KR102233597B1 - Embossing compound for embossing lithography - Google Patents

Abstract

The present invention relates to a curable embossing material that can be used in embossing lithography, consisting of a mixture of at least one polymerizable main component and at least one minor component. In addition, the invention relates to the use of an embossing material according to any one of the preceding claims for the primary formation of the embossed form (4, 4', 4'', 4''', 4 ^{IV ).}

Description

Embossing compound for embossing lithography {EMBOSSING COMPOUND FOR EMBOSSING LITHOGRAPHY}

The invention relates to an embossing material according to claim 1 and to a use according to claim 7.

In the semiconductor industry, embossing lithography methods are increasingly being used to supplement or replace standard optical lithography methods. Using microstructured and/or nanostructured embossing stamps, a mechanical way of structuring viscous embossed materials that is not limited to optical diffraction phenomena is achieved. The structured viscous embossing material is crosslinked/cured prior to and/or during the embossing process to remain dimensionally stable. In this case, the crosslinking is in particular carried out via electromagnetic radiation, preferably via UV light and/or by heat, ie thermally. After crosslinking, the embossing stamp can be removed from the cured embossing material. The remaining hardened embossing material already has a functional shape or is further processed in a later process step. A large amount of embossing material, which is mainly based on inorganic molecules, is heat treated at a very high temperature after the demolding step. The heat treatment ensures that the embossing material is irreversibly hardened. When using an embossing material containing organic and inorganic molecules, the heat treatment mainly ensures that the organic portion is removed from the embossing material and the inorganic molecules are crosslinked with each other. As a result, it is possible to structure the embossing material composed of organic and inorganic molecules by the stamping process and to completely convert the embossing material into the inorganic material after the stamping process.

In order to carry out the structuring of the embossing material, a special embossing stamp is required. Embossing stamps must meet extremely high requirements so that micro- and/or nanometer-sized structures can be completely transferred to the embossing material as negative. In the prior art, there are several different types of stamps. It is generally divided into a hard stamp and a soft stamp.

Hard stamps are made of metal, glass, or ceramic. It is less deformable, corrosion resistant, wear resistant, and very expensive to manufacture. The surface of the hard stamp is in most cases processed by electron beam lithography or laser beam lithography. These manufacturing methods are generally very expensive. The advantage of a hard stamp is mainly its high wear resistance. The decisive drawback lies in the high level of bending resistance, which does not allow the embossed stamp to come out in pieces from the embossing material as is possible in the case of soft stamps. The hard stamp can be pulled out of the embossing material only by means of a normal force over the entire surface.

Soft stamps are often molded as intaglios of hard stamps. Usually it consists of a polymer with high elasticity and low bending strength. Usually this is entropy elasticity. The reason is mainly the large adhesion between the embossing material and the soft stamp and/or the swelling of the soft stamp. Soft stamps can be distinguished from hard stamps by a variety of chemical, physical, and technical parameters. A distinction based on elastic behavior may be considered. The soft stamp has a deformation characteristic mainly based on entropy elasticity, and the hard stamp has a deformation characteristic mainly based on energy elasticity. In addition, the two types of stamps can be distinguished, for example by their hardness. Hardness is the resistance of a material against a penetrating body. Since the hard stamp consists mainly of metal or ceramic, it has a correspondingly high hardness value. There are various ways of expressing the hardness of a solid. The most common method is an indication of hardness according to Vickers. Without detailed description, it can be roughly stated that the hard stamp has a Vickers hardness value greater than 500 HV. In theory, the soft stamp should be very simply removable from the embossing material, but often this is not the case. Thus, the biggest problem with the current embossing technique is mainly in the release stage, ie the separation of the embossed stamp, in particular the soft stamp, from the embossing material.

It is therefore an object of the present invention to provide an embossing material that can be better removed from the embossing stamp.

This object is solved by the features of claim 1. Advantageous further developments of the invention appear in the dependent claims. All combinations of at least two of the features shown in the specification, claims, and/or drawings are also within the scope of the present invention. In a given range of values, values that fall within the stated limits should also be considered to be disclosed as bounding values and may be claimed in any combination.

The present invention describes the application/use of the embossing material according to the invention as well as the embossing material for embossing lithography. The embossing material is a mixture of at least one main component, preferably consisting of an inorganic and/or organic moiety, and at least one subcomponent which is preferably an organic component, which is suitable/used in particular for adjusting the interaction properties of the embossing material with water It features. The principal component is defined as the component that contributes to a major extent in the creation of the final embossed shape. Minor ingredients are defined as all other ingredients mixed with the main ingredient; These mainly comprise organic components, initiators and solvents whose hydrophilicity or hydrophobicity according to the invention is adjusted/affected. According to the invention, therefore, the embossing material can also consist of several main components and/or several sub-components. Hereinafter, although according to the invention several main components and/or several subcomponents can be provided to the embossed material according to the invention, one main component and one subcomponent will be mentioned as an example.

