concentration than the semiconductor substrate 110.

The plurality of first electrodes C141 may be physically and electrically connected to the emitter unit 121, respectively, and may be formed on the rear surface of the semiconductor substrate 110 along the emitter unit 121.

In addition, the plurality of second electrodes C142 are formed on the rear surface of the semiconductor substrate 110 along the plurality of rear electric field units 172, and are physically and electrically connected to the semiconductor substrate 110 through the rear electric field units 172, respectively. Can be connected to.

Here, each of the plurality of first electrodes C141 may extend in a first direction (x), as shown in FIG. 3, and each of the plurality of first electrodes C141 is in the first direction (x) and They may be arranged to be spaced apart from each other in an intersecting second direction (y).

In addition, each of the plurality of second electrodes C142 may also extend in a first direction (x), as shown in FIG. 3, and each of the plurality of second electrodes C142 crosses the first direction (x). They may be arranged to be spaced apart from each other in the second direction y.

In addition, the plurality of first and second electrodes C141 and C142 may be spaced apart from each other and electrically isolated, and the first electrode C141 and the second electrode C142 may be alternately disposed.

Holes collected through the first electrode C141 and electrons collected through the second electrode C142 in the solar cell according to the present invention manufactured with such a structure will be used as power of an external device through an external circuit device. I can.

The solar cell applied to the solar cell module according to the present invention is not necessarily limited to FIGS. 2 and 3, and the first and second electrodes C141 and C142 provided in the solar cell are formed only on the rear surface of the semiconductor substrate 110 Except for, other components can be changed anytime.

For example, in the solar cell module of the present invention, a part of the first electrode C141 and the emitter part 121 are located on the front surface of the semiconductor substrate 110, and a part of the first electrode C141 is located on the semiconductor substrate 110. An MWT type solar cell connected to the rest of the first electrode C141 formed on the rear surface of the semiconductor substrate 110 through the formed hole may also be applied.

As such, the solar cells described in FIGS. 2 and 3 may be arranged in the second direction y as shown in FIG. 1. That is, as an example, the first solar cell C1 and the second solar cell C2 may be arranged in the second direction y.

In this case, the length direction of the plurality of first and second electrodes C141 and C142 provided in the first and second solar cells C1 and C2 may be disposed to face in the first direction x.

In this way, while the first and second solar cells C1 and C2 are arranged in the second direction y, the first and second solar cells C1 and C2 are connected to the first, second, and third wirings IC1 and IC2. , IC3) may form a single string connected in series by extending in the second direction y.

Here, the first, second, and third wirings (IC1, IC2, IC3) are made of a conductive metal material, and the first and second wirings (IC1, IC2) are connected to the rear surface of the semiconductor substrate 110 of each solar cell, The first and second wirings IC1 and IC2 connected to each semiconductor substrate 110 for serial connection of the solar cell may be connected to the third wiring IC3.

In addition, the plurality of first and second wirings IC1 and IC2 may have a shape of a conductive wire having the same width and thickness or a ribbon shape having a width greater than that of the thickness.

Specifically, the plurality of first wirings IC1 overlap and connect to the plurality of first electrodes C141 provided in any one of two solar cells immediately adjacent to each other among the plurality of solar cells C1 and C2. Can be.

For example, as shown in FIGS. 1 and 4, a plurality of first wirings IC1 are provided in the first solar cell C1 of two first and second solar cells C1 and C2 immediately adjacent to each other. The plurality of first electrodes C141 may be overlapped and connected.

In this case, each of the plurality of first wirings IC1 may be elongated in a second direction y crossing the length direction of the plurality of first electrodes C141, and as shown in FIG. 1, the semiconductor substrate ( When viewed from the rear surface of 110, the plurality of first wirings IC1 may be formed by being drawn out of the semiconductor substrate 110.

Here, as shown in FIGS. 1 and 4, each of the plurality of first wirings IC1 may be connected to the plurality of first electrodes C141 through a conductive adhesive CA.

Here, as the conductive adhesive CA, any one of a solder paste having excellent adhesion between metal materials, a conductive adhesive paste containing metal particles in an insulating resin, or a conductive adhesive film may be used.

In addition, for insulation between each of the plurality of first wirings IC1 and the plurality of second electrodes C142, an insulating layer is provided between each of the plurality of first wirings IC1 and the plurality of second electrodes C142. (IL) can be deployed.

Here, the insulating layer IL may be any insulating material, and as an example, an insulating resin such as epoxy may be used.

