KR102238509B1 - 3d 프린팅 패턴의 치수정밀도 평가방법 - Google Patents
3d 프린팅 패턴의 치수정밀도 평가방법 Download PDFInfo
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- KR102238509B1 KR102238509B1 KR1020170168353A KR20170168353A KR102238509B1 KR 102238509 B1 KR102238509 B1 KR 102238509B1 KR 1020170168353 A KR1020170168353 A KR 1020170168353A KR 20170168353 A KR20170168353 A KR 20170168353A KR 102238509 B1 KR102238509 B1 KR 102238509B1
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- pattern
- printing
- dimensional
- dimensional accuracy
- ink
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- 238000000034 method Methods 0.000 title claims description 20
- 238000007639 printing Methods 0.000 title description 10
- 238000010146 3D printing Methods 0.000 claims abstract description 35
- 238000011156 evaluation Methods 0.000 claims abstract description 20
- 238000007599 discharging Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Abstract
Description
도 2는 본 발명에 따른 치수정밀도 평가지표의 측정을 위한 샘플의 구조를 도시한 것이다.
도 3 및 도 4는 본 발명에 따른 평가방법을 이용하여 각각의 샘플에 대한 치수정밀도의 측정결과를 나타낸 것이다.
# 1 | # 2 | # 3 | # 4 | ||
잉크정보 | 점도(cP @ 25℃) | 20.5 | 68 | 52.8 | 68 |
공정 조건 | 잉크젯 헤드 정보 | Dimatix사 Sapphire QS-256/80 AAA | |||
head heating(℃) | 40 | 60 | 60 | 60 | |
치수정밀도 | Steepness index(%) (패턴 거리(d): 191um) |
24.9 | 28.2 | 100 | 100 |
Claims (6)
- 3D 프린팅 잉크 조성물로 제1 패턴을 형성하는 단계;
상기 제1 패턴을 경화시키는 단계;
상기 경화된 제1 패턴상에 상기 3D 프린팅 잉크 조성물로 높이가 H이고, 패턴간 간격이 d인 제2 패턴을 형성하는 단계; 및
상기 제2 패턴을 경화시키는 단계를 포함하며, 하기 식 1을 이용하여 계산되는 값을 치수정밀도의 평가지표로서 이용하는 것인 3D 프린팅 패턴의 치수정밀도 평가방법:
[식 1]
치수정밀도 평가지표(steepness index)=h/H*100
상기 식 1에 있어서,
H는 제2 패턴의 높이이고,
△h는 [제2 패턴의 높이(H) - 제2 패턴간의 사이가 잉크의 유동으로 채워진 부분의 높이(hf)]를 나타내는 값이다. - 제1항에 있어서,
상기 패턴간 간격(d)는 10 내지 1000㎛ 인 3D 프린팅 패턴의 치수정밀도 평가방법. - 제1항에 있어서,
상기 제2 패턴의 패턴간 간격은 노즐의 직경인 d인 노즐을 미 토출 시킴으로써 형성되는 것인 3D 프린팅 패턴의 치수정밀도 평가방법. - 제1항에 있어서,
상기 제1 패턴은 200 내지 1000의 DPI 및 25 내지 127㎛의 도트피치로 형성되는 것인 3D 프린팅 패턴의 치수정밀도 평가방법. - 제1항에 있어서,
상기 제1 패턴 및 제2 패턴의 경화는 300 내지 500nm의 광원으로 5 내지 30초 동안 경화시키는 것인 3D 프린팅 패턴의 치수정밀도 평가방법. - 잉크젯 3D 프린팅을 이용하여 제조된 입체패턴의 제1항에 따른 평가지표가 90%이상인 입체패턴.
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KR1020170168353A KR102238509B1 (ko) | 2017-12-08 | 2017-12-08 | 3d 프린팅 패턴의 치수정밀도 평가방법 |
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KR1020170168353A KR102238509B1 (ko) | 2017-12-08 | 2017-12-08 | 3d 프린팅 패턴의 치수정밀도 평가방법 |
Publications (2)
Publication Number | Publication Date |
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KR20190068201A KR20190068201A (ko) | 2019-06-18 |
KR102238509B1 true KR102238509B1 (ko) | 2021-04-08 |
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KR1020170168353A KR102238509B1 (ko) | 2017-12-08 | 2017-12-08 | 3d 프린팅 패턴의 치수정밀도 평가방법 |
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