According to the invention, therefore, there is a first component which is the main component. The second component is preferably a component that is an organic compound that substantially contributes to the hydrophilicity or hydrophobicity adjustment according to the present invention. The third component is a solvent. The fourth component is an initiator that initiates polymerization between the main components, preferably a photoinitiator. This mixture consisting of at least four components is adhered to the substrate by a coating process. The solvent, by weight percentage, significantly exceeds the weight percentage of the main component at least prior to primary forming of the embossing material. The proportion of the main component is less than 10%, preferably less than 8%, more preferably less than 6%, even more preferably less than 4%, most preferably less than 3% by weight percent. The proportion of the second component substantially responsible for adjusting the hydrophilicity or hydrophobicity is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably 0.1% by weight. Less than %. The proportion of initiator used, preferably photoinitiator, is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably less than 0.2% by weight. . The proportion of the solvent used is less than 98%, preferably less than 96%, more preferably less than 94%, even more preferably less than 92%, most preferably less than 90% by weight percent. After the solvent is removed from the mixture or evaporated, the weight percent of the embossing material according to the invention is changed accordingly.

Polymerization, shrinkage and/or adhesion can be particularly tuned or at least affected by organic subcomponents. Preferably, the organic subcomponent is selected so that the adhesion between the embossing material and the embossing stamp is as small as possible to enable simple release of the embossing stamp from the embossing material. In particular, for simple release as possible, the surface of the embossing material is selected to be hydrophobic when the embossing stamp surface is hydrophilic, or vice versa.

According to an advantageous embodiment of the invention, the combination of the hydrophobic stamp surface and the hydrophobic surface of the embossing material is particularly optimal for release. The optimal combination can be determined empirically according to the invention.

Hydrophilicity refers to the great interaction of water with the surface of a material. Hydrophilic surfaces are predominantly polar and thus interact well with the permanent dipoles of fluids, preferably water molecules. The hydrophilicity of the surface is quantified by a contact angle measuring device. The hydrophilic surface has a very small contact angle in this case. If the embossing material according to the invention is to have a hydrophilic surface so that it can be released from the stamp as easily as possible, the following range of values applies according to the invention: the hydrophilic surface is, according to the invention, in particular less than 90°, preferably Preferably less than 60°, more preferably less than 40°, even more preferably less than 20°, and most preferably less than 1°.

Hydrophobicity correspondingly refers to the small interaction of water with the surface of a material. Hydrophobic surfaces are primarily non-polar and rarely interact with the permanent dipoles of fluid molecules. If the embossing material according to the invention has a hydrophobic surface in one embodiment of the invention so that it can be released from the stamp as easily as possible, the following range of values applies according to the invention: the hydrophobic surface, according to the invention, is 90 It has a contact angle of greater than °, preferably greater than 100 °, more preferably greater than 120 °, even more preferably greater than 140 ° and most preferably greater than 160 °. According to another particularly independent aspect of the invention, an embossing material is provided, wherein after the embossing process, the embossing material derived therefrom is embossed due to the weak contact properties of the embossing material to the embossed stamp without damaging the embossed structure. The mixing ratio between the main component and at least one subcomponent is adjusted in such a way that it can be loosened. The main component in this case is preferably an organic/inorganic compound. In this case, the subcomponent is preferably an organic compound.

The invention is also based on a particularly independent idea of producing embossed materials from special mixtures. The mixture consists of at least one main component and at least one minor component. The main component is preferably silsesquioxane. According to the invention, additionally the following materials will be conceivable:

Polyhedral oligomer silsesquioxane (POSS)

Polydimethylsiloxane (PDMS)

Tetraethyl Orthosilicate (TEOS)

Poly(organo)siloxane (silicone)

Perfluoropolyether (PFPE)

Subcomponents may consist of any organic and/or inorganic compounds. The minor component is primarily responsible for the adjustment of hydrophilicity or hydrophobicity according to the invention, which allows easier release of the stamp from the embossed material according to the invention. Particularly preferably, the subcomponent has an appropriate functional group that affects hydrophilicity or hydrophobicity. These subcomponents can be any complex having a desired organic structure. It is not possible to list all possible compounds that may affect the hydrophilicity or hydrophobicity of the embossing material according to the invention, so instead some collective names of chemical substances and/or functional groups are mentioned. Thus, a compound may consist of a combination of the elements in the following list. All chemical compounds appearing in the list can be used as monomers or polymers. At least one of the subcomponents is preferably an organic compound, in particular one of the following compounds:

Acrylic or (poly)acrylate

Epoxide

Epoxy resin

phenol

Alkane

Alken

Alkyn

benzene

ether

ester

Carboxylic acid

Ketone

Alcohol.

