KR102238913B1 - recognizing method of temperature sensor for multi point temperature monitering system of busduct - Google Patents

Abstract

Disclosed is a temperature sensor recognition method of a bus duct multi-point temperature monitoring system. The temperature sensor recognition method of the bus duct multi-point temperature monitoring system according to the present invention can accurately and quickly identify the temperature inside the connection part in real time to prevent and inspect accidents, and easily and quickly perform recognition of each temperature sensor at the time of initial installation. It can be done, and real-time temperature monitoring of the installed bus duct can be easily implemented at low cost. In addition, it is possible to easily perform replacement in case of failure or damage of the temperature sensor.

Description

Recognizing method of temperature sensor for multi point temperature monitoring system of busduct}

The present invention relates to a temperature sensor recognition method of a bus duct multi-point temperature monitoring system, and more particularly, a temperature sensor of a bus duct multi-point temperature monitoring system that can accurately and continuously measure the temperature of a connection and is easy to install and set. It is about the recognition method.

In general, cables have been used a lot in the past as a medium for transmitting electrical energy, but bus ducts have been widely used as a replacement for cables in recent years. The bus duct has a bus bar that performs the same role as a conductor core wire included in a cable, and has an advantage of being able to conduct a large amount of current.

Originally, in the power wiring method, the wiring method by wire cable has been widely used, but in the wiring method such as high-rise buildings or large-scale factories, the wiring method by bus duct gradually having a bus bar. More and more cases are being adopted.

These bus ducts and cables have a conductor and an insulator in common, but the cable uses vinyl or rubber to protect or insulate the conductor, but the bus duct transfers a large amount of current through the conductor, so it is difficult to directly protect it as an insulator. There is a difference in that the insulator is covered on the busbar and at the same time the busbar is embedded in the metal duct.

Such a bus duct is widely used in places that use a relatively large amount of power because it is not only easy to expand and relocate, but also can be quickly recovered when an abnormality or accident occurs on the power wiring of the bus bar.

Moreover, compared to the past, since the electricity supply system of today's buildings is increasingly larger and requires energy of various capacities, according to this trend, the use of bus ducts with safe and low energy loss is rapidly increasing.

For example, booth ducts are factories, buildings, apartments, large discount marts, officetels, research complexes, department stores, golf courses, tunnels, semiconductor and LCD factories, chemicals, oil refining, steelmaking, high-rise buildings, ultra-high voltage substations, LNG receiving bases, new airports, and ports. It is applied to facilities in various fields such as.

The busbars provided inside the bus ducts are usually provided inside a duct of a predetermined size in a state that is isolated from the outside because a large current flows, and the bus ducts including these busbars are manufactured as unit units having a certain length. It is then connected and constructed according to the facility and distribution design to be installed.

At this time, a connection part is provided so that the bus duct manufactured as a unit unit can be continuously installed. In other words, each bus duct is connected to each other by the connection part, and the conductor is connected to each other, and the external ground is connected to each other.

Such a conventional connection part consists of a structure in which the conductor plate and the insulating plate are alternately arranged, and the bus bar of the bus duct is inserted between the conductor plates, and then the conductor plate and the insulating plate are tightened with a fastening bolt so that the inserted bus bar does not separate. . After that, by combining the enclosure of the bus duct and the enclosure of the connection part, the bus ducts adjacent to each other are assembled.

Due to the characteristics of the bus duct that is constructed by connecting unit units in this way, management and inspection of the connection part is important, and in particular, it is necessary to continuously monitor whether the temperature rises abnormally at the connection part.

The bus bar of the bus duct is generally made of copper or aluminum with excellent conductivity. When a current flows through the bus bar, Joule's heat is generated and the temperature rises, and Joule heat due to contact resistance is concentrated on the connection part. Phenomenon can happen.

In addition, since the temperature may rise due to an increase in resistance due to poor connection of the connection or deformation due to the expansion and contraction of the busbar, it is important to monitor such temperature changes to prevent accidents and check them in advance. More important.

However, it takes a lot of cost to build such a temperature monitoring system, and since it is not easy to repair or replace a general temperature sensor, a lot of manpower and cost are inevitably required for maintenance as well.

In the case of a non-contact temperature sensor, heat in the connection part is transferred through a temperature sensor through radiation and convection to measure the temperature. In particular, since radiant heat is not well transferred to the temperature sensor, temperature measurement is often not performed accurately.

In addition, in installing and setting the temperature sensor, since the temperature sensor is recognized only when the address of each temperature sensor is manually set in the central control unit, there is a problem that it takes a long time for the initial setting.