At this time, as an example, the material applied to the insulating layer IL may preferably have a melting temperature of approximately 400°C or higher and a curing temperature of 210°C to 250°C.

Next, the plurality of second wirings IC2 are overlapped and connected to the plurality of second electrodes C142 provided in the remaining one of the two solar cells immediately adjacent to each other among the plurality of solar cells C1 and C2. I can.

For example, as shown in FIGS. 1 and 4, a plurality of second wirings IC2 are provided in the second solar cell C2 of two first and second solar cells C1 and C2 immediately adjacent to each other. The plurality of second electrodes C142 may be overlapped and connected.

In this case, each of the plurality of second wirings IC2 may be elongated in a second direction y crossing the length direction of the plurality of second electrodes C142, and as shown in FIG. 1, the semiconductor substrate ( When viewed from the rear surface of 110, the plurality of second wirings IC2 may be formed by being drawn out of the semiconductor substrate 110.

Here, as shown in FIGS. 1 and 4, each of the plurality of second wirings IC2 may be connected to the plurality of second electrodes C142 through the same conductive adhesive CA as described above.

In addition, in order to insulate between each of the plurality of second wirings IC2 and the plurality of first electrodes C141, the above-described The same insulating layer IL as that may be disposed.

In addition, from the front, the first wiring IC1 is connected to the first electrode C141 of the first solar cell C1, and the second wiring IC2 is the second electrode C142 of the second solar cell C2. Although only the connection to is described, as shown in FIGS. 1 and 4, a plurality of second wirings IC2 are also provided in a plurality of second electrodes C142 provided in the first solar cell C1. CA), and the plurality of first wires IC1 may be connected to the plurality of first electrodes C141 provided in the second solar cell C2 through the conductive adhesive CA.

That is, a plurality of first wirings IC1 and a plurality of second wirings IC2 may be connected to each of the cell electrodes C141 and C142 on the rear surface of the semiconductor substrate 110 formed of one solar cell device.

Accordingly, as shown in FIGS. 1 and 4, the first wiring IC1 is connected to the first electrode C141 of each solar cell, and the second wiring IC2 is connected to the second electrode C142. I can.

In this way, among the plurality of first wirings IC1 and the plurality of second wirings IC2 connected to the rear surface of each solar cell, a portion drawn out of each semiconductor substrate 110 is shown in FIGS. 1 and 4. Likewise, it can be connected to the rear surface of the third wiring IC3 disposed between the first and second solar cells C1 and C2, and accordingly, a plurality of solar cells C1 and C2 can be formed as a single string. I can.

In this case, the length direction of the third wiring IC3 may be formed to be elongated in the same first direction x as the length direction of the first and second electrodes C141 and C142 of each solar cell.

Here, there may be one or a plurality of third wires IC3, but in the first embodiment, a case in which the third wire IC3 is formed of a single metal pad extending in the first direction x will be described as an example.

In this case, the third wiring IC3 may be disposed between the semiconductor substrates 110 provided in each solar cell, as shown in FIGS. 1 and 4. That is, the third wiring IC3 may be spaced apart without overlapping with the semiconductor substrate 110 provided in each of the plurality of solar cells C1 and C2, and as an example, when the string is viewed from the rear, it is shown in FIG. 1. As described above, between the third wiring IC3 and the semiconductor substrate 110 of the first solar cell C1 may be spaced apart by D1, and the semiconductor substrate of the third wiring IC3 and the second solar cell C2 Between (110) can be separated by D2. In this case, the spacing between D1 and D2 may be the same or different from each other.

In this way, since the third wiring IC3 is disposed between the semiconductor substrates 110, it is possible to reflect light incident between each solar cell and re-enter the solar cell. In addition, each semiconductor substrate 110 ), the third wiring IC3 serves to fix the first and second wirings IC1 and IC2, thereby further increasing the structural stability of the solar cell module.

In addition, the width WI3 of the third wire IC3 is, as shown in FIG. 1, the widths WI1 and WI2 of each of the plurality of first and second wires IC1 and IC2 in order to secure sufficient contact force and connection resistance. Can be greater than ). For example, the widths WI1 and WI2 of each of the plurality of first and second wires IC1 and IC2 may be between 0.05 mm and 4 mm, and the width WI3 of the third wire IC3 is the first and second wires. (IC1, IC2) It may be formed between 0.5mm ~ 8mm under the condition that is larger than the respective widths (WI1, WI2).