In certain embodiments, the minor component may belong to the same functional group as the organic functional group of the active component.

The solvent is always used to dissolve the main component, the initiator, and the organic component according to the invention to which the hydrophilicity or hydrophobicity is adjusted and/or affected. Preferably, in the course of the manufacturing process of the actual structure, the solvent is removed from the embossed material according to the invention or leaks by itself. Preferably, one of the following solvents is used:

Acetone

Acetonitrile

aniline

Cyclohexane

n-pentane

Triethylene glycol dimethyl ether (triglyme)

Dimethylacetamide

Dimethylformamide

Dimethyl sulfoxide

1,4-dioxane

Glacial acetic acid

Acetic anhydride

Ethyl acetate

ethanol

Ethylene dichloride

Ethylene glycol

Anisole

benzene

Benzonitrile

Ethylene glycol dimethyl ether

Petroleum ether/light gasoline

Piperidine

Propanol

Propylene carbonate (4-methyl-1,3-dioxol-2-one)

Pyridine

g-butyrolactone

Quinoline

Chlorobenzene

chloroform

n-heptane

2-propanol (isopropyl alcohol)

Methanol

3-methyl-1-butanol (isoamyl alcohol)

2-methyl-2-propanol (tert-butanol)

Methylene chloride

Methyl ethyl ketone (butanone)

N-methyl-2-pyrrolidone (NMP)

N-methylformamide

Tetrahydrofuran

Lactic acid ethyl ester

toluene

Dibutyl ether

Diethylene glycol

Diethyl ether

Bromobenzene

1-butanol

tert-butyl methyl ether (TBME)

Triethylamine

Triethylene glycol

Formamide

N-hexane

Nitrobenzene

Nitromethane

1,1,1-trichloroethane

Trichloroethene

Carbon disulfide

Sulfolane

Tetrachloroethene

Carbon tetrachloride

Propylene glycol monomethyl ether acetate (PGMEA)

water.

The main and minor ingredients are mixed in the corresponding stoichiometrically correct proportions, together with the initiator to initiate the chain reaction. By mixing of the main component and the minor component and the initiator, upon activation of the initiator, this in particular or at least primarily causes polymerization between the organic parts of the main component. Subcomponents may partially participate in the polymerization. In particular, only the main components are polymerized with each other. During polymerization, long chain molecules and/or entire 2D- and/or 3D-networks are preferably produced with a certain tunable number of monomers. In this case, the number of monomers is more than 1, preferably more than 10, more preferably more than 100, most preferably more than 1,000, and most preferably, the monomers are polymerized to form a complete 2D- and/or 3D-network. To form.

The hydrophilicity (or hydrophobicity) of the embossing material according to the present invention can be adjusted by a quantitative ratio between the main component and the minor component. Since the main component is preferably at least primarily, in particular completely, mainly inorganic material, preferably silsesquioxane, the hydrophilicity is preferably determined by the type and amount of the minor component. Hydrophilicity mainly depends on the polarity of the organic and/or inorganic compounds of the minor component(s). Preferably, hydrophilicity and hydrophobicity alternate between the embossing material and the embossing stamp according to the invention. When the embossing stamp is hydrophobic, the embossing material is preferably hydrophilic, or vice versa. The surface of the embossed stamp to be used is preferably selected to be hydrophobic. A very optimal combination could be the use of a hydrophobic embossing material according to the invention with a hydrophobic stamp.

Embossing materials, which are particularly hydrophilic, advantageously have adhesion to the embossed stamp as weak as possible. The adhesion ability between two surfaces can best be explained by the energy per unit surface, that is, the energy surface density. This refers to the energy required to be separated from each other in two surfaces connected to each other along a unit area. The adhesion between the embossing material and the embossing stamp, in particular, according to the invention, is 2.5 J/m 2 Less than, preferably 1 J/m2 Less than, more preferably 0.1 J/m 2 Less than, even more preferably 0.01 J/m 2 Less than, most preferably 0.001 J/m2 Less than, most preferably 0.0001 J/m2 Less than, most preferably 0.00001 J/m2 Is less than.