Accordingly, there is a need for a bus duct multi-point temperature monitoring system that can accurately and continuously measure the temperature of the connection and is easy to install and set, and a temperature sensor recognition method.

Embodiments of the present invention are intended to perform accident prevention and inspection by accurately and quickly grasping the temperature inside the connection part in real time.

In addition, it is intended to provide a bus duct multi-point temperature monitoring system that can easily recognize each temperature sensor during initial installation.

In addition, real-time temperature monitoring of the installed bus duct is to be implemented easily at low cost.

In addition, it is intended to be easily replaced in case of failure or damage of the temperature sensor.

According to an aspect of the present invention, a plurality of temperature sensors respectively installed at a plurality of connection portions connecting a bus duct, and a sensing unit for sensing temperature are disposed to face each other without contacting the bus bar of the bus duct, and the A power supply device that supplies operating power to a temperature sensor, a data collection device that collects and transmits temperature information from the plurality of temperature sensors, and a temperature information is received from the data collection device for inquiry and setting of a normal range. And a terminal performing an alarm function, wherein a temperature sensor close to a data collection device among the plurality of temperature sensors detects and recognizes the number of temperature sensors for a temperature sensor at a far side. Recognizing the temperature sensor of the bus duct multi-point temperature monitoring system comprising transmitting a command signal for and recognizing each temperature sensor through the collected number information sequentially transmitted from the last temperature sensor among the plurality of temperature sensors. A method can be provided.

In the step of transmitting the command signal, a temperature sensor near the data collection device among neighboring temperature sensors may be set as a master calling a command signal, and a temperature sensor on the far side may be set as a slave responding to the command signal.

The temperature sensor recognition method of the bus duct multi-point temperature monitoring system according to the present invention may further include the step of transmitting the command signal to the next lower temperature sensor by the temperature sensor receiving the command signal.

The temperature sensor recognition method of the bus duct multi-point temperature monitoring system according to the present invention may further include transmitting an end signal to the next higher temperature sensor when the temperature sensor receiving the command signal is the last temperature sensor.

According to embodiments of the present invention, accident prevention and inspection may be performed by accurately and quickly grasping the temperature inside the connection part in real time.

In addition, it is possible to provide a bus duct multi-point temperature monitoring system that can easily recognize each temperature sensor during initial installation.

In addition, real-time temperature monitoring of the installed bus duct can be easily implemented at low cost.

In addition, it is possible to easily perform replacement in case of failure or damage of the temperature sensor.

1 is a perspective view showing the structure of a bus duct connection unit according to an embodiment of the present invention
2 is an exploded perspective view of a bus duct connection part according to an embodiment of the present invention
3 is a perspective view as viewed from above of a temperature sensor according to an embodiment of the present invention
4 is a perspective view of a temperature sensor according to an embodiment of the present invention as viewed from the lower side
5 is a partial enlarged view of a temperature sensor according to an embodiment of the present invention as viewed from the front
6 is an exploded perspective view showing an assembly structure of a bus duct connection unit according to an embodiment of the present invention
7 is an exploded perspective view showing an assembly structure of an insulating plate and a energizing plate of a bus duct connection part according to an embodiment of the present invention
8 is a cross-sectional view showing an assembly structure of a bus duct connection unit according to an embodiment of the present invention
9 is a partially enlarged view showing an enlarged portion A of FIG. 8
10 is a block diagram showing the configuration of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention
11 is a flow chart showing the sequence of a temperature sensor recognition method of the bus duct multi-point temperature monitoring system according to an embodiment of the present invention
12 is a graph showing a ratio differential temperature monitoring method of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention
13 is a graph showing a static temperature monitoring method of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention
14 is a graph showing a differential temperature monitoring method of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art. The same reference numbers throughout the specification indicate the same elements.

1 is a perspective view showing the structure of a bus duct connection unit according to an embodiment of the present invention, Fig. 2 is an exploded perspective view of a bus duct connection unit according to an embodiment of the present invention, and Fig. 3 is an embodiment of the present invention It is a perspective view of the temperature sensor according to the upper side. 4 is a perspective view of a temperature sensor according to an embodiment of the present invention as viewed from a lower side, FIG. 5 is a partial enlarged view of a temperature sensor according to an embodiment of the present invention as viewed from the front, and FIG. 6 is an embodiment of the present invention It is an exploded perspective view showing the assembly structure of the bus duct connection according to the example. 7 is an exploded perspective view showing an assembly structure of an insulating plate and a current-carrying plate of a bus duct connection unit according to an embodiment of the present invention, and FIG. 8 is an exploded perspective view showing an assembly structure of a bus duct connection unit according to an embodiment of the present invention. It is a cross-sectional view, and FIG. 9 is a partially enlarged view showing an enlarged portion A of FIG. 8.