In this case, the thickness of the third wiring IC3 may be equal to or greater than the thickness of each of the plurality of first and second wirings IC1 and IC2. For example, the thickness of the first and second wirings IC1 and IC2 may be between 0.05mm and 0.4mm, and the thickness of the third wiring IC3 is 1. 2 It may be the same as the thickness of the wiring or may be formed between 0.05mm and 1mm.

At this time, as shown in FIGS. 1 and 4, the first wiring IC1 connected to the first solar cell C1 and the second wiring IC2 connected to the second solar cell C2 are different lines. Since they are located on the line and are provided independently, the ends of the first interconnection IC1 and the second interconnection IC2, which are positioned at a portion overlapping the third interconnection IC3, may be spaced apart from each other.

Therefore, when there is a solar cell in which connection failure has occurred between the first and second wirings IC1 and IC2 and the first and second electrodes C141 and C142 among the plurality of solar cells, the third wiring IC3 and the plurality of By releasing the connection between the 1st and 2nd wirings (IC1, IC2), only the solar cell can be replaced more easily.

However, differently, in a portion overlapping with the third wiring, the first wiring IC1 and the second wiring IC2 may be integrally connected without being spaced apart from each other. This will be described in more detail in the second embodiment of the present invention.

Here, a more specific structure of the third wiring IC3 will be described with reference to FIG. 5 as follows.

As shown in FIG. 5, the third wiring IC3 includes a core CO formed of a conductive first metal material, a first coating portion CT1 coated on and positioned on the incident surface of the core CO, and And a second coating part CT2 coated and positioned on the rear surface of the core CO.

Here, the first metal material of the core CO may be a metal material having good conductivity, for example, copper (Cu).

Here, as illustrated in FIG. 5, a plurality of irregularities may be provided on the surface of the first coating part CT1 toward the incident surface. Such irregularities are formed in a pyramid-shaped structure to scatter light incident on the third wiring IC3, or a plurality of peaks and valleys extend long in the second direction (y), which is formed between the peaks and valleys. The inclined surface may be shaped toward the first solar cell C1 or the second solar cell C2.

In addition, the first coating part CT1 may include a second metal material having a higher surface reflectivity than the first metal material in order to increase the reflectance by the third wiring IC3. For example, as the second metal material, silver (Ag) having a higher surface reflectivity than copper (Cu), which is the first metal material, may be used.

In addition, in order to further improve the contact force and contact resistance with the plurality of first and second wirings IC1 and IC2 connected to the rear surface of the third wiring IC3, the second coating CT2 A third metal material having a lower melting point than that of the metal material may be included.

For example, the third metal material may include at least one metal material of tin (Sn) and indium (In) having a lower melting point than that of the first and second metal materials, such as copper (Cu) or silver (Ag). More specifically, the third metal material may include, for example, a material such as SnPb, SnBi, or In.

In addition, a plurality of grooves HIC into which a plurality of first and second wirings IC1 and IC2 are inserted may be provided on the rear surface of the second coating part CT2 as shown in FIG. 5. That is, each of the plurality of grooves HIC formed on the rear surface of the second coating part CT2 may have a structure in which the plurality of first and second wirings IC1 and IC2 are engaged.

Accordingly, contact resistance can be minimized by increasing the connection area between the second coating part CT2 and the first and second wirings IC1 and IC2, and a plurality of first and second wirings IC1 and IC2 are provided. When connecting to the three wirings IC3, the first and second wirings IC1 and IC2 can be more easily aligned and fixed.

At this time, the thickness (TCT2) of the portion where the groove (HIC) is not formed in the second coating part CT2 is to be formed between 5 μm and 30 μm in order to sufficiently exert the connection force of the second coating part CT2. I can.

If the thickness of the second coating part CT2 is not sufficient, the first and second wires IC1 and IC2 may be connected to the third wire IC3 using the conductive adhesive CA described above.

However, as described above, when the thickness of the second coating part CT2 is between 5 μm and 30 μm, since a separate conductive adhesive (CA) is not required, the manufacturing process can be further simplified, and the manufacturing cost can be reduced. It can be further reduced.

In this way, the strings in which the plurality of solar cells C1 and C2 are connected in series by the first, second, and third wirings IC1, IC2, and IC3 are the transparent substrate FG, the first filler EC1, and the second filler. In a state disposed between the (EC2) and the rear sheet (BS), they are laminated together, and as shown in FIG. 6, it may be formed as one integrated module.