In a first specific embodiment, the embossing material consists of at least, particularly precisely, four components. The main component is any compound based on silicon oxide, preferably silsesquioxane, while the minor component is preferably a particularly pure organic compound. The third component is in particular a solvent. The fourth component is in particular an initiator that initiates polymerization between the main components, preferably a photoinitiator. This mixture, consisting of at least four components, adheres to the substrate by a coating process. The solvent, by weight percent, greatly exceeds the weight percent of the main component, minor component, and initiator. The proportion of the main component is less than 10%, preferably less than 8%, more preferably less than 6%, even more preferably less than 4%, most preferably less than 3% by weight percent. The proportion of subcomponents substantially responsible for the hydrophilicity or hydrophobicity adjustment is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably less than 0.1% by weight. to be. The proportion of the initiator used, preferably photoinitiator, is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably less than 0.2% by weight percent. The proportion of the solvent used is less than 98%, preferably less than 96%, more preferably less than 94%, even more preferably less than 92%, most preferably less than 90% by weight percent. After the solvent has been removed from the mixture or evaporated, the weight percent of the embossing material according to the invention is changed accordingly.

In a second specific embodiment, the embossing material also consists of, at least, particularly precisely, four components. The main component is any compound based on atomic silicon and oxygen, preferably a TEOS compound. The subcomponent is preferably an organic compound. The third component is in particular a solvent. The fourth component is in particular an initiator that initiates polymerization between the main components, preferably a photoinitiator. This mixture consisting of at least four components adheres to the substrate by a coating process. The solvent, by weight percent, greatly exceeds the weight percent of the main component, minor component, and initiator. The proportion of the main component is less than 10%, preferably less than 8%, more preferably less than 6%, even more preferably less than 4%, most preferably less than 3% by weight percent. The proportion of subcomponents contributing to the hydrophilicity or hydrophobicity adjustment is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably less than 0.1% by weight. The proportion of initiator used, preferably photoinitiator, is less than 2%, preferably less than 1.5%, more preferably less than 1.0%, even more preferably less than 0.5%, most preferably less than 0.2% by weight. . The proportion of the solvent used is less than 98%, preferably less than 96%, more preferably less than 94%, even more preferably less than 92%, most preferably less than 90% by weight percent. After the solvent has been removed from the mixture or evaporated, the weight percent of the embossing material according to the invention is changed accordingly.

In particular, thermal initiators and/or photoinitiators are added to the embossing material to cure or crosslink the embossing material and to render them in a cured form, particularly in an irreversible manner. Photoinitiators preferred according to the invention react sensitively in the range of 100 nm to 1,000 nm, preferably 200 nm to 500 nm, more preferably 300 nm to 400 nm. The thermal initiator initiates crosslinking at 25°C to 400°C, preferably 50°C to 300°C, and more preferably 100°C to 200°C.

After the crosslinking process, the embossing stamp is removed from the embossing material. The embossing material according to the invention is primarily, but not entirely, suitable for an embossing process in which the embossing stamp is removed from the embossing material by a peeling or rolling process rather than a pure normal force over the entire surface. In soft stamps, it is common to peel the soft stamp from the embossing material rather than remove it. In this type of release, a force must be applied along the separation line/separation front where separation occurs only for separation between the embossing stamp and the embossing material.

In another optional process step according to the invention, the embossing material is fed to a high temperature process to sinter it. During the sintering process, all organic residues are preferably oxidized in the embossing material and removed from the embossing material, leaving a pure, preferably inorganic structure, most preferably a SiO ₂ structure. Sintering is in particular carried out above 50°C, preferably above 200°C, more preferably above 400°C, most preferably above 600°C, most preferably above 800°C and most preferably above 1,000°C.

Oxidation of organic residues in the embossing material is carried out particularly efficiently in an atmosphere having a high oxygen content. The oxygen content is in particular more than 20%, preferably more than 60%, more preferably more than 80% and most preferably 100%. Special sintering atmospheres made of highly oxidizing components such as oxygen, and inert gaseous components such as nitrogen, argon, helium or carbon dioxide would also be conceivable.

The embossing material according to the invention can be used for a variety of applications, particularly preferably for the following applications:

In a particularly independent, first embodiment according to the invention, the embossing material according to the invention is used as a protective or encapsulating material. To this end, an embossing material is applied over the structure to be protected in the first step according to the invention. Thereafter, the planarization of the embossed material with a preferably unstructured flat embossing stamp or structuring with a structured embossing stamp is carried out. The planarization of the embossed material according to the invention is particularly used in further processing steps requiring a flat surface. The structuring of the embossing material according to the invention only allows the functionalization of the embossing material, which is actually provided as a protective material. The use according to the invention for structuring a lens by the structure to be protected or encapsulated, one or more channels for microfluidic devices, cavities for MEMs, or for structuring another functional component is contemplated. The protective material can fulfill various roles as a protective layer. When the protective layer is optically transparent, it allows electrical and/or magnetic isolation of the underlying components without limiting the transparency to the electromagnetic beam to a specific wavelength range. Thus, communication between two optoelectronic components, in particular through protective materials, would also be conceivable. A group of components according to the invention can and still communicate electrically and/or magnetically from the environment. The protective material is in particular electrically insulating. Electrical insulation is a dielectric property. Mainly SiO ₂ -based materials are particularly suitable for insulating components, especially due to their bonding structure and band structure. Thus, galvanic isolation from the surrounding environment is performed. The protective material is preferably very thermally stable. Since mainly inorganic materials, in particular ceramic oxides, have a very high melting point, a protective cover that is stable up to very high temperatures can be provided with embodiments according to the invention. Moreover, the embossing material according to the invention is particularly chemically inert. This makes the embossing material resistant to acids, bases, oxidation and reduction. These aforementioned chemical defects can occur during further processing of the component or in subsequent use.

In a particularly independent preferred embodiment of the invention, the embossing material is applied by an adhesion process, is not changed by a planarization process or an embossing process and remains on the surface in the corresponding dispensing. The embossing material can be applied to an extremely thin thickness on the structure, for example by means of a spray coating process. This particular embodiment has the advantage that the embossing material still follows the topography of the surface and does not completely cover the surface. Another possible application would be the dispensing of the embossed material, applied in the center, preferably by a spin coating process. This variant will be suitable primarily for flat structures to be protected. If the embossing material according to the invention has a thickness several times thicker than the structure to be protected, spin coating can also be used successfully for adhesion. After the above-mentioned process steps, irreversible hardening of the embossing material is carried out by at least one of the previously mentioned methods.

In a particularly independent, second embodiment according to the invention, the embossing material according to the invention is used as a base material for various functional units. In this case, the embossing material according to the invention is itself a starting material and serves as a building material rather than protecting the structure as in the previously mentioned embodiment according to the invention. MEMS assemblies (MEMS devices), microfluidic assemblies (microfluidic devices), or embossing of photonic crystals may be considered. In this case, the embossing material according to the invention is preferably applied to the substrate. Although any known adhesion process for applying the embossing material according to the invention to a preferably completely flat substrate can be carried out, mainly spin coating is suitable for this embodiment according to the invention. In a first process step, a puddle of the embossing material according to the invention is applied at a point on the substrate, preferably in the center. Then, a spin coating process evenly distributes the embossing material according to the invention over the entire surface of the substrate. In this case, the layer thickness of the embodiment according to the invention is preferably completely uniform. In a second process step according to the invention, embossing of the embossing material according to the invention is carried out with an embossing stamp. In this case, the structure of the embossed stamp is transferred to the embossed material according to the invention as an intaglio. For example, manufacturing of process chambers, channels, mixing chambers, general cavities, etc., which are mainly required for the manufacture of microfluidic components, may be considered. Moreover, the manufacture of cavities for MEMS assemblies or LED assemblies would be conceivable. In particular, parts of the assembly are manufactured by this embodiment according to the invention, and such assembly alone is not completely functional. In general, the structuring of the embossed material according to the invention is disclosed. Immediately after the above-mentioned process steps, irreversible hardening of the embossing material is carried out by at least one of the previously mentioned methods. The advantages of this embodiment according to the invention can be seen primarily in the manufacture of microfluidic assemblies.

The microfluidic assembly features a channel, a reaction chamber, a mixing chamber, a pump chamber, and/or an analysis chamber. Various chambers are connected to each other through channels. The microfluidic assembly transports fluid, gas, and/or liquid from one location on the microfluidic assembly to a second location, whereby the fluid flows through one or more of the chambers. In the chamber, in particular physical and/or chemical processes take place. These processes change the fluid or generate physical measurement signals that can be evaluated for the fluid. A typical chemical process will be a mixing process between a first fluid and a second fluid in a mixing chamber. Another chemical process would be the reaction of the first fluid and the second fluid to form a third fluid, in particular in the reaction chamber. A typical physical process would be the blow of a fluid with a laser, which excites the fluid to fluoresce. The emitted radiation can then be detected accordingly and evaluated for the fluid. One of the most important uses of the microfluidic assembly according to the invention is the sequencing of macromolecules, preferably DNA fragments, particularly preferably complete DNA strands. In this case, the following procedure preferably takes place in the microfluidic assembly. A solution containing the macromolecule to be sequenced is injected into the microfluidic assembly. In the first reaction chamber, a portion of the macromolecule to be sequenced binds to the surface of the reaction chamber. The macromolecules to be sequenced are preferably bound to the surface by their two ends to form a molecular “archegil”. That is, it is bent in the shape of an arch. In another step, these bound macromolecules are replicated by a solution containing the corresponding building blocks injected into the microfluidic assembly. After successful replication of the macromolecule, the macromolecule is sequentially sequenced by means of a defined marker molecule whose functional groups can be attached to the portion of the macromolecule to be sequenced, and alternatively flows through the microfluidic assembly. When the attachment of the marker molecule to the macromolecule to be sequenced is carried out, a corresponding sensor, preferably an optical sensor capable of detecting the interaction of the marker molecule with the electromagnetic radiation irradiated in the microfluidic assembly, detects the attachment process. And can be saved in digital format. By repetitive flow through various marker molecules, entire macromolecules can be sequenced according to the present invention. The embossing material according to the present invention and the embossing product produced therefrom significantly improve the manufacturing, structuring and efficiency of such microfluidic assemblies.