1 to 9, the bus duct connection part 100 according to an embodiment of the present invention is coupled to a connection part enclosure 105 surrounding the outside of the connection part 100, and one side of the connection part enclosure 105, A temperature sensor 200 for measuring the temperature of the connection part 100 may be included.

The connection part 100 is configured to surround the outside of the connection part assembly 100a to which the bus bar 20 of the neighboring bus duct 10 is inserted and fastened. The connection part enclosure 105 surrounds the connection part assembly 100a by being fastened by coupling the first enclosure 101 and the second enclosure 103 from the upper and lower sides, respectively.

The temperature sensor 200 may be installed in a way that is buried inside or attached to the outside of the connection part enclosure 105, but in this embodiment, a hollow part 103a is formed on one side of the connection part enclosure 105, and the hollow part It may be configured to be detachably coupled to the portion (103a).

That is, in the present embodiment, the temperature sensor 200 may be coupled from the outside of the connection unit enclosure 105 but inserted through the connection unit enclosure 105.

In this case, the temperature sensor 200 may be a digital temperature sensor. The resistance value of a metal or semiconductor varies with temperature, and an electromotive force is generated when the junction between dissimilar metals is heated. The digital temperature sensor measures the temperature by measuring the resistance or electromotive force generated here.

Since the digital temperature sensor outputs the measured temperature value as a digital signal, processing of the output data is convenient, and performance degradation due to the influence of noise can be prevented. In addition, the power consumption is low, and there is an advantage that is advantageous for measuring a relatively wide range of temperature.

Here, the temperature sensor 200 may be disposed to face each other in a state in which the sensing unit 210 for sensing the temperature does not contact the bus bar 20 of the bus duct 10.

Specifically, as shown in FIGS. 4 and 5, the sensing unit 210 includes a printed circuit board (PCB) 212 disposed in parallel to face the bus bar 20 and the printed circuit board 212. It is provided on the top and includes a packaging portion 214 having a semiconductor made of a PN junction therein, and at least one lead 216 protruding from the packaging portion 214 and connected to the opposite PCB 212 I can.

The temperature sensor 200 changes the current voltage characteristics of the PN junction constituting the semiconductor inside the packaging part 214 according to the temperature change, and amplifies the sensor data, which is a small signal, by embedding an amplifying circuit, and when amplifying the signal It may be configured to remove noise that may be introduced from the outside.

The opposite PCB 212 may be supported by a supporting PCB 202, wherein one side of the supporting PCB 202 is connected to a communication module (not shown) of the temperature sensor 200, and the other side is the opposite PCB. Connected to (212). In this case, the opposite PCB 212 may be connected and supported so as to be perpendicular to each other with the supporting PCB 202. The temperature information measured by the sensing unit 210 may be transmitted to a communication module through the opposite PCB 212 and the supporting PCB 202 and transmitted through communication.

The sensing unit 210 configured as described above is positioned to face each other without contacting the bus bar 20 of the bus duct 10 within the connection unit 100, and accordingly, as shown in FIG. Radiant heat radiated from the bar 20 is directly transferred to the packaging unit 214 and the lid 216 so that the temperature can be accurately measured.

That is, since the sensing unit 210 is disposed so as to face the transfer direction of heat radiated from the bus bar 20 as a heat source, a temperature change in the connection unit 100 can be more accurately detected.

In addition, since the sensing unit 210 itself is disposed at the end of the supporting PCB 202, it is possible to sensitively detect not only radiant heat but also heat transfer due to convection, so that the accuracy of the overall temperature measurement can be improved.

In the sensing unit 210 having such a structure, the heat transferred to the packaging unit 214 or the lid 216 by radiation and convection is transferred to the PN junction of the semiconductor provided inside the packaging unit 214 to provide temperature. Measurements can be made.

On the other hand, the temperature sensor 200 may include at least one locking portion 204 that holds so as not to be separated from the outside when inserted into the hollow portion 103a of the connection portion enclosure 105. In the present embodiment, two locking portions 204 are formed on one side and two are formed at positions corresponding to the other, so that all four are provided.