Here, the transparent substrate FG may be made of a light-transmitting glass or plastic material, and the first and second fillers EC1 and EC2 are a material having elasticity and insulation, and may include EVA, for example. In addition, the rear sheet BS may be formed of an insulating material having a moisture-proof function.

In this way, when using the third wiring IC3 serving as a reflector between a plurality of solar cells, as shown in FIG. 6, the light incident between the solar cells is transferred to the third wiring IC3 and the transparent substrate FG. ), it is possible to re-enter the solar cell, thereby further improving the efficiency of the solar cell.

In the first embodiment so far, the first wiring IC1 connected to the first solar cell C1 and the second wiring IC2 connected to the second solar cell C2 are located on different line lines. Since the ends of the first wiring IC1 and the ends of the second wiring IC2, which are located at a portion overlapping with the third wiring IC3, are described only when they are separated from each other, differently from this, the following description has been made. In the second embodiment of, a case in which the first wiring IC1 connected to the first solar cell C1 and the second wiring IC2 connected to the second solar cell C2 are integrally formed will be described.

7 and 8 are diagrams for explaining a second embodiment of the solar cell module according to the present invention. Here, FIG. 7 is a shape as viewed from the rear of the string applied to the solar cell module according to the second embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the CSx2-CSx2 line in FIG. 7.

In FIGS. 7 and 8, contents overlapping with those described in FIGS. 1 to 6 will be omitted, and other parts will be mainly described. Therefore, unless there is a specific description and are not compatible with each other, the portions described in FIGS. 1 to 6 may be equally applied.

7 and 8, the first wiring IC1 connected to the first solar cell C1 and the second wiring IC2 connected to the second solar cell C2 may be integrally formed. Accordingly, the first wiring IC1 and the second wiring IC2 may be integrally formed without being spaced apart from each other in a portion overlapping the third wiring.

Accordingly, each of the plurality of first wirings IC1 connected to the first solar cell C1 and the plurality of second wirings IC2 connected to the second solar cell C2 may be positioned on the same line.

At this time, the same as described above in FIGS. 1 to 6, as shown in FIGS. 7 and 8, the plurality of first wirings IC1 connected to the first solar cell C1 includes a plurality of first electrodes ( A plurality of second wirings IC2 connected to C141 through a conductive adhesive CA and connected to the second solar cell C2 may be connected to the plurality of second electrodes C142 through a conductive adhesive CA. I can.

In the first and second embodiments so far, only the case where the third wiring IC3 is positioned between the semiconductor substrates 110 of each solar cell and is disposed apart from each other without overlapping with each of the semiconductor substrates 110 has been described as an example. Unlike this, the third wiring IC3 is positioned between the semiconductor substrates 110 of each solar cell, but may be disposed to overlap with some of the semiconductor substrates 110. This will be described as follows.

9 and 10 are diagrams for explaining a third embodiment of the solar cell module according to the present invention. Here, FIG. 9 is a shape as viewed from the rear of a string applied to the solar cell module according to the third embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the CSx3-CSx3 line in FIG. 9.

In FIGS. 9 and 10, contents overlapping with those described in FIGS. 1 to 6 will be omitted, and other parts will be mainly described. Therefore, unless there is a specific description and are not compatible with each other, the portions described in FIGS. 1 to 6 may be equally applied.

At least a portion of the third wiring IC3 according to the present invention may be disposed to overlap with some of the semiconductor substrates 110 provided in the plurality of solar cells C1 and C2.

For example, as shown in FIGS. 9 and 10, a part of the third wiring IC3 overlaps the semiconductor substrate 110 of the first solar cell C1, and the semiconductor of the second solar cell C2 It may be disposed and formed in a state spaced apart from the substrate 110.

However, differently, the entire area of the third wiring IC3 may overlap the semiconductor substrate 110 of the first solar cell C1.

At this time, the first wiring IC1 connected to the first solar cell C1 may be connected to the front surface of the third wiring IC3, and the second wiring IC2 connected to the second solar cell C2 is It may be connected to the rear surface of the third wiring IC3.

In addition, the third wiring IC3 and the semiconductor substrate 110 are in a region where the first wiring IC1 is not located among the areas where the semiconductor substrate 110 and the third wiring IC3 of the first solar cell C1 overlap. In order to prevent unnecessary short circuit with ), as shown in FIG. 10, an insulating layer IL may be formed.