Particularly independent, according to a third embodiment according to the invention, the embossing material according to the invention is used in the manufacture of optical elements that are already fully efficient and perform the intended task by themselves. These mainly include convex and concave lenses, diffractive optical elements (DOE) such as Fresnel lenses, diffraction gratings, and phase gratings. Particularly preferably, the optical element produced by the embossing step can be adjusted by means of a functional unit, for example an image sensor, a camera, a CCD detector, an LED, a laser stamper, a photodiode, or a temperature sensor. The optical effect achieved from the optical element manufactured according to the invention, i.e., the change in the intensity, phase, and direction of incidence or exit of the electromagnetic beam, is therefore an evaluation unit (photodiode, image sensor, etc.) or a generating unit (LED, laser Etc.).

Particularly independent, in the fourth embodiment according to the invention, the embossing material according to the invention is used as an etch mask. In this case, the embossing material according to the invention is applied on the surface to be etched in the first step according to the invention. Thereafter, in the second step according to the present invention, the structuring of the embossed material according to the present invention is carried out by means of an embossing stamp. In this case, the structuring can be carried out in such a way that the point on the substrate surface to which the used etching fluid will reach is completely excluded from the embossing material according to the present invention. A preferred type of etch mask fabrication according to the invention consists in that the point on the substrate surface to which the used etch fluid will reach is still maintained at least partially covered with the embossing material according to the invention.

In the third step, the embossing material according to the present invention is then cured, followed by etching of the embossing material according to the present invention. In this case, in particular, the entire embossing material according to the invention is attacked, but the etch chemistry is correspondingly on the surface of the substrate to be actually etched at precisely structured points, since the thickness of the embossing material according to the invention is particularly several times thinner, Reach faster. After etching of the embossing material according to the present invention with a corresponding chemical, the actual surface may be generally etched with a second etching chemical different from the first etching chemical. After successful etching, the embossing material according to the present invention is completely removed from the surface of the substrate to be etched by the first etching chemical.

In a particularly independent, special embodiment, an embossed stamp coated with a material that is opaque to the electromagnetic beam at only some points may be used. When the embossing material according to the present invention is irradiated through an embossing stamp, the point coated with a material that is opaque to the electromagnetic beam blocks electromagnetic radiation and thus prevents curing of the embossed material according to the present invention in contact with the bottom. Due to this specially prepared embossing stamp, in most ideal cases, the etching of the cured embossing material by aggressive chemicals is prevented because, in most ideal cases, the uncured point of the embossing material according to the present invention can be removed by less aggressive chemicals. Unnecessary. After the etch mask is fabricated from the embossing material according to the present invention, this time the surface of the substrate can be etched with an appropriate chemical. In the final process step, the etch mask is removed by means of suitable chemicals.

In a particularly independent, fifth embodiment according to the invention, the embossing material according to the invention is used for embossing/manufacturing an embossed stamp therefrom. The embossing stamp based on the embossing material according to the invention has all the advantages mentioned above.

Particularly independent, in the sixth embodiment according to the invention, the embossing material according to the invention is transferred by contact lithography. In this case, on the one hand, it is an advantage that the adhesion between the embossing material according to the invention and the embossing stamp in the fixing of the embossing material according to the invention is strong enough to adhere the embossing material according to the invention to the embossing stamp. . On the other hand, since the adhesion between the embossing material according to the present invention and the surface of the substrate to be embossed is stronger than the adhesion between the embossing material according to the present invention and the embossing stamp, cross-section transfer of the embossing material according to the present invention can be considered. Preferably, more than 50% of the embossing material is transferred. Particularly preferably, in this case, the adhesion which can be tuned in the embossed material according to the invention is utilized through the correct selection of the subcomponent(s), their chemical structure, quantity, and chemical and/or physical bonding behavior.