The locking part 204 is made of an elastic material, and when the hollow part 103a is inserted, it is deformed inward by being pressed against the edge of the hollow part 103a. The temperature sensor 200 is prevented from being caught by the enclosure 105 from being separated. And, when replacing the temperature sensor 200, it is removed by applying an external force to damage the locking portion 204, and it can be replaced with a new temperature sensor 200.

As described above, the temperature sensor 200 applied to the bus duct connection part 100 according to an embodiment of the present invention has the advantage of being easy to install, easy to manage and check, and to be easily replaced in case of failure or damage. .

On the other hand, the temperature sensor 200 may further include a double-sided tape 206 for improving the adhesion around the contact portion in contact with the enclosure 105. Through the adhesive force of the double-sided tape 206, the temperature sensor 200 may be more stably coupled to the connection unit enclosure 105.

A connection part 208 through which a communication cable 70 is inserted and connected may be provided on the upper part of the temperature sensor 200. The connection part 208 is connected by inserting and connecting the terminals of the communication cable 70 from both sides, so that electrical connection can be made and required power and electrical signals can be exchanged.

Meanwhile, the hollow part 103a may be formed under the connection part enclosure 105 so that the temperature sensor 200 may be coupled to the lower part of the connection part enclosure 105. That is, the hollow part 103a is formed under the connection part enclosure 105 as a construction standard, and in this embodiment, as shown in FIG. 2, it is fastened from the lower part of the first enclosure 101 and the second enclosure 103 A hollow portion 103a may be formed on the side of the second enclosure 103 that is to be formed.

In this way, by forming the hollow part 103a under the connection part enclosure 105 based on the construction standard, and by combining the temperature sensor 200 to the lower part, water falling from the upper side by rainwater or leakage permeates and short-circuits or the temperature sensor 200 ) Can be prevented from being damaged.

Meanwhile, looking at the basic structure of the bus duct 10 according to an embodiment of the present invention, an enclosure 12 is provided to form a predetermined space therein. The inside of the enclosure 12 is provided with a bus bar 20 serving as a conductor core wire included in a cable to conduct a large amount of current. Wings 14 are formed to extend a predetermined length on both sides of the upper and lower surfaces of the enclosure 12 to reinforce strength.

The bus bar 20 is made of a conductor 22 such as copper or aluminum. In this embodiment, a case mainly made of aluminum will be described as an example. The surfaces of the conductors 22 are each covered with an insulator 24 such as an epoxy coating to be electrically insulated from each other. Since the busbar 20 normally flows a large current, it is first insulated by covering the insulator 24, and is accommodated and protected inside the enclosure 12 in a state isolated from the outside. The enclosure 12 including the bus bar 20 may be manufactured as a unit unit having a predetermined length and then connected and installed by the bus duct connection unit 100. At this time, the end of the bus bar 20 inserted into the bus duct connection part 100 peels off the insulator 24 to expose the conductor 22 to the outside.

Looking at the structure of the bus duct connection unit 100 according to an embodiment of the present invention in more detail with reference to FIGS. 6 to 8, first, a plurality of insulating plates 110 are disposed at a predetermined interval, and the plurality of insulating plates ( The energizing plate 120 is provided on one or both sides of 110) to come into contact with the bus bar 20. Here, the insulating plate 110 may serve to insulate between phases.

Specifically, the energizing plate 120 is preferably configured to contact both side surfaces of the busbars 20 that are provided and inserted on opposite surfaces of the insulating plates 110 adjacent to each other.

In this embodiment, the busbars 20 are composed of four phases of R, S, T, and N, and four are provided. Accordingly, five of the insulating plates 110 are arranged at regular intervals to form four busbars 20 A passage through which) can be inserted is formed, and energizing plates 120 are provided on opposite surfaces of the insulating plates 110 that are adjacent to each other to contact each of the four busbars 20 from both sides.

That is, a pair of electrifying plates 120 arranged to face each other between the insulating plates 110 make electrical connection by contacting the bus bar 20, and the insulating plates 110 form each pair. It serves to insulate the phases between the plates 120.

The configuration of the bus bar 20 may be variously configured according to an installation target of the bus duct 10, an installation environment, and power capacity to be supplied. For example, the busbar 20 may be made of three-phase busbars 20 of R, S, and T, or may be made of five busbars 20 by combining R, S, T, and two Ns. In this case, the insulating plate 110 and the energizing plate 120 are also provided to correspond to the number of the bus bars 20 to constitute the bus duct connection part 100.

An outer plate 180 may be provided on the outermost side of the plurality of insulating plates 110. As shown in FIG. 6, two outer plates 180 may be provided on both upper and lower sides.