In addition, in FIGS. 9 and 10, a case in which the first wiring IC1 connected to the first solar cell C1 is drawn out of the semiconductor substrate 110 of the first solar cell C1 is illustrated as an example. One wiring IC1 may not be drawn out of the semiconductor substrate 110 of the first solar cell C1.

Until now, in the first to third embodiments of the present invention, only a case in which the third wiring IC3 is formed of a single metal pad extending in the first direction x has been described as an example. It can also be formed of dogs. This will be described as follows.

11 and 12 are diagrams for explaining a fourth embodiment of the solar cell module according to the present invention. Here, FIG. 11 is a shape as viewed from the rear of a part of the string applied to the solar cell module according to the fourth embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along the CSx4-CSx4 line in FIG. 11.

In FIGS. 11 and 12, contents overlapping with those described in FIGS. 1 to 6 will be omitted, and other parts will be mainly described. Therefore, unless there is a specific description and are not compatible with each other, the portions described in FIGS. 1 to 6 may be equally applied.

As shown in FIGS. 11 and 12, the third wiring IC3 may be formed in a plurality of lines that are spaced apart from each other and extend long in the first direction x.

Even in such a case, the efficiency of the solar cell module may be further improved by re-inciding light incident between the solar cells to the solar cell through the plurality of third wirings IC3 elongated in the first direction x.

In this case, the plurality of third wires IC3 may also include a core CO, a first coating part CT1, and a second coating part CT2, as described with reference to FIG. 5.

In addition, in the case of the fourth embodiment, the width WI3 of the third wiring IC3 may be the same as the widths WI1 and WI2 of the first and second wirings IC1 and IC2. However, in order to secure series resistance between cells, the width WI3 or the thickness of the third wiring IC3 may be larger than the width or thickness of the first and second wirings IC1 and IC2.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention belongs can make various modifications, changes, and substitutions within the scope not departing from the essential characteristics of the present invention. will be.

Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

Claims (16)

A plurality of aspects including a semiconductor substrate, and a plurality of first electrodes and a plurality of second electrodes, each extending in a first direction and spaced apart from each other on the rear surface of the semiconductor substrate in a second direction crossing the first direction battery;
Extending in the second direction, overlapping the plurality of first electrodes and the plurality of second electrodes provided in a first solar cell among two solar cells immediately adjacent to each other among the plurality of solar cells, and the first solar cell A plurality of first wirings connected to the plurality of first electrodes provided in a battery; And
A plurality of solar cells extending in the second direction, overlapping the plurality of first electrodes and the plurality of second electrodes provided in a second solar cell among the two immediately adjacent solar cells, and provided in the second solar cell A plurality of second wirings connected to the second electrode; And
A third wire extending in the first direction, disposed between the first and second solar cells, and connected to the plurality of first wires and the plurality of second wires; and
The plurality of solar cells are connected in series by the first, second, and third wirings to form one string extending in the second direction. delete delete delete The method of claim 1,
The third wiring is disposed between the semiconductor substrates provided in each of the plurality of solar cells and spaced apart from the semiconductor substrate provided in each of the plurality of solar cells. The method of claim 1,
A solar cell module in which an end of the first wire and an end of the second wire positioned at a portion overlapping with the third wire are spaced apart from each other. The method of claim 1,
A solar cell module in which the first wiring and the second wiring are not spaced apart from each other and integrally formed at a portion overlapping the third wiring. The method of claim 1,
The third wiring is one or a plurality of solar cell modules. The method of claim 8,
The third wiring is formed of a single metal pad elongated in the first direction,
The width of the third wiring is larger than that of the first and second wirings. The method of claim 1,
The third wiring includes a core formed of a conductive first metal material, a first coating portion coated and positioned on the incident surface side of the core, and a second coating portion coated and positioned on the rear surface of the core. Solar module. The method of claim 10,
A solar cell module provided with a plurality of irregularities on the surface of the first coating part. The method of claim 10,
The solar cell module including a second metal material having a higher surface reflectivity than the first metal material in the first coating part. The method of claim 12,
The second coating part solar cell module including a third metal material having a melting point lower than that of the first and second metal materials. The method of claim 10,
The solar cell module having a plurality of grooves into which the first and second wires are inserted in the second coating part. The method of claim 1,
A solar cell module in which at least a portion of the third wiring is disposed to overlap with some of the semiconductor substrates provided in the plurality of solar cells. The method of claim 8,
The third wiring is formed in a plurality of spaced apart from each other and elongated in the first direction,
The width of the third wiring is the same as the width of the first and second wirings solar cell module.

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