Particularly independent, in the seventh embodiment according to the invention, the embossing material according to the invention is used as a protective layer having a point of contact penetration. In this case, the embossing material according to the present invention is opened through the corresponding contact by an etching process. The embossing material according to the invention is then used as a dielectric layer having an open contact connection point.

Particularly independent, in the eighth embodiment according to the present invention, the use of the embossing material according to the present invention as a mask for the transfer etching process is conceivable. This refers to that the embossing material that is embossed over the substrate is actually structured into a shape in which the substrate will be structured/structured later. In particular, embossing of a lens having an embossing material according to the present invention on a silicon substrate may be considered. The embossing material according to the present invention is continuously etched by a chemical and/or physical etching process. Since the layer thickness of the embossing material according to the present invention is non-uniform, the substrate to be etched is reached earlier by the etching chemical, or sputtering atoms and/or sputtering molecules at a point having fewer embossing materials according to the present invention in a physical etching process. Is reached earlier by Therefore, the etching process starts at some points before other points. In the etching isotropy of the embossing material according to the present invention (which is virtually always present due to the amorphousness of the embossing material according to the present invention), it is understood that the shape embossed on the embossing material according to the present invention can be directly transferred to the substrate in contact with the bottom. appear. The structure of the embossing material is distinct from the structure to be created on the substrate at different etch rates between the embossing material and the material to be etched. The transfer etching process is mainly suitable for structuring materials that cannot be formed in a conventional manner. This is of particular importance in the manufacture of silicon lenses, for example in infrared optics. At wavelengths in the infrared radiation range, silicon has an index of refraction greater than 3.5, while in the same wavelength range the index of refraction of quartz glass is only approximately 1.45.

Additional contemplated materials that can be prepared by the embodiments according to the invention and have a corresponding high refractive index are CaF, ZnS, sapphire, germanium, BaF, and ZnSe. The better the resolution of the lens, the shorter the wavelength used and the greater the numerical aperture. The numerical aperture is the product of the sine of the allowable angle and the index of refraction. The greater the refractive index of the material, the greater the resolution possible with a constant allowable angle and constant wavelength. Therefore, silicon is a much more suitable material than quartz glass for the infrared range. Unfortunately, it cannot be readily prepared by the corresponding wet-chemical process and is rather used as a single crystal or as poly-silicon, i.e. polycrystalline. In a correspondingly simple manner, the structuring of silicon will be constructed with the disclosed transfer etching process. The transfer etching process can also be used successfully in accordance with the present invention to prepare a patterned sapphire substrate (PSS) or a nano patterned sapphire substrate (nPSS). In this case, these are structured sapphire substrates used primarily in the manufacture of highly efficient LEDs.

Further features and embodiments of the invention will become apparent from the description of the claims and the accompanying drawings. The drawing shows:
1 schematic cross-sectional view of the first application according to the invention of the embossing material of the invention,
2 schematic cross-sectional view of a second use according to the invention of the embossing material of the invention,
3 schematic cross-sectional view of the third use according to the invention of the embossing material of the invention,
Fig. 4 is a schematic cross-sectional view of an etching mask made of an embossing material for a fourth use according to the present invention,
5 schematic cross-sectional view of a fifth use according to the present invention of the embossing material of the present invention as an embossing stamp,
6 schematic cross-sectional view of a sixth use according to the invention of the inventive embossing material in contact lithography,
7 a schematic cross-sectional view of a seventh application according to the invention of the embossing material of the invention as a locally confined, through-etched insulating layer, and
Fig. 8 is a schematic cross-sectional view of an eighth use according to the present invention of the embossing material of the present invention as a transfer etching mask.

1 shows a first use of an embossing material 2 according to the invention for encapsulating or protecting a functional unit 3 on a substrate 1 by primary formation of a first embossing form 4.

Fig. 2 shows a second use of the embossing material 2 according to the invention as a base material and construction material by primary formation of a second embossing form 4'.

3 shows a third use of the embossing material 2 according to the invention for the manufacture of an optical element 6 on a functional unit 3. In this case, the optical element 6 can be embossed directly via the functional unit 3, preferably by means of a primary formation of a third embossing type 4".

4 shows a fourth use of the embossing material 2 according to the present invention as an etching mask having a contact penetration point 7 that already exists by primary formation of a fourth embossing type (4 ″'). The contact penetration point 7 reaches the surface 5o of the layer 5 to be etched.

5 shows a fifth use of the embossing material 2 according to the present invention as a stamp 8 by primary formation of ^{a fifth embossing form 4 IV.}

6 shows a sixth use of the embossing material 2 according to the invention as an embossing material on the embossing structure 9 of the stamp 8'in a sixth embossing form (4 ^V).