In this case, a ground plate 18 extending from the enclosure 12 surrounding the bus bar 20 may be inserted between the outer plate 180 and the insulating plate 110. The ground plates 18 are formed to extend from the enclosure 12 of the bus duct 10 connected to each other, and are connected together when the bus bars 20 are connected to perform a grounding role.

Meanwhile, through holes 112, 122, 182 are formed in the centers of the outer plate 180, the insulating plate 110, and the energizing plate 120, respectively, and a fastening bolt through the through holes 112, 122, 182 140 is inserted to couple the outer plate 180, the insulating plate 110 and the energizing plate 120.

The fastening bolt 140 is inserted into the through hole 112, 122, 182, and then a nut 170 is coupled to the opposite side to be tightened, and the outer plate 180, the insulating plate 110, and the energizing plate 120 Press the inside to fix it. At this time, the busbar 20 inserted between the insulating plates 110 is also fixed in a crimped state, and makes electrical contact in a state in close contact with the energizing plate 120.

A washer 150 is provided at the portion where the fastening bolt 140 is inserted and the nut 170 on the other side is tightened to increase the fastening force, and a loosening prevention hole 160 is additionally provided on the outer circumferential side of the nut 170 It may be configured to prevent the nut 170 from being loosened from the fastening bolt 140.

On the other hand, when the fastening bolt 140 is inserted into the through holes 112, 122, 182, the insulating bush 130 may be inserted together to surround the outside of the fastening bolt 140. The insulating bush 130 may be configured to be inserted and coupled from both sides of the upper and lower sides as shown in FIG. 6, and by enclosing the fastening bolts 140 inserted into the through holes 112, 122, 182, the booth Even if the bar 20 is extended, it serves to insulate it so that it does not come into contact with the fastening bolt 140.

In addition, a ring member 132 is additionally provided between the insulating plates 110 so as to surround the outer circumferential surface of the insulating bush 130 to protect the insulating bush 130 and additionally insulate the fastening bolt 140 You can do it.

When the connection of the bus duct connection unit 100 configured as described above is completed, the connection unit enclosure 105 is covered.

Meanwhile, an uneven portion 124 may be formed on the energizing plate 120 to facilitate movement of the bus bar 20 when the bus bar 20 is stretched or contracted. As described above, the busbar 20 inserted between the energizing plate 120 by the fastening force of the fastening bolt 140 and the nut 170 is tightened and connected under a high pressure. In this state, if a new construction by thermal deformation or a reduced load of the building itself is received, the busbar 20 cannot move due to the frictional force acting by the pressure received between the energized plates 120, and the buckling phenomenon occurs due to deformation accordingly. I can.

The uneven portion 124 serves to smoothly move according to the expansion and contraction of the busbar 20 by reducing the frictional force. Specifically, the uneven portion 124 may be elastically deformed according to the expansion and contraction of the bus bar 20.

The uneven portion 124 may be formed on the energization plate 120 in contact with the bus bar 20, and as shown in FIGS. 6 to 8, in a direction in which the bus bar 20 is inserted. The concave portion and the convex portion may be formed in a shape that is continuously repeated for a predetermined length.

When the bus bar 20 is elongated, the uneven portion 124 elastically deforms in the direction in which the bus bar 20 travels, thereby reducing frictional force acting on the bus bar 20. In addition, even when the bus bar 20 is reduced and returned to its original position, the uneven portion 124 is elastically deformed in the opposite direction to help the movement of the bus bar 20.

At this time, as the uneven portion 124 elastically deforms, the coefficient of static friction is lowered, and accordingly, the busbar 20 is in a state in which it can move without receiving a large resistance. Of course, even in this state, since the energization plate 120 and the bus bar 20 maintain electrical contact through the uneven portion 124, there is no change in energization performance, which is confirmed by the experimental results.

In this way, the concave-convex portion 124 serves to reduce the frictional force of the bus bar 20 and the energizing plate 120 in contact with the bus bar 20, and by ensuring the movement according to the expansion and contraction of the bus bar 20 It is possible to prevent the phenomenon that the bar 20 is deformed and buckling because it cannot proceed due to the frictional force. In addition, it is possible to increase the reliability of the product by solving the problem of deteriorating the electric current performance due to damage or deformation of the bus bar 20.

Meanwhile, a first stopper 126 for holding a construction reference point when the bus duct 10 is connected may be provided on the energizing plate 120. The first stopper 126 automatically enters the bus bar 20 until the end of the bus bar 20 contacts the front end of the first stopper 126 when the bus bar 20 is connected. By allowing the initial entry amount of the bar 20, that is, the initial position to be determined, it serves to align all the busbars 20 in a uniform position.

Here, the first stopper 126 is configured to be structurally bent when the bus bar 20 is stretched by thermal expansion and the end of the bus bar 20 is pushed to allow the extension of the bus bar 20 naturally. It is possible to absorb the movement of the bus bar (20).

Furthermore, the ring member 132 surrounding the outer circumferential surface of the insulating bush 130 may include at least one second stopper 136 that extends for a predetermined length in a direction in which the bus bar 20 is inserted and is elastically deformable. .

As described above, the ring member 132 serves to secondarily protect the fastening bolt 140 by surrounding the outer circumferential surface of the insulating bush 130 between the insulating plates 110. The second stopper 136 is formed to extend a predetermined length from the ring member 132, and may be formed by injection molding as an integral part with the ring member 132, and the ring member 132 as a whole may be formed of rubber or resin. It may be made of an elastic material.

The second stopper 136 may be formed to protrude in both directions into which the bus bar 20 is inserted. In the present embodiment, three are provided in both directions, but the number of the second stoppers 136 may be differently applied as necessary.

This second stopper 136 can be applied in combination with the first stopper 126, and as shown in FIG. 7, except for the first stopper 126, only the second stopper 136 is applied. It is possible.

The second stopper 136, like the first stopper 126, can serve to hold the reference point for the construction of the bus bar 20, as well as the bus bar 20 is extended by thermal expansion and thus the bus bar 20 When the end of) is pushed, it is elastically deformed, thereby naturally allowing the extension of the bus bar 20 to absorb the movement of the bus bar 20.

In the structure of the connection part 100 configured as described above, the temperature sensor 200 may be installed in the upper or lower part of the section in which the bus bar 20 of the connection part 100 and the energizing plate 120 contact each other, as shown in FIG. 9. I can.

In general, the most heat is generated by the contact resistance at the part where the bus bar 20 and the energizing plate 120 contact, and accordingly, the upper or lower part of the section in which the bus bar 20 and the energizing plate 120 are in contact. Since the temperature of is the highest, if the temperature sensor 200 is installed in that section, the internal temperature of the connection unit 100 can be most accurately sensed.

In addition, due to the structure of the connection part assembly 100a, the section in which the busbar 20 and the energization plate 120 contact with each other has a large margin in space, so even when considering the ease of installation and workability, the busbar 20 and the energization plate 120 It is desirable to install it on the upper or lower part of the section where) contacts.

At this time, the temperature sensor (D) between the sensing unit 210 of the temperature sensor 200 and the heat source, that is, a portion where the bus bar 20 and the energizing plate 120 are in contact with each other, is 2 mm to 10 mm. 200) can be installed.

If the distance (D) between the sensing unit 210 of the temperature sensor 200 and the heat source is less than 2 mm, mechanical damage may occur due to interference during installation, and it is too close to the heat source to be affected only by a local part. Since there is a possibility that an error may occur in the temperature measurement, it is preferable to be 2mm or more.

In addition, when the distance (D) between the sensing unit 210 of the temperature sensor 200 and the heat source is greater than 10 mm, that is, if it is installed too far, a measurement error may occur because the temperature effect due to convection in addition to radiant heat is too large. Since there is a possibility, it is preferable to be 10 mm or less.

Meanwhile, the temperature sensor 200 is preferably installed at a central axis position in the longitudinal direction of the bus duct 10 and the connection part 100. In this way, since the temperature sensor 100 is installed on the central axis in the longitudinal direction, it is possible to prevent twisting of the communication cable 70 and effectively absorb radiant heat from a heat source to perform accurate temperature measurement.

10 is a block diagram showing the configuration of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention, and FIG. 11 is a sequence of a temperature sensor recognition method of the bus duct multi-point temperature monitoring system according to an embodiment of the present invention. Is a flow chart, and Figure 12 is a graph showing a ratio differential temperature monitoring method of the bus duct multi-point temperature monitoring system according to an embodiment of the present invention. 13 is a graph showing a static temperature monitoring method of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention, and FIG. 14 is a differential temperature monitoring method of a bus duct multi-point temperature monitoring system according to an embodiment of the present invention. It is a graph showing.