7 shows a seventh application of the embossing material 2 according to the invention. In the first process step, which is the embossing step, the structuring of the embossing material 2 applied to the substrate 1 results in a still unopened contact connection point 11 on the contact 10 in which the embossing material 2 is electrically conductive. It is done in a way that has The contact 10 is connected to the functional unit 3, for example. In the second process step, the etching step, the embossing material 2 is etched until the still unopened contact point 11 is completely etched to form the contact point 11'. The contact connection point 11 ′ reaches the contact 10. In another process step not shown, a coating of the embossing material 2'with a conductive material, which connects the contact 10 with the surface of the embossing material 2'or enables connection to individual contacts, is then carried out. I can.

8 shows an eighth use of the embossing material 2 according to the present invention as a transfer etching mask. In a first process step, the embossing material 2 according to the invention is structured. In FIG. 8 structuring can be seen as an example in the form of several lenses 6. The structured embossing material 2 according to the invention is actually placed on the substrate 1 to be etched. The substrate 1 is formed of an etched substrate 1 ′ that does not appear by an etching process. The shape of the embossing material 2 according to the invention has been transferred to the substrate 1 in such a way that the shape is completely damaged. In the example shown, the etch rate is the same between the embossing material 2 and the substrate 1. When the etch rates are different, in transfer, the shape of the structure in a specific example of the lens 6 is changed.

List of reference symbols
1 substrate
2, 2'embossing material
3, 3'functional unit
4, 4', 4``, 4''', 4 ^IV , 4 ^V , 4 ^VI , 4 ^VII embossed form
5 layers
6 optical elements
7 Contact penetration point
8, 8'die
9 embossing structure
10 contacts
11, 11' contact point of contact

Claims (11)

Combination of a stamp with a hydrophobic stamp surface and an embossing material with a hydrophilic surface, usable and curable for embossing lithography, or a stamp with a hydrophilic stamp surface, and an embossing with a hydrophobic surface, usable and curable for embossing lithography A combination with a material, wherein the embossing material is:
-At least one polymerizable main component, and
At least one subcomponent for adjusting the hydrophilicity and hydrophobicity of the embossing material, and
-Initiator and
-Solvent
Consisting of a mixture of,
Here, the initiator polymerizes only the at least one polymerizable main component upon activation,
The main component is at least one of the following substances:
Polyhedral oligomer silsesquioxane (POSS)
Poly(organo)siloxane (silicone)
Formed from, the combination. delete The combination of claim 1, wherein the organic subcomponent(s) consists of at least one of the following compounds:
acryl
Epoxide
Epoxy resin
phenol
Alkane
Alken
Alkyn
benzene
Polyacrylate
ether. The combination of claim 1, wherein the embossing material consists of a chain of polymerized monomers having a length of at least two monomers. The combination of claim 1, wherein the embossing material is designed to be hydrophobic upon contact with an embossing die that is hydrophilic at the embossing surface, and the embossing material is designed to be hydrophilic upon contact with an embossing die that is hydrophobic at the embossing surface. The method of claim 1, wherein the embossing material is:
-At least one polymerizable main component,
-At least one subcomponent to establish hydrophilicity or hydrophobicity,
-Initiator and
-Solvent
Wherein only said at least one polymerizable main component is polymerized during initiator activation, wherein the inorganic main component(s) is formed from at least one of the following substances:
Polyhedral oligomer silsesquioxane (POSS)
Poly(organo)siloxane (silicone). A curable embossing material that can be used in embossing lithography, consisting of the following mixtures:
-At least one polymerizable main component, and
At least one subcomponent for adjusting the hydrophilicity and hydrophobicity of the embossing material, and
-Initiator and
-Solvent
Consisting of a mixture of,
Here, the initiator polymerizes only the at least one polymerizable main component upon activation,
The main component is at least one of the following substances:
Polyhedral oligomer silsesquioxane (POSS)
Poly(organo)siloxane (silicone)
Formed from delete The embossing material according to claim 7, wherein the organic subcomponent(s) consists of at least one of the following compounds:
acryl
Epoxide
Epoxy resin
phenol
Alkane
Alken
Alkyn
benzene. 8. The embossing material according to claim 7, comprising a chain of polymerized monomers having a length of at least two monomers. 8. The embossing material of claim 7, wherein the embossing material is designed to be hydrophobic upon contact with an embossing die that is hydrophilic at the embossing surface, and the embossing material is designed to be hydrophilic upon contact with an embossing die that is hydrophobic at the embossing surface.

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