10 to 14, a bus duct multi-point temperature monitoring system 1000 according to an embodiment of the present invention is installed on a plurality of connection units 100 connecting the bus duct 10, respectively, and senses the temperature. A plurality of temperature sensors 200 disposed to face each other in a state in which the sensing unit 210 is not in contact with the bus bar 20 of the bus duct 10, and each collected from the plurality of temperature sensors 200 The temperature information of the connection unit may be transmitted, and may include a monitoring unit 300 that monitors the temperature information and performs an alarm for temperature information outside a preset range.

That is, as in the above-described structure, by installing a temperature sensor 200 on each connection unit 100 to measure the temperature, and by additionally providing a monitoring unit 300 capable of monitoring in real time through the temperature information collected through the booth The duct multi-point temperature monitoring system 1000 can be configured.

Here, the monitoring unit 300 includes a power supply device 310 that supplies operating power to the temperature sensor 200, and a data collection device 320 that collects and transmits temperature information from the plurality of temperature sensors 200. ), and a terminal 330 configured to receive temperature information from the data collection device 320 and perform an inquiry, and set a normal range and perform an alarm function.

Each of the temperature sensors 200 is connected by a communication cable 70, wherein the communication cable 70 may be an RS485 communication cable. Since the RS485 communication cable can communicate in a range of 1 to several kilometers, there is an advantage that it is possible to monitor the temperature of the bus duct 10 installed in a wide range without installing an additional relay server.

In addition, the communication cable 70 is preferably provided with a shielding function to minimize the influence of the magnetic field formed by the current flowing through the bus bar 20 of the bus duct 10.

The communication cable 70 is fixed to the mounting groove 16 (see FIG. 1) formed in the bus duct enclosure 12 and installed along the bus duct 10, and the temperature sensor 200 installed at the connection part 100 It is connected to the connection part 208.

The power supply device 310 supplies operating power so that the temperature sensor 200 can operate, and for example, DC 24V or DC 36V may supply various operating power as needed. At this time, a power line for supplying operating power from the power supply device 310 is allocated to the communication cable 70 so that the cable can be used in common.

The temperature information measured by each temperature sensor 200 is transmitted to the data collection device 320 and collected through a communication cable, and the collected temperature information may be transmitted to the terminal 330 again.

The terminal 330 may be implemented in various forms such as a PC or a touch pad mobile device, and the user can query temperature information and set and monitor the normal range through the terminal 330, and an alarm in case of an abnormal temperature rise. The alarm signal can be delivered through.

In order to build the system as described above, after installing the temperature sensor 200 in each connection unit 100, the monitoring unit 300 recognizes each temperature sensor 200, and data transmission/reception is performed properly along with the location information check. It is necessary to set it so that it can be set.

Conventionally, since the temperature sensor 200 is recognized only when the address of each temperature sensor 200 is manually set in the monitoring unit 300, there is a problem that it takes a lot of time for initial setting. However, the bus duct multi-point temperature monitoring system 1000 of the present invention provides a Plug & Play (PnP) function in recognizing the temperature sensor 200, so that initial setting can be performed simply and quickly.

Specifically, referring to FIG. 11, first, among the plurality of temperature sensors 200, the temperature sensor 200 near the data collection device 320 determines the number of temperature sensors targeting the temperature sensor 200 at the far side. And transmits a command signal for recognition.

At this time, among the neighboring temperature sensors 200, the temperature sensor 200 near the data collection device 320 is a master calling the command signal, and the temperature sensor 200 on the far side is a slave responding to the command signal. Is set.

The temperature sensor 200 receiving the command signal transmits the command signal to the next lower temperature sensor 200, where the temperature sensor 200 receiving the command signal is itself the last temperature sensor 200. The end signal is transmitted to the upper-order temperature sensor 200.

In this way, when an end signal is transmitted from the last temperature sensor 200, the collected number information sequentially transmitted starting from the last temperature sensor 200 is transmitted to the monitoring unit 300, through which All individual temperature sensors can be recognized.

In addition, since each temperature sensor 200 is automatically recognized and set in the system when installed, it is possible to conveniently and conveniently perform the temperature sensor 200 recognition and setting even when there is an initial setting as well as future exchange or expansion. There is an advantage.

As described above, when the system is built and the initial setting is completed, the temperature monitoring of the bus duct connection unit 100 can be performed.If the temperature is abnormally high, an alarm is performed so that the user recognizes it and takes appropriate measures such as repair or replacement. You can take it.

Specifically, as shown in FIG. 12, the average value is obtained through temperature information collected by at least three or more temperature sensors 200, and the difference between the temperature measured at an arbitrary connection unit 100 and the average value is a preset value. If greater, it can be configured to trigger an alarm.

This is called a ratio differential method, which determines whether there is an abnormality based on the amount of temperature change between the measuring point and the other measuring point. Here, the location of the temperature information collected to obtain the average value or the numerical range determined to be abnormal may be variously set in consideration of the installation environment of the bus duct 10 or the previously collected temperature information database.

For example, as shown in FIG. 12, after collecting temperature information about four points before and after the measurement point as a reference, an average value is obtained, and an alarm may be performed when the temperature of the measurement point is higher than that of 15°C.

Meanwhile, as shown in FIG. 13, the monitoring unit 300 may be configured to perform an alarm when a temperature measured by an arbitrary connection unit 100 is greater than a preset reference temperature. This is a constant temperature type, which determines whether or not the temperature rises more than the set reference temperature.

For example, when the reference temperature is 60° C., a pre-alarm may be performed at 50° C., and when the temperature rises above 60° C., this alarm may be performed.

In addition, as illustrated in FIG. 14, the monitoring unit 300 may be configured to perform an alarm when a temperature change value measured for a predetermined time by an arbitrary connection unit 100 is greater than a preset value. This is a differential type, and it is possible to determine whether there is an abnormality by whether or not the temperature changes rapidly within a certain period of time.

For example, if the set time is set to 1 minute and the temperature change during that time changes by 7℃ or more, it may be configured to perform an alarm, as shown in FIG. 13, when the temperature changes by 13℃ or more for 40 seconds, an alarm is performed, etc. It can be configured in various ways.

The above-described temperature monitoring methods may be respectively applied to the present system, or two or more or all three may be applied in duplicate to perform temperature monitoring.

The bus duct multi-point temperature monitoring system according to the embodiments of the present invention described so far can accurately and quickly identify the temperature in the connection part in real time to prevent and inspect accidents, and easily recognize each temperature sensor at the time of initial installation. It can be performed quickly, and real-time temperature monitoring of the installed bus duct can be easily implemented at low cost. In addition, it is possible to easily perform replacement in case of failure or damage of the temperature sensor.

Although the above has been described with reference to one embodiment of the present invention, those skilled in the art may variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. I will be able to do it. Therefore, if the modified implementation basically includes the elements of the claims of the present invention, all should be considered to be included in the technical scope of the present invention.

10: bus duct 18: ground plate
20: bus bar 100: bus duct connection
110: insulation plate 120: conduction plate
124: uneven portion 126: first stopper
130: insulation bush 132: ring member
136: second stopper 140: fastening bolt
150: washer 160: anti-loosening hole
170: nut 180: outer plate
200: temperature sensor 202: support PCB
204: locking portion 206: double-sided tape
208: connection part 210: sensing part
212: opposite PCB 214: packaging unit
216: lead 300: monitoring unit
310: power supply 320: data acquisition device
330: terminal 1000; Bus duct multi-point temperature monitoring system

Claims (4)

A plurality of temperature sensors respectively installed at a plurality of connection portions connecting the bus ducts, and a sensing unit for sensing temperature is disposed to face each other without contacting the bus bar of the bus duct, and supplying operating power to the temperature sensor. A power supply device, a data collection device that collects and transmits temperature information from the plurality of temperature sensors, and a terminal capable of receiving and inquiring temperature information from the data collection device, setting a normal range and performing an alarm function. In the bus duct multi-point temperature monitoring system including,
Transmitting a command signal for identifying and recognizing the number of temperature sensors from a temperature sensor closer to a data collection device among the plurality of temperature sensors to a temperature sensor at a far side; And
Recognizing each temperature sensor through the collected number information sequentially transmitted from the last temperature sensor among the plurality of temperature sensors; a temperature sensor recognition method of the bus duct multi-point temperature monitoring system comprising a. The method of claim 1,
In the step of transmitting the command signal,
Temperature of the bus duct multi-point temperature monitoring system, characterized in that the temperature sensor of the neighboring temperature sensor near the data collection device is set as a master calling the command signal, and the temperature sensor on the far side is set as a slave responding to the command signal. How to recognize the sensor. The method of claim 1,
The temperature sensor receiving the command signal is a temperature sensor recognition method of the bus duct multi-point temperature monitoring system further comprising the step of transmitting the command signal to the next lower temperature sensor. The method of claim 1,
The temperature sensor receiving the command signal transmitting an end signal to the next higher temperature sensor when it is the last temperature sensor; temperature sensor recognition method of the bus duct multi-point temperature monitoring system further comprising.

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